201009962 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於藉由封裝材料來封裝安裝於 具上之電子元件的方法，其包含如下處理步驟：A)將二載 於封裝之電子s件置放p模具部件上；B)藉由_封閉= 用力使若干模具部件移向彼此，以使得用於封裝之該電子 元件係由-模穴封入且該載具係夾在該等模具部件：間. c)藉由至少一個活塞將壓力施加於一液體封裝材料上：以 使得封裝材料位移至封人該t子元件之該模穴；d) 裝材料填充該模穴；及E)至少部分地使該模穴中据 材料固化。 x、丁装 【先前技術】 根據先前技術，該封閉作用力無關於處理狀況係十互定 的，或該封閉作用力之控制係在兩個不同位準之間 填充模穴(饋入狀況)時之較低壓力位準 攻田糟由封裝材料完全埴奋媒 拄 異充模八時（且在該時刻填充壓力 力、：準饋二況中之麼力）“較大封閉作用力之較高壓 自（㈣測之）較低壓力轉變為（經伯 刻’大體上係由一達到經確定之位置的藉以供 == 塞確m —個（或多個）活塞之位置201009962 VI. Description of the Invention: [Technical Field] The present invention relates to a method for packaging an electronic component mounted on a device by a packaging material, comprising the following processing steps: A) loading the package in the package The electronic component is placed on the p-mold component; B) by means of _blocking = forcefully moving the plurality of mold components toward each other such that the electronic component for packaging is enclosed by the die cavity and the carrier is clamped thereto Mold component: between: c) applying pressure to a liquid encapsulating material by at least one piston: such that the encapsulating material is displaced to the cavity in which the t subelement is sealed; d) the filling material fills the cavity; and E At least partially curing the material in the cavity. x, Ding [Prior Art] According to the prior art, the sealing force is independent of the processing conditions, or the control of the closing force fills the cavity between two different levels (feeding condition) The lower pressure level of the time is better than the packaging material. The packaging material is completely excited and the filling is eight times (and the pressure is filled at this moment: the force in the two conditions of the feed). The high pressure is converted from (at the fourth test) to a lower pressure (in general, by a position that reaches a determined position for == plugged m - one (or more) piston position
的壓力控制之缺點為也丨I 為該控制不準確且不可靠。舉例而言， 該控制尤其不考廣捭获ώ、、备宜 > 必 量/體積的封裝材料的顆粒之重 =體積的變化及待填充之模穴的容積之變化（例如歸因於 於封裝之較多或較少電子元件的存在）。可以簡單且可 201009962 J之方式實現現有控制，但置放於載具上之電子元件之封 縮強度之載具（亦稱作:較軟品質且㈣ 載及變形損害。不…在封裝過程期間易受過 清形可具有針對載具之不利影響， 用㈣1、可不利地影響處理條件；用於封裝材料之通路及 件（且聞“道此又影響’此導致不可控制之處理條 (且因此亦導致不可控制之處理結果）。 ❹ 【發明内容】 封裝=本發明之目標在於提供-種用於藉由封裝材料來 女裝於載具上之電子元件的經改良之方法，其具有較 少廢棄物及經改良之封裝品質。 、、 為達成此目的，本發明提供一種如前言中所陳述之方 ’其中封裝材料上之壓力係由至少―個作用力感測器量 …且將Μ具部件推向彼此之封閉作用力及施加於該封震 材料上之壓力隨時間動態地取決於彼此。較佳藉 至該封裝材料之壓力感測器或藉由一連接至活塞之作用力 感測器來量測該封裝材料上之壓力。根據本發明之方法的 優點相關於模Μ之封裝材料施加於模具部件上的壓力盘 :模具部件推向彼此之封閉作用力的合力。此係因為此: :現已變得可容易地控制。該合力決定由模具部件施加於 具f之壓力。施加於載具上之作用力的良好可控制性可 防止„亥合力（實務上亦稱作板壓力）超過一經確定之最大 值。因此可防止載具之不良損害及變形。藉此亦有可能防 止該合力在封裝過程期間降至低於經決定之最小值，進而 5 201009962 漏（所謂的溢料及铸 結果（例如，由封震 ’對載具之較少損害 防止液體封裝材料於模穴外的不良茂 漏）。本方法因此導致經改良之封装 材料製造之封裝體/外殼的較佳壓實） 及載具之較少污染。 封裝材料上之壓力係藉由一作用力感測器來 作用力感測器可（例如）由一連接至 ^ « „ 了裝材料之壓力感測 器組成。此4感測器中之一或多者 , ^ Μ , 非常精確地里測封裝 / 且在此處與封裝材料接觸。、繼而必須選擇 感測器以使得其不會由於固化封裝材料而出現故障且使得 感測器之存在不對封裝過程產生負效應。量測封裝材料上 =的替代方法係由藉由連接至活塞之作用力感測器來 卜㈣力所^。該作用力感測器可繼而在距封裝材料 :::處起作用’且因此不“（或存在較少）由固化 封裝材料引起之污染的危險。 模具部件之封閉作用力及封裝材料上之屋力可動態地 、於彼此（亦即’以隨時間之連續方式）且正向地及負 ϋ 父正’換言之’不是僅界定根據固定型樣來控制壓力 之相對調整所依據的一或多個離散位準。實情為，該調整 =連續方式進行且可能不會僅遵循_預先程式化之模型而 = 據、！量測之值導致待控制之變數的隨機正調整或負 :整。封裝材料上之壓力及封閉作用力的該自由控制亦具 如下優點：當封裝材料上之壓力仍相對低時封裝開始 時（亦即，在尚未藉由封裝材料完全填充模穴時）之封閉 作用力可同樣保持為受限的。此情形具有如下結果：模穴 201009962 2連接件（封裝材料之饋人件及氣 大且模穴中之空間卩出件）將保持相對 穴之壁之間的空 ：：，用於封裝之電子元件與模 封㈣力，藉此模且：! 