JPH09252018A - Method for molding resin sealing of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the entry of moisture through a space between a molded resin sealing and a lead frame by improving the contact between the resin sealing molded in a cavity of a mould and the lead frame. SOLUTION: An electronic component covered with a lead frame 6 is fitted in cavities 3 and 4 of a mould. A resin material melted by heat is injected and charged in the mould cavities 3 and 4, is subject to a predetermined resin pressure, is pressed against the lead frame 6 and molded in the mould cavities 3 and 4 by compressed air supplied from the outside to form a moulded resin sealing. The contact between the molded resin sealing 7 and the lead frame.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a resin encapsulation method for an electronic component in which an electronic component such as an IC, an LSI, a diode, and a capacitor mounted on a lead frame is encapsulated with a resin material. It is.

[0002]

2. Description of the Related Art Conventionally, electronic parts have been resin-molded by a transfer molding method. However, this method is usually performed by using a resin molding apparatus for electronic parts. It is done like this.

That is, in advance, the fixed upper mold and the movable lower mold in the above-mentioned mold apparatus are heated to the resin molding temperature by the heating means, and the upper and lower molds are opened. Next, the lead frame on which the electronic component is mounted is supplied and set at a predetermined position on the lower mold surface, and the resin material is supplied into the lower mold pot. Next, the lower mold is moved upward to clamp the upper and lower molds. At this time, the electronic component and the lead frame around it are fitted and set in the upper and lower cavities facing the mold surfaces of the upper and lower dies,
The resin material in the pot is heated and melted sequentially. Next, the resin material heated and melted in the pot is pressurized by a plunger to inject and fill the molten resin material into the upper and lower cavities through a resin passage. The lead frame is sealed in a resin-sealed molded body (mold package) molded according to the shapes of the two cavities. Therefore, after the required time required for curing the molten resin material has elapsed, the upper and lower molds are opened, and the resin sealing molded body in the upper and lower cavities and the cured resin in the lead frame and the resin passage are removed. Ejector pins provided on both molds release the mold.

[0004]

However, the above-described mold cavity is filled with the resin material that has been melted by heating, and the plunger is used to fill the resin that has been filled into the mold cavity with a predetermined amount. Although it is configured to apply a resin pressure (resin pressing force), the adhesive force (adhesion) between the resin sealing molded body molded in the mold cavity and the lead frame is weak, and therefore, A gap is easily formed between the above-mentioned resin-sealed molded body and the lead frame. That is, it can be said that water penetrates through the above-mentioned gap to impede the function of the electronic component sealed inside the resin-sealed molded body and impairs the quality and reliability of the product (resin-sealed molded body). There's a problem.

Accordingly, an object of the present invention is to provide a method of resin-encapsulating and molding an electronic component, which can improve the adhesion between a resin-encapsulated molded article molded in a mold cavity and a lead frame. I do. Further, according to the present invention, a gap is formed between the above-described resin-sealed molded article and the lead frame by improving the adhesion between the resin-sealed molded article and the lead frame molded in the mold cavity. It is another object of the present invention to obtain a high quality and highly reliable product by preventing moisture from entering from between the above-mentioned resin-sealed molded body and the lead frame.

[0006]

A resin encapsulation molding method for an electronic component according to the present invention for solving the above-mentioned technical problems includes a mold provided opposite to a mold surface of a fixed mold and a movable mold. The electronic component mounted on the lead frame is fitted and set in the cavity, and the resin material which is heated and melted is injected and filled in the mold cavity, and the electronic component in the mold cavity and the lead frame around it A method for resin-sealing an electronic component, wherein a resin is molded into a resin-molded body corresponding to the shape of the mold cavity, wherein a predetermined resin pressure is applied to the resin injected and filled in the mold cavity. After the addition, the resin in the mold cavity is pressed against the lead frame surface from the outside, and the adhesion between the resin-molded body and the lead frame is improved. And it features.

Further, in order to solve the above-mentioned technical problems, the method for resin-sealing and molding an electronic component according to the present invention is a method in which a predetermined resin pressure is applied to the resin injected and filled in the mold cavity. It is characterized in that the resin in the mold cavity is pressed against the lead frame surface from the outside by sending compressed air to the resin in the mold cavity.

