201220553 ^tuzozpii 六、發明說明： 【發明所屬之技術領域】 本發明是關於封膠材料形成裝置及其方法，更具體 說，是特別適於藉由二次注塑系統形成發光二極體封裝之 封膠材料的封膠材料形成裝置及其方法。 t 【先前技術】 以樹脂形成封膠材料來封裝晶片的技術是用於製造封 裝製品（包括如發光二極體晶片的半導體晶片）^根據技 術水準及現今製品及市場所要求的特性，傾向將如發光二 極體封裝的半導體封裝變得更輕、更薄、更短及更小。基 於此趨勢及減少原物料耗損的努力，積極研究封膠材料ς 形成’以㈣㈣賴騎料的樹脂使用量減到最少。 本領域中廣知的封膠材料形成技術有：轉注成型 二次注塑（0v_lding)(或，壓縮成型叫職^ molding))。 在轉注成型的案例中，為了使執行注塑的腔中注 為原料的未固化樹脂，首先供給樹脂到形成於模具中 port) ’並在上模具與可動模具閉合的狀態下將外力 加至蟑’藉此，樹脂應可依序經由流道及閘進人腔中。卷 ，注滿樹脂後，通過閘的樹脂在預設時間_化 ^ 封膠材料的封膠材料或製品與模具分離。此時，留括 流道及閘巾的留麵脂與製品分離，且隨後被拾棄。皁、 如上所述，由於在轉注成型（或射出成型）中樹心 201220553 40262pif 的路徑傳送’因此需要大的樹脂流量。此外，由於 及閘比S封膠材料形成於其中的腔數量較多，且 、流道及閘中的樹脂被捨棄，因此造成樹脂耗損 另I、ϋ、失。因此，儘管有多種優點如良好的成型精確性 时Ϊ尺寸的高穩定性，但因樹脂耗損過度，轉注成型有 人濟效益惡化的本質問題。 ^時’與轉注成型相反，二次注塑不使用埠、流道及 甲’接將_旨供給域並壓賴脂⑽成娜材料。因 ^於樹脂的耗損可大量減少’二次注塑在經濟方面是 :。然而，在傳統的二次注财，由於在樹脂壓縮過 二’在成型厚度方向上腔的體積減少或改變，因此成型 根據樹脂的供給而改變。此外，當多個單元的封 :厂姉成時，傳統的二次注塑具有優勢，但傳統二 -人注塑中的問題是難以處理特殊製品 =應用在形成半導體晶片（位於具有多個通孔^^ 二，上）的封膝材料時，樹脂可能經由通孔流出。因此， 攻方面傳統二姐塑極錢利且顧，舉㈣言，鹿當 需要以防漏膠布或相似物堵住通孔的預先處理。〜 在表面黏著元件（surface _咖；smd)式的 ^，極體封裝（上述發*二極體封裝在發*二極體封裝 佔大夕數）龄，丨巾，為了增進光學效率，需要圍繞 j 一極體晶4的反紐。反紐是藉由在導線架基板（由 圖案化金屬而成）上射出成型及結合（integrating)苯丙醇 胺（plienylpropanolamine ; ppA)獲得的製品，且具有將 201220553 ^υζοζριι 的開口。為了使二次注塑應用於上 脂的供給超過可膠材料或透鏡。因此’若樹 導線架的不需要tc腔’封膠材料甚至會形成於 單元或咖的間體外部周圍）。如此， 耗捨棄的樹脂越多，上述(Plteh)越大，需要消 中可能進—步造成額/在成型處理及任何後續處理 耗捨棄而形成薄的封二2::，若為了減少樹脂的消 的黏著，使得封膠材“ Lift光體與封膠材料間 導致其他_。 任何賴處对分離，因而 【發明内容】 問題本解決的前文所提到先前技術中的 度尺寸的封膠材 的導線架）上形成封膠材料。、、*反（*如具有通孔 法可另—目的是提供封騎料形成方法，上述方 =次注塑式形繼在基板(特別是具3 處理r喊具村轉度尺寸的轉材料而不用預 :£S5;?::== 谈入陰模；及提供、、立於固疋模具與可動模具間的 夂於甘人入陰模與可動模具間的樹脂裝载空 201220553 ^U2b2pif 間，其中於嵌入陰模處形成朝向基板的成型空腔及連结從 樹脂裝載空關成型空腔的樹脂移動路徑處月: 動路徑包括形成於嵌人陰模中的樹脂人口埠處用 板、嵌入陰模及樹脂裝載空間連續相觸時將樹脂裝载空 及成型空腔彼此連結。 根據一實施例，可動模具可包括腔保持塊，上述腔保 ，塊上升或下降直到腔保持塊接觸嵌入陰模後停止；^腔 壓縮塊，在腔保持塊停止後進一步上升或下降，以朝嵌入 陰模壓縮樹脂裝載空間中的樹脂，其中將膜應用於覆蓋腔 保持塊的上部及腔壓縮塊的上部。 …/根據本發明用以達成目的的另一態樣，也提供封膠材 ^形成方法，此方純㈣置基板於固定模具；藉由使用 敗入陰模形成與基板接觸的至少一個成型空腔；及藉由使 ，可動模具，壓縮樹脂裝載空間中的樹脂至成型空腔中， 藉此於成型空腔中形成封膠材料。 【實施方式】 之後將參照隨附圖式，詳細描述本發明的較佳實扩 ，。此外，提供實施例是為了使本領域中具通常知識者】 完整了解本發明，且本發明不受實施例侷限。 圖1到圖3為根據本發明實施例表現封膠材料形成穿 置的橫剖面®，上述橫剖面圖分職職起始成型階^ 第-位置、對應中間成型階段的第二位置，和對應最^ 型階段的第三位置；且圖4是圖3中封膠材 晋 本部分的放大制關。 Μ置基 7 201220553 Wlttzpn 如圖1到圖3所示，此實施例的封膠材料形成裝置為 -次注塑式形成裝置，或擠壓成型式形成裝置，包括上固 定模具20、下可動模具3〇及在二者中間的嵌入陰模（_ cavity blGd〇 40。雖朗未料，為了藉上升或下降 模具以執行樹脂的壓縮成型，舉例而言，使用 機的抬升機械。 ~ 固定模具20及可動模具3〇分別配置於如加壓空 之抬升機械的上部和下部，以使彼此相對。固定模且 及/或可動 3〇可裝備加熱元件（未料）以在預設溫 度下加熱觸。在此實施财，轉㈣軸於具有導 架11的基板10上，且基板1G包括發光二極體晶片12及 反光體13 ’上述發光二極體晶片12裝置在導線架u上， 上述反光體13分別具有用以接收各別發光二極體晶片12 的開口。此外，基板10在封膠材料形成後被鱗，以使上 述基板10分為多個表面黏著元件式發光二極體封裝中 ，板ω具有來自導線架u之圖案的通孔。藉本說明^， 定義詞彙「基板」為包括各難置在固定難2()或可動模 具30以形成封膠材料的物件。此外，如圖所示，基板是 膠材料形成處的物件，其#由將發 線絲製造，細本發明不被前述所限。裝置於導 藉由個別提供的基板供給單元（未繪示），將基板ι〇 共應至固定模具2〇’並裝置朗定模具2()。為了使基板 〇裝置至ϋ定模具20,可使用真空吸附方法或夾合方法， 但也可用其他方法來使基板1G裝置至蚊模具2…在固 201220553 40262pif n二f可動模具3 〇彼此空間分離預定距離的狀態 下’基板供料元藉加_動單元供雜板Μ。裝設裝置 Μ _板1G ’ __獅紐上的基板 10的買·闊表面朝向可動模具3〇。 此外，嵌入陰模40裝置於基板1〇 (裝置至固定模具 上如圖4所良好!會示的，嵌人陰模4〇分別在一表面 具有多個成型空腔4卜及在連接至成型㈣4ι的另一表 面具有多個樹脂入π埠（或閘）42。此外，嵌入陰模4〇 裝置於基板1G ’以使多個成型空腔41朝向基板1〇，且多 麵脂入叫42朝向在可動模具30上的獅裝載空間 如上所述’基板1〇包括在一表面處的發光二極體晶片 12及反光^ 13 ’上述各反光體13具有用以接收相應的發 光-極體晶>| 12的開口，且上述反光體13的開口需要以 封膠材料填滿。為了上述目的，反光體13實質上緊密安裝 於相應的嵌入陰模40之成型空腔41中。因此，在成型空 腔41中，只有反光體13的開口實際上可被樹脂尺填滿。 為了使封膠材料具有所需形狀，成型空腔41可設計為具有 凸透鏡形狀或其他所需形狀。以腔壓縮塊31壓縮在可動模 具30的樹脂裝載空間中的樹脂，使上述樹脂受壓縮經入口 琿42流進成型空腔41，且隨之固化，從而形成在反光體 13的開口中用來包覆發光二極體晶片12的封膠材料。若 與此實施例相反，基板1〇不包括反光體13，就連圖中被 反光體13佔據的空間都會被樹脂填滿。 201220553 HUZOZpil 回到參照圖1到圖3，可動模具30包括配置在基部3 上的腔壓縮塊31及腔保持塊36 ^基部3用來連接抬升機 械（未繪示），以藉抬升機械垂直地驅動。腔壓縮塊3ι 固定於基部3上表面的中央區域處，且以設置在基部3上 的彈性構件37彈性地支持腔保持塊36。若操作基部3上 升，則腔壓縮塊31及腔保持塊36 一同上升。之後，若腔 保持塊36因接觸其他構件（此實施例中為嵌入陰模4〇) 知止上升，則僅腔壓縮塊31隨彈性構件37之壓縮上 預定高度。 