JP2017037947A - Molding mold, molding method, and molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding mold capable of securely exposing a semiconductor chip to mold it by using a large sized work and securely performing underfill molding with a simple mold configuration.SOLUTION: A mold resin R is clamped by a molding mold while supporting a plurality of electronic components at a carrier plate 1 and fills a gap of a semiconductor chip 3 accommodated in a cavity 5g through through-holes 1a and 2a from a cavity space with a resin injection mechanism.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a mold, a molding method, and a molding apparatus that mold a chip-exposed type work using a rectangular or circular large carrier.

  For example, when underfill molding a work in which a plurality of semiconductor chips are flip-chip mounted on a substrate, it is generally performed by transfer molding because a resin needs to be poured between the chip and the substrate. On the other hand, a work using a semiconductor wafer, such as WLP (Wafer Level Package), or a work supporting a semiconductor chip on a large carrier is exposed and the resin molding is performed by compression molding.

JP 2014-231185 A

  When a chip-exposed type work using a rectangular or circular large carrier is resin-molded (underfill mold), the resin flow is large according to transfer molding, and the resin pressure hardly acts according to compression molding. There is a problem that mold resin may be unfilled in gaps or underfill spaces between semiconductor chips and air may be easily involved. Moreover, since the film supply is also required, the apparatus configuration is complicated, and it is difficult for the mold clamping pressure to act on the work in the mold area, so that it is difficult to reliably expose and mold the end face of the semiconductor chip.

  In recent years, IoT (Internet of Things / Internet of things) has attracted attention as a field of application of resin mold technology for sealing electronic components such as semiconductor chips. For example, in semiconductor packages used in mobile devices as one aspect of the Internet of things and semiconductor packages for sensor devices, low-cost production technology by producing a large number of products at once, and components such as interposer substrates There is a demand for miniaturization technology such as a reduction in profile and a reduction in footprint, as well as to meet the complex demands for higher performance and higher functionality.

An object of the present invention is to solve the above-described problems of the prior art, and to mold a semiconductor chip with a large workpiece reliably exposed, and to perform underfill molding with a simple mold configuration, and It is to provide a molding method.
Another object of the present invention is to provide a molding apparatus that is equipped with the molding die and can improve the molding quality of a large-sized molded product.

In order to achieve the above object, the present invention comprises the following arrangement.
A mold that clamps a carrier plate that supports a plurality of electronic components with a pair of molds supplied with mold resin to a resin injection mechanism and performs resin molding, and the carrier plate includes the resin injection mechanism and A through-hole communicating with each other and communicating with the cavity space is formed.
In the molding method, the carrier plate that supports the plurality of electronic components is clamped by the pair of molds supplied with the mold resin to the resin injection mechanism, and is provided on the carrier plate by the resin injection mechanism. The plurality of electronic components are molded by filling the cavity space with the molding resin through the formed through-holes.
Using the mold and the molding method, a plurality of electronic components are clamped by a mold while supporting a plurality of electronic components on the carrier plate, and a plurality of mold resins are accommodated in the cavity from the cavity space through the through holes by the resin injection mechanism. It is possible to fill a gap between electronic components (semiconductor chips). Therefore, it is possible to reliably expose and mold a plurality of electronic components, and to reliably perform underfill molding with a simple mold configuration.

The carrier plate may support the workpiece by adhesion to the metal plate via a heat release sheet.
Thereby, after resin molding, the pressure-sensitive adhesive surface of the workpiece to the heat-peeling sheet can be reliably exposed and molded.

In addition, a work on which an electronic component is mounted may be supported toward the carrier plate.
Thereby, after the resin molding, the support surface of the carrier plate that supports the electronic component of the workpiece can be reliably exposed and molded.

The through-hole formed in the carrier plate is preferably formed in a tapered shape on the resin injection port side.
Thereby, it is easy to gate break the unnecessary resin from the molded product, and it is possible to prevent the resin protrusions from being formed.

  In the case where a plurality of semiconductor chips are aligned and supported on the heat release sheet, the flow amount of the resin is suppressed through a through hole in a gap between chips or an underfill space even in a large molded product. The mold resin can be filled. Therefore, it is difficult to entrain air and the occurrence of an unfilled area can be prevented.

A semiconductor chip is adhesively supported on the carrier plate in a matrix arrangement via the heat release sheet, and the through holes are formed at a plurality of locations at equal intervals on the diagonal of the center portion of the carrier plate and the center portion. Preferably it is formed.
As a result, the flow rate of the mold resin filled from each through hole is made uniform, and the mold resin is filled while expelling air outward from the center of the workpiece, thereby preventing unfilled areas and improving molding quality. Can be made.

  If the through hole is formed so as to communicate between the semiconductor chips mounted on the substrate, the mold resin can be efficiently filled into the cavity from a wide filling space.

