KR102114804B1 - Apparatus and method for supplying resin material of compression molding apparatus, compression molding apparatus and resin molding product manufacturing method - Google Patents

Abstract

[Problem] A resin material supply device for a compression molding apparatus capable of supplying a resin material in a cavity with a small variation is provided.
[Resolution means] The resin material supply device 19 has a size corresponding to the resin material holding portion 20 having a shape corresponding to the planar shape of the cavity, and 1/4 of the resin material holding portion 20 disposed thereon. A small resin material holding portion 40 having a resin material holding portion 20 and a resin material holding portion 20 under the resin material holding portion 20 (that is, when the resin material supply device 19 is disposed on the cavity) It is composed of a diffuser plate (60) disposed between the cavity. The resin material holding portion 20 is provided with a moving portion 30 that moves it in-plane, and a diffusion plate 60 is provided with an excitation portion 70 that vibrates it. The resin material is supplied from the small resin material holding portion 40 to the plurality of resin material receiving portions 22 of the resin material holding portion 20 in the first step, and the plurality of resin materials are received in the second step. Each of the parts 22 is rotated and dropped in the cavity. At that time, the resin is supplied to the cavity so as to have a small deviation by vibrating the diffusion plate 60.

Description

Resin material supply device and method for compression molding device and method for manufacturing compression molding device and resin molded product

The present invention relates to an apparatus for sealing an electronic component such as a semiconductor chip with a resin, and in particular, a resin material having a form of granule, powder, etc. for compression molding (hereinafter specifically described) A resin material supply apparatus and method for supplying a mold cavity with a granular or powdered resin material, in the simple case of "resin material", except for one case, and the resin material supply It relates to a compression molding apparatus having a device and a method for manufacturing a resin molded article.

With the miniaturization of electronic components and the small size of bonding wires such as semiconductor chips, compression molding is used for sealing molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold coated with a release film, heated and melted, and thereafter between an upper mold equipped with a substrate on which electronic components are mounted. Molding is performed by pressing the resin and compressing the resin. In such compression molding, in order to perform defect-free molding across the entire large-sized substrate, it is important to supply the cavity with a predetermined amount of resin material without oversupply and evenly. If there is non-uniformity in the amount of the resin material supplied to the cavity, the flow (movement) of the resin material occurs in the cavity at the time of clamping, which adversely affects wiring such as bonding wires of the electronic component substrate.

In order to uniformly supply a predetermined amount of the resin material to the cavity, rather than supplying the resin material directly to the cavity from the supply section for storing the resin material, the resin material is once provided with a tray for resin having a shape corresponding to the cavity. To a uniform thickness, and thereafter, a method in which a resin material is dropped from a tray for resin into a cavity at the same time is taken.

One of the methods of simultaneously dropping the resin material from the resin tray is a method of opening a shutter made of two flat plates protruding from the center of the resin tray (this is called a 'simple shutter method'). box).

Further, as a method for more uniformly supplying the resin material into the cavity, as shown in Fig. 12, a plurality of slit-shaped resin material supply holes 932 are provided in the resin tray 931 (Fig. 12 is a resin material). It is a cross-sectional view of a plane perpendicular to the longitudinal direction of the slit of the supply hole 932, and the cross sections of the three resin material supply holes 932 are shown), provided at the bottom of the resin tray 931, protruding from the center 2 The resin material is supplied from each resin material supply hole 932 by opening the shutter 933 made of a sheet of flat sheets in a direction perpendicular to the longitudinal direction of the slit of the resin material supply hole 932 (in the left and right directions in Fig. 12). There is a method of falling in the cavity 934 (this is called a slit-shutter method).

Similarly, as a method of using a resin tray having a plurality of slit-shaped resin material supply holes, there is also a method shown in FIG. 13. In this method, the resin tray 940 is composed of an upper tray 941 and a lower tray 942, and a plurality of parallel slit-shaped resin material supply holes are formed in both. In this resin tray 940, the resin material supply hole 943 of the upper tray 941 functions as a resin holding portion for holding the resin, and the resin material supply hole 944 of the lower tray 942 is the upper part. It functions as an opening for dropping the resin material held in the resin material supply hole 943 of the tray 941. The upper tray with the resin material supply holes 943 and 944 of the upper and lower trays 941 and 942 do not completely fit (that is, the non-opening of the lower tray 942 blocks the opening of the upper tray 941). The resin material is supplied to the resin material supply hole 943 of (941), and the tray 940 for resin is placed on the cavity 955 (Fig. 13 (a)). Then, by moving the upper tray 941 in the direction perpendicular to the slits of the resin material supply holes 943 and 944 (left and right directions in Fig. 13), the resin material supply hole 943 in the upper tray 941 is moved. The resin material is dropped into the cavity 955 through the resin material supply hole 944 of the lower tray 942 (Fig. 13 (b), this is referred to as a 'up and down slit method').