In order to solve the above-mentioned technical problems, a method for resin-molding an electronic component according to the present invention comprises: applying a predetermined resin pressure to the resin injected and filled in the mold cavity; Compressed air is pressure-fed to a mold release film stretched in the mold cavity so as to cover the mold cavity so that the resin in the mold cavity is removed through the mold release film. It is characterized in that the lead frame surface is pressed from the outside.

Further, in the resin encapsulation molding method for an electronic component according to the present invention for solving the above-mentioned technical problem, after a predetermined resin pressure is applied to the resin injected and filled in the mold cavity described above. The pressing member provided on the bottom surface of the mold cavity presses the resin in the mold cavity from the outside against the lead frame surface.

In order to solve the above-mentioned technical problems, a method of resin-sealing and molding an electronic component according to the present invention is such that a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, and then a predetermined pressure is applied. The fixed mold and the movable mold, which are clamped at a low mold clamping pressure, are further clamped at a predetermined high mold clamping pressure to press the resin in the mold cavity from the outside against the lead frame surface. It is characterized by

In addition, in order to solve the above-mentioned technical problems, the method for resin-molding an electronic component according to the present invention is such that a lead frame is provided in a mold cavity opposite to a mold surface of a fixed mold and a movable mold. While fitting and setting the mounted electronic parts, a heat radiating plate is fixed to the inner bottom surface of the mold cavity, and the resin material that has been heated and melted is injected and filled into the mold cavity. A resin encapsulation molding method for an electronic component, comprising: encapsulating an electronic component in a cavity and a lead frame in the periphery thereof in a resin encapsulation molding body corresponding to the shape of the die cavity. After a predetermined resin pressure is applied to the filled resin, the resin in the mold cavity is forced out of the outside by compressed air to the heat radiating plate, so that the resin is passed through the heat radiating plate to move the resin to the lead frame surface. With pressing, characterized by being configured to enhance the adhesion between the resin-seal-molded body and the lead frame.

[0012]

According to the present invention, the resin material that has been heated and melted is injected and filled into the mold cavities that are opposed to the mold surfaces of the fixed mold and the movable mold, and the mold cavities described above are also injected and filled. After a predetermined resin pressure is applied to the resin, compressed air is sent to the resin injected and filled in the mold cavity to press the resin in the mold cavity from the outside against the lead frame surface. can do. That is, since the resin injected into the mold cavity can be pressed against the lead frame surface from the outside, the close contact between the resin molding and the lead frame molded in the mold cavity can be achieved. Performance can be improved. Therefore, it is possible to prevent a gap from being formed between the resin-sealed molded body and the lead frame by improving the adhesion between the resin-sealed molded body and the lead frame, and It is possible to prevent moisture from intruding from between the formed resin molded article and the lead frame.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 and 2 show a main part of a mold in a mold apparatus for resin encapsulation molding according to the present invention. The mold includes a fixed upper mold (fixed mold) 1 and a fixed upper mold 1. And a movable lower mold (movable mold) 2 which is arranged to face. Also, the upper mold cavity 3 for resin molding is provided on the mold surface on the upper mold 1 side.
And a lower mold cavity 4 for resin molding is provided on the mold surface on the lower mold 2 side so as to face the upper mold cavity 3. The upper and lower molds 1 and 2 are provided with a heating means (not shown) for heating the molds to a predetermined temperature. A required number of pots (not shown) for supplying a resin material are provided on the mold surface on the lower mold 2 side, and plungers (not shown) for pressing the resin are fitted in the pots. . A setting recess 2a for supplying and setting the lead frame 6 on which the electronic component 5 is mounted is provided on the lower die 2 side, and a lower resin passage (not shown) is formed in the cavity 4 of the lower die 2. Communication is established. The upper mold 1 is provided with a cull (not shown) for receiving the molten resin material pressurized and transferred from the pot by the plunger and distributing the molten resin material to the upper mold resin passage. In addition, when the upper and lower dies 1 and 2 are clamped, the upper resin passage and the lower resin passage are provided so as to be connected to each other, and the pot and the upper and lower cavities 3.4 are connected to each other. A cull portion is provided so as to communicate with the upper mold resin passage and the lower mold resin passage. That is, by pressurizing the resin material heated and melted in the mold pot with the plunger, the resin material is injected and filled into the mold cavities 3 and 4 through the cull part, the upper mold and the lower mold resin passages. In addition, a predetermined resin pressure can be applied to the resin injected and filled into the mold cavities 3 and 4 by the plunger. Therefore, the electronic component 5 fitted and set in the mold cavities 3.4 is sealed and molded in the resin molded body 7 corresponding to the shape of the mold cavities 3.4.

