CN102105282B - Method for compression-molding electronic component and die apparatus - Google Patents

Method for compression-molding electronic component and die apparatus Download PDF

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Publication number
CN102105282B
CN102105282B CN200980128894.XA CN200980128894A CN102105282B CN 102105282 B CN102105282 B CN 102105282B CN 200980128894 A CN200980128894 A CN 200980128894A CN 102105282 B CN102105282 B CN 102105282B
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China
Prior art keywords
resin
resettlement section
resin material
supplied
electronic unit
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CN200980128894.XA
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Chinese (zh)
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CN102105282A (en
Inventor
浦上浩
高田直毅
大槻修
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Towa Corp
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention provides a method for compression-molding electronic component and a die apparatus. A resin supply pre-plate (21a) is configured by forming an opening section (37) on a resin-storing section (22) by applying a die-releasing film (11) on a lower surface of a resin-storing plate (21) having the opening section (37) corresponding to a lower die cavity (5) so as to efficiently improve reliability of a resin quantity supplied into the lower cavity (5) at the time of supplying a granular resin (6) into the lower die cavity (5). A resin-dispersed plate (25) is formed by supplying the resin-storing section (22) with the granular resin (6) of a required quantity and flattening the resin (i.e., forming the resin in uniform thickness). Then, by placing the resin-dispersed plate (25) at a position of the lower die cavity (5) and pulling the die-releasing film (11) into the lower die cavity (5), the flattened granular resin (6) of a required quantity is dropped together with the die-releasing film (11) and is supplied into the cavity (5) covered with the die-releasing film (11).

Description

The compress moulding method of electronic unit and die device
Technical field
The present invention relates to a kind of by the method for the electronic unit compression moldings such as IC (Integrated Circuit) and for the die device of this compress moulding method.
Background technology
At present, as shown in Figure 6, use is equipped on the mould 81 for compression molding of the electronic unit of die device for the compression molding of electronic unit, the requisite number object electronic unit 83 that utilizes 84 pairs of granular resin materials (particulate resin) to be arranged on substrate 82 carries out compression molding (resin-seal molding), and it carries out in the following manner.
First, somatotype film 88 is covered in the lower impressions 87 in the mould 81 for compression molding (mo(u)ld top half 85 and mo(u)ld bottom half 86) of being located at electronic unit, and make its melting to the interior supply particulate resin 84 of the lower impressions 87 that has covered this somatotype film 88 heating, then, make described mould 81 (85,86) matched moulds, the molten resin that the requisite number object electronic unit 83 being arranged on substrate 82 be impregnated in lower impressions 87, thus by requisite number object electronic unit 83 compression moldings (a time one side is molded) in resin molded body corresponding to the shape with lower impressions 87.
In addition, now, the die cavity bottom surface member 93 that can press use by resin is pressed the resin of lower impressions 87.
Wherein, for to the interior supply particulate resin 84 of described lower impressions 87, use resin material feed mechanism 89 (bottom gear door 90 and supply unit 91).
; to described resin material feed mechanism 89 (supply unit 91), drop into the particulate resin 84 of aequum and make this resin material feed mechanism 89 enter 8586 of described upper and lower amphitypys; then; the bottom gear door 90 that pulls open resin material feed mechanism 89, makes particulate resin 84 fall and be supplied in lower impressions 87 from supply unit 91 thus.
Patent documentation 1: No. 2004-216558, TOHKEMY
Yet, during to the interior supply resin 84 of mold cavity 87, when opening the gear door 90 of resin material feed mechanism 89 and particulate resin 84 being fallen be supplied to lower impressions 87 interior, exist the part 92 of resin to remain in the situation of resin material feed mechanism 89 (supply unit 91) side.
Thereby, during to the interior supply resin 84 of mold cavity 87, existence cannot be expeditiously to the shortcoming of the interior supply resin 84 of mold cavity 87.
In addition, during to the interior supply resin 84 of mold cavity 87, because the part (residual particulate resin) 92 of resin remains in resin material feed mechanism 89 (supply unit 91) side, therefore easily produce to the situation of the amount of resin deficiency of mold cavity 87 interior supplies.
Thereby during to the interior supply resin 84 of mold cavity 87, existence cannot improve expeditiously to the shortcoming of the reliability of the amount of resin of mold cavity 87 interior supplies.
Summary of the invention
Problem to be solved by this invention is, when supplying with resin in mold cavity, can expeditiously resin be supplied in mold cavity, and improve the reliability that is supplied to the amount of resin in mold cavity expeditiously.
In order to solve described problem, the compress moulding method of electronic unit of the present invention is supplied to the resin material of aequum in the mold cavity that has covered somatotype film, and electronic unit be impregnated in to the resin in described die cavity, thus in described die cavity, in resin molded body corresponding to the shape with this die cavity by described electronic unit compression molding, the compress moulding method of described electronic unit is characterised in that, comprise: the resin that possesses the peristome corresponding with described mold cavity by somatotype film is covered in is accommodated the lower surface with plate, thereby form the operation of the resin supply header board with resin resettlement section, the resin material of aequum is supplied with to the operation of the described resin resettlement section supply of header board to described resin, form resin material even thickness in described resin resettlement section and the resin of the planarization operation of dispersion plate, by described resin dispersion plate being loaded to position in described mold cavity, making described resin resettlement section via the described somatotype film operation consistent with described mold cavity thus, described somatotype film is covered in to the operation of described cavity surface, and when described somatotype film is covered in to described cavity surface, resin material is supplied to the operation in described mold cavity in described resin resettlement section.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that, comprise following operation: form resin material even thickness in described resin resettlement section and the resin of planarization during dispersion plate, the described resin resettlement section that the resin material of aequum is supplied with to header board to described resin supplies with and makes simultaneously this resin supply header board to move along directions X or Y-direction, thus the resin material in this resin resettlement section is formed to required uniform thickness and makes its planarization.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that, comprise following operation: form resin material even thickness in described resin resettlement section and the resin of planarization during dispersion plate, panel vibration before resin is supplied with, forms the resin material in described resin resettlement section required uniform thickness and makes its planarization thus.
