JPH08197567A - Resin molding method and resin molding device - Google Patents

Abstract

PURPOSE: To make possible the creation of a resin molding with enhanced molding properties and consequently increased reliability by injecting a resin supplied from a pot under pressure into an interior between a molding and a release film and mold the resin along the inner profile of a resin molding part. CONSTITUTION: A release film 20 is supported by aspiration onto the facing of molding dies 10a, 10b with a resin molding part, and a molding 30 is clamped through the release film 20. In addition, a resin supplied under pressure from a pot 12 is injected into an interior between the molding 30 and the release film 20 covering the former. The resin is charged into the interior in such a manner that it inflates the release film 20, and thus is formed along the inner profile of the resin molding part. Further, the resin is charged into a clearance between the release film 20 and the molding 30, so that the charging of the resin is accomplished without the entrainment of an air to form the resin molding free from air voids.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method and a resin molding apparatus applied to the manufacture of a resin-sealed semiconductor device.

[0002]

2. Description of the Related Art FIG. 18 is a sectional view showing the structure of a conventional resin mold device used for manufacturing a resin-sealed semiconductor device. The molded product is clamped by the upper mold 10a and the lower mold 10b, and the resin is pressure-fed from the pot 12 to the cavity 14 to be resin-molded. 16 is pot 1
A mold cull provided on the upper mold 10a facing 2 is a runner 17 and a gate 18.

[0003]

By the way, in the conventional resin molding apparatus, when the molded product is clamped, the resin path portion such as the cavity 14 and the runner 17 for filling the resin is a space. When the cavity 14 was filled with the resin, there was a problem that the air in the cavity 14 or the resin path portion was entrained and mixed into the resin to cause air voids in the molded resin.

As described above, the present invention provides a resin molding method and a resin molding apparatus which eliminate the occurrence of air voids during resin molding, improve moldability, and enable highly reliable resin molding. With the goal.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in a resin molding method in which a resin molding part of a molding die is covered with a release film, and a pot is supplied with a wrapping resin to mold an article to be molded such as a lead frame with a resin, a molding die provided with the resin molding part. The release film is adsorbed and supported on the mold surface of the mold, and the resin mold range of the molded product is covered with the release film by clamping the molded product through the release film, and the molded product and the It is characterized by injecting a resin that is pressure-fed from the pot into the inside sandwiched by a release film to mold the resin according to the shape of the inner surface of the resin molding portion. Further, it is characterized in that the molded product is mounted with a semiconductor chip by a connection method such as bump connection without using a bonding wire. In addition, after the molded product is clamped through the release film, air pressure is applied to the cavity to discharge the air in the gap sandwiched between the release film and the molded product to the outside, and the resin mold It is characterized by doing. Also, cover the resin molding part of the mold with a release film,
A resin molding device that supplies a lapping resin to a pot to perform resin molding, and a suction support mechanism that suction-supports the release film on a mold surface of the mold.
After clamping the article to be molded through the release film, after ejecting air from the gap between the release film and the molded article, and after ejecting air in the gap by the air ejection mechanism , A resin pumping mechanism for pumping resin from the pot to the inside sandwiched between the release film and the article to be molded so as to mold the resin according to the shape of the inner surface of the resin molding portion. . Further, the air discharge mechanism has a cavity vent hole having one end opened in the cavity and a cavity vent hole communicating with the cavity vent hole, and communicating between the upper die and the lower die during mold clamping so that the cavity interior is closed. It is characterized in that it has a cavity conduction path that opens at the same position on the clamp surface of the mold so as to obtain a uniform pressure, and an air mechanism that communicates with the cavity ventilation hole and the cavity conduction path and applies air pressure. Further, as the air discharge mechanism, an air vent portion is provided on the clamp surface of the mold so as to communicate with the cavity.

[0006]

In the resin molding apparatus according to the present invention, the molded product is clamped via the release film, and then the resin is injected into the release film from the state where the molded product is covered with the release film. The resin is filled so as to swell the release film, and finally the resin is molded according to the shape of the inner surface of the resin molding portion. By filling the resin through the gap between the release film and the molded product, the resin can be filled without entraining air, and resin molding without air voids is possible. When the product to be molded is covered with the release film, air pressure is applied to the cavity to expel the air in the gap between the release film and the product to perform resin molding to further suppress the influence of air. It can be resin-molded.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a sectional view showing the structure of an embodiment of a resin molding apparatus according to the present invention. The resin molding apparatus of the embodiment is an apparatus that covers the resin molding portion of the molding die with the release film 20 and performs resin molding.
It is characterized in that the release film 20 is used so that air can be prevented from entering the mold resin as much as possible and the resin can be molded.