In the molding apparatus, any of the above-described mold dies may be provided, and the mold resin supplied into the pot may be filled into a cavity provided on the opposite side of the carrier plate through the through hole. .
As a result, the mold for transfer molding is used to reliably expose the semiconductor chip to large workpieces, and underfill molding can be reliably performed with a simple mold configuration. The molding quality can be improved.

Further, the molding apparatus may include any of the above-described mold dies, and the mold resin supplied onto the workpiece may be filled into a cavity provided on the opposite side of the carrier plate through the through hole.
As a result, even if a molding die for compression molding is used, the semiconductor chip is securely exposed to a large workpiece and molded, and the resin pressure is applied to the cavity directly above through the through hole, thereby simplifying the mold. Underfill molding can be performed reliably with the mold configuration, and the molding quality of large-sized molded products can be improved.

By using the mold and the molding method described above, a semiconductor chip can be reliably exposed and molded using a large workpiece, and underfill molding can be reliably performed with a simple configuration.
Moreover, in the resin mold apparatus provided with the said mold metal mold | die, the shaping | molding quality of a large sized molded article can be improved.

It is sectional drawing which shows the process of carrying out the adhesion support of sectional drawing of a carrier plate, and a workpiece | work. It is the top view and sectional drawing of the state which adhered and supported the workpiece | work on the carrier plate. It is. It is sectional explanatory drawing which shows the resin mold process using the mold die for transfer molding. FIG. 4 is an explanatory cross-sectional view showing a resin molding process following FIG. 3. FIG. 5 is an explanatory cross-sectional view showing a resin molding step following FIG. 4. FIG. 6 is a cross-sectional explanatory view showing a resin molding step following FIG. 5. FIG. 7 is a cross-sectional explanatory view showing a resin molding step following FIG. 6. FIG. 8 is an explanatory cross-sectional view illustrating a resin molding process subsequent to FIG. 7. FIG. 9 is an explanatory cross-sectional view illustrating a resin molding process following FIG. 8. It is explanatory drawing which shows the post process of a resin mold. It is the top view and arrow A-A 'sectional view of the state which adhered and supported the workpiece | work on the carrier plate at the time of providing a several pot. FIG. 12 is a cross-sectional view in the direction of arrow B-B ′ of a mold die clamped with the workpiece of FIG. 11. FIG. 13 is a cross-sectional view of a mold according to another example of FIG. 12. It is sectional drawing of the mold die for compression molding which concerns on another example. It is explanatory drawing which shows the form of the workpiece | work which concerns on the other example which carries out adhesion support to the carrier plate. FIG. 16 is a cross-sectional explanatory view of a mold for molding the workpiece of FIG. 15.

  Hereinafter, preferred embodiments of a mold according to the present invention and a resin mold apparatus including the mold will be described in detail with reference to the accompanying drawings. In the following, for example, a rectangular workpiece having a side of about 300 mm or 600 mm is used as a workpiece, and a workpiece in which a plurality of semiconductor chips (electronic components) are flip-chip mounted on a substrate is placed on a rectangular carrier plate having a larger size. A mold, a resin molding apparatus, and a resin molding method for resin-molding an adhesive-supported one will be described. As an example, the resin mold apparatus will be described assuming that the lower mold is a movable mold and the upper mold is a fixed mold. The resin molding apparatus includes a mold opening / closing mechanism, but the illustration thereof is omitted. In the following description, the configuration of the mold will be mainly described.

First, the carrier plate and the work supported by the carrier plate will be described with reference to FIGS.
In FIG. 1 (A), the carrier plate 1 is a metal plate (super steel alloy (WC), stainless steel, etc.), and is larger than the workpiece size. In this embodiment, as shown in FIG. 2A, for example, a rectangular plate having a larger size corresponding to a rectangular workpiece is used.

  The carrier plate 1 is formed with a through hole 1 a that communicates the front and back surfaces to communicate a cavity space, which will be described later, and a mold side resin passage. The through hole 1a is formed in a tapered shape (sprue shape) on the resin injection port side. The through hole 1a is drilled at an arbitrary position (center portion) of the carrier plate 1 (see FIG. 2A). Further, the carrier plate 1 is provided with a heat release sheet 2 stacked thereon. This thermal release sheet 2 is a sheet material having an adhesive surface, and is a sheet material (adhesive sheet) that is easily peeled off by predetermined heating. A member to be exposed such as the semiconductor chip 3 is adhered to and supported on the heat release sheet 2. The heat release sheet 2 is also provided with a through hole 2a communicating with the mold side resin path via the through hole 1a. In addition, it may replace with the heat peeling sheet 2, and you may use other adhesive sheets, such as a thing which a viscosity falls by irradiation of an ultraviolet-ray.