In addition, in order to solve described problem, the compress moulding method of electronic unit of the present invention is characterised in that, described resin material is granular resin material or pulverous resin material.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention possesses the compression molding mould of the electronic unit forming by mo(u)ld top half and with the mo(u)ld bottom half of described mo(u)ld top half arranged opposite with die device, be located at the compression molding die cavity of described mo(u)ld bottom half, be located at the substrate placement portion of described mo(u)ld top half, cover the somatotype film in described lower impressions, the resin that resin in described lower impressions is pressed is pressed the die cavity bottom surface member of use, and the inside loading machine that resin material and the substrate that electronic unit is installed are supplied with to described mould, the compression molding of described electronic unit is characterised in that with die device, possess: the resin that is installed on described inner loading machine and has a peristome is accommodated with plate, cover described resin and accommodate the somatotype film that by the lower face side of plate, described peristome is formed to resin resettlement section, and the distributor gear of the resin material that resin material is supplied with to described resin resettlement section, covering described compression molding, with the described somatotype film in die cavity, to accommodate with the described somatotype film of plate lower face side with the described resin of covering be same film.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device, in the distributor gear of the resin material that resin material is supplied with to described resin resettlement section, is provided with: the feed mechanism of the resin material that resin material is supplied with to described resin resettlement section; The metrological service of the resin material of the resin material that metering is supplied with to described resin resettlement section; And make to be supplied to the planarization mechanism of resin material of the resin material planarization of described resin resettlement section.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device, described planarization mechanism be described resin is accommodated with plate, along directions X or Y-direction, move move horizontally planarization mechanism.
In addition, in order to solve described problem, the compression molding of electronic unit of the present invention is characterised in that with die device, and described resin material is granular resin material or pulverous resin material.
According to the present invention, can play and expeditiously resin is supplied to the superior effect in mold cavity when supplying with resin in mold cavity.
In addition, according to the present invention, can play the superior effect that improves expeditiously the reliability that is supplied to the amount of resin in mold cavity when supplying with resin in mold cavity.
Accompanying drawing explanation
Fig. 1 is that schematic representation illustrates that the resin of the compress moulding method of electronic unit of the present invention accommodates the concise and to the point stereogram with the distributor gear of plate and resin material, is illustrated in the state of described plate distribution of resin material.
Fig. 2 (1), Fig. 2 (2) are that schematic representation illustrates that the resin of the compress moulding method of electronic unit of the present invention accommodates the concise and to the point stereogram with plate, Fig. 2 (1) means in the distributor gear of the resin material shown in Fig. 1, be assigned onboard the state of resin material, Fig. 2 (2) means resin that the distributor gear of resin material as shown in Figure 1 distributed resin material dispersion plate.
Fig. 3 is the concise and to the point profilograph of die device for compression molding of the electronic unit of schematic representation compress moulding method that electronic unit of the present invention is described, represents the resin shown in Fig. 2 (2) dispersion plate to be supplied to the state of described die device.
Fig. 4 is the concise and to the point profilograph of die device for the compression molding of the schematic representation electronic unit corresponding with Fig. 3, represents the absorption of somatotype film to cover in the lower impressions of being located in described die device (mould), make resin material from resin dispersion plate, fall the state being supplied in the die cavity that has covered somatotype film thus.
Fig. 5 is the concise and to the point profilograph of the die device for compression molding (mould) of the schematic representation electronic unit corresponding with Fig. 3, represents the matched moulds state of described mould.
Fig. 6 is the concise and to the point profilograph of die device for compression molding of the electronic unit of schematic representation compress moulding method that known electronic unit is described.
The specific embodiment
According to the present invention, first, the absorption of somatotype film is covered in to resin and accommodates the lower surface with plate, by the plate lower opening portion sealing of peristome, resin is accommodated with the peristome of plate and form resin resettlement section thus, thereby can obtain the resin supply header board with resin resettlement section.
Then, the resin resettlement section of granular resin material (particulate resin) the slave plate upper opening portion of aequum being supplied with to header board to resin by the distributor gear of resin material is supplied with, planarization mechanism by resin material forms the particulate resin of aequum uniform thickness and makes its planarization, can form thus the particulate resin of the planarization of aequum is contained in to resin in resin resettlement section dispersion plate.
Then, at the lower side clamping resin of inner loading machine dispersion plate, and the substrate that requisite number object electronic unit is installed is downloaded to the upper side that is placed in inner loading machine at electronic unit installed surface state downward.
Then, make inner loading machine enter up and down between the amphitypy of mould for compression molding of electronic unit.
Now, the substrate that electronic unit is installed is supplied with to the substrate placement portion that is placed in mo(u)ld top half under electronic unit installed surface state downward.
In addition, then, by inner loading machine is moved down, resin dispersion plate can be loaded to the profile in mo(u)ld bottom half thus.
Now, resin the plate lower opening portion of dispersion plate via the position consistency of the peristome of somatotype film and die cavity.
In addition, now, in the resin resettlement section of resin dispersion plate, the particulate resin of aequum loads on somatotype film with the state being flattened.
In addition, then, remove the resin absorption of dispersion plate to somatotype film.
In addition, so from the profile of mo(u)ld bottom half and die cavity by force air attract to discharge, thus somatotype film is limited to lower profile, and somatotype film is drawn in die cavity and is made somatotype film be covered in die cavity.
