TW201927514A - Resin molding device and manufacturing method of resin molded product capable of constituting a molding die with a small number of parts - Google Patents

Abstract

The present invention provides a resin molding device capable of constituting a molding die with a small number of parts. The resin molding device of the present invention is characterized by: comprising a molding die (1000), a temperature rising stage (S1), a resin molding stage (S2), and a discharging stage (S4). The molding die (1000) includes one mold (200) and the other mold (100), which is capable of demolding a resin molded product (1b), after the resin is molded, from the other mold (100) while being fixed to one mold (200). At least one of the mold (200) and the other mold (100) can be mounted and disassembled with respect to each of the stages, and can be moved among the respective stages at the same time. The temperature of the molding die (1000) is increased in the temperature rising stage (S1), the resin is molded in the resin molding stage (S2), the resin molded product (1b) is demolded from the molding die (1000) in the discharging stage (S4).

Description

Resin molding device and method for producing resin molded article

The present invention relates to a resin molding apparatus and a method of producing a resin molded article.

Conventionally, in resin molding, a resin molding die is fixed in one stage of a resin molding apparatus to perform molding (for example, Patent Document 1 and the like).

[Previous Technical Literature]

[Patent Literature]

Patent Document 1: JP-A-6-177190.

However, when resin molding is performed in one step to take out (release) the resin molded article, for example, it is necessary to add an accessory or the like for taking out the resin molded article to the molding die. In this case, the number of parts of the molding die increases, which may increase the manufacturing cost and the production time of the molding die.

Accordingly, an object of the present invention is to provide a resin molding apparatus and a method of producing a resin molded article which can form a molding die with a small number of parts.

In order to achieve the object, the first resin molding apparatus of the present invention is characterized by comprising a molding die, a temperature rising stage, a resin molding stage, and a discharge stage, the molding die including one mold and another mold, and resin molding after resin molding The product can be demolded from the other mold in a state of being fixed to the one mold, and at least one of the one mold and the other mold can be attached and detached with respect to each of the stages, and at the same time Moving between the stages, the temperature rising stage heats the molding die, the resin molding stage performs resin molding, and the discharging stage releases the resin molded article from the molding die, and the one mold has a fixing A resin molded article fixing mechanism of the resin molded article.

Further, in order to achieve the object, the second resin molding apparatus of the present invention is characterized by comprising a molding die, a temperature rising stage, a resin molding stage, and a discharge stage, the molding die including one mold and another mold, and the resin is molded. The resin molded article can be released from the other mold in a state of being fixed to the one mold, and at least one of the one mold and the other mold can be attached and detached with respect to each of the stages, and at the same time Moving between the various stages, The temperature rising stage causes the molding die to be heated, the resin molding stage performs resin molding, and the discharge stage releases the resin molded article from the molding die, due to the sum with the other die The area of the surface of the one mold opposite to the other mold and the surface in contact with the resin is larger than the area of the surface of the mold which is in contact with the resin, so that the resin molded article can be fixed in the The state on one of the molds is released from the other mold.

In addition, the first resin molding apparatus of the present invention and the second resin molding apparatus of the present invention are collectively referred to as "the resin molding apparatus of the present invention" hereinafter.

The method for producing a first resin molded article of the present invention is characterized in that a molding die comprising one mold and another mold is used, and includes a temperature increasing step of heating the molding die in a temperature rising phase; and performing resin in a resin molding stage a molded resin molding step; a first mold release step of demolding the resin molded article from the other mold in a state where the resin molded article fixing member is fixed to the one mold; and A second demolding step of releasing the resin molded article from the one mold in the discharge stage.

A method of producing a second resin molded article of the present invention is characterized in that a molding die comprising one mold and another mold is used, and comprises: a temperature increasing step of heating the molding die in a temperature rising phase; a resin molding step of performing resin molding in a resin molding stage; and a resin molded article after resin molding is fixed in the state of the one mold from the other a first demolding step of demolding the mold; and a second demolding step of demolding the resin molded article from the one mold in the discharging stage, due to the mold and the mold of the other mold The area of the surface of the one mold opposite to the other mold and in contact with the resin is larger than the area of the surface in contact with the resin, so that the resin can be made in the first demolding step The molded article is released from the other mold in a state of being fixed to the one mold.

In the following, the method for producing the first resin molded article of the present invention and the method for producing the second resin molded article of the present invention are collectively referred to as "the method for producing a resin molded article of the present invention".