The upper and lower molds 1 and 2 are filled with the resin material which has been heated and melted in the mold cavities 3 and 4 and the resin in the mold cavities 3 and 4 is filled. After applying a predetermined resin pressure, the mold cavity 3
A pressing means for improving the adhesiveness between the resin frame 7 and the lead frame 6 formed in the mold cavities 3.4 by pressing the resin in the mold 4 from the outside onto the surface of the lead frame 6. Is provided.

The pressing means described above is constructed as follows. That is, on the upper mold 1 side, a required number of ventilation holes 8 having a required shape communicating with the inner bottom surface of the upper cavity 3 are provided, and the ventilation holes 8 are provided with required air passages 9.
The compressor is connected to an air compression source 10 such as a compressor, and is configured to send compressed air from the air compression source 10 into the upper cavity 3 through the air passage 9 and the ventilation hole 8. Therefore, the upper cavity 3
The resin inside can be pressed against the upper surface of the lead frame 6 by the compressed air (see FIG. 2). Further, on the lower mold 2 side, similarly to the upper mold 1 side, a required number of ventilation holes 12 of a required shape communicating with the inner bottom surface of the lower cavity 4 are provided, and the ventilation holes 12 are provided with required air. It is connected to an air compression source 10 such as a compressor through a passage 9, and is configured to send compressed air from the air compression source 10 into the lower cavity 4 through the air passage 9 and the ventilation hole 12. Therefore, the lower cavity 4
The resin inside can be pressed against the lower surface of the lead frame 6 by the compressed air (see FIG. 2).

On the upper die 1 side, an opening / closing pin 11 (valve pin) for opening / closing the ventilation hole 8 is fitted in the ventilation hole 8 and, on the lower die 2 side, in the ventilation hole 12 side. An open / close pin 13 for opening / closing the vent hole 12 is fitted, and the open / close pins 11 and 13 of both types are vertically movable by an appropriate vertical drive mechanism (not shown). That is, in the upper and lower molds 1 and 2, the tip surfaces of the open / close pins 11 and 13 are moved by the vertical drive mechanism to positions substantially flush with the inner bottom surfaces of the upper and lower cavities 3.4. The opening / closing pins 11/13 are configured so that the above-described vent holes 8/12 can be reliably shut off by the tip portions 11a / 13a of the opening / closing pins 11/13, respectively. In this case, the upper and lower cavities 3 and 4
Has the same function and configuration as a normal cavity, and the upper and lower cavities 3 and 4 and the air compression source 10
Since the configuration is such that the shut-off pins 11 and 13 are reliably shut off by the tip portions 11a and 13a, the compressed air can be prevented from flowing into the cavities 3 and 4, respectively.

Further, the tip portion 11 of the opening / closing pins 11 and 13 described above.
a ・ 13a are the above-mentioned ventilation holes 8 ・ 12 and upper and lower cavities 3.
The opening / closing pins 11 and 13 themselves are provided so as to fit tightly into the communication holes 8a and 12a with the communication holes 8a and 12a.
・ It is provided to fit loosely with 12 respectively. In addition, the open / close pins 11 and 1 described above by the vertical drive mechanism are used.
3 is moved to the opposite side of the upper cavities 3 and 4, respectively, and the vent holes 8 (communication holes 8a) and the vent holes 12 (communication holes 12a) formed by the tip portions 11a and 13a of the open / close pins 11 and 13 are formed. The ventilation holes 8 and the ventilation holes 12 are provided so that the closed state can be released and the ventilation holes 8 and 12 can be opened.

