TWI529822B - A method of compression-molding electronic components and an apparatus of metal mold - Google Patents

A method of compression-molding electronic components and an apparatus of metal mold Download PDF

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TWI529822B
TWI529822B TW103119341A TW103119341A TWI529822B TW I529822 B TWI529822 B TW I529822B TW 103119341 A TW103119341 A TW 103119341A TW 103119341 A TW103119341 A TW 103119341A TW I529822 B TWI529822 B TW I529822B
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Taiwan
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resin
resin material
release film
lower mold
mold cavity
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TW103119341A
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Chinese (zh)
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TW201436061A (en
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浦上浩
高田直毅
大槻修
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東和股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Description

電子零件之壓縮成形方法及金屬模具裝置 Compression forming method for electronic parts and metal mold device

本發明係關於一種IC(Integrated Circuit)等之電子零件之壓縮成形方法及使用於該壓縮成形方法之金屬模具裝置。 The present invention relates to a compression molding method for an electronic component such as an IC (Integrated Circuit) and a metal mold device used in the compression molding method.

以往，如圖6所示，使用裝載於電子零件之壓縮成形用金屬模具裝置之電子零件之壓縮成形用金屬模具81，以顆粒狀之樹脂材料(顆粒樹脂)84進行安裝在基板82之所需數目之電子零件83之壓縮成形(樹脂密封成形)，其係以下述方式進行。 In the related art, as shown in FIG. 6, the metal mold 81 for compression molding of the electronic component of the compression molding die apparatus mounted on the electronic component is required to be mounted on the substrate 82 by a granular resin material (particle resin) 84. The compression molding (resin sealing formation) of the number of electronic parts 83 is carried out in the following manner.

首先，將脫模膜88被覆於設在電子零件之壓縮成形用金屬模具81(上模具85與下模具86)之下模具腔87內，且將顆粒樹脂84供應至被覆該脫模膜88之下模具腔87內並加熱使其熔融，接著，使上述金屬模具81(85、86)閉模，將安裝在基板82之所需數目之電子零件83浸漬於下模具腔87內之熔融樹脂，據以在與下模具腔87之形狀對應之樹脂成形體內將所需數目之電子零件83壓縮成形(一次單面模具)。 First, the release film 88 is coated in the mold cavity 87 provided under the compression molding metal mold 81 (the upper mold 85 and the lower mold 86) of the electronic component, and the particulate resin 84 is supplied to cover the release film 88. The lower mold cavity 87 is heated and melted, and then the molds 81 (85, 86) are closed, and the required number of electronic components 83 mounted on the substrate 82 are immersed in the molten resin in the lower mold cavity 87. The required number of electronic parts 83 are compression-molded (primary single-sided mold) in a resin molded body corresponding to the shape of the lower mold cavity 87.

此外，此時，能以樹脂按壓用之腔底面構件93按壓下模具腔87之樹脂。 Further, at this time, the resin of the lower mold cavity 87 can be pressed by the cavity bottom surface member 93 for resin pressing.

然而，為了將顆粒樹脂84供應至上述下模具腔87內，使用樹脂材料供應機構89(下部擋門90與供應部91)。 However, in order to supply the particulate resin 84 into the lower mold cavity 87 described above, a resin material supply mechanism 89 (the lower shutter 90 and the supply portion 91) is used.

亦即，將所需量之顆粒樹脂84放入至上述樹脂材料供應機構89(供應部91)以使該樹脂材料供應機構89進入上述上下兩模具85,86間，接著，拉開樹脂材料供應機構89之下部擋門90，據以使顆粒樹脂84從供應部91落下供應至下模具腔87內。 That is, the required amount of the particulate resin 84 is placed in the above-mentioned resin material supply mechanism 89 (supply portion 91) so that the resin material supply mechanism 89 enters between the upper and lower molds 85, 86, and then the resin material supply is pulled apart. The lower door 90 of the mechanism 89 is such that the granular resin 84 is dropped from the supply portion 91 into the lower mold cavity 87.

專利文獻1：日本特開2004-216558號 Patent Document 1: Japanese Patent Laid-Open No. 2004-216558

然而，將樹脂84供應至金屬模具腔87內時，開啟樹脂材料供應機構89之擋門90使顆粒樹脂84落下供應至下模具腔87內時，會有樹脂之一部分92殘留在樹脂材料供應機構89(供應部91)側之情形。 However, when the resin 84 is supplied into the metal mold cavity 87, when the shutter 90 of the resin material supply mechanism 89 is opened to cause the granular resin 84 to fall into the lower mold cavity 87, a portion of the resin 92 remains in the resin material supply mechanism. 89 (supply part 91) side situation.

是以，將樹脂84供應至金屬模具腔87內時，會有無法高效率將樹脂84供應至金屬模具腔87內之缺點。 Therefore, when the resin 84 is supplied into the mold cavity 87, there is a disadvantage that the resin 84 cannot be supplied into the mold cavity 87 with high efficiency.

又，將樹脂84供應至金屬模具腔87內時，由於樹脂之一部分(殘留之顆粒樹脂)92殘留在樹脂材料供應機構89(供應部91)側，因此供應至金屬模具腔87內之樹脂量會容易產生不足情形。 Further, when the resin 84 is supplied into the mold cavity 87, since a part of the resin (residual particle resin) 92 remains on the side of the resin material supply mechanism 89 (supply portion 91), the amount of resin supplied into the mold cavity 87 is It will easily lead to deficiencies.

是以，將樹脂84供應至金屬模具腔87內時，會有無法高效率提昇供應至金屬模具腔87內之樹脂量之可靠性之缺點。 Therefore, when the resin 84 is supplied into the mold cavity 87, there is a disadvantage that the reliability of the amount of the resin supplied into the mold cavity 87 cannot be improved with high efficiency.

本發明所欲解決之問題，係將樹脂供應至金屬模具腔內時，能高效率將樹脂供應至金屬模具腔內，且高效率提昇供應至金屬模具腔內之樹脂量之可靠性。 The problem to be solved by the present invention is that when the resin is supplied into the cavity of the metal mold, the resin can be efficiently supplied into the cavity of the metal mold, and the reliability of the amount of the resin supplied into the cavity of the metal mold can be improved with high efficiency.

為了解決上述問題，本發明之電子零件之壓縮成形方法，係將所需量之樹脂材料供應至被覆有脫模膜之金屬模具腔內，且將電子零件浸漬於該腔內之樹脂，據以在該腔內之與該腔之形狀對應之樹脂成形體內將該電子零件壓縮成形，其特徵在於，包含：將脫模膜被覆於具備與該金屬模具腔對應之開口部之樹脂收容用板之下面，以形成具有樹脂收容部之樹脂供應前板的步驟；將所需量之樹脂材料供應至該樹脂供應前板之該樹脂收容部的步驟；使該樹脂收容部內之樹脂材料之厚度均勻，以形成平坦化之樹脂已分散板的步驟；將該樹脂已分散板裝載於該金屬模具腔之位置，據以使該樹脂收容部透過該脫模膜與該金屬模具腔一致的步驟；將該脫模膜被覆於該腔面的步驟；以及將該脫模膜被覆於該腔面時，將樹脂材料從該樹脂收容部內供應至該金屬模具腔內的步驟。 In order to solve the above problems, the compression molding method of the electronic component of the present invention is to supply a required amount of the resin material to the metal mold cavity covered with the release film, and immerse the electronic component in the cavity. The electronic component is compression-molded in a resin molded body corresponding to the shape of the cavity in the cavity, and the release film is coated with a resin-receiving sheet having an opening corresponding to the mold cavity. Next, a step of forming a resin supply front plate having a resin accommodating portion; a step of supplying a required amount of the resin material to the resin accommodating portion of the resin supply front plate; and making the thickness of the resin material in the resin accommodating portion uniform, a step of forming a flattened resin-dispersed plate; loading the resin-dispersed plate at a position of the metal mold cavity, thereby passing the resin receiving portion through the release film and the mold cavity; a step of coating a release film on the cavity surface; and feeding the resin material from the resin housing portion into the mold cavity when the release film is coated on the cavity surface Sudden.

又，為了解決上述問題，電子零件之壓縮成形方法，其包含使該樹脂收容部內之樹脂材料之厚度均勻以形成平坦化之樹脂已分散板時，一邊將所需量之樹脂材料供應至該樹脂供應前板之該樹脂收容部、一邊使該樹脂供應前板移動於X方向或Y方向，據以將該樹脂收容部內之樹脂材料形成為所需之均勻厚度以使其平坦化的步驟。 Moreover, in order to solve the above problem, the electronic component compression molding method includes supplying a required amount of the resin material to the resin when the thickness of the resin material in the resin accommodating portion is made uniform to form a flattened resin dispersed plate. The resin accommodating portion of the front plate is supplied, and the resin supply front plate is moved in the X direction or the Y direction, and the resin material in the resin accommodating portion is formed into a desired uniform thickness to be flattened.

又，為了解決上述問題，本發明之電子零件之壓縮成形方法，其包含使該樹脂收容部內之樹脂材料之厚度均勻以形成平坦化之樹脂已分散板時，使樹脂供應前板振動，據以將該樹脂收容部內之樹脂材料形成為所需之均勻厚度以使其平坦化的步驟。 Moreover, in order to solve the above problem, the compression molding method for an electronic component according to the present invention includes a method of making the resin supply front plate vibrate when the thickness of the resin material in the resin storage portion is made uniform to form a flattened resin dispersed plate. The resin material in the resin accommodating portion is formed into a desired uniform thickness to planarize it.

又，為了解決上述問題，本發明之電子零件之壓縮成形方法，其中，該樹脂材料係顆粒狀之樹脂材料或粉末狀之樹脂材料。 Further, in order to solve the above problems, the method of compression molding of an electronic component according to the present invention, wherein the resin material is a granular resin material or a powdery resin material.

又，為了解決上述問題，本發明之電子零件之壓縮成形用金屬模具裝置，具備由上模具及與該上模具對向配置之下模具構成之電子零件之壓縮成形用金屬模具、設於該下模具之壓縮成形用腔、設於該上模具之基板安裝部、被覆該下模具腔內之脫模膜、按壓該下模具腔內之樹脂之樹脂按壓用之腔底面構件、及將樹脂材料與安裝電子零件之基板供應至該金屬模具之內部裝載機，其特徵在於：具備安裝於該內部裝載機且具有開口部之樹脂收容用板、被覆該樹脂收容用板之下面側以將該開口部形成於樹脂收容部之脫模膜、及將樹脂材料供應至該樹脂收容部之樹脂材料之分配手段，被覆該壓縮成形用腔內之該脫模膜與被覆該樹脂收容用板下面側之該脫模膜相同。 Moreover, in order to solve the above-mentioned problem, the metal mold apparatus for compression molding of the electronic component of the present invention includes a metal mold for compression molding including an upper mold and an electronic component which is disposed opposite to the upper mold, and is provided under the mold. a cavity for compression molding of a mold, a substrate mounting portion provided in the upper mold, a release film covering the lower mold cavity, a cavity bottom member for pressing the resin in the lower mold cavity, and a resin material and An internal loader for mounting an electronic component substrate to the metal mold, comprising: a resin storage plate having an opening attached to the internal loader; and a lower surface side of the resin storage plate covering the opening a release film formed in the resin accommodating portion and a dispensing means for supplying the resin material to the resin accommodating portion, covering the release film in the compression molding cavity and the underside of the resin accommodating plate The release film is the same.