根據此實關’由於難縮塊31的定位總是低於位於 其外部周_腔保持塊36，故在可動模具3()上形成可接 收熔融樹脂的凹面空間（由以腔壓縮塊31及腔保持塊％ 義）B/此外’此實施例的__形絲置包括離型 膜5〇，用以覆蓋可動模具3〇的上部， 的過程中熔融樹脂直接接觸可動模具3〇，==: =到可動模具30下。當離型膜5G覆蓋可動模且 : 時’離型膜50是藉安裝於可動模具3 ^單 示）真雜附在可動模具3〇的上部。真工早兀（未緣 此時’離型膜50經由可動模且％ 保持塊3 6之間的狹隙而真空黏附，且塊31與腔 脂在壓縮過程部分漏㈣樹脂裝載 止熔融樹 3形8成。預定量的固態或液態樹脂平均 進一步依序描述藉由 現在，將參照圖1、圖2及圖3， 201220553 40262pif 使用形成裝置在基板上形成封膠材料的過程。 後將1，絲10首絲置於上定模具2G，且隨 且有^ =模⑽裝置於基板1G上。_膜50真空 ^有^的可動模具3〇的上部，藉此形成樹脂裝载= 在此自腔離31與腔保持塊36間的措：： 二嵌人陰模4G裝置在位於固賴具心的 (離型膜50:入陰模4〇也可裝置於可動模具30的上部 I離1膜50真空黏附處）。在圖 模具30的部件盘所有固所不位置處，所有可動 川千興所有固疋核具2〇的構件分離。 ，照圖2 ’若基部3餘升機械操作上升，可 ，由接觸到嵌入陰模4。，並停止移動:、 i觸。^ ί 型膜％與嵌人陰模4G彼此確實201220553 ^tuzozpii VI. Description of the Invention: [Technical Field] The present invention relates to a sealing material forming apparatus and method thereof, and more particularly to a sealing of a light emitting diode package formed by an overmolding system A sealing material forming device for a glue material and a method therefor. t [Prior Art] The technique of encapsulating a wafer by forming a sealing material with a resin is for manufacturing a packaged product (including a semiconductor wafer such as a light-emitting diode wafer). According to the technical level and characteristics required by current products and markets, the tendency is to Semiconductor packages such as light-emitting diode packages have become lighter, thinner, shorter, and smaller. Based on this trend and efforts to reduce the loss of raw materials, we actively studied the sealing material ς formation to minimize the use of resin in (4) (4). Sealing material forming techniques well known in the art include: transfer molding, overmolding (0v_lding) (or compression molding). In the case of transfer molding, in order to make the uncured resin which is injected into the cavity of the injection molding, the resin is first supplied to the port formed in the mold and the external force is applied to the state where the upper mold and the movable mold are closed. Thereby, the resin should be sequentially introduced into the human cavity through the flow path and the gate. After the resin is filled with the resin, the sealing material or the product of the sealing material is separated from the mold at a predetermined time by the resin of the gate. At this time, the residual grease leaving the flow path and the wiper was separated from the product and then picked up. Soap, as described above, requires a large resin flow rate due to the transfer of the center of the 201220553 40262pif in the transfer molding (or injection molding). In addition, since the number of cavities in which the gate ratio S sealant is formed is large, and the resin in the flow path and the gate is discarded, the resin wear is caused by the loss of the resin. Therefore, despite various advantages such as good molding accuracy and high stability of the crucible size, the transfer molding has an essential problem of deterioration of the human economy due to excessive resin wear. In contrast to the transfer molding, the overmolding does not use the crucible, the runner, and the armor to supply the domain and press the grease (10) into a material. Because the loss of resin can be greatly reduced, the economical aspect of overmolding is: However, in the conventional secondary coining, since the volume of the cavity is reduced or changed in the direction of the molding thickness in the resin compression, the molding is changed in accordance with the supply of the resin. In addition, when the sealing of a plurality of units is completed, the conventional overmolding has an advantage, but the