PH12014500725B1 - Method for compression-molding electronic component and die apparatus - Google Patents

Method for compression-molding electronic component and die apparatus

Info

Publication number
PH12014500725B1
PH12014500725B1 PH12014500725A PH12014500725A PH12014500725B1 PH 12014500725 B1 PH12014500725 B1 PH 12014500725B1 PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 B1 PH12014500725 B1 PH 12014500725B1
Authority
PH
Philippines
Prior art keywords
resin
die cavity
release film
mold release
supplied
Prior art date
Application number
PH12014500725A
Other versions
PH12014500725A1 (en
Inventor
Hiroshi Uragami
Naoki Takada
Osamu Otsuki
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of PH12014500725B1 publication Critical patent/PH12014500725B1/en
Publication of PH12014500725A1 publication Critical patent/PH12014500725A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/345—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461—Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3488—Feeding the material to the mould or the compression means uniformly distributed into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/251—Particles, powder or granules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

In the process of supplying a granular resin 6 into a lower-die cavity 5, the reliability of the amount of resin supplied into lower-die cavity 5 is efficiently improved by the following method: The bottom side of a resin-receiving plate 21 having an opening section 37 corresponding to the lower-die cavity 5 is covered with a mold release film 11 to obtain a resin-supplying plate 21a in which the opening section 37 functions as a resin-receiving section 22. A required amount of granular resin 6 is supplied into the resin-receiving section 22 and then formed into a flat layer (with a uniform thickness) to obtain a resin-fiat-loaded plate 25. Next, the resin-fiat-loaded plate 25 is set at the position of the lower-die cavity 5, and the mold release film 11 is pulled into the lower-die cavity 5 so that the required amount of flattened granular resin 6 is made to fall together with the mold release film 11 and supplied into the cavity 5 covered with the mold release film 11.
PH12014500725A 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus PH12014500725A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008205018A JP5153509B2 (en) 2008-08-08 2008-08-08 Electronic component compression molding method and mold apparatus
PCT/JP2009/003683 WO2010016223A1 (en) 2008-08-08 2009-08-03 Method for compression-molding electronic component and die apparatus

Publications (2)

Publication Number Publication Date
PH12014500725B1 true PH12014500725B1 (en) 2015-01-26
PH12014500725A1 PH12014500725A1 (en) 2015-01-26

Family

ID=41663452

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014500725A PH12014500725A1 (en) 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus

Country Status (7)

Country Link
JP (1) JP5153509B2 (en)
KR (3) KR101430797B1 (en)
CN (2) CN102105282B (en)
MY (2) MY152441A (en)
PH (1) PH12014500725A1 (en)
TW (3) TWI567837B (en)
WO (1) WO2010016223A1 (en)

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JP5576197B2 (en) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 Electronic component compression molding method and molding apparatus
SG11201402077UA (en) * 2011-11-08 2014-09-26 Apic Yamada Corp Resin molding apparatus
KR101373459B1 (en) * 2011-12-23 2014-03-11 세메스 주식회사 Resin mold apparatus
KR101299259B1 (en) * 2013-04-03 2013-08-22 주식회사 에스아이 플렉스 Mode key attachment method
JP6049597B2 (en) * 2013-11-28 2016-12-21 Ｔｏｗａ株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6057880B2 (en) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 Resin material supply method and supply device for compression molding apparatus
JP6212399B2 (en) 2014-01-21 2017-10-11 Ｔｏｗａ株式会社 Film sheet cutting device and cutting method
JP6017492B2 (en) 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 Manufacturing method of resin-encapsulated electronic component, plate-like member with protruding electrode, and resin-encapsulated electronic component
JP6310773B2 (en) * 2014-05-22 2018-04-11 Ｔｏｗａ株式会社 Resin molding apparatus and resin molding method
JP6298719B2 (en) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 Resin sealing device and resin sealing method
JP5944445B2 (en) * 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 Manufacturing method of resin-encapsulated electronic component, plate-like member with protruding electrode, resin-encapsulated electronic component, and manufacturing method of plate-like member with protruding electrode
JP6282564B2 (en) * 2014-09-16 2018-02-21 東芝メモリ株式会社 Manufacturing method of semiconductor device
JP6400446B2 (en) * 2014-11-28 2018-10-03 Ｔｏｗａ株式会社 Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component
JP6212609B1 (en) 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 Resin molding apparatus and resin molded product manufacturing method
JP6279047B1 (en) * 2016-10-11 2018-02-14 Ｔｏｗａ株式会社 Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method
JP6270969B2 (en) * 2016-11-22 2018-01-31 Ｔｏｗａ株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6774865B2 (en) 2016-12-13 2020-10-28 アピックヤマダ株式会社 Frame jig, resin supply jig and its weighing method, mold resin measuring device and method, resin supply device, resin supply measuring device and method, and resin molding device and method
JP6165372B1 (en) * 2017-01-10 2017-07-19 信越エンジニアリング株式会社 Work conveying apparatus and work conveying method
JP6236561B1 (en) * 2017-04-27 2017-11-22 信越エンジニアリング株式会社 Work bonding apparatus and work bonding method
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6349447B2 (en) * 2017-08-10 2018-06-27 Ｔｏｗａ株式会社 Method for manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component
TWI787417B (en) 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
CN110223992B (en) * 2019-06-27 2021-09-03 武汉华星光电半导体显示技术有限公司 Display panel, forming die of display panel and preparation method of display panel
CN110667021B (en) * 2019-09-16 2021-06-25 大同新成新材料股份有限公司 Carbon composite material flattening and forming device and using method thereof
WO2022264374A1 (en) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP2023048797A (en) * 2021-09-28 2023-04-07 アピックヤマダ株式会社 Resin sealing device and resin sealing method

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JP3900947B2 (en) * 2002-01-30 2007-04-04 大日本インキ化学工業株式会社 Manufacturing method of fuel cell separator, fuel cell separator and fuel cell
JP4268389B2 (en) * 2002-09-06 2009-05-27 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
JP4262468B2 (en) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 Resin molding method, resin molding apparatus, and support jig used therefor
JP4336499B2 (en) * 2003-01-09 2009-09-30 Ｔｏｗａ株式会社 Resin sealing molding method and apparatus for electronic parts
JP4431440B2 (en) * 2004-05-25 2010-03-17 住友重機械工業株式会社 Resin supply device and resin supply method
JP4741383B2 (en) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 Resin sealing method for electronic parts
JP4855307B2 (en) * 2007-03-13 2012-01-18 Ｔｏｗａ株式会社 Electronic component compression molding method

Also Published As

Publication number Publication date
KR20110051228A (en) 2011-05-17
KR101430797B1 (en) 2014-08-18
CN102105282B (en) 2014-04-09
KR101523163B1 (en) 2015-05-26
JP2010036542A (en) 2010-02-18
KR20130124416A (en) 2013-11-13
TW201616586A (en) 2016-05-01
MY152441A (en) 2014-09-30
KR20130125407A (en) 2013-11-18
CN103921384A (en) 2014-07-16
JP5153509B2 (en) 2013-02-27
KR101523164B1 (en) 2015-05-26
TW201007859A (en) 2010-02-16
TWI529822B (en) 2016-04-11
TWI543275B (en) 2016-07-21
WO2010016223A1 (en) 2010-02-11
PH12014500725A1 (en) 2015-01-26
TW201436061A (en) 2014-09-16
TWI567837B (en) 2017-01-21
MY182931A (en) 2021-02-05
CN102105282A (en) 2011-06-22
CN103921384B (en) 2016-11-16

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