In the simple shutter system, the slit shutter system, and the vertical slit system, in order to move the shutter smoothly, a slight gap may occur between the bottom of the resin tray and the upper surface of the shutter. When such a gap exists, when moving the shutter or the upper tray, a resin material may enter or flow into the gap, thereby preventing the movement of the shutter or the upper tray. In this case, the moving speed of the shutter or upper tray becomes slow or non-uniform, and the amount of the resin material supplied into the cavity becomes non-uniform. Moreover, in the worst case, the movement of the shutter or upper tray stops halfway, so that the resin material is not supplied to a part of the cavity.

Patent document 1 discloses a resin supply device that solves the problem of such resins being repelled. The resin supply device (resin input device) includes a container reversing mechanism capable of inverting the resin tray to inject the resin contained in the resin tray (pallet) into the cavity, and at least when inverting A method of inverting the tray for resin at a time so as to generate a pressing force toward the bottom side of the tray for resin for a certain time and for all the resin accommodated in the tray for resin is taken.

Patent Document 1: Japanese Patent Publication No. 2009-234042

In the resin supply device described in Patent Document 1, in order to generate a pressing pressure toward the bottom side of the resin tray for all the resins accommodated in the resin tray, the resin tray must be rapidly accelerated and reversed at once. This acceleration serves the purpose of rotation initially, but when the resin tray is completely inverted and the resin material therein is introduced into the cavity, the resin material is introduced into the cavity at a large speed, so that the inside of the cavity with little deviation is reduced. It is impossible to fulfill the purpose of input.

An object to be solved by the present invention is to provide a resin material supply device for a compression molding apparatus capable of supplying a resin material in a cavity with a small variation.

The resin material supply device of the first aspect of the compression molding apparatus according to the present invention made to solve the above problems is

a) in the columnar material, a groove opening laterally and extending in the axial direction is formed, the resin material holding unit having a plurality of resin material receiving parts which are rotatable about the axis of the columnar material, and arranged parallel to each other,

b) a rotation driving unit for rotating the plurality of resin material accommodating portions about each axis,

c) a diffusion plate disposed under the resin material holding portion, in which a plurality of holes for dropping the resin material are arranged,

d) It is characterized in that it comprises an excitation portion (勵 振 部) for vibrating the diffusion plate.

Moreover, the resin material supply apparatus of the 2nd form of the compression molding apparatus which concerns on this invention made in order to solve the said subject,

a) a resin material holding portion having a plurality of resin material accommodating portions disposed in parallel to each other, which is formed in a column shape material, a groove opening laterally and extending in an axial direction, and rotatable about an axis of the column shape material,

b) a rotation driving unit for rotating the plurality of resin material accommodating portions about each axis,

c) can be disposed on the resin material holding portion, has a shape corresponding to the shape of the resin material holding portion divided into a plurality of regions of the same shape, and causes the resin material to fall on each of the plurality of resin material receiving portions. Small resin material holding part,

d) a movement for moving the small resin material holding portion and the resin material holding portion relatively so that the small resin material holding portion is located in any one of the plurality of regions of the same shape of the resin material holding portion. It is characterized by having a wealth.

The resin material supply method of the first aspect of the present invention corresponding to the resin material supply device of the first aspect of the compression molding apparatus is

a) a plurality of resin material holding portions having a plurality of resin material receiving portions arranged in parallel to each other, which are formed in a column shape material, and have grooves extending laterally and extending in an axial direction, which are rotatable about the axis of the column shape material; A step of accommodating the resin material in the corresponding groove from the opening in a state in which the opening of the dog's resin material accommodating portion is upward;

b) placing the resin material holding portion on the opening of the cavity,

c) a step of dropping the resin material from the groove by rotating the plurality of resin material accommodating portions about each axis,

d) having a step of supplying a resin material which has fallen on the diffusion plate from the groove to the cavity by vibrating the diffusion plate in which a plurality of holes for dropping the resin material are disposed below the resin material holding portion. It is characterized by.

