JP6257737B2 - Resin material supply device and method for compression molding apparatus, compression molding apparatus, and resin molded product manufacturing method - Google Patents

Description

  The present invention relates to an apparatus for resin-sealing an electronic component such as a semiconductor chip, and in particular, a resin material having a granular or powder form for compression molding (hereinafter, unless otherwise specified, simply “resin The term "material" refers to a granular or powdery resin material.) A resin material supply apparatus and method for supplying a resin to a mold cavity, and a compression molding apparatus and method having the resin material supply apparatus .

  With the downsizing of electronic components and the resulting reduction in the diameter of bonding wires such as semiconductor chips, compression molding has been used for sealing molding of electronic components. In compression molding, a resin material is supplied to a cavity of a lower mold covered with a release film, heated and melted, and then clamped with an upper mold on which a substrate on which electronic components are mounted is clamped to compress the resin. Thus, molding is performed. In such compression molding, in order to perform defect-free molding over the entire large substrate, it is important to supply a predetermined amount of a resin material to the cavity in an even and sufficient manner. If the amount of the resin material supplied to the cavity is non-uniform, the resin material flows (moves) in the cavity during mold clamping, which adversely affects wiring such as bonding wires of the electronic component substrate.

  In order to evenly supply a predetermined amount of resin material to the cavity, the resin material is not directly supplied to the cavity from the supply part for storing the resin material, but once the resin material has a uniform thickness on the resin tray. Then, the resin material is simultaneously dropped from the resin tray into the cavity.

  One method of dropping resin materials all at once from the resin tray is to open a shutter made of two flat plates abutted at the center provided on the lower surface of the resin tray (see Patent Document 1). [Background Technology], this is called the simple shutter method).

  Further, as a method of more uniformly supplying the resin material into the cavity, as shown in FIG. 8, a plurality of slit-shaped resin material supply holes 932 are provided in the resin tray 931 (FIG. 8 shows the resin material supply). It is a cross-sectional view of the surface perpendicular to the longitudinal direction of the slit of the hole 932, and the cross section of the three resin material supply holes 932 appears.), Provided at the bottom of the resin tray 931 and abutted at the center 2 By opening a shutter 933 made of a flat plate in a direction perpendicular to the longitudinal direction of the slit of the resin material supply hole 932 (width direction, left-right direction in FIG. 8), the resin material is released from each resin material supply hole 932 into the cavity 934. There is a method of dropping it into the inside (Patent Document 1 [0011]. This is called a slit shutter method).

  Similarly, as a method of using a resin tray having a plurality of slit-shaped resin material supply holes, there is a method shown in FIG. In this method, the resin tray 940 is composed of an upper tray 941 and a lower tray 942, and a number of parallel slit-shaped resin material supply holes are formed in both. In the resin tray 940, the resin material supply hole 943 of the upper tray 941 functions as a resin holding portion for holding resin, and the resin material supply hole 944 of the lower tray 942 is connected to the resin material supply hole 943 of the upper tray 941. It functions as an opening for dropping the held resin material. The resin material supply holes 943 and 944 of the upper and lower trays 941 and 942 are completely different from each other (that is, the non-opening portion of the lower tray 942 blocks the opening portion of the upper tray 941). A resin material is supplied to the resin tray 940, and the resin tray 940 is placed on the cavity 955 (FIG. 9A). Then, by moving the upper tray 941 in a direction perpendicular to the slits of the resin material supply holes 943 and 944 (left and right in FIG. 9), the resin material in the resin material supply holes 943 of the upper tray 941 is moved to the lower tray 942. It is dropped into the cavity 955 through the resin material supply hole 944 (FIG. 9B, this is referred to as an upper and lower slit method).

JP 2007-125783 A

  In any of the simple shutter method, the slit / shutter method, and the upper / lower slit method, a slight gap may occur between the bottom of the resin tray and the upper surface of the shutter in order to move the shutter smoothly. If there is such a gap, when the shutter or the upper tray is moved, the resin material may enter or bite into the gap, thereby preventing the movement of the shutter or the upper tray. In this case, the moving speed of the shutter or the upper tray becomes slow or non-uniform, and the amount of the resin material supplied into the cavity becomes non-uniform. Furthermore, in the worst case, the movement of the shutter and the upper tray stops halfway, and the resin material is not supplied to a part of the cavity.

