CN102105282A - Method for compression-molding electronic component and die apparatus - Google Patents

Method for compression-molding electronic component and die apparatus Download PDF

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Publication number
CN102105282A
CN102105282A CN200980128894XA CN200980128894A CN102105282A CN 102105282 A CN102105282 A CN 102105282A CN 200980128894X A CN200980128894X A CN 200980128894XA CN 200980128894 A CN200980128894 A CN 200980128894A CN 102105282 A CN102105282 A CN 102105282A
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CN
China
Prior art keywords
resin
resin material
resettlement section
electronic unit
planarization
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Granted
Application number
CN200980128894XA
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Chinese (zh)
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CN102105282B (en
Inventor
浦上浩
高田直毅
大槻修
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Towa Corp
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Towa Corp
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Priority to CN201410145446.3A priority Critical patent/CN103921384B/en
Publication of CN102105282A publication Critical patent/CN102105282A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention provides a method for compression-molding electronic component and a die apparatus. A resin supply pre-plate (21a) is configured by forming an opening section (37) on a resin-storing section (22) by applying a die-releasing film (11) on a lower surface of a resin-storing plate (21) having the opening section (37) corresponding to a lower die cavity (5) so as to efficiently improve reliability of a resin quantity supplied into the lower cavity (5) at the time of supplying a granular resin (6) into the lower die cavity (5). A resin-dispersed plate (25) is formed by supplying the resin-storing section (22) with the granular resin (6) of a required quantity and flattening the resin (i.e., forming the resin in uniform thickness). Then, by placing the resin-dispersed plate (25) at a position of the lower die cavity (5) and pulling the die-releasing film (11) into the lower die cavity (5), the flattened granular resin (6) of a required quantity is dropped together with the die-releasing film (11) and is supplied into the cavity (5) covered with the die-releasing film (11).

Description

The compress moulding method of electronic unit and die device
Technical field
The present invention relates to a kind of with IC electronic unit compression moldings such as (Integrated Circuit) method and be used for the die device of this compress moulding method.
Background technology
At present, as shown in Figure 6, use is equipped on the compression molding mould 81 of the compression molding of electronic unit with the electronic unit of die device, the requisite number purpose electronic unit 83 that utilizes 84 pairs of granular resin materials (particulate resin) to be installed in substrate 82 carries out compression molding (resin-seal molding), and it carries out in the following manner.
At first, somatotype film 88 is covered the compression molding of being located at electronic unit with in the lower impressions 87 in the mould 81 (mo(u)ld top half 85 and mo(u)ld bottom half 86), and in the lower impressions 87 that has covered this somatotype film 88, supply with particulate resin 84 and heat and make its fusionization, then, make described mould 81 (85,86) matched moulds, impregnated in molten resin in the lower impressions 87 with being installed in requisite number purpose electronic unit 83 on the substrate 82, thus with requisite number purpose electronic unit 83 compression moldings (a time single face is molded) in the resin molded body corresponding with the shape of lower impressions 87.
In addition, at this moment, can push the resin of lower impressions 87 by the die cavity bottom surface member 93 that resin is pushed usefulness.
Wherein, in order in described lower impressions 87, to supply with particulate resin 84, use resin material feed mechanism 89 (bottom retaining door 90 and supply unit 91).
Promptly, drop into the particulate resin 84 of aequum and make this resin material feed mechanism 89 enter 8586 of described amphitypys up and down to described resin material feed mechanism 89 (supply unit 91), then, draw back the bottom retaining door 90 of resin material feed mechanism 89, particulate resin 84 is fallen from supply unit 91 supply in the lower impressions 87.
Patent documentation 1: TOHKEMY 2004-216558 number
Yet, when in mold cavity 87, supplying with resin 84, open the retaining door 90 of resin material feed mechanism 89 and when particulate resin 84 being fallen supply in the lower impressions 87, exist the part 92 of resin to remain in the situation of resin material feed mechanism 89 (supply unit 91) side.
Thereby when supplying with resin 84 in mold cavity 87, existence can't be supplied with the shortcoming of resin 84 expeditiously in mold cavity 87.
In addition, when in mold cavity 87, supplying with resin 84,, therefore be easy to generate the situation of the amount of resin deficiency of in mold cavity 87, supplying with because the part (residual particles resin) 92 of resin remains in resin material feed mechanism 89 (supply unit 91) side.
Thereby when supplying with resin 84 in mold cavity 87, existence can't improve the shortcoming of the reliability of the amount of resin of supplying with expeditiously in mold cavity 87.
Summary of the invention
Problem to be solved by this invention is, when supplying with resin in mold cavity, can expeditiously resin be supplied in the mold cavity, and improve the reliability that supplies to the amount of resin in the mold cavity expeditiously.
