TW201007859A - A method of compression-molding electronic components and an apparatus of metal mold - Google Patents

A method of compression-molding electronic components and an apparatus of metal mold Download PDF

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Publication number
TW201007859A
TW201007859A TW098126295A TW98126295A TW201007859A TW 201007859 A TW201007859 A TW 201007859A TW 098126295 A TW098126295 A TW 098126295A TW 98126295 A TW98126295 A TW 98126295A TW 201007859 A TW201007859 A TW 201007859A
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Taiwan
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resin
cavity
resin material
plate
release film
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TW098126295A
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Chinese (zh)
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TWI543275B (en
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Hiroshi Uragami
Naoki Takada
Osamu Otsuki
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A resin supply pre-plate (21a) is configured by forming an opening section (37) on a resin-storing section (22) by applying a die-releasing film (11) on a lower surface of a resin-storing plate (21) having the opening section (37) corresponding to a lower die cavity (5) so as to efficiently improve reliability of a resin quantity supplied into the lower cavity (5) at the time of supplying a granular resin (6) into the lower die cavity (5). A resin-dispersed plate (25) is formed by supplying the resin-storing section (22) with the granular resin (6) of a required quantity and flattening the resin (i.e., forming the resin in uniform thickness). Then, by placing the resin-dispersed plate (25) at a position of the lower die cavity (5) and pulling the die-releasing film (11) into the lower die cavity (5), the flattened granular resin (6) of a required quantity is dropped together with the die-releasing film (11) and is supplied into the cavity (5) covered with the die-releasing film (11).

Description

201007859 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種IC(Integrated Circuit)等之電子零件 之壓縮成形方法及使用於該壓縮成形方法之金屬模具裝 置。 【先前技術】 以往，如圖6所示，使用裝載於電子零件之壓縮成形 用金屬模具裝置之電子零件之壓縮成形用金屬模具81，以 φ 顆粒狀之樹脂材料（顆粒樹脂）84進行安裝在基板82之所需 數目之電子零件83之壓縮成形（樹脂密封成形），其係以下 述方式進行。 首先，將脫模膜88被覆於設在電子零件之壓縮成形用 金屬模具81 (上模具85與下模具86)之下模具腔87内，且 將顆粒樹脂84供應至被覆該脫模膜88之下模具腔87内並 加熱使其炫融’接著，使上述金屬模具81(85、86)閉模， φ 將安裝在基板82之所需數目之電子零件83浸潰於下模具 腔87内之熔融樹脂，據以在與下模具腔87之形狀對應之 樹脂成形體内將所需數目之電子零件83壓縮成形（一次單 面模具）。 此外’此時’能以樹脂按壓用之腔底面構件93按壓下 模具腔87之樹脂。 然而，為了將顆粒樹脂84供應至上述下模具腔87内， 使用樹脂材料供應機構89(下部擋門9〇與供應部91卜 亦即，將所需量之顆粒樹脂84放入至上述樹脂材料供 3 201007859 應機構89(供應部91)以使該樹脂材料供應機構89進入上述 上下兩模具85, 86間，接著，拉開樹脂材料供應機構89之 下部擋門90，據以使顆粒樹脂84從供應部91落下供應至 下模具腔87内。 專利文獻1 :日本特開2004- 216558號 【發明内容】 然而’將樹脂84供應至金屬模具腔87内時，開啟樹 脂材料供應機構89之擋門90使顆粒樹脂84落下供應至下 模具腔87内時，會有樹脂之一部分92殘留在樹脂材料供 應機構89(供應部91)侧之情形。 是以’將樹脂84供應至金屬模具腔87内時，會有無 法高效率將樹脂84供應至金屬模具腔87内之缺點。 又，將樹脂84供應至金屬模具腔87内時，由於樹脂 之一部分（殘留之顆粒樹脂）92殘留在樹脂材料供應機構 89(供應部91)侧，因此供應至金屬模具腔87内之樹脂量會 容易產生不足情形。 是以，將樹脂84供應至金屬模具腔87内時，會有無 法高效率提昇供應至金屬模具腔87内之樹脂量之可靠性之 缺點。 本發明所欲解決之問題，係將樹脂供應至金屬模具腔 内時’能高效率將樹脂供應至金屬模具腔内，1高效率提 昇供應至金屬模具腔内之樹脂量之可靠性。 、為了解決上述問題，本發明之電子零件之壓縮成形方 法係將所需量之樹脂材料供應至被覆有脫模膜之金屬模 201007859 具腔内’且將電子零件浸潰於該腔内之樹脂，據以在該腔 内之與該腔之形狀對應之樹脂成形體内將該電子零件壓縮 成形，其特徵在於’包含：將脫模膜被覆於具備與該金屬 模具腔對應之開口部之樹脂收容用板之下面，以形成具有 樹脂收容部之樹脂供應前板的步驟；將所需量之樹脂材料 供應至該樹脂供應前板之該樹脂收容部的步驟；使該樹脂 收谷部内之樹脂材料之厚度均勻，以形成平坦化之樹脂已 參 为散板的步驟，將該樹脂已分散板裝載於該金屬模具腔之 位置，據以使該樹脂收容部透過該脫模膜與該金屬模具腔 一致的步驟；將該脫模膜被覆於該腔面的步驟；以及將該 脫模膜被覆於該腔面時，將樹脂材料從該樹脂收容部内供 應至該金屬模具腔内的步驟。 又，為了解決上述問題，電子零件之壓縮成形方法， 其包含使該樹脂收容部内之樹脂材料之厚度均勻以形成平 坦化之樹脂已分散板時，一邊將所需量之樹脂材料供應至 鲁該樹脂供應前板之該樹脂收容部、一邊使該樹脂供應前板 移動於X方向或γ方向，據以將該樹脂收容部内之樹脂材 料形成為所需之均勻厚度以使其平坦化的步驟。 ，又’為了解決上述問冑’本發明之電子零件之麼縮成 形方法，其包含使該樹脂收容部内之樹脂材料之厚度均勻 以形成平坦化之樹脂已分散板時，使樹脂供應前板振動’ 據以將該樹脂枚容部内之樹脂材料形成為所需之均句厚度 以使其平坦化的步驟。 又’為了解決上述問題，本發明之電子零件之壓縮成 201007859 形方法，其中，該樹脂材料係顆粒狀之樹脂材料或粉末狀 之樹脂材料。 又，為了解決上述問題，本發明之電子零件之壓縮成 形用金屬模具裝置，具備由上模具及與該上模具對向配置 之下模具構成之電子零件之壓縮成形用金屬模具'設於該 下模具之壓縮成形用腔、設於該上模具之基板安裝部、被 覆該下模具腔内之脫模膜、按壓該下模具腔内之樹脂之樹 脂按壓用之腔底面構件、及將樹脂材料與安裝電子零件之 基板供應至該金屬模具之内部裝載機，其特徵在於：具備 安裝於該内部裝載機且具有開口部之樹脂收容用板、被覆 該樹脂收容用板之下面側以將該開口部形成於樹脂收容部 之脫模膜、及將樹脂材肖供應至該樹脂收容部之樹脂材料 之刀配手奴’被覆該壓縮成形用腔内之該脫模膜與被覆該 樹脂收容用板下面側之該脫模膜相同。 又’為了解決上述問題， 形用金屬模具裝置，其中，在 本發明之電子零件之壓縮 將樹脂材料供應至該樹脂 成 收 容部之樹脂材料之分配手段， 脂收容部之樹脂材料之供應手 部之樹脂材料之量之樹脂材料 設置將樹脂材料供應至該樹 段、計算供應至該樹脂收容 之計量手段、及使供應至該 樹脂收容部之樹脂材料平坦化之樹脂材料之平坦化手段 又’為了解決上述問冑，本發明之電子零件之壓縮 形用金屬模具裝置，,, 4 八中該平坦化手段，係使該樹脂 容用板移動於X方向戋,τ Υ方向之水平移動平坦化機構。 又為了解決上述問題，本發明之電子零件之壓縮 0 成 收 成 201007859 形用金屬模具裝置，其中，該樹脂材料係顆粒狀之樹脂材 料或粉末狀之樹脂材料。 根據本發明’可達到將樹脂供應至金屬模具腔内時， 能高效率將樹脂供應至金屬模具腔内之優異效果。 又’根據本發明，可達到將樹脂供應至金屬模具腔内 時’能高效率提昇供應至金屬模具腔内之樹脂量之可靠性 之優異效果。 【實施方式】 w 根據本發明’首先，將脫模膜吸附被覆於樹脂收容用 板之下面，將開口部之板下方開口部封閉，據以將樹脂收 谷用板之開口部形成於樹脂收容部，可獲得具有樹脂收容 部之樹脂供應前板。 接著’以樹脂材料之分配手段，將所需量之顆粒狀之 樹脂材料（顆粒樹脂）從板上方開口部供應至樹脂供應前板 之樹知收容部，以樹脂材料之平坦化手段，將所需量之顆 • 粒樹脂形成為均勻厚度以使其平坦化，藉此能形成將所需 量之平坦化之顆粒樹脂收容於樹脂收容部内之樹脂已分散 板。 接著’將在内部裝載機之下部側卡接樹脂已分散板且 在内部裝載機之上部側安裝所需數目之電子零件之基板， 在電子零件構裝面朝向下方之狀態下裝載。 接著’使内部裝載機進入電子零件之壓縮成形用金屬 模具之上下兩模具之間。 此時，將安裝電子零件之基板，在電子零件構裝面朝 7 201007859 向下方之狀態下供應安裝於上模具之基板安裝部。 又’接著’使内部裝載機向下移動’藉此能將樹脂已 分散板安裝於下模具之模具面。 此時，樹脂已分散板之板下方開口部，係透過脫模膜 與腔之開口部之位置一致。 又’此時，在樹脂已分散板之樹脂收容部内，所需量 之顆粒樹脂係在平坦化狀態下裝載於脫模膜上。 又’接著，解除樹脂已分散板之脫模膜之吸附。 又’再者’從下模具之模具面與腔内強制吸引排出空 氣’據以將脫模膜卡止於下模具面’且將脫模膜拉入腔内 以將脫模膜被覆於腔。 此時’在所需量之平坦化之顆粒樹脂裝載於脫模膜之 狀態下’且使脫模膜與所需量之平坦化之顆粒樹脂一起之 狀態下（成為一體之狀態下），將所需量之平坦化之顆粒樹脂 拉入下模具腔内以使其落下。 因此’能將所需量之顆粒樹脂在平坦化之狀態下（均勻 厚度之狀態下）供應至被覆脫模膜之下模具腔内。 亦即’使所需量之平坦化之顆粒樹脂與脫模膜一起之 狀態下（成為一體之狀態下），將所需量之平坦化之顆粒樹脂 拉入下模具腔内以使其落下，藉此能將所需量之顆粒樹脂 在平坦化之狀態下供應至被覆脫模膜之腔内。 是以，根據本發明，將樹脂供應至金屬模具腔内時， 能高效率將樹脂供應至金屬模具腔内。 又’由於能將所需量之顆粒樹脂在平坦化之狀態下供 201007859 貞至被覆脫模臈之下模具腔内，因此將樹脂供應至金屬模 具腔内時，能尚效率提昇供應至金屬模具腔内之樹脂量之 可靠性。 此外，因此，能在被覆脫模膜之腔内對平坦化狀態（具 有均勻厚度）之顆粒樹脂均勻加熱以使其溶融化。 是以，可有效防止在腔内樹脂之一部分硬化而產生殘 粉。 (實施例） 詳細說明實施例（本發明）。 (關於裝載電子零件之壓縮成形用金屬模具之金屬模具 裝置之構成） 首先，對裝載實施例所示之電子零件之壓縮成形方法 所使用之電子零件之壓縮成形用金屬模具（模具組品之電 子零件之壓縮成形用金屬模具裝置進行說明。 如圖例所不’在電子零件之壓縮成形用金屬模具裝 置，設有電子零件之壓縮成形用金屬模具（模具組品口、將 所需量之顆粒狀之樹脂材料（顆粒樹脂）6與安裝所需數目之 電子零件7之基板8(成形前基板）各別或同時供應至該金屬 模具1之内部裝載機9、取出以該金屬模具丨壓縮成形（樹 脂密封成形）之已成形基板（後述樹脂成形體12)之卸載機 (未圖示）、及使金屬模具1閉模之閉模機構（未圖示）。 是以’以内部裝載機9將所需量之顆粒樹脂6與基板8 供應至金屬模具1以進行壓縮成形，藉此能在金屬模具1 獲得已成形基板（樹脂成形體12)，且能以卸載機從金屬模 9 201007859 具1取出已成形基板。 又’如後述，在實施例所示之金屬模具裝置，設有將 所需量之顆粒樹脂6供應至以内部裝載機9卡接之樹脂已 为散板25並進行分配之樹脂材料之分配手段31。 是以’能以樹脂材料之分配手段31將所需量之顆粒樹 脂6供應至樹脂供應前板2丨a並進行分配以形成後述樹脂已 刀散板25(所需量之平坦化之顆粒樹脂6)。 (關於電子零件之壓縮成形用金屬模具之構成） 如圖例所不’在電子零件之壓縮成形用金屬模具（模具 組m3 )1，具備固疋上模具2、與上模具2對向配置之可動下 模具3。 又，在上模具2之模具面，設有將安裝所需數目之電 子零件7之基板8在電子零件構裝面侧朝向下方之狀態下 供應安裝之基板安裝部4。 又，在下模具3之模具面，壓縮成形用之腔5係以腔 開口。卩10朝向上方（上模具2方向）開口之狀態下設置。 是以’藉由使上下兩模具1(2, 3)閉模，據以將安裝於 供應安裝至上模具基板安襄部4之基板8之電子零件7欲 裝安裝於下模具腔5内。 又，在上下兩模具收3)，設有將上下兩模具1(2, 3) 加熱至所需之溫度之加熱手段（未圖示）。 是以，能將以内部裝栽機9(後述樹月旨已分散板25)供應 至下模具腔5内之所需量之顆粒樹脂6，以金屬模具i之加 熱手段加熱熔融化。 201007859 又，在腔5之底面設有將腔5内之樹脂6以所需之按 壓力按壓之樹脂按壓用之腔底面構件38。 是以’以腔底面構件38按壓下模具腔5内之樹脂6, 藉此能在下模具腔5内將安裝於基板8之電子零件7壓縮 成形（樹脂密封成形）。 (關於下模具之脫模膜之吸附機構） 又’雖未圖示’在下模具3’在下模具面與腔5之面， ©設有吸附脫模膜11之脫模膜之吸引機構。 此外，吸引機構具備例如吸引孔、真空路徑、及真空 吸引機構（真空泵），吸引孔係以能到達下模具3之模具面與 腔5之表面之方式設在下模具3内部。 是以，使吸引機構作動’將空氣強制吸引排出，藉此 月b將脫模膜11沿著下模具3之模具面與腔5之面之形狀被 覆固定。 例如，在下模具3之模具面裝載（平面形狀之）脫模膜 φ 11並使吸引機構作動時，首先，在下模具3之模具面卡止 脫模膜11，接著，在下模具腔5内吸引脫模膜u將其拉入， 藉此能沿著下模具腔5之形狀將脫模膜11被覆固定。 此外，根據本發明，如後述，將脫模膜丨i拉入下模具 腔5内被覆時，同時將裝載於後述樹脂已分散板25之脫模 膜11之所需量之（如後述，平坦化之）顆粒樹脂<5與被拉入 下模具腔5内之脫模膜u 一起拉入以使其落下，藉此能將 所需量之顆粒樹脂6(如後述，在平坦化之狀態下）供應至被 覆脫模骐11之腔5内。 11 201007859 是以’將所需量之顆粒樹月旨6供應至被覆脫模膜U之 腔5内之後，首先’使上下兩模具1(2, 3)閉模據以將安 裝於供應#裝於上模具基板安裝部4之基板8之電子零件7 浸潰於在被覆脫模膜1 i之腔5内加熱溶融化之樹脂6中， 接著’以腔底面構件38透過脫模膜u按壓腔5内之樹脂卜 藉此能在下模具腔5内之與下模具腔5之形狀對應之樹脂 成形髏U内將安裝於基板8之電子零件7壓縮成形(樹脂密 封成形）。 (關於樹脂收容用板之構成） ® 接著，對將所需量之顆粒樹脂6供應至本發明之下模 具腔5内之樹脂收容用板21(樹脂供應前板2U)之構成進行 說明。 在樹脂收容用板21設有貫通於上下方向之開口部37、 及形成於開口部37周圍之板周緣部24(外框部）。 又’在開口部37,設有設於板上方侧之板上方開口部 39及設於板下方侧之板下方開口部23。 又’雖未圖示’在板周緣部24 模膜11之脫模膜吸附固定機構。 之下面設有吸附固定脫[Technical Field] The present invention relates to a compression molding method for an electronic component such as an IC (Integrated Circuit), and a metal mold device used in the compression molding method. [Prior Art] As shown in Fig. 6, a metal mold 81 for compression molding of an electronic component mounted on a compression molding die apparatus for an electronic component is mounted on a φ granular resin material (particle resin) 84. The compression molding (resin sealing formation) of the required number of electronic parts 83 of the substrate 82 is carried out in the following manner. First, the release film 88 is coated in the mold cavity 87 provided under the compression molding metal mold 81 (the upper mold 85 and the lower mold 86) of the electronic component, and the granular resin 84 is supplied to cover the release film 88. The lower mold cavity 87 is heated and smelted. Then, the metal mold 81 (85, 86) is closed, and φ the desired number of electronic components 83 mounted on the substrate 82 are immersed in the lower mold cavity 87. The molten resin is subjected to compression molding (a single-sided mold) of a desired number of electronic parts 83 in a resin molded body corresponding to the shape of the lower mold cavity 87. Further, at this time, the resin of the lower mold cavity 87 can be pressed by the cavity bottom surface member 93 for resin pressing. However, in order to supply the granular resin 84 into the lower mold cavity 87, a resin material supply mechanism 89 (the lower door 9 〇 and the supply portion 91, that is, the required amount of the granule resin 84 is placed in the above resin material, is used. 3 201007859 The mechanism 89 (supply portion 91) is such that the resin material supply mechanism 89 enters between the upper and lower molds 85, 86, and then, the lower door 90 of the resin material supply mechanism 89 is pulled apart, so that the granular resin 84 is thereby obtained. The supply portion 91 is dropped from the supply portion 91 to the lower mold cavity 87. Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-216558. However, when the resin 84 is supplied into the mold cavity 87, the resin material supply mechanism 89 is opened. When the door 90 drops the granular resin 84 into the lower mold cavity 87, there is a case where one of the resin portions 92 remains on the side of the resin material supply mechanism 89 (supply portion 91). The resin 84 is supplied to the metal mold cavity 87. In the meantime, there is a disadvantage that the resin 84 cannot be efficiently supplied into the mold cavity 87. Further, when the resin 84 is supplied into the mold cavity 87, a part of the resin (residual particle resin) 92 remains. On the side of the resin material supply mechanism 89 (supply portion 91), the amount of the resin supplied into the mold cavity 87 is likely to be insufficient. Therefore, when the resin 84 is supplied into the mold cavity 87, there is no high efficiency. The disadvantage of improving the reliability of the amount of resin supplied into the metal mold cavity 87. The problem to be solved by the present invention is to supply the resin to the cavity of the metal mold with high efficiency when the resin is supplied into the cavity of the metal mold, 1 high The efficiency is improved by the reliability of the amount of resin supplied into the cavity of the metal mold. In order to solve the above problems, the compression molding method of the electronic component of the present invention supplies the required amount of the resin material to the metal mold coated with the release film 201007859 a resin in which the electronic component is immersed in the cavity, and the electronic component is compression-molded in a resin molded body corresponding to the shape of the cavity in the cavity, characterized by 'including: demoulding The film is coated on the lower surface of the resin accommodating plate having the opening corresponding to the mold cavity to form a resin supply front plate having a resin accommodating portion; a step of supplying a resin material to the resin receiving portion of the resin supply front plate; making the thickness of the resin material in the resin receiving portion uniform, to form a step of the planarized resin having been dispersed, and dispersing the resin a step of loading the plate at the position of the metal mold cavity, wherein the resin receiving portion passes through the release film and the mold cavity; a step of coating the release film on the cavity surface; and the release film The step of supplying the resin material from the resin accommodating portion into the mold cavity when covering the cavity surface. Further, in order to solve the above problem, the electronic component compression molding method includes the resin material in the resin accommodating portion. When the thickness is uniform to form a flattened resin-dispersed plate, the required amount of the resin material is supplied to the resin containing portion of the resin supply front plate, and the resin supply front plate is moved in the X direction or the γ direction. The resin material in the resin accommodating portion is formed into a desired uniform thickness to planarize it. Further, in order to solve the above problem, the method for molding an electronic component according to the present invention comprises the step of making the resin supply front plate vibrate when the thickness of the resin material in the resin containing portion is made uniform to form a flattened resin dispersed plate. The step of forming the resin material in the resin entraining portion into a desired uniform thickness to planarize it. Further, in order to solve the above problems, the electronic component of the present invention is compressed into a method of 201007859, wherein the resin material is a granular resin material or a powdery resin material. Moreover, in order to solve the above problem, the metal mold apparatus for compression molding of an electronic component according to the present invention includes a metal mold for compression molding of an electronic component including an upper mold and a mold disposed opposite to the upper mold. a cavity for compression molding of a mold, a substrate mounting portion provided in the upper mold, a release film covering the lower mold cavity, a cavity bottom member for pressing the resin in the lower mold cavity, and a resin material and An internal loader for mounting an electronic component substrate to the metal mold, comprising: a resin storage plate having an opening attached to the internal loader; and a lower surface side of the resin storage plate covering the opening The release film formed in the resin accommodating portion and the knives of the resin material that supplies the resin material to the resin accommodating portion cover the release film in the cavity for compression molding and the underside of the resin accommodating plate The release film on the side is the same. Further, in order to solve the above problem, a metal mold device is used, in which the resin material is supplied to the resin material in the accommodating portion by the compression of the electronic component of the present invention, and the resin material supply portion of the fat accommodating portion is provided. The resin material of the amount of the resin material is provided by supplying the resin material to the tree segment, calculating the measuring means supplied to the resin, and flattening the resin material for flattening the resin material supplied to the resin receiving portion. In order to solve the above problems, the metal mold device for compressing the electronic component of the present invention, the flattening means, moves the resin containing plate in the X direction, and horizontally moves in the τ Υ direction. mechanism. Further, in order to solve the above problems, the electronic component of the present invention is compressed into a 201007859-shaped metal mold device, wherein the resin material is a granular resin material or a powdery resin material. According to the present invention, an excellent effect of supplying the resin into the cavity of the metal mold with high efficiency can be attained when the resin is supplied into the cavity of the metal mold. Further, according to the present invention, it is possible to achieve an excellent effect of efficiently increasing the reliability of the amount of the resin supplied into the cavity of the metal mold when the resin is supplied into the cavity of the metal mold. [Embodiment] According to the present invention, first, the release film is adsorbed and coated on the lower surface of the resin-receiving sheet, and the opening below the plate of the opening is closed, whereby the opening of the resin-receiving sheet is formed in the resin. A resin supply front plate having a resin receiving portion can be obtained. Then, the resin material (granular resin) of a desired amount is supplied from the opening portion above the plate to the tree-receiving portion of the resin supply front plate by means of a resin material distribution means, and the resin material is flattened. The required amount of particles is formed into a uniform thickness to be flattened, whereby a resin-dispersed plate in which a desired amount of the planarized particulate resin is accommodated in the resin containing portion can be formed. Next, the substrate on which the resin-dispersed plate is attached to the lower portion of the internal loader and the required number of electronic components are mounted on the upper side of the internal loader is loaded with the electronic component mounting surface facing downward. Then, the internal loader is placed between the upper and lower molds of the metal mold for compression molding of the electronic component. At this time, the substrate on which the electronic component is mounted is supplied to the substrate mounting portion