期間）之相對低之 形至相^ I、°卩件未緊㈣封卩相致其等使載具變 m^斤得之處理優點係封裝材料之饋入及 脫氣可相對容易地進行， 汉 裝材料之流動亦較容易、a之額外空間，封 籲开行且具有（例如）連接引線變 开/ (引線偏移）的較少可*处 了靶性。藉此不僅改良處理結果， 而且富藉由封裝材料穿+ 土吉古 叶凡王填充梹八時，亦可加速封裝材料 之饋入及稍後在處理循環期間的壓力上升。 較佳地為量測封裳材料上之麼力，模具部件之封閉作 用力依據此受到控制。在此狀況中，封褒材料上之壓力（亦 稱作填充壓力）為控制模具部件之封閉作用力（從變數） 所依據的前導變數（主變數）。然而，亦有可能量測控制 春封裝材料上之壓力所依據之模具部件之封閉作用力。在此 第二狀況中，封閉作用力為控制封裝材料上之壓力（從變 數）所依據之前導變數（主變數）。然而亦有可能兩個變 數（封閉作用力及封裝材料上之壓力）互動式地彼此相關。 亦有可能基於經量測之壓力來改變連接至模穴之氣體 排出件的通路。藉由控制一可變通路開口（例如，藉由旋 轉一通道段（channel segment ) (V形銷）或位移用於來自 模八之乳體之排出通道的壁部分）而使此成為可能。另— 選擇為動態控制氣體排出件上之負壓力以使得此取決於藉 201009962 由壓力感測器偵測之封裝材料上之壓力的變化。為達成此 目的，尤其參考專利公開案NL 1026739及N]L 2〇〇〇488。 為了進一步增強本方法之可靠性，需要針對封裝材料 上之壓力決定至少一個值，基於該至少—個值之偵測，若 尚未達到-經決定之最小值，則夾持作用力增加至此值。 以此方式引入一安全裝置。此係因為，若封裝材料上之壓 力達到經決定之最小值，則模具部件之封閉作用力亦將必 須增加。在動態控制出現故障的不可能之情況下，可以此 方式防止諸如產品損耗、模具部件之污染等嚴重問題。 根據又一進一步改良，亦量測載具上之模具部件的壓 力’且將模具部件推向彼此之封閉作用力及施加於封裝材 枓上之壓力繼而隨時間取決於模具部件上量測的壓力。施 =於載具上之壓力的此量測表示可能關鍵之變數的直接量 測。特定言之，在表面負載之—位準下以 離處理載具的情況中，可因此防止 ；敏感之小距 此防止抗過載之額外安全裝置。 亦有可能使用經改良之方法仍摘測活塞位置，且當達 到至y —個預先確定之位置 右尚未達到一經確定之 值，則將夾持作用力修改為此 裝置。若（例如）藉以量測封震材二方：併入額外安全 3| 4, π 裝材枓上之壓力的壓力感測 器出現故障且不傳輸任何 ^ ^ 0H , 了以此方式防止災害。 本發明亦提供一種用於 件的裝置，其包含：至少兩個楔子元 置該等模具部件用於在-推向彼此之位 封入一夹在該等模具部件之間的載具上之該電 201009962 子元件的模穴；饋入機構，其連接至該模穴且具備至少— 個活塞’該至少一個活塞用於將壓力施加於一液體封裝材 料上以使得該封裝材料位移至封入該電子元件之該模穴； 至少一個作用力感測器，其用於偵測該液體封裝材料上之 該壓力；驅動機構，其用於藉由一可控制壓力而使該等模 具部件相互位移且將該等模具部件推向彼此；一智慧型控 制器，其連接至該作用力感測器及該等模具部件之驅動機 構，此智慧型控制器經調適以至少部分地依據藉由該作用 力感測器偵測的該等經量測之值而隨時間動態地控制該等 ，具部件之驅動機構。連接至該作用力感測器及該等模具 部件之驅動機構的該智慧型㈣器較佳耦接至用於封裝材 料之饋入機構以控制由該活塞施加於該封裝材料上的壓 :。该作用力感測器可包含—連接至該模穴之壓敏感測 =仁亦可連接至該活塞。進一步有利的是該智慧型控制 器具備-控制系統，其中該封裝材料上之—增加之 致由該等模具部件之驅動機播 古a 仟之㈣機構在δ亥等模具部件朝向彼此之 ::施加的一增加之壓力。已參考根據本發明之用於封 =件的方法來描述㈣本發明之封裝裝置的優點。 基於以下諸圖中所顯示之非 步闌明本發明。 …關不性實施例進一 【實施方式】 圖1顯示封裝裝置1之示意 備兩個可相3 意眭表不，戎封裝裝置1具 個了相互位移之模具部件2、 接觸側4上凹入至#核八5在相互面對之 上凹入至Μ模具部件2、3卜結合於下部模具 9 201009962 1 1中者為活塞6,藉由該活塞6可在已加熱封裝材料(例 推動:氧樹脂）之顆粒（未展示於此圖中）之後將其向上 沾以使得封裝材料（因此其已變成液體）經由為達成 的而配置於模具部件2、3 t之通道流動至模穴5。由 於模具。p件2、3之相對位移，下部模具部件3與一框架7 形成固定總成，且上部模具部件2經由呈氣缸8之形式的 2機構耦接至框架7。應注意，驅動機構亦可由機電驅動 =氣動/液壓增壓驅動器形成。模具部件2、3可藉由氣缸 子位移且藉由經確定之虔力推向彼此。藉由操作主抽 〇藉以旋轉之飼服電動機9進行針對封裝材料之活塞6之 :立移。主軸10之旋轉導致工作台n沿垂直導件12之垂直 立移，在工作台“上，活塞 工作台u-起位移。 支牙作口 η且因此連同 作用力感測器13 (測力計）係置放於工作台u盥活塞 6之間。作用力感測器13可因此產生—量測值其在封裝 材料為液體時表示封裝材料上之壓力。作用力感測器⑴里 號線14連接至智慧型控制$ 15。亦向智慧型控制器 :5供應來自伺服電動機9之資訊（參見可藉以傳輸（例如） 活塞6之位置相依資訊的信號線16)及來自氣缸8之資訊 (參見可藉以傳輸（例如）央' ㈣^例如）來自乳缸8之位置及壓力相依 資訊的信號線17)。亦可進—步由信號線18向智慧型控制 器15供應來自機器控制器19之資訊。機器控制器Η藉由 控制線20連接至藉以控制氣紅8之位移的泵〜控制器 幻。智慧型控制器15經由各別控制線^、以作用於藉^ 10 201009962 使活塞6位務夕供 控制器25上因= 轉制氣^之操作的 屢力且… 位移來控制封裝材料上的 =='8來控制模具部件2、3之封閉作用力，封 適/力及封閉作用力以動態且連續之方式彼此調 參 參 如二::封裝裝置3〇之替代實施例變體，其中對應於 者數1 $之封裝裝置1之元件的元件係藉由相同參 ==與以上所展示之封裝裝…同，此處所展 不之封裝裝置30具借一厭士 w w 、 I力感測器3 1，其收納於凹入至下 ^模具部件3中之模穴5中，以使得Μ力感測器31之須測 =成棋穴5之壁的一部分。可因此直接藉由壓力感測 3…測處於模穴5中之封裝材料上的壓力。經由信號線 此5己錄之量測值發送至智慧型控制器15。壓力感測 器3!形成對形成封裝裝置1之一部分的在活塞6下之作用 力感測器13的替代。 圖3顯示三曲線圖40、41、42’其分別展示由活塞施 加於封I材料上之廢力（F“，錢圖40)、將模具部件 推向彼此之作用力（F曲線圖41)及夾在模具部件之 =的=子元件之載具上之合成壓力（F板，曲線圖42)的隨 一段時間之壓力的平行變化。頂部曲線圖41顯示：施加於 封裝材料上之麼力F “在藉由封裝材料填充模穴期間保持 有限歷時較長時間段’且接著模穴一藉由封裝材料完全填 充壓力F轉移便突然快速增加。中間曲線圖4 i展示：藉以 將載具（板）夾箝在模具部件之間的壓力F ^在已處於一 11 201009962 恆定位準歷時較長時間段（又，告 曰正藉由封裝材料填充模 穴時）之後突然迅速增加至一較高位準1因於由如圖丄 及圖2中所顯示之智慧型控制器15控制的F “與F “之 相互相依性，作用於載具上之合成作用力（F板）保持在兩 個極值内（在藉由虛線展示之上限h max與下限min 之間）。此係 '因為作用於載具上之作用力由藉以使模具部 件移向彼此之作用力減去模穴中之封裝材料的（反）壓力 、、且成（F板=F夾箝-F轉移）〇在所顯示之實例中，動態 地且連續地控制封裝材料上之壓力；此壓力（F轉*)之曲 線圖最終顯現清楚地偏離直線的不可預知之圖案。 【圖式簡單說明】 圖1顯示根據本發明之封裝裝置之示意性表示。 圖2顯示根據本發明之封裝裝置之替代實施例變體的 不思性表示。 圖3顯示關於封裝材料上之壓力、將模具部件推向彼 此之作用力及載具上所造成之壓力的變化的三曲線圖。 