Now, the particulate resin of the planarization of aequum is being loaded under the state of somatotype film, and under the state making together with the particulate resin of somatotype film and the planarization of aequum (under the state becoming one), the particulate resin of the planarization of aequum is drawn in lower impressions it is fallen.
Therefore, can be by the particulate resin of aequum under the state of planarization (under the state of uniform thickness) be supplied in the lower impressions that has covered somatotype film.
; under state in the particulate resin of planarization that makes aequum together with somatotype film (under the state becoming one); the particulate resin of the planarization of aequum is drawn in lower impressions it is fallen, the particulate resin of aequum can be supplied in the die cavity that has covered somatotype film under the state of planarization thus.
Thereby, according to the present invention, when supplying with resin in mold cavity, can expeditiously resin be supplied in mold cavity.
Therefore in addition, owing to the particulate resin of aequum can being supplied under the state of planarization in the lower impressions that has covered somatotype film, when supplying with resin in mold cavity, can improve expeditiously the reliability that is supplied to the amount of resin in mold cavity.
Therefore, can in the die cavity that has covered somatotype film, to the particulate resin homogeneous heating of planarization state (thering is uniform thickness), make its melting.
Thereby the part that can effectively prevent resin in die cavity is solidified and is produced the situation of residual powder.
(embodiment)
Describe embodiment (the present invention) in detail.
(about being equipped with the structure of the die device of mould for the compression molding of electronic unit)
First, the compression molding of the electronic unit of the mould for compression molding that is equipped with electronic unit (type assembly) 1 using in the compress moulding method of the electronic unit shown in embodiment is described with die device.
As shown in legend, in the compression molding of electronic unit with being provided with in die device: the mould for compression molding of electronic unit (type assembly) 1; To described mould 1, supply with respectively or simultaneously the granular resin material (particulate resin) 6 and the inside loading machine 9 that the substrate 8 (shaping prebasal plate) of requisite number object electronic unit 7 is installed of aequum; The unloader (not shown) of the forming board (described later resin molded body 12) of taking-up after by described mould 1 compression molding (resin-seal molding); And make the clamping (not shown) of mould 1 matched moulds.
Thereby the particulate resin 6 of supplying with aequum to mould 1 by inner loading machine 9 is carried out compression molding with substrate 8, can obtain forming board (resin molded body 12) at mould 1 thus, and can from mould 1, take out molded substrate by unloader.
In addition, as described later, in the die device shown in embodiment, be provided with the particulate resin of aequum 6 is supplied with and the distributor gear 31 of the resin material that distributes to the resin by inner loading machine 9 clampings dispersion plate 25.
Thereby the distributor gear 31 that can utilize resin material is supplied with header board 21a by the particulate resin of aequum 6 to resin and is supplied with and distribute and form resin described later dispersion plate 25 (particulate resin 6 of the planarization of aequum).
(about the compression molding of electronic unit, using the structure of mould)
As shown in legend, in the mould for compression molding (type assembly) 1 of electronic unit, possess fixing mo(u)ld top half 2, with the movable mo(u)ld bottom half 3 of mo(u)ld top half 2 arranged opposite.
In addition, in the profile of mo(u)ld top half 2, be provided with the substrate 8 that requisite number object electronic unit 7 is installed is supplied with to the substrate placement portion 4 of settling with electronic unit installed surface side state downward.
In addition, in the profile of mo(u)ld bottom half 3, the die cavity 5 that compression molding is used is the state setting of (towards mo(u)ld top half 2 directions) opening towards top with die cavity peristome 10.
Thereby, by making upper and lower amphitypy 1 (23) matched moulds, thus electronic unit 7 setting-ins that are installed on substrate 8 are placed in lower impressions 5, wherein, described substrate 8 is supplied with and is placed in mo(u)ld top half substrate placement portion 4.
In addition, in upper and lower amphitypy 1 (23), be provided with the heating arrangements (not shown) that upper and lower amphitypy 1 (23) is heated to required temperature.
Thereby, can utilize the heating arrangements of mould 1 will by inner loading machine 9 (resin described later is dispersion plate 25), to be supplied to particulate resin 6 heating of the aequum in lower impressions 5 and to make its melting.
In addition, in the bottom surface of die cavity 5, be provided with the die cavity bottom surface member 38 that the resin that the resin in die cavity 56 is pressed with required pressing force is pressed use.
Thereby, by die cavity bottom surface member 38, press the resin 6 in lower impressions 5, can will be installed on electronic unit 7 compression moldings (resin-seal molding) of substrate 8 lower impressions 5 is interior thus.
(about the adsorbing mechanism of the somatotype film of mo(u)ld bottom half)
In addition, though not shown, in mo(u)ld bottom half 3, on the face of lower profile and die cavity 5, be provided with the attraction mechanism of the somatotype film of absorption somatotype film 11.
It should be noted that, attract mechanism to possess and for example attract hole, vacuum path and vacuum device (vavuum pump), attract hole can arrive the profile of mo(u)ld bottom half 3 and the surperficial mode of die cavity 5, to be located at the inside of mo(u)ld bottom half 3.
Thereby, make to attract mechanism action, force air is attracted to discharge, thus can somatotype film 11 is fixing along the shape covering of the profile of mo(u)ld bottom half 3 and the face of die cavity 5.
For example, when the profile of mo(u)ld bottom half 3 loads (flat shape) somatotype film 11 and makes to attract mechanism action, first, somatotype film 11 is limited to the profile of mo(u)ld bottom half 3, then, attract somatotype film 11 and drawn in lower impressions 5, can somatotype film 11 be covered fixing along the shape of lower impressions 5 thus.