  The workpiece W is flip-chip mounted on the substrate 4 in which a plurality of semiconductor chips 3 are three-dimensionally stacked via connection terminals (solder bumps) (chip on chip). As shown in FIG. 2A, the semiconductor chips 3 are arranged on the substrate 4 vertically and horizontally.

Here, the process of adhering and supporting the workpiece W to the carrier plate 1 will be described with reference to FIGS. 1 and 2.
As shown in FIG. 1A, a heat release sheet 2 is attached to the carrier plate 1. At this time, the through holes 1a of the carrier plate 1 and the through holes 2a of the heat release sheet 2 are aligned and bonded so as to communicate with each other.
Next, as illustrated in FIG. 1B, the workpiece W is bonded onto the heat-peeling sheet 2 with the semiconductor chip 3 to be exposed facing down. In other words, the semiconductor chip 3 is attached to the heat release sheet 2. At this time, the through holes 1a and 2a of the carrier plate 1 and the heat release sheet 2 are bonded so as to face the space between the semiconductor chips 3 (see FIG. 1C).

2A and 2B are a plan view and a cross-sectional view in a state where the workpiece W is set on the carrier plate 1. The carrier plate 1 and the through holes 1a and 2a of the heat release sheet 2 are arranged at the center of the substrate 4, and the semiconductor chip 3 is divided into four blocks and arranged around the periphery. 2A, the broken line L1 is the outline of the substrate 4, L2 is the cavity outline, L3 is the outline of the heat release sheet 2, and L4 is the outline of the carrier plate 1.
The through holes 1 a and 2 a serving as gate holes into which the mold resin is injected are not provided in the arrangement area (position) of the semiconductor chip 3. The mold resin injected from the gate holes provided in this way is filled using the space between the semiconductor chips 3. The steps shown in FIGS. 1 and 2 may be performed inside the resin molding apparatus or outside the apparatus.

  Next, an example of a mold will be described with reference to FIG. The upper mold and the lower mold are described mainly with respect to the structure of the insert, and the upper mold and the lower mold chase block, and the upper mold and the lower mold that close the mold space before closing the mold mold. The chamber block is omitted. Moreover, the resin mold apparatus is equipped with a known mold opening / closing mechanism that mounts the mold mold and guides the platen up and down guided by posts provided at four corners.

  In the upper mold 5, the upper mold cavity piece 5b is fixed to the upper mold block 5a. An upper mold movable clamper 5c is suspended and supported by a coil spring 5d around the upper mold cavity piece 5b. A seal material 5e is provided between the outer peripheral surface of the upper mold cavity piece 5b and the inner peripheral surface of the upper mold movable clamper 5c. The lower surface of the upper mold cavity piece 5b forms the upper mold cavity bottom, and the inner peripheral surface of the upper mold movable clamper 5c forms the upper mold cavity side. An air suction path 5f is formed in the upper mold movable clamper 5c. The upper mold clamping surface including the upper mold cavity 5g is sucked and held by the air from the air suction path 5f and is sucked and held. The film F has heat resistance and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene. A single-layer film or a multi-layer film composed mainly of a film, polyvinylidine chloride or the like is preferably used. The film F may be either a continuous long film or a sheet film cut into a predetermined size (the same applies in the following description).

  The lower mold 6 includes a lower mold block 6a on which the workpiece W is placed. The lower mold block 6a is provided with a resin injection mechanism for the mold resin R. In this embodiment, a pot 6b and a plunger 6c provided in the pot 6b so as to be movable up and down are provided in the lower mold block 6a, and these constitute a resin injection mechanism. As an example, the plunger 6c can be driven up and down by a known transfer mechanism. The gap between the pot 6b and the plunger 6c is sealed with a sealing material 6e. Mold resin R (liquid resin, granular resin, powdered resin, solid resin, etc.) is supplied to the pot 6b by a resin supply device 7 (for example, a nozzle, a loader, etc. communicating with a syringe).

Next, the process of supplying the workpiece W together with the carrier plate 1 to the mold and resin molding will be described with reference to FIGS.
In FIG. 3, the mold resin R is supplied by the resin supply device 7 to the pot 6 b of the lower mold 6 of the mold mold opened. It is assumed that the film F is sucked and held on the upper mold clamping surface including the upper mold cavity 5g of the upper mold 5.

  Next, as shown in FIG. 4, the work W adhered and held on the carrier plate 1 via the heat release sheet 2 is carried into the lower mold 6 by a loader, a robot hand, or the like (not shown). The carrier plate 1 is placed on the lower die block 6a with the through hole 1a (2a) aligned with the upper end opening (die side resin path) of the pot 6b. The carrier plate 1 may be held by suction on the lower mold block 6a. According to this, it is possible to prevent the carrier plate 1 from being lifted and the resin leakage by the pressure of the plunger 6c.