又，為了解決上述問題，本發明之電子零件之壓縮成形用金屬模具裝置，其中，在將樹脂材料供應至該樹脂收容部之樹脂材料之分配手段，設置將樹脂材料供應至該樹脂收容部之樹脂材料之供應手段、計算供應至該樹脂收容部之樹脂材料之量之樹脂材料之計量手段、及使供應至該樹脂收容部之樹脂材料平坦化之樹脂材料之平坦化手段。 Moreover, in order to solve the above-mentioned problem, the metal mold apparatus for compression molding of the electronic component of the present invention is provided with a resin material supplied to the resin accommodating portion, and a resin material is supplied to the resin accommodating portion. The means for supplying the resin material, the measuring means for calculating the amount of the resin material supplied to the resin containing portion, and the means for flattening the resin material for flattening the resin material supplied to the resin containing portion.

又，為了解決上述問題，本發明之電子零件之壓縮成形用金屬模具裝置，其中，該平坦化手段，係使該樹脂收容用板移動於X方向或Y方向之水平移動平坦化機構。 Moreover, in order to solve the above-mentioned problem, the metal mold apparatus for compression molding of an electronic component according to the present invention is characterized in that the flattening means moves the resin accommodation plate in a horizontal movement flattening mechanism in the X direction or the Y direction.

又，為了解決上述問題，本發明之電子零件之壓縮成 形用金屬模具裝置，其中，該樹脂材料係顆粒狀之樹脂材料或粉末狀之樹脂材料。 Moreover, in order to solve the above problems, the electronic component of the present invention is compressed into The metal mold device is used, wherein the resin material is a granular resin material or a powdery resin material.

根據本發明，可達到將樹脂供應至金屬模具腔內時，能高效率將樹脂供應至金屬模具腔內之優異效果。 According to the present invention, it is possible to achieve an excellent effect of supplying the resin into the cavity of the metal mold with high efficiency when the resin is supplied into the cavity of the metal mold.

又，根據本發明，可達到將樹脂供應至金屬模具腔內時，能高效率提昇供應至金屬模具腔內之樹脂量之可靠性之優異效果。 Moreover, according to the present invention, it is possible to achieve an excellent effect of efficiently increasing the reliability of the amount of the resin supplied into the cavity of the metal mold when the resin is supplied into the cavity of the metal mold.

1‧‧‧電子零件之壓縮成形用金屬模具(模具組品) 1‧‧‧Metal mold for compression molding of electronic parts (mold kit)

2‧‧‧固定上模具 2‧‧‧Fixed mold

3‧‧‧可動下模具 3‧‧‧ movable mold

4‧‧‧基板安裝部 4‧‧‧Substrate Installation Department

5‧‧‧下模具腔 5‧‧‧ Lower mold cavity

6‧‧‧顆粒狀之樹脂材料(顆粒樹脂) 6‧‧‧Party resin material (granular resin)

7‧‧‧電子零件 7‧‧‧Electronic parts

8‧‧‧基板 8‧‧‧Substrate

9‧‧‧內部裝載機 9‧‧‧Internal loader

9a‧‧‧板卡接部 9a‧‧‧ board interface

9b‧‧‧基板裝載部 9b‧‧‧Substrate loading department

10‧‧‧腔開口部 10‧‧‧ cavity opening

11‧‧‧脫模膜 11‧‧‧ release film

12‧‧‧樹脂成形體 12‧‧‧Resin molded body

21‧‧‧樹脂收容用板 21‧‧‧Resin containment board

21a‧‧‧樹脂供應前板 21a‧‧‧Resin supply front panel

22‧‧‧樹脂收容部 22‧‧‧Resin containment department

23‧‧‧板下方開口部 23‧‧‧ openings under the board

24‧‧‧板周緣部 24‧‧‧Plate peripheral

25‧‧‧樹脂已分散板 25‧‧‧Resin dispersed board

31‧‧‧樹脂材料之分配手段 31‧‧‧Distribution of resin materials

31a‧‧‧放入側分配手段 31a‧‧‧Input side allocation

31b‧‧‧接受供應側分配手段 31b‧‧‧ Accepting supply side allocation

32‧‧‧樹脂材料之放入手段 32‧‧‧Resin means of resin materials

33‧‧‧進給器側之計量手段 33‧‧‧Measuring means on the feeder side

34‧‧‧進料斗 34‧‧‧ Feeding hopper

35‧‧‧線性振動進給器 35‧‧‧Linear vibrating feeder

36‧‧‧板側之計量手段 36‧‧‧Measurement on the side of the board

37‧‧‧開口部 37‧‧‧ openings

38‧‧‧腔底面構件 38‧‧‧ cavity bottom member

39‧‧‧板上方開口部 39‧‧‧ openings above the board

40‧‧‧板裝載部 40‧‧‧Board loading department

41‧‧‧所需之厚度(距離) 41‧‧‧ Required thickness (distance)

42‧‧‧水平移動平坦化機構 42‧‧‧Horizontal mobile flattening mechanism

圖1係概略顯示說明本發明之電子零件之壓縮成形方法之樹脂收容用板與樹脂材料之分配機構的概略立體圖，顯示在該板分配樹脂材料的狀態。 1 is a schematic perspective view showing a distribution mechanism of a resin accommodating plate and a resin material in a compression molding method for an electronic component according to the present invention, and shows a state in which a resin material is dispensed on the plate.

圖2(1)、圖2(2)係概略顯示說明本發明之電子零件之壓縮成形方法之樹脂收容用板的概略立體圖，圖2(1)係顯示在圖1所示之樹脂材料之分配機構中，在板分配樹脂材料的狀態，圖2(2)係顯示在圖1所示之樹脂材料之分配機構中，分配樹脂材料的樹脂已分散板。 2(1) and 2(2) are schematic perspective views showing the resin-receiving sheet for the compression molding method of the electronic component of the present invention, and FIG. 2(1) shows the distribution of the resin material shown in FIG. In the mechanism, in the state in which the resin material is dispensed in the sheet, Fig. 2 (2) shows that the resin-dispensing resin is dispersed in the distribution mechanism of the resin material shown in Fig. 1.

圖3係概略顯示說明本發明之電子零件之壓縮成形方法之電子零件之壓縮成形用金屬模具裝置的概略縱截面圖，顯示將圖2(2)所示之樹脂已分散板供應至該金屬模具裝置的狀態。 3 is a schematic longitudinal cross-sectional view showing a metal mold apparatus for compression molding of an electronic component in a compression molding method for an electronic component according to the present invention, showing that a resin dispersed plate shown in FIG. 2 (2) is supplied to the metal mold. The status of the device.

圖4係概略顯示與圖3對應之電子零件之壓縮成形用金屬模具裝置的概略縱截面圖，顯示將脫模膜吸附被覆於設在該金屬模具裝置(金屬模具)之下模具腔內，據以使樹脂材料從樹脂已分散板落下供應至被覆脫模膜之腔內的狀態。 4 is a schematic longitudinal cross-sectional view showing a metal mold apparatus for compression molding of an electronic component corresponding to FIG. 3, showing that the release film is adsorbed and coated in a mold cavity provided under the metal mold device (metal mold), The resin material is supplied from the resin dispersed plate to the state in which the cavity of the release film is covered.

圖5係概略顯示與圖3對應之電子零件之壓縮成形用金 屬模具裝置(金屬模具)的概略縱截面圖，顯示該金屬模具的閉模狀態。 Fig. 5 is a view schematically showing the gold for compression molding of the electronic component corresponding to Fig. 3; A schematic longitudinal cross-sectional view of a mold device (metal mold) showing the mold closing state of the metal mold.

圖6係概略顯示說明習知電子零件之壓縮成形方法之電子零件之壓縮成形用金屬模具裝置的概略縱截面圖。 Fig. 6 is a schematic longitudinal cross-sectional view showing a metal mold apparatus for compression molding of an electronic component in a compression molding method of a conventional electronic component.

根據本發明，首先，將脫模膜吸附被覆於樹脂收容用板之下面，將開口部之板下方開口部封閉，據以將樹脂收容用板之開口部形成於樹脂收容部，可獲得具有樹脂收容部之樹脂供應前板。 According to the present invention, the release film is adsorbed and coated on the lower surface of the resin-receiving sheet, and the opening below the plate of the opening is closed, whereby the opening of the resin-receiving sheet is formed in the resin accommodating portion, and resin can be obtained. The resin of the accommodating part is supplied to the front plate.

接著，以樹脂材料之分配手段，將所需量之顆粒狀之樹脂材料(顆粒樹脂)從板上方開口部供應至樹脂供應前板之樹脂收容部，以樹脂材料之平坦化手段，將所需量之顆粒樹脂形成為均勻厚度以使其平坦化，藉此能形成將所需量之平坦化之顆粒樹脂收容於樹脂收容部內之樹脂已分散板。 Then, a desired amount of the granular resin material (granular resin) is supplied from the upper opening portion of the upper plate to the resin receiving portion of the resin supply front plate by means of a resin material distribution means, and the resin material is planarized means The amount of the particulate resin is formed into a uniform thickness to be flattened, whereby a resin-dispersed plate in which a desired amount of the planarized particulate resin is housed in the resin containing portion can be formed.

接著，將在內部裝載機之下部側卡接樹脂已分散板且在內部裝載機之上部側安裝所需數目之電子零件之基板，在電子零件構裝面朝向下方之狀態下裝載。 Next, the substrate on which the resin-dispersed plate is attached to the lower side of the internal loader and the required number of electronic components are mounted on the upper side of the internal loader is loaded with the electronic component mounting surface facing downward.

接著，使內部裝載機進入電子零件之壓縮成形用金屬模具之上下兩模具之間。 Next, the internal loader is placed between the upper and lower dies of the metal mold for compression molding of the electronic component.

此時，將安裝電子零件之基板，在電子零件構裝面朝向下方之狀態下供應安裝於上模具之基板安裝部。 At this time, the substrate on which the electronic component is mounted is supplied to the substrate mounting portion mounted on the upper mold with the electronic component mounting surface facing downward.

又，接著，使內部裝載機向下移動，藉此能將樹脂已分散板安裝於下模具之模具面。 Further, the internal loader is moved downward, whereby the resin dispersed plate can be attached to the mold surface of the lower mold.

此時，樹脂已分散板之板下方開口部，係透過脫模膜 與腔之開口部之位置一致。 At this time, the resin has dispersed the opening below the plate, which is passed through the release film. It is in the same position as the opening of the cavity.

又，此時，在樹脂已分散板之樹脂收容部內，所需量之顆粒樹脂係在平坦化狀態下裝載於脫模膜上。 Moreover, at this time, in the resin accommodating portion of the resin-dispersed plate, the required amount of the granule resin is placed on the release film in a flattened state.

又，接著，解除樹脂已分散板之脫模膜之吸附。 Further, the adsorption of the release film of the resin dispersed plate is released.

又，再者，從下模具之模具面與腔內強制吸引排出空氣，據以將脫模膜卡止於下模具面，且將脫模膜拉入腔內以將脫模膜被覆於腔。 Further, the discharge air is forcibly sucked from the mold surface of the lower mold and the cavity, whereby the release film is locked to the lower mold surface, and the release film is pulled into the cavity to cover the release film.

此時，在所需量之平坦化之顆粒樹脂裝載於脫模膜之狀態下，且使脫模膜與所需量之平坦化之顆粒樹脂一起之狀態下(成為一體之狀態下)，將所需量之平坦化之顆粒樹脂拉入下模具腔內以使其落下。 At this time, in a state where the required amount of the planarized particulate resin is loaded on the release film, and the release film is brought together with the desired amount of the planarized granular resin (in an integrated state), The required amount of planarized particulate resin is drawn into the lower mold cavity to cause it to fall.

因此，能將所需量之顆粒樹脂在平坦化之狀態下(均勻厚度之狀態下)供應至被覆脫模膜之下模具腔內。 Therefore, the required amount of the particulate resin can be supplied to the lower mold cavity of the coated release film in a state of being flattened (in a state of uniform thickness).