In FIG. 1, the molded product 30 is located on the left half of the center line.
Is clamped by the upper mold 10a and the lower mold 10b via the release film 20, and the molded product 30 is resin-molded in the right half part from the center line. As shown in the figure, the resin molding apparatus of the present embodiment is characterized in that when the molded product 30 is clamped, the release film 20 covers the resin molded portion of the molded product 30 for clamping.

The release film 20 is adsorbed and supported on the mold by an air adsorbing mechanism. In FIG. 1, reference numeral 21 is a cavity vent hole that opens at the bottom of the cavity recess, and 22 is a suction hole that opens at the clamp surface of the molding die. As shown in FIG. 2, the cavity vent hole 21 is formed in the cavity recess 15
A suction hole 22 is provided around the cavity concave portion 15 and has a slit-like opening at the peripheral edge of the inner bottom surface of the suction hole 22. The cavity vent hole 21 and the suction hole 22 are provided with an air flow path 24a provided in a support block 23 for fixing the upper mold 10a and the lower mold 10b,
The air flow paths 24a and 24b communicate with the air mechanisms A and B, respectively.

When the resin is molded, the cavity vent holes 21 of the upper mold 10a and the lower mold 10b are communicated with each other.
The upper mold 10a and the lower mold 10b are provided with cavity passages 25a, 2
5b is provided. The cavity communication paths 25a and 25b are shown in FIG.
As shown in FIG. 3, the upper mold 10a and the lower mold 10b are opened at the same position on the parting surfaces, and are connected to the air flow path 24a in the support block 23. FIG. 2 shows a planar arrangement position of the cavity conduction path 25b in the lower mold 10b. One cavity passage 25b is provided in each cavity recess 15.

In the embodiment, the cavity vent hole 21 is provided with a cavity bottom piece 26 manufactured separately from the base portion of the molding die to form a slit hole, and the suction hole 22 is formed as the suction hole 22. It was formed by providing a through hole in the portion. As described above, at the time of resin molding, the resin molding portion is covered with the release film 20 and molded, so that the cavity bottom piece 26 can be made of a material such as copper or aluminum that cannot be used in the past as the material of the molding die. Become. Further, by incorporating the heater 27 inside the cavity bottom piece 26, it is possible to directly heat the cavity bottom piece 26 and promote heat exchange with the mold resin.

As described above, the release film 20 is for resin molding without directly contacting the resin with the resin molding portion of the molding die, but the pot 12, runner 17, gate 18, etc. other than the resin molding portion. In order to prevent the resin from coming into contact with the mold even in the portion of, the wrapping resin 40 sealed with the wrapping film 41 is used for the pot 1
2 and resin mold. As shown in FIG. 2, in the molding die of the embodiment, since the pot 12 is formed in a plane shape and elongated, the lapping resin 40 supplied to the pot 12 also has a stick shape.

The lapping resin 40 seals the lapping resin 40 with the lapping resin 40 set in the pot 12, and the lapping film 41 is a runner 17 and a gate 18.
Is formed so as to cover the mold surface with the resin path portion of. Figure 2
The extension piece 42 is extended from the side edge of the wrapping film 41 in order to prevent the resin from adhering to the mold die and the molding target 30 at the runner 17 and the gate 18 when the resin is molded. Extend piece 4 according to the road
2 is formed.

In FIG. 2, 28 is a pilot pin for positioning and setting the wrapping resin 40 in the pot 12. Pilot pin 28 on wrapping film 41
A pilot hole to be fitted to is provided so that the lapping resin 40 can be set by accurately aligning it with the pot 12 and the molding target 30. As the resin to be stored in the wrapping resin 40, it is also possible to use a compression resin or a powder resin obtained by crushing a resin material extruded and then compression-molding it into a predetermined shape, but the extruded resin is used as it is. This makes it possible to suppress the air content in the resin and perform suitable resin molding. Since the wrapping resin 40 is hermetically sealed with the wrapping film 41, adsorption of moisture can be prevented, and it is suitable for resin molding.