In order to solve described problem, the compress moulding method of electronic unit of the present invention supplies to the resin material of aequum in the mold cavity that has covered the somatotype film, and electronic unit be impregnated in resin in the described die cavity, thus in described die cavity, in the resin molded body corresponding with the shape of this die cavity with described electronic unit compression molding, the compress moulding method of described electronic unit is characterised in that, comprising: accommodate lower surface with plate by the somatotype film being covered in possess with the resin of described mold cavity corresponding opening portion, thereby form the operation that the resin with resin resettlement section is supplied with header board; The resin material of aequum is supplied with the operation of the described resin resettlement section supply of header board to described resin; Form in the described resin resettlement section resin material thickness evenly and the resin of the planarization operation of dispersion plate; By with described resin dispersion plate mounting in the position of described mold cavity, make described resin resettlement section via the described somatotype film operation consistent thus with described mold cavity; Described somatotype film is covered in the operation of described cavity surface; And when described somatotype film is covered in described cavity surface, resin material is supplied to operation in the described mold cavity in the described resin resettlement section.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that, comprise following operation: form in the described resin resettlement section resin material thickness evenly and the resin of planarization during dispersion plate, supply with and make simultaneously this resin supply header board to move to the described resin resettlement section that described resin is supplied with header board the resin material of aequum, thus the resin material in this resin resettlement section is formed required uniform thickness and makes its planarization along directions X or Y direction.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that, comprise following operation: form in the described resin resettlement section resin material thickness evenly and the resin of planarization during dispersion plate, panel vibration before resin is supplied with forms the resin material in the described resin resettlement section required uniform thickness and makes its planarization thus.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that described resin material is granular resin material or pulverous resin material.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention possesses the compression molding mould of the electronic unit that constitutes by mo(u)ld top half and with the mo(u)ld bottom half of described mo(u)ld top half arranged opposite with die device, be located at the compression molding die cavity of described mo(u)ld bottom half, be located at the substrate arrangement portion of described mo(u)ld top half, cover the somatotype film in the described lower impressions, the resin that resin in the described lower impressions is pushed is pushed the die cavity bottom surface member of usefulness, and with resin material and the inside loading machine of the substrate that electronic unit is installed to described mould supply, the compression molding of described electronic unit is characterised in that to possess with die device: the resin that is installed on described inner loading machine and has a peristome is accommodated and is used plate; Cover described resin and accommodate the somatotype film that described peristome is formed the resin resettlement section with the lower face side of plate; And the distributor gear of the resin material that resin material is supplied with to described resin resettlement section, covering the described somatotype film that described compression molding accommodates with the plate lower face side with described somatotype film in the die cavity and the described resin of covering is same film.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device, and resin material is being provided with in the distributor gear of the resin material of described resin resettlement section supply: with the feed mechanism of resin material to the resin material of described resin resettlement section supply; Metering is to the metrological service of the resin material of the resin material of described resin resettlement section supply; And make the planarization mechanism of the resin material of the resin material planarization that supplies to described resin resettlement section.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device, and described planarization mechanism accommodates with plate described resin to move horizontally planarization mechanism along what directions X or Y direction moved.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device described resin material is granular resin material or pulverous resin material.
According to the present invention, can play the superior effect that expeditiously resin is supplied to when in mold cavity, supplying with resin in the mold cavity.
In addition, according to the present invention, can play the superior effect that improves the reliability that supplies to the amount of resin in the mold cavity when in mold cavity, supplying with resin expeditiously.
Description of drawings
Fig. 1 is that schematic representation illustrates that the resin of the compress moulding method of electronic unit of the present invention accommodates the concise and to the point stereogram with the distributor gear of plate and resin material, is illustrated in the state of described plate distribution of resin material.
Fig. 2 (1), Fig. 2 (2) are that schematic representation illustrates that the resin of the compress moulding method of electronic unit of the present invention accommodates the concise and to the point stereogram with plate, Fig. 2 (1) is illustrated in the distributor gear of resin material shown in Figure 1, be assigned the state of resin material onboard, Fig. 2 (2) resin that to be expression distributed resin material by the distributor gear of resin material shown in Figure 1 is dispersion plate.
Fig. 3 be the compression molding of electronic unit of schematic representation compress moulding method that electronic unit of the present invention is described with the concise and to the point profilograph of die device, expression supplies to the resin shown in Fig. 2 (2) dispersion plate the state of described die device.
Fig. 4 is the concise and to the point profilograph of the compression molding of the schematic representation electronic unit corresponding with Fig. 3 with die device, and expression covers the absorption of somatotype film in the lower impressions of being located in the described die device (mould), makes resin material fall the state that supplies in the die cavity that has covered the somatotype film from resin dispersion plate thus.
Fig. 5 is the concise and to the point profilograph of the compression molding of the schematic representation electronic unit corresponding with Fig. 3 with die device (mould), represents the matched moulds state of described mould.
Fig. 6 is that the compression molding of electronic unit of compress moulding method of the known electronic unit of schematic representation explanation is with the concise and to the point profilograph of die device.
The specific embodiment
According to the present invention, at first, the absorption of somatotype film is covered in resin accommodates the lower surface of using plate, with the plate lower opening portion sealing of peristome, the peristome of resin being accommodated with plate forms the resin resettlement section thus, thereby can obtain to have the resin supply header board of resin resettlement section.
Then, distributor gear by resin material is supplied with granular resin material (particulate resin) the slave plate top peristome of aequum to the resin resettlement section that resin is supplied with header board, by the planarization mechanism of resin material the particulate resin of aequum is formed uniform thickness and makes its planarization, can form particulate resin with the planarization of aequum thus and be contained in resin dispersion plate in the resin resettlement section.
Then, at the lower side clamping resin of inner loading machine dispersion plate, and the substrate that requisite number purpose electronic unit will be installed the electronic unit installed surface towards below state download the upper side that places inner loading machine.
Then, make inner loading machine enter up and down between the amphitypy of mould of compression molding of electronic unit.
At this moment, with substrate that electronic unit is installed the electronic unit installed surface towards below state under supply with the substrate arrangement portion that is placed in mo(u)ld top half.
In addition, then, move down by making inner loading machine, thus can be with resin dispersion plate mounting in the profile of mo(u)ld bottom half.
At this moment, resin the plate lower opening portion of dispersion plate via the position consistency of the peristome of somatotype film and die cavity.
In addition, at this moment, in the resin resettlement section of resin dispersion plate, the particulate resin of aequum with the state mounting that is flattened on the somatotype film.
In addition, then, remove resin dispersion plate to the absorption of somatotype film.