In addition, according to the present invention, as described later, somatotype film 11 is drawn in and covered lower impressions 5 when interior, simultaneously by be positioned in resin described later the aequum on the somatotype film 11 of dispersion plate 25 (as described later, planarization) particulate resin 6 draws in and these particulate resin 6 fallen with together with somatotype film 11 in being drawn into lower impressions 5, the particulate resin of aequum 6 (as described later, under the state of planarization) can be supplied in the die cavity 5 that has covered somatotype film 11 thus.
Thereby, by the particulate resin of aequum 6 be supplied to covered the die cavity 5 of somatotype film 11 interior after, first, make upper and lower amphitypy 1 (23) matched moulds, thus the electronic unit 7 that is installed on substrate 8 be impregnated in the resin 6 of die cavity 5 interior heating and meltings that has covered somatotype film 11, wherein, described substrate 8 is supplied with and is placed in mo(u)ld top half substrate placement portion 4, then, by die cavity bottom surface member 38, via somatotype film 11, press the resin 6 in die cavity 5, resin molded body 12 corresponding to the shape with lower impressions 5 that thus can be in lower impressions 5 is interior carries out compression molding (resin-seal molding) to being installed on the electronic unit 7 of substrate 8.
(about resin, accommodating the structure with plate)
Then, the resin of the particulate resin 6 to the interior supply aequum of lower impressions 5 of the present invention is accommodated by the structure of plate 21 (resin is supplied with header board 21a) and described.
At resin, accommodate with plate 21 and be provided with the peristome 37 connecting along the vertical direction and be formed at peristome 37 plate circumference 24 (outer frame) around.
In addition, at peristome 37, be provided with the plate upper opening portion 39 that is located at plate upper side and the plate lower opening portion 23 that is located at plate lower side.
In addition, though not shown, the lower surface of plate circumference 24 be provided with absorption fixedly the somatotype film of somatotype film 11 adsorb fixed mechanism.
By somatotype film absorption fixed mechanism, somatotype film 11 is absorbed and fixed to the lower surface of plate circumference 24, can plate lower opening portion 23 (peristome 37) be sealed by somatotype film 11 thus.
That is, by somatotype film 11, by the plate lower opening portion of peristome 37 23 sealing, form thus the resin resettlement section 22 of the recess with particulate resin 6 that can collecting post's requirement.
In addition, by somatotype film 11, form resin resettlement section 22, can obtain thus the resin supply header board 21a with resin resettlement section 22.That is the resin supply header board 21a that, has resin resettlement section 22 is accommodated with plate 21 and somatotype film 11 and is formed by resin.
Thereby as described later, the resin resettlement section 22 that can the particulate resin of aequum 6 slave plate upper opening portions 39 be supplied with to header board 21a to resin by the distributor gear 31 of resin material is supplied with.
In addition, (in plane) shape of (in plane) shape of plate below, upper opening portion 23,39 and die cavity peristome 10 is corresponding and form.
For example, die cavity peristome 10 shapes form rectangle, and the shape of the plate of peristome 37 below, the shape of upper opening portion 23,39 and the die cavity peristome 10 of rectangle is corresponding and form.
(about the structure of the distributor gear of resin material)
In an embodiment, the particulate resin 6 of the distributor gear of resin material as shown in Figure 1 (planarization mechanism is supplied with in the metering of resin material) 31 First Astronautic Research Institute for Measurement and Test's requirements is also supplied with these particulate resin 6 in the resin resettlement section 22 of dropping into resin supply header board 21a, and at resin, supply with the resin resettlement section 22 of header board 21a, with uniform thickness (a certain amount of amount of resin of per unit area), by particulate resin 6 planarizations, the particulate resin after the planarization of aequum 6 can be allocated in thus to the resin resettlement section 22 that resin is supplied with header board 21a.
In addition, the distributor gear 31 of resin material be provided with resin material input side distributor gear 31a, resin material accept side distributor gear 31b.
(about the input side distributor gear of resin material)
As shown in Figure 1, the input side distributor gear 31a of resin material comprises: injection mechanism (feed mechanism of resin material) 32 from the resin material of the particulate resin 6 that drops into aequums to the resin resettlement section 22 of resin supply header board 21a that supply with; And metering is to the feeder side metrological service (dynamometer) 33 of the resin material of the particulate resin 6 of the aequum of resin resettlement section 22 inputs of resin supply header board 21a.
In addition, as shown in Figure 1, at the injection mechanism 32 of resin material, when being provided with the feed hopper 34 of particulate resin and utilizing suitable vibrating mechanism (not shown) to make particulate resin 6 vibration, move and drop into resin and supply with the linear oscillator feeder 35 in the resin resettlement section 22 of header board 21a.
In addition, supply with while dropping into particulate resin 6, the particulate resin 6 dropping into is supplied with in the resin resettlement section 22 that can supply with header board 21a to resin by feeder side metrological service (dynamometer) 33 meterings.
Thereby, in the input side distributor gear 31a of resin material, by linear oscillator feeder 35, made to move while vibrating from the particulate resin 6 of feed hopper 34, can supply with to resin the particulate resin 6 (for example, on a small quantity successively) of the resin resettlement section 22 supply input aequums of header board 21a thus.
In addition, for example, in linear oscillating feeder 35, also can make particulate resin 6 vibrations, input is supplied with in the resin resettlement section 22 that time per unit is supplied with header board 21a by a certain amount of amount of resin to resin thus.