According to the present invention, it is possible to provide a resin molding apparatus and a method of producing a resin molded article which can constitute a molding die with a small number of parts.

1‧‧‧Substrate (framework)

1b‧‧‧Resin molded product (packaged substrate)

20‧‧‧ Curing resin

20a‧‧‧ board (resin material)

20b‧‧‧ molten resin (liquid resin)

20d, 20e, 20f‧‧‧ Remaining resin (unused resin, protrusion)

100, 110‧‧‧Upper mold (another mold)

101, 111‧‧‧ Upper model cavity (another model cavity)

101a‧‧‧Side side of the model cavity (another model cavity) 101

119‧‧‧ slots (opening mold suppression member mounting groove)

200, 210‧‧‧ die (a mold)

201, 211‧‧‧ model cavity (a model cavity)

Side of the model cavity (a model cavity) 201 under 201a‧‧

202, 212‧‧ ‧ Residual parts (residual resin accommodating part, unnecessary resin accommodating part, resin molded product fixing mechanism)

203‧‧‧ gate (resin flow path, resin molded product fixing mechanism)

208‧‧‧ slots (burr countermeasure slots)

213‧‧‧1st gate (resin runner)

214‧‧‧ flow path

215‧‧‧2nd gate (resin runner)

219‧‧‧ slots (opening mold suppression member mounting groove)

300‧‧‧Opening suppression member

1000, 1010‧‧‧ molding die

2110‧‧‧Upper platen (another platen)

2111‧‧‧heater

2200‧‧‧heating table

2201‧‧‧heater

2210‧‧‧ Lower platen (one platen)

2211‧‧‧heater

3100, 3120‧‧‧Upper plate (another platen)

3101‧‧‧heater

3200, 3210, 3220‧‧‧ lower plate (one plate)

3201, 3211, 3221‧‧ heater

3202, 3212, 3222‧‧‧Plunger drive mechanism (flow resin injection member drive mechanism)

3203, 3213, 3223‧‧‧Plunger (flowable resin injection member)

3204, 3214, 3224‧‧‧ cans

3205, 3225‧‧‧ slots (plunger slots, recesses)

3216, 3226‧‧‧ resin input rod

3219, 3229‧‧‧ resin input

4000‧‧‧ Residual material discharge rod (unused resin removal member)

4001‧‧‧ slots (rod grooves and recesses for residual material discharge)

5000, 5010‧‧‧ cooling station

5001, 5011‧‧‧Cooling mechanism (cold runner)

5002, 5012‧‧‧ air supply hole

5100‧‧‧heating table

5101‧‧‧heater

5102‧‧‧Air supply hole

5200‧‧‧Cool supply mechanism

5201‧‧‧Pipe (coolant supply piping)

5300‧‧‧Air supply agency

5301‧‧‧Pipe (air supply piping)

6000‧‧‧Unloader (handling mechanism)

6001‧‧‧ Cooling section (resin molded product cooling mechanism)

7000‧‧‧Upper lifting mechanism

8000‧‧‧heating table

8001‧‧‧heater

8002‧‧‧ exit slot

A1, a11~a12, a21~a26‧‧‧ indicate the direction of movement of the lower mold (one mold) 200

B1‧‧‧ indicates the arrow in the upward direction of the plunger 3203

B11, b12‧‧‧ indicates the arrow in the upward direction of the plunger 3213

B13‧‧‧ indicates the arrow in the downward direction of the plunger 3213

B21, b22‧‧‧ indicates the arrow in the upward direction of the plunger 3223

C1, c21‧‧‧ indicates that the residual material discharge rod 4000 is rising in the upward direction arrow

C2, c22‧‧‧ indicates the arrow in the direction in which the residual material discharge rod 4000 descends

D1, d21‧‧‧ indicates the arrow in the direction of rotation of the rod discharge rod 4000

X1, x2, x11, x21‧‧‧ indicate the direction of the air supply direction from the air supply hole

A1, A2, A11, A12‧‧‧ indicates the arrow in the upward direction of the lower platen (one platen) 2210

B1, B2, B11, B12‧‧‧ indicates the arrow in the downward direction of the lower platen (one platen) 2210

C1‧‧‧ indicates the arrow in the upward direction of the lower platen (one platen) 3210

C11‧‧‧ indicates the arrow in the upward direction of the lower platen (one platen) 3220

D1‧‧‧ indicates the arrow in the downward direction of the lower platen (one platen) 3210

