TW200811968A - Resin sealing apparatus for electronics parts - Google Patents

Resin sealing apparatus for electronics parts Download PDF

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Publication number
TW200811968A
TW200811968A TW096120517A TW96120517A TW200811968A TW 200811968 A TW200811968 A TW 200811968A TW 096120517 A TW096120517 A TW 096120517A TW 96120517 A TW96120517 A TW 96120517A TW 200811968 A TW200811968 A TW 200811968A
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TW
Taiwan
Prior art keywords
resin
mold
cavity
electronic component
substrate
Prior art date
Application number
TW096120517A
Other languages
Chinese (zh)
Other versions
TWI338342B (en
Inventor
Hiroki Okamoto
Original Assignee
Towa Corp
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Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200811968A publication Critical patent/TW200811968A/en
Application granted granted Critical
Publication of TWI338342B publication Critical patent/TWI338342B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

In the resin sealing apparatus for electronics parts of the present invention, more than one protrusion formed in the mold cavity penetrates through the more-than-one opening respectively on the heat-dissipation plate mounted in the mold cavity. Thus, the heat-dissipation plate can be positioned with respect to the mold cavity. According to the said method, the heat-dissipation plate can be positioned inside the mold cavity with high precision.

Description

200811968 九、發明說明： 【發明所屬之技術領域】 • 技術領域 - 树明係有關於—種可將電子零件及散熱板填封成形 • 5的電子零件之樹脂填封成形裝置。 夕 C先前技術】 背景技術 • 、，今，已知-種包含上模與下模之電子零件樹脂填封 成形用的模具組。例如，在特開細⑻觀號公報及特 10平11_274196號公報中，便揭示有使用前述模具組將電子零 件及散熱板填封成形的裝置。 7 在特開2001-110830號公報及特開平1K274i96號公報 所揭不之半導體裝置與製造方法中，首先，將散熱板定位 於下模之模穴内。接著，安置裝載有半導體晶片等電子零 15件的引線框，並在前述狀態下，使流動性樹脂透過樹月旨通 ⑩ 路注入楔穴内。結果，可製造出以樹脂包覆住半導體元件 的半導體裝置。 在前述特開2〇〇1-11〇83〇號公報中，提出各種可在模具 組呈閉合狀態下將流動性樹脂流入模具組内時，防止散熱 2G =在模穴内移動的方法。特開：嶋-則謂號公報中揭示二 月J述方法之-例’係於散熱板本身設置凸部，並藉由前述 凸部與頂出銷互相卡合，可使散熱板固定於頂出銷。又， 特開平U-27·號公報中所揭示之前述方法之另一例，係 藉由配置於模具組之樹脂注入口之延長線上的支持鎖支持 5 200811968 住配置於模穴内的散熱板，並且藉由在位於散熱板之下 面、用於防止位置偏移的凹部内設置支持銷，來支持散熱 板0 又，特開2001-110830號公報及特開平u_274i96號公報 5中，揭示了在基板之-侧及另-侧之各個主表面上搭載有 半導體裝置的封裝體。然而，近年來，由於封裝體製品以 薄型化為佳，故大多製造出僅在基板上側之主表面及;^ 之主表面中任一者搭載有半導體裝置的封裝體。又，已製 造出一種在前述薄型化之一側主表面上具有複數積層半導 H)體裝置之積層構造的封裝體。此外，為了提昇前述僅在薄 型化之其中一主表面上搭載半導體裝置之封裝體的散熱 性，也可於封裝體安裝散熱板。 在前述狀況中，徐了封裝體本身的薄型化之外，散熱 板也以薄型化為佳。 15 專利文獻1 :特開2001-110830號公報 專利文獻2 :特開平11-274196號公報 【每明内容】 發明揭示 發明所欲解決之課題 20 根據上述特開2001-110830號公報及特開平11-274196 5虎公較所揭示之技術，為了使散熱板不會在對應於封裝體 之模穴内移動而固定散熱板的位置，會產生下列問題。 例如，根據上述文獻所揭示的技術，為了使散熱板不 會移動而固定位置，必須使用三根以上的頂出銷（或支持 6 200811968 銷)/因此，為了可以對應於三根以上的頂出销(或支持銷）， 。又， 。因此，必須 會使製造成本200811968 IX. Description of the invention: [Technical field to which the invention pertains] • Technical field - The Shuming Department has a resin encapsulation forming device for encapsulating electronic parts and heat sinks. C. Prior Art Background Art • A mold set for resin encapsulation molding of an electronic component including an upper mold and a lower mold is known. For example, Japanese Laid-Open Patent Publication No. Hei. No. Hei 11-274196 discloses an apparatus for sealing an electronic component and a heat sink by using the above-described mold set. In the semiconductor device and the manufacturing method disclosed in Japanese Laid-Open Patent Publication No. 2001-110830 and No. 1K274i96, first, the heat dissipation plate is positioned in the cavity of the lower mold. Next, a lead frame on which electrons such as semiconductor wafers are mounted is placed, and in the above state, the fluid resin is injected into the wedge holes through the tree. As a result, a semiconductor device in which a semiconductor element is covered with a resin can be manufactured. In the above-mentioned Japanese Patent Publication No. 2-11-1183, various methods