Moreover, the resin material supply method of 2nd aspect which concerns on this invention corresponding to the resin material supply device of 2nd aspect of the said compression molding apparatus is

a) a plurality of resin material holding portions having a plurality of resin material receiving portions arranged in parallel to each other, which are formed in a column shape material, and have grooves extending laterally and extending in an axial direction, which are rotatable about the axis of the column shape material; The process of raising the opening of the resin material accommodating part upward,

b) a small element disposed on the resin material holding portion, having a shape corresponding to the shape in which the resin material holding portion is divided into a plurality of regions of the same shape, and dropping the resin material into each of the plurality of resin material receiving portions. A step of dropping the resin material from the resin material holding portion to each groove of the plurality of resin material receiving portions;

c) a step of holding the resin material in all of the plurality of resin material receiving portions of the resin material holding portion by repeating the resin material dropping step while moving the small resin material holding portion,

d) placing the resin material holding portion on the opening of the cavity,

e) It is characterized in that it has a process of supplying the resin material to the cavity by rotating the plurality of the resin material accommodating parts about each axis.

The first form of the compression molding apparatus according to the present invention is characterized by having the resin material supply device of the first form.

Moreover, the thing of the 2nd form of the compression molding apparatus which concerns on this invention is characterized by having the resin material supply device of the said 2nd form.

The present invention can also be practiced as a method for producing a resin molded article characterized by having a step of supplying a resin material to a cavity of a lower mold of a compression molding apparatus by the resin material supply method of the first aspect.

Moreover, this invention can also be implemented as a resin molded article manufacturing method characterized by having a process of supplying a resin material to a cavity of a lower mold of a compression molding apparatus by the resin material supply method of the second aspect.

According to the present invention, it is possible to supply the resin material so that there is little variation in the cavity.

1 is a process chart for explaining the steps (a) to (f) for performing compression molding using one embodiment of the resin material supply device according to the present invention.
Fig. 2 is a schematic cross-sectional view of the entire resin material supply apparatus in one embodiment.
3 is a plan view of a resin material holding part of one embodiment.
4 (a) is a plan view of a small resin material holding part of one embodiment, and (b) is a cross-sectional view.
It is explanatory drawing which shows the relationship between the whole resin material holding part and a small resin material holding part.
6 is a schematic plan view of a diffuser plate of one embodiment.
Fig. 7 (a) is a schematic cross-sectional view of one resin material accommodating portion of one embodiment, and (b) is an explanatory diagram showing how a resin material falls from two resin material accommodating portions.
8 (a) and 8 (b) are schematic plan views showing two different types of diffusion plates.
9 is a plan view showing another example of the small resin material holding portion.
10 is a perspective view showing still another example of a small resin material holding unit.
11 is a flow chart for explaining a procedure for supplying a resin material to a lower cavity by the resin material supply device of one embodiment.
12 is an explanatory view showing a state in which a resin material is supplied to a cavity by a conventional slit-shutter method.
13 is an explanatory view showing a state in which a resin material is supplied to a cavity by a conventional vertical slit method.

The procedure of compression molding of an electronic component using one embodiment of the resin material supply device according to the present invention will be described with reference to FIG. 1. The mold of the compression molding apparatus 10 used here comprises an upper mold 11, a lower mold 12 (incorporating a heater (not shown)), and an intermediate plate 13, The cavity 121 of (12) forms a rectangle (rectangular) when viewed in a plane. In this embodiment, granular resin is used as the resin material, but other forms of powder may be used.

First, the substrate 15 on which the electronic component is mounted is set on the substrate set portion 111 of the upper mold 11 in a state where the mounting surface is facing downward (FIG. 1 (a)). Before or after that, the supply-side and winding-side release film rolls provided over the lower mold 12 are rotated, and a new release film 16 drawn out from the supply-side release film roll is unfolded on top of the cavity 121 of the lower mold 12 To prepare. Next, the lower mold 12 is raised in a state where the intermediate plate 13 is fixed, and the film pressing portion 122 of the lower plate 12 is brought into contact with the intermediate plate 13 via the release film 16. . The release film 16 is softened and heated by being heated by the lower mold 12. In addition, by raising the lower mold 12 in a state where the intermediate plate 13 is fixed, the contact surface of the film pressing portion 122 of the intermediate plate 13 and the lower mold 12 is pressed down against the cavity 121. The release film 16 on the cavity 121 is provided unfolded by pressing down the abutting surface between the intermediate plate 13 and the film pressing portion 122 of the lower mold 12. And the cavity 121 is covered with the release film 16 by suctioning the release film 16 from the cavity 121 side ((a), (b) of Fig. 1).