  Next, as shown in FIG. 5, the mold is closed. When the movable lower mold 6 is moved upward, the carrier plate 1 and the heat release sheet 2 are first clamped by the upper movable clamper 5c and the lower mold block 6a at the outer peripheral edge. Prior to this, a reduced pressure space may be formed in a mold space in which the upper mold chamber and the lower mold chamber block are closed and closed.

  Next, as shown in FIG. 6, when the mold closing operation further proceeds, the coil spring 5d of the upper mold movable clamper 5c is compressed, the volume of the upper mold cavity 5g is reduced, and the upper mold cavity piece 5b is moved to the film F. The workpiece W is clamped by being pressed against the workpiece W (substrate 4). Thereby, a cavity space is formed between the substrate 4 and the carrier plate 1 in the upper mold cavity 5g. Further, the back surface of the workpiece W (the surface on which the semiconductor chip 3 is not mounted) is covered and protected by the film F, so that this surface can be reliably exposed. Further, since the workpiece W and the carrier plate 1 are clamped in an overlapping state, the carrier plate 1 can be pressed against the lower mold block 6a, and resin leakage is prevented.

  Next, as shown in FIG. 7, the plunger 6c is raised, and the mold resin R melted in the pot 6b is formed on the opposite side of the carrier plate 1 through the through holes 1a and 2a (gate holes). Fill inside (underfill mold). In other words, the mold resin R is filled through the through holes 1a and 2a (gate holes) that communicate with each other and connect the resin injection mechanism and the cavity space. In this case, since the mold resin R is filled through the thin through holes 1a and 2a (gate holes), the mold resin R is supplied through the expansion / contraction path. R can be supplied. In addition, the area for the filling path of the mold resin R can be minimized, the molding area in the mold can be increased, and efficient molding can be performed. Further, the positions of the through holes 1a and 2a (gate holes) can be overlapped with a cutting position by a dicing cutting blade (blade), which will be described later, so that the traces of the through holes 1a and 2a are not left.

  The mold resin R is filled from the center portion of the workpiece W (substrate 4) toward the peripheral portion, and is cured by heating. Specifically, the resin is filled between the adjacent semiconductor chips 3 so that the side surfaces of the semiconductor chip 3 are sealed with resin. At this time, underfill molding can also be performed by filling a resin between the bump-connected chips or between the chip and the substrate. Further, by filling and filling the mold resin R from the center in the mold cavity 5g of the mold, the flow distance of the mold resin R can be shortened (halved), and the molding quality can be improved. .

  When the resin molding is completed, the mold is opened as shown in FIG. When the lower mold 6 is moved downward, the film F and the molded product 8 are peeled off. Further, the film F is peeled off from the upper mold clamping surface by applying a tension by a film supply device (not shown), or ejecting air from an upper mold film suction hole, or using them together.

  Further, as shown in FIG. 9, the molded product 8 is taken out from the lower mold 6 together with the carrier plate 1 by an unloader, robot hand or the like (not shown). For releasing from the lower mold 6 of the molded product 8, the plunger 6c may be pushed up from the pot 6b, or an ejector pin (not shown) may be pushed out from the lower mold block 6a to push up the carrier plate 1, which is used in combination. May be.

  In FIG. 10A, the molded product 8 is separated from the carrier plate 1. Since the molded product 8 is adhesively supported via the carrier plate 1 and the heat release sheet 2, for example, the adhesive force is lowered only by setting the carrier plate 1 to a predetermined heating state (for example, heating to a predetermined temperature). Thus, the molded product 8 can be peeled from the heat release sheet 2. Further, the heat release sheet 2 can be easily peeled off from the carrier plate 1. Even if the molded product 8 and the heat release sheet 2 are separated from the carrier plate 1, the gate resin 8a (unnecessary resin) remains in the through hole 1a which is a gate hole.

  As shown in FIG. 10B, the molded product 8 is separated into individual pieces for each package region (for example, the semiconductor chip 3). The semiconductor chips 3 are arranged in a matrix of n rows and m columns, and are formed by exposing the semiconductor chips 3. Next, after arbitrarily forming a wiring structure (bump or rewiring layer), it can be diced into pieces by a dicing apparatus (not shown).

  In addition, as shown in FIG. 10C, after forming the rewiring layer 3a to be connected to the connection terminals of the semiconductor chip 3 exposed by peeling the substrate 4 from the molded product 8, and connecting the solder balls 3b, Dicing may be performed by dicing with a dicing apparatus.

  Next, as shown in FIG. 10D, the carrier plate 1 is cleaned by removing the gate resin 8a (unnecessary resin) adhering to the through hole 1a of the carrier plate 1, and the next workpiece W is removed. It may be reused in the molding process.

