JP2010036542A - Compression molding method for electronic component, and molding die device - Google Patents

Compression molding method for electronic component, and molding die device Download PDF

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Publication number
JP2010036542A
JP2010036542A JP2008205018A JP2008205018A JP2010036542A JP 2010036542 A JP2010036542 A JP 2010036542A JP 2008205018 A JP2008205018 A JP 2008205018A JP 2008205018 A JP2008205018 A JP 2008205018A JP 2010036542 A JP2010036542 A JP 2010036542A
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Prior art keywords
resin
plate
resin material
cavity
mold
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JP2008205018A
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JP5153509B2 (en
Inventor
Hiroshi Uragami
浩 浦上
Naoki Takada
直毅 高田
Osamu Otsuki
修 大槻
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Towa Corp
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Towa Corp
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Priority to JP2008205018A priority Critical patent/JP5153509B2/en
Application filed by Towa Corp filed Critical Towa Corp
Priority to KR1020137028418A priority patent/KR101523164B1/en
Priority to CN201410145446.3A priority patent/CN103921384B/en
Priority to CN200980128894.XA priority patent/CN102105282B/en
Priority to PCT/JP2009/003683 priority patent/WO2010016223A1/en
Priority to MYPI2011000513A priority patent/MY152441A/en
Priority to KR1020117005300A priority patent/KR101430797B1/en
Priority to KR1020137028417A priority patent/KR101523163B1/en
Priority to MYPI2014000688A priority patent/MY182931A/en
Priority to TW103119341A priority patent/TWI529822B/en
Priority to TW098126295A priority patent/TWI543275B/en
Priority to TW105101358A priority patent/TWI567837B/en
Publication of JP2010036542A publication Critical patent/JP2010036542A/en
Application granted granted Critical
Publication of JP5153509B2 publication Critical patent/JP5153509B2/en
Priority to PH12014500725A priority patent/PH12014500725A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently enhance the reliability of a resin amount supplied to a lower die cavity 5, when supplying a granular resin 6 into the lower die cavity 5. <P>SOLUTION: A mold release film 11 is coated at first on a lower face of a resin storing plate 21 provided with a through-hole 37 corresponding to the lower die cavity 5, the through-hole 37 is formed in a plate resin storage part 22, to constitute a plate 21a before filling the resin, and a resin distribution-finished plate 25 is formed by supplying the granular resin 6 of prescribed amount into the resin storage part 22, followed to be flattened (formed into a uniform thickness). Then, the flattened granular resin 6 of prescribed amount is dropped together with the mold release film 11, to be supplied into the lower die cavity 5 coated with the mold release film 11, by mounting the resin distribution-finished plate 25 in a position of the lower die cavity 5 and by drawing the mold release film 11 into the lower die cavity 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、ＩＣ（Integrated Circuit）等の電子部品を圧縮成形する方法及びそれに用いられる金型装置に関するものである。   The present invention relates to a method of compression-molding an electronic component such as an IC (Integrated Circuit) and a mold apparatus used therefor.

従来から、図６に示すように、電子部品の圧縮成形用金型装置に搭載した電子部品の圧縮成形用金型８１を用いて、基板８２に装着した所要数の電子部品８３を顆粒状の樹脂材料（顆粒樹脂）８４にて圧縮成形（樹脂封止成形）することが行われているが、次のようにして行われている。   Conventionally, as shown in FIG. 6, a required number of electronic components 83 mounted on a substrate 82 are granulated using a compression molding die 81 for electronic components mounted on an electronic component compression molding device. Compression molding (resin sealing molding) is performed with a resin material (granular resin) 84, and is performed as follows.

即ち、まず、電子部品の圧縮成形用金型８１（上型８５と下型８６）に設けた下型キャビティ８７内に離型フィルム８８を被覆すると共に、この離型フィルム８８を被覆した下型キャビティ８７内に顆粒樹脂８４を供給して加熱溶融化し、次に、前記した金型８１（８５・８６）を型締めして下型キャビティ８７内の溶融樹脂に基板８２に装着した所要数の電子部品８３を浸漬することにより、下型キャビティ８７の形状に対応した樹脂成形体内に所要数の電子部品８３を圧縮成形（一括片面モールド）している。
なお、このとき、下型キャビティ８７の樹脂を樹脂押圧用のキャビティ底面部材９３にて押圧することができる。 That is, first, a release film 88 is coated in a lower mold cavity 87 provided in a compression molding die 81 (upper mold 85 and lower mold 86) of an electronic component, and the lower mold is coated with this release film 88. The granule resin 84 is supplied into the cavity 87 and melted by heating. Next, the above-described mold 81 (85/86) is clamped, and the required number of the melt resin in the lower mold cavity 87 attached to the substrate 82 is obtained. By immersing the electronic components 83, the required number of electronic components 83 are compression-molded (collective single-sided molding) in a resin molded body corresponding to the shape of the lower mold cavity 87.
At this time, the resin of the lower mold cavity 87 can be pressed by the cavity bottom member 93 for resin pressing.

ところで、前記した下型キャビティ８７内に顆粒樹脂８４を供給するには樹脂材料供給機構８９（下部シャッタ９０と供給部９１）が用いられている。
即ち、前記した樹脂材料供給機構８９（供給部９１）に所要量の顆粒樹脂８４を投入してこの樹脂材料供給機構８９を前記した上下両型８５・８６間に進入させ、次に、樹脂材料供給機構８９の下部シャッタ９０を引いて開けることにより、供給部９１から下型キャビティ８７内に顆粒樹脂８４を落下させて供給している。 Incidentally, a resin material supply mechanism 89 (lower shutter 90 and supply unit 91) is used to supply the granular resin 84 into the lower mold cavity 87 described above.
That is, a predetermined amount of granular resin 84 is put into the above-described resin material supply mechanism 89 (supply unit 91), and this resin material supply mechanism 89 enters between the upper and lower molds 85 and 86, and then the resin material. By pulling and opening the lower shutter 90 of the supply mechanism 89, the granular resin 84 is dropped from the supply unit 91 into the lower mold cavity 87 and supplied.

特開２００４−２１６５５８号JP 2004-216558 A

しかしながら、金型キャビティ８７内への樹脂８４の供給時において、樹脂材料供給機構８９のシャッタ９０を開けて下型キャビティ８７内に顆粒樹脂８４を落下供給させた場合、樹脂の一部９２が樹脂材料供給機構８９（供給部９１）側に残存することがある。
従って、金型キャビティ８７内への樹脂８４の供給時において、金型キャビティ８７内に樹脂８４を効率良く供給することができないと云う弊害がある。
また、金型キャビティ８７内への樹脂８４の供給時に、樹脂の一部（残存する顆粒樹脂）９２が樹脂材料供給機構８９（供給部９１）側に残存するため、金型キャビティ８７内に供給される樹脂量に不足が発生し易い。
従って、金型キャビティ８７内への樹脂８４の供給時において、金型キャビティ８７内に供給される樹脂量の信頼性を効率良く向上させることができないと云う弊害がある。 However, when the resin 84 is supplied into the mold cavity 87, when the shutter 90 of the resin material supply mechanism 89 is opened and the granular resin 84 is dropped and supplied into the lower mold cavity 87, a part 92 of the resin is resin. It may remain on the material supply mechanism 89 (supply unit 91) side.
Therefore, when the resin 84 is supplied into the mold cavity 87, there is an adverse effect that the resin 84 cannot be efficiently supplied into the mold cavity 87.
Further, when the resin 84 is supplied into the mold cavity 87, a part of the resin (residual granular resin) 92 remains on the resin material supply mechanism 89 (supply unit 91) side, so that the resin 84 is supplied into the mold cavity 87. Insufficient amount of resin is likely to occur.
Therefore, when the resin 84 is supplied into the mold cavity 87, there is an adverse effect that the reliability of the amount of resin supplied into the mold cavity 87 cannot be improved efficiently.

即ち、本発明は、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することを目的とする。
また、本発明は、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることを目的とする。 That is, an object of the present invention is to efficiently supply the resin into the mold cavity when the resin is supplied into the mold cavity.
It is another object of the present invention to efficiently improve the reliability of the amount of resin supplied into the mold cavity when supplying the resin into the mold cavity.

前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、離型フィルムが被覆された金型キャビティ内に所要量の樹脂材料を供給すると共に、前記したキャビティ内の樹脂に電子部品を浸漬することにより、前記したキャビティ内で当該キャビティの形状に対応した樹脂成形体内に前記した電子部品を圧縮成形する電子部品の圧縮成形方法であって、前記した金型キャビティに対応した貫通孔を備えた樹脂収容用のプレートの下面に離型フィルムを被覆することにより、前記したプレート貫通孔をプレート樹脂収容部に形成する工程と、前記したプレート樹脂収容部に所要量の樹脂材料を供給する工程と、前記したプレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成する工程と、前記した樹脂配布済プレートを前記した金型キャビティの位置に載置することにより、前記した金型キャビティに前記した離型フィルムを介して前記した樹脂収容部を合致させる工程と、前記した離型フィルムを前記したキャビティ面に被覆する工程と、前記した離型フィルムを前記したキャビティ面に被覆する時に、前記した金型キャビティ内に前記した樹脂収容部内から樹脂材料を供給する工程とを含むことを特徴とする。   In order to solve the above-mentioned technical problem, a compression molding method of an electronic component according to the present invention supplies a required amount of a resin material into a mold cavity covered with a release film, and the resin in the cavity described above. An electronic component compression molding method in which the electronic component is compression molded in a resin molded body corresponding to the shape of the cavity in the cavity by immersing the electronic component in the cavity, and corresponds to the mold cavity described above A step of forming the plate through hole in the plate resin containing portion by covering the lower surface of the resin containing plate having the through hole with the release film, and a required amount of resin in the plate resin containing portion. A step of supplying a material, a step of forming a resin-distributed plate in which the thickness of the resin material in the plate resin container is made uniform and flattened, Placing the above-described resin distributed plate at the position of the above-described mold cavity, and aligning the above-described resin container with the above-described mold cavity via the above-described release film; and the above-described mold release A step of covering the cavity surface with the film, and a step of supplying a resin material from the resin housing portion into the mold cavity when the release film is coated on the cavity surface. It is characterized by.

また、前記した技術的課題を解決するための電子部品の圧縮成形方法は、前記したプレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成するときに、プレートをＸ方向に或いはＹ方向に移動させることにより、前記したプレート樹脂収容部内の樹脂材料を所要の均一な厚さに形成して平坦化する工程を含むことを特徴とする。   Further, the compression molding method of the electronic component for solving the technical problem described above is performed when the resin distributed plate is formed by flattening the thickness of the resin material in the plate resin accommodating portion. It is characterized in that it includes a step of flattening by forming the resin material in the plate resin accommodating portion to a required uniform thickness by moving in the X direction or the Y direction.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記したプレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成するときに、プレートを振動させることにより、前記したプレート樹脂収容部内の樹脂材料を所要の均一な厚さに形成して平坦化する工程を含むことを特徴とする。   The electronic component compression molding method according to the present invention for solving the technical problem described above forms a flattened resin-distributed plate by making the thickness of the resin material in the plate resin container uniform. In some cases, the method includes a step of flattening the resin material in the above-described plate resin housing portion to a required uniform thickness by vibrating the plate.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形方法は、前記した樹脂材料が、顆粒状の樹脂材料、或いは、粉末状の樹脂材料であることを特徴とする。   Further, in the compression molding method of an electronic component according to the present invention for solving the technical problem described above, the resin material is a granular resin material or a powder resin material. .