亦即，使所需量之平坦化之顆粒樹脂與脫模膜一起之狀態下(成為一體之狀態下)，將所需量之平坦化之顆粒樹脂拉入下模具腔內以使其落下，藉此能將所需量之顆粒樹脂在平坦化之狀態下供應至被覆脫模膜之腔內。 That is, a desired amount of the planarized particulate resin is pulled into the lower mold cavity to cause it to fall, in a state where the desired amount of the planarized particulate resin is brought together with the release film (in an integrated state). Thereby, the required amount of the particulate resin can be supplied to the cavity of the coated release film in a flat state.

是以，根據本發明，將樹脂供應至金屬模具腔內時，能高效率將樹脂供應至金屬模具腔內。 Therefore, according to the present invention, when the resin is supplied into the cavity of the metal mold, the resin can be efficiently supplied into the cavity of the metal mold.

又，由於能將所需量之顆粒樹脂在平坦化之狀態下供應至被覆脫模膜之下模具腔內，因此將樹脂供應至金屬模具腔內時，能高效率提昇供應至金屬模具腔內之樹脂量之可靠性。 Moreover, since the required amount of the particulate resin can be supplied to the mold cavity under the release mold film in a flat state, when the resin is supplied into the mold cavity, the supply to the mold cavity can be efficiently improved. The reliability of the amount of resin.

此外，因此，能在被覆脫模膜之腔內對平坦化狀態(具有均勻厚度)之顆粒樹脂均勻加熱以使其熔融化。 Further, therefore, the granular resin in a flattened state (having a uniform thickness) can be uniformly heated to be melted in the cavity in which the release film is coated.

是以，可有效防止在腔內樹脂之一部分硬化而產生殘粉。 Therefore, it is possible to effectively prevent partial hardening of the resin in the cavity to generate residual powder.

(實施例) (Example)

詳細說明實施例(本發明)。 The embodiment (present invention) will be described in detail.

(關於裝載電子零件之壓縮成形用金屬模具之金屬模具裝置之構成) (Configuration of a metal mold device for a metal mold for compression molding of an electronic component)

首先，對裝載實施例所示之電子零件之壓縮成形方法所使用之電子零件之壓縮成形用金屬模具(模具組品)1之電子零件之壓縮成形用金屬模具裝置進行說明。 First, a metal mold device for compression molding of an electronic component for a compression molding metal mold (mold assembly) 1 of an electronic component used in a compression molding method for an electronic component shown in the embodiment will be described.

如圖例所示，在電子零件之壓縮成形用金屬模具裝置，設有電子零件之壓縮成形用金屬模具(模具組品)1、將所需量之顆粒狀之樹脂材料(顆粒樹脂)6與安裝所需數目之電子零件7之基板8(成形前基板)各別或同時供應至該金屬模具1之內部裝載機9、取出以該金屬模具1壓縮成形(樹脂密封成形)之已成形基板(後述樹脂成形體12)之卸載機(未圖示)、及使金屬模具1閉模之閉模機構(未圖示)。 As shown in the example, a metal mold device for compression molding of electronic components is provided with a metal mold for compression molding (mold assembly) for electronic components, and a required amount of granular resin material (particle resin) 6 and mounting. The substrate 8 (pre-formed substrate) of the required number of electronic components 7 is supplied to the internal loader 9 of the metal mold 1 separately or simultaneously, and the formed substrate which is compression-molded (resin-sealed) by the metal mold 1 is taken out (described later) An unloader (not shown) of the resin molded body 12) and a mold closing mechanism (not shown) for closing the mold 1.

是以，以內部裝載機9將所需量之顆粒樹脂6與基板8供應至金屬模具1以進行壓縮成形，藉此能在金屬模具1獲得已成形基板(樹脂成形體12)，且能以卸載機從金屬模具1取出已成形基板。 Therefore, the required amount of the particulate resin 6 and the substrate 8 are supplied to the metal mold 1 by the internal loader 9 to perform compression molding, whereby the formed substrate (resin molded body 12) can be obtained in the metal mold 1, and The unloader takes out the formed substrate from the metal mold 1.

又，如後述，在實施例所示之金屬模具裝置，設有將所需量之顆粒樹脂6供應至以內部裝載機9卡接之樹脂已分散板25並進行分配之樹脂材料之分配手段31。 Further, as will be described later, the metal mold apparatus shown in the embodiment is provided with a dispensing means 31 for supplying a resin resin 6 of a desired amount to the resin dispersed plate 25 which is engaged by the internal loader 9 and dispensing the resin material. .

是以，能以樹脂材料之分配手段31將所需量之顆粒樹脂6供應至樹脂供應前板21a並進行分配以形成後述樹脂已 分散板25(所需量之平坦化之顆粒樹脂6)。 Therefore, the required amount of the particulate resin 6 can be supplied to the resin supply front plate 21a by the distribution means 31 of the resin material and distributed to form a resin which will be described later. Dispersion plate 25 (required amount of planarized particulate resin 6).

(關於電子零件之壓縮成形用金屬模具之構成) (Construction of a metal mold for compression molding of electronic parts)

如圖例所示，在電子零件之壓縮成形用金屬模具(模具組品)1，具備固定上模具2、與上模具2對向配置之可動下模具3。 As shown in the example, the metal mold (mold assembly) 1 for compression molding of an electronic component includes a fixed upper mold 2 and a movable lower mold 3 disposed opposite to the upper mold 2.

又，在上模具2之模具面，設有將安裝所需數目之電子零件7之基板8在電子零件構裝面側朝向下方之狀態下供應安裝之基板安裝部4。 Further, on the mold surface of the upper mold 2, a substrate mounting portion 4 for mounting and mounting the substrate 8 on which the required number of electronic components 7 are mounted is provided with the electronic component mounting surface side facing downward.

又，在下模具3之模具面，壓縮成形用之腔5係以腔開口部10朝向上方(上模具2方向)開口之狀態下設置。 Further, on the mold surface of the lower mold 3, the cavity 5 for compression molding is provided in a state in which the cavity opening portion 10 is opened upward (in the direction of the upper mold 2).

是以，藉由使上下兩模具1(2,3)閉模，據以將安裝於供應安裝至上模具基板安裝部4之基板8之電子零件7嵌裝安裝於下模具腔5內。 Therefore, by closing the upper and lower molds 1 (2, 3), the electronic component 7 attached to the substrate 8 supplied to the upper mold substrate mounting portion 4 is fitted and mounted in the lower mold cavity 5.

又，在上下兩模具1(2,3)，設有將上下兩模具1(2,3)加熱至所需之溫度之加熱手段(未圖示)。 Further, heating means (not shown) for heating the upper and lower molds 1 (2, 3) to a desired temperature are provided in the upper and lower molds 1 (2, 3).

是以，能將以內部裝載機9(後述樹脂已分散板25)供應至下模具腔5內之所需量之顆粒樹脂6，以金屬模具1之加熱手段加熱熔融化。 In other words, the amount of the particulate resin 6 supplied to the lower mold cavity 5 by the internal loader 9 (the resin-dispersed plate 25 to be described later) can be heated and melted by the heating means of the metal mold 1.

又，在腔5之底面設有將腔5內之樹脂6以所需之按壓力按壓之樹脂按壓用之腔底面構件38。 Further, a cavity bottom member 38 for pressing the resin in the cavity 5 with a desired pressing force is provided on the bottom surface of the cavity 5.

是以，以腔底面構件38按壓下模具腔5內之樹脂6，藉此能在下模具腔5內將安裝於基板8之電子零件7壓縮成形(樹脂密封成形)。 Therefore, the resin 6 in the lower mold cavity 5 is pressed by the cavity bottom surface member 38, whereby the electronic component 7 mounted on the substrate 8 can be compression-molded (resin sealing molding) in the lower mold cavity 5.

(關於下模具之脫模膜之吸附機構) (About the adsorption mechanism of the release film of the lower mold)

又，雖未圖示，在下模具3，在下模具面與腔5之面， 設有吸附脫模膜11之脫模膜之吸引機構。 Further, although not shown, in the lower mold 3, on the lower mold surface and the cavity 5, A suction mechanism that adsorbs the release film of the release film 11 is provided.

此外，吸引機構具備例如吸引孔、真空路徑、及真空吸引機構(真空泵)，吸引孔係以能到達下模具3之模具面與腔5之表面之方式設在下模具3內部。 Further, the suction mechanism includes, for example, a suction hole, a vacuum path, and a vacuum suction mechanism (vacuum pump), and the suction hole is provided inside the lower mold 3 so as to reach the surface of the lower mold 3 and the surface of the cavity 5.

是以，使吸引機構作動，將空氣強制吸引排出，藉此能將脫模膜11沿著下模具3之模具面與腔5之面之形狀被覆固定。 Therefore, the suction mechanism 11 is forced to be sucked and discharged, whereby the release film 11 can be covered and fixed along the surface of the mold surface of the lower mold 3 and the surface of the cavity 5.

例如，在下模具3之模具面裝載(平面形狀之)脫模膜11並使吸引機構作動時，首先，在下模具3之模具面卡止脫模膜11，接著，在下模具腔5內吸引脫模膜11將其拉入，藉此能沿著下模具腔5之形狀將脫模膜11被覆固定。 For example, when the release film 11 (in the planar shape) is loaded on the mold surface of the lower mold 3 and the suction mechanism is actuated, first, the release film 11 is locked on the mold surface of the lower mold 3, and then the release mold is sucked in the lower mold cavity 5. The film 11 is pulled in, whereby the release film 11 can be covered and fixed along the shape of the lower mold cavity 5.

此外，根據本發明，如後述，將脫模膜11拉入下模具腔5內被覆時，同時將裝載於後述樹脂已分散板25之脫模膜11之所需量之(如後述，平坦化之)顆粒樹脂6與被拉入下模具腔5內之脫模膜11一起拉入以使其落下，藉此能將所需量之顆粒樹脂6(如後述，在平坦化之狀態下)供應至被覆脫模膜11之腔5內。 Further, according to the present invention, when the release film 11 is pulled into the lower mold cavity 5 as will be described later, the amount of the release film 11 loaded on the resin-dispersed plate 25 to be described later is also required (flattened as will be described later). The particulate resin 6 is pulled together with the release film 11 drawn into the lower mold cavity 5 to be dropped, whereby the desired amount of the particulate resin 6 (as described later, in a flattened state) can be supplied. It is to cover the cavity 5 of the release film 11.

是以，將所需量之顆粒樹脂6供應至被覆脫模膜11之腔5內之後，首先，使上下兩模具1(2,3)閉模，據以將安裝於供應安裝於上模具基板安裝部4之基板8之電子零件7浸漬於在被覆脫模膜11之腔5內加熱熔融化之樹脂6中，接著，以腔底面構件38透過脫模膜11按壓腔5內之樹脂6，藉此能在下模具腔5內之與下模具腔5之形狀對應之樹脂成形體12內將安裝於基板8之電子零件7壓縮成形(樹脂密封成形)。 Therefore, after the required amount of the particulate resin 6 is supplied into the cavity 5 of the coated release film 11, first, the upper and lower molds 1 (2, 3) are closed, and the substrate is mounted on the upper mold substrate. The electronic component 7 of the substrate 8 of the mounting portion 4 is immersed in the resin 6 which is heated and melted in the cavity 5 covering the release film 11, and then the cavity bottom member 38 is pressed through the release film 11 to press the resin 6 in the cavity 5. Thereby, the electronic component 7 mounted on the substrate 8 can be compression-molded (resin-sealed) in the resin molded body 12 corresponding to the shape of the lower mold cavity 5 in the lower mold cavity 5.

(關於樹脂收容用板之構成) (Regarding the structure of the resin storage board)

接著，對將所需量之顆粒樹脂6供應至本發明之下模具腔5內之樹脂收容用板21(樹脂供應前板21a)之構成進行說明。 Next, a configuration in which the required amount of the particulate resin 6 is supplied to the resin containing plate 21 (resin supply front plate 21a) in the mold cavity 5 of the present invention will be described.