for preventing heat dissipation 2G from moving in the cavity when the flowable resin is introduced into the mold set in the closed state of the mold set are proposed. The special method is disclosed in the 嶋- 谓 公报 公报 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二Selling. Further, another example of the above-described method disclosed in Japanese Laid-Open Patent Publication No. U-27-A is a heat dissipating plate disposed in a cavity by a support lock support 5 200811968 disposed on an extension line of a resin injection port of a mold set, and A heat dissipating plate is supported by a support pin provided in a recessed portion for preventing a positional displacement on the lower surface of the heat dissipation plate, and a substrate is disclosed in Japanese Laid-Open Patent Publication No. 2001-110830 A package in which a semiconductor device is mounted on each of the main surfaces of the side and the other side. However, in recent years, since the package product is preferably made thinner, a package body in which a semiconductor device is mounted on only one of the main surface on the upper side of the substrate and the main surface of the substrate is manufactured. Further, a package having a laminated structure having a plurality of laminated semiconductor substrates on one side of the thinned side main surface has been produced. Further, in order to enhance the heat dissipation of the package in which the semiconductor device is mounted on only one of the thinned main surfaces, the heat sink may be mounted on the package. In the above-mentioned situation, in addition to the thinning of the package itself, the heat dissipation plate is preferably thinned. CITATION OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The present invention is disclosed in Japanese Laid-Open Patent Publication No. 2001-110830 and Japanese Patent Application No. 2001-110830. -274196 5 Hugong compared to the disclosed technology, in order to prevent the heat sink from moving in the cavity corresponding to the package to fix the position of the heat sink, the following problems occur. For example, according to the technique disclosed in the above documents, in order to fix the position where the heat sink does not move, it is necessary to use three or more ejector pins (or support 6 200811968 pins) / therefore, in order to be able to correspond to three or more ejector pins ( Or support pin), . Again, . Therefore, it must make the manufacturing cost

必須大幅提高散熱板之凸部及支持銷的尺寸精準度 為了提昇散熱性，必須使散熱板露出封裝體 X 以高精準度進行散熱板的複雜加工，結果， 增加。 又，备使政熱板疋位於樹脂成形用模穴内時，必須將 散熱板維持為水平狀態。因此，必須以高精準度控制模穴 内之頂出銷（或支持銷），所以模具組之内部構造會變得 複雜。 10 , ^ η 發明彳轉於上述問題㈣成者，目的在於提供一種 y輕易地以高精準度將散熱板定位於模穴内的電子零件之 错脂填封成形裝置。 解決課題之手段 15 ^本發明之電子零件之樹脂填封成形裝置包含有：第！ 挺係可安裝搭載有電子零件之基板者；第2模，係配置成 j目對於則述第_，且具有可插入前述電子零件之模穴者·， 個以上之突出部，係形成於前述模穴内者；及散熱板，係 二有1個以上之開口，並且藉由前述1個以上之突出部分別 2〇貝通珂述1個以上之開口，可相對於前述模穴而定位者。 根據上述，可輕易地以高精準度將散熱板定位於模穴 内的電子零件m旨填封鋪⑽具組。 別述1個以上之突出部中至少丨個也可為用以使成形品 3述第2模分離的頂出銷。藉此，由於可利用頂出銷進行 散熱板之定位，故可防止零件數增加。又，前述1個以上之 7 200811968 突出部中至少i個也可構成用以將流動性樹駿 八内的树脂通路。藉此，由於可使樹脂通路突出’L果 故可使樹崎容易流遍模穴内全體。 果八内’ =、’細脂通路之一部分或全部也可安裂於前述第2模且 可與刖述第2模分離。藉此，可在樹脂通路因硬化樹脂而 基時父換樹脂通路。 發明之效果In order to improve the heat dissipation, the heat sink must be exposed to the package X. The complex processing of the heat sink is performed with high precision, and the result is increased. Further, when the hot plate is placed in the cavity for resin molding, the heat sink must be maintained in a horizontal state. Therefore, the ejector pin (or the support pin) in the cavity must be controlled with high precision, so the internal structure of the die set becomes complicated. 