mounted on the upper mold with the electronic component mounting surface facing downward toward 7 201007859. Further, 'then', the internal loader is moved downward', whereby the resin-dispersed plate can be attached to the mold surface of the lower mold. At this time, the opening of the lower portion of the resin-dispersed plate is aligned with the position of the opening of the cavity through the release film. Further, at this time, in the resin accommodating portion of the resin-dispersed plate, the required amount of the granule resin is placed on the release film in a flat state. Further, the adsorption of the release film of the resin dispersed plate is released. Further, 'further' forcedly sucks the discharge air from the mold surface and the cavity of the lower mold, so as to lock the release film to the lower mold surface and pull the release film into the cavity to cover the release film. At this time, in a state where the desired amount of the planarized granular resin is loaded on the release film and the release film is brought together with the desired amount of the planarized granular resin (in the state of being integrated), The required amount of planarized particulate resin is drawn into the lower mold cavity to cause it to fall. Therefore, the required amount of the particulate resin can be supplied to the mold cavity under the coated release film in a state of being flattened (in a state of uniform thickness). That is, in a state where the desired amount of the planarized particulate resin is brought together with the release film (in a state of being integrated), a desired amount of the planarized particulate resin is pulled into the lower mold cavity to cause it to fall, Thereby, the required amount of the particulate resin can be supplied to the cavity of the coated release film in a flat state. Therefore, according to the present invention, when the resin is supplied into the cavity of the metal mold, the resin can be efficiently supplied into the cavity of the metal mold. In addition, since the required amount of the granular resin can be supplied to the mold cavity under the release mold in the state of flattening, the resin can be efficiently supplied to the metal mold when the resin is supplied into the mold cavity. The reliability of the amount of resin in the cavity. Further, therefore, the granular resin in a flattened state (having a uniform thickness) can be uniformly heated in the cavity covering the release film to be melted. Therefore, it is possible to effectively prevent partial hardening of the resin in the cavity to generate residual powder. (Embodiment) The embodiment (present invention) will be described in detail. (Configuration of the metal mold device for the metal mold for compression molding of the electronic component) First, the metal mold for compression molding of the electronic component used in the compression molding method for the electronic component shown in the embodiment (the electronic component of the mold assembly) A metal mold device for compression molding of a part is described. As shown in the following example, a metal mold device for compression molding of an electronic component is provided with a metal mold for compression molding of an electronic component (a mold assembly port and a desired amount of granular material) The resin material (granular resin) 6 is supplied to the internal loader 9 of the metal mold 1 separately or simultaneously with the substrate 8 (formed front substrate) on which the required number of electronic parts 7 are mounted, and taken out by the metal mold 丨 compression molding ( An unloader (not shown) of a molded substrate (resin molded body 12 to be described later) and a mold closing mechanism (not shown) for closing the mold 1 are formed by an internal loader 9 The required amount of the particulate resin 6 and the substrate 8 are supplied to the metal mold 1 for compression molding, whereby the formed substrate can be obtained in the metal mold 1 (resin molding) The body 12) is capable of taking out the formed substrate from the mold 9 201007859 by the unloader. Further, as will be described later, the metal mold device shown in the embodiment is provided with the required amount of the particulate resin 6 to be supplied internally. The resin to which the loader 9 is stuck is the distribution plate 31 of the resin material to be dispensed and distributed. The resin resin 6 of the resin material can be supplied to the resin supply front plate 2 by the distribution means 31 of the resin material. a is distributed to form a resin-coated blade 25 (a desired amount of planarized particle resin 6). (Construction of a metal mold for compression molding of an electronic component) As shown in the following example, compression molding of an electronic component is not performed. A metal mold (mold group m3) 1 is provided with a fixed upper mold 2 and a movable lower mold 3 disposed opposite to the upper mold 2. Further, on the mold surface of the upper mold 2, a required number of electronic parts are mounted. The substrate 8 of the seventh substrate 8 is supplied with the substrate mounting portion 4 in a state where the electronic component mounting surface side faces downward. Further, the cavity 5 for compression molding is opened by the cavity on the mold surface of the lower mold 3. The crucible 10 faces upward (upper Mold 2 direction) opening In the state, the electronic component 7 mounted on the substrate 8 supplied to the upper mold substrate mounting portion 4 is intended to be mounted in the lower mold cavity by closing the upper and lower molds 1 (2, 3). In addition, in the upper and lower molds, 3), a heating means (not shown) for heating the upper and lower molds 1 (2, 3) to a desired temperature is provided. Therefore, the internal loader can be used. The desired amount of the particulate resin 6 supplied to the lower mold cavity 5 is heated and melted by the heating means of the metal mold i. 201007859 Further, a cavity is provided on the bottom surface of the cavity 5 (9) The resin 6 in the 5 is pressed against the cavity bottom member 38 for resin pressing at the required pressing force. The resin 6 in the lower mold cavity 5 is pressed by the cavity bottom member 38, whereby the lower mold cavity 5 can be mounted. The electronic component 7 on the substrate 8 is compression-molded (resin sealing molding). (Absorption mechanism of the release film of the lower mold) Further, although not shown, the lower mold 3' is provided with a suction mechanism for adsorbing the release film of the release film 11 on the surface of the lower mold surface and the cavity 5. Further, the suction mechanism includes, for example, a suction hole, a vacuum path, and a vacuum suction mechanism (vacuum pump), and the suction hole is provided inside the lower mold 3 so as to reach the surface of the lower mold 3 and the surface of the cavity 5. Therefore, the suction mechanism is actuated to forcibly suck and discharge the air, whereby the release film 11 is covered and fixed along the surface of the mold surface of the lower mold 3 and the surface of the cavity 5 by the month b. For example, when the release film φ 11 (in the planar shape) is loaded on the mold surface of the lower mold 3 and the suction mechanism is actuated, first, the release film 11 is locked on the mold surface of the lower mold 3, and then, the lower mold cavity 5 is attracted. The mold film u pulls it in, whereby the release film 11 can be covered and fixed along the shape of the lower mold cavity 5. Further, according to the present invention, when the release film 丨i is pulled into the lower mold cavity 5 as will be described later, the amount of the release film 11 to be loaded on the resin-dispersed plate 25 to be described later is required (as will be described later, flat) The granule resin <5 is pulled together with the release film u drawn into the lower mold cavity 5 to be dropped, whereby the desired amount of the granule resin 6 can be obtained (as will be described later, in a flattened state) B) is supplied into the cavity 5 of the coated release 骐 11. 11 201007859 After the supply of the required amount of the granules 6 to the cavity 5 of the coated release film U, firstly, the upper and lower dies 1 (2, 3) are closed and installed on the supply # The electronic component 7 of the substrate 8 on the upper mold substrate mounting portion 4 is immersed in the resin 6 which is heated and melted in the cavity 5 covering the release film 1 i, and then the cavity is pressed by the cavity bottom member 38 through the release film u. In the resin forming chamber 5, the electronic component 7 mounted on the substrate 8 can be compression-molded (resin sealing molding) in the resin molding 髅U corresponding to the shape of the lower mold cavity 5 in the lower mold cavity 5. (Construction of the resin-receiving plate). Next, a configuration in which the required amount of the particulate resin 6 is supplied to the resin-receiving sheet 21 (resin supply front sheet 2U) in the mold cavity 5 of the present invention will be described. The resin accommodating plate 21 is provided with an opening 37 that penetrates in the vertical direction and a peripheral edge portion 24 (outer frame portion) formed around the opening 37. Further, the opening portion 37 is provided with a plate upper opening portion 39 provided on the upper side of the plate and a plate lower opening portion 23 provided on the lower side of the plate. Further, the release film suction/fixing mechanism of the mold film 11 is not shown in the plate peripheral portion 24. Adhesive fixing