(about resin material accept side distributor gear)
As shown in Figure 1, the side distributor gear 31b that accepts at resin material is provided with: by resin, accommodated and with the somatotype film absorption fixed mechanism of plate 21,11 absorption of somatotype film are fixed on to resin and accommodate and with the lower face side of plate 21, form the resin with resin resettlement section 22 and supply with the resin supply header board of header board 21a and form mechanism (not shown); Mounting resin is supplied with the plate mounting table 40 of header board 21a; Resin is supplied with to header board 21a to be loaded in the plate of plate mounting table 40 and moves carrying mechanism (diagram) from resin supply header board formation mechanism; And make to be supplied to and to load the planarization mechanism (for example, resin material described later move horizontally planarization mechanism 42) of resin material that supplies with particulate resin 6 planarizations of the aequum the resin resettlement section 22 of header board 21a in the resin of plate mounting table 40 from the linear oscillator feeder 35 of the input side distributor gear 31a of resin material with required thickness.
Thereby, at resin material, accept side distributor gear 31b, first, by resin supply header board, form mechanism and form the resin supply header board 21a with resin resettlement section 22, and by plate, moving carrying mechanism supplies with header board 21a by resin and loads in plate mounting table 40, then, while being vibrated, the particulate resin 6 of aequum moves the resin resettlement section 22 of supplying with header board 21a to be supplied to resin from linear oscillator feeder 35.
Now, by the planarization mechanism (moving horizontally planarization mechanism 42) of resin material and the common running operation of linear oscillator feeder 35, can make to be supplied to required uniform thickness 41 particulate resin 6 planarizations of the aequum of resin resettlement section 22.
(about the planarization mechanism of resin material)
Resin material accept side distributor gear 31b, as the planarization mechanism of resin material, be provided with and for example move horizontally planarization mechanism 42.
That is, can by move horizontally planarization mechanism 42 make to load in the resin of plate mounting table 40 supply with header board 21a in the horizontal direction, be that the directions X shown in Fig. 1 or Y-direction move respectively or simultaneously.
Thereby, while can make the particulate resin 6 of aequum vibrate to move, from linear oscillator feeder 35, to loading the resin resettlement section 22 of supplying with header board 21a in the resin of plate mounting table 40, supply with.
In addition, now, by moving horizontally planarization mechanism 42, resin supply header board 21a is moved along directions X or Y-direction, can in resin resettlement section 22, with required uniform thickness 41 (with reference to Fig. 3), make particulate resin 6 planarizations (per unit area forms a certain amount of amount of resin) of aequum thus, thereby form resin dispersion plate 25.
(about the structure of inner loading machine)
At inner loading machine 9, the clamping resin plate Access Division 9a of dispersion plate 25 (that is the resin that, contains the particulate resin 6 after the planarization of aequum in the resin resettlement section 22 being formed by somatotype film 11 is accommodated with plate 21) is located at inner loading machine lower side.
In addition, at inner loading machine 9, substrate 8 is located at inner loading machine upper side with the 9b of substrate-placing portion of electronic unit 7 state mounting downward.
Thereby, inner loading machine 9 is entered between upper and lower amphitypy 1 (23), substrate 8 is moved up, the substrate 8 that electronic unit 7 is installed can be supplied with to the substrate placement portion 4 that is placed in mo(u)ld top half 2 under electronic unit installed surface side state downward thus.
In addition, inner loading machine 9 is entered between upper and lower amphitypy 1 (23), inner loading machine 9 is moved down, can make thus resin accommodate the position of the plate lower opening portion 23 that uses plate 21 via the position consistency of the die cavity peristome 10 of somatotype film 11 and mo(u)ld bottom half 3.
Now, at the profile of mo(u)ld bottom half 3 and resin, accommodate and between the lower surface with plate 21, clamp somatotype film 11.
In addition, now, can remove and be located at resin and accommodate the absorption to somatotype film of somatotype film absorption fixed mechanism with the lower surface of plate 21.
In addition, and then attracted by the attraction mechanism being located on the profile of mo(u)ld bottom half 3 and the face of die cavity 5, can lock somatotype film 11 in the profile of mo(u)ld bottom half 3 thus, and somatotype film 11 is drawn in lower impressions 5, and somatotype film 11 is covered on the face of die cavity 5.
Now, the particulate resin 6 that contains the planarization of the aequum that is placed in somatotype film 11 in the resin resettlement section 22 of resin dispersion plate 25 (peristome 37) falls in die cavity 5 with together with somatotype film 11 in being drawn into die cavity 5.
That is, the particulate resin of the planarization of aequum 6 (once) can be supplied in the die cavity 5 that has covered somatotype film 11.
Thereby, in having covered the die cavity 5 of somatotype film 11, the thickness of the particulate resin of aequum 6 can be formed evenly.
(about somatotype film)
By the somatotype film of strip (the somatotype film of web-like) being cut off in advance to (pre-cutting), become Len req to prepare somatotype film 11 used in the present invention (the somatotype film of short strip shape).
Therefore, compared to the somatotype film (the somatotype film of strip) that fills in the web-like in die device being cut into the die device of somatotype film 11 (the somatotype film of short strip shape) when particulate resin 6 is supplied with to header board 21a supply to resin, can omit the mechanism that the somatotype film of web-like is filled in to die device.
Thereby, compare with the size of die device of the somatotype film of filling web-like, can make the compact in size of die device integral body of the present invention.
(about the compress moulding method of electronic unit)
First, make 11 absorption of somatotype film be covered in resin and accommodate the lower face side with plate 21, the plate lower opening portion 23 of closed peristome 37 and form resin resettlement section 22, forms thus the resin with resin resettlement section 22 and supplies with header board 21a (with reference to Fig. 2 (1)～(2), Fig. 3).
Then, as shown in Figure 1, in the distributor gear 31 of resin material, on pallet 40, load resin and supply with header board 21a.