The release film 20 and the wrapping film 41 are required to have functions such as heat resistance that can withstand the heating temperature of the molding die, peelability that can be easily peeled from the molding die and molding resin, and a certain degree of flexibility. As materials for the release film 20 and the wrapping film 41, FEP sheet film, PET sheet film, fluororesin-impregnated glass cloth, polyvinylidene chloride, etc. can be used.

Next, the operation of resin-molding the molded article 30 with the resin molding apparatus of the above embodiment will be described with reference to FIGS. In the figure, only the right half from the center line is shown. FIG. 3 shows a state in which the release film 20 is fed in conforming to the resin molding portions of the upper mold 10a and the lower mold 10b while the upper mold 10a and the lower mold 10b are opened.

In FIG. 4, the release film 20 is attached to the suction hole 22.
The air is sucked from the upper mold 10a and the lower mold 10b to be respectively adsorbed and supported on the clamping surfaces, while the loader 50 supports the lapping resin 40 and the molding target 30 to wrap the molding target 30 above the lower mold 10b. This is a state in which the resin 40 has been sent. The molded product 30 and the wrapping resin 40 are the lower mold 10.
Air is sucked and supported by the loader 50 in accordance with the set position of the molding target 30 and the wrapping resin 40 in b. It is to be noted that the molded product 30 is preferably connected by a method in which a semiconductor chip is not used with a bonding wire, for example, a method in which bumps are connected and mounted, a method using a TAB tape, or the like.

Next, the loader 50 is lowered onto the lower mold 10b to set the lapping resin 40 in the pot 12, and at the same time, the molded product 30 is set on the release film 20 sucked and supported on the lower mold 10b. (Fig. 5). The molded product 30 can be positioned by inserting a guide pin into the guide hole as in the conventional case. Next, the loader 50
Is pulled out of the apparatus, and the upper die 10a is moved downward to clamp the article to be molded 30 (FIG. 6). As a result, the molded product 30 is clamped via the release film 20 on the upper mold side and the release film 20 on the lower mold side.

In the state shown in FIG. 6, the portion of the molded product 30 in the cavity is simply sandwiched by the release film 20. FIG. 7 shows that from this state, air pressure is applied to the inside of the cavity 32 from the air mechanism communicating with the cavity ventilation hole 21 through the cavity ventilation hole 21.
It shows that an operation is performed to discharge air from the gap portion sandwiched between the molded article 30 and the release film 20 inside.
The purpose of this air exhaust operation is to exhaust unnecessary air so that the air is not entrained during resin molding.

When performing this air exhaust operation, the cavity 3
Since 2 is divided into upper and lower parts by the molded product 30 and the release film 20, it is necessary to balance the air pressure by the upper and lower molds when the air pressure is applied. The balance of the air pressure is automatically made by connecting the cavity communication paths 25a and 25b provided in the upper mold 10a and the lower mold 10b and communicating the cavity vent holes 21 through the air flow path 24a.

When air pressure is applied to the molded product 30 and the release film 20, the air is discharged from the air vent portion 34 provided in the upper mold 10a and the lower mold 10b. FIG. 2 shows the air vent portion 34 of the lower mold 10b. The air vent portion 34 is provided on the clamp surface of the lower die 10b in a narrow streak shape from the center portion side of the molding die toward the outer edge, and each corner portion of the cavity recess 15 and the air vent portion 34 are connected by the air vent passage 36. are doing. By applying air pressure to the cavity 32, the air vent passage 34,
Air is discharged from the air vent portion 32 to the outside of the mold. The upper die 10a is also provided with the air vent portion 32 and the air vent passage 34 in the same manner. The air vent portion 32, the cavity communication paths 25a and 25b, the cavity vent hole 21,
The air mechanism or the like constitutes an air discharge mechanism.

After air is discharged from the gap between the molded product 30 and the release film 20, the air flow paths 24a, 24
After b is opened to the atmosphere and the balance pressure through the cavity passages 25a and 25b is reduced, the molten resin is pumped from the pot 12 into the cavity 32. Figure 8 shows the plunger 3
8 shows a state where 8 is pushed up to fill the cavity 32 with resin. The resin that is pressure-fed from the pot 12 advances by spreading the wrapping film 41 at the runner 17 and the gate 18, and is injected from the gap part sandwiched between the release film 20 and the molding target 30 to swell the release film 20 with the resin. Then it is filled. Then, the resin is molded by filling the entire cavity 32 with the resin.