E1‧‧‧ indicates the arrow in the upward direction of the forming die 1000

E11, E12‧‧‧ indicates the arrow in the upward direction of the forming die 1010

F1, F11‧‧‧ indicates the arrow in the downward direction of the upper die lift mechanism 7000

F2, F12‧‧‧ indicates the arrow in the upward direction of the upper mold lifting mechanism 7000

S1‧‧‧ warming phase

S2‧‧‧ resin molding stage

S3‧‧‧ curing stage

S4‧‧‧ discharge phase

1A is a schematic cross-sectional view showing a part of the configuration of a resin molding apparatus of Embodiment 1 and a part of steps of a method of manufacturing a resin molded article using the resin molding apparatus.

1B is another part of the structure of the same resin molding apparatus as that of FIG. 1A and A schematic cross-sectional view of another step of the method of manufacturing the same resin molded article as in Fig. 1A.

1C is a schematic cross-sectional view showing a modification of the resin molding apparatus and the method of producing the resin molded article of the first embodiment.

2A is a schematic cross-sectional view showing a part of steps of a structure of a resin molding apparatus of Embodiment 2 and a method of manufacturing a resin molded article using the resin molding apparatus.

Fig. 2B is a schematic cross-sectional view showing another configuration of the same resin molding apparatus as that of Fig. 2A and another step of the method of manufacturing the same resin molded article as Fig. 2A.

Fig. 2C is a schematic cross-sectional view showing still another step of the same resin molding apparatus as that of Fig. 2A and still another step of the method of manufacturing the same resin molded article as Fig. 2A.

3A is a schematic cross-sectional view showing a part of steps of a structure of a resin molding apparatus of Embodiment 3 and a method of manufacturing a resin molded article using the resin molding apparatus.

Fig. 3B is a schematic cross-sectional view showing another configuration of the same resin molding apparatus as that of Fig. 3A and another step of the method of manufacturing the same resin molded article as Fig. 3A.

Fig. 3C is a schematic cross-sectional view showing still another step of the same resin molding apparatus as that of Fig. 3A and a further step of the method of manufacturing the same resin molded article as Fig. 3A.

3D is a schematic view showing still another part of the structure of the same resin molding apparatus as that of FIG. 3A and another step of the method of manufacturing the same resin molded article as that of FIG. 3A. Cutaway view.

Fig. 3E is a schematic cross-sectional view showing still another step of the same resin molding apparatus as that of Fig. 3A and a further step of the method of manufacturing the same resin molded article as Fig. 3A.

Fig. 3F is a schematic cross-sectional view showing still another step of the same resin molding apparatus as that of Fig. 3A and still another step of the method of manufacturing the same resin molded article as Fig. 3A.

4 is a schematic view showing an outline of an example of a resin molding apparatus and a method of producing a resin molded article using the same according to the present invention.

Fig. 5 is a schematic cross-sectional view showing a modification of the molding die.

Fig. 6 is a schematic view showing another modification of the molding die. Fig. 6(a) is a plan view and Fig. 6(b) is a cross-sectional view.

Fig. 7 is a schematic view showing an example of a structure of an unnecessary resin portion after resin molding. Fig. 7 (a) is a side view, and Fig. 7 (b) is a front view.

Each of (a) and (b) of FIG. 8 is a schematic view showing an example of the relationship between the shape of the plunger and the form of the unnecessary resin portion.

Next, the present invention will be described in further detail by way of examples. However, the invention is not limited to the following description.

In the resin molding apparatus of the present invention, for example, the other mold can be fixed in the resin molding stage, and the one mold can be moved between the respective stages while being detachable with respect to each of the stages. .

In the resin molding apparatus of the present invention, for example, the tree The fat molding stage can further release the resin molded article from the other mold in a state of being fixed to the one mold, the discharge stage enabling the resin molded article to be from the one of the molding molds The mold is demolded.

In the resin molding apparatus of the present invention, for example, both the one mold and the other mold can be attached and detached with respect to each of the stages, and can be moved between the respective stages.

In the resin molding apparatus of the present invention, for example, the discharge step can release the resin molded article from the other mold in a state of being fixed to the one mold, and further cause the resin molded article to be removed from the other mold. The one mold of the molding die is demolded.

The resin molding apparatus of the present invention may further include, for example, a curing stage that cures the resin in the molding die.