【主要元件符號說明】 2 4 ❿ ❹ 封裝裝置 模具部件 模具部件 接觸側 模穴 活塞 框架 12 6 201009962 氣缸 Ο 伺服電動機 :主軸 :工作台 :垂直導件 :作用力感測器 :信號線 :智慧型控制器 :信號線 :信號線 :信號線 :機器控制器 :控制線 :控制器 :泵 :控制線 :控制線 :封裝裝置 :壓力感測器 :信號線 :曲線圖 :曲線圖 .曲線圖 13The disadvantage of pressure control is that 丨I is inaccurate and unreliable for this control. For example, the control is particularly devoid of ώ, 备 & 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The presence of more or less electronic components in the package). It is simple and can implement the existing control in the way of 201009962 J, but the carrier of the sealing strength of the electronic components placed on the carrier (also called: softer quality and (4) load and deformation damage. No... during the packaging process Vulnerability to the shape can have adverse effects on the vehicle, using (4) 1, can adversely affect the processing conditions; the passages and parts used to encapsulate the material (and smell "this in turn affects" this leads to uncontrollable treatment strips (and therefore It also results in uncontrollable processing results. ❹ [Invention] The object of the present invention is to provide an improved method for electronic components for women's clothing on a carrier by encapsulating materials, which has less Waste and improved package quality. In order to achieve this, the present invention provides a method as set forth in the introduction, wherein the pressure on the encapsulating material is determined by at least one force sensor... and the cookware component The closing force pushing against each other and the pressure applied to the sealing material dynamically depend on each other over time. Preferably, the pressure sensor of the encapsulating material is connected or connected The force sensor of the plug measures the pressure on the encapsulating material. The advantage of the method according to the invention is related to the pressure plate on which the encapsulating material of the mold is applied to the mold part: the closing force of the mold parts pushing each other This is because: it has now become easily controllable. The resultant force is determined by the pressure exerted by the mold part on the pressure of f. The good controllability of the force applied to the vehicle can prevent the It is also referred to as the plate pressure) and exceeds a certain maximum value. Therefore, the damage and deformation of the carrier can be prevented. It is also possible to prevent the resultant force from falling below the determined minimum during the packaging process, and thus 5 201009962 Leakage (so-called flash and casting results (for example, by the shock-proofing, less damage to the carrier prevents the liquid encapsulating material from leaking out of the cavity). The method thus results in a package made of improved packaging material/ The better compaction of the outer casing and the less pollution of the carrier. The pressure on the packaging material is acted upon by a force sensor (for example) by a connection to ^ « A pressure sensor consisting of a material. One or more of the 4 sensors, ^ Μ , very accurately measure the package / and here contact with the packaging material. Then the sensor must be selected to make It does not fail due to curing of the encapsulating material and the presence of the sensor