Thereafter, the resin material is supplied into the cavity 121 by the resin material supply device 19 (Fig. 1 (c)). The operation of the resin material supply device 19 will be described in detail later.

After the resin material is melted by the heat of the lower mold 12 (FIG. 1 (d)), the lower mold 12 is approached to the upper mold 11 to immerse the electronic component in the melted resin, and the resin is cavity. It is pressed by the bottom member 123 (Fig. 1 (e)). After the resin is cured, the resin sealing molded article of the electronic component is obtained by opening the upper mold 11, the lower mold 12, and the intermediate plate 13 (Fig. 1 (f)).

Next, the resin material supply device 19 of this embodiment will be described in detail with reference to FIGS. 2 to 7. As shown in FIG. 2, the resin material supply device 19 of this embodiment has a resin material holding portion 20 having a shape corresponding to the planar shape of the cavity 121 and a resin material holding portion disposed thereon. A small resin material holding portion 40 having a size of about 1/4 of (20) and under the resin material holding portion 20 (that is, the present resin material supply device 19 is a cavity 121) And a diffusion plate 60 disposed between the resin material holding portion 20 and the cavity when placed on the top. The resin material holding portion 20 is provided with a moving portion 30 that moves it in-plane (in FIG. 2 in a direction perpendicular to the left and right and the ground) relative to the small resin material holding portion 40. In addition, an excitation portion 70 that vibrates the diffusion plate 60 is provided. 2 is a view for showing the positional relationship between the small resin material holding portion 40, the resin material holding portion 20 and the diffusion plate 60, and in reality, they do not exist in this positional relationship at the same time. In the first step of supplying the resin from the small resin material holding portion 40 to the resin material holding portion 20, as will be described later, only both of them, the cavity 121 from the resin material holding portion 20 In the second step of supplying the resin, only the resin material holding portion 20 and the diffusion plate 60 have this positional relationship.

As shown in FIG. 3, the resin material holding portion 20 is parallel to the base frame 29, the rectangular frame member 21 provided on the base plate 29, and the inside of the frame member 21. A plurality of resin material accommodating portions 22 disposed at equal intervals and rotatably mounted thereon are provided. 3, the illustration of the moving part 30 is omitted. Hereinafter, as shown in FIG. 3, the axial direction of the resin material accommodating part 22 is the Y direction, and the direction perpendicular to the Y direction in the plane of the frame member 21 is the X direction. The base stand 29 has a rectangular opening which is the same size as the opening of the cavity 121, but slightly smaller than that. The rectangle inside the frame member 21 is slightly smaller in the X direction than the opening of the base stand 29, and has the same size in the Y direction.

The resin material accommodating part 22 is provided in the side of the pillar-shaped material 221 of one cylindrical shape, and the pillar-shaped material 221, opening to the side, respectively, and the axial direction (Y) of the pillar-shaped material 221 Direction). In addition, in FIG. 3, in order to clearly show the configuration of the resin material accommodating portion 22, only one resin material accommodating portion 22 near the center and both ends is shown, and some resin material accommodating portions 22 are shown. City is omitted. The resin material accommodating part 22 is a plane parallel to the axis of the side surface of the column of the pillar-shaped material 221 in an enlarged view in Fig. 7 (a) in a cross section perpendicular to the axis (Y cross-section). It has a shape cut out by (P), and the groove 222 is provided to open in this plane (P). The groove 222 is a cross section perpendicular to the axis, and is rectangular inside, and has a shape extending toward the opening. In the present embodiment, the pillar-shaped material 221 has a shape in which the side surfaces of the cylinder are cut out, but a cylindrical shape (not cut out) may be used, or may be formed into another shape such as a square column or a hexagonal column. The length and number of the resin material accommodating portions 22 can be appropriately set depending on the size of the cavity to be supplied with the resin or the batch density determined by the uniformity of the required resin.