If the mold is used, the work W is adhered and supported on the carrier plate 1 and clamped by the mold, and the mold resin R is filled into the gap between the semiconductor chips 3 from the mold side resin path through the through holes 1a and 2a. be able to. Therefore, the semiconductor chip 3 can be reliably exposed and molded, and underfill molding can be reliably performed with a simple mold configuration.
In addition, the semiconductor chip is surely exposed and molded with respect to a large workpiece W by using transfer molding, and underfill molding can be reliably performed with a simple configuration, and the molding quality of the large-sized molded product 8 is improved. be able to.

Next, another example of the mold will be described with reference to FIGS.
In the embodiment described above, as the resin injection mechanism of the mold resin R, the mold resin is filled into the upper mold cavity from a single pot through a single gate hole, but a plurality of pots and gate holes may be provided. Good. The configuration of the mold is the same as that shown in FIG.

  FIGS. 11A and 11B are a plan view and a cross-sectional view taken along arrow A-A ′ when a plurality of gate holes (through holes 1 a and 2 a) are provided in the carrier plate 1 and the heat release sheet 2. Similar to FIG. 2, the semiconductor chip 3 is adhesively supported on the carrier plate 1 in a matrix arrangement via the heat release sheet 2. However, as shown in FIG. 11 (A), the through-holes are formed not only in the through-holes 1a1 and 2a1 in the center of the carrier plate 1 but also in a plurality of locations (four locations) on the diagonal line. Has been. Further, as shown in FIGS. 11 (B) and 12, a resin path 1b communicating with the mold side resin path (pot 6b) is formed by engraving on the lower mold block 6a side of the carrier plate 1 to form a resin. The passage 1b communicates with the through holes 1a1, 2a1 and the through holes 1a2, 2a2. The resin path 1b may be provided on the lower mold block 6a side. Further, a resin injection mechanism including a pot 6b and a plunger 6c can be provided for each through hole 1a2 without providing the resin passage 1b.

  As shown in FIG. 11A, the flow distance of the mold resin R from the through hole 1a1 at the center of the workpiece W (substrate 4) to the semiconductor chip 3 existing in the four corner directions is the longest in the cavity, The timing at which they are performed is likely to be different. That is, the flow distance of the mold resin R flowing toward the four corners in the rectangular cavity becomes the maximum, and the flow distance of the mold resin R flowing from the central through-hole 1a1 to the center of each side of the cavity in the rectangular cavity. Is minimized. Therefore, the through holes 1a2 and 2a2 for injecting the molding resin in the four corner directions with respect to the central through hole 1a1 can be provided. In this case, in addition to the mold resin filling region drawn by a concentric circle having a radius R from the through hole 1a1 at an arbitrary filling time, a mold resin filling region drawn by a concentric circle by the surrounding through hole 1a2 is provided. Become. For example, the through holes 1a2 and 2a2 can be provided at positions of a radius r (R> r) from the through hole 1a2 at two diagonal positions (total of four positions) of the rectangular workpiece W (rectangular substrate 4). Thereby, for example, it is possible to efficiently fill the work W without entraining air by suppressing the flow amount of the resin.

  Next, FIG. 13 shows another example of the mold. In the above-described embodiment, the case where the injection mechanism including the plunger 6c driven by the transfer mechanism and the pot 6b is provided has been described. However, the resin has the internal structure of the mold using the same configuration as the compression mold. You may make it provide the injection | pouring mechanism which inject | pours mold resin from a reservoir part. The structure of the upper die 5 is the same as that shown in FIG. 3, and the carrier plate 1 having a plurality of gate holes with the same layout as that shown in FIG. 11A is used. Therefore, below, it demonstrates centering around the structure of the lower mold | type 9. FIG.

Resin pressurizing blocks 9b are fixed to the lower mold block 9a at a plurality of locations. Further, a clamper 9c having a through-hole through which the resin pressurizing block 9b can be inserted is floatingly supported by the lower mold block 9a by a coil spring 9d. Thus, the resin press block 9b and the clamper 9c constitute a lower pot portion 9g serving as a resin reservoir. The depth of the lower mold pot portion 9g can be changed by pressing and contracting the coil spring 9d by clamping. With the above configuration, a resin injection mechanism for injecting the mold resin R from the center in the upper mold cavity 5g of the mold is configured.
Moreover, as shown in the figure, it is preferable to have a structure in which a plurality of lower mold pot portions 9g are provided. In this case, for example, compared to a structure in which only one lower mold pot portion 9g is provided, the amount of mold resin R supplied to one lower mold pot portion 9g can be reduced. According to this, it is possible to prevent the carrier plate 1 from being deformed due to the pressurization of the mold resin R as compared with the case where the integrally formed lower mold pot portion 9g is provided, and the lower mold pot portion 9g. It is also possible to prevent the film F from being broken by suppressing the depth of the film.