また、前記の技術的課題を解決するための本発明に係る電子部品の圧縮成形用金型装置は、上型及び前記した上型に対向配置した下型とから成る電子部品の圧縮成形用金型と、前記した下型に設けた圧縮成形用キャビティと、前記した上型に設けた基板セット部と、前記した下型キャビティ内を被覆する離型フィルムと、前記した下型キャビティ内の樹脂を押圧する樹脂押圧用のキャビティ底面部材と、前記した金型に樹脂材料と電子部品を装着した基板とを供給するインローダとを備えた電子部品の圧縮成形用金型装置であって、前記したインローダに装着され且つ貫通孔を有する樹脂収容用プレートと、前記した樹脂収容用プレートの下面側を被覆して前記したプレート貫通孔を樹脂収容部に形成する離型フィルムと、前記した樹脂収容部に樹脂材料を供給する樹脂材料の配布手段とを備えたことを特徴とする。   In addition, an electronic component compression molding die apparatus according to the present invention for solving the above technical problem is an electronic component compression molding die comprising an upper die and a lower die arranged opposite to the upper die. A mold, a cavity for compression molding provided in the lower mold, a substrate set part provided in the upper mold, a release film covering the inside of the lower mold cavity, and a resin in the lower mold cavity A mold apparatus for compression molding of an electronic component, comprising: a cavity bottom member for pressing a resin that presses and an inloader that supplies a substrate having a resin material and an electronic component mounted on the mold described above, A resin-accommodating plate attached to the inloader and having a through-hole, a release film for covering the lower surface side of the resin-accommodating plate and forming the plate-through hole in the resin-accommodating portion, and the resin-accommodating described Characterized in that a distribution unit of the resin material supplying resin material.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形用金型装置は、前記した樹脂収容部に樹脂材料を供給する樹脂材料の配布手段に、前記した樹脂収容部に樹脂材料を供給する樹脂材料の供給手段と、前記した樹脂収容部に供給された樹脂材料を計量する樹脂材料の計量手段と、前記した樹脂収容部に供給された樹脂材料を平坦化する樹脂材料の平坦化手段とを設けて構成したことを特徴とする。   Moreover, the mold apparatus for compression molding of the electronic component according to the present invention for solving the technical problem described above is provided with the above-described resin container in the resin material distribution means for supplying the resin material to the resin container. Resin material supplying means for supplying resin material to the resin, resin material measuring means for measuring the resin material supplied to the resin housing portion, and resin for flattening the resin material supplied to the resin housing portion A material flattening means is provided.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形用金型装置は、前記したプレートに形成された樹脂収容部内に供給される樹脂材料を平坦化する樹脂材料の平坦化手段として、前記したプレートをＸ方向に或いはＹ方向に移動させる水平移動平坦化機構を設けて構成したことを特徴とする。   In addition, a mold apparatus for compression molding of an electronic component according to the present invention for solving the technical problem described above is a resin material for flattening a resin material supplied into a resin container formed on the plate. As the flattening means, a horizontal movement flattening mechanism for moving the plate in the X direction or the Y direction is provided.

また、前記した技術的課題を解決するための本発明に係る電子部品の圧縮成形用金型装置は、前記した樹脂材料が、顆粒状の樹脂材料、或いは、粉末状の樹脂材料であることを特徴とする。   Further, in the mold device for compression molding of an electronic component according to the present invention for solving the above technical problem, the resin material described above is a granular resin material or a powder resin material. Features.

本発明によれば、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することができると云う優れた効果を奏する。
また、本発明によれば、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることができると云う優れた効果を奏する。 According to the present invention, there is an excellent effect that the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity.
Further, according to the present invention, there is an excellent effect that the reliability of the amount of resin supplied into the mold cavity can be improved efficiently when the resin is supplied into the mold cavity.

本発明によれば、まず、樹脂収容用プレートの下面に離型フィルムを吸着被覆してプレート貫通孔のプレート下方開口部を閉鎖することにより、樹脂収容用プレートにおける貫通孔を樹脂収容部（凹部）に形成して、樹脂収容部（凹部）を有する樹脂収容前プレートを得ることができる。
次に、樹脂材料の配布手段にて、樹脂供給前プレートの樹脂収容部にプレート上方開口部から所要量の顆粒状の樹脂材料（顆粒樹脂）を供給し、樹脂材料の平坦化手段にて、所要量の顆粒樹脂を均等な厚さに形成して平坦化することにより、所要量の平坦化した顆粒樹脂を樹脂収容部内に収容した樹脂配布済プレートを形成することができる。
次に、インローダの下部側に樹脂配布済プレートを係着し且つインローダの上部側に所要数の電子部品を装着した基板を、電子部品装着面を下方に向けた状態で載置する。
次に、インローダを電子部品の圧縮成形用金型における上下両型の間に進入させる。
このとき、上型の基板セット部に電子部品を装着した基板を、電子部品装着面を下方に向けた状態で供給セットすることになる。 According to the present invention, first, the release film is adsorbed and coated on the lower surface of the resin containing plate to close the plate lower opening of the plate through hole, so that the through hole in the resin containing plate is formed into the resin containing portion (recess ) To form a pre-resin-containing plate having a resin containing portion (concave portion).
Next, in the resin material distribution means, a required amount of granular resin material (granular resin) is supplied from the upper opening of the plate to the resin accommodating portion of the plate before resin supply, and the resin material flattening means By forming and flattening the required amount of granular resin to a uniform thickness, it is possible to form a resin distributed plate in which the required amount of flattened granular resin is stored in the resin storage portion.
Next, a substrate having a resin distributed plate attached to the lower side of the inloader and a required number of electronic components mounted on the upper side of the inloader is placed with the electronic component mounting surface facing downward.
Next, the inloader is inserted between the upper and lower molds in the compression molding mold for electronic parts.
At this time, the substrate on which the electronic component is mounted on the upper substrate setting portion is supplied and set with the electronic component mounting surface facing downward.

また、次に、インローダを下動することにより、樹脂配布済プレートを下型の型面に載置することができる。
このとき、樹脂配布済プレートのプレート下方開口部は、離型フィルムを介してキャビティの開口部の位置に合致することになる。
また、このとき、樹脂配布済プレートの樹脂収容部内において、所要量の顆粒樹脂は離型フィルム上に平坦化された状態で載置されている。
また、次に、樹脂配布済プレートによる離型フィルムの吸着を解除する。
また、更に、下型の型面とキャビティ内から空気を強制的に吸引排出することにより、離型フィルムを下型面に係止し、且つ、離型フィルムをキャビティ内に引き込んで離型フィルムをキャビティに被覆させることができる。
このとき、離型フィルムに所要量の平坦化した顆粒樹脂を載置した状態で、且つ、離型フィルムと所要量の平坦化した顆粒樹脂とを一緒にした状態で（一体にした状態で）、下型キャビティ内に所要量の平坦化した顆粒樹脂が引き込まれて落下することになる。
このため、離型フィルムを被覆した下型キャビティ内に所要量の顆粒樹脂を平坦化した状態で（均一な厚さの状態で）供給することができる。
即ち、所要量の平坦化した顆粒樹脂と離型フィルムと一緒にした状態で（一体にした状態で）、下型キャビティ内に所要量の平坦化した顆粒樹脂を引き込んで落下させることにより、離型フィルムを被覆したキャビティ内に所要量の顆粒樹脂を平坦化した状態で供給することができる。
従って、本発明によれば、金型キャビティ内への樹脂の供給時に、金型キャビティ内に樹脂を効率良く供給することができる。
また、離型フィルムを被覆した下型キャビティ内に所要量の顆粒樹脂を平坦化した状態で供給することができるので、金型キャビティ内への樹脂の供給時において、金型キャビティ内に供給される樹脂量の信頼性を効率良く向上させることができる。
なお、このため、離型フィルムを被覆したキャビティ内で平坦化した状態の（均等な厚さを有する）顆粒樹脂を均等に加熱して溶融化することができる。
従って、キャビティ内で樹脂の一部が硬化してママコが発生することを効率良く防止することができる。 Next, the resin-distributed plate can be placed on the lower mold surface by lowering the inloader.
At this time, the plate lower opening of the resin distributed plate coincides with the position of the opening of the cavity through the release film.
At this time, the required amount of granular resin is placed on the release film in a flattened state in the resin container of the resin-distributed plate.
Next, the adsorption of the release film by the resin distributed plate is released.
Further, the release film is locked to the lower mold surface by forcibly sucking and discharging air from the lower mold surface and the cavity, and the release film is drawn into the cavity to release the release film. Can be coated in the cavity.
At this time, in a state in which a required amount of the flattened granule resin is placed on the release film, and in a state where the release film and the required amount of the flattened granule resin are combined (in an integrated state) A required amount of the flattened granular resin is drawn into the lower mold cavity and falls.
Therefore, a required amount of granular resin can be supplied in a flattened state (with a uniform thickness) into the lower mold cavity covered with the release film.
That is, with the required amount of the flattened granular resin and the release film together (in an integrated state), the required amount of the flattened granular resin is drawn into the lower mold cavity and dropped, thereby releasing the mold. A required amount of granular resin can be supplied in a flattened state in a cavity coated with a mold film.
Therefore, according to the present invention, the resin can be efficiently supplied into the mold cavity when the resin is supplied into the mold cavity.
In addition, since a required amount of granular resin can be supplied in a flattened state in the lower mold cavity covered with the release film, it is supplied into the mold cavity when the resin is supplied into the mold cavity. The reliability of the amount of resin to be improved can be improved efficiently.
For this reason, the granular resin (having a uniform thickness) in a state of being flattened in the cavity covered with the release film can be uniformly heated and melted.
Therefore, it is possible to efficiently prevent a part of the resin from being hardened in the cavity and generating mamako.

まず、実施例１（本発明）を詳細に説明する。
図１は、実施例１に用いられる電子部品の圧縮成形用金型装置（電子部品の圧縮成形用金型）に設けられた樹脂材料の配布手段である。
図２（１）は樹脂材料の配布手段の要部である。
図２（２）は、樹脂材料配布済プレートである。
図３、図４、図５は、電子部品の圧縮成形用金型装置（電子部品の圧縮成形用金型）である。 First, Example 1 (the present invention) will be described in detail.
FIG. 1 shows a resin material distribution means provided in an electronic component compression molding die apparatus (electronic component compression molding die) used in the first embodiment.
FIG. 2 (1) shows the main part of the means for distributing the resin material.
FIG. 2 (2) shows a resin material distributed plate.
3, 4, and 5 show an electronic component compression molding die apparatus (electronic component compression molding die).