In FIG. 3, a plurality of through holes are provided at equal intervals in one of two opposing frames of the frame member 21, and an equal number of non-through holes are provided at the same interval in the other. Each pillar-shaped material 221 has one end penetrating each through hole, the other end being held in the non-penetrating hole, and can be rotated between the through hole and the non-penetrating hole. A pinion 224 is provided at the one end of each of the resin material accommodating portions 22 to be the outside of the frame member 21. Moreover, a rack 23 is provided outside the frame member 21 so as to be movable in the X direction so as to mesh with the pinion 224 of the entire resin material accommodating portion 22. The lower portion of the frame member 21 protrudes to the outside (right in Fig. 3), and the rack 23 is movably mounted thereon. In addition, a penetration hole may be provided in the other of the two frames of the frame member 21 as opposed to the other.

A connecting member 241 for rotation is fixed to one end of the rack 23. The connecting member 241 for rotation consists of a plate-shaped member 2411 for rotation provided parallel to the frame member 21, and a cam pin 2412 for rotation provided on the lower surface thereof. In addition, the connecting member 242 for parallel movement is also fixed to the frame member 21. Similarly, the plate member 2421 for parallel movement provided parallel to the frame member 21 and the cam pin for parallel movement provided on the lower surface thereof ( 2422).

The cam pin 2412 for rotation and the cam pin 2422 for parallel movement are engaged with the cam groove 2511 for rotation of the cam 251 for rotation and the cam groove 2521 for parallel movement of the cam 252 for parallel movement, respectively. It becomes movable along the cam profile. The cam 251 for rotation and the cam 252 for parallel movement are fixed to the common connecting member 26, and are moved in the Y direction by the air actuator 27.

In this embodiment, the rotation drive unit for rotating the entire resin material accommodating portion 22 is a rack 23, a pinion 224, a rotating connecting member 241, a rotating cam 251, and a connecting member 26 ) And an air actuator (27). In addition, the rotational movement unit for parallelly moving the entire resin material accommodating portion 22 in the X direction includes a frame member 21, a connection member 242 for parallel movement, a cam 252 for parallel movement, a connection member 26 and air It is constituted by an actuator (27).

Next, the small resin material holding part 40 disposed on the resin material holding part 20 will be described. As shown in FIG. 4, the small resin material holding part 40 is arranged in a pitch corresponding to the arrangement pitch of the resin material receiving part 22 in the resin material holding part 20. A resin holding portion 41 having four slits 43 and a shutter 42 having a plurality of slits 44 of the same arrangement provided below it are provided. In addition, for convenience of explanation, the number of slits of the small resin material holding unit 40 is small in FIG. 4. As shown in Fig. 5, the small resin material holding portion 40 has a size of about 1/4 of the resin material holding portion 20. Further, the small resin material holding portion 40 has a shape corresponding to the shape in which the resin material holding portion 20 is divided into a plurality of regions of the same shape.

The diffusion plate 60 disposed under the resin material holding portion 20 has a shape substantially the same as that of the frame member 21 of the resin material holding portion 20 (that is, a shape almost the same as the cavity), and is shown in FIG. 6. As shown, a plurality of through holes 61 are provided in a two-dimensional shape. It is preferable that the through holes 61 are evenly provided in the diffusion plate 60. Moreover, it is preferable to make the arrangement period (pitch) of the through-hole 61 smaller than the arrangement period (pitch) of the plurality of resin material accommodating portions 22 of the resin material holding portion 20. The diffusion plate 60 is provided with an excitation portion 70 for vibrating it, and the diffusion plate 60 vibrates in one direction (left and right directions in FIG. 6) along the rails 67 provided at both sides. .

The operation of the resin material supply device 19 of this embodiment will be described with reference to FIG. 11.

First, a process in the first step of supplying resin from the small resin material holding portion 40 to the resin material holding portion 20 is performed. In the first step, a small resin material holding portion 40 is disposed on one of the regions in which the resin material holding portion 20 is divided into four (see FIG. 5). In this state, the resin material is supplied to each slit 43 of the resin holding part 41 of the small resin material holding part 40 (step S11). And the resin material holding part 20 of the resin material in each slit 43 of the resin holding part 41 is moved through the slit 44 by moving the shutter 42 perpendicular to the slits 43 and 44. ) Into the groove 222 of each resin material accommodating portion 22 (step S12). Next, it is judged whether or not the injection of the resin material from the small resin material holding portion 40 to the resin material holding portion 20 is performed in all areas (step S13), and the area that has not yet been injected is If there is, the resin material holding portion 20 is moved by the moving portion 30 so that the small resin material holding portion 40 is located on the next region (step S14). Here, in order to change such a region, the side of the small resin material holding portion 40 instead of the resin material holding portion 20 may be moved, or both may be moved.