The resin molding apparatus of the present invention may further include, for example, a fluid resin injection member that injects a fluid resin into one mold cavity, and an unnecessary resin portion removal member that removes the unnecessary resin portion from which the fluid resin is cured, the fluid resin The injection member includes at least one of a convex portion and a concave portion on a contact surface with the fluid resin, and the unnecessary resin portion removing member includes a convex portion and a concave portion on a contact surface with the unnecessary resin portion. At least one.

The resin molding apparatus of the present invention may further include, for example, a mold opening suppressing member that suppresses opening of the one mold and the other mold.

The resin molding apparatus of the present invention can further comprise, for example A temperature rising mechanism that heats the molding die and a resin molded article cooling mechanism that cools the resin molded article.

In the resin molding apparatus of the present invention, the one mold may be provided with a mold cavity (one mold cavity) or may not be provided. Further, in the resin molding apparatus of the present invention, the other mold may be provided with a mold cavity (another mold cavity) or may not be provided. For example, in the resin molding apparatus of the present invention, the one mold may be provided with a mold cavity (one mold cavity), and the other mold may not have a mold cavity. Further, in the resin molding apparatus of the present invention, the one mold may have one mold cavity, and the other mold may have another mold cavity. That is, in the resin molding apparatus of the present invention, both of the one mold and the other mold can be provided with a mold cavity.

In the other mold of the resin molding apparatus of the present invention, the face opposite to the one mold is, for example, referred to as a face perpendicular to the mold opening direction. Further, the surface facing the one mold also includes a surface other than the other mold cavity (for example, a surface of the remaining resin housing portion, a surface of the resin flow path, and the like). In the one mold of the resin molding apparatus of the present invention, a surface opposed to the other mold is, for example, a surface perpendicular to the mold opening direction. Further, the surface facing the other mold also includes a surface other than the one mold cavity (for example, a surface of the remaining resin housing portion, a surface of the resin flow path, a flow path surface, and the like).

In the method for producing a resin molded article of the present invention, for example, the first mold release step can be carried out in the resin molding stage.

The method for producing a resin molded article of the present invention can be, for example, The discharge step is performed in the first demolding step.

The method for producing a resin molded article of the present invention can further include, for example, a resin curing step of curing the resin in the molding die in a curing stage.

The method for producing a resin molded article of the present invention may further include, for example, a fluid resin injection step of injecting a fluid resin into the one mold cavity using a fluid resin injection member; and removing the fluid resin curing using a useless resin portion removing member In the unnecessary resin portion removing step of the unnecessary resin portion, the fluid resin injection member includes at least one of a convex portion and a concave portion on a contact surface with the fluid resin, and the unnecessary resin portion removing member is At least one of a convex portion and a concave portion is provided on the contact surface with the unnecessary resin portion.

In the method for producing a resin molded article of the present invention, for example, in the molding step, mold opening of the one mold and the other mold can be suppressed by using a mold opening suppressing member.

In the method for producing a resin molded article of the present invention, for example, in the demolding step, the resin molded article can be cooled while the molding die is heated.

In the method of producing a resin molded article of the present invention, the one mold may be provided with a mold cavity (one mold cavity) or may not be provided. Further, in the method of producing a resin molded article of the present invention, the other mold may be provided with a mold cavity (another mold cavity) or may not be provided. For example, in the method of producing a resin molded article of the present invention, the one may be The mold has a mold cavity (one mold cavity) that does not have a mold cavity. Further, in the method of producing a resin molded article of the present invention, the one mold may have one mold cavity, and the other mold may have another mold cavity. In other words, in the method of producing a resin molded article of the present invention, both of the one mold and the other mold may have a mold cavity.

In the other mold of the method for producing a resin molded article of the present invention, the surface facing the one mold is, for example, referred to as a surface perpendicular to the mold opening direction. Further, the surface facing the one mold also includes a surface other than the other mold cavity (for example, a surface of the remaining resin housing portion, a surface of the resin flow path, and the like). In the one mold of the method for producing a resin molded article of the present invention, a surface facing the other mold is, for example, a surface perpendicular to the mold opening direction. Further, the surface facing the other mold also includes a surface other than the one mold cavity (for example, a surface of the remaining resin housing portion, a surface of the resin flow path, a flow path surface, and the like).

The method for producing a resin molded article of the present invention is carried out, for example, by using the resin molding apparatus of the present invention.