In the case of the present embodiment, since the resin is injected while the air is discharged from between the molded product 30 and the release film 20, there is no air entrapment and no air void when the resin is filled in the cavity 32. Suitable resin molding can be performed. In particular, if an extrusion molding resin is used as the wrapping resin 40, the inclusion of air in the resin can be suppressed and more suitable resin molding can be performed.

FIG. 9 shows a state where the upper mold 10a and the lower mold 10b are opened after resin molding and the molded product 60 is taken out by the unloader 52. After the unloader 52 is opened,
Inserted between the molds and lowered to above the lower mold 10b to form the molded product 6
0 is adsorbed and it rises again to the pull-out position. When the molded product 60 is suction-supported from the lower mold 10b, the plunger 38 is pushed up to pass the used lapping resin 40 to the unloader 52, and the molded product 6 is sucked from the suction hole 22.
Apply air pressure in the direction of releasing 0 to facilitate release.
The figure shows that the upper and lower release films 20 are peeled and removed from the molded product 60 suction-supported by the unloader 52.

In the resin molding apparatus of the embodiment, the resin is molded through the release film 20, so that the mold can be released from the mold very easily, and the resin does not adhere to and remain on the mold surface. Also, the molded product 60
It is easy to remove the release film 20 from, and there is an advantage that the degate operation becomes unnecessary because the runner resin does not adhere to the surface of the molded product 20. After taking out the molded product 60, the operation of feeding the release film 20 shown in FIG. 3 is returned to and the next resin molding operation is performed.

The above resin molding apparatus is an apparatus for producing a double-sided resin molded product, and FIGS. 10 to 15 show an example of an apparatus for producing a single-sided resin molded product like BGA. As shown in FIG. 10, in the resin molding apparatus of this embodiment, the upper mold 10a sucks the molded product 30 and the lower mold 1
The release film 20 is adsorbed and supported on 0b to be resin-molded. The loader 50 supports the molding target 30 on the upper surface,
The wrapping resin 40 and the release film 20 are supported on the lower surface and enter between the molds, and the upper mold 10a and the lower mold 10b adsorb and support the molded product 30, the wrapping resin 40 and the release film 20, respectively (FIG. 10).

FIG. 11 shows the lower mold 10b in which the upper mold 10a is lowered.
And the molded product 30 is clamped via the release film 20 between. Next, as shown in FIG. 12, from the cavity vent hole 21 of the lower mold 10b to the cavity 32.
Air pressure is applied inside to release film 20 and molded product 3
Air is exhausted from the gap between the air gap and zero. At this time, the air is also discharged from the air vent portion provided in the lower mold 10b as in the above embodiment.

FIG. 13 shows a state in which the plunger 38 is pushed up to fill the cavity 32 with resin from the pot 12. Also in this embodiment, since the resin is filled after the air between the molded product 30 and the release film 20 is discharged, the resin can be filled without air entrapment. FIG. 14 shows a state in which the unloader 52 is inserted between the molds to take out the molded product 60 after resin molding. When delivering the molded product 60 to the unloader 52, as shown in FIG.
By sucking the release film 20 in advance, the release film 20 can be separated from the molded product 60 and released.

Wrapping resin 40 by unloader 52
After taking out the molded product 60 and the molded product 60, air pressure is applied to the cavity vent holes 21 of the lower mold 10b as shown in FIG.
Release film 2 remaining in cavity recess 15 of 0b
Release 0 and remove. Also in the case of the present embodiment, by covering the cavity concave portion with the release film 20, resin molding can be performed without contacting the resin with the mold surface of the mold, and the molded product 60 can be easily released from the mold. You can

In the above-described embodiment, air pressure is applied to the cavity to expel air from the gap between the release film 20 and the molded product 30, but as shown in FIG. 17, the release film 20 and the molded product are molded. A method is also possible in which the suction tube 70 is sandwiched and clamped in the middle of being sandwiched between the product 30 and the air, and the resin in the cavity is forcibly discharged from the suction tube 70 and then the resin is filled. The suction tube 70 may be arranged so as to be sandwiched between the ends of the air vents 72 provided in the mold.

[0031]

As described above, according to the resin molding method and the resin molding apparatus of the present invention, it is possible to prevent the entrainment of air at the time of resin molding and perform resin molding. It is possible to form a resin mold that effectively suppresses the occurrence of the above, and it is possible to obtain a highly reliable semiconductor device.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a resin molding device.