In this way, the first step is ended when the resin material is put into all regions of the resin material holding portion 20 (that is, all the resin material receiving portions 22).

Next, the second step of supplying the resin to the cavity from the resin material holding unit 20 is entered. In the second step, the resin material holding portion 20 in which the resin material is held in all the resin material receiving portions 22 is moved onto the cavity 121 covered with the release film 16 of the compression molding apparatus 10, , It is arrange | positioned so that the opening of the base stand 29 may align with the opening of the cavity 121 (step S15. FIG. 1 (b)). In this step, the diffusion plate 60 is disposed between the resin material holding portion 20 and the cavity 121. In addition, the diffusion plate 60 may be fixed to the resin material holding portion 20 and may be moved to the cavity together with the resin material holding portion 20. Where the resin material holding portion 20 is disposed on the cavity 121, the diffusion plate 60 is vibrated by the excitation portion 70. The vibration direction is a direction perpendicular to the axis of the resin material receiving portion 22 of the resin material holding portion 20. Although it may be a vibration in another direction (for example, circular motion), it is preferable to include a component in a direction perpendicular to the axis of the resin material accommodating portion 22 at least.

Through the first step and the second step, in the initial state, the openings of the grooves 222 of each resin material accommodating portion 22 are directed directly above. When the connection member 26 is moved by the air actuator 27 at a constant speed in the Y direction, the rotation connection member 241 moves in the X direction along the cam profile of the rotation cam 251. As a result, the rack 23 moves, and the resin material accommodating portion 22 fixed to the pinion 224 engaged with it rotates (see Fig. 7 (b)) to diffuse the resin material in the groove 222. The plate 60 is dropped. In synchronization with it, the resin material accommodating portion 22 is moved in the X direction by the movement of the frame member 21 along the cam profile of the movement cam 252. Thereby, the resin material is first evenly dropped on the diffusion plate 60 from the entire resin material accommodating portion 22 of the resin material holding portion 20, and the cavity is formed from the through hole 61 of the diffusion plate 60. It falls to (121) (step S16). Here, because the diffusion plate 60 is vibrating, the resin material is evenly distributed in the cavity 121. In addition, it is assumed that the vibration of the diffusion plate 60 gives an acceleration exceeding the friction of the resin material on the upper surface of the diffusion plate 60 and the upper surface. For this reason, by making the upper surface of the diffusion plate 60 smooth and reducing its friction coefficient, it is possible to drop from the diffusion plate 60 to the cavity 121 with smaller (weak) vibration. A chamfer (chamfering) (chamfering) may be provided on the upper surface side of each through hole 61 of the diffusion plate 60. In addition, when the effect of uniform spreading by the diffusion plate 60 is sufficiently obtained, movement of the entire resin material accommodating portion 22 in at least one of the X direction and the Y direction by the rotational moving portion is not necessarily required. Mechanisms for this can be omitted. Moreover, the diffusion plate 60 is stopped at the time when the resin material falls from each resin material receiving portion 22 to the diffusion plate 60, and when all the resin materials fall on the diffusion plate 60 (Although some resin materials fall to the cavity 121 through the through hole 61) The vibrating plate 60 is vibrated, and the resin material placed on the upper surface thereof is cavity 121 through the through hole 61. ).

When all of the resin material on the diffusion plate 60 is supplied into the cavity 121, vibration of the diffusion plate 60 is stopped (step S17), and the resin material supply device 19 is evacuated from the cavity 121. (退避). Thereafter, the lower mold 12 is approached to the upper mold 11, the electronic component is immersed in the molten resin, and the resin is pressed by the cavity bottom member 123 (FIGS. 1 (e), (f). )). Thereby, manufacturing of the resin molded article is completed.

The resin material supply device 19 of the above embodiment is an example of the present invention, and modification, modification and addition are appropriately permitted within the scope of the present invention.