In addition, and then in the profile of mo(u)ld bottom half and die cavity, force air ground is attracted to discharge, thus the somatotype film is limited to down profile, and the somatotype film drawn in the die cavity and make the somatotype film be covered in die cavity.
At this moment, with the particulate resin mounting of the planarization of aequum under the state of somatotype film, and make somatotype film (under the state that becomes one) under the state of the particulate resin of the planarization of aequum, the particulate resin of the planarization of aequum is being drawn in the lower impressions it is fallen.
Therefore, the particulate resin (under state of uniform thickness) under the state of planarization of aequum can be supplied in the lower impressions that has covered the somatotype film.
Promptly, particulate resin (under the state that becomes one) under the state of somatotype film in the planarization that makes aequum, the particulate resin of the planarization of aequum drawn in the lower impressions it is fallen, the particulate resin of aequum can be supplied under the state of planarization in the die cavity that has covered the somatotype film thus.
Thereby,, when in mold cavity, supplying with resin, can expeditiously resin be supplied in the mold cavity according to the present invention.
In addition, owing to the particulate resin of aequum can be supplied in the lower impressions that has covered the somatotype film, when therefore in mold cavity, supplying with resin, can improve the reliability that supplies to the amount of resin in the mold cavity expeditiously under the state of planarization.
Therefore, can be in the die cavity that has covered the somatotype film to the evenly heating and make its fusionization of the particulate resin of planarization state (having uniform thickness).
Thereby the part that can prevent resin in die cavity is effectively solidified and is produced the situation of residual powder.
(embodiment)
Describe embodiment (the present invention) in detail.
(using the structure of the die device of mould about the compression molding that is equipped with electronic unit)
At first, the compression molding of using in the compress moulding method to the electronic unit shown in the embodiment that is equipped with electronic unit describes with die device with the compression molding of the electronic unit of mould (type assembly) 1.
Shown in legend, be provided with in die device in the compression molding of electronic unit: the compression molding of electronic unit is with mould (type assembly) 1; Supply with the granular resin material (particulate resin) 6 and the inside loading machine 9 that the substrate 8 (shaping prebasal plate) of requisite number purpose electronic unit 7 is installed of aequum respectively or simultaneously to described mould 1; The unloader (not shown) of the forming board (described later resin molded body 12) of taking-up after by described mould 1 compression molding (resin-seal molding); And make the clamping (not shown) of mould 1 matched moulds.
Thereby, carry out compression molding by the particulate resin 6 that inner loading machine 9 is supplied with aequum to mould 1 with substrate 8, can obtain forming board (resin molded body 12) at mould 1 thus, and can take out molded substrate from mould 1 by unloader.
In addition, as described later, in the die device shown in the embodiment, be provided with the particulate resin 6 of aequum distributor gear 31 to the resin material of supplying with by the resin of inner loading machine 9 clampings dispersion plate 25 and distributing.
Thereby the distributor gear 31 that can utilize resin material is supplied with header board 21a with the particulate resin 6 of aequum to resin and is supplied with and distribute and form resin described later dispersion plate 25 (particulate resin 6 of the planarization of aequum).
(using the structure of mould about the compression molding of electronic unit)
Shown in legend, the compression molding of electronic unit possess in mould (type assembly) 1 fixing mo(u)ld top half 2, with the movable mo(u)ld bottom half 3 of mo(u)ld top half 2 arranged opposite.
In addition, in the profile of mo(u)ld top half 2, be provided with the substrate 8 that requisite number purpose electronic unit 7 is installed is supplied with the substrate arrangement portion 4 that settles with electronic unit installed surface side towards the state of below.
In addition, in the profile of mo(u)ld bottom half 3, the die cavity 5 that compression molding is used is with the state setting of die cavity peristome 10 (towards mo(u)ld top half 2 directions) opening towards the top.
Thereby by making amphitypy 1 (23) matched moulds up and down, electronic unit 7 setting-ins that will be installed on substrate 8 thus are placed in the lower impressions 5, and wherein, described substrate 8 is supplied with the mo(u)ld top half substrate arrangement portion 4 that is placed in.
In addition, in amphitypy 1 (23) up and down, be provided with the heating arrangements (not shown) that amphitypy 1 (23) up and down is heated to required temperature.
Thereby, can utilize the heating arrangements of mould 1 to supply to particulate resin 6 heating of the aequum in the lower impressions 5 and to make its fusionization by inner loading machine 9 (resin described later is dispersion plate 25).
In addition, be provided with the die cavity bottom surface member 38 that the resin that the resin in the die cavity 56 is pushed with required pressing force is pushed usefulness in the bottom surface of die cavity 5.
Thereby, push resin 6 in the lower impressions 5 by die cavity bottom surface member 38, can in lower impressions 5, will be installed on electronic unit 7 compression moldings (resin-seal molding) of substrate 8 thus.
(about the adsorbing mechanism of the somatotype film of mo(u)ld bottom half)
In addition, though not shown, in mo(u)ld bottom half 3, on the face of following profile and die cavity 5, be provided with the attraction mechanism of the somatotype film of absorption somatotype film 11.
Need to prove, attract mechanism to possess for example to attract hole, vacuum path, and vacuum device (vavuum pump), attract the hole to be located at the inside of mo(u)ld bottom half 3 in the mode on the surface of the profile that can arrive mo(u)ld bottom half 3 and die cavity 5.
Thereby, make the attraction mechanism action, force air attract is discharged, can cover fixing along the shape of the face of the profile of mo(u)ld bottom half 3 and die cavity 5 somatotype film 11 thus.