以脫模膜吸附固定機構將脫模骐丨丨吸附固定於板周 部24之下面，藉此能以脫模膜u將板下方開口部2 部37)封閉。 外即，以 、队· 々丨幵j u部 · 閉，據以形成具有能收容所需量之顆粒樹脂6之凹部 脂收容部22。 12 201007859 又，以脫模膜11形成樹脂收容部22,藉此能獲得具有 樹脂收容部22之樹脂供應前板21a。亦即，具有樹脂收容 部22之樹脂供應前板21a，係由樹脂收容用板21與脫模膜 11構成。 是以，如後述，能以樹脂材料之分配手段31將所需量 之顆粒樹脂6從板上方開口部39供應至樹脂供應前板21a 之樹脂收容部22。 又，板下方、上方開口部23, 39之（平面上之）形狀係與 腔開口部1 0之（平面上之）形狀對應形成。 例如，腔開口部10之形狀形成為矩形，且開口部37 之板下方、上方開口部23，39之形狀與矩形之腔開口部1〇 之形狀對應形成。 (關於樹脂材料之分配手段之構成） 實施例中，以圖1所示之樹脂材料之分配手段（樹脂材 料之計量供應平坦化手段）31計算所需量之顆粒樹脂6之量 並供應放入樹脂供應前板21a之樹脂收容部22内，且在樹 月a供應則板21 a之樹脂收容部2 2，以均勻厚度（每單位面積 一定量之樹脂量）將顆粒樹脂6平坦化，藉此能將所需量之 平坦化之顆粒樹脂6分配於樹脂供應前板21 a之樹脂收容部 22 〇 此外’在樹脂材料之分配手段3 1設有樹脂材料之放入 側为配手段31 a與樹脂材料之接受供應側分配手段3 1 b。 (關於樹脂材料之放入側分配手段） 如圖1所示’樹脂材料之放入側分配手段3 la，係由將 13 201007859 所需量之顆粒樹脂6供應放入至樹脂供應前板21a之樹脂收 容部22之樹脂材料之放入手段（樹脂材料之供應手段）32、 及計算放入至樹脂供應前板21a之樹脂收容部22之所需量 之顆粒樹脂6之量之樹脂材料之進給器側計量手段（測力 计）3 3構成。 又，如圖1所示，在樹脂材料之放入手段32，設有顆 粒樹脂之進料斗34、及在樹脂供應前板21a之樹脂收容部 22以適當振動手段（未圖示）使顆粒樹脂6 —邊振動一邊移 動放入之線性振動進給器35。 又，供應放入顆粒樹脂6時，能以進給器側計量手段（測 力計）33計算供應放入至樹脂供應前板21a之樹脂收容部22 之顆粒樹脂6之量。 是以’在樹脂材料之放入側分配手段3 1 a，以線性振動 進給器35使來自進料斗34之顆粒樹脂6 —邊振動一邊移 動’藉此能將所需量之顆粒樹脂6(例如，少量逐次）供應放 入至樹脂供應前板21a之樹脂收容部22。 此外’例如，在線性振動進給器35，使顆粒樹脂6振 動’據以將每單位時間一定量之樹脂量供應放入至樹脂供 應前板21a之樹脂收容部22亦可。 (關於樹脂材料之接受供應側分配手段） 如圖1所示，在樹脂材料之接受供應側分配手段3 lb， 設有以樹脂收容用板21之脫模膜吸附固定機構將脫模膜11 吸附固定於樹脂收容用板21之下面側以形成具有樹脂收容 部22之樹脂供應前板21a之樹脂供應前板形成手段（未圖 201007859 不）、裝載樹脂供應前板21a之板裝載台40、將樹脂供應前 板21a從樹脂供應前板形成手段裝载至板裝載台4〇之板移 動裝載手段（未圖示）、及以所需之厚度使從樹脂材料之放入 侧分配手段31a之線性振動進給器35供應至裝載於板裝載 台40之樹脂供應前板21a之樹脂收容部22之所需量之顆粒 樹脂6平坦化之樹脂材料之平坦化手段（例如，後述樹脂材 料之水平移動平坦化機構42)。 _ 是以’在樹脂材料之接受供應側分配手段31 b，首先， 以樹I曰供應别板形成手段形成具有樹脂收容部22之樹腊供 應前板21a’且以板移動裝載手段將樹脂供應前板21a裝載 至板裝載台40’接著，使所需量之顆粒樹脂6 —邊振動一 邊移動以從線性振動進給器35供應至樹脂供應前板21a之 樹脂收容部22。 此時，藉由樹脂材料之平坦化手段（水平移動平坦化機 構42)與線性振動進給器35之共同運轉作業，能以所需之 ❹ 均勻厚度41使供應至樹脂收容部22之所需量之顆粒樹脂6 平坦化。 (關於樹脂材料之平坦化手段） 在樹脂材料之接受供應側分配手段31b，作為樹月旨材_ 之平坦化手段，例如設有水平移動平坦化機構42。 亦即，能以水平移動平坦化機構42使裝載於板駿栽‘ 40之樹脂供應前板21a在水平方向、亦即圖1所示 / 向或Y方向各別或同時移動。 是以，能使所需量之顆粒樹脂6 —邊振動—邊移動以 15 201007859 從線性振動進給器35供應至裝載於板裝載台4〇之樹脂供 應前板21a之樹脂收容部22。 又此時，以水平移動平坦化機構42使樹脂供應前板 21a移動於X方向或γ方向藉此能在樹脂收容部u内以 所需之㈣厚度41(參照圖3)使所需量之顆粒樹脂6平土曰化 (每單位面積形成-定量之樹脂量），以形成樹脂已分散板 (關於内部裝載機之構成） 在内部裝載機9，卡接樹脂已分散板25(亦即，在以脫 模膜u形成之樹脂收容部22收容所需量之平坦化之顆粒 樹脂6之樹脂收容用板21)之板卡接部9a係設於内部裝載 又，在内部裝載機9,在電子零件7朝向下方之狀態下 裝載基板8之基板裝栽部9b係設於内部裝載機上部側。 是以’使内部裝載機9進人上下兩模具1(2, 3)之間，The release enthalpy is adsorbed and fixed to the lower surface of the peripheral portion 24 of the plate by the release film adsorption fixing means, whereby the opening portion 2 of the lower portion of the plate can be closed by the release film u. In other words, the unit, the team, and the unit are closed, and a concave portion accommodating portion 22 having a particulate resin 6 capable of accommodating a desired amount is formed. 12 201007859 Further, the resin accommodating portion 22 is formed by the release film 11, whereby the resin supply front plate 21a having the resin accommodating portion 22 can be obtained. In other words, the resin supply front plate 21a having the resin accommodating portion 22 is composed of the resin accommodating plate 21 and the release film 11. Therefore, as will be described later, the required amount of the particulate resin 6 can be supplied from the upper plate opening portion 39 to the resin containing portion 22 of the resin supply front plate 21a by the resin material distributing means 31. Further, the shape of the lower opening portions 23, 39 (on the plane) of the lower portion of the plate is formed corresponding to the shape of the cavity opening portion 10 (on the plane). For example, the shape of the cavity opening portion 10 is formed in a rectangular shape, and the shape of the lower portion of the opening portion 37 and the upper opening portion 23, 39 is formed corresponding to the shape of the rectangular cavity opening portion 1A. (Regarding the configuration of the distribution means of the resin material) In the embodiment, the amount of the desired amount of the particulate resin 6 is calculated by the means for distributing the resin material shown in Fig. 1 (the means for measuring the supply of the resin material) 31 and supplied. The resin is supplied into the resin accommodating portion 22 of the front plate 21a, and the resin accommodating portion 22 of the plate 21a is supplied in the tree month a, and the granular resin 6 is flattened with a uniform thickness (a certain amount of resin per unit area). This can distribute the required amount of the planarized particulate resin 6 to the resin accommodating portion 22 of the resin supply front plate 21a. Further, 'the resin material distribution means 31 is provided with the resin material on the insertion side as the matching means 31a. The supply side distribution means 3 1 b with the resin material. (About the side-distribution means of the resin material) As shown in Fig. 1, the 'side-side dispensing means 3 la of the resin material is supplied from the pellet resin 6 of the amount required for 13 201007859 to the resin supply front plate 21a. The resin material insertion means (supply means for resin material) 32 of the resin accommodating portion 22, and the amount of the resin material for calculating the amount of the granule resin 6 to be placed in the resin accommodating portion 22 of the resin supply front plate 21a The feeder side measuring means (dynamometer) 3 3 is constructed. Further, as shown in Fig. 1, the resin material charging means 32 is provided with a pellet resin hopper 34 and a resin accommodating portion 22 of the resin supply front plate 21a by a suitable vibration means (not shown) to make the granule resin. 6 - Move the linear vibrating feeder 35 while moving while vibrating. Further, when the pellet resin 6 is supplied, the amount of the particulate resin 6 supplied to the resin containing portion 22 of the resin supply front plate 21a can be calculated by the feeder side measuring means (dynamometer) 33. The particle resin 6 (which can be moved while vibrating while moving the particle resin 6 from the feed hopper 34 with the linear vibration feeder 35 at the side of the resin material on the side of the distribution means 3) For example, a small amount of supply is supplied to the resin accommodating portion 22 of the resin supply front plate 21a. Further, for example, in the linear vibrating feeder 35, the granular resin 6 is vibrated. It is also possible to supply a predetermined amount of the resin amount per unit time to the resin containing portion 22 of the resin supply front plate 21a. (Receiving supply side distribution means of the resin material) As shown in Fig. 1, the release means 11 lb of the resin material is provided, and the release film 11 is adsorbed by the release film adsorption fixing means of the resin containing plate 21. a resin supply front plate forming means (not shown in FIG. 201007859) which is fixed to the lower surface side of the resin accommodating plate 21 to form the resin supply front plate 21a of the resin accommodating portion 22, and a plate loading table 40 on which the resin supply front plate 21a is loaded, The resin supply front plate 21a is loaded from the resin supply front plate forming means to the plate loading table 4's plate moving loading means (not shown), and linearly from the resin material's insertion side distribution means 31a at a desired thickness. The vibrating feeder 35 supplies a flattening means for the resin material flattened by the required amount of the particulate resin 6 to the resin accommodating portion 22 of the resin supply front plate 21a of the plate loading table 40 (for example, the horizontal movement of the resin material described later) Flattening mechanism 42). _ is based on the supply side distribution means 31b of the resin material, firstly, the tree wax supply front plate 21a' having the resin accommodating portion 22 is formed by the tree I 曰 supply plate forming