10 , ^ η Invented in the above-mentioned problem (4), the purpose is to provide a fault-filling and sealing device for electronic parts that easily position the heat sink in the cavity with high precision. Means for Solving the Problem 15 ^ The resin sealing and molding device for electronic parts of the present invention includes: The sturdy system can be mounted on a substrate on which an electronic component is mounted, and the second mode is arranged in the _, and the embossed portion of the electronic component can be inserted into the cavity. The inside of the cavity; and the heat dissipation plate have two or more openings, and the one or more of the protrusions can be positioned with respect to the cavity by one or more openings. According to the above, the electronic component that can easily position the heat sink in the cavity with high precision is required to be filled and sealed (10). At least one of the one or more protruding portions may be an ejector pin for separating the second mold from the molded article 3. Thereby, since the positioning of the heat radiating plate can be performed by the ejector pin, the number of parts can be prevented from increasing. Further, at least one of the protrusions of the above-mentioned one or more of the 200811968 may constitute a resin passage for the inside of the fluidity. Thereby, the resin passage can be made to protrude 'L, so that the tree can easily flow through the entire cavity. Some or all of the fine grease passages may be split into the second mold and may be separated from the second mold. Thereby, the resin passage can be changed when the resin passage is made of a hardened resin. Effect of invention

根據本發明，可更提昇安裝有散熱板及電子零件之封 裝製品（成形品）的生產性。 與附加圖式一併參照以下關於本發明之詳細說明，應 可更清楚地理解本發明之上述及其他目的、特徵、型態及 優點。 圖式簡單說明 第1圖係搭載於電子零件之樹脂密封成形裝置之模組 15品的概略截面圖，顯示模組品的開啟狀態。 第2圖係顯示第1圖所示之模組品為閉合狀態時注入流 動性樹脂之狀態的圖。 第3圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 20 脂之狀態。 第4圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。 第5圖係與第1圖所示之模組品不同之另外一例之模組 8 200811968 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。 I：實施方式3 實施發明之最佳型態 5 以下，使用第1〜5圖詳細說明本發明之實施型態的樹 脂填封成形裝置。第1及2圖分別係搭載於電子零件之樹脂 填封成形裝置的模具組的主要部分。第3〜5圖分別係搭載 於樹脂填封成形裝置之其他例子的模具組的主要部分。 首先，說明第1及2圖所示之電子零件之樹脂填封成形 1〇用的模具組構造，並且說明使用前述模具組而進行的樹脂 填封成形方法。另外’對於第3〜5圖中具有與第⑴圖中 之部位同樣構造及機能的部位，附上與第如圖中之元件 符號同樣的符號。 模具組包含有：作為第i模而為固定的上模1;配置於 U相對於上模W作為第2模的可動之中間模2;及配置於中間 模2下方的下模（未圖示）。 上模1具有凹部7，該凹部7係可設置安裝有電子零件4 的基板6者。中間模2具有樹脂成形用之模幻，而模穴艸 可設置散熱板5。此外，下模具有樹脂材料供給用之加孰部 (未圖示），加熱部内則設有樹脂加壓用的活塞(未圖示）。 又，中間模2具有可連通加熱部與模穴3的樹脂移送用 之樹脂通路8。上模i及中間模2(或可動之下模⑼分別包含 有：插裝加熱器及/或柔性加熱器等加熱機構(未圖示）；用 以使在模幻内成形之樹脂成型體(成形品)9突出於模穴⑽ 9 200811968 頂出鎖H);域模穴3與模具細之外部空間相連通的通氣孔 (未圖示）。 模具組可為第1及2圖所示之上模卜中間模2及下模(未 圖示)所構成的三模構造，也可為兩個或四個以上之模具所 5構成者。又，也可使用配置非單—數而為複數模具組的模 組方式的樹脂填封成形裝置。 如第1及2圖所示，電子零件4包含··作為安裝於基板6 上之IC(IntegraUon Circuit ··積體電路）等半導體元件的晶片 11，及可電氣性地連接晶片U與基板6的線體12。在第认] 10圖中，雖顯不為單-數之晶片u安装於基板6的半成品，但 也可使用將複數晶片11安裝於基板6的矩陣陣列封裝型或 矩陣型半成。若使用矩陣陣列封裝型或矩陣型的基板6， 可一次對複數之晶片11進行樹脂填封成形。 又，第1及2圖中，雖顯示為打線接合基板，但本發明 15之基板並非限定於此，也可為倒裝晶片基板或晶圓級封裝 基板等其他基板。此外，也可使用複數樹脂填封成型體在 基板上於上下方向積層的積層型封裝基板。 為了貫現薄型化封裝製品，在第1及2圖中，將散熱板5 設置成在儘量接近電子零件4、但不接觸的狀態下，覆蓋住 20電子零件4。散熱板5之水平部15在樹脂填封成形結束後， 會在樹脂成型體9之上面露出，電子零件4的熱便會從前述 鉻出之散熱板5的水平部15放出至外部。結果，可提升電子 零件的散熱性。 另外’散熱板5在樹脂填封成形前，並不固定於基板6， 200811968 散熱板5在樹脂填封成形時，會藉由樹脂材料而與安置於上 模1及中間模2内之電子零件4及基板6 —體化。 如第1圖所示，散熱板5具有水平部15、及可支持水平 部15的支持部16。於水平部15及支持糾形成有開口可 5在樹脂填封成形時，使因加熱而炼融的樹脂材料(流動性樹 脂17)可順暢地流動。另外，散熱板5之水平部⑽外形係 圓形或有角形。 樹脂通路7係由例如相對於加熱部配置的樹脂分配用 的篩選部、流道及澆口（豎澆道)所構成。從第2圖可知，流 10動性樹脂17係從設置於模穴3略中央部位而作為開口的澆 口 13注入填充至模穴3内。洗口 13形成為可貫通設置於中間 模2之澆口構件14。又，澆口構件14係可脫離中間模2地安 裝於中間模2。 澆口構件14之澆口 13的前端部分係突出於模穴3的底 15 面，並且當散熱板5安置於模穴3内之時，可貫通散熱板5的 開口。如第2圖所示，前述澆口 13之前端部位係突出部isa。 本發明之1個以上的突出部18係包含有包括澆口構件η之 澆口 13的前端部分（18a)、與頂出銷10的前端部分（18b)中任 一方或雙方者。 20 如上所述，在本實施型態中，藉由突出部18a及18b分 別貫通散熱板5之水平部15的開口，散熱板5可相對於模穴3 而定位。此時，模穴3之底面與散熱板之水平部15相接觸， 因此，可防止散熱板5在上下方向及水平方向兩方向的移 動0 11 200811968 更簡單地來說，藉由突出部18a、以及與突出制 =突出㈣所構成的突出部，散熱 以 同精準度定位於模穴3内。另外，突出部之數不限定於2個 也可為3個以上。 