That is, on the upper cavity 3 side, the upper cavity 3 and the compressed air source 10 side are configured to be connected and communicated with each other through the ventilation hole 8, and from the ventilation hole 8 (communication hole 8a) to Compressed air is pumped into the upper cavity 3 (in the example shown in FIG. 2, compressed air is pumped downward from the inner bottom surface side of the upper cavity 3 described above). Therefore, the resin in the upper cavity 3 can be pressed against the upper surface of the lead frame 6 by the pressing force of the compressed air, and the resin sealing molded body 7 ( Of the lead frame 6 and the upper surface of the lead frame 6 and the electronic component 5 can be improved. Further, on the lower cavity 4 side, the lower cavity 4 and the compressed air source 10 side are connected to each other through the ventilation holes 12 so as to be configured.
Compressed air is pumped into the lower cavity 4 from the ventilation hole 12 (communication hole 12a) (in the example shown in FIG. 2, compressed air is pumped upward from the inner bottom surface side of the lower cavity 4). ). Therefore, the resin in the lower cavity 4 can be pressed against the lower surface of the lead frame 6 by the pressing force of the compressed air, so that the resin sealing molded body molded in the lower cavity 4 can be formed. 7 (lower part) and the lower surface of the lead frame 6 can be improved in adhesion.

As shown in FIGS. 1 and 2, on the opposite side of the vent hole 8 from the side of the upper cavity 3, the vent hole 8 and the opening / closing pin 11 are always closely fitted. Therefore, it is configured in a closed state with the outside. Also, on the side opposite to the lower cavity 4 side of the ventilation hole 12, like the ventilation hole 8, the ventilation hole 12 and the opening / closing pin 13 are always tightly fitted. It is configured in a closed state. After the resin in the upper and lower cavities 3 and 4 is cured, the opening and closing pins 11 and 1
3 by projecting the tip portions 11a and 13a into the upper and lower cavities 3.4, respectively, thereby releasing the resin-sealed molded body 7 molded in the cavities 3.4 from the cavities 3.4. be able to. In this case, the open / close pins 11 and 13 are
Each has a so-called ejector pin releasing action.

Therefore, the resin encapsulation molding of an electronic component by the above-mentioned resin encapsulation molding die device is usually performed as follows. That is, the fixed upper mold 1 and the movable lower mold 2 in the mold apparatus are heated to the resin molding temperature by a heating means in advance, and the upper and lower molds 1 and 2 are opened.
Next, the lead frame 6 on which the electronic components 5 are mounted is attached to the lower mold 2.
The resin material is supplied and set at a predetermined position on the mold surface, and the resin material is supplied into the lower mold pot. Next, the lower mold 2 is moved upward, and the upper and lower molds 1 and 2 are clamped. At this time, the electronic component 5 and the lead frame 6 around it are connected to the upper and lower molds 1.
It is set in the upper and lower cavities 3 and 4 facing the mold surface of No. 2. Next, the resin material heated and melted in the mold pot is pressurized by the plunger, and the resin material heated and melted through the above-described cull / upper and lower resin passages is transferred to the upper and lower cavities. 3.
4 Fill and fill. At this time, a predetermined resin pressure can be applied to the resin injected and filled into the mold cavities 3 and 4 by the above-described plungers. Further, after a predetermined resin pressure is applied to the resin injected and filled in the mold cavities 3 and 4, the mold cavities 3 and 4 are further applied by the pressing means.
Press the resin inside. That is, the opening / closing pins 11/13 are moved to open the ventilation holes 8/13 on the inner bottom surfaces of the mold cavities 3.4, and the compressed air is supplied from the compressed air source 10 to the mold cavities 3.4. To press the resin in the mold cavities 3 and 4 against the lead frame 6 surface. Therefore, the resin in the mold cavities 3 and 4 can be pressed against the surface of the lead frame 6, so that the resin sealing molded body 7 and the lead frame 6 and the Adhesion with the component 5 can be improved. After a lapse of time required for curing the molten resin material, the upper and lower molds 1 and 2 are opened, and at the same time, the resin molding 7 and the lead frame 6 in the mold cavities 3 and 4 are separated. Opening / closing pins 11 provided on both molds 1 and 2
・ 13 (Ejector pin) can be released separately.