means, and the resin is supplied by the plate moving loading means. The front plate 21a is loaded to the plate loading table 40'. Then, the required amount of the particulate resin 6 is moved while being vibrated to be supplied from the linear vibration feeder 35 to the resin containing portion 22 of the resin supply front plate 21a. At this time, by the operation of the flattening means of the resin material (horizontal movement flattening means 42) and the linear vibrating feeder 35, it is possible to supply the resin accommodating portion 22 with the required uniform thickness 41. The amount of the particulate resin 6 is flattened. (Resolving means for flattening the resin material) The receiving side distribution means 31b of the resin material is provided with, for example, a horizontal movement flattening means 42 as a flattening means for the tree material. That is, the resin supply front plate 21a loaded on the plate spring can be moved in the horizontal direction, that is, in the / direction or the Y direction shown in Fig. 1, by the horizontal movement flattening mechanism 42. Therefore, the desired amount of the particulate resin 6 can be vibrated while moving by 15 201007859 from the linear vibrating feeder 35 to the resin containing portion 22 of the resin supply front plate 21a loaded on the plate loading table 4A. At this time, the resin supply front plate 21a is moved in the X direction or the γ direction by the horizontal movement flattening mechanism 42 so that the required amount can be made in the resin accommodating portion u with the desired (four) thickness 41 (refer to FIG. 3). The granule resin 6 is flattened (the amount of resin is formed per unit area - the amount of resin is formed) to form a resin-dispersed plate (for the structure of the internal loader). The internal loader 9 is engaged with the resin-dispersed plate 25 (that is, The plate engaging portion 9a of the resin containing plate 21) which accommodates the required amount of the flattened granular resin 6 in the resin accommodating portion 22 formed of the release film u is attached to the inside, and is loaded on the internal loader 9, The substrate loading portion 9b on which the substrate 8 is mounted with the electronic component 7 facing downward is attached to the upper portion of the internal loader. So that the internal loader 9 is inserted between the upper and lower molds 1 (2, 3),

使基板8向上移動’藉此能將安裝電子零件7之基板8在 電子零件構裝面側朝向下方之狀態下供應安裝於上模具2 之基板安裝部4。 又，使内部裝載機9進入上下兩模纟1(2, 3)之間，使 内部裝載機9向下移動，藉此能使樹脂收容用板21之板下 方開口部23之位置透過脫模膜u與下模具3之腔開 Μ之位置一致。 此時在下模具3之模具面與樹脂收容用板21之下面 之間挾持脫模膜1 i。 16 201007859 又’此時，能解除設於樹脂收容用板21之下面之脫模 膜吸附固定機構之脫模膜之吸附。 又’再者，以設於下模具3之模具面與腔5之面之吸 引機構吸引，藉此能在下模具3之模具面卡止脫模膜u， 且將脫模膜11拉入下模具腔5内，將脫模膜丨丨被覆於腔5 之面。 此時，在樹脂已分散板25之樹脂收容部22(開口部37) φ 内裝載於脫模膜11之所需量之平坦化之顆粒樹脂ό，係與 被拉入腔5内之脫模膜u 一起落下至腔5内。 亦即，能將所需量之平坦化之顆粒樹脂6(一次）供應至 被覆脫模膜11之腔5内。 是以，在被覆脫模膜11之腔5内，能將所需量之顆粒 樹脂6之厚度形成為均勻。 (關於脫模臈） 本發明所使用之脫模膜U(短帶狀之脫模膜），係將長 ❹ 帶狀之脫模膜（捲物狀之脫模膜）預先切斷（預切斷）成所需長 度而準備者。 因此’相較於每當將顆粒樹脂6供應至樹脂供應前板 21a時將裝填於金屬模具裝置之捲物狀之脫模膜（長帶狀之 脫模膜）切斷成脫模膜11(短帶狀之脫模膜）之金屬模具裝 置’可省略將捲物狀之脫模膜裝填於金屬模具裝置之手段。 是以’相較於裝填捲物狀之脫模膜之金屬模具裝置之 尺寸，能使本發明之金屬模具裝置整體之尺寸小型化。 (關於電子零件之壓縮成形方法） 17 201007859 首先’將脫模膜11吸附被覆於樹脂收容用板21之下 面侧，將開口部37之板下方開口部23封閉以形成樹脂收 容部22，據以形成具有樹脂收容部22之樹脂供應前板 21a(參照圖2(1)〜（2)、圖3) » 接著’如圖1所示，在樹脂材料之分配手段31，將樹 脂供應前板21a裝載於板台40上。 此時’在樹脂收容用板21與板台40之間挾持脫模膜 11 〇 接著’在樹脂材料之分配手段31，以樹脂材料之放入 側分配手段31a侧之進給器側計量手段（測力計）33計算所 需量之顆粒樹脂6之量’且使所需量之顆粒樹脂6 —邊振 動一邊移動以從進料斗34通過線性振動進給器35自板上 方開口部39供應至樹脂供應前板21 a之樹脂收容部22。 此時’在樹脂材料之接受供應侧分配手段31b側，以 水平移動平坦化機構42(樹脂材料之平坦化手段）使裝載於 板裝載台40之樹脂供應前板21&在又方向或γ方向各別或 同時移動’藉此能使一邊振動一邊供應至樹脂供應前板21a 之樹脂收容部22内之所需量之顆粒樹脂6在樹脂供應前板 21a之樹脂收容部22内平坦化，將顆粒樹脂6之厚度形成 為均勻（參照圖2(1)〜（2)、圖3)。 是以’在樹脂材料之分配手段31,使所需量之顆粒樹 脂6 —邊振動一邊供應至裝載於板台4〇上之樹脂供應前板 2la之樹脂收容部22内並使其平坦化藉此能形成樹脂已 分散板25。 18 201007859 此外，在此樹脂已分散板25,能在開口部37之板下方 開口部23側之脫模膜u上(樹脂收容部22内之脫模膜" 上）裝載所需量之平坦化之顆粒樹脂6之狀態下（裝載具有 所需量之均勻厚度之顆粒樹脂6之狀態下）形成。 者如圖3所示，將樹脂已分散板25卡接於内部裝 載機9之板卡接部9a，且將安裝電子零件7之基板8裝載 於内部裝載機9之基板裝載部9b。 φ 接著，使内部裝載機9進入上下兩模具丨（2，3)之間， 且使基板8向上移動，據以將安裝電子零件7之基板8在 電子零件構裝面朝向下方之狀態下供應安裝於上模具2之 基板安裝部4。 又’接著，使内部裝載機9向下移動，據以將樹脂已 分散板25裝載於下模具3之模具面。 此時，能使樹脂已分散板25之板下方開口部23透過 脫模膜11與腔5之開口部1〇 一致。 ❷ 又’此時，在樹脂已分散板25之樹脂收容部22内， 所需量之顆粒樹脂6係在平坦化之狀態下裝載於脫模膜n 上。 接著’解除樹脂已分散板25之脫模膜吸附固定機構之 脫模膜11之吸附。 又’接著，如圖4所示’使下模具3側之吸引機構作 動’據以從下模具3之模具面與下模具腔5之面將空氣強 制吸引排出。 此時’在將脫模膜11卡止於下模具3之模具面之狀態 201007859 下’能將脫模膜11拉入下模具腔5内，沿著腔5之形狀被 覆脫模膜11。 又’此時’如圖4所示，在樹脂已分散板25之樹脂收 容部22内’在裝載於脫模膜11上之所需量之平坦化之顆 粒樹脂6與脫模膜11 一起之狀態下，將所需量之平坦化之 顆粒樹脂6拉入並使其落下至下模具腔5内。 又’此時，在所需量之顆粒樹脂6為平坦化之狀態下， 亦即在使顆粒樹脂6之厚度為均勻之狀態下，能夠供應至 被覆脫模膜11之下模具腔5内。 是以’此時’在將所需量之平坦化之顆粒樹脂6裝載 於脫模膜11上之狀態下，且使所需量之平坦化之顆粒樹脂 6與脫模膜11 —起之狀態下（成為一體之狀態下），能在平 坦化之狀態下（均勻厚度之狀態下）使所需量之顆粒樹脂6 落下（一次）供應至下模具腔5内。 亦即’本發明’係將安裝有樹脂已分散板25之内部裝 載機9(樹脂材料供應機構）之樹脂已分散板25之板下方開 口部23裝載於下模具3(腔開口部1〇)之構成，能將所需量 之平坦化之顆粒樹脂6高效率供應至被覆脫模膜U之下模 具腔5内。 又，本發明，由於能在平坦化之狀態下（均勻厚度之狀 態下）將所需量之顆粒樹脂ό供應至被覆脫模膜π之下模具 腔5内’因此如習知例所示，可有效防止樹脂之一部分％ 卡住擒門90而殘留在供應機構89。 是以’根據本發明，不需要習知例所示之擋門9〇，消 20 201007859 除了顆粒樹腊84之-部分92殘留在供應機構89側之習知 例之缺陷。 此外，因此，本發明，能將所需量之平坦化之顆粒樹 脂6(與脫模膜11 一起一次）供應至被覆脫模膜u之腔5内。 接著’於被覆脫模膜U之腔5内使所需量之顆粒樹脂 ό在平坦化之狀態下加熱熔融化。 此時’由於能在平坦化之狀態下(均勻厚度之狀態下) ❹將所需量之顆粒樹脂6供應至被覆脫模膜η之下模且腔5 内，因此於被覆脫模膜U之下模具腔5内能（例如，從腔底 面側)β均勾加熱所需量之顆粒樹脂6以使其熔融化。 疋以相較於不均勻地將顆粒樹脂6供應至下模具腔5 内之情形，可有效防止因顆粒樹脂6不均勻地加熱溶融化 而一部分硬化而成為殘粉（例如，較小之硬化樹脂之粒）。 接著，使下模具3往上移動以使上下兩模具2,3閉模， 據以將安裝於供應安裝至上模具基板安裝部4 之基板8之 ❹電子零件7/χ潰於下模具腔5内之加熱熔融化之樹脂6，且 以腔底面構件38按壓腔5内之樹脂。 經過硬化所需時間後，藉由使上下兩模具2, 3開模， ，此&在腔5内之與腔5之形狀對應之樹脂成形體12内將 安裝於基板8之電子零件7壓縮成形（樹脂密封成形）。 亦即’如上述’能以樹脂材料之分配手段3 1將所需量 顆粒樹知6供應至樹脂供應前板21a之樹脂收容部22並 使其平坦化，以形成樹脂已分散板… 又如上述’在樹脂已分散板25之樹脂收容部22内 21 201007859 將裝載於脫模膜11上之所需量之平坦化之顆粒樹脂6與脫 模膜11 一起拉入腔5内並使其落下’藉此能在平坦化之狀 態下（使所需量之顆粒樹脂6形成為均勻厚度之狀態下）將 所需量之顆粒樹脂6供應至被覆脫模臈n之腔5内。 疋以，根據本發明，藉由將所需量之平坦化之顆粒樹 月曰6與脫模膜u 一起拉入腔5内並使其落下，能在平坦化 之狀態下將所需量之顆粒樹脂6供應至被覆脫模膜n之腔 5内，因此可達到將樹脂供應至金屬模具腔内時，能高效率 將樹脂供應至金屬模具腔5内之優異效果。 又，根據本發明，如上述，由於能在平坦化之狀態下 將所需量之顆粒樹脂6供應至被覆脫模膜u之腔5内，因 此可達到將樹脂供應至金屬模具腔5内時，能高效率提昇 供應至金屬模具腔5内之樹脂量之可靠性之優異效果。 本發明並不限於上述實施例，在不違背本發明思想之 範圍内，可視需要任意且適當地進行變更並加以選擇採用。 (關於其他樹脂材料之計量手段） 在樹脂材料之接受供應側分配手段3 1 b，設有計算供應 放入至樹脂供應前板21a之樹脂收容部22之所需量之顆粒 樹脂6之量之樹脂材料之板側計量手段（測力計）36。 是以，在樹脂材料之接受供應側分配手段31 b侧，能 以樹脂材料之板側計量手段36計算供應至樹脂供應前板 21a之樹脂收容部22之顆粒樹脂6之量。 此外，關於顆粒樹脂6之計量，可併用樹脂材料之放 入側分配手段3 1 a之進給器側計量手段33之計量步驟與樹 22 201007859 知材料之接受供應侧分配手段3lb之板側計量手段36之計 量步驟。 又’採用僅實施該等兩計量步驟之任一者之構成亦可。 (關於其他樹脂材料之平坦化手段） 又’在樹脂材料之接受供應側分配手段3 lb，設有作為 樹月a材料之平坦化手段之樹脂材料之振動均勻化手段（未圖 不）’其係使從線性振動進給器35放入至樹脂收容部22内 ❹之顆粒樹脂6(與樹脂供應前板21a —起）振動並使該顆粒樹 脂6各別或同時在χ方向或γ方向移動，據以在樹脂收容 22内使顆粒樹脂6平坦化並使顆粒樹脂6之厚度均勻化。 亦即’在樹脂材料之接受供應側分配手段31b，以振動 句勻化手段使樹脂供應前板21 a振動，藉此能使供應放入至 樹脂供應前板21 a之樹脂收容部22之顆粒樹脂ό在X方向 或Υ方向移動。 此時，使供應至樹脂收容部22之顆粒樹脂6在χ方向 Φ 或γ方向移動並使其平坦化，藉此能在樹脂收容部22内使 顆粒樹脂6之厚度均勻化。 疋以，能形成具有供應有所需量之平坦化之顆粒樹脂 6(具有均勻厚度之顆粒樹脂6)之樹脂收容部22(開口部37) 之樹脂已分散板25。 又，在樹脂材料之放入手段32(線性振動進給器35)， 使顆粒樹脂6振動，藉此能以每單位時間—定量之樹脂量 放入至樹脂供應前板21a之樹脂收容部22。 此時’適當調整該每單位時間之樹脂量放入量、及樹 23 201007859 脂材料之振動均勻化手段對樹脂供應前板21a(顆粒樹脂6) 之振動作用’藉此能將放入至樹脂收容部22内之顆粒樹脂 6形成為均勻厚度（每單位面積一定量之樹脂量）。 此外’可採用使顆粒樹脂6落下放入至樹脂供應前板 21a之樹脂收容部22之中央部的構成。 此時’在樹脂收容部22内能使施加振動之顆粒樹脂6 朝向外周圍方向均勻移動以平坦化（使顆粒樹脂6之厚度均 勻）。 又’樹脂供應前板21a之樹脂收容部22内之放入之顆 〇 粒樹脂6殘留有凹凸部之情形，藉由以適當之樹脂材料之 平坦化手段、亦即對樹脂供應前板21a施加振動作用，或藉 由托板，能使該凹凸部平坦化以使顆粒樹脂6之厚度均勻 化。 又，於上述實施例，雖說明使用熱硬化性之樹脂材料， 但使用熱塑性之樹脂材料亦可。 又，於上述實施例，雖說明使用顆粒狀之樹脂材料6， 但亦可採用具有所需之粒徑分布之粉狀之樹脂材料（粉樹 ◎ 月曰）、粉末狀之樹脂材料（粉末樹脂）等各種形狀之樹脂材料。 又，於上述實施例，可使用例如矽氧系之樹脂材料、 環氡系之樹脂材料。 又，於上述實施例，可使用具有透明性之樹脂材料' 具有半透明性之樹脂材料、含有填光物質螢光物質之 脂材料等各種樹脂材料。 又，於樹脂已分散板25，採用在樹脂收容用板2ι之上 24 201007859 面設置蓋構件之構成，可採用在板上方開口部39(樹脂收容 部22)設置蓋之構成。 【圖式簡單說明】 圖1係概略顯示說明本發明之電子零件之壓縮成形方 法之樹脂收容用板與樹脂材料之分配機構的概略立體圖， 顯示在該板分配樹脂材料的狀態。 圖2(1)、圖2(2)係概略顯示說明本發明之電子零件之壓 ❹ 縮成形方法之樹脂收谷用板的概略立體圖，圖2(1)係顯示 在圖1所示之樹脂材料之分配機構中，在板分配樹脂材料 的狀態，圖2(2)係顯示在圖1所示之樹脂材料之分配機構 中，分配樹脂材料的樹脂已分散板。 圖3係概略顯示說明本發明之電子零件之壓縮成形方 法之電子零件之壓縮成形用金屬模具裝置的概略縱截面 圖，顯不將圖2(2)所示之樹脂已分散板供應至該金屬模具 裝置的狀態。 φ 圖4係概略顯示與圖3對應之電子零件之壓縮成形用 金屬模具裝置的概略縱截面圖，顯示將脫模膜吸附被覆於 設在該金屬模具裝置（金屬模具）之下模具腔内，據以使樹脂 材料從樹脂已分散板落下供應至被覆脫模臈之腔内的狀 態。 圖5係概略顯示與圖3對應之電子零件之壓縮成形用 金屬模具裝置（金屬模具）的概略縱截面圖，顯示該金屬模具 的閉模狀態。 圖6係概略顯示說明習知電子零件之壓縮成形方法之 25 201007859 電子零件之愿縮成形用金屬模具裝置的概略縱截面圖β 【主要元件符號說明】 1 電子零件之壓縮成形用金屬模具（模具組品） 2 固定上模具 3 可動下模具 4 基板安裝部 5 下模具腔 6 顆粒狀之樹脂材料（顆粒樹脂） 7 電子零件 8 基板 9 内部裝載機 9a 板卡接部 9b 基板裝載部 10 腔開口部 11 脫模膜 12 樹脂成形體 21 樹脂收容用板 21a 樹脂供應前板 22 樹脂收容部 23 板下方開口部 24 板周緣部 25 樹脂已分散板 31 樹脂材料之分配手段 31a 放入側分配手段The substrate 8 is moved upward. The substrate 8 on which the electronic component 7 is mounted can be supplied to the substrate mounting portion 4 attached to the upper mold 2 with the electronic component mounting surface side facing downward. Further, the internal loader 9 is moved between the upper and lower molds 1 (2, 3) to move the internal loader 9 downward, whereby the position of the lower opening portion 23 of the resin-receiving sheet 21 can be released through the mold release. The film u is in the same position as the cavity opening of the lower mold 3. At this time, the release film 1 i is held between the mold surface of the lower mold 3 and the lower surface of the resin containing sheet 21. 