、2個’ 5According to the present invention, the productivity of the packaged product (molded article) to which the heat sink and the electronic component are mounted can be further improved. The above and other objects, features, aspects and advantages of the present invention will become more <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a module of a resin sealing and molding apparatus mounted on an electronic component, showing the open state of the module. Fig. 2 is a view showing a state in which a fluid resin is injected when the module shown in Fig. 1 is in a closed state. Fig. 3 is a schematic cross-sectional view showing another example of a module different from the module shown in Fig. 1, showing a state in which the fluidity tree 20 is injected when the module is in a closed state. Fig. 4 is a schematic cross-sectional view showing another example of a module different from the module shown in Fig. 1, showing a state in which a fluidity resin is injected when the module is in a closed state. Fig. 5 is a block diagram of another example of a module different from the module shown in Fig. 1. The schematic cross-sectional view of the product of 200811968 shows the state in which the fluidity resin is injected when the module is closed. I: Embodiment 3 BEST MODE FOR CARRYING OUT THE INVENTION 5 Hereinafter, a resin sealing and molding apparatus according to an embodiment of the present invention will be described in detail using Figs. The first and second figures are the main parts of the mold set mounted on the resin sealing and molding apparatus for electronic parts. Figs. 3 to 5 are main parts of a mold set mounted on another example of the resin sealing molding apparatus. First, a mold set structure for resin encapsulation molding of the electronic component shown in Figs. 1 and 2 will be described, and a resin encapsulation molding method using the above mold set will be described. Further, the same reference numerals as in the drawings are attached to the portions having the same structure and function as those in the first embodiment in the third to fifth embodiments. The mold set includes: an upper mold 1 that is fixed as an i-th mold; a movable intermediate mold 2 that is disposed as a second mold with respect to the upper mold W; and a lower mold that is disposed below the intermediate mold 2 (not shown) ). The upper mold 1 has a recessed portion 7 which can be provided with a substrate 6 on which the electronic component 4 is mounted. The intermediate mold 2 has a phantom for resin molding, and the cavity 艸 can be provided with a heat dissipation plate 5. Further, the lower mold has a twisting portion (not shown) for supplying a resin material, and a piston (not shown) for pressurizing the resin is provided in the heating portion. Further, the intermediate mold 2 has a resin passage 8 for resin transfer which can communicate with the heating portion and the cavity 3. The upper mold i and the intermediate mold 2 (or the movable lower mold (9) respectively include a heating mechanism (not shown) such as an insertion heater and/or a flexible heater; and a resin molded body for molding in the phantom ( The molded article 9 protrudes from the cavity (10) 9 200811968 The ejector lock H); the vent hole (not shown) in which the domain cavity 3 communicates with the outer space of the mold. The mold set may be a three-mold structure composed of the upper mold 2 and the lower mold (not shown) shown in Figs. 1 and 2, or may be composed of two or more molds. Further, a resin encapsulation molding apparatus in which a non-single-number is used as a module type of a plurality of mold sets can be used. As shown in FIGS. 1 and 2, the electronic component 4 includes a wafer 11 as a semiconductor element such as an IC (IntegraUon Circuit) integrated on the substrate 6, and electrically connects the wafer U and the substrate 6. Line body 12. In