CN102548729A - Method and device for encapsulating electronic components with controlled gas pressure - Google Patents

Method and device for encapsulating electronic components with controlled gas pressure Download PDF

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Publication number
CN102548729A
CN102548729A CN2010800413057A CN201080041305A CN102548729A CN 102548729 A CN102548729 A CN 102548729A CN 2010800413057 A CN2010800413057 A CN 2010800413057A CN 201080041305 A CN201080041305 A CN 201080041305A CN 102548729 A CN102548729 A CN 102548729A
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CN
China
Prior art keywords
pressure
encapsulating material
mold cavity
pore
equipment
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CN2010800413057A
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Chinese (zh)
Inventor
W·G·J·加尔
H·A·M·费尔肯斯
A·F·G·范迪尔
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Fico BV
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Fico BV
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B29C2945/762—Injection unit injection piston
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B29C2945/76257—Mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76732—Mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76775—Fluids
    • B29C2945/76779—Fluids auxiliary fluids introduced into the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76775—Fluids
    • B29C2945/76789—Fluids environment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76822—Phase or stage of control
    • B29C2945/76859—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method for encapsulating electronic components mounted on a carrier, wherein the gas pressure in a venting connecting to the mould cavity is actively increased to an overpressure of at least 3 atmosphere after filling of the mould cavity with encapsulating material. The invention also relates to a device for performing such a method for encapsulating electronic components mounted on a carrier, comprising: mould parts which in a closed position define a mould cavity, feed means for liquid encapsulating material, a venting for suctioning gas from the mould cavity, and a pressure conduit whereby an overpressure can be applied in the venting.

Description

Utilize the method and apparatus of controlled air pressure encapsulating electronic components
Technical field
The present invention relates to as according to claim 1 method of utilizing controlled air pressure that electronic components mounted on the carrier band is encapsulated as described in the preamble.The invention still further relates to a kind of equipment of carrying out this method.
Background technology
In the packing of electronic component, more specifically,, utilize so-called " transfer modling technology " to being installed in the semi-conductive packing on the carrier band (such as lead frame (lead frame)).Here, the carrier band that has electronic component is clamped between the molded parts, thereby forms mold cavity at the component ambient that encapsulates.Liquid encapsulating material then is introduced into these mold cavity, afterwards after it is partly solidified at least, removes molded parts and removes the carrier band of the electronic component with encapsulation.Usually utilize one or more pistons to carry out the injection of moulding material, the pressure of piston can be applied in the supply process of encapsulating material.Piston can carry out displacement in a space, in this space, has also carried moulding material.Moulding material usually with the bead form of on-liquid state, utilize the packetized form of film wrapped or particle form to be arranged in mould.But the encapsulating material that injects liquid form also is possible.Encapsulating material generally includes heat cured epoxy or resin, is incorporated into funnel.Piston is exerted pressure to the encapsulating material (add hot encapsulation material to its also be not the degree of liquid) of heating simultaneously, makes it become liquid.In response to the piston applied pressure, the encapsulating material of liquid flows to the heated mold chamber, and injects mold cavity.For the encapsulating material that is not shifted, after encapsulating material was heated, as chemical bonding (being also referred to as cross linkage) result, it solidified in the mold cavity of heating at least in part.In order to increase the quality of encapsulation, can before beginning to inject encapsulating material, apply definite evacuation processes (that is, air pressure is lower than ambient pressure) in mold cavity.Here, handle the mold cavity of finding time through the air draft of flowing out usually at mold cavity influx time chien shih gas.Make encapsulating material fill with mold cavity fully and the restriction encapsulating material is extremely important to the supply of mold cavity.
Japan Patent 05-259652 has described the system of processing of book film MULTILAYER SUBSTRATE, can make the narrow gap between the lead conductor inject resin.Before moulding, utilize vavuum pump that mold cavity is found time.Then,, turn back to atmosphere pressure state, make cavity pressure be set to 5-10kg/cm through interrupting evacuation processes and in mold cavity, introducing inert gas 2Because the volatilization composition of resin is therefore non-volatile, so suppressed invalid generation.