For example, in the diffusion plate, the small through holes 61 as shown in FIG. 6 are not uniformly arranged two-dimensionally, but the slit-shaped through holes 63 as shown in FIG. 8 (a). ) May be a diffusion plate 62 in which one dimension is evenly arranged. In this case, the longitudinal direction of the through hole 63 is set in a direction perpendicular to the axis of the entire resin material receiving portion 22 of the resin material holding portion 20. Moreover, the direction of the vibration is set to a direction orthogonal to the longitudinal direction of the through hole 63. Moreover, even if it is not completely orthogonal, as shown in FIG. 8 (b), it is also possible to cross (cross, cross at an angle). Also in this case, the vibration direction of the diffusion plate 64 is set to a direction orthogonal to the longitudinal direction of the through hole 65.

Moreover, the small resin material holding part may have the same structure as the resin material holding part 20, as shown in FIG. However, in this small resin material holding portion 45, the number of the resin material receiving portions 46 is half of that of the resin material receiving portion 22 of the resin material holding portions 20 (pitch Is the same), and the length is also halved.

As another example of the small resin material holding portion, as shown in Fig. 10, one having a large number of small through holes provided in a two-dimensional shape is mentioned. In this small resin material holding portion 47, a number of small through holes 481 are uniformly arranged two-dimensionally in the resin material receiving portion 48, and beneath the resin material receiving portion 48. The shutter plate 49 is provided with a small through hole of the same arrangement. After supplying the resin material to each of the small through-holes 481 of the resin material accommodating portion 48, by moving the shutter plate 49 in the direction of the arrow, each of the small through-holes 481 of the resin material accommodating portion 48 ), The resin material held in the shutter plate 49 is dropped into each resin material receiving portion 22 of the resin material holding portion 20 through a small through hole in the shutter plate 49.

In FIG. 2, the resin material supply device 19 may be configured to include a resin material holding portion 20 and a diffusion plate 60 by omitting the small resin material holding portion 40. . In Fig. 2, the resin material supply device 19 also has a configuration in which the diffusion plate 60 is omitted and is provided with a small resin material holding portion 40 and a resin material holding portion 20. It is possible.

In the description using FIG. 5, the small resin material holding portion 40 is set to a size of about 1/4 of the resin material holding portion 20, and the resin material is supplied from the small resin material holding portion 40. It was made to supply the resin material to the holding part 20 four times. In addition to this, the small resin material holding portion 40 has a size of about 1/6 of the resin material holding portion 20, and the resin material holding portion 20 from the small resin material holding portion 40 The resin material is supplied to the furnace six times, or the small resin material holding part 40 is about 1/8 of the size of the resin material holding part 20 and the small resin material holding part 40 The size of the small resin material holding portion 40 and the resin material holding portion 20 and the small resin material holding portion, such as supplying the resin material to the resin material holding portion 20 eight times The number of times the resin is supplied to the resin material holding portion 20 from 40 can be appropriately set.

The planar shape of the cavity to which the resin material is supplied may be square, circular, oval, rhomboid, triangular, or the like. In these cases, the shape of the frame member may be fitted to it, and the length of each resin material receiving portion may be adjusted to be evenly arranged in the frame member.

10-compression molding apparatus 11-upper mold
111-Substrate Set 12-Lower
121-cavity 122-film press
123-cavity bottom member 13-intermediate plate
15-substrate 16-release film
19-Resin material supply device 21-Frame member
22-Resin material receiving section 221-Column-shaped material
222-Home 224-Pinion
23-Rack 241-Rotating connection member
2411-pivoting plate member 2412-pivoting cam pin
242-parallel connecting member 2421-parallel plate member
2422-cam pin for parallel movement 251-cam for rotation
2511-Cam groove for rotation 252-Cam for parallel movement
2521-Cam groove for parallel movement 26-Connecting member
27-Air actuator 29-Base stand
30-moving part 40-small resin material holding part
41-Resin holding part 42-Shutter
43, 44-Slit 45, 47-Small resin material holding part
46, 48-Resin material receiving portion 481-Small through hole
49-shutter plate 60, 62, 64-diffuser plate
61, 63, 65-Through hole 67-Rail
70-Aftershock 931, 940-Resin tray
932, 943, 944-Resin material supply hole 933-Shutter
934, 955-cavity 941-top tray
942-lower tray