In the present invention, the resin molded article is not particularly limited, and may be, for example, a resin molded article obtained by molding only a resin, or may be a resin molded article obtained by resin-sealing a component such as a wafer. In the present invention, the resin molded article may be, for example, an electronic component or the like. Further, in the present invention, the resin molded article may be, for example, a product as a finished product or an unfinished semi-finished product.

In the present invention, "resin molding" or "resin encapsulation" It means a state in which, for example, the resin has been cured (hardened). However, in the present invention, "resin molding" or "resin encapsulation" is not limited to the above meaning, and may be, for example, a semi-cured (semi-hardened) state in which the resin is not completely cured (hardened). The semi-cured (semi-hardened) state may be, for example, a cured (hardened) state in which the resin can be released from the molding die or can be conveyed together with the molding die.

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or an oxime resin, or a thermoplastic resin. Further, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include a pellet resin, a fluid resin, a sheet resin, a plate resin, a powder resin, and the like. In the present invention, the fluid resin is not particularly limited as long as it is a fluid resin, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin means, for example, a resin which is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to a resin which becomes liquid or melts in a fluid state, for example. The form of the resin may be other forms as long as it can be supplied to a cavity or a pot of a molding die.

Further, although the term "electronic component" refers to the case of a wafer before resin encapsulation and the case of a state in which a wafer resin has been packaged, in the present invention, only the case of "electronic component" is referred to unless otherwise specified. , refers to an electronic component (as an electronic component of the finished product) in which the wafer has been encapsulated by a resin. In the present invention, "wafer" means a crystal before resin encapsulation Specifically, for example, a wafer such as an integrated circuit (IC), a semiconductor wafer, or a semiconductor element for power control can be exemplified. In the present invention, the wafer before the resin package is distinguished from the electronic package after the resin package, and is referred to as a "wafer" for convenience. However, the "wafer" of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be wafer-shaped.

In the present invention, "flip-chip" refers to an integrated circuit (IC) wafer having a bulge-like protruding electrode called a bump on an electrode (pad) on the surface portion of an integrated circuit (IC) wafer or this. Wafer morphology. The wafer is mounted downward (facing downward) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as one of a wafer for wire bonding or a mounting method.

In the present invention, for example, a resin molded article can be produced by resin molding both surfaces of a substrate. Further, for example, a resin molded article is produced by resin-sealing (resin molding) a component (for example, a wafer, a flip chip, or the like) mounted on both surfaces of the substrate. In the present invention, the substrate (also referred to as an insert) is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, a mounting substrate on which a wafer is mounted on one surface or both surfaces as described above. The mounting method of the wafer is not particularly limited, and for example, wire bonding, flip chip bonding, or the like can be exemplified. In the present invention, for example, an electronic component in which the wafer is resin-encapsulated can be manufactured by resin-sealing both surfaces of the mounting substrate. In addition, the use of the resin-sealed substrate of the resin-sealed device of the present invention is not particularly limited, and examples thereof include a high-frequency module substrate for a mobile communication terminal, a power control module substrate, and a mechanical control substrate.

Also, in the present invention, "installation" includes "placement" Or "fixed." Further, in the present invention, "placement" includes "fixed".

Further, in the present invention, the "forming die" is not particularly limited, and is a metal mold, a ceramic mold, or the like.

Further, in the present invention, the method for producing the resin molded article may be any molding method such as transfer molding, injection molding, or compression molding. Further, the resin molding device may be, for example, any resin molding device such as a transfer molding device, an injection molding device, or a compression molding device. In Examples 1 to 3 which will be described later, an example in which a resin molded article is produced by transfer molding using a resin molding apparatus as a transfer molding device will be described.

As described above, the resin molding apparatus of the present invention has a stage other than the resin molding stage, and the molding die can be conveyed at the other stage. An outline of this example is schematically shown in FIG. As shown in the figure, the resin molding apparatus includes a temperature rising stage S1, a resin molding stage S2, a curing stage S3, and a discharge stage S4. Then, the molding die 1000 is moved between the respective stages in the above-described order to produce the resin molded article 1b. After that, the molding die 1000 can be returned to the temperature rising step S1 again, and the same method of manufacturing the resin molded article can be performed again. By using a structure in which the molding die is circulated between the respective stages as described above, it is possible to, for example, reduce the number of parts of the molding die and reduce the manufacturing time and cost of the molding die.