Summary of the invention
The object of the present invention is to provide a kind of method and apparatus of encapsulating electronic components, wherein limited the leakage chance of encapsulating material, and can apply the diluent liquid encapsulating material of increase.
For this purpose; The present invention provides a kind of method that is used to be encapsulated in electronic components mounted on the carrier band as described in the preamble as claimed in claim 1; Have characteristic: after liquid encapsulating material had arrived the pore that is connected to mold cavity, the pressure that is connected in the pore of mold cavity was increased to overvoltage condition.Excess pressure also can be increased to for example 5,8,10,20 or 30 atmospheric pressures.Option of another restriction excess pressure be maximization to encapsulating material in being connected to the pore of mold cavity on the restriction of the corresponding pressure of pressure.The adjustment mold cavity has been to limit the possibility that encapsulating material further infiltrates pore thus by the advantage of the excess pressure of the pore after injecting fully.Be accurately under the situation of extremely thin liquid encapsulating material (use in the reality increases so that form the dilution encapsulation and make injection at the very narrow opening between electronic component and the carrier band), can prevent encapsulating material to pore as far as reaching infiltration.Therefore, have a spot of cure package material (pore infiltration) in the pore, this makes carrier band receive the pollution of encapsulating material less.The maintenance of encapsulating material edge freely also has following advantage: after encapsulation process, carrier band can be more easily through transporting with the transmission system such as the track conveyer that lateral edges accurately cooperates.This not only has the advantage freely that carrier band keeps (cured) encapsulating material of putting well at air-breathing aperture position place, but also has reduced the chance that the pore that is absorbed in molding portion is contaminated and/or block.The moment that excess pressure applies is different with prior art.According to prior art; (through the stream forward of valve (gate)) applied excess pressure when encapsulating material gets into mold cavity; Consequently, because excess pressure, also because the steam pressure of encapsulating material; Encapsulating material is compressed in the process that gets into mold cavity, thereby less discharge (void) in encapsulation, do not occur or occur.The present invention relates to increases gas pressure in the diverse moment, that is, and only after liquid encapsulating material has arrived the pore that is connected to mold cavity.So, so the complete packed material of mold cavity fills up, and these are significantly different with prior art.According to enlightenment of the present invention; For the chance of injecting mold cavity fully that increases encapsulating material (perhaps even can guarantee the injection mold cavity fully of encapsulating material), hope to introduce the pore that is connected to mold cavity so that only part moment of getting into the pore that is connected to mold cavity applies excess pressure at encapsulating material.Therefore the leakage chance (via the overshoot of pore) of the encapsulating material through pore is lowered or even is reduced to zero.According to the present invention; Must during injecting encapsulating material, formerly not apply excess pressure meticulously to mold cavity; Because different with the teaching of prior art, prior art needs the careful chance that increases that in encapsulating material, occurs discharging under the situation that the type of encapsulating material is confirmed.Hope more that at this air pressure in pore can not become greater than the pressure on the encapsulating material; Gas applied pressure in pore is incited somebody to action thus, and not packed material is sent to mold cavity.Therefore gas pressure in the pore will not influence the encapsulation process in the mold cavity.Pressure on the encapsulating material is approximately 60-90 atmospheric pressure (6-9mPa), and the excess pressure in the pore is preferably 3-30 atmospheric pressure (0.3-3mPa).
According to treatment step D) with encapsulating material inject mold cavity during, hope in being connected to the pore of mold cavity, to bring gas pressure to being lower than 1 atmospheric under-voltage power state.For example can preferentially apply in the practice between 0-0.5 atmospheric pressure (0-50000Pa) than low pressure, perhaps in addition lower between 0-0.1 atmospheric pressure (0-10000Pa) than low pressure.In the practice, possibly generally refer to vacuum basically.At treatment step D) in to use the advantage of under-voltage power be therefore to reduce the chance of the discharge (this does not obviously expect) of encapsulating material.