  The problem to be solved by the present invention is to provide a resin material supply device for a compression molding apparatus that can supply a resin material evenly and smoothly into a cavity.

The resin material supply device of the compression molding device according to the present invention, which has been made to solve the above problems,
Grooves are formed in the columnar material so as to open in the side surface and extend in the longitudinal direction of the columnar material, and are arranged in parallel to each other, which are rotatable around a rotation axis that passes through the columnar material and extends in the longitudinal direction. A plurality of resin material containing portions,
A rotation drive unit that rotates each of the plurality of resin material accommodation portions around the rotation axis to an angle at which the resin material accommodated in the resin material accommodation portion falls is provided.

  In the resin material supply apparatus according to the present invention, the resin material is accommodated in the groove from the opening in all the resin material accommodation portions with the opening of the groove facing upward. Thereafter, the resin material supply device is arranged on the opening of the cavity, and the resin material accommodated in the grooves is dropped into the cavity by the rotation driving unit. Rotate to the state. For example, when the groove has a side wall that is vertical when the opening is upward, the groove is accommodated in the groove by rotating the resin material accommodating portion from an upward state to an angle exceeding 90 °. The applied resin material falls.

  Thereby, since the resin material accommodated in the groove | channel of the several resin material accommodating part arrange | positioned in parallel is supplied to a cavity in each position, the resin material is supplied substantially equally in a cavity. Further, since the operation of the resin material supply device is not hindered by the biting of the resin material or the like, the resin material can always be supplied smoothly into the cavity.

  As the rotation driving unit, a unit including a rack and pinion mechanism that simultaneously rotates a plurality of resin material accommodation units can be preferably used. Of course, other transmission mechanisms may be used, and a rotational drive source such as a servomotor may be provided in each resin material container.

  The resin material supply device according to the present invention further includes the plurality of resin material accommodating portions accommodated in the plurality of resin material accommodating portions while the rotation driving portion rotates the plurality of resin material accommodating portions. It is desirable to provide a moving part that moves in a plane that is formed by the part and is not parallel to the axis. Since the position where the resin material falls into the cavity from the groove of each resin material accommodation portion moves as the resin material accommodation portion moves while rotating in this way, the amount of resin material supplied into the cavity The uniformity can be further increased.

  In the case where the resin material supply device according to the present invention includes the moving unit, the rotation of the plurality of resin material accommodating units by the rotation driving unit and the plurality of resin material accommodating units by the moving unit. It is desirable that the movement is synchronized so that more uniform supply is possible. For example, when the resin material housing portion rotates to an angle at which the resin material in the groove starts to drop, the resin material housing portion stops rotating and the resin material housing portion starts moving. It is moved by a distance (desired to be the same distance as the arrangement pitch of the resin material accommodating portions or a distance slightly longer than that). The movement is stopped when the resin material supply unit is moved by a predetermined distance, and the resin material container is further rotated to drop all the resin material in the groove. In addition, while moving the resin material accommodating part by a predetermined distance, the resin material accommodating part may be continuously rotated little by little.

  The rotation and movement of these resin material accommodation portions can be synchronized using a cam mechanism. Or you may make it carry out synchronous control using actuators, such as a servomotor provided in each resin material accommodating part.

The resin material supply method of the compression molding apparatus according to the present invention is as follows.
Grooves are formed in the columnar material so as to open in the side surface and extend in the longitudinal direction of the columnar material, and are arranged in parallel to each other, which are rotatable around a rotation axis that passes through the columnar material and extends in the longitudinal direction. A step of accommodating a resin material in the groove from the opening in a state where the opening of the plurality of resin material accommodating portions is directed upward;
Disposing the plurality of resin material containing portions on the opening of the cavity;
A step of supplying the resin material to the cavity by rotating each of the plurality of resin material accommodating portions around the rotation axis to an angle at which the resin material accommodated in the resin material accommodating portion falls. It is characterized by having.

  The plurality of resin material accommodation portions can be rotated by a rack and pinion mechanism. Moreover, you may carry out by providing rotational drive sources, such as a servomotor, in each resin material accommodating part.

  In the resin material supply method according to the present invention, in the step of supplying the resin material to the cavity, the entire plurality of resin material accommodation portions are within the plane formed by the plurality of resin material accommodation portions and are connected to the shaft. It is desirable to move in non-parallel directions.