16 201007859 Further, at this time, the adsorption of the release film of the release film adsorption fixing means provided on the lower surface of the resin containing plate 21 can be released. Further, in addition, the suction mechanism provided on the surface of the lower mold 3 and the surface of the cavity 5 is sucked, whereby the release film u can be locked on the mold surface of the lower mold 3, and the release film 11 can be pulled into the lower mold. In the cavity 5, the release film is coated on the surface of the cavity 5. At this time, the required amount of the flattened granule resin crucible loaded in the release film 11 in the resin accommodating portion 22 (opening portion 37) φ of the resin-dispersed plate 25 is released from the cavity pulled into the cavity 5. The membrane u falls down into the chamber 5 together. That is, the desired amount of the planarized particulate resin 6 (once) can be supplied into the cavity 5 of the coated release film 11. Therefore, the thickness of the desired amount of the particulate resin 6 can be made uniform in the cavity 5 covering the release film 11. (Removal 臈) The release film U (short-belt release film) used in the present invention is obtained by cutting a long strip-shaped release film (a roll-like release film) in advance (precut) Prepare the person to the required length. Therefore, the release film (long strip-shaped release film) loaded in the roll of the metal mold device is cut into the release film 11 as compared with the case where the granular resin 6 is supplied to the resin supply front plate 21a ( The metal mold device of the short strip-shaped release film can omit the means for loading the roll-shaped release film to the metal mold device. The size of the entire metal mold apparatus of the present invention can be miniaturized by the size of the metal mold apparatus which is a release film-like release film. (Repression molding method for electronic components) 17 201007859 First, the release film 11 is adsorbed and coated on the lower surface side of the resin accommodation plate 21, and the lower plate opening portion 23 of the opening portion 37 is closed to form the resin storage portion 22, The resin supply front plate 21a having the resin accommodating portion 22 is formed (refer to Figs. 2(1) to (2), Fig. 3). Next, as shown in Fig. 1, in the resin material distributing means 31, the resin is supplied to the front plate 21a. Loaded on the pallet 40. At this time, 'the release film 11 is sandwiched between the resin accommodation plate 21 and the plate 40, and then the 'receiving means 31 for the resin material, and the feeder side measuring means for the side of the resin-side insertion side distribution means 31a" ( The dynamometer 33 calculates the amount of the desired amount of the particulate resin 6 and causes the required amount of the particulate resin 6 to move while being vibrated to be supplied from the feed hopper 34 through the linear vibrating feeder 35 from the upper opening 39 of the upper plate. The resin is supplied to the resin housing portion 22 of the front plate 21a. At this time, the resin supply front plate 21 & mounted in the plate loading table 40 is placed in the direction of the y-direction or the γ direction on the side of the supply-side distribution means 31b of the resin material by the horizontal movement flattening means 42 (the flattening means of the resin material) The respective amounts of the particulate resin 6 which can be supplied to the resin accommodating portion 22 of the resin supply front plate 21a while being vibrated are flattened in the resin accommodating portion 22 of the resin supply front plate 21a, respectively. The thickness of the granular resin 6 is formed to be uniform (see FIGS. 2(1) to (2), FIG. 3). In the resin accommodating means 31, the required amount of the granule resin 6 is supplied while being supplied to the resin accommodating portion 22 of the resin supply front plate 21a loaded on the slab 4a, and is flattened. This can form the resin dispersed plate 25. In addition, in the resin-dispersed plate 25, the required amount of flatness can be loaded on the release film u on the opening portion 23 side of the opening portion 37 (on the release film in the resin accommodating portion 22). It is formed in the state of the granular resin 6 (in the state of loading the granular resin 6 having a uniform thickness of a desired amount). As shown in Fig. 3, the resin dispersion plate 25 is engaged with the board engaging portion 9a of the internal loader 9, and the substrate 8 on which the electronic component 7 is mounted is mounted on the substrate loading portion 9b of the internal loader 9. φ Next, the internal loader 9 is moved between the upper and lower molds 丨 (2, 3), and the substrate 8 is moved upward, whereby the substrate 8 on which the electronic component 7 is mounted is supplied with the electronic component mounting surface facing downward. It is attached to the board mounting portion 4 of the upper mold 2. Further, next, the internal loader 9 is moved downward, whereby the resin dispersion plate 25 is loaded on the mold surface of the lower mold 3. At this time, the opening 23 below the plate of the resin-dispersed plate 25 can be transmitted through the release film 11 to coincide with the opening 1 of the cavity 5. In this case, in the resin accommodating portion 22 of the resin-dispersed plate 25, the required amount of the particulate resin 6 is placed on the release film n in a flattened state. Then, the adsorption of the release film 11 of the release film adsorption fixing means of the resin dispersed plate 25 is released. Further, next, as shown in Fig. 4, the suction mechanism on the lower mold 3 side is actuated. According to the surface of the lower mold 3 and the surface of the lower mold cavity 5, air is strongly sucked and discharged. At this time, the release film 11 is pulled into the lower mold cavity 5 in a state where the release film 11 is locked to the mold surface of the lower mold 3, and the release film 11 is covered along the shape of the cavity 5. Further, at this time, as shown in FIG. 4, in the resin accommodating portion 22 of the resin-dispersed plate 25, the required amount of the planarized granule resin 6 and the release film 11 are placed on the release film 11. In the state, the desired amount of the planarized particulate resin 6 is pulled in and dropped into the lower mold cavity 5. Further, at this time, in a state where the required amount of the particulate resin 6 is flattened, that is, in a state where the thickness of the particulate resin 6 is uniform, it can be supplied into the lower mold cavity 5 of the coated release film 11. In a state where the desired amount of the planarized granular resin 6 is loaded on the release film 11 at the same time, and the desired amount of the planarized granular resin 6 and the release film 11 are brought together Under the state of being integrated (in a state of being integrated), the required amount of the particulate resin 6 can be dropped (once) into the lower mold cavity 5 in a state of being flattened (in a state of uniform thickness). In the present invention, the lower opening portion 23 of the resin-dispersed plate 25 of the internal loader 9 (resin material supply mechanism) to which the resin-dispersed plate 25 is attached is placed in the lower mold 3 (cavity opening portion 1). With this configuration, the desired amount of the planarized particulate resin 6 can be efficiently supplied into the mold cavity 5 below the coated release film U. Further, in the present invention, since a desired amount of the particulate resin ruthenium can be supplied into the mold cavity 5 under the release release film π in a state of being flattened (in a state of uniform thickness), as shown in the conventional example, It is possible to effectively prevent a part of the resin from being caught in the supply mechanism 89 by being stuck on the card door 90. Therefore, according to the present invention, the shutter 9 shown in the conventional example is not required, and the defect of the conventional example in which the portion 92 of the granular tree wax 84 remains on the side of the supply mechanism 89 is eliminated. Further, therefore, in the present invention, the required amount of the planarized granulated resin 6 (together with the release film 11) can be supplied into the cavity 5 of the coated release film u. Then, the desired amount of the particulate resin ruthenium is heated and melted in the cavity 5 in which the release film U is coated. At this time, since the required amount of the particulate resin 6 can be supplied to the lower mold and the cavity 5 of the coated release film η in a