The lower mold pot portion 9g is formed corresponding to the gate holes (through holes 1a, 2a) formed in the carrier plate 1. The volume of the lower mold pot portion 9g may be different in resin capacity between the center portion and the other portions.
Further, it is preferable that the film F is sucked and held on the lower mold clamping surface including the lower mold pot portion 9g for the purpose of preventing resin leakage.

  With the mold open, mold resin R (liquid resin, granule resin, powder resin, solid resin, etc.) is supplied to the lower mold pot portion 9g covered with the film F, and the workpiece W is a heat release sheet. The carrier plate 1 adhered and supported via 2 is carried into the lower mold 9. The carrier plate 1 is placed on the lower mold clamping surface so that the through-hole 1a is in contact with the lower mold pot portion 9g (mold side resin path). The film F is held by suction on the clamp surface of the upper mold 5.

  When the mold is closed, first, the carrier plate 1 and the heat release sheet 2 are clamped by the upper mold movable clamper 5c and the clamper 9c. Prior to this, a reduced pressure space may be formed in a mold space in which the upper mold chamber and the lower mold chamber block are closed and closed.

  Next, when the mold closing operation further proceeds, the coil spring 5d of the upper mold movable clamper 5c is pressed and contracted to reduce the volume of the upper mold cavity, and the upper mold cavity piece 5b is moved to the workpiece W (substrate 4) via the film F. And the workpiece W is clamped. The clamper 9c is pressed by the upper mold movable clamper 5c and the coil spring 9d is pressed and contracted, so that the resin pressurizing block 9b is relatively raised. For this reason, the mold resin R supplied into the lower mold pot portion 9g is filled into the upper mold cavity 5g formed on the opposite side of the carrier plate 1 through the gate holes (through holes 1a, 2a). That is, by using such a resin injection mechanism, it is possible to fill the mold resin R by providing only a mold clamping operation without providing a separate drive mechanism.

  At this time, the mold resin R is injected not only from the central through-hole 1a1 but also from the through-holes 1a2 provided in the periphery, so that the amount of resin flow on the workpiece W is suppressed and the upper mold is efficiently wound without entraining air The cavity 5g can be filled. For this reason, for example, high quality underfill molding is also possible. The mold resin R is filled from the center portion of the workpiece W (substrate 4) toward the peripheral portion, and is cured by heating. At this time, since the carrier plate 1 is not routed through the resin passages other than the through holes 1a1 and 1a2, unnecessary resin can be reduced and the flow amount of the resin can be reduced.

  Thereby, since the structure similar to the metal mold | die for compression molding can be used as a resin injection | pouring mechanism, there can exist an effect similar to the structural example mentioned above with an inexpensive structure.

  FIG. 14 shows another example of the mold. The mold shown in the figure has the same configuration as that obtained by inverting the compression mold shown in FIG. On the other hand, the entire structure including the carrier plate 1 and the like is reversed, and the mold resin R is mounted on the carrier plate 1 and transported, so that the mold resin R can be supplied in the external setup and transported. It differs in that the structure can be simplified.

  A lower mold cavity piece 10b is fixedly supported on the lower mold block 10a. A lower mold movable clamper 10c is floatingly supported by a coil spring 10d around the lower mold cavity piece 10b. A gap between the outer peripheral surface of the lower mold cavity piece 10b and the lower mold movable clamper 10c is sealed with a sealing material 10e. The lower mold cavity 10g is formed by a lower mold cavity piece 10b that forms the bottom of the cavity and a lower mold movable clamper 10c that forms the side of the cavity. The lower mold movable clamper 10c is provided with an air suction path 10f that holds the film F by suction. Further, the film F is sucked and held on the lower mold clamping surface including the lower mold cavity 10g by the suction operation through the air suction path 10f.

  The workpiece W is adhered and supported on the carrier plate 1 via the heat release sheet 2 and the mold resin R (liquid resin, granule resin, Powdered resin, solid resin, sheet resin, etc.). In addition, the thermal peeling sheet 2 may be formed with a slit instead of the opening hole corresponding to the through hole 1a. In this manner, by supplying the mold resin R outside the mold, it is not necessary to supply the mold resin R directly to the mold, and the mold opening time can be shortened.

  In a state where the mold is opened, the carrier plate 1 on which the work W is adhesively supported via the heat release sheet 2 is carried into the lower mold clamping surface covered with the film F. Here, the conveyance structure can be simplified by supplying the mold resin R to the carrier plate 1 in advance and carrying it into the mold. The carrier plate 1 is positioned so that the adhesive side of the semiconductor chip 3 faces the lower mold cavity 10g and the through hole 1a communicates with the lower mold cavity 10g (mold side resin path), and is aligned with the lower mold movable clamper 10c. Placed. The film F is held by suction on the clamp surface of the upper mold 5.