在樹脂收容用板21設有貫通於上下方向之開口部37、及形成於開口部37周圍之板周緣部24(外框部)。 The resin accommodation plate 21 is provided with an opening 37 that penetrates in the vertical direction and a peripheral edge portion 24 (outer frame portion) formed around the opening 37.

又，在開口部37，設有設於板上方側之板上方開口部39及設於板下方側之板下方開口部23。 Further, the opening portion 37 is provided with a plate upper opening portion 39 provided on the upper side of the plate and a plate lower opening portion 23 provided on the lower side of the plate.

又，雖未圖示，在板周緣部24之下面設有吸附固定脫模膜11之脫模膜吸附固定機構。 Further, although not shown, a release film adsorption fixing mechanism that adsorbs and fixes the release film 11 is provided on the lower surface of the peripheral edge portion 24 of the plate.

以脫模膜吸附固定機構將脫模膜11吸附固定於板周緣部24之下面，藉此能以脫模膜11將板下方開口部23(開口部37)封閉。 The release film 11 is adsorbed and fixed to the lower surface of the peripheral edge portion 24 of the plate by the release film adsorption fixing means, whereby the lower plate opening portion 23 (opening portion 37) can be closed by the release film 11.

亦即，以脫模膜11將開口部37之板下方開口部23封閉，據以形成具有能收容所需量之顆粒樹脂6之凹部之樹脂收容部22。 In other words, the opening 23 of the lower portion of the opening 37 is closed by the release film 11, and a resin accommodating portion 22 having a concave portion capable of accommodating a desired amount of the particulate resin 6 is formed.

又，以脫模膜11形成樹脂收容部22，藉此能獲得具有樹脂收容部22之樹脂供應前板21a。亦即，具有樹脂收容部22之樹脂供應前板21a，係由樹脂收容用板21與脫模膜11構成。 Moreover, the resin accommodating portion 22 is formed by the release film 11, whereby the resin supply front plate 21a having the resin accommodating portion 22 can be obtained. In other words, the resin supply front plate 21a having the resin accommodating portion 22 is composed of the resin accommodating plate 21 and the release film 11.

是以，如後述，能以樹脂材料之分配手段31將所需量之顆粒樹脂6從板上方開口部39供應至樹脂供應前板21a之樹脂收容部22。 Therefore, as will be described later, the required amount of the particulate resin 6 can be supplied from the upper plate opening portion 39 to the resin containing portion 22 of the resin supply front plate 21a by the resin material distributing means 31.

又，板下方、上方開口部23,39之(平面上之)形狀係與腔開口部10之(平面上之)形狀對應形成。 Further, the shape of the lower opening portions 23, 39 (in the plane) of the lower portion of the plate is formed corresponding to the shape of the cavity opening portion 10 (on the plane).

例如，腔開口部10之形狀形成為矩形，且開口部37之板下方、上方開口部23,39之形狀與矩形之腔開口部10之形狀對應形成。 For example, the shape of the cavity opening portion 10 is formed in a rectangular shape, and the shape of the lower portion of the opening portion 37 and the upper opening portion 23, 39 is formed corresponding to the shape of the rectangular cavity opening portion 10.

(關於樹脂材料之分配手段之構成) (Regarding the composition of the distribution means of the resin material)

實施例中，以圖1所示之樹脂材料之分配手段(樹脂材料之計量供應平坦化手段)31計算所需量之顆粒樹脂6之量並供應放入樹脂供應前板21a之樹脂收容部22內，且在樹脂供應前板21a之樹脂收容部22，以均勻厚度(每單位面積一定量之樹脂量)將顆粒樹脂6平坦化，藉此能將所需量之平坦化之顆粒樹脂6分配於樹脂供應前板21a之樹脂收容部22。 In the embodiment, the amount of the desired amount of the particulate resin 6 is calculated by the dispensing means of the resin material shown in Fig. 1 (the gauge supply flattening means of the resin material) 31 and supplied to the resin containing portion 22 of the resin supply front plate 21a. Further, in the resin accommodating portion 22 of the resin supply front plate 21a, the granular resin 6 is planarized with a uniform thickness (a certain amount of resin per unit area), whereby the desired amount of the planarized granule resin 6 can be distributed. The resin accommodating portion 22 of the front plate 21a is supplied to the resin.

此外，在樹脂材料之分配手段31設有樹脂材料之放入側分配手段31a與樹脂材料之接受供應側分配手段31b。 Further, the resin material distributing means 31 is provided with a resin-side placing side dispensing means 31a and a resin material receiving side distributing means 31b.

(關於樹脂材料之放入側分配手段) (About the dispensing side of the resin material)

如圖1所示，樹脂材料之放入側分配手段31a，係由將所需量之顆粒樹脂6供應放入至樹脂供應前板21a之樹脂收容部22之樹脂材料之放入手段(樹脂材料之供應手段)32、及計算放入至樹脂供應前板21a之樹脂收容部22之所需量之顆粒樹脂6之量之樹脂材料之進給器側計量手段(測力計)33構成。 As shown in Fig. 1, the placing side dispensing means 31a of the resin material is a means for placing a resin material which is supplied to the resin accommodating portion 22 of the resin supply front plate 21a by supplying a desired amount of the granule resin 6 (resin material) The supply means 32) and a feeder-side measuring means (dynamometer) 33 for calculating the amount of the resin resin 6 to be placed in the resin containing portion 22 of the resin supply front plate 21a.

又，如圖1所示，在樹脂材料之放入手段32，設有顆粒樹脂之進料斗34、及在樹脂供應前板21a之樹脂收容部22以適當振動手段(未圖示)使顆粒樹脂6一邊振動一邊移動放入之線性振動進給器35。 Further, as shown in Fig. 1, the resin material charging means 32 is provided with a pellet resin hopper 34 and a resin accommodating portion 22 of the resin supply front plate 21a by a suitable vibration means (not shown) to make the granule resin. 6 The linear vibrating feeder 35 is moved while being vibrated.

又，供應放入顆粒樹脂6時，能以進給器側計量手段(測 力計)33計算供應放入至樹脂供應前板21a之樹脂收容部22之顆粒樹脂6之量。 Moreover, when the pellet resin 6 is supplied, it can be measured by the feeder side (measurement) The force meter 33 calculates the amount of the particulate resin 6 supplied to the resin containing portion 22 of the resin supply front plate 21a.

是以，在樹脂材料之放入側分配手段31a，以線性振動進給器35使來自進料斗34之顆粒樹脂6一邊振動一邊移動，藉此能將所需量之顆粒樹脂6(例如，少量逐次)供應放入至樹脂供應前板21a之樹脂收容部22。 In the insertion side distribution means 31a of the resin material, the linear resin feeder 35 moves the granular resin 6 from the feed hopper 34 while vibrating, whereby the required amount of the granular resin 6 can be obtained (for example, a small amount). The resin accommodating portion 22 placed in the resin supply front plate 21a is supplied successively.

此外，例如，在線性振動進給器35，使顆粒樹脂6振動，據以將每單位時間一定量之樹脂量供應放入至樹脂供應前板21a之樹脂收容部22亦可。 Further, for example, in the linear vibrating feeder 35, the granular resin 6 is vibrated, and accordingly, a predetermined amount of the resin amount per unit time may be supplied to the resin accommodating portion 22 of the resin supply front plate 21a.

(關於樹脂材料之接受供應側分配手段) (About the supply side distribution means of the resin material)

如圖1所示，在樹脂材料之接受供應側分配手段31b，設有以樹脂收容用板21之脫模膜吸附固定機構將脫模膜11吸附固定於樹脂收容用板21之下面側以形成具有樹脂收容部22之樹脂供應前板21a之樹脂供應前板形成手段(未圖示)、裝載樹脂供應前板21a之板裝載台40、將樹脂供應前板21a從樹脂供應前板形成手段裝載至板裝載台40之板移動裝載手段(未圖示)、及以所需之厚度使從樹脂材料之放入側分配手段31a之線性振動進給器35供應至裝載於板裝載台40之樹脂供應前板21a之樹脂收容部22之所需量之顆粒樹脂6平坦化之樹脂材料之平坦化手段(例如，後述樹脂材料之水平移動平坦化機構42)。 As shown in Fig. 1, the release-receiving means 31b of the resin material is provided with a release film adsorption fixing means for the resin-receiving plate 21, and the release film 11 is adsorbed and fixed to the lower surface side of the resin-receiving plate 21 to form A resin supply front plate forming means (not shown) having a resin supply front plate 21a of the resin accommodating portion 22, a plate loading table 40 on which the resin supply front plate 21a is loaded, and a resin supply front plate 21a loaded from the resin supply front plate forming means The plate loading means (not shown) to the plate loading table 40, and the linear vibrating feeder 35 from the resin-side insertion side distributing means 31a are supplied to the resin loaded on the plate loading table 40 at a desired thickness. A flattening means for flattening the resin material (for example, a horizontal movement flattening mechanism 42 of a resin material to be described later) for supplying the required amount of the resin resin 6 to the resin accommodating portion 22 of the front plate 21a.

是以，在樹脂材料之接受供應側分配手段31b，首先，以樹脂供應前板形成手段形成具有樹脂收容部22之樹脂供應前板21a，且以板移動裝載手段將樹脂供應前板21a裝載至板裝載台40，接著，使所需量之顆粒樹脂6一邊振動一 邊移動以從線性振動進給器35供應至樹脂供應前板21a之樹脂收容部22。 In the supply-side distribution means 31b of the resin material, first, the resin supply front plate 21a having the resin storage portion 22 is formed by the resin supply front plate forming means, and the resin supply front plate 21a is loaded by the plate movement loading means. The plate loading table 40, and then, the required amount of the granular resin 6 is vibrated one side It is moved to be supplied from the linear vibrating feeder 35 to the resin accommodating portion 22 of the resin supply front plate 21a.

此時，藉由樹脂材料之平坦化手段(水平移動平坦化機構42)與線性振動進給器35之共同運轉作業，能以所需之均勻厚度41使供應至樹脂收容部22之所需量之顆粒樹脂6平坦化。 At this time, by the operation of the flattening means of the resin material (the horizontal movement flattening mechanism 42) and the linear vibration feeder 35, the required amount supplied to the resin containing portion 22 can be made with the required uniform thickness 41. The granular resin 6 is flattened.

(關於樹脂材料之平坦化手段) (about the flattening means of resin materials)

在樹脂材料之接受供應側分配手段31b，作為樹脂材料之平坦化手段，例如設有水平移動平坦化機構42。 In the supply-side distribution means 31b of the resin material, as the flattening means of the resin material, for example, a horizontal movement flattening means 42 is provided.

亦即，能以水平移動平坦化機構42使裝載於板裝載台40之樹脂供應前板21a在水平方向、亦即圖1所示之X方向或Y方向各別或同時移動。 That is, the resin supply front plate 21a loaded on the plate loading table 40 can be moved in the horizontal direction, that is, in the X direction or the Y direction shown in FIG. 1 by the horizontal movement flattening mechanism 42.

是以，能使所需量之顆粒樹脂6一邊振動一邊移動以從線性振動進給器35供應至裝載於板裝載台40之樹脂供應前板21a之樹脂收容部22。 Therefore, the desired amount of the particulate resin 6 can be moved while being vibrated to be supplied from the linear vibrating feeder 35 to the resin containing portion 22 of the resin supply front plate 21a loaded on the plate loading table 40.