Further, in the mold apparatus shown in FIGS. 1 and 2, the mold clamping pressure of the fixed upper mold 1 and the movable lower mold 2 described above is divided into a predetermined low mold clamping pressure and a predetermined high and low mold clamping pressure. By setting it, the resin in the mold cavities 3 and 4 can be pressed to improve the adhesion between the resin-sealed molded body 7 and the lead frame 6 and the electronic component 5. That is, the molds 1 and 2 are clamped at a predetermined low mold clamping pressure, and the electronic component 5 mounted on the lead frame 6 is fitted and set in the mold cavities 3.4. Next, the resin material heated and melted in the lower mold pot is pressurized by the plunger, and the molten resin material is passed through the above-described cull / upper mold and lower mold resin passages to form the upper and lower cavities 3. Four
Fill and fill. Next, the upper and lower cavities 3.
4 After applying the specified resin pressure to the resin inside,
2 is further clamped at a predetermined high and low mold clamping pressure. That is, both upper and lower molds 1 and 2 clamped at the predetermined low mold clamping pressure.
2 is further clamped at a predetermined high and low mold clamping pressure to apply pressure to the resin in the mold cavities 3 and 4 and to remove the resin in the mold cavities 3 and 4 from the lead frame surface. Can be pressed. Accordingly, it is possible to improve the adhesion between the resin-encapsulated molded body 7 formed in the upper and lower cavities 3 and 4 and the lead frame 6 and the electronic component 5.

Next, the resin sealing molding die device shown in FIG. 3 will be described. The basic configuration of the mold apparatus shown in FIG. 3 is the same as the configuration of the mold apparatus shown in FIGS. That is, the mold apparatus shown in FIG.
A movable lower mold 40 facing the fixed upper mold 30 is provided. As in the embodiment shown in FIGS. 1 and 2, upper and lower cavities 31 and 41 for resin molding are provided on the mold surfaces of the upper and lower dies 30 and 40, respectively. When the mold is clamped, the electronic components mounted on the lead frame 6 can be fitted and set in the upper and lower cavities 31 and 41.

Further, in the mold device shown in FIG. 3, as in the embodiment shown in FIGS.
Pressing means for pressing the resin in 31 and 41 is provided.
That is, similarly to the embodiment shown in FIGS. 1 and 2, a required number of ventilation holes 33 and 43 are provided on the inner bottom surfaces of the upper and lower cavities 31 and 41, respectively. Vent
Opening / closing pins 32/42 for opening / closing 33/43 are fitted respectively, and the above-mentioned ventilation holes 33/43 are connected to and connected to an air compression source (not shown) through a required air passage 50. By moving the opening / closing pins 32 and 42 described above, the ventilation holes 33 and 43 are moved.
The compressed air is fed to the upper and lower cavities 31 and 41 by opening.

The mold device shown in FIG. 3 is provided with a release film supply mechanism 52 for supplying a release film 51 for preventing resin contact to the mold surfaces of the upper and lower molds 30 and 40, and the release film supply mechanism 52 is provided. The mold film supply mechanism 52 is composed of a mold release film feeding section 53, a mold release film winding section 54, etc., and the mold release film 51 installed in the mold release film feeding section 53 is controlled by a control mechanism (not shown). The release film 51 is automatically supplied between the mold surfaces of the upper and lower molds 30 and 40, respectively. After the resin molding by the upper and lower molds 30 and 40, the mold release film 51 is supplied between the mold surfaces and is automatically wound by the mold release film winding section 54. I have. Also, this release film 51
Is supplied in close proximity to the upper and lower dies 30 and 40 in a state of being stretched over the mold surfaces. Further, the release film 51 is provided at least in the two cavities 31 on the mold surfaces of the upper and lower molds 30 and 40.
• The release film is a long film member supplied to each of the 41 surfaces. The release film has heat resistance to withstand the resin molding temperature (for example, 175 ° C) and prevents damage during resin molding. Any material may be used as long as it has flexibility that can be elastically deformed and non-adhesiveness (peelability) with a resin that can be peeled off from the resin-sealed molded article after molding.