does not have a negative effect on the encapsulation process. An alternative method of measuring the encapsulation material is by means of a force sensor connected to the piston. The force sensor can then act at a distance from the packaging material::: and therefore not (or less) the risk of contamination by the cured packaging material. The sealing force and packaging of the mold part The house forces on the material can be dynamically, in each other (ie, 'in a continuous manner over time) and positively and negatively. The father is 'in other words' not only defining the relative adjustment of the pressure based on the fixed pattern. One or more discrete levels. The truth is, this adjustment = continuous mode and may not just follow the _ pre-programmed model = data,! The value of the measurement results in a random positive or negative change of the variable to be controlled: integer. This free control of the pressure on the encapsulating material and the sealing force also has the advantage of sealing when the packaging is initially low (ie, when the cavity has not been completely filled by the encapsulating material) when the pressure on the encapsulating material is still relatively low. The force can also be kept limited. This situation has the following results: the cavity 201009962 2 connector (the feeding member of the packaging material and the gas-filled space in the cavity) will maintain the space between the walls of the opposing holes::, the electronic components used for packaging And the mold seal (four) force, by means of the mold and: the period of the relatively low shape to the phase ^ I, ° the piece is not tight (four) seal the same, so that the carrier becomes m ^ kg of the processing advantages of the packaging material The feeding and degassing can be carried out relatively easily, the flow of the Han materials is also relatively easy, the extra space of a, the sealing is open and there are fewer (for example) connection leads open / (lead offset) Targeting. This not only improves the processing results, but also enriches the filling of the encapsulating material by the encapsulation material + the earthenware, and accelerates the pressure rise during the processing cycle. Preferably, the force on the sealing material is measured, and the sealing force of the mold member is controlled according to this. In this case, the pressure on the sealing material (also referred to as the filling pressure) is the leading variable (main variable) on which the closing force (from the variable) of the mold part is controlled. However, it is also possible to measure the closing force of the mold parts on which the pressure on the spring packaging material is controlled. In this second condition, the closing force is the control of the pressure (from the variable) on the packaging material based on the previous derivative (main variable). However, it is also possible that the two variables (the closing force and the pressure on the packaging material) are interactively related to each other. It is also possible to vary the passage of the gas discharge member connected to the cavity based on the measured pressure. This is made possible by controlling a variable passage opening (e.g., by rotating a channel segment (V-pin) or displacing a wall portion for the