WO2011008098A3 - Method and device for encapsulating electronic components with controlled gas pressure - Google Patents

Method and device for encapsulating electronic components with controlled gas pressure Download PDF

Info

Publication number
WO2011008098A3
WO2011008098A3 PCT/NL2010/050463 NL2010050463W WO2011008098A3 WO 2011008098 A3 WO2011008098 A3 WO 2011008098A3 NL 2010050463 W NL2010050463 W NL 2010050463W WO 2011008098 A3 WO2011008098 A3 WO 2011008098A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
gas pressure
encapsulating electronic
mould cavity
controlled gas
Prior art date
Application number
PCT/NL2010/050463
Other languages
French (fr)
Other versions
WO2011008098A2 (en
Inventor
Wilhelmus Gerardus Jozef Gal
Henricus Antonius Maria Fierkens
Albertus Franciscus Gerardus Van Driel
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to CN2010800413057A priority Critical patent/CN102548729A/en
Publication of WO2011008098A2 publication Critical patent/WO2011008098A2/en
Publication of WO2011008098A3 publication Critical patent/WO2011008098A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B29C2945/762—Injection unit injection piston
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76254—Mould
    • B29C2945/76257—Mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/76287—Moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76732—Mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76775—Fluids
    • B29C2945/76779—Fluids auxiliary fluids introduced into the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76775—Fluids
    • B29C2945/76789—Fluids environment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76822—Phase or stage of control
    • B29C2945/76859—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The present invention relates to a method for encapsulating electronic components mounted on a carrier, wherein the gas pressure in a venting connecting to the mould cavity is actively increased to an overpressure of at least 3 atmosphere after filling of the mould cavity with encapsulating material. The invention also relates to a device for performing such a method for encapsulating electronic components mounted on a carrier, comprising: mould parts which in a closed position define a mould cavity, feed means for liquid encapsulating material, a venting for suctioning gas from the mould cavity, and a pressure conduit whereby an overpressure can be applied in the venting.
PCT/NL2010/050463 2009-07-17 2010-07-19 Method and device for encapsulating electronic components with controlled gas pressure WO2011008098A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010800413057A CN102548729A (en) 2009-07-17 2010-07-19 Method and device for encapsulating electronic components with controlled gas pressure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL2003237 2009-07-17
NL2003237 2009-07-17
NL2003792 2009-11-12
NL2003792A NL2003792C2 (en) 2009-07-17 2009-11-12 METHOD AND DEVICE FOR COATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE

Publications (2)

Publication Number Publication Date
WO2011008098A2 WO2011008098A2 (en) 2011-01-20
WO2011008098A3 true WO2011008098A3 (en) 2011-07-07

Family

ID=43450012

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2010/050463 WO2011008098A2 (en) 2009-07-17 2010-07-19 Method and device for encapsulating electronic components with controlled gas pressure

Country Status (4)

