PH12014500725A1 - Method for compression-molding electronic component and die apparatus - Google Patents

Method for compression-molding electronic component and die apparatus

Info

Publication number
PH12014500725A1
PH12014500725A1 PH12014500725A PH12014500725A PH12014500725A1 PH 12014500725 A1 PH12014500725 A1 PH 12014500725A1 PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 A PH12014500725 A PH 12014500725A PH 12014500725 A1 PH12014500725 A1 PH 12014500725A1
Authority
PH
Philippines
Prior art keywords
resin
die
cavity
releasing film
plate
Prior art date
Application number
PH12014500725A
Other versions
PH12014500725B1 (en
Inventor
Uragami Hiroshi
Takada Naoki
Otsuki Osamu
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of PH12014500725A1 publication Critical patent/PH12014500725A1/en
Publication of PH12014500725B1 publication Critical patent/PH12014500725B1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0067Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
    • B29C37/0075Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • B29C2043/345Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material
    • B29C2043/3461Feeding the material to the mould or the compression means using gas, e.g. air, to transport non liquid material for foils, sheets, gobs, e.g. floated
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • B29C2043/3488Feeding the material to the mould or the compression means uniformly distributed into the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25Solid
    • B29K2105/251Particles, powder or granules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

A resin supply pre-plate (21a) is configured by forming an opening section (37) on a resin-storing section (22) by applying a die-releasing film (11) on a lower surface of a resin-storing plate (21) having the opening section (37) corresponding to a lower die cavity (5) so as to efficiently improve reliability of a resin quantity supplied into the lower cavity (5) at the time of supplying a granular resin (6) into the lower die cavity (5). A resin-dispersed plate (25) is formed by supplying the resin-storing section (22) with the granular resin (6) of a required quantity and flattening the resin (i.e., forming the resin in uniform thickness). Then, by placing the resin-dispersed plate (25) at a position of the lower die cavity (5) and pulling the die-releasing film (11) into the lower die cavity (5), the flattened granular resin (6) of a required quantity is dropped together with the die-releasing film (11) and is supplied into the cavity (5) covered with the die-releasing film
PH12014500725A 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus PH12014500725B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008205018A JP5153509B2 (en) 2008-08-08 2008-08-08 Electronic component compression molding method and mold apparatus
PCT/JP2009/003683 WO2010016223A1 (en) 2008-08-08 2009-08-03 Method for compression-molding electronic component and die apparatus

Publications (2)

Publication Number Publication Date
PH12014500725A1 true PH12014500725A1 (en) 2015-01-26
PH12014500725B1 PH12014500725B1 (en) 2015-01-26

Family

ID=41663452

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014500725A PH12014500725B1 (en) 2008-08-08 2014-04-01 Method for compression-molding electronic component and die apparatus

Country Status (7)