the first drawing, although the single-numbered wafer u is not mounted on the substrate 6 as a semi-finished product, a matrix array package type or a matrix type half-mounting in which the plurality of wafers 11 are mounted on the substrate 6 may be used. If a matrix array package type or matrix type substrate 6 is used, the plurality of wafers 11 can be resin-sealed at a time. Further, in the first and second drawings, the substrate is shown as a wire bonding substrate. However, the substrate of the present invention 15 is not limited thereto, and may be another substrate such as a flip chip substrate or a wafer level package substrate. Further, a laminated type package substrate in which a plurality of resin-sealed molded bodies are laminated on the substrate in the vertical direction may be used. In order to realize the thinned packaged product, in the first and second figures, the heat radiating plate 5 is placed so as to cover the electronic component 4 while being in close contact with the electronic component 4 as far as possible. After the resin sealing molding is completed, the horizontal portion 15 of the heat radiating plate 5 is exposed on the upper surface of the resin molded body 9, and the heat of the electronic component 4 is discharged to the outside from the horizontal portion 15 of the chrome-emitting heat radiating plate 5. As a result, the heat dissipation of the electronic parts can be improved. In addition, the heat dissipating plate 5 is not fixed to the substrate 6 before the resin is filled, and the heat dissipating plate 5 is formed by the resin material and the electronic components disposed in the upper mold 1 and the intermediate mold 2 when the resin is filled and formed. 4 and the substrate 6 is integrated. As shown in Fig. 1, the heat sink 5 has a horizontal portion 15 and a support portion 16 that can support the horizontal portion 15. An opening is formed in the horizontal portion 15 and the support is formed. When the resin is filled and molded, the resin material (fluid resin 17) which is smelted by heating can flow smoothly. Further, the horizontal portion (10) of the heat radiating plate 5 has a circular or angular shape. The resin passage 7 is composed of, for example, a screening portion for distributing the resin disposed in the heating portion, a flow path, and a gate (down gate). As is apparent from Fig. 2, the fluid-permeable resin 17 is injected and filled into the cavity 3 from the gate 13 which is provided at the center of the cavity 3 and which is an opening. The mouthpiece 13 is formed to pass through the gate member 14 provided in the intermediate mold 2. Further, the gate member 14 is attached to the intermediate mold 2 so as to be detachable from the intermediate mold 2. The front end portion of the gate 13 of the gate member 14 protrudes from the bottom surface 15 of the cavity 3, and penetrates the opening of the heat dissipation plate 5 when the heat dissipation plate 5 is placed in the cavity 3. As shown in Fig. 2, the front end portion of the gate 13 is a projection portion isa. The one or more protruding portions 18 of the present invention include either or both of the front end portion (18a) of the gate 13 including the gate member η and the front end portion (18b) of the ejector pin 10. 20 As described above, in the present embodiment, the heat radiating plate 5 can be positioned with respect to the cavity 3 by the protrusions 18a and 18b respectively opening through the opening of the horizontal portion 15 of the heat radiating plate 5. At this time, the bottom surface of the cavity 3 is in contact with the horizontal portion 15 of the heat dissipation plate, so that the movement of the heat dissipation plate 5 in both the up and down direction and the horizontal direction can be prevented. 0 11 200811968 More simply, by the projection 18a, And the protruding portion formed by the protruding system=protruding (four), the heat dissipation is positioned in the cavity 3 with the same precision. Further, the number of the protruding portions is not limited to two or three or more. , 2 ' 5