Now, between accommodating with plate 21 and pallet 40, resin clamps somatotype film 11.
Then, in the distributor gear 31 of resin material, by the particulate resin 6 of feeder side metrological service (dynamometer) 33 First Astronautic Research Institute for Measurement and Test's requirements of the input side distributor gear 31a side of resin material, while and the particulate resin 6 of aequum is vibrated move and be supplied to from plate upper opening portion 39 the resin resettlement section 22 that resin is supplied with header board 21a by linear oscillator feeder 35 from feed hopper 34.
Now, at resin material, accept side distributor gear 31b side, by moving horizontally planarization mechanism 42 (the planarization mechanism of resin material), make to load resin in plate mounting table 40 and supply with header board 21a and move respectively or simultaneously along directions X or Y-direction, can make thus at resin, to supply with the interior planarization in resin resettlement section 22 of header board 21a while the particulate resin 6 of vibrating the aequum in the resin resettlement section 22 that is supplied to resin supply header board 21a, the thickness of particulate resin 6 be formed evenly (with reference to Fig. 2 (1)～(2), Fig. 3).
Thereby, in the distributor gear 31 of resin material, the particulate resin 6 that makes aequum is supplied to the resin loading on pallet 40 and supplies with in the resin resettlement section 22 of header board 21a and make these particulate resin 6 planarizations while vibrating, and can form thus resin dispersion plate 25.
It should be noted that, can be on the somatotype film 11 of plate lower opening portion 23 sides of peristome 37 (in resin resettlement section 22 and on somatotype film 11) mounting have under the state of particulate resin 6 of planarization of aequum (mounting has under the state of the particulate resin with uniform thickness 6 of aequum) to form this resin dispersion plate 25.
Then, as shown in Figure 3, resin dispersion plate 25 is connected in to the plate Access Division 9a of inner loading machine 9, and the substrate 8 that electronic unit 7 is installed is loaded to the 9b of substrate-placing portion in inner loading machine 9.
Then, inner loading machine 9 is entered between upper and lower amphitypy 1 (23), and substrate 8 is moved up, thus the substrate 8 that electronic unit 7 is installed is supplied with to the substrate placement portion 4 that is placed in mo(u)ld top half 2 under electronic unit installed surface state downward.
In addition, then make inner loading machine 9 move down, thus resin dispersion plate 25 is loaded in the profile of mo(u)ld bottom half 3.
Now, the plate lower opening portion 23 of dispersion plate 25 is consistent with the peristome 10 of die cavity 5 via somatotype film 11 can to make resin.
In addition, now, in the resin resettlement section 22 of resin dispersion plate 25, the particulate resin 6 of aequum is downloaded and is placed on somatotype film 11 at the state of planarization.
Then, remove the resin somatotype film absorption fixed mechanism of dispersion plate 25 absorption to somatotype film 11.
In addition, then, as shown in Figure 4, make the attraction mechanism action of mo(u)ld bottom half 3 sides, thus from the profile of mo(u)ld bottom half 3 and the face of lower impressions 5 by force air attract discharge.
Now, can under the state of profile that somatotype film 11 is limited to mo(u)ld bottom half 3, somatotype film 11 be drawn in lower impressions 5, somatotype film 11 is covered along the shape of die cavity 5.
In addition, now, as shown in Figure 4, in the resin resettlement section 22 of resin dispersion plate 25, under state in the particulate resin 6 of planarization that loads the aequum on somatotype film 11 together with somatotype film 11, draw in and make it to fall in lower impressions 5 particulate resin of the planarization of aequum 6.
In addition, now, can be by the particulate resin of aequum 6 under the state of planarization, be to be supplied in the lower impressions 5 that has covered somatotype film 11 under the state of even thickness of particulate resin 6.
Thereby, in this case, the particulate resin of the planarization of aequum 6 is being loaded under the state on somatotype film 11, and under the state in the particulate resin 6 of planarization that makes aequum together with somatotype film 11 (under the state becoming one), make the particulate resin 6 of aequum fall (once) with the state (state of uniform thickness) of planarization and to the interior supply of lower impressions 5.
; the present invention be configured to by be provided with resin the resin in the inside loading machine 9 of dispersion plate 25 (resin material feed mechanism) the plate lower opening portion 23 of dispersion plate 25 load in the structure of mo(u)ld bottom half 3 (die cavity peristome 10), the particulate resin of the planarization of aequum 6 can be supplied in the lower impressions 5 that has covered somatotype film 11 expeditiously.
In addition, in the present invention, due to can be by the particulate resin of aequum 6 under the state of planarization (under the state of uniform thickness) be supplied in the lower impressions 5 that has covered somatotype film 11, therefore can prevent as known example, the part 92 of resin blocks gear 90 and remain in the situation of feed mechanism 89.
Thereby, according to the present invention, not needing the gear door 90 shown in known example, a part 92 of having eliminated particulate resin 84 remains in the defect shown in the such known example of feed mechanism 89 sides.
Therefore, the present invention can be supplied to the particulate resin of the planarization of aequum 6 (together with somatotype film 11 once) in the die cavity 5 that has covered somatotype film 11.
Then, the interior particulate resin of aequum 6 is heated under the state in planarization of the die cavity 5 that has covered somatotype film 11, make its melting.
In this case, due to can be by the particulate resin of aequum 6 under the state of planarization (under the state of uniform thickness) be supplied in the lower impressions 5 that has covered somatotype film 11, therefore can be in the lower impressions 5 that has covered somatotype film 11 (for example,, from die cavity bottom surface side) homogeneous heating aequum particulate resin 6 and make its melting.
Thereby, compare with situation about unevenly particulate resin 6 being supplied in lower impressions 5, can effectively prevent because of particulate resin 6 unevenly a heating and melting part solidify and become residual powder
(for example, the grain of less cured resin).