Country Link
JP (1) JP5153509B2 (en)
KR (3) KR101523163B1 (en)
CN (2) CN102105282B (en)
MY (2) MY152441A (en)
PH (1) PH12014500725B1 (en)
TW (3) TWI543275B (en)
WO (1) WO2010016223A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5576197B2 (en) * 2010-07-08 2014-08-20 Towa株式会社 Electronic component compression molding method and molding apparatus
WO2013069496A1 (en) * 2011-11-08 2013-05-16 アピックヤマダ株式会社 Resin sealing device
KR101373459B1 (en) * 2011-12-23 2014-03-11 세메스 주식회사 Resin mold apparatus
KR101299259B1 (en) * 2013-04-03 2013-08-22 주식회사 에스아이 플렉스 Mode key attachment method
JP6049597B2 (en) * 2013-11-28 2016-12-21 Towa株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6057880B2 (en) * 2013-11-28 2017-01-11 Towa株式会社 Resin material supply method and supply device for compression molding apparatus
JP6212399B2 (en) 2014-01-21 2017-10-11 Towa株式会社 Film sheet cutting device and cutting method
JP6017492B2 (en) 2014-04-24 2016-11-02 Towa株式会社 Manufacturing method of resin-encapsulated electronic component, plate-like member with protruding electrode, and resin-encapsulated electronic component
JP6310773B2 (en) * 2014-05-22 2018-04-11 Towa株式会社 Resin molding apparatus and resin molding method
JP6298719B2 (en) * 2014-06-09 2018-03-20 Towa株式会社 Resin sealing device and resin sealing method
JP5944445B2 (en) 2014-07-18 2016-07-05 Towa株式会社 Manufacturing method of resin-encapsulated electronic component, plate-like member with protruding electrode, resin-encapsulated electronic component, and manufacturing method of plate-like member with protruding electrode
JP6282564B2 (en) * 2014-09-16 2018-02-21 東芝メモリ株式会社 Manufacturing method of semiconductor device
JP6400446B2 (en) * 2014-11-28 2018-10-03 Towa株式会社 Method for manufacturing plate-like member with protruding electrode, plate-like member with protruding electrode, method for manufacturing electronic component, and electronic component
JP6212609B1 (en) 2016-08-19 2017-10-11 Towa株式会社 Resin molding apparatus and resin molded product manufacturing method
JP6279047B1 (en) 2016-10-11 2018-02-14 Towa株式会社 Resin material supply device, resin material supply method, resin molding device, and resin molded product manufacturing method
JP6270969B2 (en) * 2016-11-22 2018-01-31 Towa株式会社 Resin material supply method and supply mechanism of compression molding apparatus, and compression molding method and compression molding apparatus
JP6774865B2 (en) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 Frame jig, resin supply jig and its weighing method, mold resin measuring device and method, resin supply device, resin supply measuring device and method, and resin molding device and method
JP6236561B1 (en) * 2017-04-27 2017-11-22 信越エンジニアリング株式会社 Work bonding apparatus and work bonding method
JP6165372B1 (en) * 2017-01-10 2017-07-19 信越エンジニアリング株式会社 Work conveying apparatus and work conveying method
US10199299B1 (en) 2017-08-07 2019-02-05 Micron Technology, Inc. Semiconductor mold compound transfer system and associated methods
JP6349447B2 (en) * 2017-08-10 2018-06-27 Towa株式会社 Method for manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component
TWI787417B (en) 2018-02-09 2022-12-21 日商山田尖端科技股份有限公司 Mold for compression molding and compression molding device
CN110223992B (en) * 2019-06-27 2021-09-03 武汉华星光电半导体显示技术有限公司 Display panel, forming die of display panel and preparation method of display panel
CN110667021B (en) * 2019-09-16 2021-06-25 大同新成新材料股份有限公司 Carbon composite material flattening and forming device and using method thereof
WO2022264374A1 (en) * 2021-06-17 2022-12-22 アピックヤマダ株式会社 Resin sealing device and resin sealing method
JP2023048797A (en) * 2021-09-28 2023-04-07 アピックヤマダ株式会社 Resin sealing device and resin sealing method

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Publication number Priority date Publication date Assignee Title
JP3900947B2 (en) * 2002-01-30 2007-04-04 大日本インキ化学工業株式会社 Manufacturing method of fuel cell separator, fuel cell separator and fuel cell
JP4268389B2 (en) * 2002-09-06 2009-05-27 Towa株式会社 Resin sealing molding method and apparatus for electronic parts
JP4262468B2 (en) * 2002-10-30 2009-05-13 アピックヤマダ株式会社 Resin molding method, resin molding apparatus, and support jig used therefor
JP4336499B2 (en) * 2003-01-09 2009-09-30 Towa株式会社 Resin sealing molding method and apparatus for electronic parts
JP4431440B2 (en) * 2004-05-25 2010-03-17 住友重機械工業株式会社 Resin supply device and resin supply method
JP4741383B2 (en) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 Resin sealing method for electronic parts
JP4855307B2 (en) * 2007-03-13 2012-01-18 Towa株式会社 Electronic component compression molding method

Also Published As

Publication number Publication date
TW201007859A (en) 2010-02-16
KR20130125407A (en) 2013-11-18
MY182931A (en) 2021-02-05
KR20110051228A (en) 2011-05-17
CN102105282B (en) 2014-04-09
KR20130124416A (en) 2013-11-13
TWI529822B (en) 2016-04-11
MY152441A (en) 2014-09-30
CN103921384A (en) 2014-07-16
WO2010016223A1 (en) 2010-02-11
KR101430797B1 (en) 2014-08-18
TW201616586A (en) 2016-05-01
JP2010036542A (en) 2010-02-18
KR101523163B1 (en) 2015-05-26
TW201436061A (en) 2014-09-16
CN103921384B (en) 2016-11-16
CN102105282A (en) 2011-06-22
JP5153509B2 (en) 2013-02-27
TWI567837B (en) 2017-01-21
PH12014500725B1 (en) 2015-01-26
TWI543275B (en) 2016-07-21
KR101523164B1 (en) 2015-05-26

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