關於本實施型態之樹脂填封成形方法，為了將電子$ 件4及散細安於上嫌巾物，錢，上模= 中間模2(或可動之下模⑼，並在前述狀態下，使2個突出部 他及⑽可分別貫通水平部15的2個開口，將散熱板5插入 杈八3。然後，將安裝有電子零件4的基板6安置於凹部7。 1〇 在第1及2圖中，藉由突出部咖及⑽將散熱板5定位 時，由洗口構件14之前端部分(18a)與頂出銷1〇之前端部分 (18b)所構成的2個突出部18a及哪，分別貫通於設在散熱板 5的2個開口。 又，本發明另一貫施型態之模具組如第3圖所示。從第 15 3圖可知，頂出銷1〇之前端部（18b)及同樣為頂出銷10之其他 月i)端部分（18c)，分別貫通散熱板5的2個開口。如第3圖所 不，澆口構件14之前端部分並不突出於模穴3内，而模穴3 之底面與澆口 13位於同一平面。若散熱板5從平面看來的輪 廓為例如圓形’則僅藉由澆口構件14之前端部分（18a)之一 20處在平面看來模穴3之略中央（中心）部分為貫通散熱板5，即 可使散熱板5相對於模穴3而定位。 又，在第1〜3圖中，澆口構件14雖平面看來係形成於 模穴3的略中央部，但澆口構件14的配置並不限定於第1〜3 圖所示者，也可為第4及5圖所示者。在第4及5圖中，係以 12 200811968 樹脂填封倒裝晶片基板。此時，在晶片u與基板7之間注入 流動性樹脂17(倒扣封裝(un(jer_fiii))。在第4圖中，洗口 η 係配置於模穴3之底面。又，在第5圖中，澆口 13係配置於 模六3的側面，並藉由基板7之一部分與模穴3之側面所構 5成。在第3〜5圖中，藉由將2個頂出銷10之前端部分（18b、 18c)分別貫通散熱板5的2個開口，而使散熱板5定位於模穴 3 〇 又，在第1〜4圖所示之模具組中，係構成為樹脂通路8 之澆口構件14為可安裝及可拆卸，但在第5圖所示之模具組 1〇 中，便無需澆口構件14。 如上所述，在使用薄型化之封裝製品及散熱板5時，藉 由在設置於電子零件4之樹脂填封成形用模組具的模穴3内 形成1個以上的突出部18，可輕易地以高精準度使散熱板5 在模穴3内定位。 15 在使用本實施型態之樹脂填封成形裝置時，首先，藉 由加熱機構將上模1及中間模2(或可動之下模19)加熱至樹 脂成形溫度。接著，散熱板5之水平部分15定位於可動之中 間模2(或可動之下模19)的預定位置。此時，如第⑻圖所 示，兩個突出部18a及18b係貫通散熱板5之水平部15的開 20 口。又，在第3〜5圖之模具組中，兩個突出部18b及18c則 係分別貝通散熱板5之水平部的2個開口。 接著，在已定位之散熱板5安置於模穴3内之狀態下， 將安裝有電子零件5之基板（或引線框）安置於模穴3内。然 後，將樹脂材料供給至加熱部内，接著，使中間模2(或可 13 200811968 狀下綱往上方㈣。藉此，上模丨及中购(或可動之 下模19)為閉合。此時，將電子零件4插入模穴3内。 接著，藉由活塞對於已在加熱部内炼融之樹脂材料施 加壓力’藉&amp;，可將流動性樹脂17注入模穴3内，並且在模 5穴3中，散熱板5、電子零件4及基板6表面的一部分可包含 在對應於模穴3形狀的樹脂成型體(成形品）9内。 經過流動樹脂硬化所需的時間後，開啟上模2及中間模 2(或可動之下模19)，使中間模2(或可動之下模19)移動至下 方。然後，利用用以將散熱板5定位之頂出銷1〇，使樹脂成 10型體9脫離模穴3。藉此，可從上模1及中間模2(或可動之下 模19)取出樹脂成形體9及基板6。 根據本實施型愍之樹脂填封成形裝置，可輕易地以高 精準度將政熱板5定位於用以將電子零件4樹脂填封成形之 模具組1及2的模穴3内。因此，可更提昇安裝有散熱板5及 15電子零件4之封裝製品（成形品）的生產性。 以上詳細地說明本發明，但本發明不限定於所舉之 例，本發明之申請專利範圍所限定者僅為發明之精神與範 圍。 【圖式簡單說明】 20 第1圖係搭載於電子零件之樹脂密封成形裝置之模組 品的概略截面圖，顯示模組品的開啟狀態。 第2圖係顯示第1圖所示之模組品為閉合狀態時注入流 動性樹脂之狀態的圖。 第3圖係與第1圖所示之模組品不同之另外一例之模組 14 200811968 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。 第4圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。 第5圖係與第1圖所示之模組品不同之另外一例之模組 品的概略截面圖，顯示模組品為閉合狀態時注入流動性樹 脂之狀態。With regard to the resin sealing method of the present embodiment, in order to attach the electronic component 4 and the fineness to the upper towel, the upper die = the intermediate die 2 (or the movable lower die (9), and in the aforementioned state, The two protrusions and (10) are respectively inserted through the two openings of the horizontal portion 15, and the heat dissipation plate 5 is inserted into the 杈8. Then, the substrate 6 on which the electronic component 4 is mounted is placed in the recess 7. In the figure, when the heat radiating plate 5 is positioned by the protruding portion and (10), the two protruding portions 18a composed of the front end portion (18a) of the mouthwashing member 14 and the front end portion (18b) of the ejector pin 1〇 and Further, each of the two openings is provided in the heat dissipation plate 5. The mold group according to another embodiment of the present invention is as shown in Fig. 3. As can be seen from Fig. 35, the front end of the ejector pin 1 is ( 18b) and the other month i) end portion (18c), which is also the ejector pin 10, respectively penetrate the two openings of the heat sink 5. As shown in Fig. 3, the front end portion of the gate member 14 does not protrude into the cavity 3, and the bottom surface of the cavity 3 is located in the same plane as the gate 13. If the profile of the heat sink 5 from the plane is, for example, a circle, then only a portion of the front end portion (18a) of the gate member 14 is in a plane, and the central portion (center) of the cavity 3 is transparent. The plate 5 allows