又，此時，以水平移動平坦化機構42使樹脂供應前板21a移動於X方向或Y方向，藉此能在樹脂收容部22內以所需之均勻厚度41(參照圖3)使所需量之顆粒樹脂6平坦化(每單位面積形成一定量之樹脂量)，以形成樹脂已分散板25。 Further, at this time, the resin supply front plate 21a is moved in the X direction or the Y direction by the horizontal movement flattening mechanism 42, whereby the desired uniform thickness 41 (see Fig. 3) can be made in the resin containing portion 22. The amount of the particulate resin 6 is planarized (a certain amount of resin is formed per unit area) to form a resin dispersed plate 25.

(關於內部裝載機之構成) (about the composition of the internal loader)

在內部裝載機9，卡接樹脂已分散板25(亦即，在以脫模膜11形成之樹脂收容部22收容所需量之平坦化之顆粒樹脂6之樹脂收容用板21)之板卡接部9a係設於內部裝載機下部側。 In the internal loader 9, the card is bonded to the resin-dispersed plate 25 (that is, the resin accommodating portion 22 of the flattened granular resin 6 is accommodated in the resin accommodating portion 22 formed by the release film 11). The joint portion 9a is provided on the lower side of the internal loader.

又，在內部裝載機9，在電子零件7朝向下方之狀態下裝載基板8之基板裝載部9b係設於內部裝載機上部側。 Further, in the internal loader 9, the substrate loading portion 9b on which the substrate 8 is mounted with the electronic component 7 facing downward is attached to the upper portion of the internal loader.

是以，使內部裝載機9進入上下兩模具1(2,3)之間，使基板8向上移動，藉此能將安裝電子零件7之基板8在電子零件構裝面側朝向下方之狀態下供應安裝於上模具2之基板安裝部4。 Therefore, the internal loader 9 is moved between the upper and lower molds 1 (2, 3) to move the substrate 8 upward, whereby the substrate 8 on which the electronic component 7 is mounted can be directed downward toward the electronic component mounting surface side. The substrate mounting portion 4 mounted on the upper mold 2 is supplied.

又，使內部裝載機9進入上下兩模具1(2,3)之間，使內部裝載機9向下移動，藉此能使樹脂收容用板21之板下方開口部23之位置透過脫模膜11與下模具3之腔開口部10之位置一致。 Further, the internal loader 9 is moved between the upper and lower dies 1 (2, 3) to move the internal loader 9 downward, whereby the position of the lower opening portion 23 of the resin accommodating plate 21 can be transmitted through the release film. 11 coincides with the position of the cavity opening portion 10 of the lower mold 3.

此時，在下模具3之模具面與樹脂收容用板21之下面之間挾持脫模膜11。 At this time, the release film 11 is held between the mold surface of the lower mold 3 and the lower surface of the resin storage sheet 21.

又，此時，能解除設於樹脂收容用板21之下面之脫模膜吸附固定機構之脫模膜之吸附。 Moreover, at this time, the adsorption of the release film of the release film adsorption fixing means provided in the lower surface of the resin accommodation board 21 can be canceled.

又，再者，以設於下模具3之模具面與腔5之面之吸引機構吸引，藉此能在下模具3之模具面卡止脫模膜11，且將脫模膜11拉入下模具腔5內，將脫模膜11被覆於腔5之面。 Further, by suctioning the suction means provided on the surface of the lower mold 3 and the surface of the cavity 5, the release film 11 can be locked on the mold surface of the lower mold 3, and the release film 11 can be pulled into the lower mold. In the cavity 5, the release film 11 is coated on the surface of the cavity 5.

此時，在樹脂已分散板25之樹脂收容部22(開口部37)內裝載於脫模膜11之所需量之平坦化之顆粒樹脂6，係與被拉入腔5內之脫模膜11一起落下至腔5內。 At this time, the required amount of the planarized particulate resin 6 loaded on the release film 11 in the resin accommodating portion 22 (opening portion 37) of the resin-dispersed plate 25 is a release film that is pulled into the cavity 5. 11 fell together into the cavity 5.

亦即，能將所需量之平坦化之顆粒樹脂6(一次)供應至被覆脫模膜11之腔5內。 That is, the desired amount of the planarized particulate resin 6 (once) can be supplied into the cavity 5 of the coated release film 11.

是以，在被覆脫模膜11之腔5內，能將所需量之顆粒樹脂6之厚度形成為均勻。 Therefore, the thickness of the desired amount of the particulate resin 6 can be made uniform in the cavity 5 covering the release film 11.

(關於脫模膜) (About release film)

本發明所使用之脫模膜11(短帶狀之脫模膜)，係將長帶狀之脫模膜(捲物狀之脫模膜)預先切斷(預切斷)成所需長度而準備者。 The release film 11 (short-belt release film) used in the present invention is obtained by cutting (pre-cutting) a long strip-shaped release film (rolled release film) into a desired length. Preparer.

因此，相較於每當將顆粒樹脂6供應至樹脂供應前板21a時將裝填於金屬模具裝置之捲物狀之脫模膜(長帶狀之脫模膜)切斷成脫模膜11(短帶狀之脫模膜)之金屬模具裝置，可省略將捲物狀之脫模膜裝填於金屬模具裝置之手段。 Therefore, the release film (long strip-shaped release film) loaded in the metal mold device is cut into the release film 11 as compared with the case where the granular resin 6 is supplied to the resin supply front plate 21a ( In the metal mold apparatus of the short strip-shaped release film, the means for loading the roll-shaped release film to the metal mold apparatus can be omitted.

是以，相較於裝填捲物狀之脫模膜之金屬模具裝置之尺寸，能使本發明之金屬模具裝置整體之尺寸小型化。 Therefore, the size of the entire metal mold apparatus of the present invention can be reduced in size compared to the size of the metal mold apparatus for the release film-like release film.

(關於電子零件之壓縮成形方法) (About compression forming method for electronic parts)

首先，將脫模膜11吸附被覆於樹脂收容用板21之下面側，將開口部37之板下方開口部23封閉以形成樹脂收容部22，據以形成具有樹脂收容部22之樹脂供應前板21a(參照圖2(1)~(2)、圖3)。 First, the release film 11 is adsorbed and coated on the lower surface side of the resin accommodation plate 21, and the lower plate opening portion 23 of the opening portion 37 is closed to form the resin accommodation portion 22, whereby the resin supply front plate having the resin accommodation portion 22 is formed. 21a (refer to Fig. 2 (1) ~ (2), Fig. 3).

接著，如圖1所示，在樹脂材料之分配手段31，將樹脂供應前板21a裝載於板台40上。 Next, as shown in FIG. 1, the resin supply front plate 21a is placed on the pallet 40 in the resin material distributing means 31.

此時，在樹脂收容用板21與板台40之間挾持脫模膜11。 At this time, the release film 11 is held between the resin accommodation plate 21 and the plate stage 40.

接著，在樹脂材料之分配手段31，以樹脂材料之放入側分配手段31a側之進給器側計量手段(測力計)33計算所需量之顆粒樹脂6之量，且使所需量之顆粒樹脂6一邊振動一邊移動以從進料斗34通過線性振動進給器35自板上方開口部39供應至樹脂供應前板21a之樹脂收容部22。 Then, in the resin material distributing means 31, the amount of the desired amount of the particulate resin 6 is calculated by the feeder-side measuring means (dynamometer) 33 on the side of the resin-side placing side dispensing means 31a, and the required amount is made. The particulate resin 6 is moved while being vibrated to be supplied from the feed hopper 34 through the linear vibration feeder 35 from the upper opening portion 39 to the resin accommodating portion 22 of the resin supply front plate 21a.

此時，在樹脂材料之接受供應側分配手段31b側，以水 平移動平坦化機構42(樹脂材料之平坦化手段)使裝載於板裝載台40之樹脂供應前板21a在X方向或Y方向各別或同時移動，藉此能使一邊振動一邊供應至樹脂供應前板21a之樹脂收容部22內之所需量之顆粒樹脂6在樹脂供應前板21a之樹脂收容部22內平坦化，將顆粒樹脂6之厚度形成為均勻(參照圖2(1)~(2)、圖3)。 At this time, on the side of the resin supply receiving side distribution means 31b, water is used. The flat movement flattening mechanism 42 (the flattening means of the resin material) moves the resin supply front plate 21a mounted on the plate loading table 40 in the X direction or the Y direction, respectively, or simultaneously, thereby being supplied to the resin supply while vibrating. The required amount of the particulate resin 6 in the resin accommodating portion 22 of the front plate 21a is flattened in the resin accommodating portion 22 of the resin supply front plate 21a, and the thickness of the granule resin 6 is formed to be uniform (refer to Fig. 2 (1) - ( 2), Figure 3).

是以，在樹脂材料之分配手段31，使所需量之顆粒樹脂6一邊振動一邊供應至裝載於板台40上之樹脂供應前板21a之樹脂收容部22內並使其平坦化，藉此能形成樹脂已分散板25。 In the resin material distributing means 31, the required amount of the particulate resin 6 is supplied to the resin accommodating portion 22 of the resin supply front plate 21a mounted on the pallet 40 while being vibrated, and is flattened. The resin-dispersed plate 25 can be formed.

此外，在此樹脂已分散板25，能在開口部37之板下方開口部23側之脫模膜11上(樹脂收容部22內之脫模膜11上)裝載所需量之平坦化之顆粒樹脂6之狀態下(裝載具有所需量之均勻厚度之顆粒樹脂6之狀態下)形成。 Further, in the resin-dispersed plate 25, the desired amount of flattened particles can be loaded on the release film 11 on the opening portion 23 side of the opening portion 37 (on the release film 11 in the resin containing portion 22). It is formed in the state of the resin 6 in a state in which the particulate resin 6 having a uniform thickness of a desired amount is loaded.

接著，如圖3所示，將樹脂已分散板25卡接於內部裝載機9之板卡接部9a，且將安裝電子零件7之基板8裝載於內部裝載機9之基板裝載部9b。 Next, as shown in FIG. 3, the resin dispersion plate 25 is engaged with the board engaging portion 9a of the internal loader 9, and the substrate 8 on which the electronic component 7 is mounted is mounted on the substrate loading portion 9b of the internal loader 9.

接著，使內部裝載機9進入上下兩模具1(2,3)之間，且使基板8向上移動，據以將安裝電子零件7之基板8在電子零件構裝面朝向下方之狀態下供應安裝於上模具2之基板安裝部4。 Next, the internal loader 9 is moved between the upper and lower molds 1 (2, 3), and the substrate 8 is moved upward, whereby the substrate 8 on which the electronic component 7 is mounted is supplied and mounted with the electronic component mounting surface facing downward. The substrate mounting portion 4 of the upper mold 2.

又，接著，使內部裝載機9向下移動，據以將樹脂已分散板25裝載於下模具3之模具面。 Further, next, the internal loader 9 is moved downward, whereby the resin dispersed plate 25 is placed on the mold surface of the lower mold 3.

此時，能使樹脂已分散板25之板下方開口部23透過脫模膜11與腔5之開口部10一致。 At this time, the opening 23 below the plate of the resin dispersed plate 25 can be passed through the release film 11 to coincide with the opening 10 of the cavity 5.

又，此時，在樹脂已分散板25之樹脂收容部22內，所需量之顆粒樹脂6係在平坦化之狀態下裝載於脫模膜11上。 Moreover, at this time, in the resin accommodating portion 22 of the resin-dispersed plate 25, the required amount of the particulate resin 6 is placed on the release film 11 in a flat state.

接著，解除樹脂已分散板25之脫模膜吸附固定機構之脫模膜11之吸附。 Next, the adsorption of the release film 11 of the release film adsorption fixing means of the resin dispersed plate 25 is released.

又，接著，如圖4所示，使下模具3側之吸引機構作動，據以從下模具3之模具面與下模具腔5之面將空氣強制吸引排出。 Then, as shown in FIG. 4, the suction mechanism on the lower mold 3 side is actuated, whereby air is forcibly sucked and discharged from the surface of the lower mold 3 and the surface of the lower mold cavity 5.