However, FIG. 4 is merely an illustration, and the present invention is not limited thereto. For example, in the resin molding apparatus of the present invention, the curing stage S3 is arbitrary, and may or may not be included. In the first embodiment and the second embodiment to be described later, an example in which the curing stage is not used is shown, and in the third embodiment to be described later, an example in which the curing stage is used is shown. child. Further, the configuration of the molding die 1000 of Fig. 4 is merely an example, and the configuration of the molding die of the resin molding device of the present invention is not limited thereto. In addition, the molding die 1000 of FIG. 4 includes an upper die (another die) 100 and a lower die (one die) 200 as shown in the drawing. The upper mold 100 is provided with an upper mold cavity (another mold cavity) 101 on the lower surface side thereof, and the lower mold 200 is provided with a lower mold cavity (a mold cavity) 201 on the upper surface side thereof. The lower mold 200 is provided with a residue portion (residual resin housing portion) 202 on the lower surface side thereof. The residual portion 202 is connected to the lower surface of the lower mold cavity 201 by a gate (resin flow path) 203. In the case of the molding die 1000, for example, the upper mold (another mold) 100 can be fixed in the resin molding stage, and only the lower mold (one mold) 200 can be attached and detached with respect to each of the stages, and can be between the respective stages. mobile. Further, in the molding die 1000, for example, both the upper mold (the other mold) 100 and the lower mold (one mold) 200 can be attached and detached with respect to each of the stages, and can be moved between the respective stages. Further, the resin molded product 1b of FIG. 4 is resin-molded with resin (cured resin) 20 on both surfaces of the substrate 1. However, the structure of the resin molded article which can be produced in the present invention is not limited to the structure of the resin molded article 1b of Fig. 4 .

Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically drawn by appropriate omission, exaggeration, etc. for convenience of explanation.

[Example 1]

In the present embodiment, an example of a resin molding apparatus and an example of a method of producing a resin molded article using the same are described.

Steps (a) to (f) of Fig. 1A and steps (g) to (n) of Fig. 1B The steps of a part of the structure of the resin molding apparatus of the present embodiment and a method of manufacturing a resin molded article using the resin molding apparatus are schematically shown. Further, a modification of the resin molding apparatus and the method of manufacturing the resin molded article of FIGS. 1A and 1B is shown in steps (11) to (o1) of FIG. 1C. 1A, 1B, and 1C are diagrams in which Fig. 1 is divided into three parts for convenience. Hereinafter, some or all of FIGS. 1A, 1B, and 1C will be referred to as "FIG. 1".

The resin molding apparatus of the present embodiment includes a molding die, a temperature rising stage, a resin molding stage, and a discharge stage as will be described later. And, as will be described later, the upper mold (another mold) of the molding die is fixed in the resin molding stage, and the lower mold (one mold) can be attached and detached with respect to each of the stages, and at the same time Move between stages.

The method for producing a resin molded article shown in steps (a) to (n) of Fig. 1 can be carried out as follows. First, as shown in (a) of FIG. 1, a lower mold (one mold) 200 is prepared. As shown in the figure, the lower mold 200 is provided with a lower mold cavity (a mold cavity) 201 on the upper surface side thereof. Further, the lower mold 200 is provided with a residue portion (residual resin housing portion) 202 on the lower surface side thereof. The residual portion 202 is connected to the lower mold cavity 201 by a gate (resin flow path) 203. The lower mold 200 can be attached and detached with respect to each stage of the temperature rising stage, the resin molding stage, and the discharge stage, and can be moved between stages.

Next, as shown in FIG. 1(b), the lower mold 200 is heated (heating step). Specifically, the lower mold 200 is first moved to the temperature rising stage. As shown in FIG. 1(b), the temperature rising stage includes a temperature increasing stage 2200. The heating stage 2200 is provided with a heater 2201 inside. The heater 2201 is not particularly limited, and for example, It is a cartridge heater or the like. Then, as shown in the figure, the substrate (frame) 1 is supplied to the upper surface of the lower mold 200 in a state where the lower mold 200 is placed on the temperature rising stage 2200. Then, in this state, the lower mold 200 and the substrate 1 are heated by the temperature rising stage 2200 and the heater 2201. Further, a through hole (not shown) may be provided on the substrate 1, for example. For example, the flowable resin can flow from the lower mold cavity (one mold cavity) 201 side to the upper mold cavity (the other mold cavity) 101 side by the through hole of the substrate 1.

Then, as shown in FIG. 1(c), after the lower mold 200 and the substrate 1 are heated, the lower mold 200 and the substrate 1 are moved to the resin molding stage.