Country Link
KR (1) KR20120052325A (en)
CN (1) CN102548729A (en)
NL (1) NL2003792C2 (en)
WO (1) WO2011008098A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2007614C2 (en) * 2011-10-18 2013-04-22 Fico Bv METHOD AND DEVICE FOR COVERING ELECTRONIC COMPONENTS USING A REDUCTION MATERIAL UNDERTAKING A PHASE TRANSITION
DE102014003491A1 (en) * 2014-03-14 2015-03-05 Autoliv Development Ab Mold and method for manufacturing a workpiece
DE102015011735B3 (en) * 2015-09-04 2016-11-10 Audi Ag Apparatus for producing a plastic molding and method for producing a plastic molding
NL2016011B1 (en) * 2015-12-23 2017-07-03 Besi Netherlands Bv Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
CN107466159B (en) * 2016-06-06 2022-07-19 宁波舜宇光电信息有限公司 Molded circuit board of camera module and manufacturing equipment and manufacturing method thereof
CN107466160B (en) * 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 Equipment and method for manufacturing molded circuit board of camera module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259652A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Manufacturing system for thin-film multilayer substrate
JPH07164473A (en) * 1993-12-15 1995-06-27 Sumitomo Bakelite Co Ltd Resin sealing method for semiconductor component, semiconductor sealing device and resin-sealed semiconductor component
JPH0864623A (en) * 1994-08-22 1996-03-08 Nec Corp Resin sealing method for semiconductor device and resin sealing device used for said resin sealing method
JPH11297731A (en) * 1998-04-15 1999-10-29 Hitachi Ltd Molding method and apparatus thereof, and manufacture of semiconductor device
US20020025352A1 (en) * 2000-08-22 2002-02-28 Fumio Miyajima Method of resin molding and resin molding machine
WO2008100146A2 (en) * 2007-02-15 2008-08-21 Fico B.V. Method and device for encapsulating electronic components using underpressure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259652A (en) * 1992-03-13 1993-10-08 Hitachi Ltd Manufacturing system for thin-film multilayer substrate
JPH07164473A (en) * 1993-12-15 1995-06-27 Sumitomo Bakelite Co Ltd Resin sealing method for semiconductor component, semiconductor sealing device and resin-sealed semiconductor component
JPH0864623A (en) * 1994-08-22 1996-03-08 Nec Corp Resin sealing method for semiconductor device and resin sealing device used for said resin sealing method
JPH11297731A (en) * 1998-04-15 1999-10-29 Hitachi Ltd Molding method and apparatus thereof, and manufacture of semiconductor device
US20020025352A1 (en) * 2000-08-22 2002-02-28 Fumio Miyajima Method of resin molding and resin molding machine
WO2008100146A2 (en) * 2007-02-15 2008-08-21 Fico B.V. Method and device for encapsulating electronic components using underpressure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199345, Derwent World Patents Index; AN 1993-355354, XP002635169 *

Also Published As

Publication number Publication date
NL2003792C2 (en) 2011-01-18
WO2011008098A2 (en) 2011-01-20
CN102548729A (en) 2012-07-04
KR20120052325A (en) 2012-05-23

Similar Documents

Publication Publication Date Title
WO2011008098A3 (en) Method and device for encapsulating electronic components with controlled gas pressure
EP2581936A3 (en) Package with unattached semiconductor device
EP2458359A4 (en) Semiconductor pressure sensor, pressure sensor device, electronic apparatus, and method for manufacturing semiconductor pressure sensor
WO2012010129A3 (en) Mold for producing fiber-reinforced components
MX2010001790A (en) Method for producing a device for dispensing fluid product under pressure, apparatus for implementing such a method and device for dispensing fluid product under pressure.
WO2015052267A9 (en) Injector for filling a molding tool, and method for producing molded parts from foamed polymer particles
EP3575548A3 (en) Sonde with integral pressure sensor and method
WO2011047815A3 (en) Brewing device and method for extracting a portion capsule
WO2010100107A3 (en) Process for preparing stable suspensions of metal nanoparticles and the stable colloidal suspensions obtained thereby
EP2221704A4 (en) Method and device for controlling pressure of vacuum container
MY154276A (en) Gripper for a contact lens and process for transporting a contact lens
WO2011106810A8 (en) Floating platform
MY161050A (en) Method for encapsulating electronic components with a controllable closing force
BRPI0913917A2 (en) fluid product conditioning process in a dispenser
MY161485A (en) Molded product production device, molded product production method, and molded product
WO2012045511A3 (en) Method for producing a silicone foil, silicone foil and optoelectronic semiconductor component comprising a silicone foil
EP2639822A3 (en) Method of producing a resin molded semiconductor device
PL2248760T3 (en) Method and device for filling components with supplies on automobile industry production lines
WO2015185578A8 (en) Method for manufacturing a part out of a metal matrix composite material, and related device
WO2008100146A3 (en) Method and device for encapsulating electronic components using underpressure
MY162478A (en) Molded body production device, molded body production method, and molded body
EP2735421A3 (en) Apparatus for removing resin molded product and method for removing resin molded product
WO2009015138A3 (en) Encapsulating semiconductor components using vented mold
MX345685B (en) Die, molding device, and method for producing foam molded body.
WO2009073351A3 (en) Defoaming method, defoaming device and manufacturing method of transfer mold

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080041305.7

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10736845

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20127004132

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 10736845

Country of ref document: EP

Kind code of ref document: A2