problem in the conventional two-person injection molding is that it is difficult to handle special products = application in forming a semiconductor wafer (located in a plurality of through holes ^ ^2, above) When sealing the knee material, the resin may flow out through the through hole. Therefore, the attack on the traditional second sister is extremely profitable and considers it. In the fourth sentence, the deer needs to pre-treat the through hole with a leak-proof tape or the like. ~ In the surface of the adhesive component (surface _ café; smd) type, the polar body package (the above-mentioned hair * diode package in the hair / diode package accounted for a large number of eves) age, wipes, in order to improve optical efficiency, need The anti-news around the j-pole crystal 4. The anti-neo is an article obtained by injection molding and integrating plienylpropanolamine (ppA) on a lead frame substrate (made of a patterned metal) and having an opening of 201220553 ^υζοζριι. In order to apply the overmolding to the upper grease, the supply exceeds the glueable material or lens. Therefore, if the tree lead frame does not require a tc cavity, the sealant material may even form around the outside of the unit or coffee compartment. Thus, the more resin that is discarded, the larger the above (Plteh), the need to eliminate the possibility of further production/disposal in the molding process and any subsequent processing to form a thin seal 2::, in order to reduce the resin Adhesive adhesion, so that the sealing material "between the light body and the sealing material lead to other _. Any separation, so [invention content] The problem of the prior art mentioned in the prior art of the size of the sealing material The lead frame is formed on the sealing material., *, * (* if there is a through hole method can be additionally - the purpose is to provide a method for forming a sealing material, the above-mentioned square = injection molding type is followed by the substrate (especially with 3 treatments Shouting the transfer material with the size of the village without pre-preparation: £S5;?::== talk about the negative mold; and provide, and stand between the solid mold and the movable mold, the Gan people into the negative mold and the movable mold The intervening resin is loaded between 201220553 ^U2b2pif, wherein a molding cavity is formed toward the substrate at the embedded female mold and a resin moving path is connected from the resin loading the void forming cavity. The moving path includes forming in the embedded yin The resin population in the mold is plated and embedded in the yin The resin loading space and the molding cavity are coupled to each other when the resin loading space is continuously in contact with each other. According to an embodiment, the movable mold may include a cavity holding block, and the cavity is raised or lowered until the cavity holding block contacts the embedded female mold. Stopping; the cavity compression block is further raised or lowered after the cavity holding block is stopped to compress the resin in the resin loading space into the female mold, wherein the film is applied to cover the upper portion of the cavity holding block and the upper portion of the cavity compression block. According to another aspect of the present invention for achieving the object, there is also provided a method for forming a sealant, wherein the substrate is placed in a fixed mold; at least one molded cavity is formed in contact with the substrate by using a negative mold. And by compressing the resin in the resin loading space into the molding cavity by the movable mold, thereby forming a sealant material in the molding cavity. [Embodiment] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the embodiments are provided to enable a person of ordinary skill in the art to fully understand the present invention, and the present invention is not limited by the embodiments. 