Then, mo(u)ld bottom half 3 is moved up and make upper and lower amphitypy 2,3 matched moulds, thus the electronic unit 7 of installing on the substrate 8 being placed in supply in mo(u)ld top half substrate placement portion 4 be impregnated in to the resin 6 of the heating and melting in lower impressions 5, and the resin of being pressed in die cavity 5 by die cavity bottom surface member 38.
Through overcuring after the required time, by making upper and lower amphitypy 2,3 die sinkings, thus can die cavity 5 interior by electronic unit 7 compression moldings (resin-seal molding) that are installed on substrate 8 in resin molded body 12 corresponding to the shape with die cavity 5.
That is, as mentioned above, the resin resettlement section 22 that can supply with header board 21a to resin by the distributor gear 31 of resin material is supplied with the particulate resin 6 of aequum and makes its planarization, thereby forms resin dispersion plate 25.
In addition, as mentioned above, by the resin resettlement section 22 at resin dispersion plate 25 being contained to the particulate resin 6 of the planarization that is placed in the aequum on somatotype film 11, draw in die cavity 5 together with somatotype film 11 and it is fallen, can under the state of planarization, (particulate resin 6 of aequum be formed under the state of uniform thickness) particulate resin of aequum 6 thus and be supplied in the die cavity 5 that has covered somatotype film 11.
Thereby, according to the present invention, by the particulate resin of the planarization of aequum 6 being drawn in together with somatotype film 11 in die cavity 5 and it being fallen, the particulate resin of aequum 6 can be supplied under the state of planarization in the die cavity 5 that has covered somatotype film 11 thus, therefore can reach when supplying with resin in mold cavity, expeditiously resin is supplied to the superior effect in mold cavity 5.
In addition, according to the present invention, as mentioned above, owing to the particulate resin of aequum 6 can being supplied under the state of planarization in the die cavity 5 that has covered somatotype film 11, therefore, in the time of can reaching to the interior supply resin of mold cavity 5, improve expeditiously the superior effect of the reliability that is supplied to the amount of resin in mold cavity 5.
The present invention is not limited to described embodiment, is not departing from the scope of the inventive concept, can optionally change arbitrarily and suitably and be selected to adopt.
(about the metrological service of other resin materials)
Resin material accept side distributor gear 31b, be provided with metering and supply with and be fed into the Ban Ce metrological service (dynamometer) 36 of resin material of particulate resin 6 of aequum that resin is supplied with the resin resettlement section 22 of header board 21a.
Thereby, resin material accept side distributor gear 31b side, can be supplied to the particulate resin 6 that resin is supplied with the resin resettlement section 22 of header board 21a by Ban Ce metrological service 36 meterings of resin material.
In addition, about the metering of particulate resin 6, the measurement process that the measurement process can and carrying out with the feeder side metrological service 33 of the input side distributor gear 31a of resin material and the Ban Ce metrological service that accepts side distributor gear 31b 36 of resin material carry out.
In addition, also can adopt any one the structure of only implementing in these two measurement process.
(about the planarization mechanism of other resin materials)
In addition, at resin material, accept side distributor gear 31b, be provided with the vibration homogenising mechanism (not shown) as the resin material of the planarization mechanism of resin material, it vibrates and makes this particulate resin 6 respectively or along directions X or Y-direction, move by making to be fed into particulate resin 6 in resin resettlement section 22 (together with supplying with header board 21a with resin) from linear oscillator feeder 35 simultaneously, makes particulate resin 6 planarizations thus and make the even thickness of particulate resin 6 in resin resettlement section 22.
That is, resin material accept side distributor gear 31b, by vibration homogenising mechanism, make resin supply with header board 21a and vibrate, make thus to supply with and be fed into the particulate resin 6 that resin supplies with in the resin resettlement section 22 of header board 21a and move along directions X or Y-direction.
Now, by making the particulate resin 6 that is supplied to resin resettlement section 22 move and make its planarization along directions X or Y-direction, can in resin resettlement section 22, make the even thickness of particulate resin 6 thus.
Thereby, can form the resin dispersion plate 25 of the resin resettlement section 22 (peristome 37) of the particulate resin 6 (particulate resin 6 with uniform thickness) with the planarization of having supplied with aequum.
In addition, at the injection mechanism 32 (linear oscillator feeder 35) of resin material, make particulate resin 6 vibrations, can be fed into the resin resettlement section 22 that resin is supplied with header board 21a with a certain amount of amount of resin of time per unit thus.
In this case, by the resin input amount of suitable this time per unit of adjustment and the vibration homogenising mechanism of resin material, resin is supplied with to the effect of vibration of header board 21a (particulate resin 6), the particulate resin 6 being fed in resin resettlement section 22 can be formed to uniform thickness (a certain amount of amount of resin of per unit area) thus.
In addition, can adopt and particulate resin 6 is fallen and be fed into the structure of central portion that resin is supplied with the resin resettlement section 22 of header board 21a.
In this case, the particulate resin 6 that is applied in vibration in resin resettlement section 22 evenly mobile and planarization (making the even thickness of particulate resin 6) of peripheral direction outward.
In addition, in the situation that be fed into the particulate resin 6 that resin supplies with in the resin resettlement section 22 of header board 21a, remain jog, planarization mechanism by the resin material by suitable applies effect of vibration to resin supply header board 21a, or by pressing plate (へ ら), can make this jog planarization and make the even thickness of particulate resin 6.
In addition, in described embodiment, though understand the resin material that uses Thermocurable, also can use thermoplastic resin material.