state of being flattened (in a state of uniform thickness), the release film U is coated. The lower mold cavity 5 is capable of heating (for example, from the bottom surface side of the cavity) a desired amount of the particulate resin 6 to melt it. In the case where the granular resin 6 is supplied to the lower mold cavity 5 in a non-uniform manner, it is possible to effectively prevent the particulate resin 6 from being uniformly melted and partially hardened to become a residual powder (for example, a small hardened resin). Grain). Next, the lower mold 3 is moved upward to close the upper and lower molds 2, 3, whereby the electronic component 7 mounted on the substrate 8 supplied to the upper mold substrate mounting portion 4 is collapsed in the lower mold cavity 5. The molten resin 6 is heated, and the resin in the cavity 5 is pressed by the cavity bottom member 38. After the time required for hardening, the upper and lower molds 2, 3 are opened, and the electronic parts 7 mounted on the substrate 8 are compressed in the resin molded body 12 corresponding to the shape of the cavity 5 in the cavity 5. Forming (resin sealing forming). That is, 'the above-described' can supply the required amount of the granules 6 to the resin accommodating portion 22 of the resin supply front plate 21a by the distribution means 31 of the resin material and planarize it to form a resin dispersed plate... The above-mentioned 'in the resin accommodating portion 22 of the resin-dispersed plate 25, 21 201007859, the required amount of the planarized granule resin 6 loaded on the release film 11 is pulled into the cavity 5 together with the release film 11 and allowed to fall. 'This allows the required amount of the particulate resin 6 to be supplied into the cavity 5 of the coated release 在n in a flattened state (in a state where the desired amount of the particulate resin 6 is formed into a uniform thickness). According to the present invention, by pulling the desired amount of the planarized granules 6 into the cavity 5 together with the release film u and dropping it, the required amount can be obtained in a flattened state. The particulate resin 6 is supplied into the cavity 5 covering the release film n, so that an excellent effect of supplying the resin into the mold cavity 5 with high efficiency when the resin is supplied into the cavity of the metal mold can be achieved. Further, according to the present invention, as described above, since the required amount of the particulate resin 6 can be supplied into the cavity 5 of the coated release film u in a flattened state, it is possible to supply the resin into the cavity 3 of the mold. The superior effect of the reliability of the amount of the resin supplied into the metal mold cavity 5 can be improved with high efficiency. The present invention is not limited to the above-described embodiments, and may be arbitrarily and appropriately changed and selected and used as needed within the scope of the inventive concept. (Measuring means for other resin materials) The supply-side distribution means 3 1 b of the resin material is provided in an amount to calculate the amount of the particulate resin 6 to be supplied to the resin containing portion 22 of the resin supply front plate 21a. Plate side measuring means (dynamometer) 36 of resin material. The amount of the particulate resin 6 supplied to the resin containing portion 22 of the resin supply front plate 21a can be calculated by the plate side measuring means 36 of the resin material on the side of the supply side distribution means 31b of the resin material. Further, regarding the measurement of the particulate resin 6, the metering step of the feeder-side metering means 33 of the resin-side side-distributing means 3 1 a can be used in combination with the tree 22 201007859. The measuring step of means 36. Further, it is also possible to adopt a configuration in which only one of the two measuring steps is performed. (the flattening means for the other resin materials) - the means for distributing the supply side 3 lb of the resin material, and the vibration equalizing means (not shown) of the resin material as the flattening means of the tree moon a material The granular resin 6 (supplied with the resin supply front plate 21a) which is placed in the resin accommodating portion 22 from the linear vibration feeder 35 is vibrated and the granular resin 6 is moved in the χ or γ direction at the same time or simultaneously. According to this, the granular resin 6 is flattened in the resin housing 22 and the thickness of the granular resin 6 is made uniform. That is, 'on the supply side distribution means 31b of the resin material, the resin supply front plate 21a is vibrated by the vibration sentence homogenization means, whereby the particles supplied to the resin accommodating portion 22 of the resin supply front plate 21a can be supplied. The resin crucible moves in the X direction or the x direction. At this time, the granular resin 6 supplied to the resin containing portion 22 is moved and flattened in the χ direction Φ or γ direction, whereby the thickness of the particulate resin 6 can be made uniform in the resin accommodating portion 22. In other words, the resin-dispersed plate 25 having the resin containing portion 22 (opening portion 37) to which the desired amount of the planarized particulate resin 6 (the particulate resin 6 having a uniform thickness) is supplied can be formed. Further, in the resin material placing means 32 (linear vibration feeder 35), the granular resin 6 is vibrated, whereby the resin accommodating portion 22 of the resin supply front plate 21a can be placed in a resin amount per unit time - a predetermined amount. . At this time, 'the amount of the resin amount per unit time is appropriately adjusted, and the vibration of the resin supply front plate 21a (particle resin 6) by the vibration homogenization means of the tree material 2010 2010059' can be put into the resin The particulate resin 6 in the accommodating portion 22 is formed to have a uniform thickness (a certain amount of resin per unit area). Further, a configuration in which the pellet resin 6 is dropped into the central portion of the resin accommodating portion 22 of the resin supply front plate 21a can be employed. At this time, in the resin accommodating portion 22, the vibrating particulate resin 6 can be uniformly moved toward the outer peripheral direction to be flattened (the thickness of the granular resin 6 is uniform). Further, in the case where the uneven resin portion is left in the resin-containing resin portion 6 in the resin accommodating portion 22 of the resin supply front plate 21a, it is applied to the resin supply front plate 21a by a flattening means of an appropriate resin material. The unevenness is flattened by the vibration or by the pallet to make the thickness of the particulate resin 6 uniform. Further, in the above embodiment, a thermosetting resin material is used, but a thermoplastic resin material may be used. Further, in the above embodiment, although the granular resin material 6 is used, it is also possible to use a powdery resin material (Pink Tree ◎ Moonworm) having a desired particle size distribution, and a powdery resin material (powder resin). ) Resin materials of various shapes. Further, in the above embodiment, for example, a resin material of a ruthenium oxygen type or a resin material of a ring lanthanum type can be used. Further, in the above embodiment, various resin materials such as a resin material having transparency, a resin material having translucency, and a fat material containing a fluorescent material of a light-filling material can be used. Further, in the resin-dispersed plate 25, a cover member is provided on the surface of the resin-receiving plate 2, 24 201007859, and a cover may be provided in the upper opening portion 39 (resin housing portion 22). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic perspective view showing a resin storage plate and a resin material distribution mechanism for a compression molding method of an electronic component according to the present invention, and shows a state in which a resin material is dispensed on the plate. 2(1) and 2(2) are schematic perspective views showing a resin-receiving sheet for explaining a press-forming method for an electronic component according to the present invention, and Fig. 2(1) shows the resin shown in Fig. 1. In the material distribution mechanism, in the state in which the resin material is dispensed in the sheet, Fig. 2 (2) shows that the resin material to which the resin material is dispensed is dispersed in the distribution mechanism of the resin material shown in Fig. 1 . 