3 is a cross section® showing the formation of a sealant material according to an embodiment of the present invention, wherein the cross-sectional view is divided into a first position, a second position corresponding to the intermediate forming stage, and a corresponding most shaped stage. The third position; and Fig. 4 is the enlargement and closing of the seal material of Fig. 3. The base 7 201220553 Wlttzpn As shown in Fig. 1 to Fig. 3, the sealing material forming device of this embodiment is - An injection molding apparatus, or an extrusion molding apparatus, comprising an upper fixing mold 20, a lower movable mold 3, and an embedded female mold (_cavity blGd〇40) therebetween. Although it is unexpected, in order to borrow or lower The mold is subjected to compression molding of a resin, for example, using a lifting machine of the machine. The fixed mold 20 and the movable mold 3 are respectively disposed at upper and lower portions of the lifting machine such as pressurized air so as to face each other. The fixed mold and/or movable 3〇 can be equipped with a heating element (unexpected) to heat the touch at a preset temperature. In this implementation, the (four) axis is on the substrate 10 having the lead frame 11, and the substrate 1G includes the light emitting diode chip 12 and the light reflecting body 13'. The light emitting diode chip 12 is disposed on the lead frame u, and the above reflecting body 13 has openings for receiving respective light emitting diode chips 12, respectively. Further, the substrate 10 is scaled after the sealant material is formed so that the substrate 10 is divided into a plurality of surface-adhesive-type light-emitting diode packages having a through-hole from the pattern of the lead frame u. By way of this description, the definition of the vocabulary "substrate" includes articles that are difficult to be placed on the fixed hard 2 () or the movable mold 30 to form a sealant. Further, as shown in the figure, the substrate is an article in which the adhesive material is formed, and # is manufactured by the hairline, and the present invention is not limited by the foregoing. The apparatus is coupled to the fixed mold 2' by a separately provided substrate supply unit (not shown) and the apparatus 2 is erected. In order to make the substrate 〇 device to the 模具 mold 20, a vacuum adsorption method or a splicing method may be used, but other methods may be used to make the substrate 1G device to the mosquito mold 2... in the solid 201220553 40262pif n two f movable mold 3 〇 spatially separated from each other In the state of the predetermined distance, the substrate feeding unit is supplied with the _ moving unit for the board. Mounting device Μ _ plate 1G _ __ The top surface of the substrate 10 on the lion is facing the movable mold 3〇. In addition, the embedded female mold 40 is mounted on the substrate 1 (the device is fixed to the fixed mold as shown in FIG. 4! It is shown that the embedded female mold 4 has a plurality of molding cavities on one surface, respectively, and is connected to the molding. (4) The other