此時，在將脫模膜11卡止於下模具3之模具面之狀態下，能將脫模膜11拉入下模具腔5內，沿著腔5之形狀被覆脫模膜11。 At this time, in a state where the release film 11 is locked to the mold surface of the lower mold 3, the release film 11 can be pulled into the lower mold cavity 5, and the release film 11 can be covered along the shape of the cavity 5.

又，此時，如圖4所示，在樹脂已分散板25之樹脂收容部22內，在裝載於脫模膜11上之所需量之平坦化之顆粒樹脂6與脫模膜11一起之狀態下，將所需量之平坦化之顆粒樹脂6拉入並使其落下至下模具腔5內。 Further, at this time, as shown in FIG. 4, in the resin accommodating portion 22 of the resin-dispersed plate 25, the required amount of the planarized granule resin 6 and the release film 11 are placed on the release film 11. In the state, the desired amount of the planarized particulate resin 6 is pulled in and dropped into the lower mold cavity 5.

又，此時，在所需量之顆粒樹脂6為平坦化之狀態下，亦即在使顆粒樹脂6之厚度為均勻之狀態下，能夠供應至被覆脫模膜11之下模具腔5內。 Further, at this time, in a state where the required amount of the particulate resin 6 is flattened, that is, in a state where the thickness of the particulate resin 6 is uniform, it can be supplied into the lower mold cavity 5 of the coated release film 11.

是以，此時，在將所需量之平坦化之顆粒樹脂6裝載於脫模膜11上之狀態下，且使所需量之平坦化之顆粒樹脂6與脫模膜11一起之狀態下(成為一體之狀態下)，能在平坦化之狀態下(均勻厚度之狀態下)使所需量之顆粒樹脂6落下(一次)供應至下模具腔5內。 In this case, in a state where the desired amount of the planarized particulate resin 6 is loaded on the release film 11, and the desired amount of the planarized particulate resin 6 is brought together with the release film 11, (In the state of being integrated), the desired amount of the particulate resin 6 can be dropped (once) into the lower mold cavity 5 in a flattened state (in a state of uniform thickness).

亦即，本發明，係將安裝有樹脂已分散板25之內部裝載機9(樹脂材料供應機構)之樹脂已分散板25之板下方開口部23裝載於下模具3(腔開口部10)之構成，能將所需量 之平坦化之顆粒樹脂6高效率供應至被覆脫模膜11之下模具腔5內。 In the present invention, the lower opening portion 23 of the resin-dispersed plate 25 of the internal loader 9 (resin material supply mechanism) to which the resin-dispersed plate 25 is attached is placed in the lower mold 3 (cavity opening portion 10). Composition, can The planarized particulate resin 6 is efficiently supplied into the mold cavity 5 below the release mold release film 11.

又，本發明，由於能在平坦化之狀態下(均勻厚度之狀態下)將所需量之顆粒樹脂6供應至被覆脫模膜11之下模具腔5內，因此如習知例所示，可有效防止樹脂之一部分92卡住擋門90而殘留在供應機構89。 Further, in the present invention, since the required amount of the particulate resin 6 can be supplied to the lower mold cavity 5 of the coated release film 11 in a state of being flattened (in a state of uniform thickness), as shown in the conventional example, It is possible to effectively prevent one of the resin portions 92 from catching the shutter 90 and remaining in the supply mechanism 89.

是以，根據本發明，不需要習知例所示之擋門90，消除了顆粒樹脂84之一部分92殘留在供應機構89側之習知例之缺陷。 Therefore, according to the present invention, the shutter 90 shown in the conventional example is not required, and the drawback of the conventional example in which one portion 92 of the granular resin 84 remains on the side of the supply mechanism 89 is eliminated.

此外，因此，本發明，能將所需量之平坦化之顆粒樹脂6(與脫模膜11一起一次)供應至被覆脫模膜11之腔5內。 Further, therefore, in the present invention, the required amount of the planarized particulate resin 6 (together with the release film 11) can be supplied into the cavity 5 of the coated release film 11.

接著，於被覆脫模膜11之腔5內使所需量之顆粒樹脂6在平坦化之狀態下加熱熔融化。 Next, the desired amount of the particulate resin 6 is heated and melted in a flat state in the cavity 5 covering the release film 11.

此時，由於能在平坦化之狀態下(均勻厚度之狀態下)將所需量之顆粒樹脂6供應至被覆脫模膜11之下模具腔5內，因此於被覆脫模膜11之下模具腔5內能(例如，從腔底面側)均勻加熱所需量之顆粒樹脂6以使其熔融化。 At this time, since the required amount of the particulate resin 6 can be supplied to the lower mold cavity 5 of the coated release film 11 in a state of being flattened (in a state of uniform thickness), the mold is coated under the release film 11 The inside of the chamber 5 can be uniformly heated (for example, from the side of the bottom surface of the chamber) to a desired amount of the particulate resin 6 to be melted.

是以，相較於不均勻地將顆粒樹脂6供應至下模具腔5內之情形，可有效防止因顆粒樹脂6不均勻地加熱熔融化而一部分硬化而成為殘粉(例如，較小之硬化樹脂之粒)。 Therefore, compared with the case where the granular resin 6 is unevenly supplied into the lower mold cavity 5, it is possible to effectively prevent the particulate resin 6 from being unevenly heated and melted and partially hardened to become a residual powder (for example, less hardening). Resin grain).

接著，使下模具3往上移動以使上下兩模具2,3閉模，據以將安裝於供應安裝至上模具基板安裝部4之基板8之電子零件7浸漬於下模具腔5內之加熱熔融化之樹脂6，且以腔底面構件38按壓腔5內之樹脂。 Next, the lower mold 3 is moved upward to close the upper and lower molds 2, 3, whereby the electronic component 7 attached to the substrate 8 supplied to the upper mold substrate mounting portion 4 is immersed in the lower mold cavity 5 for heating and melting. The resin 6 is pressed, and the resin in the cavity 5 is pressed by the cavity bottom member 38.

經過硬化所需時間後，藉由使上下兩模具2,3開模， 藉此能在腔5內之與腔5之形狀對應之樹脂成形體12內將安裝於基板8之電子零件7壓縮成形(樹脂密封成形)。 After the time required for hardening, by opening the upper and lower molds 2, 3, Thereby, the electronic component 7 mounted on the substrate 8 can be compression-molded (resin-sealed) in the resin molded body 12 corresponding to the shape of the cavity 5 in the cavity 5.

亦即，如上述，能以樹脂材料之分配手段31將所需量之顆粒樹脂6供應至樹脂供應前板21a之樹脂收容部22並使其平坦化，以形成樹脂已分散板25。 That is, as described above, the required amount of the particulate resin 6 can be supplied to the resin accommodating portion 22 of the resin supply front plate 21a by the distribution means 31 of the resin material and planarized to form the resin dispersed plate 25.

又，如上述，在樹脂已分散板25之樹脂收容部22內將裝載於脫模膜11上之所需量之平坦化之顆粒樹脂6與脫模膜11一起拉入腔5內並使其落下，藉此能在平坦化之狀態下(使所需量之顆粒樹脂6形成為均勻厚度之狀態下)將所需量之顆粒樹脂6供應至被覆脫模膜11之腔5內。 Further, as described above, the desired amount of the planarized particulate resin 6 loaded on the release film 11 is pulled into the cavity 5 together with the release film 11 in the resin accommodating portion 22 of the resin-dispersed plate 25, and By dropping, the desired amount of the particulate resin 6 can be supplied into the cavity 5 of the coated release film 11 in a state of being flattened (in a state where the desired amount of the particulate resin 6 is formed into a uniform thickness).

是以，根據本發明，藉由將所需量之平坦化之顆粒樹脂6與脫模膜11一起拉入腔5內並使其落下，能在平坦化之狀態下將所需量之顆粒樹脂6供應至被覆脫模膜11之腔5內，因此可達到將樹脂供應至金屬模具腔內時，能高效率將樹脂供應至金屬模具腔5內之優異效果。 Therefore, according to the present invention, by pulling the desired amount of the planarized particulate resin 6 into the cavity 5 together with the release film 11, and dropping it, the desired amount of the granular resin can be obtained in a flattened state. 6 is supplied into the cavity 5 covering the release film 11, so that an excellent effect of supplying the resin into the mold cavity 5 with high efficiency when the resin is supplied into the cavity of the metal mold can be achieved.

又，根據本發明，如上述，由於能在平坦化之狀態下將所需量之顆粒樹脂6供應至被覆脫模膜11之腔5內，因此可達到將樹脂供應至金屬模具腔5內時，能高效率提昇供應至金屬模具腔5內之樹脂量之可靠性之優異效果。 Further, according to the present invention, as described above, since the required amount of the particulate resin 6 can be supplied into the cavity 5 of the coated release film 11 in a flattened state, it is possible to supply the resin into the cavity 3 of the mold. The superior effect of the reliability of the amount of the resin supplied into the metal mold cavity 5 can be improved with high efficiency.

本發明並不限於上述實施例，在不違背本發明思想之範圍內，可視需要任意且適當地進行變更並加以選擇採用。 The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed and selected and used as needed within the scope of the inventive concept.

(關於其他樹脂材料之計量手段) (measurement means for other resin materials)

在樹脂材料之接受供應側分配手段31b，設有計算供應放入至樹脂供應前板21a之樹脂收容部22之所需量之顆粒樹脂6之量之樹脂材料之板側計量手段(測力計)36。 The supply side distribution means 31b of the resin material is provided with a plate side measuring means (dynamometer) for calculating the amount of the resin material 6 to be supplied to the resin containing portion 22 of the resin supply front plate 21a. ) 36.

是以，在樹脂材料之接受供應側分配手段31b側，能以樹脂材料之板側計量手段36計算供應至樹脂供應前板21a之樹脂收容部22之顆粒樹脂6之量。 The amount of the particulate resin 6 supplied to the resin containing portion 22 of the resin supply front plate 21a can be calculated by the plate side measuring means 36 of the resin material on the side of the supply side distribution means 31b of the resin material.

此外，關於顆粒樹脂6之計量，可併用樹脂材料之放入側分配手段31a之進給器側計量手段33之計量步驟與樹脂材料之接受供應側分配手段31b之板側計量手段36之計量步驟。 Further, with respect to the measurement of the particulate resin 6, the metering step of the feeder-side metering means 33 of the resin-side inlet-side dispensing means 31a and the metering step of the sheet-side metering means 36 of the resin-side receiving-side dispensing means 31b may be used in combination. .

又，採用僅實施該等兩計量步驟之任一者之構成亦可。 Further, it is also possible to adopt a configuration in which only one of the two measuring steps is performed.

(關於其他樹脂材料之平坦化手段) (about the flattening means of other resin materials)

又，在樹脂材料之接受供應側分配手段31b，設有作為樹脂材料之平坦化手段之樹脂材料之振動均勻化手段(未圖示)，其係使從線性振動進給器35放入至樹脂收容部22內之顆粒樹脂6(與樹脂供應前板21a一起)振動並使該顆粒樹脂6各別或同時在X方向或Y方向移動，據以在樹脂收容部22內使顆粒樹脂6平坦化並使顆粒樹脂6之厚度均勻化。 In addition, the resin material supply-side distribution means 31b is provided with a vibration equalizing means (not shown) of a resin material as a flattening means for the resin material, which is placed in the resin from the linear vibrating feeder 35. The particulate resin 6 (together with the resin supply front plate 21a) in the accommodating portion 22 vibrates and moves the granular resin 6 in the X direction or the Y direction, respectively, whereby the granular resin 6 is planarized in the resin accommodating portion 22. The thickness of the particulate resin 6 is made uniform.