Claims (11)

a) The columnar material is formed with grooves extending laterally and extending in the axial direction, rotatable about the axis of the columnar material, and maintaining a resin material having a plurality of resin material accommodating portions arranged parallel to each other Boo,
b) a rotation driving unit for rotating the plurality of resin material accommodating portions about each axis,
c) a diffusion plate disposed under the resin material holding portion, in which a plurality of holes for dropping the resin material are arranged,
d) A resin material supply device for a compression molding apparatus, comprising an excitation portion for vibrating the diffusion plate. The method according to claim 1,
A resin material supply device for a compression molding apparatus, wherein the diffusion plate is a plurality of holes arranged two-dimensionally in a flat plate. The method according to claim 1,
The diffusion plate, the resin material supply device of the compression molding apparatus, characterized in that the slit-shaped through-holes are uniformly arranged on the flat plate. a) in the columnar material, a groove opening laterally and extending in the axial direction is formed, the resin material holding unit having a plurality of resin material receiving parts which are rotatable about the axis of the columnar material, and arranged parallel to each other,
b) a rotation driving unit for rotating the plurality of resin material accommodating portions about each axis,
c) can be disposed on the resin material holding portion, has a shape corresponding to the shape of the resin material holding portion divided into a plurality of regions of the same shape, and causes the resin material to fall on each of the plurality of resin material receiving portions. Small resin material holding part,
d) a movement for moving the small resin material holding portion and the resin material holding portion relatively so that the small resin material holding portion is located in any one of the plurality of regions of the same shape of the resin material holding portion. A resin material supply device for a compression molding apparatus comprising a part. The method according to claim 4,
The small resin material holding unit,
A resin holding portion having slits corresponding to each of the plurality of resin material receiving portions,
And a shutter having a slit corresponding to the slit and moving relative to the resin holding portion in a direction perpendicular to the slit. The method according to claim 4,
The small resin material holding portion, provided in correspondence with a plurality of resin material receiving portions of the resin material holding portion, has a groove formed to open sideways and extends in the axial direction, and the shaft of the pillar-shaped material is formed. Equipped with a plurality of small resin material accommodating portions which are rotatable centrally and arranged parallel to each other, and a small rotation driving part that rotates the plurality of small resin material accommodating portions about each axis. A resin material supply device for a compression molding apparatus, characterized in that to do. The method according to claim 4,
The small resin material holding unit,
A resin material accommodating portion in which a plurality of through holes are disposed two-dimensionally on a flat plate,
And a shutter plate moving relative to the resin material accommodating portion in a direction perpendicular to the through hole and having a through hole corresponding to the through hole. A compression molding apparatus comprising the resin material supply device according to any one of claims 1 to 7. a) a plurality of resin material holding portions having a plurality of resin material receiving portions arranged in parallel to each other, which are formed in a column shape material, and have grooves extending laterally and extending in an axial direction, which are rotatable about the axis of the column shape material; A step of accommodating the resin material in the groove than the opening in a state in which the openings of the two resin material accommodating portions are upward;
b) placing the resin material holding portion on the opening of the cavity,
c) a step of dropping the resin material from the groove by rotating the plurality of resin material accommodating portions about each axis,
d) having a step of supplying a resin material which has fallen on the diffusion plate from the groove to the cavity by vibrating the diffusion plate in which a plurality of holes for dropping the resin material are disposed below the resin material holding portion. A resin material supply method of a compression molding apparatus, characterized in that. a) a plurality of resin material holding portions having a plurality of resin material receiving portions arranged in parallel to each other, which are formed in a column shape material, and have grooves extending laterally and extending in an axial direction, which are rotatable about the axis of the column shape material; The process of raising the opening of the resin material accommodating part upward,
b) a small element disposed on the resin material holding portion, having a shape corresponding to the shape in which the resin material holding portion is divided into a plurality of regions of the same shape, and dropping the resin material into each of the plurality of resin material receiving portions. A step of dropping the resin material from the resin material holding portion to each groove of the plurality of resin material receiving portions;
c) a step of holding the resin material in all of the plurality of resin material receiving portions of the resin material holding portion by repeating the resin material dropping step while moving the small resin material holding portion,
d) placing the resin material holding portion on the opening of the cavity,
e) A method of supplying a resin material for a compression molding apparatus, comprising a step of supplying a resin material to a cavity by rotating the plurality of resin material accommodating portions about each axis. A method for producing a resin molded article comprising the step of supplying a resin material to a cavity of a lower mold of a compression molding apparatus by the resin material supply method according to claim 9 or 10.

Images