surface of 4ι has a plurality of resins into π埠 (or gate) 42. Further, the embedded mold 4 is mounted on the substrate 1G' such that the plurality of molding cavities 41 face the substrate 1 and the multi-face grease is called 42 The lion loading space facing the movable mold 30 as described above, the substrate 1 includes a light-emitting diode wafer 12 at a surface, and the reflective body 13 has the above-mentioned respective reflectors 13 for receiving corresponding light-polar crystals. <| 12, and the opening of the above-mentioned reflector 13 needs to be filled with a sealing material. For the above purpose, the reflector 13 is substantially tightly mounted in the corresponding molding cavity 41 of the female mold 40. In the molding cavity 41, only the opening of the reflector 13 can be actually filled with the resin ruler. In order to have the desired shape of the sealing material, the molding cavity 41 can be designed to have a convex lens shape or other desired shape. Block 31 compresses the resin in the movable mold 30 The resin in the carrier space causes the resin to be compressed and flows into the molding cavity 41 through the inlet port 42 and is then solidified to form a sealing material for coating the LED chip 12 in the opening of the reflector 13. In contrast to this embodiment, the substrate 1A does not include the reflector 13, and even the space occupied by the reflector 13 in the drawing is filled with resin. 201220553 HUZOZpil Referring back to FIGS. 1 to 3, the movable mold 30 includes the configuration. The cavity compression block 31 and the cavity holding block 36 on the base 3 are used to connect a lifting mechanism (not shown) for driving vertically by a lifting mechanism. The cavity compression block 3 is fixed at a central portion of the upper surface of the base 3. And the cavity holding block 36 is elastically supported by the elastic member 37 provided on the base 3. If the operation base 3 is raised, the cavity compression block 31 and the cavity holding block 36 are raised together. Thereafter, if the cavity holding block 36 is in contact with other members (In this embodiment, the embedded female mold 4〇) knows that the rise, only the cavity compression block 31 is compressed with the elastic member 37 by a predetermined height. According to this reality, the positioning of the difficult-to-contract block 31 is always lower than External circumference_cavity retention 36, so a concave space for receiving the molten resin is formed on the movable mold 3 () (by the cavity compression block 31 and the cavity holding block %) B / Further 'the __ shaped wire of this embodiment includes the release film 5 〇, in order to cover the upper portion of the movable mold 3〇, the molten resin directly contacts the movable mold 3〇, ==: = to the movable mold 30. When the release film 5G covers the movable mold and: the 'release film 50 It is attached to the upper part of the movable mold 3〇 by the movable mold 3 ^ single). The work is early (not at this time, the release film 50 is vacuum-bonded via the gap between the movable mold and the % holding block 36, and the block 31 and the cavity grease partially leak during the compression process. (4) Resin loading the molten tree 3 The shape is 80%. The predetermined amount of solid or liquid resin is further described on the average. By now, the process of forming a sealant on the substrate using the forming apparatus will be described with reference to Figs. 1, 2 and 3, 201220553 40262pif. The filament 10 