（電子部品の圧縮成形用金型を搭載した金型装置の構成について）
まず、実施例１に示す電子部品の圧縮成形方法に用いられる電子部品の圧縮成形用金型（型組品）１を搭載した電子部品の圧縮成形用金型装置を説明する。
即ち、図例に示すように、電子部品の圧縮成形用金型装置には、電子部品の圧縮成形用金型（型組品）１と、前記した金型１に所要量の顆粒状の樹脂材料（顆粒樹脂）６と所要数の電子部品７を装着した基板８（成形前基板）とを各別に或いは同時に供給するインローダ９と、前記した金型１で圧縮成形（樹脂封止成形）された成形済基板（後述する樹脂成形体１２）を取り出すアンローダ（図示なし）と、金型１を型締めする型締機構（図示なし）とが設けられて構成されている。
従って、インローダ９にて金型１に所要量の顆粒樹脂６と基板８とを供給して圧縮成形することにより、金型１で成形済基板（樹脂成形体１２）を得ることができると共に、アンローダにて金型１から成形済基板を取り出すことができるように構成されている。 (Regarding the configuration of a mold apparatus equipped with a mold for compression molding of electronic parts)
First, an electronic component compression molding die apparatus equipped with an electronic component compression molding die (die assembly) 1 used in the electronic component compression molding method shown in the first embodiment will be described.
That is, as shown in the figure, an electronic component compression molding die apparatus includes an electronic component compression molding die (mold assembly) 1 and a predetermined amount of granular resin in the mold 1 described above. The material (granular resin) 6 and a substrate 8 (substrate before molding) on which a required number of electronic components 7 are mounted are separately or simultaneously supplied with the inloader 9 and the above-mentioned mold 1 is compression-molded (resin-sealed molding). An unloader (not shown) for taking out the molded substrate (resin molded body 12 to be described later) and a mold clamping mechanism (not shown) for clamping the mold 1 are provided.
Accordingly, by supplying the required amount of the granular resin 6 and the substrate 8 to the mold 1 with the inloader 9 and compression molding, a molded substrate (resin molded body 12) can be obtained with the mold 1. The molded substrate can be taken out from the mold 1 by the unloader.

また、後述するように、実施例１に示す金型装置には、インローダ９で係着される樹脂収容用プレート（２１）に所要量の顆粒樹脂６を供給して配布する樹脂材料の配布手段３１が設けられて構成されている。
従って、樹脂材料の配布手段３１にて、所要量の顆粒樹脂６を樹脂収容用プレート（２１、２１ａ）に供給・配布して後述する樹脂配布済プレート２５（所要量の平坦化した顆粒樹脂６）を形成することができるように構成されている。 Further, as will be described later, in the mold apparatus shown in the first embodiment, a resin material distribution means for supplying and distributing a required amount of the granular resin 6 to the resin accommodating plate (21) engaged with the inloader 9 is provided. 31 is provided.
Therefore, the resin material distribution means 31 supplies and distributes a required amount of the granule resin 6 to the resin containing plates (21, 21a), and the resin distributed plate 25 described later (the required amount of the flattened granule resin 6). ) Can be formed.

（電子部品の圧縮成形用金型の構成について）
即ち、図例に示すように、電子部品の圧縮成形用金型（型組品）１には、固定上型２と、上型２に対向配置した可動下型３とが備えられている。
また、上型２の型面には、所要数の電子部品７を装着した基板８を、電子部品装着面側を下方に向けた状態で供給セットする基板セット部４が設けられている。
また、下型３の型面には、圧縮成形用のキャビティ５が上方に（上型２方向に）キャビティ開口部１０を開口した状態で設けられて構成されている。
従って、上下両型１（２・３）を型締めすることにより、下型キャビティ５内に上型基板セット部４に供給セットした基板８に装着した電子部品７を嵌装セットすることができるように構成されている。 (About the structure of electronic parts compression molding mold)
That is, as shown in the figure, a compression molding die (die assembly) 1 for electronic parts is provided with a fixed upper die 2 and a movable lower die 3 disposed opposite to the upper die 2.
The mold surface of the upper mold 2 is provided with a substrate setting section 4 for supplying and setting a substrate 8 on which a required number of electronic components 7 are mounted with the electronic component mounting surface side facing downward.
Further, the mold surface of the lower mold 3 is configured such that a cavity 5 for compression molding is provided upward (in the direction of the upper mold 2) with a cavity opening 10 opened.
Accordingly, by clamping the upper and lower molds 1 (2 3), the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold substrate setting section 4 can be fitted and set in the lower mold cavity 5. It is configured as follows.

また、上下両型１（２・３）には、上下両型１（２・３）を所要の温度にまで加熱する加熱手段（図示なし）が設けられて構成されている。
従って、インローダ９（後述する樹脂配布済プレート２５）にて下型キャビティ５内に供給された所要量の顆粒樹脂６を、金型１の加熱手段にて加熱溶融化することができるように構成されている。
また、キャビティ５の底面にはキャビティ５内の樹脂（６）を所要の押圧力で押圧する樹脂押圧用のキャビティ底面部材３８が設けられて構成されている。
従って、下型キャビティ５内の樹脂（６）をキャビティ底面部材３８で押圧することにより、下型キャビティ５内で基板８に装着した電子部品７を圧縮成形する（樹脂封止成形する）ことができるように構成されている。 The upper and lower molds 1 (2, 3) are provided with heating means (not shown) for heating the upper and lower molds 1 (2, 3) to a required temperature.
Therefore, the required amount of granular resin 6 supplied into the lower mold cavity 5 by the inloader 9 (resin distributed plate 25 described later) can be heated and melted by the heating means of the mold 1. Has been.
Further, the bottom surface of the cavity 5 is provided with a cavity bottom member 38 for pressing the resin (6) in the cavity 5 with a required pressing force.
Therefore, by pressing the resin (6) in the lower mold cavity 5 with the cavity bottom member 38, the electronic component 7 mounted on the substrate 8 in the lower mold cavity 5 can be compression molded (resin sealing molding). It is configured to be able to.

（下型における離型フィルムの吸着機構について）
また、図示はしていないが、下型３において、下型面とキャビティ５の面とには、離型フィルム１１を吸着する離型フィルムの吸引機構が設けられて構成されている。
なお、吸引機構は、例えば、吸引孔、真空経路、及び真空引き機構（真空ポンプ）を備え、吸引孔は、下型３の型面およびキャビティ５の表面まで至るように下型３の内部に設けられて構成されている。
従って、吸引機構を作動させて、空気を強制的に吸引排出することにより、離型フィルム１１を下型３の型面及びキャビティ５の面の形状に沿って被覆固定することができるように構成されている。
例えば、下型３の型面に（平面形状の）離型フィルム１１を載置して吸引機構を作動させた場合、まず、下型３の型面に離型フィルム１１を係止し、次に、下型キャビティ５内に離型フィルム１１を吸引して引き込むことにより、下型キャビティ５の形状に沿って離型フィルム１１を被覆固定することができるように構成されている。 (Adsorption mechanism of release film in lower mold)
Although not shown, the lower mold 3 is configured such that the lower mold surface and the surface of the cavity 5 are provided with a release film suction mechanism for adsorbing the release film 11.
The suction mechanism includes, for example, a suction hole, a vacuum path, and a vacuuming mechanism (vacuum pump). The suction hole is provided inside the lower mold 3 so as to reach the mold surface of the lower mold 3 and the surface of the cavity 5. It is provided and configured.
Accordingly, the release film 11 can be covered and fixed along the shape of the mold surface of the lower mold 3 and the surface of the cavity 5 by operating the suction mechanism and forcibly sucking and discharging air. Has been.
For example, when the (planar shape) release film 11 is placed on the mold surface of the lower mold 3 and the suction mechanism is operated, the mold release film 11 is first locked on the mold surface of the lower mold 3, and then In addition, the release film 11 can be covered and fixed along the shape of the lower mold cavity 5 by sucking and drawing the release film 11 into the lower mold cavity 5.

なお、本発明によれば、後述するように、離型フィルム１１を下型キャビティ５内に引き込んで被覆するとき、同時に、後述する樹脂配布済プレート２５（後述する樹脂収容用プレート２１、２１ａ）における離型フィルム１１に載置した所要量の（後述するように、平坦化した）顆粒樹脂６を、下型キャビティ５内に引き込まれる離型フィルム１１と一緒に引き込んで落下させることにより、離型フィルム１１を被覆したキャビティ５内に所要量の顆粒樹脂６を（後述するように、平坦化した状態で）供給することができるように構成されている。
従って、離型フィルム１１を被覆したキャビティ５内に所要量の顆粒樹脂６を供給した後、まず、上下両型１（２・３）を型締めすることにより、離型フィルム１１を被覆したキャビティ５内で加熱溶融化した樹脂（６）中に上型基版セット部４に供給セットした基板８に装着した電子部品７を浸漬し、次に、キャビティ底面部材３８にて離型フィルム１１を介してキャビティ５内の樹脂（６）を押圧することにより、下型キャビティ５内で下型キャビティ５の形状に対応した樹脂成形体１２内に基板８に装着した電子部品７を圧縮成形する（樹脂封止成形する）ことができるように構成されている。 According to the present invention, as will be described later, when the release film 11 is drawn into the lower mold cavity 5 to be coated, resin distributed plates 25 (resin housing plates 21 and 21a described later) described later are simultaneously used. The required amount of granulated resin 6 (flattened as will be described later) placed on the release film 11 is pulled together with the release film 11 drawn into the lower mold cavity 5 and dropped, thereby releasing the release resin. A required amount of granular resin 6 can be supplied into the cavity 5 covered with the mold film 11 (in a flattened state as will be described later).
Therefore, after supplying a required amount of the granule resin 6 into the cavity 5 coated with the release film 11, first, the upper and lower molds 1 (2 and 3) are clamped to form the cavity coated with the release film 11. 5, the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold base plate setting unit 4 is immersed in the resin (6) heated and melted in the mold 5, and then the release film 11 is attached to the cavity bottom member 38. By pressing the resin (6) in the cavity 5, the electronic component 7 mounted on the substrate 8 is compression molded in the resin molded body 12 corresponding to the shape of the lower mold cavity 5 in the lower mold cavity 5 ( It is configured so that it can be molded with resin.