  When the mold is closed, the carrier plate 1 is first clamped by the upper mold movable clamper 5c and the lower mold movable clamper 10c. Prior to this, a reduced pressure space may be formed in a mold space in which the upper mold chamber and the lower mold chamber block are closed and closed.

  Next, when the mold closing operation further proceeds, the coil spring 5d of the upper mold movable clamper 5c is compressed and the upper mold cavity piece 5b is relatively lowered and pressed against the mold resin R. Further, the lower mold movable clamper 10c is pressed by the upper mold movable clamper 5c so that the coil spring 10d is compressed so that the lower mold cavity 10g has a predetermined volume. Accordingly, the upper mold cavity piece 5b is relatively lowered, so that the mold resin R supplied to the carrier plate 1 is formed on the opposite side of the carrier plate 1 through the gate holes (through holes 1a, 2a). 10 g is filled. Thus, in the configuration shown in the figure, the resin injection mechanism is provided on the upper mold 5 side.

  The upper mold cavity piece 5b can be lowered to the same height as the upper movable clamper 5c that clamps the carrier plate 1, but the mold resin (unnecessary resin) remains on the carrier plate 1 together with the gate resin. It may be. This is because it is sufficient to remove the carrier plate 1 together with the gate resin after separating the carrier plate 1 from the molded product.

  Next, compression molding using a mold for transfer molding will be described with reference to FIGS. In the workpiece W described above, the plurality of semiconductor chips 3 are flip-chip mounted on the substrate 4, but the substrate 4 may be omitted. The structure of the carrier plate 1 is the same as that shown in FIG.

  FIGS. 15A and 15B are explanatory views of a process of supporting the workpiece W on the carrier plate 1 by adhesion. As shown in FIG. 15A, the work W is adhered to the thermal release sheet 2 in a state where the thermal release sheet 2 is adhered to the carrier plate 1. Specifically, the chip surface of the semiconductor chip 3 that can be flip-chip mounted is adhered to the heat release sheet 2 and is adhered and supported with the terminal formation surface facing up. FIG. 15B shows a state where the workpiece W is adhesively supported on the heat release sheet 2. Each semiconductor chip 3 may be adhesively supported in any form, whether it is a matrix arrangement or a map arrangement.

In FIG. 15B, the carrier plate 1 that adheres and supports the workpiece W is carried into a mold. The configuration of the mold is the same as in FIG.
In FIG. 16, the mold resin R is supplied by the resin supply device 7 to the pot 6b of the lower mold 6 of the mold mold opened (see FIG. 3). It is assumed that the film F is sucked and held on the upper mold clamping surface including the upper mold cavity 5g of the upper mold 5.

  Next, the work W adhered and held on the carrier plate 1 is carried into the lower mold 6. The carrier plate 1 is placed on the lower die block 6a with the through hole 1a (2a) aligned with the upper end opening (die side resin path) of the pot 6b. The carrier plate 1 may be held by suction on the lower mold block 6a.

  Next, the mold is closed. When the lower mold 6 which is a movable mold is moved upward, the carrier plate 1 and the heat release sheet 2 are first clamped by the upper mold movable clamper 5c and the lower mold block 6a. Prior to this, a reduced pressure space may be formed in a mold space in which the upper mold chamber and the lower mold chamber block are closed and closed.

  Next, when the mold closing operation further proceeds, the coil spring 5d of the upper mold movable clamper 5c is pressed and contracted, and the upper mold cavity piece 5b is relatively moved downward to reduce the volume of the upper mold cavity 5g. The cavity piece 5b is pressed against the workpiece W (terminal surface of the semiconductor chip 3) through the film F.

Next, as shown in FIG. 16, the plunger 6c is raised, and the mold cavity 5g formed on the opposite side of the carrier plate 1 through the through holes 1a and 2a (gate holes) with the mold resin R melted in the pot 6b. Fill inside (underfill mold). The mold resin R is filled from the center part of the work W toward the peripheral part and is heated and cured.
As a result, the molded product can expose the semiconductor chip 3 adhered to the heat-peeling sheet 2, and the terminal F is pressed against the film F, so that the connection terminal is exposed and molded. be able to. That is, the side surfaces can be sealed while exposing both surfaces of the semiconductor chip 3. In such a configuration, for example, when a redistribution layer can be formed by providing terminals on both sides like the semiconductor chip 3 of the TSV structure, or when receiving and emitting light on the other side while making electrical connection on one side It can be used for such as thinning.

In each embodiment described above. The carrier plate 1 and the workpiece W that adheres and supports the carrier plate 1 are illustrated as being rectangular. However, the carrier plate 1 is not limited to this and may be a circular workpiece or a polygonal workpiece (such as a hexagon or octagon). . The carrier plate 1 can also be a polygon (such as a hexagon or an octagon).
Further, the semiconductor chip 3 to be mounted on the substrate is not limited to flip chip mounting but may be wire bonding mounting. In this case, it is also possible to adopt a configuration in which a convex portion is provided on the carrier plate 1 and a position other than the wire bonded position (chip center position) is pressed.