the heat sink 5 to be positioned relative to the cavity 3. Further, in the first to third figures, the gate member 14 is formed at a substantially central portion of the cavity 3 in plan view, but the arrangement of the gate member 14 is not limited to those shown in the first to third figures. Can be shown in Figures 4 and 5. In Figures 4 and 5, the flip chip substrate was filled with 12 200811968 resin. At this time, a fluid resin 17 (an undercut package (un(jer_fiii)) is injected between the wafer u and the substrate 7. In Fig. 4, the wash port η is disposed on the bottom surface of the cavity 3. Further, at the fifth In the figure, the gate 13 is disposed on the side surface of the die 6 and is formed by a portion of the substrate 7 and the side surface of the cavity 3. In Figures 3 to 5, by ejector pins 10 The front end portions (18b, 18c) respectively pass through the two openings of the heat dissipation plate 5, and the heat dissipation plate 5 is positioned in the cavity 3, and in the mold set shown in Figs. 1 to 4, the resin passage 8 is formed. The gate member 14 is detachable and detachable, but in the mold set 1 shown in Fig. 5, the gate member 14 is not required. As described above, when the thinned packaged article and the heat sink 5 are used, By forming one or more protruding portions 18 in the cavity 3 of the resin sealing molding module provided in the electronic component 4, the heat dissipation plate 5 can be easily positioned in the cavity 3 with high precision. When the resin sealing and molding apparatus of this embodiment is used, first, the upper mold 1 and the intermediate mold 2 (or the movable lower mold 19) are heated to a resin by a heating mechanism. Then, the horizontal portion 15 of the heat dissipation plate 5 is positioned at a predetermined position of the movable intermediate mold 2 (or the movable lower mold 19). At this time, as shown in the figure (8), the two protruding portions 18a and 18b are through the heat dissipation. Further, in the mold group of the third to fifth embodiments, the two projecting portions 18b and 18c are two openings of the horizontal portion of the Beton heat sink 5, respectively. The substrate (or lead frame) on which the electronic component 5 is mounted is placed in the cavity 3 in a state where the positioned heat dissipation plate 5 is placed in the cavity 3. Then, the resin material is supplied into the heating portion, and then the middle is made The modulo 2 (or 13 can be up to the top (4). Thus, the upper die and the middle die (or the movable die 19) are closed. At this time, the electronic component 4 is inserted into the cavity 3. Next, by The piston applies a pressure 'borrowing' to the resin material that has been fused in the heating portion, and the fluid resin 17 can be injected into the cavity 3, and in the cavity 5 of the die 5, the surface of the heat dissipation plate 5, the electronic component 4, and the substrate 6 A part may be contained in a resin molded body (molded article) 9 corresponding to the shape of the cavity 3. After the time required for the kinetic resin to harden, the upper mold 2 and the intermediate mold 2 (or the movable lower mold 19) are opened, and the intermediate mold 2 (or the movable lower mold 19) is moved to the lower side. Then, the heat dissipation plate is used. 5 The top end of the positioning pin is 1 〇, and the resin is formed into the 10-shaped body 9 from the cavity 3. Thereby, the resin molded body 9 and the substrate 6 can be taken out from the upper mold 1 and the intermediate mold 2 (or the movable lower mold 19). According to the resin sealing and forming apparatus of the present embodiment, the political hot plate 5 can be easily positioned with high precision in the cavity 3 of the mold sets 1 and 2 for sealing the resin