In order to confirm that exactly encapsulating material arrives the moment of pore, can measure the pressure on the encapsulating material, the increase of the pressure on encapsulating material that is wherein write down forms control signal.Pressure increase on the encapsulating material has hinted that after all liquid encapsulating material just meets with the resistance of increase really, and situation when this is the injection mold cavity and encapsulating material can only be escaped via little a lot of pore (or a plurality of pore) of sectional area ratio mold cavity.Therefore the pressure of the increase on the encapsulating material will become the control signal that initiatively increases the pressure in the pore that is connected to mold cavity.Clamp-on the pressure of the single central position of a plurality of mold cavity and can confirm the pressure on the encapsulating material through measuring encapsulating material wherein.For example this can use the direct measurement of the sensor (loading sensor) of contiguous mold cavity perhaps to pass through to measure indirectly (for example, in the situation of measuring the piston applied pressure, making encapsulating material move to the mold cavity of encirclement electronic component by piston).Indirectly measure and have advantage that sensor need not contact with encapsulating material etc.For example can measure the power that makes the piston beam cause displacement.A plurality of pistons use a piston beam to produce displacement usually.Therefore, the increase on the encapsulating material that the result write down can for example be the time delay of confirming, effective increase of the pressure in being connected to the pore of mold cavity.Therefore to have arrived pore be very possible to encapsulating material before pressure increased in pore.Time delay for example can guarantee that encapsulating material has got into pore and surpassed a restricted distance; Stage when mold cavity does not also have packed material to fill up fully need prevent that the pressure on the encapsulating material from accumulating after all; This can cause inevitably not exclusively injecting of mold cavity.Time delay can reduce the danger of the incomplete injection of mold cavity.
The present invention can also handle mobile strong encapsulating material, because limited the probability of mobile strong encapsulating material through the leakage (splash, flow out) of pore.Therefore become and to handle the situation during have the 2-9 poiseuille encapsulating material of dynamic viscosity of ([Pa.s]=[kg/m.s]) injects mold cavity.In this attention; The encapsulating material of the lower viscosity that increases applies hopes, therefore so that can make encapsulating material in relatively little space and the abundant injection of dropping from the air (this is the result of the market demand of the miniaturization of sustainable growth) with very limited height.
Can also with this method with place membrane material and combine being connected on the pore of mold cavity, wherein on a side, apply excess pressure away from the film of encapsulating material.On a side of encapsulating material, applying under-voltage power during then also being desirably in encapsulation.This has prevented the feed path of excess pressure pollution encapsulating material.And in this mode, also reduced gas flows into mold cavity with the mode of not expecting probability.When excess pressure is applied on the film, be sealably coupled to the under-voltage connecting portion of pore through using film, pore (it was effective before mold cavity is not also introduced processing cycle of under-voltage power when injecting fully) will can packed material contamination yet.
The pressure increase can be adopted the menu control form in the pore, thereby it also depends on the quantity of treatment variable.The treatment variable of introducing menu for example comprises: the clossing pressure of the type of encapsulating material, treatment temperature, carrier band material type, molded parts, minimum quality levels or the like.
The present invention also provides a kind of equipment that is encapsulated in electronic components mounted on the carrier band, comprising: molded parts, and movable against each other, it is used to surround at least one mold cavity of electronic component in closing position definition; Injection device is used to be connected to the liquid encapsulating material of mold cavity; And at least one pore, be connected to mold cavity, be used for bleeding from mold cavity, wherein, this equipment also provides the pressure pipeline that is connected to pore, thereby can gas be introduced pore with the overvoltage condition of at least 3 atmospheric pressures.Use such equipment, can realize the advantage of having described with regard to above-mentioned according to the method for the invention.Should also be noted that at this this equipment makes to not too needing measure to give with variant the size of venthole (or part of pore), so that make the probability of pumping capacity and the leakage through pore reduce combination well.Have on the air hole structure of variable-sized passage complicated, therefore expensive and sensitive.The present invention makes the measure of such complicacy on most probable degree, become unessential.This means that the present invention is having less requirement aspect the full-size of extraction opening.Compare with less extraction opening, through because the present invention and the extraction opening of now possible large-size can access the effect of better bleeding, and the dynamic control action of pressure can be realized better preferably in the mold cavity.Injection device is provided with at least one piston usually, and pressure pipeline can be connected to (gas) pressure source, for example compressed air system, charge air receiver or stepup transformer as expected.