（樹脂収容用プレートの構成について）
次に、本発明に係る下型キャビティ５内に所要量の顆粒樹脂６を供給する樹脂収容用プレート２１（樹脂供給前プレート２１ａ）の構成について説明する。
即ち、樹脂収容用プレート２１には、上下方向に貫通した貫通孔３７と、貫通孔３７の周囲に形成されたプレート周縁部２４（外枠部）とが設けられて構成されている。
また、プレート貫通孔３７においては、プレート上方側に設けられたプレート上方開口部３９と、プレート下方側に設けられたプレート下方開口部２３とが設けられて構成されている。
また、図示はしていないが、プレート周縁部２４の下面には離型フィルム１１を吸着固定する離型フィルム吸着固定機構が設けられて構成されている。
即ち、離型フィルム吸着固定機構にて、プレート周縁部２４の下面に離型フィルム１１を吸着固定することにより、離型フィルム１１でプレート下方開口部２３（プレート貫通孔３７）を閉鎖することができるように構成されている。
即ち、離型フィルム１１にてプレート貫通孔３７のプレート下方開口部２３を閉鎖することにより、プレート貫通孔３７を所要量の顆粒樹脂６を供給する樹脂収容部（凹部）２２に形成することができる。
また、閉鎖離型フィルム１１にて樹脂収容部（凹部）２２を形成することにより、樹脂収容部（凹部）２２を有する樹脂収容用プレート２１（樹脂供給前プレート２１ａ）を得ることができる。
従って、後述するように、樹脂材料の配布手段３１にて、プレート２１の樹脂収容部（凹部）２２に所要量の顆粒樹脂６をプレート上方開口部３９から供給することができるように構成されている。
また、貫通孔開口部２４、３９の（平面上の）形状はキャビティ開口部１０の（平面上の）形状に対応して形成されるものである。
例えば、キャビティ開口部１０の形状を矩形状にて形成すると共に、貫通孔３７の開口部２４、３９の形状を矩形状のキャビティ開口部１０の形状に対応して形成することができる。
なお、厳密に言えば、樹脂収容部（凹部）２２を有する樹脂供給前プレート２１ａは、樹脂収容用プレート２１と離型フィルム１１とから構成されている。 (Regarding the structure of the resin housing plate)
Next, the structure of the resin containing plate 21 (pre-resin supply plate 21a) for supplying the required amount of granular resin 6 into the lower mold cavity 5 according to the present invention will be described.
In other words, the resin containing plate 21 is provided with a through hole 37 penetrating in the vertical direction and a plate peripheral portion 24 (outer frame portion) formed around the through hole 37.
Further, the plate through-hole 37 includes a plate upper opening 39 provided on the upper side of the plate and a plate lower opening 23 provided on the lower side of the plate.
Although not shown, the lower surface of the peripheral edge 24 of the plate is provided with a release film suction fixing mechanism for sucking and fixing the release film 11.
In other words, the release film 11 is fixed to the lower surface of the plate peripheral edge 24 by the release film suction fixing mechanism, whereby the plate lower opening 23 (plate through hole 37) can be closed by the release film 11. It is configured to be able to.
That is, by closing the plate lower opening 23 of the plate through-hole 37 with the release film 11, the plate through-hole 37 can be formed in the resin containing portion (recessed portion) 22 for supplying a required amount of the granular resin 6. it can.
Moreover, by forming the resin accommodating part (recessed part) 22 with the closed release film 11, the resin accommodating plate 21 (resin pre-supply plate 21 a) having the resin accommodating part (recessed part) 22 can be obtained.
Therefore, as will be described later, the resin material distribution means 31 can supply the required amount of granular resin 6 from the plate upper opening 39 to the resin accommodating portion (recessed portion) 22 of the plate 21. Yes.
Further, the shape (on the plane) of the through-hole openings 24 and 39 is formed corresponding to the shape (on the plane) of the cavity opening 10.
For example, the shape of the cavity opening 10 can be formed in a rectangular shape, and the shapes of the openings 24 and 39 of the through hole 37 can be formed corresponding to the shape of the rectangular cavity opening 10.
Strictly speaking, the pre-resin supply plate 21 a having the resin storage portion (concave portion) 22 is composed of the resin storage plate 21 and the release film 11.

（樹脂材料の配布手段の構成について）
即ち、実施例１において、図１に示す樹脂材料の配布手段（樹脂材料の計量供給平坦化手段）３１にて、樹脂収容用のプレート２１における貫通孔３７の下方開口部２３を離型フィルム１１にて閉鎖して形成した樹脂収容部２２内に、所要量の顆粒樹脂６を計量して供給投入し、且つ、樹脂収容用のプレート２１、２１ａの樹脂収容部２２において、顆粒樹脂６を均一な厚さ（単位面積当たり一定量の樹脂量）で平坦化することにより、樹脂収容用のプレート２１、２１ａ（樹脂収容部２２）に所要量の平坦化した顆粒樹脂６を配布することができるように構成されている。
なお、樹脂材料の配布手段３１には、樹脂材料の投入側配布手段３１ａと、樹脂材料の受給側配布手段３１ｂとが設けられて構成されている。 (Configuration of resin material distribution means)
That is, in Embodiment 1, the resin film distribution means (resin material metering and flattening means) 31 shown in FIG. A required amount of the granular resin 6 is weighed and supplied into the resin accommodating portion 22 formed by being closed at the same time, and the granular resin 6 is uniformly distributed in the resin accommodating portions 22 of the resin accommodating plates 21 and 21a. By flattening with a certain thickness (a constant amount of resin per unit area), a required amount of the flattened granular resin 6 can be distributed to the resin containing plates 21 and 21a (resin containing portion 22). It is configured as follows.
The resin material distribution means 31 includes a resin material input side distribution means 31a and a resin material receiving side distribution means 31b.

（樹脂材料の投入側配布手段について）
また、図１に示すように、樹脂材料の投入側配布手段３１ａには、プレート２１、２１ａ（樹脂収容部２２）に所要量の顆粒樹脂６を供給投入する樹脂材料の投入手段（樹脂材料の供給手段）３２と、プレート２１、２１ａ、２２に投入される所要量の顆粒樹脂６を計量する樹脂材料のフィーダ側計量手段（ロードセル）３３とから構成されている。
また、図１に示すように、樹脂材料の投入手段３２には、顆粒樹脂のホッパ３４と、プレート２１、２１ａ（樹脂収容部２２）に顆粒樹脂６を適宜な振動手段（図示なし）にて振動させながら移動させて投入するリニア振動フィーダ３５とが設けられて構成されている。
また、顆粒樹脂６の供給投入時に、プレート２１、２１ａ（樹脂収容部２２）に供給投入される顆粒樹脂６を、フィーダ側計量手段（ロードセル）３３にて計量することができるように構成されている。
従って、樹脂材料の投入側配布手段３１ａにおいて、ホッパ３４からの顆粒樹脂６をリニア振動フィーダ３５にて振動させながら移動させることにより、プレート２１、２１ａ（樹脂収容部２２）に、所要量の顆粒樹脂６を（例えば、少量ずつ）供給投入することができるように構成されている。
なお、例えば、リニア振動フィーダ３５においては、顆粒樹脂６を振動させることにより、単位時間当たり一定量の樹脂量にてプレート２１、２１ａ（樹脂収容部２２）に供給投入するように構成しても良い。 (About the resin material input side distribution means)
Further, as shown in FIG. 1, the resin material input side distribution means 31a is supplied with resin material supply means (resin material material) for supplying and supplying a required amount of granular resin 6 to the plates 21 and 21a (resin accommodating portion 22). Supply means) 32 and a feeder-side weighing means (load cell) 33 of a resin material for weighing a required amount of the granular resin 6 put into the plates 21, 21 a, 22.
Further, as shown in FIG. 1, the resin material feeding means 32 includes a granular resin hopper 34 and granular resin 6 in the plates 21 and 21a (resin housing portion 22) by appropriate vibration means (not shown). A linear vibration feeder 35 that moves and inputs while vibrating is provided.
In addition, the granular resin 6 supplied and supplied to the plates 21 and 21a (resin accommodating portion 22) can be measured by the feeder-side measuring means (load cell) 33 when the granular resin 6 is supplied and supplied. Yes.
Therefore, in the resin material input side distribution means 31a, the granular resin 6 from the hopper 34 is moved while being vibrated by the linear vibration feeder 35, so that a required amount of granules are transferred to the plates 21 and 21a (resin accommodating portion 22). The resin 6 can be supplied and charged (for example, in small amounts).
Note that, for example, the linear vibration feeder 35 may be configured to supply and feed the plates 21 and 21a (resin housing portion 22) at a constant amount of resin per unit time by vibrating the granular resin 6. good.

（樹脂材料の受給側配布手段について）
また、図１に示すように、樹脂材料の受給側配布手段３１ｂには、プレート２１の下面側に離型フィルム１１をプレートの離型フィルム吸着固定機構で吸着固定して樹脂収容部２２を有するプレート２１（樹脂供給前プレート２１ａ）を形成する樹脂供給前プレート形成手段（図示なし）と、樹脂収容部２２を有するプレート２１（樹脂供給前プレート２１ａ）を載置するプレート載置台４０と、樹脂供給前プレート２１、２１ａを樹脂供給前プレート形成手段からプレート載置台４０に載置するプレート移動載置手段（図示なし）と、樹脂材料の投入側配布手段３１ａにおけるリニア振動フィーダ３５からプレート載置台４０に載置された樹脂供給前プレート２１、２１ａの樹脂収容部２２に供給された所要量の顆粒樹脂６を所要の厚さで平坦化する樹脂材料の平坦化手段（例えば、後述する樹脂材料の水平移動平坦化機構４２）が設けられて構成されている。
従って、樹脂材料の受給側配布手段３１ｂにおいて、まず、樹脂供給前プレート形成手段にて樹脂収容部２２を有するプレート２１（樹脂供給前プレート２１ａ）を形成すると共に、プレート２１（樹脂供給前プレート２１ａ）をプレート移動載置手段にてプレート載置台４０に載置し、次に、リニア振動フィーダ３５からプレート２１、２１ａの樹脂収容部２２に所要量の顆粒樹脂６を振動させながら移動させて供給することができるように構成されている。
このとき、樹脂材料の平坦化手段（水平移動平坦化機構４２）とリニア振動フィーダ３５との協働作業によって、プレート樹脂収容部２２に供給された所要量の顆粒樹脂６を所要の均一な厚さ（４１）で平坦化することができるように構成されている。 (Receiver distribution means for resin materials)
Further, as shown in FIG. 1, the resin material receiving side distribution means 31b has a resin accommodating portion 22 by adsorbing and fixing the release film 11 to the lower surface side of the plate 21 by the release film adsorption fixing mechanism of the plate. Plate forming means (not shown) for forming a plate 21 (pre-resin supply plate 21a), a plate mounting table 40 for mounting a plate 21 (pre-resin supply plate 21a) having a resin accommodating portion 22, and a resin Plate moving placement means (not shown) for placing the pre-supply plates 21 and 21a on the plate placement table 40 from the plate formation means before resin supply, and the plate placement table from the linear vibration feeder 35 in the resin material input side distribution means 31a. A predetermined amount of the granular resin 6 supplied to the resin container 22 of the pre-resin supply plates 21 and 21a placed on 40 is provided with a required thickness. Tanka flattening means of the resin material (e.g., horizontal movement flattening mechanism 42 to be described later resin material) is configured provided.
Accordingly, in the resin material receiving side distribution means 31b, first, the plate 21 (pre-resin supply plate 21a) having the resin accommodating portion 22 is formed by the pre-resin supply plate forming means and the plate 21 (pre-resin supply plate 21a). ) Is mounted on the plate mounting table 40 by the plate moving mounting means, and then the required amount of the granular resin 6 is moved from the linear vibration feeder 35 to the resin accommodating portion 22 of the plates 21 and 21a while being vibrated and supplied. It is configured to be able to.
At this time, the required amount of the granular resin 6 supplied to the plate resin accommodating portion 22 is made to have the required uniform thickness by the cooperative operation of the flattening means (horizontal movement flattening mechanism 42) of the resin material and the linear vibration feeder 35. It is comprised so that it can planarize with (41).