is placed on the upper mold 2G, and the mold is placed on the substrate 1G. The film 50 is vacuumed and the upper portion of the movable mold 3 is formed, thereby forming a resin load = here The method between the cavity 31 and the cavity holding block 36: The two embedded female die 4G device is located at the center of the fixed mold 50 (the release film 50: the negative mold 4 can also be installed on the upper part of the movable mold 30. The film 50 is vacuum-bonded.) At the position where all the parts of the mold plate of the mold 30 are not fixed, all the components of the movable Chuanxing all solid-state nucleus are separated. See Figure 2 'If the base is 3 liters, the mechanical operation rises. , can, by contact to the embedded female mold 4., and stop moving:, i touch. ^ ί type film% with embedded female mold 4 G really does each other
接觸然而，如果樹脂的漏討以其 I ，膜50。因此，通過此描述，將會^ “ : 先接觸腔倾塊36。 40 ^ _ 所不’若基部3藉抬升機械操作進—步上升， 腔£縮鬼31隨彈性構件37 _縮一 壓縮在樹脂裝裁办門Μ击ν上升因此 空間％越來ΪΓ。0如圖4所士述壓縮導致樹脂裝載 轉移到凹穴區域，且進一能限制樹脂 樹脂裝載空間38越來越封閉效果。如同上述，當 Λ, ^ 越、，樹脂變得被直接加壓，且經壓 縮的树驗料人陰模4G中提供的樹脂人σ槔42注入= 11 201220553 w^ozpn 型空腔41。 有效地移除經由上面過裎留存或生成的氣 泡（孔隙）並提升成雜（f_碰ty)，可形成直 道，亦即通氣孔。通氣孔可選擇性地沿表面形成，^述表 陰模4G接觸反光體13的上表面，及形成樹脂裝 載二間38的外部周圍的腔保持塊％的上表面。 經過預定時間後，經加壓的液態型樹脂固化。若樹脂 固化’則固定模具20及可動模具3〇彼此分離，且基板1〇 ^嵌入陰模4G可藉由使用材料供給單元（树示）整批卸 -以與模具整批分冑。在其他例子中，嵌入陰模可首 先同時卸載與分離，且隨後基板（其中封膠材料已完成） 可被抑下。 圖5以一例表現表面1〇的相對表面（亦即與形成 膠材料的表面相對的另-表面）為非平面。若凸出部19 形成於基板10的相對表面上，在固定模具2〇巾形成與凸 出部19相應的漏出槽27，以避免基板1〇抬升。漏出槽、27 可不只與凸出部19相應，也消除成型空腔41外部周^的 間隙（gap)，上述間隙由多個反光體13的上表面形成的 偏移及嵌入陰模40的壩條表面43 (見圖4)的偏移之間的 重疊而形成。當基板10的部份被彈性推進形成於固定模具 20中的漏出槽27時’回彈仙可導致抵銷上述偏移，且 進一步提升密封能力。 圖6為根據本發明實施例另一實施例表現封膠材料形 成裝置的橫剖面圖。此實施例除了基板1〇是裝置在相反方Contact, however, if the resin is missing, I, film 50. Therefore, by this description, it will be ": first contact with the cavity tilting block 36. 40 ^ _ no" if the base 3 is lifted up by the lifting mechanical operation, the cavity is reduced with the elastic member 37 _ The resin tampering door slamming ν rises so that the space % becomes more and more entangled. 0 The compression as shown in Fig. 4 causes the resin loading to be transferred to the pocket area, and further, the resin resin loading space 38 can be restricted to be more and more closed. When Λ, ^越,, the resin becomes directly pressurized, and the resin σ槔42 injected in the compressed tree tester's negative mold 4G is injected = 11 201220553 w^ozpn type cavity 41. Effectively moved In addition to the bubbles (pores) retained or generated by the above-mentioned enthalpy, and raised into impurities (f_touch ty), a straight channel, that is, a vent hole, may be formed. The vent hole may be selectively formed along the surface, and the surface of the negative mold 4G is contacted. The upper surface of the reflector 13 and the upper surface of the cavity holding block around the outer portion of the resin-loading two spaces 38. After a predetermined period of time, the pressurized liquid type resin is cured. If the resin is cured, the mold 20 is fixed and movable. The molds 3 are separated from each other, and the substrate 1 is embedded The female mold 4G can be unloaded in batches by using a material supply unit (tree) to dispense the entire batch with the mold. In other examples, the embedded female mold can be simultaneously unloaded and separated simultaneously, and then the substrate (where the sealing material has been Fig. 5 is a non-planar surface on the opposite side of the surface (i.e., the other surface opposite to the surface on which the glue material is formed). If