  In the resin material supply method according to the present invention, when the entire plurality of resin material accommodation portions are moved, the rotation of the plurality of resin material accommodation portions and the movement of the plurality of resin material accommodation portions are synchronized. The embodiment of the present invention can be made so as to enable more uniform supply.

  The rotation and movement of these resin material accommodation portions can be synchronized by a cam mechanism. Or you may make it carry out synchronous control of the servomotor provided in each resin material accommodating part.

  A compression molding apparatus according to the present invention includes the resin material supply apparatus.

  The compression molding method according to the present invention includes a step of supplying a resin material to a cavity of a lower mold of a compression molding apparatus by the resin material supply method.

  According to the present invention, the resin material can be supplied uniformly and always smoothly into the cavity.

Process drawing explaining the procedure (a)-(f) which performs compression molding using one Example of the resin material supply apparatus which concerns on this invention. The schematic plan view (a) of the resin material supply apparatus of the Example, Y sectional drawing (b), and X sectional drawing (c). The expanded Y sectional view of a resin material supply part. The top view of the cam for rotation (a) and the cam for horizontal movement (b) of the Example. The flowchart explaining the procedure which supplies the resin material to the cavity of a lower mold | type with the resin material supply apparatus of the Example. The graph which shows the relationship between the rotation angle of a resin material accommodating part, and the parallel movement distance of a frame member at the time of supplying resin material to the cavity of a lower mold | type with the resin material supply apparatus of the Example. Explanatory drawing (a)-(e) which shows a mode that the resin material falls from the resin material accommodating part of the Example. Explanatory drawing which shows the state which supplies the resin material to a cavity by the conventional slit shutter system. Explanatory drawing which shows the state which supplies the resin material to a cavity by the conventional up-and-down slit system.

  A procedure of compression molding of an electronic component using an embodiment of the resin material supply apparatus according to the present invention will be described with reference to FIG. The mold of the compression molding apparatus 10 used here comprises an upper mold 11, a lower mold 12 (with a heater (not shown) incorporated), and an intermediate plate 13. A cavity 121 of the lower mold 12 is rectangular (rectangular) in plan view. Make. In this embodiment, a granular resin is used as the resin material, but it may be in a powder form or other forms. Alternatively, a liquid resin (a resin material having fluidity at normal temperature) may be used as the resin material.

  First, the substrate 15 on which the electronic component is mounted is set on the substrate setting portion 111 of the upper mold 11 with the mounting surface facing downward (FIG. 1 (a)). Before or after that, the release film roll on the supply side and the take-up side provided across the lower mold 12 is rotated, and a new release film 16 drawn from the release film roll on the supply side is inserted into the cavity of the lower mold 12. It is stretched above 121. Next, the lower die 12 is raised with the intermediate plate 13 fixed, and the intermediate plate 13 and the film presser 122 of the lower die 12 are brought into contact with each other through the release film 16. The release film 16 is softened and stretched by being heated by the lower mold 12. Further, by raising the lower mold 12 with the intermediate plate 13 fixed, the contact surface between the intermediate plate 13 and the film presser 122 of the lower mold 12 is pushed down with respect to the cavity 121. The release film 16 on the cavity 121 is stretched by pressing down the contact surface between the intermediate plate 13 and the film presser 122 of the lower mold 12. And the cavity 121 is coat | covered with the release film 16 by attracting | sucking the release film 16 from the cavity 121 side (FIG. 1 (a), (b)).

  Thereafter, the resin material is supplied into the cavity 121 by the resin material supply device 20 (FIG. 1C). The operation of the resin material supply device 20 will be described in detail later.

  After the resin material is melted by the heat of the lower mold 12 (FIG. 1 (d)), the lower mold 12 is brought close to the upper mold 11, the electronic component is immersed in the molten resin, and the resin is pressed by the cavity bottom member 123. (FIG. 1 (e)). After the resin is cured, the upper mold 11, the lower mold 12 and the intermediate plate 13 are opened to obtain a resin-sealed molded product of an electronic component (FIG. 1 (f)).