For example, at profile mounting (flat shape) the somatotype film 11 of mo(u)ld bottom half 3 and make when attracting mechanism action, at first, somatotype film 11 is limited to the profile of mo(u)ld bottom half 3, then, attract somatotype film 11 and it is drawn in the lower impressions 5, can cover somatotype film 11 fixing along the shape of lower impressions 5 thus.
In addition, according to the present invention, as described later, somatotype film 11 drawn in and when covering in the lower impressions 5, to be positioned in simultaneously resin described later the aequum on the somatotype film 11 of dispersion plate 25 (as described later, planarization) the somatotype films 11 of particulate resin 6 in being drawn into lower impressions 5 draw in and these particulate resin 6 are fallen, the particulate resin 6 (as described later, under the state of planarization) of aequum can be supplied in the die cavity 5 that has covered somatotype film 11 thus.
Thereby, after supplying to the particulate resin 6 of aequum in the die cavity 5 that has covered somatotype film 11, at first, make amphitypy 1 (23) matched moulds up and down, the electronic unit 7 that will be installed on substrate 8 thus impregnated in the resin 6 of heating and meltingization in the die cavity 5 that has covered somatotype film 11, wherein, described substrate 8 is supplied with the mo(u)ld top half substrate arrangement portion 4 that is placed in, then, push resin 6 in the die cavity 5 by die cavity bottom surface member 38 via somatotype film 11, in the corresponding resin molded body 12 of shape that thus can be in lower impressions 5 electronic unit 7 that is installed on substrate 8 is carried out compression molding (resin-seal molding) with lower impressions 5.
(accommodating the structure of using plate about resin)
Then, the structure that the resin of supplying with the particulate resin 6 of aequum in lower impressions 5 of the present invention is accommodated with plate 21 (resin is supplied with header board 21a) describes.
Accommodate at resin and to be provided with along the vertical direction the peristome 37 that connects with plate 21 and to be formed at plate circumference 24 (outer frame) around the peristome 37.
In addition, at peristome 37, be provided with the plate top peristome 39 of being located at the plate upper side and the plate lower opening portion 23 that is located at the plate lower side.
In addition, though not shown, the lower surface of plate circumference 24 be provided with absorption fixedly the somatotype film of somatotype film 11 adsorb fixed mechanism.
By somatotype film absorption fixed mechanism somatotype film 11 is absorbed and fixed at the lower surface of plate circumference 24, can plate lower opening portion 23 (peristome 37) be sealed by somatotype film 11 thus.
That is,, form the resin resettlement section 22 of recess thus with particulate resin 6 that can collecting post's requirement by plate lower opening portion 23 sealing of somatotype film 11 with peristome 37.
In addition, form resin resettlement section 22, can obtain to have the resin supply header board 21a of resin resettlement section 22 thus by somatotype film 11.That is, the resin with resin resettlement section 22 is supplied with header board 21a and is accommodated with plate 21 and somatotype film 11 by resin and constitute.
Thereby, as described later, can the particulate resin 6 slave plates top peristome 39 of aequum be supplied with to the resin resettlement section 22 that resin is supplied with header board 21a by the distributor gear 31 of resin material.
In addition, (on the plane) shape of (on the plane) shape of plate below, top peristome 23,39 and die cavity peristome 10 is corresponding and form.
For example, die cavity peristome 10 shapes form rectangle, and the shape of the plate of peristome 37 below, top peristome 23,39 is corresponding with the shape of the die cavity peristome 10 of rectangle and form.
(about the structure of the distributor gear of resin material)
In an embodiment, supply with by the particulate resin 6 of the distributor gear of resin material shown in Figure 1 (planarization mechanism is supplied with in the metering of resin material) 31 First Astronautic Research Institute for Measurement and Test's requirements and with these particulate resin 6 and to drop into resins and supply with in the resin resettlement section 22 of header board 21a, and supply with the resin resettlement section 22 of header board 21a at resin, with particulate resin 6 planarizations, the particulate resin after the planarization of aequum 6 can be allocated in the resin resettlement section 22 that resin is supplied with header board 21a with uniform thickness (a certain amount of amount of resin of per unit area) thus.
In addition, the distributor gear 31 of resin material be provided with resin material input side distributor gear 31a, resin material accept side distributor gear 31b.
(about the input side distributor gear of resin material)
As shown in Figure 1, the input side distributor gear 31a of resin material comprises: injection mechanism (feed mechanism of resin material) 32 from the resin material of the particulate resin 6 that drops into aequums to the resin resettlement section 22 of resin supply header board 21a that supply with; And metering is to the feeder side metrological service (dynamometer) 33 of the resin material of the particulate resin 6 of the aequum of resin resettlement section 22 inputs of resin supply header board 21a.
In addition, as shown in Figure 1, at the injection mechanism 32 of resin material, move when being provided with the feed hopper 34 of particulate resin and utilizing suitable vibrating mechanism (not shown) to make particulate resin 6 vibration and drop into resin and supply with linear oscillator feeder 35 in the resin resettlement section 22 of header board 21a.
In addition, supply with when dropping into particulate resin 6, can supply with the particulate resin 6 that drops into to the resin resettlement section 22 that resin is supplied with header board 21a by feeder side metrological service (dynamometer) 33 meterings.
Thereby, in the input side distributor gear 31a of resin material, by linear oscillator feeder 35 particulate resin 6 from feed hopper 34 is moved while vibrating, can supply with the particulate resin 6 (for example, on a small quantity one by one) of the resin resettlement section 22 supply input aequums of header board 21a thus to resin.
In addition, for example in linear oscillating feeder 35, also can make particulate resin 6 vibrations, time per unit is supplied with input with a certain amount of amount of resin to the resin resettlement section 22 that resin is supplied with header board 21a thus.