the protrusions 19 are formed on the opposite surfaces of the substrate 10, The leakage groove 27 corresponding to the protruding portion 19 is formed in the fixed mold 2, so as to prevent the substrate 1 from being lifted up. The leakage groove 27 can not only correspond to the protruding portion 19, but also eliminate the gap of the outer circumference of the molding cavity 41. (gap), the gap is formed by an overlap between the offset formed by the upper surfaces of the plurality of reflectors 13 and the offset of the dam strip surface 43 (see FIG. 4) embedded in the female mold 40. When the portion of the substrate 10 is When rebounded by the leakage groove 27 formed in the fixed mold 20, the rebound can cause the offset to be offset and further improve the sealing ability. FIG. 6 is a view showing a sealing material forming device according to another embodiment of the present invention. Cross section view. This embodiment is in addition to Plate means is in the opposite 1〇
12 201220553 40262pif 向中，實質上同於在前面實施例中描述的機制。換士之 根據此實施例’可動模具30配置於上方處以作為上模呈 且固定模具20配置於下方處以作為下模具。基板 在下固定模具20，且將嵌入陰模40放置其上。嵌^ 4〇具有提供於其一表面的成型空腔41，其中成型空 的開口朝向裝置在下模具的基板1〇，亦即固定模具"2〇"。 朝向可動模具3G 人陰模4G的其他表面上，、ς樹 裝載空間38及連接樹脂裝載空間38域型空腔的樹脂二 口璋42。離型膜50配置在可動模具3〇之下或嵌入陰模4〇 之上，以放置在樹脂裝載空間38下。可動模具3〇首先下 降，以使可動模具30的腔保持塊36接觸到嵌入陰模4〇， 其中離型膜5〇置入其間。此外，雜縮塊Μ隨同彈性構 件37的壓縮進-步下降，藉此壓縮在樹脂裝載空間％ # 的樹脂。以強大壓力將樹脂從樹脂裝载空間％經由樹脂入 口槔注入欲人陰模。將成型空腔中的液態樹脂固化 緻密且厚尺寸穩㈣__形姐成㈣財。即使沒 真空黏附，離顏5G可維持在下固定模具2G上，亦ΐ下 模具且因此可能排除麟㈣執躲顏50的真^ 刷# 27 (如圖5所示）也可形成於固定 根f本ί明的目前建構，能預期到下述效益。 首先，於封膠材料是經由固 板緊密吸附嵌人陰模以形成）心、W 1 猎由基 穩定尺寸而不需注意樹脂的供給成，因此封膠材料可具有 13 201220553 40262pif 第二，藉減少供給與壓縮樹脂的位置以及形成封膠材 料的成型空腔之間的距離，可能使無必要的樹脂移動路徑 (諸如：無必要鱗、無必要的流道，或諸如此類）最小 化’因此使樹脂的廢棄消耗最小化。 第三，由於嵌入陰模可使排列於導線架中的數個元件 獨自地密封，即使穿過導線架的形成區域形成通孔，可不 採任何額外的防堵行動來避免樹脂的漏出。 第四，由於嵌入陰模（即決定封膠材料形狀並直接對 封膠材料的品質給予影響的構件）不需組裝成模具中的喪 入系統’因此可易於檢查及維護/修復空腔的狀態而不用 分離向溫且重的固定或可動模具。 第五’不可能或無必要執行成型處理的區域可輕 選擇性關閉對應的嵌入陰模之樹脂入口埠排除，且封^ 料可不管樹脂的供給而形成相同尺寸。 第六，由於當基板安裝於可動模具上時，用來壓縮樹 脂的腔壓縮塊裝置於上方位置’因此不f要在真空結 真空黏附離型膜轉備用已接收樹脂的預定空間，且 要用以真空黏附的分離真空元件或裝置。 而 【圖式簡單說明】 圖1至圖3為根據本發明實施例表現封膠材料形 的橫剖面圖，分別觀測自第一、第二和第三位置。义 圖4為根據本發明於圖3中表現的實施;;表現封 形成裝置部分的放大橫剖面圖。 夕 Ή 圖5以橫舶表現適於在相對表面有凸出部的基板上 14 201220553 40262pif 形成封膠材料的封膠材料形成裝置之一例。 圖6為根據本發明實施例另一實施例表現封膠材料形 成裝置的橫剖面圖。 【主要元件符號說明】 3 :基部 10 :基板 11 :導線架 12 :發光二極體晶片 13 :反光體 19 :凸出部 20 :固定模具 27 :漏出槽 30 :可動模具 31 :腔壓縮塊 36 :腔保持塊 37 :彈性構件 38 :樹脂裝載空間 40 :嵌入陰模 41 :成型空腔 42 :入口埠（或閘） 43 :壩條表面 50 :離型膜 1512 201220553 40262pif The orientation is essentially the same as the mechanism described in the previous embodiment. According to this embodiment, the movable mold 30 is disposed at the upper portion as the upper mold and the fixed mold 20 is disposed at the lower portion as the lower mold. The substrate is fixed to the mold 20 below, and the embedded female mold 40 is placed thereon. The insert has a molding cavity 41 provided on one surface thereof, wherein the opening of the molding opening faces the substrate 1 of the lower mold, that is, the fixed mold "2". On the other surface of the movable mold 3G human female mold 4G, the eucalyptus loading space 38 and the resin port 42 connecting the resin loading space 38 domain cavity. The release film 50 is disposed under the movable mold 3〇 or embedded in the female mold 4〇 to be placed under the resin loading space 38. The movable mold 3 is first lowered to bring the cavity holding block 36 of the movable mold 30 into contact with the female mold 4, wherein the release film 5 is placed therebetween. Further, the concavity block 下降 is successively lowered with the compression of the elastic