This equipment also can provide controller, makes through this controller and can between excess pressure and under-voltage power, control the pressure in the pore.Hope less than 0.5 atmospheric pressure in this under-voltage power, preferably less than 0.1 atmospheric pressure.
The present invention also can provide controller, makes through this controller and can control this under-voltage power on one's own initiative.Here ACTIVE CONTROL is interpreted as to mean dynamic control option, makes that the requirement according to mold cavity presents many and few under-voltage power during injecting encapsulating material.In this way, can control encapsulation process better.These pressure help to improve the quality of packaged electronic component.
This equipment also provides and is connected to pore and can be by at least one valve of this controller control.Therefore in case in pore, applying just closure of excess pressure pore through pressure pipeline.Therefore prevent the pollution of under-voltage system etc.
To inject the pressure on the encapsulating material during the encapsulating material in order detecting, to expect that this equipment provides pressure sensor, be connected to mold cavity and be connected to controller.In the specific embodiment modification, the injection device that is used for encapsulating material provides a piston, and this piston also comprises the pressure sensor that is connected to controller, is used to detect the pressure on the encapsulating material that injects during the encapsulating material.Through these measures, can detect the pressure on the encapsulating material in real time during the encapsulation process, thereby in time apply excess pressure to pore in the suitable moment.In another embodiment variant, to piston position detector is provided, this position detector is connected to controller.Suppose that the starting position is known, then position of piston has formed the accurate measurement of the injection degree of mold cavity.Can easily confirm position of piston through position detector.Externally measured (promptly in the outside measurement of mold cavity) therefore also represented the injection degree of mold cavity.
This equipment provides the pressure source that is connected to pore, is used for producing at the pore that is connected to mold cavity the intermediate pressure of at least 3 atmospheric pressures.Such pressure source for example can maybe can produce any other source of the gas pressure of at least 3 atmospheric pressures through pressure pipeline, gas cylinder, stepup transformer.
Description of drawings
Based on the nonrestrictive example embodiment shown in the figs, will illustrate the present invention better.Wherein:
Fig. 1 shows the schematic diagram according to equipment of the present invention;
Fig. 2 shows the curve map of variation of the pressure of pressure and aspirating chamber on the encapsulating material;
Fig. 3 A and 3B illustrate the variation part according to the sealed in unit during the sustained period of the method that is used for encapsulating electronic components of the present invention.
The specific embodiment
Fig. 1 shows the equipment 1 that is used to encapsulate the electronic component 3 that is installed on the carrier band 2.Carrier band 2 clampers are at two molded parts 4, between 5, thereby electronic component 3 is in this is received in mold cavity 6, and mold cavity 6 is positioned at the left side, molded parts 4 tops.Because having become the encapsulating material 8 of liquid, heating can be advanced to mold cavity 6 by piston 7 through running channel (runner) 9.Now for the injection of the suitable encapsulating material 9 that obtains mold cavity 6, between influx time, can via aspirating chamber 11 and pore 12 through activate pump 10 to environment (referring to arrow P 1) (normally air possibly have the gas that discharges from encapsulating material 9 to exhaust.) equipment 1 also provides intelligent controller 13, illustrates with form of computers at this, wherein preferably can programme the control of the behavior of finding time in the mold cavity 6 that is suitable for correlated condition to be provided through a plurality of menus through importing definite parameter.