of the electronic component 4. Therefore, The productivity of the packaged product (molded article) in which the heat sinks 5 and 15 electronic components 4 are mounted can be further improved. The invention is described in detail above, but the invention is not limited to the examples, and the scope of the invention is limited only by the spirit and scope of the invention. [Brief Description] Fig. 1 is a schematic cross-sectional view of a module mounted on a resin sealing and molding apparatus for electronic components, showing the open state of the module. Fig. 2 is a view showing a state in which a fluid resin is injected when the module shown in Fig. 1 is in a closed state. Fig. 3 is a diagram showing another example of a module different from the module shown in Fig. 1. The schematic cross-sectional view of the product of 200811968 shows the state in which the fluidity resin is injected when the module is closed. Fig. 4 is a schematic cross-sectional view showing another example of a module different from the module shown in Fig. 1, showing a state in which a fluidity resin is injected when the module is in a closed state. Fig. 5 is a schematic cross-sectional view showing another example of a module different from the module shown in Fig. 1, showing a state in which a fluidity resin is injected when the module is in a closed state.

【主要元件符號說明】 1&quot;·讀 2.. .中間模 3.. .模穴 4.. .電子零件 5…放熱板 6…勒反 7··.凹部 8.··樹脂通路 9…樹脂成形體(成形品) 10.. .頂出銷(脫模銷） 11…半導體晶片 12…線體 13···洗口 14···澆口構件 15…水平部 16…支持部 17…流動性樹脂 18(18a、18b、18c)···突出部 19···下模 15[Description of main component symbols] 1&quot;·Reading 2... Intermediate die 3... Mold hole 4.. . Electronic component 5... Heat release plate 6...Reverse 7·.. Recessed part 8.·Resin passage 9...Resin Molded body (molded article) 10.. ejection pin (release pin) 11: semiconductor wafer 12... wire body 13···washing port 14··gate member 15...horizontal portion 16...support portion 17...flow Resin 18 (18a, 18b, 18c) ··· protruding part 19··· lower mold 15

Claims (1)

200811968 十、申請專利範圍： 1. 一種電子零件之樹脂填封成形裝置，包含有： _ 1 第1模，係可安裝搭載有電子零件之基板者； - 第2模，係配置成相對於前述第1模，且具有可插入 ' 5 前述電子零件之模穴者； ‘ 1個以上之突出部，係形成於前述模穴内者；及 散熱板，係具有1個以上之開口，並且藉由前述1 ^ 個以上之突出部分別貫通前述1個以上之開口，可相對 於前述模穴而定位者。 10 2·如申請專利範圍第1項之電子零件之樹脂填封成形裝 置，其中前述1個以上之突出部中至少1個係用以使成形 品與前述第2模分離的脫模銷。 3.如申請專利範圍第1項之電子零件之樹脂填封成形裝 置，其中前述1個以上之突出部中至少1個構成用以將流 15 動性樹脂注入前述模穴内的樹脂通路。 φ 4·如申請專利範圍第3項之電子零件之樹脂填封成形裝 置，其中前述樹脂通路之一部分或全部安裝於前述第2 模且可與前述第2模分離。 16200811968 X. Patent application scope: 1. A resin sealing and forming device for electronic parts, comprising: _ 1 first mold, which can be mounted on a substrate on which electronic components are mounted; - second mold, configured to be relative to the foregoing a first mold having a cavity into which the electronic component can be inserted; 'one or more protruding portions are formed in the cavity; and the heat dissipation plate has one or more openings, and by the foregoing Each of the 1 ^ or more protruding portions penetrates through the one or more openings, and is positioned relative to the cavity. The resin sealing device for an electronic component according to the first aspect of the invention, wherein at least one of the one or more protruding portions is a mold release pin for separating the molded article from the second mold. 3. The resin encapsulation molding apparatus for an electronic component according to the first aspect of the invention, wherein at least one of the one or more protruding portions constitutes a resin passage for injecting a fluid resin into the cavity. The resin encapsulation molding apparatus for an electronic component according to claim 3, wherein one or all of the resin passages are partially or entirely attached to the second mold and are separable from the second mold. 16
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