discharge passage from the die of the die. In addition - the choice is to dynamically control the negative pressure on the gas discharge member such that this depends on the change in pressure on the packaging material detected by the pressure sensor in 201009962. To achieve this, reference is made in particular to Patent Publication NL 1026739 and N]L 2〇〇〇488. In order to further enhance the reliability of the method, it is necessary to determine at least one value for the pressure on the encapsulating material. Based on the detection of the at least one value, if the determined minimum value has not been reached, the clamping force is increased to this value. In this way a safety device is introduced. This is because if the pressure on the encapsulating material reaches a determined minimum, the sealing force of the mold part will also have to increase. Serious problems such as product loss, contamination of mold parts, etc. can be prevented in this way in the event that dynamic control fails. According to a further refinement, the pressure of the mould parts on the carrier is also measured and the closing force pushing the mould parts towards each other and the pressure exerted on the packing material are then dependent on the pressure measured on the mould parts over time. . This measurement of the pressure on the vehicle indicates a direct measurement of the possible key variables. In particular, it can be prevented in the case of handling the carrier at the surface load level. Sensitive small distance This additional safety device against overload. It is also possible to use the modified method to still measure the position of the piston, and when the y-predetermined position is reached and the right has not reached a certain value, the clamping force is modified to this device. If, for example, the two sides of the sealed seismic material are measured: the pressure sensor incorporating the additional safety 3| 4, π loading pressure fails and does not transmit any ^ ^ 0H, in this way to prevent disasters. The present invention also provides an apparatus for a member, comprising: at least two wedge elements disposed on the mold member for enclosing the electric device on a carrier sandwiched between the mold members at positions that are pushed toward each other 201009962 A cavity of a sub-element; a feed mechanism coupled to the cavity and having at least one piston' for applying pressure to a liquid encapsulating material to cause displacement of the encapsulation material to enclose the electronic component The cavity; at least one force sensor for detecting the pressure on the liquid encapsulating material; and a driving mechanism for displacing the mold parts with each other by a controllable pressure and And the like, the smart controller is coupled to the force sensor and the drive mechanism of the mold components, the smart controller being adapted to sense at least in part by the force The measured values are detected by the device and dynamically controlled over time, with the drive mechanism of the component. The smart (4) device coupled to the force sensor and the drive mechanism of the mold members is preferably coupled to a feed mechanism for the package material to control the pressure applied to the package material by the piston. The force sensor can include - a pressure sensitive test connected to the cavity. The kernel can also be coupled to the piston. It is further advantageous that the intelligent controller is provided with a control system in which the packaging material is increased by the driving of the mold parts, and the (4) mechanism is oriented toward each other in the mold parts: An increased pressure applied. The advantages of the package device of the present invention have been described with reference to the method for sealing a member according to the present invention. The invention will be described based on the non-steps shown in the following figures. BRIEF DESCRIPTION OF THE DRAWINGS [Embodiment] FIG. 1 shows two schematic representations of a package device 1. The package device 1 has a mold member 2 that is displaced from each other, and a concave portion on the contact side 4. To #核八5, recessed to each other on the face of the mold member 2, 3b combined with the lower mold 9 201009962 1 1 is the piston 6, by which the piston 6 can be heated in the package material (for example: The particles of oxy-resin (not shown in this figure) are then smeared upward so that the encapsulating material (and thus it has become liquid) flows to the cavity 5 via the channels configured for the mold parts 2, 3 t to be achieved. Thanks to the mold. The relative displacement of the p pieces 2, 3, the lower mold part 3 forms a fixed assembly with a frame 7, and the upper mold part 2 is coupled to the frame 7 via a mechanism 2 in the form of a cylinder 8. It should be noted that the drive mechanism can also be formed by an electromechanical drive = pneumatic / hydraulic booster drive. The mold parts 2, 3 can be displaced by the cylinders and pushed toward each other by a determined force. The displacement of the piston 6 for the encapsulating material is carried out by operating the main pumping motor 9 by rotating the main motor. The rotation of the spindle 10 causes the table n to move vertically along the vertical guide 12, and on the table "the piston table u-displaces. The teeth act as the port η and thus together with the force sensor 13 (dynamometer The system is placed between the workbench and the piston 6. The force sensor 13 can thereby produce a measured value indicating the pressure on the package material when the package material is liquid. The force sensor (1) 14 is connected to the smart control $ 15. The information from the servo motor 9 is also supplied to the smart controller: 5 (see the signal line 16 by which the positional information of the piston 6 can be transmitted, for example) and the information from the cylinder 8 ( See, for example, a signal line 17) for transmitting (for example, the position of the breast cylinder 8 and pressure dependent information), or the signal from the signal line 18 to the smart controller 15 from the machine controller 19 The machine controller is connected to the pump-controller by means of the control line 20 to control the displacement of the gas red 8. The smart controller 15 acts on the piston 6 via the respective control line ^. Location of the eve of the controller 25 on = turn The force of the operation of the gas ^ ... displacement to control the == '8 on the packaging material to control the closing force of the mold parts 2, 3, sealing / force and