MY161050A - Method for encapsulating electronic components with a controllable closing force - Google Patents

Method for encapsulating electronic components with a controllable closing force

Info

Publication number
MY161050A
MY161050A MYPI2010006012A MYPI2010006012A MY161050A MY 161050 A MY161050 A MY 161050A MY PI2010006012 A MYPI2010006012 A MY PI2010006012A MY PI2010006012 A MYPI2010006012 A MY PI2010006012A MY 161050 A MY161050 A MY 161050A
Authority
MY
Malaysia
Prior art keywords
closing force
electronic components
encapsulating material
encapsulating electronic
controllable closing
Prior art date
Application number
MYPI2010006012A
Inventor
Wilhelmus Gerardus Jozef Gal
Johannes Lambertus Gerardus Venrooij
Henricus Antonius Maria Fierkens
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of MY161050A publication Critical patent/MY161050A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/7653—Measuring, controlling or regulating mould clamping forces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76013—Force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B29C2945/76214—Injection unit drive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B29C2945/76257—Mould cavity
    • B29C2945/7626—Mould cavity cavity walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76505—Force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76702—Closure or clamping device
    • B29C2945/76709—Closure or clamping device clamping or closing drive means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76822—Phase or stage of control
    • B29C2945/76876—Switch-over
    • B29C2945/76882—Switch-over injection-holding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76929—Controlling method
    • B29C2945/76933—The operating conditions are corrected immediately, during the same phase or cycle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

THE INVENTION RELATES TO A METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS MOUNTED ON A CARRIER, COMPRISING THE PROCESSING STEPS OF: MOVING A NUMBER OF MOULD PARTS (2, 3) TOWARD EACH OTHER WITH A CLOSING FORCE WHEREBY THE ELECTRONIC COMPONENT IS ENCLOSED BY A MOULD CAVITY (5), EXERTING PRESSURE ON A LIQUID ENCAPSULATING MATERIAL, FILLING THE MOULD CAVITY (5) WITH ENCAPSULATING MATERIAL, AND CURING THE ENCAPSULATING MATERIAL, WHEREIN THE PRESSURE ON THE ENCAPSULATING MATERIAL IS MEASURED, AND THE CLOSING FORCE OF THE MOULD PARTS AND THE EXERTED PRESSURE ARE DEPENDENT ON EACH OTHER. THE MOST ILLUSTRATIVE DRAWING IS
MYPI2010006012A 2008-07-17 2009-07-16 Method for encapsulating electronic components with a controllable closing force MY161050A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2001818A NL2001818C2 (en) 2008-07-17 2008-07-17 Method for encapsulating electronic components with a controllable closing force.

Publications (1)

Publication Number Publication Date
MY161050A true MY161050A (en) 2017-04-14

Family

ID=40361595

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010006012A MY161050A (en) 2008-07-17 2009-07-16 Method for encapsulating electronic components with a controllable closing force

Country Status (6)

Country Link
KR (1) KR20110043620A (en)
CN (1) CN102099170A (en)
MY (1) MY161050A (en)
NL (1) NL2001818C2 (en)
TW (1) TWI509715B (en)
WO (1) WO2010008287A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5625673B2 (en) * 2010-09-24 2014-11-19 日本電気株式会社 Injection molding method and apparatus
JP6076117B2 (en) * 2013-02-13 2017-02-08 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
CN103395180B (en) * 2013-08-20 2016-05-18 铜陵富仕三佳机器有限公司 A kind of portable die ejecting force testing arrangement
AT514847B1 (en) * 2013-09-30 2015-06-15 Engel Austria Gmbh Method for determining a setpoint for a setting parameter
NL2016011B1 (en) 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
US20210031425A1 (en) * 2018-02-13 2021-02-04 Kistler Holding Ag Pressure sensor
JP7068148B2 (en) * 2018-12-05 2022-05-16 Ｔｏｗａ株式会社 Resin molding equipment and manufacturing method of resin molded products
NL2025807B1 (en) * 2020-06-10 2022-02-16 Besi Netherlands Bv Method and mold for encapsulating electronic components mounted on a carrier

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1270269B (en) * 1963-08-03 1968-06-12 Eckert & Ziegler G M B H Mold closing and opening device for mold filling machines, especially injection molding machines
JPS6039009B2 (en) * 1978-05-06 1985-09-04 ぺんてる株式会社 Injection molding control method
JPH02273220A (en) * 1989-04-14 1990-11-07 Minolta Camera Co Ltd Clamping force setting apparatus of injection molding machine
JPH0813486B2 (en) * 1990-11-01 1996-02-14 株式会社ソディック Control method of mold clamping force of injection molding machine
JP3144699B2 (en) * 1991-11-30 2001-03-12 アピックヤマダ株式会社 Resin molding method and resin molding device for resin molded products
DE4200163A1 (en) * 1992-01-07 1993-07-08 Juergen Roeper Automatic regulating system for injection mould closure pressure - has controller which regulates curve of mould closure pressure against time according to corresponding curve of internal mould pressure
GB2273175B (en) * 1992-12-04 1996-05-15 Advanced Systems Automation Pt Direct drive electro-mechanical press for encapsulating semiconductor devices
JPH06182803A (en) * 1992-12-17 1994-07-05 Fujitsu Miyagi Electron:Kk Molding resin sealing device
JP2736757B2 (en) * 1995-03-16 1998-04-02 日精樹脂工業株式会社 Mold clamping force control method for injection molding machine
JP3524205B2 (en) * 1995-04-18 2004-05-10 株式会社サイネックス Semiconductor resin sealing device
NL1002083C2 (en) * 1996-01-12 1997-07-15 Fico Bv Device for enclosing electronic components fixed on lead frames in casing
JP3746357B2 (en) * 1997-08-21 2006-02-15 アピックヤマダ株式会社 Resin molding equipment
US7008575B2 (en) * 1999-12-16 2006-03-07 Dai-Ichi Seiko Co., Ltd. Resin sealing mold and resin sealing method
NL1022323C2 (en) * 2003-01-08 2004-07-09 Fico Bv Device and method for encapsulating an electronic component mounted on a carrier with encapsulating material.
NL1026670C2 (en) * 2004-07-16 2006-01-17 Fico Bv Encapsulation of electronic components, e.g. semiconductors, in mold by introducing part of conditioning gas into mold cavity during release of encapsulating material such that releasing gas pressure is exerted on encapsulating material
NL1026739C2 (en) * 2004-07-29 2006-01-31 Fico Bv Mold part for enveloping electronic components.

Also Published As

Publication number Publication date
TWI509715B (en) 2015-11-21
WO2010008287A1 (en) 2010-01-21
NL2001818C2 (en) 2010-01-19
CN102099170A (en) 2011-06-15
TW201009962A (en) 2010-03-01
KR20110043620A (en) 2011-04-27

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