Further, in the mold apparatus shown in FIG. 3, a vacuum source (not shown) such as a vacuum pump is connected to the air passage 50 through a switching valve (not shown) so as to communicate with the ventilation holes 33 and 43. At the same time, by switching the switching valve to evacuate (decompress) the air in the upper and lower cavities 31 and 41 through the ventilation holes 33 and 43 and the air passage 50, the outside of the upper and lower cavities 31 and 41 can be reduced. Is forcibly sucked and discharged, that is, a forced exhaust mechanism is provided. That is, before injecting and filling the molten resin material into the upper and lower cavities 31 and 41, the suction force is obtained by evacuating from the air holes 33 and 43 provided on the inner bottom surfaces of the upper and lower cavities 31 and 41. The release film 51 supplied between the two mold surfaces of the upper and lower molds 30 and 40 is stretched in a state of covering the shape of the upper and lower cavities 31 and 41, and the release film 51 is It can be elastically deformed. As in the case of the upper and lower cavities 31 and 41, it is possible to adopt a configuration in which a forced exhaust mechanism such as the air passage 50 or the like is provided at required locations on both mold surfaces of the upper and lower molds 30 and 40. In other words, the release film 51 is moved by the forcible exhaust mechanism so as to form the concave and convex shapes of the both mold surfaces (for example, the above-mentioned cull portion, upper and lower mold resin passages).
The release film 51 can be elastically deformed by stretching the mold surface along the surface of the mold.

Therefore, the resin encapsulation molding of the electronic component by the resin encapsulation molding die device shown in FIG. 3 is performed as follows. That is, when the molds 30 and 40 are opened, the release films 51 are respectively supplied to the mold surfaces, and the lead frame 6 on which electronic parts are mounted is provided between the release films 51 (that is, the upper and lower molds). (Between the mold surfaces) to clamp both the molds 30 and 40, and at the same time to mount the electronic parts to the upper and lower cavities 31.4
Insert and set in 1. Next, the release film 51 is elastically deformed along the shape of the upper and lower cavities 31 and 41 by the forced exhaust mechanism. Next, the resin material heated and melted by the plunger from the pot provided in the lower mold 40 is passed through the cull portion, the upper mold and the lower mold resin passages provided in the upper mold 30 and into the upper and lower cavities 31 and 41. And a predetermined resin pressure is applied to the resin in the upper and lower cavities 31 and 41 by the plunger. Therefore, the resin molding 55 corresponding to the shape of the upper and lower cavities 31 and 41 can be formed in the upper and lower cavities 31 and 41, and the lead frame 6 can be formed in the resin molding 55. The mounted electronic component can be sealed and molded. Also, next,
After applying a predetermined resin pressure to the resin in the upper and lower cavities 31 and 41 (that is, between the two release films 51),
The resin in the upper and lower cavities 31 and 41 is pressed through the release film 51 by the pressing means. That is, the open / close pins 32/42 are moved to open the ventilation holes 33/43 on the inner bottom surfaces of the upper / lower cavities 31/41, and compressed air is supplied from the compressed air source to the upper / lower cavities 31/41. The resin in the upper and lower cavities 31 and 41 is pressed from the outside to the surface of the lead frame 6 through the release film 51 by pressure feeding and pressing the release film 51 with compressed air. Therefore, it is possible to improve the adhesiveness between the resin sealing molded body 55 formed in the upper and lower cavities 31 and 41 and the lead frame 6 and the electronic component.

Next, the resin sealing mold shown in FIG. 4 will be described. The basic configuration of the mold apparatus shown in FIG. 4 is the same as the configuration shown in FIGS. That is, in the mold apparatus shown in FIG. 4, as in the embodiment shown in FIGS. 1 and 2, a mold including a fixed upper mold 70 and a movable lower mold 80 opposed to the fixed upper mold 70 is provided. The upper and lower cavities 71 and 81 for resin molding are provided on the mold surfaces of the upper and lower molds 70 and 80.
Are arranged so that the electronic parts mounted on the lead frame 6 can be fitted and set when the upper and lower molds 70 and 80 are clamped. Further, pressing members 72, 82 (pressing means) for pressing the resin in the upper and lower cavities 71, 81 are provided on the inner bottom surfaces of the upper and lower cavities 71, 81, and the pressing members 72, 82 are pushed by the pressing members 72, 82. Elastic members 73 and 83 such as springs for pressing the members 72 and 82 in the mold surface direction are provided, and after the predetermined resin pressure is applied to the resin in the upper and lower cavities, the pressing members 72 and 82 (that is, the upper and lower Both cavities
The resin in the upper and lower cavities 71 and 81 is pressed by the bottom surface of 71 and 81).