Can be arranged in pore 12 by the valve 14 of intelligent controller 13 controls, this valve 14 can closed lead to the pore 12 of molded parts 4 sides.Equipment 1 also provides the source 15 that is used to apply air pressure (being gas cylinder here), and it is connected to aspirating chamber 11 via pressure pipeline 16.Aspirating chamber 11 is connected to mold cavity 6 through narrow vent openings 17 (it is also referred to as pore).In case encapsulating material 9 has injected mold cavity 6 fully and arrived pore 17, then intelligent controller 13 will be closed controlled valve 14 and opened control valve 18 so that pressure source 15 is open.Then will be with at least 3 atmospheric pressures entering aspirating chambers 11 and the part that does not still have the pore 17 of encapsulating material 9 from the compressed air of gas cylinder 15.Therefore the encapsulating material 9 that further flows to pore 17 is cancelled, and this just in time is very popular effect.
In order to confirm moment that pump 10 must stop and must be through the moment (possibly be after very short time) that provides gas to increase the pressure in the aspirating chamber via pressure pipeline 16; Placement force sensor 18 in piston 7, it is connected to intelligent controller 13 via holding wire 19.In case mold cavity 6 is filled encapsulating material 9 and encapsulating material reaches pore 19, the resistance that encapsulating material runs into will increase, and the pressure on the encapsulating material 9 increases as a result.Pressure sensor 19 detects the increase of the pressure on the encapsulating materials 9, and the result makes the position that intelligent controller 13 can control valve 14,18 and the operation of pump 10.
Fig. 2 shows two curves 20,21, represents respectively through piston 8 and is applied to the pressure (P on the encapsulating material 9 Transfer, curve 20) and aspirating chamber 11 in pressure (P Venting, curve 21) in time the parallel variation of pressure.Top curve 20 shows the pressure P that is applied on the encapsulating material 9 TransferDuring mold cavity 6 injection encapsulating materials 9, keeping the limited long period, in case and follow mold cavity 6 and inject encapsulating material 9, pressure P fully TransferJust sharply increase suddenly.Second curve 21 is illustrated in pressure P between the mold cavity influx time VentingVery low, be lower than 1 atmospheric pressure (under-voltage condition), but in case be applied to the pressure P on the encapsulating material 9 TransferWhen beginning to increase suddenly (in case mold cavity is injected encapsulating material fully), the pressure P of aspirating chamber 11 VentingJust be transposed to the overvoltage condition of several times of atmospheric pressures rapidly.
Fig. 3 A shows the part according to the variation of sealed in unit of the present invention, and wherein pore 30 separates with pressure pipeline 31.Here another variation of making is that thin layer 33 is arranged in molded parts 32.Not only this thin layer 33 makes the wall 35 of mold cavity 36 not contact with encapsulating material, and the pore here 30 also plays a protective role, and will set forth below.In case encapsulating material 37 reaches pore 38, will interrupt through bleeding of pore 30.Then gas will flow into and process pressure pipeline 31, and shown in Fig. 3 B, therefore in the position of pressure pipeline 31, film 33 is released from last molded parts 32.Here, film 33 has formed the extra of encapsulating material 37 has been stopped, prevents that it from further injecting pore 38.Another advantage of film 33 is that its protection pore 30 avoids through pressure pipeline 31 feed-in pressed gas and avoids contacting encapsulating material 37.Therefore, if do not use film 33, pore 30 has less possibility contaminated.

Claims (15)

1. method that is encapsulated in electronic components mounted on the carrier band comprises following treatment step:
The electronic component that A) will be used for encapsulating is placed on the mold cavity that is connected to carrier band;
B) add hot encapsulation material so that it becomes liquid;
C) be shifted encapsulating material through on liquid encapsulating material, exerting pressure to the mold cavity of surrounding electronic component;
D) inject mold cavity with encapsulating material; And
E) encapsulating material in mold cavity is partly solidified at least,
Wherein, at treatment step D) during, after mold cavity is injected encapsulating material, be connected to the overvoltage condition that gas pressure in the pore of mold cavity initiatively is increased at least 3 atmospheric pressures,
It is characterized in that after liquid encapsulating material had arrived the pore that is connected to mold cavity, the pressure that is connected in the pore of mold cavity was increased to overvoltage condition.