In addition, in described embodiment, though understand to use granular resin material 6, also can adopt the resin material of the various shapes such as resin material (powder resin), pulverous resin material (powdex) with the powdery that required particle diameter distributes.
In addition, in described embodiment, can use the resin material of the system of silicon for example, the resin material of epoxy system.
In addition, in described embodiment, can use the resin material that there is transparent resin material, there is translucence, the various resin materials such as resin material that contain phosphorus, fluorescent substance.
In addition, resin dispersion plate 25 can adopt at resin and accommodates the structure of covering member with the upper surface setting of plate 21, also can adopt square peristome 39 (resin resettlement section 22) onboard that the structure of lid is set.
Symbol description
The mould for compression molding of 1 electronic unit (type assembly)
2 fixing mo(u)ld top halves
3 movable mo(u)ld bottom halves
4 substrate placement portions
5 lower impressions
6 granular resin materials (particulate resin)
7 electronic units
8 substrates
9 inner loading machines
9a plate Access Division
9b substrate-placing portion
10 die cavity peristomes
11 somatotype films
12 resin molded bodies
21 resins are accommodated and are used plate
21a resin is supplied with header board
22 resin resettlement sections
23 plate lower opening portions
24 plate circumferences
25 resins are dispersion plate
The distributor gear of 31 resin materials
31a drops into side distributor gear
31b accepts side distributor gear
The injection mechanism of 32 resin materials
The metrological service of 33 feeder sides
34 feed hoppers
35 linear oscillator feeders
The metrological service of 36 plate sides
37 peristomes
38 die cavity bottom surface members
39 plate upper opening portions
40 plate mounting portions
41 required thickness (distance)
42 move horizontally planarization mechanism

Claims (9)

1. the compress moulding method of an electronic unit, its resin material by aequum is supplied in the mold cavity that has covered somatotype film, and electronic unit be impregnated in to the resin in described mold cavity, thus in described mold cavity, in resin molded body corresponding to the shape with this mold cavity by described electronic unit compression molding, the compress moulding method of described electronic unit is characterised in that, comprising:
Thereby the resin that possesses the peristome corresponding with described mold cavity by somatotype film is covered in is accommodated the operation that forms the resin supply header board with resin resettlement section with the lower surface of plate;
The graininess of aequum or pulverous resin material are supplied with to the operation of the described resin resettlement section supply of header board to described resin;
Form resin material even thickness in described resin resettlement section and the resin of the planarization operation of dispersion plate;
By described resin dispersion plate being loaded to position in described mold cavity, making described resin resettlement section via the described somatotype film operation consistent with described mold cavity thus;
Described somatotype film is covered in to the operation of the face of described mold cavity; And
When described somatotype film is covered in to the face of described mold cavity, resin material is supplied to the operation in described mold cavity in described resin resettlement section.
2. the compress moulding method of electronic unit as claimed in claim 1, is characterized in that,
Comprise following operation: form resin material even thickness in described resin resettlement section and the resin of planarization during dispersion plate, the described resin resettlement section that the resin material of aequum is supplied with to header board to described resin supplies with and makes simultaneously this resin supply header board to move along directions X or Y-direction, thus the resin material in this resin resettlement section is formed to required uniform thickness and makes its planarization.
3. the compress moulding method of electronic unit as claimed in claim 1, is characterized in that,
Comprise following operation: form resin material even thickness in described resin resettlement section and the resin of planarization during dispersion plate, panel vibration before resin is supplied with, forms the resin material in described resin resettlement section required uniform thickness and makes its planarization thus.
4. the compress moulding method of the electronic unit as described in any one in claim 1～3, is characterized in that,
In the operation of face that described somatotype film is covered in to described mold cavity, by the Bas Discharged in described mold cavity.
5. the compression molding die device of an electronic unit, it possesses the compression molding mould of the electronic unit forming by mo(u)ld top half and with the mo(u)ld bottom half of described mo(u)ld top half arranged opposite, be located at the compression molding die cavity of described mo(u)ld bottom half, be located at the substrate placement portion of described mo(u)ld top half, cover the somatotype film in die cavity for described compression molding, described compression molding is pressed to the die cavity bottom surface member of use with the resin that the resin in die cavity is pressed, and the inside loading machine that resin material and the substrate that electronic unit is installed are supplied with mould to described compression molding, the compression molding of described electronic unit is characterised in that with die device, possess:
The resin that is installed on described inner loading machine and has a peristome is accommodated with plate; Cover described resin and accommodate the somatotype film that by the lower face side of plate, described peristome is formed to resin resettlement section; And the distributor gear of the resin material that graininess or pulverous resin material are supplied with to described resin resettlement section, covering described compression molding, with the described somatotype film in die cavity, to accommodate with the described somatotype film of plate lower face side with the described resin of covering be same film.
6. the compression molding die device of electronic unit as claimed in claim 5, is characterized in that,
In the distributor gear of the resin material that resin material is supplied with to described resin resettlement section, be provided with: the feed mechanism of the resin material that resin material is supplied with to described resin resettlement section; The metrological service of the resin material of the resin material that metering is supplied with to described resin resettlement section; And make to be supplied to the planarization mechanism of resin material of the resin material planarization of described resin resettlement section.
7. the compression molding die device of electronic unit as claimed in claim 6, is characterized in that,
Described planarization mechanism be described resin is accommodated with plate, along directions X or Y-direction, move move horizontally planarization mechanism.
8. the compression molding die device of electronic unit as claimed in claim 5, is characterized in that,
By being cut into Len req in advance, the somatotype film of strip prepares described somatotype film.
9. the compression molding die device of the electronic unit as described in any one in claim 5～8, is characterized in that,
Possesses the output mechanism with the Bas Discharged in die cavity by described compression molding.
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