That is, in the mold apparatus shown in FIG. 4, by pressing the resin material heated and melted in the pot of the mold with the plunger, the above-mentioned mold cavities 71, 81.
After a predetermined resin pressure is applied to the resin injected and filled in the mold cavities 71 and 81, the resin in the mold cavities 71 and 81 is pressed by the pressing members 72 and 82. By pressing, the resin in the mold cavities 71 and 81 can be pressed against the surface of the lead frame 6 from outside. Therefore, it is possible to improve the adhesiveness between the resin frame 90 and the lead frame 6 and the electronic components formed in the upper and lower cavities 71 and 81.

Next, the resin sealing mold shown in FIG. 5 will be described. The basic configuration of the mold apparatus shown in FIG. 5 is the same as the configuration shown in FIGS. In other words, the mold apparatus shown in FIG. 5 includes a mold including a fixed upper mold 100 and a movable lower mold 200 disposed opposite to the fixed upper mold 100, as in the embodiment shown in FIGS. The upper and lower molds 100 and 200 are provided with upper and lower cavities 101 and 201 for resin molding, respectively. In addition, an electronic component (not shown) mounted on the lead frame 300 can be fitted and set in the upper and lower cavities 101 and 201, and a heat dissipation plate 31 can be attached to the inner bottom surface of the upper and lower cavities 101 and 201.
It is configured so that 0 · 311 can be fixedly set.

The inner bottom surfaces of the upper and lower cavities 101 and 201 have an air passage communicating with the inside of the cavities 101 and 201.
The required number of 102 and 202 are provided, and
102 and 202 are air compression sources 330 and 331 for pumping compressed air through switching valves 320 and 321;
A vacuum source that forcibly sucks and discharges (decompresses) the air inside 201
340 and 341 are provided.

Therefore, in the mold apparatus shown in FIG. 5, the electronic components mounted on the lead frame 300 and the heat radiating plates 310 and 31 in the upper and lower cavities 101 and 201 of the upper and lower molds 100 and 200, respectively.
1 is set and both molds 100 and 200 are clamped. At this time, the heat radiating plates 310 and 311 are fixedly set on the inner bottom surfaces of the upper and lower cavities 101 and 201 by using the suction force of the vacuum sources 340 and 341. Next, the resin material heated and melted in a pot (not shown) provided in the lower mold 200 is pressed by a plunger, and the cull of the upper mold 100 and the resin passages of the upper mold and the lower mold are passed through. The upper and lower cavities 101 and 201 are injected and filled. Next, after a predetermined resin pressure is applied to the resin in the upper and lower cavities 101 and 201, the switching valves 320 and 321 are switched so that compressed air is supplied from the air compression sources 330 and 331 to the upper and lower cavities 101 and 201. By squeezing the inside of the cavity 101, 201, the heat dissipation plate 310.
It is possible to apply pressure to 311 and press the resin in the upper and lower cavities 101 and 201 against the surface of the lead frame 300 through the heat radiating plates 310 and 311. Therefore, the resin-sealed molded body 350 formed in the upper and lower cavities 101 and 201
It is possible to improve the adhesion between the lead frame 300 and the electronic component.

Further, instead of the compressed air in the above-mentioned embodiment, a gas such as nitrogen gas, carbon dioxide gas or argon gas can be adopted.

The present invention is not limited to the above-mentioned embodiments, but can be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

[0034]

According to the present invention, the present invention provides a method for resin-encapsulating and molding an electronic component, which can improve the adhesion between a resin-encapsulated molded article formed in a mold cavity and a lead frame. It has an excellent effect that it can be provided.

Further, according to the present invention, the adhesion between the resin-sealed molded body molded in the mold cavity and the lead frame is improved so that the resin-sealed molded body and the lead frame are interposed between the resin-sealed molded body and the lead frame. It can be said that a product of high quality and high reliability can be obtained by preventing the formation of a gap and preventing water from entering between the resin-sealed molded product and the lead frame. It has an excellent effect.

[Brief description of drawings]

FIG. 1 is a schematic longitudinal sectional view showing a main part of a mold of a resin molding apparatus for carrying out a method of the present invention, showing a state of a cavity in the mold before resin injection and filling. I have.