3 is a schematic longitudinal cross-sectional view showing a metal mold apparatus for compression molding of an electronic component in a compression molding method for an electronic component according to the present invention, and the resin-dispersed plate shown in FIG. 2 (2) is not supplied to the metal. The state of the mold unit. FIG. 4 is a schematic longitudinal cross-sectional view showing a metal mold apparatus for compression molding of an electronic component corresponding to FIG. 3, showing that the release film is adsorbed and coated in a mold cavity provided under the metal mold device (metal mold). The resin material is supplied from the resin-dispersed plate to the state in which the cavity of the release mold is covered. Fig. 5 is a schematic longitudinal cross-sectional view showing a metal mold device (metal mold) for compression molding of an electronic component corresponding to Fig. 3, and showing a mold closing state of the metal mold. Fig. 6 is a schematic longitudinal cross-sectional view showing a conventional molding method for a metal part by a compression molding method of a known electronic component; 201007859 A schematic longitudinal sectional view of a metal mold apparatus for shrinking molding of an electronic component; [Description of main component symbols] 1 Metal mold for compression molding of an electronic component (mold) 2) Fixing the upper mold 3 Moving the lower mold 4 Substrate mounting portion 5 Lower mold cavity 6 Granular resin material (granular resin) 7 Electronic parts 8 Substrate 9 Internal loader 9a Board contact portion 9b Substrate loading portion 10 Cavity opening Part 11 Release film 12 Resin molded body 21 Resin accommodation plate 21a Resin supply front plate 22 Resin accommodation portion 23 Under plate opening portion 24 Plate peripheral portion 25 Resin dispersed plate 31 Resin material distribution means 31a Loading side distribution means

26 201007859 - 31b接受供應側分配手段 3 2 樹脂材料之放入手段 33 進給器側之計量手段 34 進料斗 35 線性振動進給器 36 板侧之計量手段 37 開口部 ©38 腔底面構件 39 板上方開口部 40 板裝載部 41 所需之厚度（距離） 42 水平移動平坦化機構 2726 201007859 - 31b Accepting supply side distribution means 3 2 Resin material placing means 33 Feeder side measuring means 34 Feeding hopper 35 Linear vibrating feeder 36 Plate side measuring means 37 Opening part ©38 Cavity bottom part 39 plate Upper opening portion 40 Required thickness (distance) of the board loading portion 41 42 Horizontal movement flattening mechanism 27

Claims (1)

201007859 七、申請專利範圍： ι_一種電子零件之壓縮成形方法，係將所需量之樹脂材 料供應至被覆有脫模膜之金屬模具腔内，且將電子零件浸 潰於該腔内之樹脂’據以在該腔内之與該腔之形狀對應之 樹脂成形體内將該電子零件壓縮成形，其特徵在於，包含： 將脫模膜被覆於具備與該金屬模具腔對應之開口部之 樹脂收容用板之下面，以形成具有樹脂收容部之樹脂供應 前板的步驟； 將所需量之樹脂材料供應至該樹脂供應前板之該樹脂 ® 收容部的步驟； 使該樹知收容部内之樹脂材料之厚度均勻，以形成平 坦化之樹脂已分散板的步驟； 將該樹脂已分散板裝載於該金屬模具腔之位置，據以 使該樹脂收容部透過該脫模膜與該金屬模具腔一致的步 驟； 將該脫模骐被覆於該腔面的步驟；以及 將該脫模膜被覆於該腔面時，將樹脂材料從該樹脂收 © 容部内供應至該金屬模具腔内的步驟。 2·如申請專利範圍帛】項之電子零件之魔縮成形方 法’其包含使該樹脂收容部内之樹脂材料之厚度均句以形 成平坦化之樹脂已分散板時，一邊將所需量之樹脂材料供 應至該樹脂供應前板之該樹脂收容部、一邊使該樹脂供應 "t板移動於X方向或γ方向，據以將該樹脂收容部内之樹 脂材料形成為所需之均句厚度以使其平坦化的步驟。 28 201007859 '、3·如中請專㈣圍第1項之電子零件之壓縮成形方 法，其包含使該樹脂收容部内之樹脂材料之厚度均勻以形 成平坦化之樹脂已分散板時，使樹脂供應前板振動，據以 將該樹脂收容部内之樹脂材料形成為所需之均勻厚度以使 其平坦化的步驟。 4. 如申請專利範圍第〗項之電子零件之壓縮成形方 法，其中，該樹脂材料係顆粒狀之樹脂材料或粉末狀之樹 脂材料。 9 5. —種電子零件之壓縮成形用金屬模具裝置，具備由上 模具及與該上模具對向配置之下模具構成之電子零件之壓 縮成形用金屬模具、設於該下模具之壓縮成形用腔、設於 該上模具之基板安裝部、被覆該下模具腔内之脫模膜按 壓該下模具腔内之樹脂之樹脂按壓用之腔底面構件、及將 樹脂材料與安裝電子零件之基板供應至該金屬模具之内部 裝載機，其特徵在於： 參 具備安裝於該内部裝載機且具有開口部之樹脂收容用 板、被覆該樹脂收容用板之下面側以將該開口部形成於樹 月曰收谷部之脫模膜、及將樹脂材料供應至該樹脂收容部之 樹脂材料之分配手段’被覆該壓縮成形用腔内之該脫模膜 與被覆該樹脂收容用板下面側之該脫模膜相同。 6. 如申請專利範圍第5項之電子零件之壓縮成形用金 屬模具裝置，其中’在將樹脂材料供應至該樹脂收容部之 樹脂材料之分配手段，設置將樹脂材料供應至該樹脂收容 #之樹脂材料之供應手段、計算供應至該樹脂收容部之樹 29 201007859 月曰材料之量之樹脂材料之計量手段、及使供應至該樹脂收 容部之樹脂材料平坦化之樹脂材料之平坦化手段。 7.如申請專利範圍第6項之電子零件之壓縮成形用金 屬模具裝置’丨中’該平坦化手段係使該樹脂收容用板 動；X方向或Y方向之水平移動平坦化機構。 8且如申請專利範圍…之電子零件之壓縮成形用金 末狀二該樹脂材料係顆粒狀之樹脂材料或粉 鲁 9·如申請專利範圍第5項之 屬模具裝置，盆中，㈣㈣％ 件之壓縮成形用金 ^ T ’該脫模膜，你蔣且& 切斷成所需長度而準備者。 ' ，之脫模膜預先 八、圖式： (如次頁）201007859 VII. Patent application scope: ι_ An electronic component compression molding method, which supplies a required amount of resin material to a metal mold cavity covered with a release film, and impregnates the electronic component into the cavity. The compression molding of the electronic component in the resin molded body corresponding to the shape of the cavity in the cavity, comprising: coating the release film on the resin having the opening corresponding to the cavity of the metal mold a step of forming a resin supply front plate having a resin accommodating portion under the accommodating plate; a step of supplying a required amount of the resin material to the resin accommodating portion of the resin supply front plate; a step of uniformly forming a resin material to form a flattened resin-dispersed plate; loading the resin-dispersed plate at a position of the metal mold cavity, so that the resin receiving portion passes through the release film and the metal mold cavity a step of uniformly covering the cavity surface; and coating the resin material from the resin when the release film is coated on the cavity surface The step of supplying the inside into the cavity of the metal mold. 2. The method of the invention of the invention relates to a method for forming a magical component of an electronic component in which the thickness of the resin material in the resin accommodating portion is uniform to form a flattened resin dispersed plate, and a desired amount of resin is used. The material is supplied to the resin accommodating portion of the resin supply front plate, and the resin supply "t plate is moved in the X direction or the γ direction, whereby the resin material in the resin accommodating portion is formed into a desired uniform thickness. The step of flattening it. 28 201007859 ', 3·For example, please refer to the method of compression molding of the electronic component of the first item, which includes the resin supply when the thickness of the resin material in the resin accommodating portion is made uniform to form a flattened resin dispersed plate. The front plate is vibrated, and the resin material in the resin accommodating portion is formed into a desired uniform thickness to planarize it. 4. The compression molding method for an electronic component according to the scope of the patent application, wherein the resin material is a granular resin material or a powdery resin material. 9. A metal mold apparatus for compression molding of an electronic component, comprising a mold for compression molding of an electronic component including an upper mold and a mold disposed opposite to the upper mold, and a compression molding provided in the lower mold a cavity, a substrate mounting portion provided in the upper mold, a cavity bottom surface member for pressing the resin in the lower mold cavity, and a resin substrate and a substrate on which the electronic component is mounted In the internal loader of the metal mold, a resin storage plate having an opening attached to the internal loader and a lower surface side covering the resin storage plate are formed to form the opening in the tree raft The release film of the valley portion and the dispensing means of the resin material for supplying the resin material to the resin accommodating portion cover the release film in the compression molding cavity and the release film covering the lower surface side of the resin storage plate The membrane is the same. 6. The metal mold apparatus for compression molding of an electronic component according to claim 5, wherein 'the resin material is supplied to the resin material by means of a resin material supplied to the resin accommodating portion, and the resin material is supplied to the resin container # The means for supplying the resin material, the means for measuring the amount of the resin material supplied to the resin accommodating portion, and the means for flattening the resin material for flattening the resin material supplied to the resin accommodating portion. 7. The metal mold apparatus for compression molding of an electronic component according to claim 6 of the patent application, wherein the flattening means causes the resin to be accommodated in a plate; and the horizontal direction flattening mechanism is moved in the X direction or the Y direction. 8 and as in the scope of application for patents, the metal parts for compression molding are in the form of gold. The resin material is a granular resin material or powder ruth. 9. If it is a mold device of the fifth item of the patent application, in the basin, (4) (four)% The compression molding is made of gold ^T 'the release film, you Chiang and & cut into the required length and prepared. ', the release film in advance eight, the pattern: (such as the next page) 3030
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