（樹脂材料の平坦化手段について）
樹脂材料の受給側配布手段３１ｂには、樹脂材料の平坦化手段として、例えば、水平移動平坦化機構４２が設けられて構成されている。
即ち、水平移動平坦化機構４２にて、プレート載置台４０に載置されたプレート２１、２１ａを、水平方向に、即ち、図１に示すＸ方向或いはＹ方向に、各別に或いは同時に移動させることができるように構成されている。
従って、リニア振動フィーダ３５からプレート載置台４０に載置されたプレート２１、２１ａの樹脂収容部２２に所要量の顆粒樹脂６を振動させながら移動させて供給することができるように構成されている。
また、このとき、水平移動平坦化機構４２にて、プレート２１、２１ａ（樹脂収容部２２）をＸ方向或いはＹ方向に移動させることにより、プレート樹脂収容部２２内で所要量の顆粒樹脂６を所要の均一な厚さ４１（図３を参照）にて平坦化する（単位面積当たり一定量の樹脂量に形成する）ことができるように構成され、樹脂配布済プレート２５を形成することができるように構成されている。 (About flattening means of resin material)
The resin material receiving side distribution means 31b is configured with, for example, a horizontal movement flattening mechanism 42 as a resin material flattening means.
That is, the plates 21 and 21a mounted on the plate mounting table 40 are moved separately or simultaneously in the horizontal direction, that is, in the X direction or the Y direction shown in FIG. It is configured to be able to.
Therefore, it is configured such that a required amount of the granular resin 6 can be moved and supplied from the linear vibration feeder 35 to the resin accommodating portions 22 of the plates 21 and 21a mounted on the plate mounting table 40 while being vibrated. .
At this time, the horizontal movement flattening mechanism 42 moves the plates 21, 21 a (resin housing portion 22) in the X direction or the Y direction, so that a required amount of the granular resin 6 is placed in the plate resin housing portion 22. It can be flattened with a required uniform thickness 41 (see FIG. 3) (form a certain amount of resin per unit area), and the resin distributed plate 25 can be formed. It is configured as follows.

（インローダの構成について）
即ち、インローダ９において、樹脂配布済プレート２５（即ち、離型フィルム１１で形成した樹脂収容部２２に所要量の平坦化した顆粒樹脂６を供給した樹脂収容用プレート２１）を係着するプレート係着部９ａがインローダ下部側に設けられて構成されている。
また、インローダ９において、電子部品７が下方向を向いた状態で基板８が載置される基板載置部９ｂがインローダ上部側に設けられて構成されている。
従って、インローダ９を上下両型１（２、３）間に進入させて、基板８を上動させることにより、上型２の基板セット部４に、電子部品７を装着した基板８を、電子部品装着面側を下方に向けた状態で供給セットすることができるように構成されている。
また、インローダ９を上下両型１（２、３）間に進入させてインローダ９を下動させることにより、離型フィルム１１を介して、樹脂収容用プレート２１のプレート下方開口部２３の位置を下型３のキャビティ開口部１０の位置に合致させることができるように構成されている。
このとき、下型３の型面と樹脂収容用プレート２１の下面との間に離型フィルム１１が挟持されることになる。
また、このとき、樹脂収容用プレート２１の下面に設けた離型フィルム吸着固定機構による離型フィルムの吸着を解除することができる。
また、更に、下型３の型面とキャビティ５の面とに設けた吸引機構にて吸引することにより、下型３の型面で離型フィルム１１を係止し、且つ、離型フィルム１１を下型キャビティ５内に引き込んでキャビティ５の面に離型フィルム１１を被覆させることができる。
このとき、樹脂収容用プレート２１の樹脂収容部２２（貫通孔３７）内で離型フィルム１１に載置された所要量の平坦化した顆粒樹脂６は、キャビティ５内に引き込まれる離型フィルム１１と一緒にキャビティ５内に落下することになる。
即ち、所要量の平坦化した顆粒樹脂６を、離型フィルム１１を被覆したキャビティ５内に（一括して）供給することができるように構成されている。
従って、離型フィルム１１を被覆したキャビティ５内において、所要量の顆粒樹脂６の厚さを均一に形成することができる。 (About inloader configuration)
That is, in the inloader 9, a plate member for engaging the resin distributed plate 25 (that is, the resin containing plate 21 that supplies the required amount of the flattened granular resin 6 to the resin containing portion 22 formed of the release film 11). A landing portion 9a is provided on the lower side of the inloader.
In addition, the inloader 9 is configured such that a substrate placement portion 9b on which the substrate 8 is placed with the electronic component 7 facing downward is provided on the upper side of the inloader.
Therefore, by moving the inloader 9 between the upper and lower molds 1 (2, 3) and moving the board 8 upward, the board 8 having the electronic component 7 mounted on the board set part 4 of the upper mold 2 is changed to electronic. It is configured so that the supply can be set with the component mounting surface side facing downward.
Further, the inloader 9 is moved between the upper and lower molds 1 (2, 3) to move the inloader 9 downward, so that the position of the plate lower opening 23 of the resin containing plate 21 is located via the release film 11. It is configured to be able to match the position of the cavity opening 10 of the lower mold 3.
At this time, the release film 11 is sandwiched between the mold surface of the lower mold 3 and the lower surface of the resin accommodating plate 21.
At this time, the release film suction by the release film suction fixing mechanism provided on the lower surface of the resin accommodating plate 21 can be released.
Further, the release film 11 is locked by the mold surface of the lower mold 3 by sucking with a suction mechanism provided on the mold surface of the lower mold 3 and the surface of the cavity 5, and the release film 11. Can be drawn into the lower mold cavity 5 to cover the surface of the cavity 5 with the release film 11.
At this time, the required amount of the flattened granular resin 6 placed on the release film 11 in the resin accommodation portion 22 (through hole 37) of the resin accommodation plate 21 is drawn into the cavity 5. And fall into the cavity 5 together.
In other words, a required amount of the flattened granular resin 6 can be supplied (collectively) into the cavity 5 covered with the release film 11.
Therefore, the required amount of granular resin 6 can be uniformly formed in the cavity 5 covered with the release film 11.

（電子部品の圧縮成形方法について）
即ち、まず、樹脂収容用プレート２１の下面側に離型フィルム１１を吸着被覆させて、プレート貫通孔３７のプレート下方開口部２３を閉鎖して樹脂収容部（凹部）２２を形成することにより、樹脂収容部（凹部）２２を有する樹脂供給前プレート２１、２１ａを形成する〔図２（１）〜（２）、図３を参照〕。
次に、図１に示すように、樹脂材料の配布手段３１において、プレート台４０上に樹脂供給前プレート２１、２１ａを載置させる。
このとき、プレート２１、２１ａ（プレート周縁部２４）とプレート台４０との間に離型フィルム１１が挟持されることになる。 (About compression molding method of electronic parts)
That is, first, the release film 11 is adsorbed and coated on the lower surface side of the resin accommodating plate 21, and the plate lower opening 23 of the plate through hole 37 is closed to form the resin accommodating portion (concave portion) 22. The pre-resin supply plates 21 and 21a having the resin accommodating portion (concave portion) 22 are formed [see FIGS. 2 (1) to (2) and FIG.
Next, as shown in FIG. 1, the resin pre-supply plates 21 and 21 a are placed on the plate base 40 in the resin material distribution means 31.
At this time, the release film 11 is sandwiched between the plates 21 and 21a (plate peripheral portion 24) and the plate base 40.

次に、樹脂材料の配布手段３１において、樹脂材料の投入側配布手段３１ａ側におけるフィーダ側計量手段（ロードセル）３３にて所要量の顆粒樹脂６を計量し，且つ、ホッパ３４からリニア振動フィーダ３５を通して樹脂供給前プレート２１ａ（２１）の樹脂収容部２２にそのプレート上方開口部３９から所要量の顆粒樹脂６を振動させなから移動させて供給することができる。
このとき、樹脂材料の受給側配布手段３１ｂ側において、プレート載置台４０に載置した樹脂供給前プレート２１、２１ａ（樹脂収容部２２）を、水平移動平坦化機構４２（樹脂材料の平坦化手段）にて、Ｘ方向或いはＹ方向に、各別に或いは同時に移動させることにより、樹脂収容部２２内に振動しながら供給される所要量の顆粒樹脂６を、樹脂収容部２２内で平坦化し得て、顆粒樹脂６の厚さを均一に形成することができる〔図２（１）〜（２）、図３を参照）。
従って、樹脂材料の配布手段３１において、プレート台４０上に載置された樹脂供給前プレート２１、２１ａ（樹脂収容部２２）内に所要量の顆粒樹脂６を振動させなから供給して平坦化することにより、プレート２１、２１ａ（樹脂収容部２２）と所要量の平坦化した顆粒樹脂６とを備えた樹脂配布済プレート２５に形成することができる。
なお、この樹脂配布済プレート２５においては、貫通孔３７におけるプレート下方開口部２３側の離型フィルム１１上に（樹脂収容部２２内で離型フィルム１１上に）、所要量の平坦化した顆粒樹脂６を載置した状態で（所要量の均一な厚さを有する顆粒樹脂６を載置した状態で）形成することができる。 Next, in the resin material distribution means 31, a required amount of the granular resin 6 is measured by the feeder side weighing means (load cell) 33 on the resin material input side distribution means 31 a side, and the linear vibration feeder 35 is fed from the hopper 34. Through the plate upper opening 39, a required amount of the granular resin 6 can be moved without being vibrated and supplied to the resin accommodating portion 22 of the pre-resin supply plate 21a (21).
At this time, on the receiving side distribution means 31b side of the resin material, the pre-resin supply plates 21 and 21a (resin housing part 22) placed on the plate placing table 40 are moved to the horizontal movement flattening mechanism 42 (resin material flattening means. ), The required amount of granular resin 6 supplied while vibrating in the resin container 22 can be flattened in the resin container 22 by moving separately or simultaneously in the X direction or the Y direction. The thickness of the granular resin 6 can be formed uniformly (see FIGS. 2 (1) to (2) and FIG. 3).
Therefore, in the resin material distribution means 31, a predetermined amount of the granular resin 6 is supplied to the pre-resin supply plates 21 and 21a (resin accommodating portion 22) placed on the plate base 40 without being vibrated and is flattened. By doing so, it can be formed in the resin distributed plate 25 including the plates 21 and 21a (resin housing portion 22) and the required amount of the flattened granular resin 6.
In the resin-distributed plate 25, a required amount of flattened granules is formed on the release film 11 on the side of the plate lower opening 23 in the through-hole 37 (on the release film 11 in the resin container 22). It can be formed in a state where the resin 6 is placed (in a state where the granule resin 6 having a uniform thickness of a required amount is placed).