FIG. 2 is a schematic vertical sectional view showing a main part of a mold of the resin molding apparatus for molding corresponding to FIG. 1, wherein compressed air is fed to a resin in a cavity in the mold to compress the resin. The state of pressing is shown.

FIG. 3 is a schematic longitudinal sectional view showing a main part of a mold of a resin molding apparatus for carrying out the method of the present invention, in which a resin in a cavity of the mold follows a shape of the cavity. This shows a state in which compressed air is pressure-fed to the release film coated with the resin and the resin is pressed through the release film.

FIG. 4 is a schematic vertical sectional view showing a main part of a mold of a resin molding apparatus for carrying out the method of the present invention, wherein a resin in a cavity in the mold is provided on an inner bottom surface of the cavity; The state where the resin is pressed by the provided pressing member is shown.

FIG. 5 is a schematic longitudinal sectional view showing a main part of a mold of a mold apparatus for resin molding for carrying out the method of the present invention, and a heat sink fixed to a bottom surface of a cavity in the mold. 2 shows a state in which compressed air is pressure-fed and the resin is pressed through the above-described heat radiating plate.

[Explanation of symbols]

1 Fixed upper mold 30 Fixed upper mold 2 Movable lower mold 40 Movable lower mold 3 Cavity 31 Cavity 4 Cavity 41 Cavity 5 Electronic component 32 Open / close pin 6 Lead frame 33 Vent hole 7 Resin sealing molding 42 Open / close pin 8 Vent hole 43 through Pore 9 Air passage 50 Air passage 10 Air compression source 51 Release film 11 Open / close pin 52 Release film supply mechanism 12 Vent hole 55 Resin sealing molding 13 Open / close pin

Claims (6)

[Claims] 1. A resin material heat-melted in the mold cavity by fitting and setting an electronic component mounted on a lead frame in a mold cavity opposite to a fixed mold surface and a movable mold surface. Is a resin encapsulation molding method for an electronic component in which the electronic component in the mold cavity and the lead frame around it are encapsulated in a resin encapsulation molded body corresponding to the shape of the mold cavity. Then, after a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, the resin in the mold cavity is pressed from the outside to the lead frame surface, and the resin sealing is performed. A resin encapsulation molding method for an electronic component, which is configured to improve adhesion between a molded body and a lead frame. 2. The resin in the mold cavity is fixed by applying a predetermined resin pressure to the resin injected and filled in the mold cavity, and then sending compressed air to the resin in the mold cavity to press the resin in the mold cavity. The resin encapsulation molding method for an electronic component according to claim 1, wherein the surface of the lead frame is pressed from the outside. 3. After a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, the mold cavity is stretched while being covered with the mold cavity along the shape of the mold cavity. The resin sealing of the electronic component according to claim 1, wherein the resin in the mold cavity is pressed against the lead frame surface from the outside through the release film by sending compressed air to the mold film. Stop forming method. 4. After a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, the resin in the mold cavity is externally pressed by a pressing member provided on the bottom surface of the mold cavity. The resin encapsulation molding method for an electronic component according to claim 1, wherein the surface of the lead frame is pressed. 5. A fixed mold and a movable mold, which are clamped at a predetermined low mold clamping pressure after a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, and further a predetermined high mold. The resin encapsulation molding method for an electronic component according to claim 1, wherein the resin in the mold cavity is pressed against the lead frame surface from outside by clamping the mold with a clamping pressure. 6. An electronic component mounted on a lead frame is fitted and set in a mold cavity provided opposite to a mold surface of a fixed mold and a movable mold, and a heat dissipation plate is fixed to an inner bottom surface of the mold cavity. And mold and fill the mold cavity with the heated and melted resin material, and seal the electronic components in the mold cavity and the lead frame around it with resin corresponding to the shape of the mold cavity. A resin encapsulation molding method for an electronic component, comprising encapsulating in a molded body, wherein a predetermined resin pressure is applied to the resin injected and filled in the mold cavity, and then the resin in the mold cavity is externally sealed. The resin is pressed against the lead frame surface via the heat sink by sending compressed air from the heat sink to the heat sink, and the adhesion between the resin-sealed molded body and the lead frame is improved. Method of resin-seal-molding an electronic component, characterized by being configured to.