Next, the resin material supply apparatus 20 of the present embodiment will be described in detail with reference to FIGS.
As shown in FIG. 2, the resin material supply device 20 of the present embodiment is arranged in parallel and at equal intervals inside the base member 29, the rectangular frame member 21 provided on the base member 29, and the inside of the frame member 21. And a plurality of resin material accommodation portions 22 that are rotatably attached to the frame member 21. Hereinafter, as shown in FIG. 2A, the axial direction of the resin material accommodating portion 22 is defined as the Y direction, and the direction perpendicular to the Y direction within the plane of the frame member 21 is defined as the X direction. The base 29 has a rectangular opening that is the same size as or slightly smaller than the opening of the cavity 121. The rectangle inside the frame member 21 is slightly smaller than the opening of the base base 29 in the X direction and has substantially the same size in the Y direction.

  Each of the resin material accommodating portions 22 includes one columnar columnar member 221 and a groove 222 provided on the side surface of the columnar member 221 and opening in the side surface and extending in the axial direction (Y direction) of the columnar member 221. In FIG. 2 (a), only one resin material accommodating portion 22 is shown in the vicinity of the center in order to show the configuration of the resin material accommodating portion 22 in an easy-to-understand manner. Is omitted. In the cross section perpendicular to the axis (Y cross section), the resin material accommodating portion 22 has a shape obtained by cutting out the side surface of the columnar column of the columnar material 221 with a plane 2211 parallel to the axis, as shown in FIG. . The groove 222 is provided so as to open in this plane 2211. The groove 222 is rectangular inside in a cross section perpendicular to the axis, and has a shape that expands toward the opening. In this embodiment, the columnar member 221 has a shape obtained by cutting a side surface of a cylinder, but a columnar material (not cut) may be used, or another shape such as a square column or a hexagonal column may be used. . The number of the resin material accommodating portions 22 is 24 in this embodiment. However, the present invention is not limited to this, and the arrangement is determined by the size of the cavity to which the resin is supplied and the required uniformity of the resin. It can be set as appropriate according to the density.

  In the frame member 21, a plurality of through holes are provided at equal intervals in one of the two opposing frames, and the same number of non-through holes are provided at the same interval on the other. Each columnar member 221 has one end penetrating each through hole and the other end held by the non-through hole, and is rotatable between both holes. A pinion 224 is provided at a portion of the one end of each resin material accommodating portion 22 that is outside the frame member 21. In addition, a rack 23 is provided on the outside of the frame member 21 so as to be movable in the X direction so as to mesh with the pinions 224 of the total resin material accommodation portion 22. As shown in FIG. 2 (c), the lower part of the frame member 21 protrudes outward, and the rack 23 is movably mounted thereon.

  As shown in FIG. 2A, a rotation connecting member 241 is fixed to one end of the rack 23. The rotation connecting member 241 includes a rotation plate-like member 2411 provided in parallel to the frame member 21 and a rotation cam pin 2412 provided on the lower surface thereof. In addition, a parallel movement connecting member 242 is fixed to the frame member 21. Similarly to the rotation connection member 241, the parallel connection member 242 includes a parallel plate member 2421 provided in parallel to the frame member 21 and a parallel movement cam pin 2422 provided on the lower surface thereof.

  The resin material supply device 20 further includes a rotation cam 251 (FIG. 4A) and a parallel movement cam 252 (FIG. 4B). The shape (cam profile) of the cam groove (rotating cam groove 2511) of the rotating cam 251 and the cam groove (parallel moving cam groove 2521) of the parallel moving cam 252 will be described later. The rotating cam 251 and the parallel moving cam 252 are fixed to a common connecting member 26. Then, the air actuator 27 moves the connecting member 26 in the Y direction.

  In the present embodiment, the rotation drive unit includes a rack 23, a pinion 224, a rotation connection member 241, a rotation cam 251, a connection member 26, and an air actuator 27. Further, in this embodiment, the moving part is constituted by the frame member 21, the parallel movement connecting member 242, the parallel moving cam 252, the connecting member 26 and the air actuator 27.