2. the method for claim 1 is characterized in that, as according to treatment step D) during mold cavity was injected encapsulating material, the gas pressure that is connected in the pore of mold cavity was the under-voltage condition that is lower than 1 atmospheric pressure.
3. like claim 1 and 2 described methods, it is characterized in that measuring the pressure on the encapsulating material, and the increase in the pressure on the encapsulating material of record is formed for initiatively increasing the control signal of the pressure in the pore that is connected to mold cavity.
4. method as claimed in claim 3 is characterized in that advancing the pressure of a plurality of mold cavity to confirm the pressure on the encapsulating material encapsulating material through measuring at single middle position.
5. like claim 3 or 4 described methods, the increase in the pressure on the encapsulating material that it is characterized in that writing down causes the time delay confirmed of the active of the pressure in being connected to the pore of mold cavity in increasing.
6. like the described method of aforementioned any claim, it is characterized in that encapsulating material has the dynamic viscosity of 2-9 poiseuille [Pa.s], promptly equals 2-9 [kg/m.s] during injecting mold cavity with encapsulating material.
7. like the described method of aforementioned any claim, it is characterized in that in being connected to the pore of mold cavity, placing thin-film material, and during encapsulating, on a side, apply excess pressure away from encapsulating material.
8. method as claimed in claim 7 is characterized in that during encapsulating, on a side of encapsulating material, applying under-voltage power.
9. like claim 7 or 8 described methods, it is characterized in that when on film, applying excess pressure that film is sealed the under-voltage connection that connects pore.
10. equipment that is encapsulated in electronic components mounted on the carrier band comprises:
-molded parts, movable against each other, it is used to surround at least one mold cavity of electronic component in closing position definition;
-injection device is used to be connected to the liquid encapsulating material of mold cavity; And
-at least one pore is connected to mold cavity, is used for bleeding from mold cavity,
Wherein, this equipment also provides the pressure pipeline that is connected to pore, thereby can gas be introduced pore with the overvoltage condition of at least 3 atmospheric pressures according to the described method of aforementioned any claim.
11. equipment as claimed in claim 10 is characterized in that this equipment provides controller, makes through this controller and can between excess pressure and under-voltage power, control the pressure in the pore.
12. equipment as claimed in claim 11 is characterized in that this equipment provides to be connected to pore and can be by at least one valve of this controller control.
13., it is characterized in that this equipment provides pressure sensor, be connected to mold cavity and be connected to controller, to be used for during injecting encapsulating material, the detecting pressure on the encapsulating material like any described equipment of claim among the aforementioned claim 10-12.
14. as any described equipment of claim among the aforementioned claim 10-13; It is characterized in that the injection device that is used for encapsulating material comprises at least one piston; And this piston provides the pressure sensor that is connected to controller, is used to detect the pressure on the encapsulating material that injects during the encapsulating material.
15. like any described equipment of claim among the aforementioned claim 10-14, it is characterized in that this equipment provides the pressure source that is connected to pore, be used for producing the intermediate pressure of at least 3 atmospheric pressures at the pore that is connected to mold cavity.
CN2010800413057A 2009-07-17 2010-07-19 Method and device for encapsulating electronic components with controlled gas pressure Pending CN102548729A (en)

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NL2003792A NL2003792C2 (en) 2009-07-17 2009-11-12 METHOD AND DEVICE FOR COATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE
PCT/NL2010/050463 WO2011008098A2 (en) 2009-07-17 2010-07-19 Method and device for encapsulating electronic components with controlled gas pressure

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