(about resin material accept the side distributor gear)
As shown in Figure 1, the side distributor gear 31b that accepts at resin material is provided with: accommodated by resin and with the somatotype film of plate 21 absorption fixed mechanism resin is fixed in 11 absorption of somatotype film and accommodates and form the resin with resin resettlement section 22 with the lower face side of plate 21 and supply with the resin supply header board of header board 21a and form mechanism (not shown); The mounting resin is supplied with the plate mounting table 40 of header board 21a; Resin is supplied with header board 21a move carrying mechanism (diagram) in the plate of plate mounting table 40 from resin supply header board formation mechanism mounting; And make with required thickness and to supply to mounting from the linear oscillator feeder 35 of the input side distributor gear 31a of resin material and supply with the planarization mechanism (for example, resin material described later move horizontally planarization mechanism 42) of resin material of particulate resin 6 planarizations of the aequum the resin resettlement section 22 of header board 21a in the resin of plate mounting table 40.
Thereby, accept side distributor gear 31b at resin material, at first, form mechanism by resin supply header board and form resin supply header board 21a with resin resettlement section 22, and move carrying mechanism by plate resin is supplied with header board 21a mounting in plate mounting table 40, then, while the particulate resin 6 of aequum is vibrated move to supply to resin from linear oscillator feeder 35 and is supplied with the resin resettlement section 22 of header board 21a.
At this moment, by the planarization mechanism (moving horizontally planarization mechanism 42) of resin material and the common running operation of linear oscillator feeder 35, can make particulate resin 6 planarizations of the aequum that supplies to resin resettlement section 22 with required uniform thickness 41.
(about the planarization mechanism of resin material)
Resin material accept side distributor gear 31b, as the planarization mechanism of resin material, be provided with and for example move horizontally planarization mechanism 42.
That is, can by move horizontally planarization mechanism 42 make mounting in the resin of plate mounting table 40 supply with header board 21a in the horizontal direction, be that directions X or Y direction shown in Figure 1 moves respectively or simultaneously.
Thereby, supply with in the resin resettlement section 22 that the resin of plate mounting table 40 is supplied with header board 21a to mounting from linear oscillator feeder 35 while the particulate resin 6 of aequum is vibrated move.
In addition, at this moment, by moving horizontally planarization mechanism 42 resin supply header board 21a is moved along directions X or Y direction, can in resin resettlement section 22, make particulate resin 6 planarizations (per unit area forms a certain amount of amount of resin) of aequum thus, thereby form resin dispersion plate 25 with required uniform thickness 41 (with reference to Fig. 3).
(about the structure of inner loading machine)
At inner loading machine 9, the clamping resin plate Access Division 9a of dispersion plate 25 (that is, the resin that contains the particulate resin 6 after the planarization of aequum in the resin resettlement section 22 that is formed by somatotype film 11 is accommodated with plate 21) is located at inner loading machine lower side.
In addition, at inner loading machine 9, substrate 8 is located at inner loading machine upper side with electronic unit 7 towards the 9b of substrate-placing portion of the state mounting of below.
Thereby, inner loading machine 9 is entered up and down between amphitypy 1 (23), substrate 8 is moved up, thus can with substrate 8 that electronic unit 7 is installed electronic unit installed surface side towards below state under supply with the substrate arrangement portion 4 that is placed in mo(u)ld top half 2.
In addition, inner loading machine 9 is entered up and down between amphitypy 1 (23), inner loading machine 9 is moved down, can make resin accommodate position with the plate lower opening portion 23 of plate 21 thus via the position consistency of somatotype film 11 with the die cavity peristome 10 of mo(u)ld bottom half 3.
At this moment, accommodate with clamping somatotype film 11 between the lower surface of plate 21 at the profile and the resin of mo(u)ld bottom half 3.
In addition, at this moment, can remove and be located at resin and accommodate with the absorption of the somatotype film absorption fixed mechanism of the lower surface of plate 21 to the somatotype film.
In addition, and then attract, can end somatotype film 11 at the profile card of mo(u)ld bottom half 3 thus, and somatotype film 11 is drawn in the lower impressions 5, and somatotype film 11 is covered on the face of die cavity 5 by the attraction mechanism on the face of the profile of being located at mo(u)ld bottom half 3 and die cavity 5.
At this moment, the somatotype film 11 of particulate resin 6 in being drawn into die cavity 5 that contains the planarization of the aequum that places somatotype film 11 in the resin resettlement section 22 of resin dispersion plate 25 (peristome 37) falls in the die cavity 5.
That is, the particulate resin 6 (once) of the planarization of aequum can be supplied in the die cavity 5 that has covered somatotype film 11.
Thereby, in the die cavity 5 that has covered somatotype film 11, the thickness of the particulate resin 6 of aequum can be formed evenly.
(about the somatotype film)
Cutting off (pre-cutting) in advance by the somatotype film (the somatotype film of web-like) with strip becomes Len req to prepare somatotype film 11 used in the present invention (the somatotype film of short strip shape).
Therefore, compared to whenever particulate resin 6 is supplied with the die device that the somatotype film (the somatotype film of strip) that will fill in the web-like in the die device when header board 21a supplies with cuts into somatotype film 11 (the somatotype film of short strip shape) to resin, can omit the mechanism that the somatotype film of web-like is filled in die device.
Thereby, compare with the size of die device of the somatotype film of filling web-like, can make the compact in size of die device integral body of the present invention.
(about the compress moulding method of electronic unit)
At first, make 11 absorption of somatotype film be covered in resin and accommodate the lower face side of using plate 21, the plate lower opening portion 23 of closed peristome 37 and form resin resettlement section 22 forms the resin with resin resettlement section 22 thus and supplies with header board 21a (with reference to Fig. 2 (1)～(2), Fig. 3).