亦即，在樹脂材料之接受供應側分配手段31b，以振動均勻化手段使樹脂供應前板21a振動，藉此能使供應放入至樹脂供應前板21a之樹脂收容部22之顆粒樹脂6在X方向或Y方向移動。 In other words, the resin supply front side plate 21a is vibrated by the vibration equalizing means at the supply-side supply means 31b of the resin material, whereby the granular resin 6 supplied to the resin containing portion 22 of the resin supply front plate 21a can be supplied. Move in the X or Y direction.

此時，使供應至樹脂收容部22之顆粒樹脂6在X方向或Y方向移動並使其平坦化，藉此能在樹脂收容部22內使顆粒樹脂6之厚度均勻化。 At this time, the granular resin 6 supplied to the resin accommodating portion 22 is moved and flattened in the X direction or the Y direction, whereby the thickness of the granular resin 6 can be made uniform in the resin accommodating portion 22.

是以，能形成具有供應有所需量之平坦化之顆粒樹脂6(具有均勻厚度之顆粒樹脂6)之樹脂收容部22(開口部37)之樹脂已分散板25。 In other words, the resin-dispersed plate 25 having the resin accommodating portion 22 (opening portion 37) to which the desired amount of the planarized particulate resin 6 (the particulate resin 6 having a uniform thickness) is supplied can be formed.

又，在樹脂材料之放入手段32(線性振動進給器35)，使顆粒樹脂6振動，藉此能以每單位時間一定量之樹脂量放入至樹脂供應前板21a之樹脂收容部22。 Further, in the resin material placing means 32 (linear vibration feeder 35), the granular resin 6 is vibrated, whereby the resin receiving portion 22 of the resin supply front plate 21a can be placed in a predetermined amount of resin per unit time. .

此時，適當調整該每單位時間之樹脂量放入量、及樹脂材料之振動均勻化手段對樹脂供應前板21a(顆粒樹脂6)之振動作用，藉此能將放入至樹脂收容部22內之顆粒樹脂6形成為均勻厚度(每單位面積一定量之樹脂量)。 At this time, the amount of the resin amount per unit time and the vibration equalizing means of the resin material are applied to the vibration of the resin supply front plate 21a (particle resin 6), whereby the resin can be placed in the resin containing portion 22 The granular resin 6 is formed to have a uniform thickness (a certain amount of resin per unit area).

此外，可採用使顆粒樹脂6落下放入至樹脂供應前板21a之樹脂收容部22之中央部的構成。 Further, a configuration in which the pellet resin 6 is dropped into the central portion of the resin containing portion 22 of the resin supply front plate 21a can be employed.

此時，在樹脂收容部22內能使施加振動之顆粒樹脂6朝向外周圍方向均勻移動以平坦化(使顆粒樹脂6之厚度均勻)。 At this time, in the resin accommodating portion 22, the vibrating particulate resin 6 can be uniformly moved toward the outer peripheral direction to be flattened (the thickness of the granular resin 6 is made uniform).

又，樹脂供應前板21a之樹脂收容部22內之放入之顆粒樹脂6殘留有凹凸部之情形，藉由以適當之樹脂材料之平坦化手段、亦即對樹脂供應前板21a施加振動作用，或藉由托板，能使該凹凸部平坦化以使顆粒樹脂6之厚度均勻化。 Further, in the case where the uneven resin is left in the resin resin 6 placed in the resin accommodating portion 22 of the resin supply front plate 21a, vibration is applied to the resin supply front plate 21a by a flattening means of a suitable resin material. Or, by means of the pallet, the uneven portion can be flattened to make the thickness of the particulate resin 6 uniform.

又，於上述實施例，雖說明使用熱硬化性之樹脂材料，但使用熱塑性之樹脂材料亦可。 Further, in the above embodiment, a thermosetting resin material is used, but a thermoplastic resin material may be used.

又，於上述實施例，雖說明使用顆粒狀之樹脂材料6，但亦可採用具有所需之粒徑分布之粉狀之樹脂材料(粉樹脂)、粉末狀之樹脂材料(粉末樹脂)等各種形狀之樹脂材料。 Further, in the above-described embodiment, the granular resin material 6 is used, but various powder materials such as a powdery resin material (powder resin) having a desired particle size distribution and a powdery resin material (powder resin) may be used. Shape resin material.

又，於上述實施例，可使用例如矽氧系之樹脂材料、環氧系之樹脂材料。 Further, in the above embodiment, for example, a resin material of an anthracene oxygen type or a resin material of an epoxy type can be used.

又，於上述實施例，可使用具有透明性之樹脂材料、具有半透明性之樹脂材料、含有磷光物質、螢光物質之樹 脂材料等各種樹脂材料。 Further, in the above embodiment, a resin material having transparency, a resin material having translucency, a tree containing a phosphorescent substance, and a fluorescent substance can be used. Various resin materials such as grease materials.

又，於樹脂已分散板25，採用在樹脂收容用板21之上面設置蓋構件之構成，可採用在板上方開口部39(樹脂收容部22)設置蓋之構成。 Further, in the resin-dispersed plate 25, a cover member is provided on the upper surface of the resin-receiving plate 21, and a lid may be provided in the upper opening portion 39 (resin accommodating portion 22).

6‧‧‧顆粒狀之樹脂材料(顆粒樹脂) 6‧‧‧Party resin material (granular resin)

11‧‧‧脫模膜 11‧‧‧ release film

21‧‧‧樹脂收容用板 21‧‧‧Resin containment board

21a‧‧‧樹脂供應前板 21a‧‧‧Resin supply front panel

22‧‧‧樹脂收容部 22‧‧‧Resin containment department

23‧‧‧板下方開口部 23‧‧‧ openings under the board

24‧‧‧板周緣部 24‧‧‧Plate peripheral

31‧‧‧樹脂材料之分配手段 31‧‧‧Distribution of resin materials

31a‧‧‧放入側分配手段 31a‧‧‧Input side allocation

31b‧‧‧接受供應側分配手段 31b‧‧‧ Accepting supply side allocation

32‧‧‧樹脂材料之放入手段 32‧‧‧Resin means of resin materials

33‧‧‧進給器側之計量手段 33‧‧‧Measuring means on the feeder side

34‧‧‧進料斗 34‧‧‧ Feeding hopper

35‧‧‧線性振動進給器 35‧‧‧Linear vibrating feeder

36‧‧‧板側之計量手段 36‧‧‧Measurement on the side of the board

37‧‧‧開口部 37‧‧‧ openings

39‧‧‧板上方開口部 39‧‧‧ openings above the board

40‧‧‧板裝載部 40‧‧‧Board loading department

42‧‧‧水平移動平坦化機構 42‧‧‧Horizontal mobile flattening mechanism

Claims (11)