[FIG. 2] Wrapping resin in the lower mold of the resin molding apparatus,
It is an explanatory view showing a plane arrangement of a release film and the like.

FIG. 3 is an explanatory view showing a state in which a release film is fed between the molds.

FIG. 4 is an explanatory view showing a state in which an article to be molded is fed between the molds.

FIG. 5 is an explanatory diagram showing a state in which a molded product and a wrapping resin are set in a lower mold.

FIG. 6 is an explanatory view showing a state in which a molded product is clamped by an upper mold and a lower mold.

FIG. 7 is an explanatory diagram showing a state in which air is discharged from a gap portion between a release film and a molded product.

FIG. 8 is an explanatory diagram showing a state in which resin is injected from a pot and resin molding is performed.

FIG. 9 is an explanatory diagram showing a state in which a molded product is taken out from the mold.

FIG. 10 is an explanatory diagram showing a state in which the molded product is set in the upper mold and the wrapping resin and the release film are set in the lower mold.

FIG. 11 is an explanatory diagram showing a state where a molded product is clamped by an upper mold and a lower mold.

FIG. 12 is an explanatory diagram showing a state in which air is discharged from a gap portion between a release film and a molded product.

FIG. 13 is an explanatory diagram showing a state where resin is injected from a pot and resin molding is performed.

FIG. 14 is an explanatory view showing a state in which a molded product is taken out from a mold after resin molding.

FIG. 15 is an explanatory diagram showing a state where the molded product is released from the lower mold.

FIG. 16 is an explanatory view showing the manner of releasing the release film from the lower mold.

FIG. 17 is a cross-sectional view showing a structure for discharging the air in the cavity from the suction pipe.

FIG. 18 is a cross-sectional view showing a configuration of a conventional example of a resin molding device.

[Explanation of symbols]

 10a Upper mold 10b Lower mold 12 Pot 15 Cavity concave portion 17 Runner 18 Gate 20 Release film 21 Cavity vent hole 22 Adsorption hole 24a, 24b Air flow passage 25a, 25b Cavity passageway 26 Cavity bottom piece 30 Molded part 32 Cavity 34 Air vent part 40 wrapping resin 41 wrapping film 50 loader 52 unloader 60 molded product

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01L 23/28 Z

Claims (6)

[Claims] 1. A resin molding method in which a resin molding portion of a molding die is covered with a release film, and lapping resin is supplied to a pot to mold a molded product such as a lead frame with a resin, wherein the resin molding portion is provided. The release film is adsorbed and supported on the mold surface of the molding die, and the resin molding range of the molding target is covered with the release film by clamping the molding target through the release film. A resin molding method characterized by performing resin molding in accordance with the shape of the inner surface of the resin molding portion by injecting a resin that is pressure-fed from the pot into the inside sandwiched between the product and the release film. 2. The resin molding method according to claim 1, wherein the molded product has a semiconductor chip mounted by a connection method such as bump connection without using a bonding wire. 3. After the molded product is clamped through the release film, air pressure is applied to the inside of the cavity to discharge the air in the gap between the release film and the molded product to the outside. The resin molding method according to claim 1, wherein resin molding is performed. 4. A resin molding apparatus for covering a resin molding portion of a molding die with a release film and supplying a lapping resin to a pot to perform resin molding, wherein the release film is formed on a molding surface of the molding die. An adsorption support mechanism for adsorbing and supporting, an air ejection mechanism for ejecting air from a gap portion between the release film and the molded article after the molded article is clamped via the release film, and the air ejection mechanism for ejecting air. After the air in the gap is discharged, the resin is pressure-fed from the pot to the inside sandwiched between the release film and the molding target, and the resin pressure-feeding mechanism is used to mold the resin according to the shape of the inner surface of the resin molding part. A resin molding device comprising: 5. The air discharge mechanism has a cavity vent hole provided at one end with an opening in the cavity, and a cavity vent hole communicating with the cavity vent hole, and communicating between the upper die and the lower die during mold clamping. It has a cavity conduction path that opens at the same position on the clamp surface of the mold so as to make the cavity uniform pressure, and an air mechanism that communicates with the cavity ventilation hole and the cavity conduction path to apply air pressure. The resin molding device according to claim 4. 6. The resin molding apparatus according to claim 5, wherein as the air discharging mechanism, an air vent portion is provided on the clamp surface of the mold so as to communicate with the cavity.