Then, as shown in Figure 1, in the distributor gear 31 of resin material, the mounting resin is supplied with header board 21a on pallet 40.
At this moment, clamping somatotype film 11 between resin is accommodated with plate 21 and pallet 40.
Then, in the distributor gear 31 of resin material, by the particulate resin 6 of feeder side metrological service (dynamometer) 33 First Astronautic Research Institute for Measurement and Test's requirements of the input side distributor gear 31a side of resin material, while and the particulate resin 6 of aequum is vibrated move and supplied to the resin resettlement section 22 that resin is supplied with header board 21a by linear oscillator feeder 35 from plate top peristome 39 from feed hopper 34.
At this moment, accept side distributor gear 31b side at resin material, make the resin of mounting on plate mounting table 40 supply with header board 21a by moving horizontally planarization mechanism 42 (the planarization mechanism of resin material) along directions X or Y direction difference or mobile simultaneously, can make thus while vibrating and supply to the planarization in resin is supplied with the resin resettlement section 22 of header board 21a of particulate resin 6 that resin supplies with the aequum in the resin resettlement section 22 of header board 21a, the thickness of particulate resin 6 is formed evenly (with reference to Fig. 2 (1)～(2), Fig. 3).
Thereby, in the distributor gear 31 of resin material, the particulate resin 6 that makes aequum supplies to the resin of mounting on pallet 40 and supplies with in the resin resettlement section 22 of header board 21a and make these particulate resin 6 planarizations while vibrating, and can form resin dispersion plate 25 thus.
Need to prove, can be on the somatotype film 11 of plate lower opening portion 23 sides of peristome 37 (in the resin resettlement section 22 and on the somatotype film 11) mounting have under the state of particulate resin 6 of planarization of aequum (mounting has under the state of the particulate resin with uniform thickness 6 of aequum) to form this resin dispersion plate 25.
Then, as shown in Figure 3, resin dispersion plate 25 is connected in the plate Access Division 9a of inner loading machine 9, and the substrate-placing portion 9b of substrate 8 mountings of electronic unit 7 in inner loading machine 9 will be installed.
Then, inner loading machine 9 is entered up and down between amphitypy 1 (23), and substrate 8 is moved up, the substrate 8 that electronic unit 7 will be installed thus the electronic unit installed surface towards below state under supply with the substrate arrangement portion 4 that is placed in mo(u)ld top half 2.
In addition, inner loading machine 9 is moved down, thus with 25 mountings of resin dispersion plate in the profile of mo(u)ld bottom half 3.
At this moment, the plate lower opening portion 23 of dispersion plate 25 is consistent with the peristome 10 of die cavity 5 via somatotype film 11 can to make resin.
In addition, at this moment, in the resin resettlement section 22 of resin dispersion plate 25, the particulate resin 6 of aequum is downloaded at the state of planarization and is placed on the somatotype film 11.
Then, remove resin the somatotype film absorption fixed mechanism of dispersion plate 25 to the absorption of somatotype film 11.
In addition, then, as shown in Figure 4, make the attraction mechanism action of mo(u)ld bottom half 3 sides, from the profile of mo(u)ld bottom half 3 and the face of lower impressions 5 force air ground is attracted to discharge thus.
At this moment, can under the state of the profile that somatotype film 11 is limited to mo(u)ld bottom half 3, somatotype film 11 be drawn in the lower impressions 5, somatotype film 11 is covered along the shape of die cavity 5.
In addition, at this moment, as shown in Figure 4, in the resin resettlement section 22 of resin dispersion plate 25, mounting in the particulate resin 6 of the planarization of the aequum on the somatotype film 11 under the state of somatotype film 11, draw in and make it to fall in the lower impressions 5 particulate resin 6 of the planarization of aequum.
In addition, at this moment, can with the particulate resin 6 of aequum under the state of planarization, be to supply in the lower impressions 5 that has covered somatotype film 11 under the uniform state of thickness of particulate resin 6.
Thereby, in this case, with particulate resin 6 mountings of the planarization of aequum under the state on the somatotype film 11, and, make the particulate resin 6 of aequum fall (once) and supply in lower impressions 5 with the state (state of uniform thickness) of planarization in the particulate resin 6 (under the state that becomes one) under the state of somatotype film 11 of the planarization that makes aequum.
Promptly, the present invention constitute be equipped with resin the resin in the inside loading machine 9 of dispersion plate 25 (resin material feed mechanism) plate lower opening portion 23 mountings of dispersion plate 25 particulate resin 6 of the planarization of aequum can be supplied in the lower impressions 5 that has covered somatotype film 11 expeditiously in the structure of mo(u)ld bottom half 3 (die cavity peristome 10).
In addition, among the present invention, owing to the particulate resin 6 (under state of uniform thickness) under the state of planarization of aequum can be supplied in the lower impressions 5 that has covered somatotype film 11, therefore can prevent as known example, the part 92 of resin blocks retaining 90 and remain in the situation of feed mechanism 89.
Thereby, according to the present invention, not needing the retaining door 90 shown in the known example, a part 92 of having eliminated particulate resin 84 remains in the defective shown in the such known example of feed mechanism 89 sides.
Therefore, the present invention can supply to the particulate resin 6 (with somatotype film 11 once) of the planarization of aequum in the die cavity 5 that has covered somatotype film 11.
Then, in the die cavity 5 that has covered somatotype film 11, heating under the state of particulate resin 6 in planarization of aequum is made its fusionization.
In this case, owing to the particulate resin 6 (under state of uniform thickness) under the state of planarization of aequum can be supplied in the lower impressions 5 that has covered somatotype film 11, therefore can in the lower impressions 5 that has covered somatotype film 11, (for example, from the die cavity bottom surface side) evenly heat the particulate resin 6 of aequum and make its fusionization.