次に、図３に示すように、樹脂配布済プレート２５をインローダ９のプレート係着部９ａに係着すると共に、インローダ９の基板載置部９ｂに電子部品７を装着した基板８を載置する。
次に、インローダ９を上下両型１（２、３）の間に進入させると共に、基板８を上動させることにより、上型２の基板セット部４に、電子部品７を装着した基板８を、電子部品装着面を下方に向けた状態で供給セットする。
また、次に、インローダ９を下動することにより、樹脂配布済プレート２５を下型３の型面に載置する。
このとき、樹脂配布済プレート２５（２１）のプレート下方開口部２３を、離型フィルム１１を介してキャビティ５の開口部１０に合致させることができる。
また、このとき、樹脂配布済プレート２５の樹脂収容部２２内において、所要量の顆粒樹脂６は離型フィルム１１上に平坦化された状態で載置されている。 Next, as shown in FIG. 3, the resin-distributed plate 25 is engaged with the plate engaging portion 9 a of the inloader 9, and the substrate 8 having the electronic component 7 mounted thereon is placed on the substrate placing portion 9 b of the inloader 9. To do.
Next, the inloader 9 is inserted between the upper and lower molds 1 (2, 3), and the substrate 8 is moved upward so that the substrate 8 having the electronic component 7 mounted thereon is mounted on the substrate set portion 4 of the upper mold 2. Then, supply and setting is performed with the electronic component mounting surface facing downward.
Next, the in-loader 9 is moved down to place the resin distributed plate 25 on the mold surface of the lower mold 3.
At this time, the plate lower opening 23 of the resin distributed plate 25 (21) can be matched with the opening 10 of the cavity 5 through the release film 11.
At this time, a required amount of the granular resin 6 is placed on the release film 11 in a flattened state in the resin accommodating portion 22 of the resin distributed plate 25.

次に、プレート２５（２１）の離型フィルム吸着固定機構による離型フィルム１１の吸着を解除する。
また、次に、図４に示すように、下型３側の吸引機構を作動させることにより、下型３の型面と下型キャビティ５の面から空気を強制的に吸引排出させることになる。
このとき、離型フィルム１１を下型３の型面に係止した状態で、且つ、下型キャビティ５内に離型フィルム１１を引き込んでキャビティ５の形状に沿って離型フィルム１１を被覆させることができる。
また、このとき、図４に示すように、樹脂配布済プレート２５（２１）における樹脂収容部２２内において、離型フィルム１１上に載置された所要量の平坦化した顆粒樹脂６と離型フィルム１１とを一緒にした状態で、下型キャビティ５内に所要量の平坦化した顆粒樹脂６を引き込んで落下させることになる。
また、このとき、離型フィルム１１を被覆した下型キャビティ５内に、所要量の顆粒樹脂６を平坦化した状態で、即ち、顆粒樹脂６の厚さを均一にした状態で、供給することができる。
従って、この場合、所要量の平坦化した顆粒樹脂６を離型フィルム１１上に載置した状態で、且つ、所要量の平坦化した顆粒樹脂６と離型フィルム１１とを一緒にした状態で（一体にした状態で）、下型キャビティ５内に所要量の顆粒樹脂６を平坦化した状態で（均一な厚さの状態で）落下させて（一括して）供給することができる。 Next, the release of the release film 11 by the release film suction fixing mechanism of the plate 25 (21) is released.
Next, as shown in FIG. 4, by operating the suction mechanism on the lower mold 3 side, air is forcibly sucked and discharged from the mold surface of the lower mold 3 and the surface of the lower mold cavity 5. .
At this time, in a state where the release film 11 is locked to the mold surface of the lower mold 3, the release film 11 is drawn into the lower mold cavity 5 to cover the release film 11 along the shape of the cavity 5. be able to.
Further, at this time, as shown in FIG. 4, in the resin accommodating portion 22 of the resin distributed plate 25 (21), the required amount of the flattened granular resin 6 placed on the release film 11 and the release are placed. With the film 11 being put together, a required amount of the flattened granular resin 6 is drawn into the lower mold cavity 5 and dropped.
At this time, a predetermined amount of the granule resin 6 is supplied into the lower mold cavity 5 covered with the release film 11 in a flattened state, that is, in a state where the thickness of the granule resin 6 is uniform. Can do.
Therefore, in this case, with the required amount of the flattened granule resin 6 placed on the release film 11 and with the required amount of the flattened granule resin 6 and the release film 11 together. A predetermined amount of the granular resin 6 can be dropped into the lower mold cavity 5 in a flat state (in a uniform thickness) and supplied (in a lump).

即ち、本発明は、樹脂配布済プレート２５を装着したインローダ９（樹脂材料供給機構）における樹脂配布済プレート２５のプレート下方開口部２３を下型３（キャビティ開口部１０）に載置する構成であって、離型フィルム１１を被覆した下型キャビティ５内に所要量の平坦化した顆粒樹脂６を効率良く供給することができるものである。
また、本発明は、離型フィルム１１を被覆した下型キャビティ５内に所要量の顆粒樹脂６を平坦化した状態で（均一な厚さの状態で）供給することができるため、従来例に示すように、シャッタ９０に引っかかって樹脂の一部９２が供給機構８９に残存することを効率良く防止することができるものである。
従って、本発明によれば、従来例に示すシャッタ９０が必要でなくなり、顆粒樹脂８４の一部９２が供給機構８９側に残存すると云った従来例に示すような弊害がなくなるものである。
なお、このため、本発明は、離型フィルム１１を被覆したキャビティ５内に所要量の平坦化した顆粒樹脂６を（離型フィルム１１と一緒に一括して）供給することができる。 That is, the present invention has a configuration in which the plate lower opening 23 of the resin distributed plate 25 in the inloader 9 (resin material supply mechanism) equipped with the resin distributed plate 25 is placed on the lower mold 3 (cavity opening 10). Thus, a required amount of the flattened granular resin 6 can be efficiently supplied into the lower mold cavity 5 covered with the release film 11.
In addition, since the present invention can supply a required amount of the granular resin 6 in a flattened state (in a uniform thickness) into the lower mold cavity 5 covered with the release film 11, As shown, it is possible to efficiently prevent the resin portion 92 from being caught in the shutter 90 and remaining in the supply mechanism 89.
Therefore, according to the present invention, the shutter 90 shown in the conventional example is no longer necessary, and the disadvantage as shown in the conventional example that part 92 of the granular resin 84 remains on the supply mechanism 89 side is eliminated.
For this reason, the present invention can supply a required amount of the flattened granular resin 6 (together with the release film 11) into the cavity 5 coated with the release film 11.

引き続いて、次に、離型フィルム１１を被覆したキャビティ５内で所要量の顆粒樹脂６を平坦化した状態で加熱溶融化することになる。
この場合、離型フィルム１１を被覆した下型キャビティ５内で所要量の顆粒樹脂６を平坦化した状態で（均一な厚さの状態で）供給することができるので、離型フィルム１１を被覆した下型キャビティ５内で所要量の顆粒樹脂６を（例えば、キャビティ底面側から）均一に加熱して溶融化することができる。
従って、下型キャビティ５内に不均一に顆粒樹脂６が供給された場合に比べて、顆粒樹脂６が不均一に加熱溶融化されて部分的に硬化することにより、ママコ（例えば、小さな硬化樹脂の粒）になることを効率良く防止することができる。 Subsequently, the required amount of the granular resin 6 is heated and melted in a flattened state in the cavity 5 covered with the release film 11.
In this case, since a required amount of the granule resin 6 can be supplied in a flattened state (with a uniform thickness) in the lower mold cavity 5 coated with the release film 11, the release film 11 is covered. In the lower mold cavity 5, a required amount of the granular resin 6 can be uniformly heated (for example, from the bottom side of the cavity) to be melted.
Therefore, compared with the case where the granular resin 6 is supplied non-uniformly in the lower mold cavity 5, the granular resin 6 is heated and melted non-uniformly and partially cured, so that Can be efficiently prevented.

また、次に、下型３を上動して上下両型２、３を型締めすることにより、上型基板セット部４に供給セットした基板８に装着した電子部品７を、下型キャビティ５内の加熱溶融化された樹脂（６）に浸漬すると共に、キャビティ底面部材３８でキャビティ５内の樹脂を押圧することになる。
硬化に必要な所要時間の経過後、上下両型２、３を型開きすることにより、キャビティ５内で基板８に装着した電子部品７をキャビティ５の形状に対応した樹脂成形体１２内に圧縮成形する（樹脂封止成形する）ことができる。 Next, the lower mold 3 is moved up to clamp the upper and lower molds 2, 3, so that the electronic component 7 mounted on the substrate 8 supplied and set to the upper mold substrate setting unit 4 is moved to the lower mold cavity 5. The resin in the cavity 5 is pressed by the cavity bottom surface member 38 while being immersed in the heat-melted resin (6).
After the time required for curing has elapsed, the upper and lower molds 2 and 3 are opened to compress the electronic component 7 mounted on the substrate 8 in the cavity 5 into the resin molded body 12 corresponding to the shape of the cavity 5. It can be molded (resin sealing molding).