Next, as shown in (d) to (i) of Fig. 1, resin molding (resin molding step) is performed in the resin molding stage. Further, in the present embodiment, the resin molded resin is fixed to the lower mold (one mold) 200 by the resin molded product fixing mechanism (residue portion 202 and gate 203) in the resin molding stage as will be described later. The mold is released from the upper mold (another mold) 100 in the state (the first mold release step).

As shown in (d) of FIG. 1, the resin molding stage of the resin molding apparatus includes an upper platen (another platen) 3100 and a lower platen (one platen) 3200. The upper platen 3100 includes a heater 3101 therein, and the lower platen 3200 includes a heater 3201 therein. The heaters 3101 and 3201 are not particularly limited and may be, for example, a cartridge heater. The upper platen 3100 is fixed with an upper die (another die) 100 on its lower surface as shown. The upper mold 100 is provided with an upper mold cavity (another mold cavity) 101 on the lower surface side thereof. Further, as shown in the drawing, the lower pressing plate 3200 is provided with a can body 3204 in which a plate (resin material) 20a can be accommodated. And, the resin molding stage as shown in the figure further includes a plunger A drive mechanism (flowable resin injection member drive mechanism) 3202 and a plunger (flowable resin injection member) 3203. The fluid resin can be injected into the mold cavity (one mold cavity) 201 as will be described later by driving the plunger 3203 with the plunger drive mechanism 3202. Further, as shown in the drawing, the plunger 3203 is provided with a groove (concave portion) 3205 on the contact surface with the fluid resin.

As shown in FIG. 1(d), the lower mold 200 and the substrate 1 are conveyed in the direction of the arrow a1, and moved between the upper platen 3100 and the lower platen 3200 in the resin molding stage. For the conveyance of the lower mold 200, for example, a transport mechanism (not shown) can be used. Further, as shown in FIG. 1(d), a plate (resin material) 20a is supplied to the can body 3204.

Then, as shown in FIG. 1(e), the lower mold 200 is fixed to the lower pressing plate 3200, and the resin material 20a is accommodated in the can body 3204. In this state, the upper mold 100 and the lower mold 200 of the molding die 1000 are preferably heated to a temperature at which molding can be performed.

Further, as shown in FIG. 1(f), the upper mold 100 and the lower mold 200 of the molding die 1000 are closed. At this time, as shown in the figure, the resin material 20a in the can body 3204 is melted into a molten resin (flowable resin) 20b by the lower mold 200 which has been heated.

Next, as shown in FIG. 1(g), the plunger 3203 is raised in the direction of the arrow b1 by the plunger drive mechanism 3202. As shown in the figure, the fluid resin 20b is filled into the lower mold cavity 201 by the residue portion (unused resin containing portion) 202 and the gate (resin flow path) 203, and further passes through the through hole of the substrate 1 (not The illustration) is also filled into the upper mold cavity 101. At this time, since the residual portion 202 and the gate 203 are present, even if the volume of the fluid resin 20b is deviated It is also possible to suppress or prevent a change in the resin pressure in the upper mold cavity 101 and in the lower mold cavity 201.

In addition, the residue portion (the unnecessary resin accommodating portion) 202 and the gate (resin flow path) 203 function as a "resin molded product fixing mechanism" for fixing the resin after the resin molding to the lower mold 200 as will be described later. However, the resin molding die of the resin molding apparatus of the present invention is not limited to the form including the resin molded article fixing mechanism. For example, in the resin molding die of the resin molding apparatus of the present invention, on or in place of the resin molding product fixing mechanism, by The area of the surface of the one mold opposite to the other mold and in contact with the resin is larger than the area of the surface of the mold which is in contact with the resin, so that the resin after the resin molding can be fixed at The state of the one mold is released from the other mold. Specifically, for example, as shown in (g) of FIG. 1, the inclination angle (slope angle) of the side surface 201a of the lower mold cavity (one mold cavity) 201 and the side surface 101a of the upper mold cavity (the other mold cavity) 101 may be different. . In the same figure, the inclination angle of the side surface 101a of the upper mold cavity 101 is flatter and closer to the horizontal than the side surface 201a of the lower mold cavity 201. Thereby, compared with the area on the upper mold (the other mold) 100 opposite to the lower mold (one mold) 200 and in contact with the resin (that is, the upper surface of the upper mold 100), the lower mold (one mold) The area on the 200 opposite to the upper mold (the other mold) 100 and the surface in contact with the resin (i.e., the bottom surface of the lower mold 200) is larger. That is, the surface on the lower mold 200 that is perpendicular to the mold opening direction and in contact with the resin is on the upper mold 100 in a direction perpendicular to the mold opening direction and the surface in contact with the resin (the upper surface of the upper mold 100). The area of the bottom surface of the lower mold 200 is larger. Therefore, in the picture In the molding die 1000 of 1, the resin molded article is easily fixed to the lower mold 200 at the time of mold opening. Also, in the present invention, the resin is opposed to the other mold and the resin on the one mold as compared with the area of the surface on the other mold opposite to the one mold and in contact with the resin. Specific examples in which the area of the contacted face is larger are not limited thereto. For example, the resin molded article can be easily fixed to the one mold by the area of the bottom surface of one mold cavity being larger than the area of the bottom surface of the other mold cavity. Further, for example, even if one mold cavity and the other mold cavity have the same shape, the resin molded article can be easily fixed to the one mold by making one mold cavity larger than the other mold cavity.