一種電子零件之壓縮成形方法，係以供應至被覆有脫模膜之下模具腔內之所需量之樹脂材料將安裝在供應設置在上模具之基板之電子零件壓縮成形，其特徵在於：在所需尺寸之脫模膜上載置具有與該下模具腔對應之形狀之開口部的樹脂收容用板並被覆該樹脂收容用板之下面，形成具有以該開口部之內壁面及該脫模膜形成之樹脂收容部的樹脂供應前板；對該樹脂收容部供應所需量之樹脂材料並使其厚度均勻平坦化，藉此將平坦化之樹脂材料載置在該脫模膜上；藉由使載置有該平坦化之樹脂材料的脫模膜之該部分被覆於該下模具腔內，從該樹脂收容部內對該下模具腔內供應樹脂材料；在使樹脂已分散板從該下模具腔退去後，壓縮成形該電子零件。 A compression forming method for an electronic component, wherein a metal material supplied to a substrate provided on an upper mold is compression-molded by a resin material supplied to a mold cavity covered with a mold film under a release film, characterized in that: A release sheet having a shape corresponding to the lower mold cavity is placed on the release film of the desired size, and the lower surface of the resin storage plate is covered to form an inner wall surface having the opening and the release film. a resin supply front plate of the formed resin accommodating portion; supplying a required amount of the resin material to the resin accommodating portion and uniformly flattening the thickness thereof, thereby placing the planarized resin material on the release film; The portion of the release film on which the planarized resin material is placed is coated in the lower mold cavity, and the resin material is supplied into the lower mold cavity from the resin receiving portion; the resin has been dispersed from the lower mold After the cavity is retracted, the electronic component is compression molded. 一種電子零件之壓縮成形方法，係將安裝有電子零件之基板供應設置在上模具，對被覆有脫模膜之下模具腔內供應所需量之樹脂材料，在該下模具腔內將安裝在基板之電子零件壓縮成形，其特徵在於，包含：以基板供應機構將安裝有電子零件之基板在電子零件安裝面側朝向下方之狀態下供應設置在設在該上模具之基板安裝部之步驟；藉由將脫模膜配置在具備與該下模具腔對應之開口部的樹脂收容用板之下面並被覆該下面，形成以該開口部之 內壁面及該脫模膜形成之樹脂收容部之步驟；對該樹脂收容部供應所需量之樹脂材料之步驟；使該樹脂收容部內之樹脂材料之厚度均勻以形成平坦化之樹脂已分散板之步驟；藉由將該樹脂已分散板卡接於樹脂材料供應機構並載置於該下模具腔之位置，使該樹脂收容部隔著該脫模膜與該下模具腔一致之步驟；藉由從該下模具腔強制地吸引排出空氣，將該脫模膜被覆於該下模具腔內之步驟；將該脫模膜被覆於該下模具腔內時，使樹脂材料從該樹脂收容部內往該下模具腔內落下並供應之步驟；使該樹脂已分散板從該下模具腔退去之步驟；以及在使該樹脂已分散板從該下模具腔退去後，將該電子零件壓縮成形之步驟。 A compression forming method for an electronic component, wherein a substrate for mounting an electronic component is disposed in an upper mold, and a required amount of resin material is supplied into a mold cavity under the release film, and the lower mold cavity is installed in the lower mold cavity. The step of supplying the electronic component of the substrate to the substrate mounting portion provided on the upper mold in a state in which the substrate on which the electronic component is mounted is placed downward on the electronic component mounting surface side by the substrate supply mechanism; The release film is formed on the lower surface of the resin-receiving plate having the opening corresponding to the lower mold cavity, and the lower surface is covered. a step of the inner wall surface and the resin accommodating portion formed by the release film; a step of supplying a required amount of the resin material to the resin accommodating portion; and uniformizing the thickness of the resin material in the resin accommodating portion to form a flattened resin dispersed plate a step of affixing the resin-dispensing plate to the resin material supply mechanism and placing it in the lower mold cavity, so that the resin receiving portion is aligned with the lower mold cavity through the release film; a step of forcibly sucking the exhaust air from the lower mold cavity to cover the release film in the lower mold cavity; and when the release film is coated in the lower mold cavity, the resin material is moved from the resin storage portion a step of dropping and supplying the lower mold cavity; a step of retreating the resin dispersed plate from the lower mold cavity; and a step of compressing the electronic component after the resin dispersed plate is retracted from the lower mold cavity . 如申請專利範圍第1或2項之電子零件之壓縮成形方法，其中，在對該樹脂收容部供應所需量之樹脂材料時，藉由使在該樹脂收容部一邊使所需量之樹脂材料振動一邊移動以進行供應之步驟、與使該樹脂收容部往X方向或Y方向移動之步驟協同運作，將該樹脂材料形成為所需之均勻厚度並平坦化。 The compression molding method for an electronic component according to the first or second aspect of the invention, wherein, when a required amount of the resin material is supplied to the resin accommodating portion, the required amount of the resin material is made on the side of the resin accommodating portion. The step of moving while vibrating to supply is performed in cooperation with the step of moving the resin containing portion in the X direction or the Y direction, and the resin material is formed into a desired uniform thickness and planarized. 如申請專利範圍第1或2項之電子零件之壓縮成形方法，其進一步具備藉由預先將長帶狀之脫模膜切斷成所需長度以準備該脫模膜之步驟。 The compression molding method for an electronic component according to claim 1 or 2, further comprising the step of preparing the release film by cutting a long strip-shaped release film into a desired length in advance. 一種電子零件之壓縮成形裝置，具備由上模具及與該 上模具對向配置之下模具構成之電子零件之壓縮成形用模具、設在該下模具之下模具腔、設在該上模具之基板安裝部、被覆該下模具腔內之脫模膜、按壓該下模具腔內之樹脂之樹脂按壓用之腔底面構件、對該下模具腔供應樹脂材料之樹脂材料供應機構、對該基板安裝部供應安裝有電子零件之基板之基板供應機構，其特徵在於，具備：樹脂收容用板，安裝在該樹脂材料供應機構且具有開口部；脫模膜，配置在該樹脂收容用板之下面且被覆該下面，並在該樹脂收容用板，形成由該開口部之內壁面及該脫模膜構成之樹脂收容部；以及樹脂材料之分配手段，對該樹脂收容部供應所需量之樹脂材料；該樹脂材料供應機構，在將已供應有該樹脂材料之該樹脂收容用板載置於該下模具腔並將該樹脂材料供應至該下模具腔後，於壓縮成形該電子零件前，使該樹脂收容用板從該下模具腔退去。 A compression forming device for an electronic component, comprising an upper mold and the same a mold for compression molding of an electronic component formed by a mold facing the upper mold, a mold cavity provided under the lower mold, a substrate mounting portion provided in the upper mold, a release film covering the lower mold cavity, and pressing a cavity bottom member for resin pressing of the resin in the lower mold cavity, a resin material supply mechanism for supplying a resin material to the lower mold cavity, and a substrate supply mechanism for supplying the substrate on which the electronic component is mounted to the substrate mounting portion, characterized in that The resin storage plate is attached to the resin material supply mechanism and has an opening; the release film is disposed under the resin storage plate and covers the lower surface, and the resin storage plate is formed in the opening. a resin receiving portion formed by the inner wall surface of the portion and the release film; and a resin material distributing means for supplying a required amount of the resin material to the resin receiving portion; the resin material supply mechanism, which has been supplied with the resin material After the resin receiving plate is placed in the lower mold cavity and the resin material is supplied to the lower mold cavity, the resin is collected before the electronic component is compression-molded. Receded from the plate at the mold cavity. 一種電子零件之壓縮成形裝置，係使用由上模具與下模具構成之電子零件之壓縮成形用模具，對設在該上模具之基板安裝部供應安裝有電子零件之基板，對設在該下模具且被覆有脫模膜之下模具腔內供應樹脂材料，藉由將該上下兩模具閉模，將安裝於基板之電子零件浸漬於被覆有該脫模膜之該下模具腔內之樹脂，按壓該下模具腔內之樹脂，藉此在該下模具腔內將安裝於基板之電子零件壓縮成 形，其特徵在於，具備：樹脂收容用板，具有與該下模具腔對應之開口部；脫模膜，配置在該樹脂收容用板之下面且被覆該下面，並形成由該開口部之內壁部及該脫模膜構成之樹脂收容部；樹脂材料之分配手段，對該樹脂收容部供應所需量之樹脂材料；以及樹脂材料供應機構，將已供應有該樹脂材料之該樹脂收容用板載置於該下模具腔並將該樹脂材料供應至該下模具腔，在壓縮成形該電子零件前使該樹脂收容用板從該下模具腔退去。 A compression molding apparatus for an electronic component is a mold for compression molding using an electronic component composed of an upper mold and a lower mold, and a substrate on which an electronic component is mounted is mounted on a substrate mounting portion of the upper mold, and the lower mold is provided And coating the resin material in the mold cavity under the release film, and by closing the upper and lower molds, the electronic component mounted on the substrate is immersed in the resin coated in the lower mold cavity of the release film, and pressed The resin in the lower mold cavity, thereby compressing the electronic components mounted on the substrate into the lower mold cavity The resin-receiving plate has an opening corresponding to the lower mold cavity, and a release film is disposed under the resin-receiving plate and covered with the lower surface, and is formed inside the opening a wall portion and a resin accommodating portion formed of the release film; a resin material distributing means for supplying a required amount of the resin material to the resin accommodating portion; and a resin material supply means for accommodating the resin to which the resin material is supplied The plate is placed in the lower mold cavity and the resin material is supplied to the lower mold cavity, and the resin receiving plate is retracted from the lower mold cavity before the electronic component is compression-molded. 一種電子零件之壓縮成形裝置，具備由上模具與下模具構成之電子零件之壓縮成形用模具、設在該下模具之下模具腔、設在該上模具之基板安裝部、被覆該下模具腔內之脫模膜、對該下模具腔內供應樹脂材料之樹脂材料供應機構、對該上模具之基板安裝部供應安裝有電子零件之基板之基板供應機構，其特徵在於：設置有安裝在該樹脂材料供應機構且具有開口部之樹脂收容用板、配置在樹脂收容用板之下面且被覆該下面並具有形成由該開口部之內壁面及該脫模膜構成之樹脂收容部所需尺寸之脫模膜、及使所需量之樹脂材料平坦化並供應至該樹脂收容部之樹脂材料之分配手段；在該樹脂材料之分配手段，設置樹脂材料之放入側分配手段與樹脂材料之接受供應側分配手段； 在該樹脂材料之放入側分配手段，設置對該樹脂收容部放入所需量之樹脂材料的樹脂材料之放入手段、與計量放入該樹脂收容部之所需量之樹脂材料的樹脂材料之計量手段；在該樹脂材料之接受供應側分配手段，具備在該樹脂收容用板之下面固定吸附有脫模膜之狀態下進行載置之板載置部、與以所需厚度使供應至該樹脂收容部之樹脂材料平坦化的樹脂材料之平坦化手段；該樹脂材料供應機構，在將已供應有該樹脂材料之該樹脂收容用板載置於該下模具腔並將該樹脂材料供應至該下模具腔後，於壓縮成形該電子零件前使該樹脂收容用板從該下模具腔退去。 A compression molding apparatus for an electronic component, comprising: a mold for compression molding of an electronic component composed of an upper mold and a lower mold; a mold cavity provided under the lower mold; a substrate mounting portion provided on the upper mold; and the lower mold cavity a release film inside, a resin material supply mechanism for supplying a resin material to the lower mold cavity, and a substrate supply mechanism for supplying a substrate on which the electronic component is mounted to the substrate mounting portion of the upper mold, wherein the substrate supply mechanism is provided The resin material supply means has a resin receiving plate having an opening, a lower surface of the resin accommodating plate, and a lower surface of the resin accommodating plate, and has a required size for forming a resin accommodating portion including the inner wall surface of the opening and the release film. a release film, and a distribution means for flattening a required amount of the resin material and supplying the resin material to the resin accommodating portion; and the means for distributing the resin material, the receiving side distribution means of the resin material and the acceptance of the resin material Supply side allocation means; In the placing side dispensing means of the resin material, a means for inserting a resin material into which a required amount of the resin material is placed in the resin containing portion, and a resin for measuring a required amount of the resin material placed in the resin containing portion are provided. The means for measuring the material; the means for distributing the supply side of the resin material, the plate mounting portion placed in a state where the release film is fixedly adsorbed on the lower surface of the resin storage plate, and supplied at a desired thickness a flattening means for a resin material which is flattened to a resin material of the resin accommodating portion; the resin material supply means, wherein the resin accommodating plate to which the resin material has been supplied is placed in the lower mold cavity and the resin material is placed After being supplied to the lower mold cavity, the resin containing plate is retracted from the lower mold cavity before the electronic component is compression molded. 如申請專利範圍第7項之電子零件之壓縮成形裝置，其中，在該樹脂材料之放入側分配手段設置一邊使所需量之樹脂材料振動一邊移動並放入該樹脂收容部之線性振動進給器。 The compression molding apparatus for an electronic component according to the seventh aspect of the invention, wherein the resin material is placed on the side-distributing means, and the required amount of the resin material is vibrated while moving and placed in the resin accommodating portion. Give the device. 如申請專利範圍第5至7項中任一項之電子零件之壓縮成形裝置，其中，脫模膜係預先將長帶狀之脫模膜切斷成所需長度而準備。 The compression molding apparatus for an electronic component according to any one of claims 5 to 7, wherein the release film is prepared by cutting a long strip-shaped release film into a desired length in advance. 一種樹脂材料之供應方法，係在由上模具與下模具構成之電子零件之壓縮成形用模具之下模具腔內被覆有脫模膜之狀態下供應樹脂材料，其特徵在於：藉由在所需尺寸之脫模膜上載置具有與該下模具腔對應之形狀之開口部的樹脂收容用板並被覆該樹脂收容用板 下面，使所需量之樹脂材料平坦化並形成於以該開口部之內壁面及該脫模膜形成之樹脂收容部之脫模膜上；在該樹脂材料保持在該脫模膜上之狀態下，將該脫模膜與該樹脂收容用板卡接；在該下模具腔之開口部載置該樹脂收容部，使該脫模膜被覆於該下模具腔內，藉此將該平坦化之樹脂材料供應至該下模具腔內；在壓縮成形該電子零件前，使該樹脂收容用板從該下模具腔退去。 A method of supplying a resin material by supplying a resin material in a state in which a mold cavity is covered with a release film under a mold for compression molding of an electronic component composed of an upper mold and a lower mold, characterized in that: The release film of the size is placed on the resin-receiving plate having the opening of the shape corresponding to the lower mold cavity, and the resin-receiving plate is covered. Next, a desired amount of the resin material is planarized and formed on the release film of the inner wall surface of the opening portion and the resin accommodating portion formed by the release film; and the resin material is held on the release film. Then, the release film is engaged with the resin accommodation plate; the resin storage portion is placed in the opening of the lower mold cavity, and the release film is covered in the lower mold cavity, thereby planarizing the film The resin material is supplied into the lower mold cavity; the resin receiving plate is retracted from the lower mold cavity before the electronic component is compression molded. 一種樹脂材料供應機構，係在由上模具與下模具構成之電子零件之壓縮成形用模具之下模具之腔內被覆脫模膜，對被覆有該脫模膜之該下模具腔內供應樹脂材料，其特徵在於：藉由在所需尺寸之脫模膜上載置具有與該下模具腔對應之形狀之開口部的樹脂收容用板並被覆該樹脂收容用板下面，使所需量之樹脂材料平坦化並供應至以該開口部之內壁面及該脫模膜形成之樹脂收容部之脫模膜上，在已將該樹脂材料保持在該脫模膜上之狀態下，將該脫模膜與該樹脂收容用板卡接，在該下模具腔之開口部載置該樹脂收容部，使該脫模膜被覆於該下模具腔內，藉此將該平坦化之樹脂材料供應至該下模具腔內，於壓縮成形該電子零件前使該樹脂收容用板從該下模具腔退去。 A resin material supply mechanism that coats a release film in a cavity of a mold under a compression molding die of an electronic component composed of an upper mold and a lower mold, and supplies a resin material to the lower mold cavity covered with the release film A resin-receiving sheet having an opening having a shape corresponding to the lower mold cavity is placed on a release film of a desired size, and the resin-receiving sheet is covered under the resin-receiving sheet to obtain a required amount of the resin material. The film is flattened and supplied onto a release film having a resin wall portion formed by the inner wall surface of the opening portion and the release film, and the release film is held while the resin material is held on the release film. The resin storage portion is placed in the opening of the lower mold cavity, and the release film is coated in the lower mold cavity, thereby supplying the flattened resin material to the lower portion. In the mold cavity, the resin receiving plate is retracted from the lower mold cavity before the electronic component is compression molded.
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