即ち、前述したように、樹脂材料の配布手段３１にて樹脂供給前プレート２１ａ（２１）の樹脂収容部２２に所要量の顆粒樹脂６を供給して平坦化して樹脂配布済プレート２５（２１）を形成することができる。
また、前述したように、樹脂配布済プレート２５（２１）における樹脂収容部２２内で離型フィルム１１上に載置された所要量の平坦化した顆粒樹脂６を離型フィルム１１と一緒にキャビティ５内に引き込んで落下させることにより、離型フィルム１１を被覆したキャビティ５内に所要量の顆粒樹脂６を平坦化した状態で（所要量の顆粒樹脂６を均一な厚さに形成した状態で）供給することができる。
従って、本発明によれば、所要量の平坦化した顆粒樹脂６を離型フィルム１１と一緒にキャビティ５内に引き込んで落下させることにより、離型フィルム１１を被覆したキャビティ５内に所要量の顆粒樹脂６を平坦化した状態で供給することができるので、金型キャビティ内への樹脂の供給時に、金型キャビティ５内に樹脂を効率良く供給することができると云う優れた効果を奏する。
また、本発明によれば、前述したように、離型フィルム１１を被覆したキャビティ５内に所要量の顆粒樹脂６を平坦化した状態で供給することができるので、金型キャビティ５内への樹脂の供給時において、金型キャビティ５内に供給される樹脂量の信頼性を効率良く向上させることができると云う優れた効果を奏する。 That is, as described above, the resin material distribution means 31 supplies a required amount of the granular resin 6 to the resin accommodating portion 22 of the pre-resin supply plate 21a (21) and flattens the resin distribution plate 25 (21). Can be formed.
Further, as described above, a predetermined amount of the flattened granular resin 6 placed on the release film 11 in the resin accommodating portion 22 of the resin distributed plate 25 (21) is cavityd together with the release film 11. In the state in which the required amount of the granule resin 6 is flattened in the cavity 5 covered with the release film 11 (in a state where the required amount of the granule resin 6 is formed to a uniform thickness). ) Can be supplied.
Therefore, according to the present invention, the required amount of the flattened granular resin 6 is drawn into the cavity 5 together with the release film 11 and dropped, so that the required amount is put into the cavity 5 coated with the release film 11. Since the granular resin 6 can be supplied in a flattened state, the resin can be efficiently supplied into the mold cavity 5 when the resin is supplied into the mold cavity.
Further, according to the present invention, as described above, since a required amount of the granular resin 6 can be supplied into the cavity 5 covered with the release film 11 in a flattened state, When the resin is supplied, there is an excellent effect that the reliability of the amount of resin supplied into the mold cavity 5 can be improved efficiently.

本発明は、前述した実施例のものに限定されるものでなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意且つ適宜に変更・選択して採用できるものである。   The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

（他の樹脂材料の計量手段について）
また、樹脂材料の受給側配布手段３１ｂには、プレート２１、２１ａ（樹脂収容部２２）に供給投入される所要量の顆粒樹脂６を計量する樹脂材料のプレート側計量手段（ロードセル）３６が設けられて構成されている。
従って、樹脂材料の受給側配布手段３１ｂ側において、樹脂材料のプレート側計量手段３６にて、プレート２１、２１ａ（樹脂収容部２２）に供給される顆粒樹脂６を計量することができるように構成されている。 (Measuring means for other resin materials)
The resin material receiving side distribution means 31b is provided with a resin material plate side weighing means (load cell) 36 for weighing a required amount of the granular resin 6 supplied to the plates 21 and 21a (resin housing portion 22). Is configured.
Therefore, the resin material receiving side distribution means 31b side can measure the granular resin 6 supplied to the plates 21 and 21a (resin housing part 22) by the resin material plate side weighing means 36. Has been.

なお、顆粒樹脂６の計量について、樹脂材料の投入側配布手段３１ａのフィーダ側計量手段３３による計量工程と、樹脂材料の受給側配布手段３１ｂのプレート側計量手段３６による計量工程とを併用することができる。
また、これらの両計量工程をいずれか一方のみ実施する構成を採用してもよい。 For the measurement of the granular resin 6, the weighing process by the feeder-side weighing means 33 of the resin material input-side distribution means 31a and the weighing process by the plate-side weighing means 36 of the resin material receiving-side distribution means 31b are used in combination. Can do.
Moreover, you may employ | adopt the structure which implements only one of these both measurement processes.

（他の樹脂材料の平坦化手段について）
また、樹脂材料の受給側配布手段３１ｂには、リニア振動フィーダ３５から樹脂収容部２２内に投入された顆粒樹脂６を（プレート２１、２１ａと伴に）振動させながら当該顆粒樹脂６を、Ｘ方向或いはＹ方向に、各別に或いは同時に移動させることにより、樹脂収容部２２内で顆粒樹脂６を平坦化して顆粒樹脂６の厚さを均一化する樹脂材料の平坦化手段となる樹脂材料の振動均一化手段（図示なし）が設けられて構成されている。
即ち、樹脂材料の受給側配布手段３１ｂにおいて、振動均一化手段にて樹脂供給前プレート２１、２１ａ（樹脂収容部２２）を振動させることにより、樹脂供給前プレート２１、２１ａ（樹脂収容部２２）に供給投入された顆粒樹脂６をＸ方向或いはＹ方向に移動させることができる。
このとき、樹脂収容部２２に供給された顆粒樹脂６をＸ方向或いはＹ方向に移動させて平坦化させることにより、樹脂収容部２２内で顆粒樹脂６の厚さを均一化することができるように構成されている。
従って、所要量の平坦化した顆粒樹脂６（均一な厚さを有する顆粒樹脂６）が供給された樹脂収容部２２（貫通孔３７）を有する樹脂配布済プレート２５を形成することができる。 (About other resin material flattening means)
In addition, the resin material receiving side distribution means 31b allows the granular resin 6 introduced into the resin accommodating portion 22 from the linear vibration feeder 35 to vibrate (along with the plates 21 and 21a) while the granular resin 6 is X. The vibration of the resin material that serves as a flattening means for the resin material for flattening the granular resin 6 in the resin accommodating portion 22 and uniforming the thickness of the granular resin 6 by moving in the direction or the Y direction separately or simultaneously. Uniformity means (not shown) is provided.
That is, in the resin material receiving side distribution means 31b, the pre-resin supply plates 21, 21a (resin accommodating part 22) are vibrated by the vibration equalizing means, thereby pre-resin feeding plates 21, 21a (resin accommodating part 22). Can be moved in the X direction or the Y direction.
At this time, the thickness of the granular resin 6 can be made uniform in the resin accommodating portion 22 by moving the granular resin 6 supplied to the resin accommodating portion 22 in the X direction or the Y direction and flattening it. It is configured.
Accordingly, it is possible to form the resin distributed plate 25 having the resin accommodating portion 22 (through hole 37) supplied with the required amount of the flattened granular resin 6 (the granular resin 6 having a uniform thickness).

また、樹脂材料の投入手段３２（リニア振動フィーダ３５）においては、顆粒樹脂６を振動させることにより、単位時間当たり一定量の樹脂量にてプレート２１、２１ａ（樹脂収容部２２）に投入することができるように構成されている。
この場合、この単位時間当たりの樹脂投入量と、樹脂材料の振動均一化手段によるプレート２１、２１ａ（顆粒樹脂６）に対する振動作用とを適宜に調整することにより、樹脂収容部２２内に投入される顆粒樹脂６を均一な厚さ（単位面積当たり一定量の樹脂量）に形成することができるように構成されている。
なお、プレート２１（２１ａ）の樹脂収容部２２における中央部に顆粒樹脂６を落下さて投入する構成を採用することができる。
この場合、樹脂収容部２２内で振動を加えられる顆粒樹脂６は外周囲方向に均等に移動して平坦化する（顆粒樹脂６の厚さを均一にする）ことができる。 Further, in the resin material charging means 32 (linear vibration feeder 35), the granular resin 6 is vibrated to be charged into the plates 21 and 21a (resin housing portion 22) with a constant amount of resin per unit time. It is configured to be able to.
In this case, the resin is introduced into the resin container 22 by appropriately adjusting the amount of resin per unit time and the vibration action of the resin material on the plates 21 and 21a (granular resin 6) by the vibration equalizing means. The granular resin 6 can be formed to have a uniform thickness (a constant amount of resin per unit area).
In addition, the structure which drops and throws the granular resin 6 in the center part in the resin accommodating part 22 of the plate 21 (21a) is employable.
In this case, the granule resin 6 that is vibrated in the resin accommodating portion 22 can be evenly moved and flattened in the outer peripheral direction (the thickness of the granule resin 6 is made uniform).

また、プレート２１の樹脂収容部２２内における投入された顆粒樹脂６に凹凸部が残存した場合、適宜な樹脂材料の平坦化手段にて、即ち、プレート２１に振動作用を加えることにより、或いは、へらにて、当該凹凸部を平坦化し得て顆粒樹脂６の厚さを均一化することができる。   Further, when the uneven portion remains in the charged granular resin 6 in the resin accommodating portion 22 of the plate 21, by an appropriate resin material flattening means, that is, by applying a vibrating action to the plate 21, or The uneven part can be flattened with a spatula, and the thickness of the granular resin 6 can be made uniform.

また、前記した実施例において、熱硬化性の樹脂材料を用いて説明したが、熱可塑性の樹脂材料を用いても良い。   In the above-described embodiments, the thermosetting resin material has been described. However, a thermoplastic resin material may be used.

また、前記した実施例において、顆粒状の樹脂材料６を用いて説明したが、所要の粒径分布を有するパウダー状の樹脂材料（パウダー樹脂）、粉末状の樹脂材料（粉末樹脂）などの種々の形状の樹脂材料を採用することができる。   In the above-described embodiments, the granular resin material 6 has been described. However, various powder resin materials (powder resins) having a required particle size distribution, powder resin materials (powder resins), and the like can be used. It is possible to employ a resin material having a shape of

また、前記した実施例において、例えば、シリコン系の樹脂材料、エポキシ系の樹脂材料を用いることができる。
また、前記実施例において、透明性を有する樹脂材料、半透明性を有する樹脂材料、燐光物資、蛍光物質を含む樹脂材料など種々の樹脂材料を用いることができる。 In the above-described embodiments, for example, a silicon-based resin material or an epoxy-based resin material can be used.
Moreover, in the said Example, various resin materials, such as the resin material which has transparency, the resin material which has translucency, a phosphorescent material, and the resin material containing a fluorescent substance, can be used.

また、樹脂配布済プレート２５において、プレート２１の上面に蓋部材を設ける構成を採用してプレート上方開口部３９（樹脂収容部２２）に蓋をする構成を採用することができる。   Further, in the resin distributed plate 25, a configuration in which a lid member is provided on the upper surface of the plate 21 to cover the plate upper opening 39 (resin accommodating portion 22) can be employed.