  Electronic components other than the semiconductor chip as described above can be used as the electronic components supported by the carrier plate. The electronic component may include a MEMS (Micro-Electro Mechanical Systems) chip such as a sensor or an actuator, a passive element such as a resistor, a capacitor, or an inductor, or a wiring member such as a bump. Moreover, as an electronic component, not only what has an electrical function but members, such as a heat sink required as an electronic device, may be sufficient. This is particularly effective when constructing a system-in-package (SiP) structure in which these electronic components are combined.

  Further, as a configuration for supporting the workpiece W on the carrier plate 1, it is possible to adopt a configuration in which the semiconductor chip 3 is mounted and resin-molded after forming a wiring layer on the carrier plate 1 without using the heat release sheet 2. . Moreover, it is good also as a structure which mounts the board | substrate 4 which mounted the semiconductor chip 3 by positioning with a pin etc., without using the thermal peeling sheet 2 in order to support the workpiece | work W on the carrier plate 1 on a carrier plate. In this case, resin leakage to the end face of the semiconductor chip 3 is suppressed by clamping with a mold.

  Moreover, in the thermal peeling sheet 2 which adhere | attaches the semiconductor chip 3, the thermal peeling sheet 2 processed so that the center part of the position where the semiconductor chip 3 is mounted may be hollowed out can also be used. Thereby, it is good also as a structure which adheres only the outer periphery of the semiconductor chip 3 to the heat peeling sheet 2. FIG. In this case, for example, when the semiconductor chip 3 has a light receiving region in the center like an image sensor, the light receiving region can prevent resin flashing while preventing adhesion of the adhesive on the adhesive sheet 2.

    DESCRIPTION OF SYMBOLS 1 Carrier plate 1a, 2a, 1a1, 1a2, 2a1, 2a2 Through-hole 1b Resin path 2 Thermal release sheet 3 Semiconductor chip 3a Redistribution layer 3b Solder ball 4 Substrate W Work 5 Upper mold 5a Upper mold block 5b Upper mold cavity piece 5c Upper mold movable clamper 5d, 9d, 10d Coil spring 5e, 6d, 6e, 10e Sealing material 5f, 10f Air suction path 5g Upper mold cavity 6, 9, 10 Lower mold 6a Lower mold block 6b Pot 6c Plunger 7 Resin supply device R Mold resin F film 8 Molded product 8a Gate resin 9a, 10a Lower mold block 9b Resin pressure block 9c Clamper 10c Lower mold movable clamper 9g Lower mold pot 10b Lower mold cavity piece 10g Lower mold cavity

Claims (10)

A mold for clamping a carrier plate supporting a plurality of electronic components with a pair of molds supplied with mold resin to a resin injection mechanism and resin molding,
The carrier plate is formed with a through hole communicating with the resin injection mechanism and the cavity space and communicating with each other.   The mold according to claim 1, wherein the carrier plate adheres and supports a workpiece to a metal plate via a heat release sheet.   The mold according to claim 1 or 2, wherein a workpiece on which the electronic component is mounted is supported by the electronic component toward the carrier plate.   The mold according to any one of claims 1 to 3, wherein the through hole formed in the carrier plate is formed in a tapered shape on the resin injection port side.   The mold according to any one of claims 1 to 4, wherein a plurality of semiconductor chips are aligned and supported on the heat release sheet.   2. The semiconductor chip is adhesively supported on the carrier plate in a matrix arrangement via the thermal release sheet, and the through holes are formed at a plurality of locations on the center and diagonal lines of the carrier plate. The mold according to any one of claims 5 to 5.   The mold according to claim 1, wherein the through hole communicates with a gap between a plurality of semiconductor chips mounted on a substrate.   A molding apparatus comprising the mold die according to any one of claims 1 to 7, wherein the mold resin supplied into the pot is filled into a cavity provided on the opposite side of the carrier plate through the through hole.   A molding apparatus comprising the mold die according to any one of claims 1 to 7, wherein a mold resin supplied onto the workpiece is filled into a cavity provided on the opposite side of the carrier plate through a through hole. A plurality of electronic components supported by the carrier plate are accommodated in a cavity space provided in one of the pair of molds, and a mold resin is injected from a resin injection mechanism provided in the other mold. A molding method for molding a plurality of electronic components,
Clamping the carrier plate supporting the plurality of electronic components with the pair of molds supplied with the mold resin to the resin injection mechanism;
A molding method comprising: molding the plurality of electronic components by filling the cavity space with the mold resin through a through hole provided in the carrier plate by the resin injection mechanism.

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