The operation of the resin material supply apparatus 20 of this embodiment will be described with reference to FIGS.
In the initial state, the opening of the groove 222 of each resin material accommodating portion 22 faces right above. At this time, the rotation angle of the resin material accommodating portion 22 is set to 0 ° (FIG. 7A). In this initial state, a predetermined amount of resin material is put into the groove 222 of each resin material accommodating portion 22 (step S11 in FIG. 5). The input amount of the resin material is made uniform in each resin material accommodating portion 22 and uniform in the longitudinal direction of the groove 222 in each resin material accommodating portion 22. Such charging of the resin material can be performed by, for example, a resin material supply mechanism using a resin charging chute described in Patent Document 1 or a resin material supply mechanism using a conventional bowl-shaped feeder.

  Next, the resin material supply device 20 holding the resin material in the resin material container 22 is moved onto the cavity 121 covered with the release film 16 of the compression molding device 10, and the base table 29 is opened at the opening of the cavity 121. It arrange | positions so that opening may be match | combined (step S12. Refer FIG.1 (b)).

  Subsequently, the connecting member 26 is moved in the Y direction at a constant speed by the air actuator 27. Thereby, the rotating cam 251 and the parallel moving cam 252 fixed to the connecting member 26 also move at a constant speed in the Y direction. Then, according to the cam profile of the rotating cam 251, the rotating connecting member 241, the rack 23 fixed to the rotating connecting member 241, and the frame fixed to the parallel moving cam 252 and the parallel moving plate member 2421 at a predetermined timing described later. The member 21 moves in the X direction. By the movement of the rack 23, the resin material accommodating portion 22 fixed to the pinion 224 is rotated at a predetermined timing, thereby dropping the resin material in the groove 222 into the cavity 121. At the same time, the resin material container 22 is moved in the X direction at a predetermined timing by the movement of the frame member 21 (step S13).

  Here, the cam profiles of the rotation cam 251 and the parallel movement cam 252 are as shown in FIG. 4, and correspondingly, the rotation angle and the movement distance in the X direction of the resin material container 22 are as shown in FIG. Changes as shown. Specifically, until the resin material accommodating portion 22 is rotated by 70 ° from the initial position (section A shown in FIGS. 4 and 6), the resin material containing portion 22 is not moved in the X direction and is rotated from 70 ° to 105 ° ( In the same section B), the cam profile is formed so that it moves in the X direction by the same distance as the interval of the resin material accommodating portion 22 and then does not move in the X direction while rotating to 180 ° (same section C). Has been. The resin material in the groove 222 is not yet dropped when the rotation angle of the resin material accommodating portion 22 is 70 ° (FIG. 7 (b)), and falls while rotating to over 70 ° to 105 ° (FIG. 7 (b)). (C), (d)), and then the resin material remaining in the groove 222 is also dropped while rotating to 180 ° ((e)). Thus, when all the resin materials in the groove 222 are supplied to the cavities 121, the operation of supplying the resin materials to one cavity 121 is completed (step S14).

  According to the resin material supply device 20 of the present embodiment, unlike the conventional vertical slit method, the resin material is not bitten when the resin material is supplied to the cavity 121, and the supply operation is not hindered. The resin material can be supplied to the cavity 121 smoothly and evenly. Further, since the resin material is supplied to the cavity 121 while the resin material container 22 moves, the uniformity of the supply of the resin material can be further improved.

The resin material supply device 20 of the above embodiment is an example of the present invention, and appropriate modifications, corrections, and additions are permitted within the scope of the present invention.
For example, the cam profiles of the rotation cam 251 and the parallel movement cam 252 are not particularly limited, and are appropriately designed depending on the shape of the groove 222 of the resin material accommodation portion 22 and the amount of the resin material accommodated in the groove 222. be able to. Also, the resin material container 22 may continue to rotate until the resin material container 22 starts to move by a predetermined distance from the start of the parallel movement, or at a predetermined angle at which the resin material in the groove 222 falls. The rotation may be stopped. Further, the rotation and movement of the resin material container 22 may be synchronized by a mechanism other than the cam.

  The mechanism for rotating each resin material accommodating portion 22 is not limited to the rack and pinion mechanism, and any other appropriate mechanism for synchronizing and rotating all the resin material accommodating portions 22 may be used. For example, each resin material container 22 may be provided with a rotational drive source such as a servomotor.

  The resin material supply device 20 is further provided with a vibrator (including one that operates to hit each resin material housing portion 22 or the frame member 21) that vibrates each resin material housing portion 22 (or the frame member 21). Also good. When the groove 222 of the resin material accommodating portion 22 is rotated by 180 °, the vibration is applied to each resin material accommodating portion 22 by this vibrator, thereby dropping all of the resin material remaining in the groove 222 and in the cavity 121. Can be supplied to.