図１は、本発明に係る電子部品の圧縮成形方法を説明する樹脂収容用のプレートと樹脂材料の配布機構とを概略的に示す概略斜視図であって、前記したプレートに樹脂材料を配布する状態を示している。FIG. 1 is a schematic perspective view schematically showing a resin-accommodating plate and a resin material distribution mechanism for explaining a compression molding method for an electronic component according to the present invention, and the resin material is distributed to the aforementioned plate. Indicates the state. 図２（１）、図２（２）は、本発明に係る電子部品の圧縮成形方法を説明する樹脂収容用のプレートを概略的に示す概略斜視図であって、図２（１）は図１に示す樹脂材料の配布機構において、プレートに樹脂材料を配布した状態を示し、図２（２）は図１に示す樹脂材料の配布機構で樹脂材料を配布した樹脂配布済プレートを示している。2 (1) and 2 (2) are schematic perspective views schematically showing a resin housing plate for explaining a compression molding method of an electronic component according to the present invention, and FIG. 1 shows a state in which the resin material is distributed on the plate in the resin material distribution mechanism shown in FIG. 1, and FIG. 2B shows a resin distributed plate in which the resin material is distributed by the resin material distribution mechanism shown in FIG. . 図３は、本発明に係る電子部品の圧縮成形方法を説明する電子部品の圧縮成形用金型装置を概略的に示す概略縦断面図であって、前記した金型装置に図２（２）に示す樹脂配布済プレートを供給した状態を示している。FIG. 3 is a schematic longitudinal sectional view schematically showing an electronic component compression molding apparatus for explaining an electronic component compression molding method according to the present invention. FIG. The state which supplied the resin distribution completed plate shown in FIG. 図４は、図３に対応する電子部品の圧縮成形用金型装置を概略的に示す概略縦断面図であって、前記した金型装置（金型）に設けた下型キャビティ内に離型フィルムを吸着被覆することにより、樹脂配布済プレートから離型フィルムを被覆したキャビティ内に樹脂材料を落下供給した状態を示している。FIG. 4 is a schematic longitudinal sectional view schematically showing a mold apparatus for compression molding of electronic parts corresponding to FIG. 3, and the mold is released in a lower mold cavity provided in the above-described mold apparatus (mold). A state is shown in which the resin material is dropped and supplied from the resin-distributed plate into the cavity coated with the release film by adsorbing the film. 図５は、図３に対応する電子部品の圧縮成形用金型装置（金型）を概略的に示す概略縦断面図であって、前記した金型の型締状態を示している。FIG. 5 is a schematic longitudinal sectional view schematically showing a mold apparatus (mold) for compression molding of an electronic component corresponding to FIG. 3 and shows a mold clamping state of the above-described mold. 図６は、従来の電子部品の圧縮成形方法を説明する電子部品の圧縮成形用金型装置を概略的に示す概略縦断面図である。FIG. 6 is a schematic longitudinal sectional view schematically showing a mold apparatus for compression molding of electronic parts for explaining a conventional compression molding method for electronic parts.

符号の説明Explanation of symbols

１ 電子部品の圧縮成形用金型（型組品）
２ 固定上型
３ 可動下型
４ 基板セット部
５ 下型キャビティ
６ 顆粒状の樹脂材料（顆粒樹脂）
７ 電子部品
８ 基板
９ インローダ
９ａ プレート係着部
９ｂ 基板載置部
１０ キャビティ開口部
１１ 離型フィルム
１２ 樹脂成形体
２１ 樹脂収容用プレート
２１ａ 樹脂供給前プレート
２２ 樹脂収容部
２３ プレート下方開口部
２４ プレート周縁部
２５ 樹脂配布済プレート
３１ 樹脂材料の配布手段
３１ａ 投入側配布手段
３１ｂ 受給側配布手段
３２ 樹脂材料の投入手段
３３ フィーダ側の計量手段
３４ ホッパ
３５ リニア振動フィーダ
３６ プレート側の計量手段
３７ 貫通孔
３８ キャビティ底面部材
３９ プレート上方開口部
４０ プレート載置部
４１ 所要の厚さ（距離）
４２ 水平移動平坦化機構 1 Mold for compression molding of electronic parts (mold assembly)
2 Fixed upper mold 3 Movable lower mold 4 Substrate setting part 5 Lower mold cavity 6 Granular resin material (granular resin)
DESCRIPTION OF SYMBOLS 7 Electronic component 8 Board | substrate 9 Inloader 9a Plate attachment part 9b Board | substrate mounting part 10 Cavity opening part 11 Release film 12 Resin molding 21 Resin accommodation plate 21a Resin pre-supply plate 22 Resin accommodation part 23 Plate downward opening part 24 Plate Peripheral part 25 Resin distributed plate 31 Resin material distribution means 31a Input side distribution means 31b Receiving side distribution means 32 Resin material input means 33 Feeder side weighing means 34 Hopper 35 Linear vibration feeder 36 Plate side weighing means 37 Through hole 38 Cavity bottom member 39 Plate upper opening 40 Plate mounting part 41 Required thickness (distance)
42 Horizontal movement flattening mechanism

Claims (8)

離型フィルムが被覆された金型キャビティ内に所要量の樹脂材料を供給すると共に、前記したキャビティ内の樹脂に電子部品を浸漬することにより、前記したキャビティ内で当該キャビティの形状に対応した樹脂成形体内に前記した電子部品を圧縮成形する電子部品の圧縮成形方法であって、
前記した金型キャビティに対応した貫通孔を備えた樹脂収容用のプレートの下面に離型フィルムを被覆することにより、前記したプレート貫通孔をプレート樹脂収容部に形成する工程と、
前記したプレート樹脂収容部に所要量の樹脂材料を供給する工程と、
前記したプレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成する工程と、
前記した樹脂配布済プレートを前記した金型キャビティの位置に載置することにより、前記した金型キャビティに前記した離型フィルムを介して前記した樹脂収容部を合致させる工程と、
前記した離型フィルムを前記したキャビティ面に被覆する工程と、
前記した離型フィルムを前記したキャビティ面に被覆する時に、前記した金型キャビティ内に前記した樹脂収容部内から樹脂材料を供給する工程とを含むことを特徴とする電子部品の圧縮成形方法。 A resin corresponding to the shape of the cavity in the cavity is supplied by supplying a required amount of the resin material into the mold cavity covered with the release film and immersing the electronic component in the resin in the cavity. An electronic component compression molding method for compressing and molding the above-described electronic component in a molded body,
Forming the plate through hole in the plate resin containing portion by covering the lower surface of the resin containing plate provided with the through hole corresponding to the mold cavity as described above,
Supplying a required amount of the resin material to the plate resin container;
A step of forming a resin-distributed plate in which the thickness of the resin material in the plate resin container is made uniform and flattened;
By placing the above-described resin distributed plate at the position of the above-described mold cavity, to match the above-described resin accommodating portion with the above-described mold cavity via the above-described release film;
Coating the aforementioned release film on the aforementioned cavity surface;
And a step of supplying a resin material into the mold cavity from the inside of the resin container when the release film is coated on the cavity surface. プレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成するときに、プレートをＸ方向に或いはＹ方向に移動させることにより、前記したプレート樹脂収容部内の樹脂材料を所要の均一な厚さに形成して平坦化する工程を含むことを特徴とする請求項１に記載の電子部品の圧縮成形方法。   When forming a resin distributed plate that is flattened with a uniform thickness of the resin material in the plate resin container, the resin material in the plate resin container is moved by moving the plate in the X or Y direction. The method of compression molding an electronic component according to claim 1, further comprising a step of flattening by forming the film to a required uniform thickness. プレート樹脂収容部内の樹脂材料の厚さを均一にして平坦化した樹脂配布済プレートを形成するときに、プレートを振動させることにより、前記したプレート樹脂収容部内の樹脂材料を所要の均一な厚さに形成して平坦化する工程を含むことを特徴とする請求項１に記載の電子部品の圧縮成形方法。   When forming a resin distributed plate that is flattened by making the thickness of the resin material in the plate resin accommodating portion uniform, the resin material in the plate resin accommodating portion is required to have a uniform thickness by vibrating the plate. The method of compression molding of an electronic component according to claim 1, further comprising the step of forming and flattening. 樹脂材料が、顆粒状の樹脂材料、或いは、粉末状の樹脂材料であることを特徴とする請求項１に記載の電子部品の圧縮成形方法。   2. The electronic component compression molding method according to claim 1, wherein the resin material is a granular resin material or a powder resin material. 上型及び前記した上型に対向配置した下型とから成る電子部品の圧縮成形用金型と、前記した下型に設けた圧縮成形用キャビティと、前記した上型に設けた基板セット部と、前記した下型キャビティ内を被覆する離型フィルムと、前記した下型キャビティ内の樹脂を押圧する樹脂押圧用のキャビティ底面部材と、前記した金型に樹脂材料と電子部品を装着した基板とを供給するインローダとを備えた電子部品の圧縮成形用金型装置であって、前記したインローダに装着され且つ貫通孔を有する樹脂収容用プレートと、前記した樹脂収容用プレートの下面側を被覆して前記したプレート貫通孔を樹脂収容部に形成する離型フィルムと、前記した樹脂収容部に樹脂材料を供給する樹脂材料の配布手段とを備えたことを特徴とする電子部品の圧縮成形用金型装置。   An electronic component compression mold comprising an upper mold and a lower mold opposed to the upper mold, a compression molding cavity provided in the lower mold, and a substrate set portion provided in the upper mold A release film covering the inside of the lower mold cavity, a cavity bottom member for pressing the resin in the lower mold cavity, and a substrate on which the resin material and the electronic component are mounted on the mold. A mold apparatus for compression molding of an electronic component comprising an inloader for supplying a resin, the resin accommodating plate being mounted on the inloader and having a through hole, and covering the lower surface side of the resin accommodating plate. And a resin film distribution means for supplying the resin material to the resin container. Mold apparatus. 樹脂収容部に樹脂材料を供給する樹脂材料の配布手段に、前記した樹脂収容部に樹脂材料を供給する樹脂材料の供給手段と、前記した樹脂収容部に供給される樹脂材料を計量する樹脂材料の計量手段と、前記した樹脂収容部に供給された樹脂材料を平坦化する樹脂材料の平坦化手段とを設けて構成したことを特徴とする請求項５に記載の電子部品の圧縮成形用金型装置。   Resin material distribution means for supplying a resin material to the resin container, a resin material supply means for supplying the resin material to the resin container, and a resin material for weighing the resin material supplied to the resin container 6. The gold for compression molding of an electronic component according to claim 5, wherein said weighing means and a flattening means for the resin material for flattening the resin material supplied to said resin container are provided. Mold device. プレートに形成された樹脂収容部内に供給される樹脂材料を平坦化する樹脂材料の平坦化手段として、前記したプレートをＸ方向に或いはＹ方向に移動させる水平移動平坦化機構を設けて構成したことを特徴とする請求項５に記載の電子部品の圧縮成形用金型装置。   As a flattening means for the resin material for flattening the resin material supplied into the resin container formed on the plate, a horizontal movement flattening mechanism for moving the plate in the X direction or the Y direction is provided. The mold apparatus for compression molding of electronic parts according to claim 5. 樹脂材料が、顆粒状の樹脂材料、或いは、粉末状の樹脂材料であることを特徴とする請求項５に記載の電子部品の圧縮成形用金型装置。   6. The mold apparatus for compression molding of electronic parts according to claim 5, wherein the resin material is a granular resin material or a powder resin material.
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CN200980128894.XA CN102105282B (en) 2008-08-08 2009-08-03 Method for compression-molding electronic component and die apparatus
PCT/JP2009/003683 WO2010016223A1 (en) 2008-08-08 2009-08-03 Method for compression-molding electronic component and die apparatus
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