member 37, thereby compressing the resin in the resin loading space % #. The resin is injected from the resin loading space by a strong pressure into the female mold through the resin inlet. The liquid resin in the molding cavity is solidified and the thickness is stable (4) __形姐成(四)财. Even if there is no vacuum adhesion, the peeling 5G can be maintained on the lower fixed mold 2G, and the mold is also smashed and thus it is possible to exclude the true (brush) #27 (shown in Fig. 5) which can also be formed on the fixed root f. The current construction of this limming can expect the following benefits. Firstly, the sealing material is formed by closely adhering the female mold to the core through the solid plate, and the W 1 is stabilized by the base without paying attention to the supply of the resin, so the sealing material can have 13 201220553 40262pif second, borrowing Reducing the distance between the supply and the location of the compression resin and the forming cavity forming the encapsulant may minimize unnecessary resin movement paths (such as unnecessary scales, unnecessary flow paths, or the like). The waste consumption of the resin is minimized. Third, since the embedded female mold can seal a plurality of components arranged in the lead frame by itself, even if a through hole is formed through the formation region of the lead frame, no additional anti-blocking action can be taken to avoid leakage of the resin. Fourth, since the embedded female mold (ie, the member that determines the shape of the sealing material and directly affects the quality of the sealing material) does not need to be assembled into a mold-in system in the mold, it is easy to inspect and maintain/repair the state of the cavity. Instead of separating the fixed or movable mold to a warm and heavy weight. The fifth 'area where it is impossible or unnecessary to perform the molding process can lightly selectively close the resin inlet 埠 of the corresponding embedded female mold, and the sealing material can be formed into the same size regardless of the supply of the resin. Sixth, since the cavity compression block device for compressing the resin is in the upper position when the substrate is mounted on the movable mold, it is not necessary to use the vacuum junction to adhere the release film to the predetermined space of the standby resin, and to use A vacuum component or device that is vacuum bonded. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 through Fig. 3 are cross-sectional views showing the shape of a sealant material, which are observed from the first, second and third positions, respectively, in accordance with an embodiment of the present invention. 4 is an embodiment of the present invention shown in FIG. 3; an enlarged cross-sectional view showing a portion of the encapsulating device. 5 Ή Figure 5 shows an example of a sealing material forming device that forms a sealing material on a substrate having a projection on the opposite surface. Figure 6 is a cross-sectional view showing a device for forming a sealant material according to another embodiment of the present invention. [Main component symbol description] 3: Base portion 10: Substrate 11: Lead frame 12: Light-emitting diode wafer 13: Reflector 19: Projection portion 20: Fixing mold 27: Leakage groove 30: Movable mold 31: Cavity compression block 36 : cavity holding block 37: elastic member 38: resin loading space 40: embedded female mold 41: molding cavity 42: inlet 埠 (or gate) 43: dam surface 50: release film 15