Thereby, compare with the situation in unevenly particulate resin 6 being supplied to lower impressions 5, can prevent effectively because of particulate resin 6 unevenly a heating and meltingization part solidify and become residual powder
(for example, the grain of less cured resin).
Then, mo(u)ld bottom half 3 is moved up and make up and down amphitypy 2,3 matched moulds, to be placed in the resin 6 that the electronic unit of installing on the substrate 8 in the mo(u)ld top half substrate arrangement portion 47 impregnated in the heating and meltingization lower impressions 5 in supply thus, and push the interior resin of die cavity 5 by die cavity bottom surface member 38.
After the required time,, can in die cavity 5, will be installed on electronic unit 7 compression moldings (resin-seal molding) of substrate 8 thus in the resin molded body corresponding 12 through overcuring with the shape of die cavity 5 by making amphitypy 2,3 die sinkings up and down.
That is, as mentioned above, can supply with the particulate resin 6 of aequum and make its planarization to the resin resettlement section 22 that resin is supplied with header board 21a by the distributor gear 31 of resin material, thereby form resin dispersion plate 25.
In addition, as mentioned above, particulate resin 6 by will containing the planarization that places the aequum on the somatotype film 11 in the resin resettlement section 22 of resin dispersion plate 25 is in somatotype film 11 is drawn in die cavity 5 and it is fallen, and can (particulate resin 6 of aequum be formed under the state of uniform thickness) under the state of planarization the particulate resin 6 of aequum thus and supply in the die cavity 5 that has covered somatotype film 11.
Thereby, according to the present invention, by with the particulate resin 6 of the planarization of aequum in somatotype film 11 is drawn in die cavity 5 and it is fallen, the particulate resin 6 of aequum can be supplied under the state of planarization in the die cavity 5 that has covered somatotype film 11 thus, therefore can reach when in mold cavity, supplying with resin, expeditiously resin be supplied to the superior effect in the mold cavity 5.
In addition, according to the present invention, as mentioned above, owing to the particulate resin 6 of aequum can be supplied under the state of planarization in the die cavity 5 that has covered somatotype film 11, therefore can reach when in mold cavity 5, supplying with resin, improve the superior effect of the reliability that supplies to the amount of resin in the mold cavity 5 expeditiously.
The present invention is not limited to described embodiment, is not breaking away from the scope of the inventive concept, can optionally change arbitrarily and suitably and be selected to adopt.
(about the metrological service of other resin materials)
Resin material accept side distributor gear 31b, be provided with metering and supply with and be fed into the plate side metrological service (dynamometer) 36 of resin material of particulate resin 6 of aequum that resin is supplied with the resin resettlement section 22 of header board 21a.
Thereby, resin material accept side distributor gear 31b side, can supply to the particulate resin 6 that resin is supplied with the resin resettlement section 22 of header board 21a by plate side metrological service 36 meterings of resin material.
In addition, about the metering of particulate resin 6, the measurement process that the measurement process that can and be carried out with the feeder side metrological service 33 of the input side distributor gear 31a of resin material and the plate side metrological service 36 that accepts side distributor gear 31b of resin material are carried out.
In addition, also can adopt any one the structure of only implementing in these two measurement process.
(about the planarization mechanism of other resin materials)
In addition, accept side distributor gear 31b at resin material, be provided with vibration homogenising mechanism (not shown) as the resin material of the planarization mechanism of resin material, it is fed into particulate resin 6 (supplying with header board 21a with resin) in the resin resettlement section 22 from linear oscillator feeder 35 and vibrates and make this particulate resin 6 respectively or move along directions X or Y direction simultaneously by making, and makes particulate resin 6 planarizations thus in resin resettlement section 22 and makes the thickness homogenising of particulate resin 6.
That is, resin material accept side distributor gear 31b, make resin supply with header board 21a vibration by vibration homogenising mechanism, make thus to supply with to be fed into the particulate resin 6 that resin supplies with in the resin resettlement section 22 of header board 21a and to move along directions X or Y direction.
At this moment, move and make its planarization along directions X or Y direction, can in resin resettlement section 22, make the thickness homogenising of particulate resin 6 thus by making the particulate resin 6 that supplies to resin resettlement section 22.
Thereby, can form the resin dispersion plate 25 of the resin resettlement section 22 (peristome 37) of particulate resin 6 (particulate resin 6) with uniform thickness with planarization of having supplied with aequum.
In addition,, make particulate resin 6 vibrations, can be fed into the resin resettlement section 22 that resin is supplied with header board 21a with a certain amount of amount of resin of time per unit thus at the injection mechanism 32 (linear oscillator feeder 35) of resin material.
In this case, resin input amount by suitable this time per unit of adjustment, and the vibration homogenising mechanism of resin material resin is supplied with the vibration effect of header board 21a (particulate resin 6), the particulate resin 6 that are fed in the resin resettlement section 22 can be formed uniform thickness (a certain amount of amount of resin of per unit area) thus.
In addition, can adopt and particulate resin 6 is fallen and be fed into the structure of central portion that resin is supplied with the resin resettlement section 22 of header board 21a.
In this case, the particulate resin 6 that in resin resettlement section 22, is applied in vibration outward peripheral direction evenly move and planarization (make the thickness of particulate resin 6 even).
In addition, supply with under the residual situation that jog arranged of particulate resin 6 in the resin resettlement section 22 of header board 21a being fed into resin, by planarization mechanism resin is supplied with header board 21a and apply the vibration effect by suitable resin material, or by pressing plate (へ ら), can make this jog planarization and make the thickness homogenising of particulate resin 6.