  The planar shape of the cavity to which the resin material is supplied may be a square, a circle, an ellipse, a diamond, a triangle, or the like. In these cases, the shape of the frame member may be adjusted to that, and the length of each resin material accommodating portion may be adjusted so that the frame member is evenly arranged in the frame member.

DESCRIPTION OF SYMBOLS 10 ... Compression molding apparatus 11 ... Upper mold 111 ... Substrate setting part 12 ... Lower mold 121 ... Cavity 122 ... Film presser 123 ... Cavity bottom member 13 ... Intermediate plate 15 ... Substrate 16 ... Release film 20 ... Resin material supply apparatus 21 ... Frame member 22 ... Resin material accommodating portion 221 ... Columnar material 2211 ... Columnar material cutting plane 222 ... Groove 224 ... Pinion 23 ... Rack 241 ... Rotating connecting member 2411 ... Rotating plate member 2412 ... Rotating cam pin 242 ... For parallel movement Connecting member 2421 ... Parallel moving plate member 2422 ... Parallel moving cam pin 251 ... Turning cam 2511 ... Turning cam groove 252 ... Parallel moving cam 2521 ... Parallel moving cam groove 26 ... Connecting member 27 ... Air actuator 29 ... Bases 931, 940 ... Resin trays 932, 943, 944 ... Resin material supply holes 933 ... Potter 934,955 ... cavity 941 ... upper tray 942 ... the lower tray

Claims (10)

Grooves are formed in the columnar material so as to open in the side surface and extend in the longitudinal direction of the columnar material, and are arranged in parallel to each other, which are rotatable around a rotation axis that passes through the columnar material and extends in the longitudinal direction. A plurality of resin material containing portions,
A compression drive unit comprising: a rotation drive unit configured to rotate each of the plurality of resin material accommodation portions around the rotation axis to an angle at which the resin material accommodated in the resin material accommodation portion falls. Resin material supply device for molding equipment.   The resin material supply device of the compression molding apparatus according to claim 1, wherein the rotation driving unit includes a rack and pinion mechanism that simultaneously rotates the plurality of resin material accommodation units. And a moving part that moves the whole of the plurality of resin material accommodating parts in a direction that is within a plane formed by the plurality of resin material containing parts and is not parallel to the rotation axis. Item 3. A resin material supply device for a compression molding device according to Item 1 or 2.   4. A cam mechanism that synchronizes the rotation of the plurality of resin material accommodating portions by the rotation driving portion and the movement of the plurality of resin material accommodating portions by the moving portion is provided. The resin material supply apparatus of the compression molding apparatus of description. Grooves are formed in the columnar material so as to open in the side surface and extend in the longitudinal direction of the columnar material, and are arranged in parallel to each other, which are rotatable around a rotation axis that passes through the columnar material and extends in the longitudinal direction. A step of accommodating a resin material in the groove from the opening in a state where the opening of the plurality of resin material accommodating portions is directed upward;
Disposing the plurality of resin material containing portions on the opening of the cavity;
A step of supplying the resin material to the cavity by rotating each of the plurality of resin material accommodating portions around the rotation axis to an angle at which the resin material accommodated in the resin material accommodating portion falls. A resin material supply method for a compression molding apparatus, comprising:   6. The resin material supply method for a compression molding apparatus according to claim 5, wherein the plurality of resin material accommodation portions are rotated by a rack and pinion mechanism. In the step of supplying the resin material to the cavity, the entire plurality of resin material accommodation portions are moved in a direction not parallel to the rotation axis within a plane formed by the plurality of resin material accommodation portions. The method for supplying a resin material for a compression molding apparatus according to claim 5 or 6, wherein:   8. The resin material supply method for a compression molding apparatus according to claim 7, wherein the rotation of the plurality of resin material accommodation portions and the movement of the plurality of resin material accommodation portions are synchronized by a cam mechanism.   A compression molding apparatus comprising the resin material supply apparatus according to claim 1.   A method for producing a resin molded product comprising a step of supplying a resin material to a cavity of a lower mold of a compression molding apparatus by the resin material supply method according to claim 5.

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