closing force to adjust each other in a dynamic and continuous manner For example, an alternative embodiment variant of the package device 3, wherein the components of the component of the package device 1 corresponding to the number of $1 are the same as those shown above by the same reference == The package device 30 is not included in the mold hole 5 recessed into the lower mold part 3 so as to be measured by the force sensor 31. As a part of the wall of the chess hole 5, the pressure on the packaging material in the cavity 5 can be directly measured by the pressure sensing 3... The measured value recorded by the signal line is sent to the smart controller 15 The pressure sensor 3! forms an alternative to the force sensor 13 under the piston 6 forming part of the package device 1. Figure 3 shows a three-curve diagram 40, 41, 42' which respectively shows the application of the piston by the piston The waste force on the material I (F", money map 40), the force pushing the mold parts toward each other (F curve Figure 41) And the parallel change of the pressure of the resultant pressure (F plate, graph 42) on the carrier of the = component of the mold part over a period of time. The top graph 41 shows that the force F applied to the encapsulating material "stains for a longer period of time during the filling of the cavity by the encapsulating material" and then the cavity is suddenly and quickly transferred by the filling material. Increased. The middle curve Figure 4 i shows: the pressure F ^ by which the carrier (plate) is clamped between the mold parts is longer than the time period that has been at a constant level of 11 201009962 (again, the warning is being packaged When the material fills the cavity, it suddenly increases rapidly to a higher level. 1 Because of the mutual dependence of F and F controlled by the smart controller 15 as shown in FIG. 2 and FIG. 2, the carrier acts on the carrier. The resultant resultant force (F plate) is kept within two extreme values (between the upper limit h max and the lower limit min shown by the dashed line). This is because the force acting on the carrier is used to make the mold part The force of moving toward each other minus the (reverse) pressure of the encapsulating material in the cavity, and (F plate = F clamp - F transfer), in the example shown, dynamically and continuously control the encapsulation material Pressure on it; this pressure (F to * The graph finally shows an unpredictable pattern that clearly deviates from the straight line. [Schematic Description of the Drawings] Figure 1 shows a schematic representation of a packaging device according to the invention. Figure 2 shows an alternative embodiment of a packaging device according to the invention. Figure 3 shows a three-curve diagram of the pressure on the encapsulating material, the force pushing the mold parts toward each other, and the pressure on the carrier. [Key Symbol Description] 2 4 ❿封装 Package unit Mold parts Mold parts Contact side cavity piston frame 12 6 201009962 Cylinder 伺服 Servo motor: Spindle: Workbench: Vertical guide: Force sensor: Signal line: Smart controller: Signal line: Signal line: Signal line: Machine controller: Control line: Controller: Pump: Control line: Control line: Package: Pressure sensor: Signal line: Curve: Curve. Curve 13