In addition, in described embodiment,, also can use thermoplastic resin material though understand the resin material that uses Thermocurable.
In addition, in described embodiment,, also can adopt the resin material (powder resin) of powdery, the resin material of pulverous resin material different shapes such as (powdexes) with required particle diameter distribution though understand the granular resin material 6 of use.
In addition, in described embodiment, can use the resin material of the system of silicon for example, the resin material of epoxy system.
In addition, in described embodiment, can use resin material, the resin material with transparency, the various resin materials such as resin material that contain phosphorus, fluorescent substance with translucence.
In addition, resin dispersion plate 25 can adopt at resin and accommodates the structure of covering member with the upper surface setting of plate 21, also can adopt square onboard peristome 39 (resin resettlement section 22) that the structure of lid is set.
Symbol description
The compression molding of 1 electronic unit mould (type assembly)
2 fixing mo(u)ld top halves
3 movable mo(u)ld bottom halves
4 substrate arrangement sections
5 lower impressions
6 granular resin materials (particulate resin)
7 electronic units
8 substrates
9 inner loading machines
9a plate Access Division
9b substrate-placing portion
10 die cavity peristomes
11 somatotype films
12 resin molded bodies
21 resins are accommodated and are used plate
The 21a resin is supplied with header board
22 resin resettlement sections
23 plate lower opening portions
24 plate circumferences
25 resins are dispersion plate
The distributor gear of 31 resin materials
31a drops into the side distributor gear
31b accepts the side distributor gear
The injection mechanism of 32 resin materials
The metrological service of 33 feeder sides
34 feed hoppers
35 linear oscillator feeders
The metrological service of 36 plate sides
37 peristomes
38 die cavity bottom surface members
39 plates top peristome
40 plate mounting portions
41 required thickness (distance)
42 move horizontally planarization mechanism

Claims (9)

1. the compress moulding method of an electronic unit, its resin material with aequum supplies in the mold cavity that has covered the somatotype film, and electronic unit be impregnated in resin in the described die cavity, thus in described die cavity, in the resin molded body corresponding with the shape of this die cavity with described electronic unit compression molding, the compress moulding method of described electronic unit is characterised in that, comprising:
Thereby possess the lower surface of accommodating with plate and form the operation that the resin with resin resettlement section is supplied with header board with the resin of described mold cavity corresponding opening portion by the somatotype film is covered in;
The resin material of aequum is supplied with the operation of the described resin resettlement section supply of header board to described resin;
Form in the described resin resettlement section resin material thickness evenly and the resin of the planarization operation of dispersion plate;
By with described resin dispersion plate mounting in the position of described mold cavity, make described resin resettlement section via the described somatotype film operation consistent thus with described mold cavity;
Described somatotype film is covered in the operation of described cavity surface; And
When described somatotype film is covered in described cavity surface, resin material is supplied to operation in the described mold cavity in the described resin resettlement section.
2. the compress moulding method of electronic unit as claimed in claim 1 is characterized in that,
Comprise following operation: form in the described resin resettlement section resin material thickness evenly and the resin of planarization during dispersion plate, supply with and make simultaneously this resin supply header board to move to the described resin resettlement section that described resin is supplied with header board the resin material of aequum, thus the resin material in this resin resettlement section is formed required uniform thickness and makes its planarization along directions X or Y direction.
3. the compress moulding method of electronic unit as claimed in claim 1 is characterized in that,
Comprise following operation: form in the described resin resettlement section resin material thickness evenly and the resin of planarization during dispersion plate, panel vibration before resin is supplied with forms the resin material in the described resin resettlement section required uniform thickness and makes its planarization thus.
4. the compress moulding method of electronic unit as claimed in claim 1 is characterized in that,
Described resin material is granular resin material or pulverous resin material.
5. the compression molding die device of an electronic unit, it possesses the compression molding mould of the electronic unit that constitutes by mo(u)ld top half and with the mo(u)ld bottom half of described mo(u)ld top half arranged opposite, be located at the compression molding die cavity of described mo(u)ld bottom half, be located at the substrate arrangement portion of described mo(u)ld top half, cover the somatotype film in the described lower impressions, the resin that resin in the described lower impressions is pushed is pushed the die cavity bottom surface member of usefulness, and with resin material and the inside loading machine of the substrate that electronic unit is installed to described mould supply, the compression molding of described electronic unit is characterised in that to possess with die device:
The resin that is installed on described inner loading machine and has a peristome is accommodated and is used plate; Cover described resin and accommodate the somatotype film that described peristome is formed the resin resettlement section with the lower face side of plate; And the distributor gear of the resin material that resin material is supplied with to described resin resettlement section, covering the described somatotype film that described compression molding accommodates with the plate lower face side with described somatotype film in the die cavity and the described resin of covering is same film.
6. the compression molding die device of electronic unit as claimed in claim 5 is characterized in that,
Resin material is being provided with in the distributor gear of the resin material of described resin resettlement section supply: with the feed mechanism of resin material to the resin material of described resin resettlement section supply; Metering is to the metrological service of the resin material of the resin material of described resin resettlement section supply; And make the planarization mechanism of the resin material of the resin material planarization that supplies to described resin resettlement section.
7. the compression molding die device of electronic unit as claimed in claim 6 is characterized in that,
Described planarization mechanism accommodates with plate described resin to move horizontally planarization mechanism along what directions X or Y direction moved.
8. the compression molding die device of electronic unit as claimed in claim 5 is characterized in that,
Described resin material is granular resin material or pulverous resin material.
9. the compression molding die device of electronic unit as claimed in claim 5 is characterized in that,
Cut into Len req in advance by somatotype film and prepare described somatotype film strip.
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