Then, as shown in FIG. 1(h), after the fluid resin 20b is cured (hardened), the upper mold 100 and the lower mold 200 are opened. In addition, the method of curing (curing) the fluid resin 20b is not particularly limited, and a known method can be suitably used. For example, when the fluid resin 20b is a thermosetting resin, the fluid resin 20b can be cured (hardened) by continuously heating the upper mold 100 and the lower mold 200. Further, for example, when the fluid resin 20b is a thermoplastic resin, the fluid resin 20b can be cured (hardened) by cooling or naturally cooling the upper mold 100 and the lower mold 200. In (h) of FIG. 1, the fluid resin 20b in the upper mold cavity 101 and the lower mold cavity 201 is solidified into the cured resin 20. Further, the resin in the residue portion (residual resin accommodating portion) 202 and the gate (resin flow path) 203 is solidified into a residual resin (unused resin portion) 20d. A portion of the unnecessary resin portion 20d that is solidified in the plunger groove (concave portion) 3205 is a protruding unnecessary resin portion (protrusion) 20e.

Here, the shape of the residue portion 202 and the gate 203 (resin molded product fixing mechanism) is as thin as possible as shown in the drawing. Thus, as shown in Figure 1 (h) In the state in which the resin molded article (cured resin 20 and substrate 1) connected to the unnecessary resin portion 20d is fixed to the lower mold 200, only the upper mold 100 is molded from the resin molded article (the cured resin 20 and Substrate 1) demolding (first demolding step).

Next, as shown in FIG. 1(i), the lower mold 200 is conveyed together with the resin molded product and the unnecessary resin portion 20d to the outside of the resin molding stage.

Further, as shown in (j) to (l) of FIG. 1, the unnecessary resin portion 20d is removed from the resin molded article in the residual material discharge step (the unnecessary resin portion removal step) (the unnecessary resin removal step).

As shown in FIG. 1(j), the residual material discharge stage (the unnecessary resin portion removal stage) of the resin molding apparatus includes a residue discharge rod (unused resin removal member) 4000. The residue discharge lever 4000 is provided with a groove (recess) 4001 having the same size as the plunger groove 3205 on the contact surface with the unnecessary resin portion 20d.

As shown in FIG. 1(j), the residual material discharge lever 4000 is raised in the direction of the arrow c1. As a result, as shown in FIG. 1(k), the residual material discharge lever 4000 is brought into contact with the unnecessary resin portion 20d. At this time, as shown in the figure, the unnecessary resin portion (protrusion) 20e is fitted into the groove (concave portion) 4001 of the residual material discharge rod. In this state, as shown in the figure, the residual material discharge lever 4000 is rotated in the direction of the arrow d1. Thereby, the unnecessary resin portion 20d is twisted and separated from the cured resin 20 in the lower mold cavity 201.

Thereafter, as shown in (l) of FIG. 1, the residue discharge lever 4000 is lowered in the direction of the arrow c2. Thereby, as shown in the figure, the unnecessary resin portions 20d and 20e connected to the residual material discharge lever 4000 are lowered, and are taken from the lower mold cavity 201. The cured resin 20 in the whole is completely separated. Thereby, as shown in the figure, the resin molded product 1b which was resin-molded by the cured resin 20 on both surfaces of the substrate 1 was produced.

Next, the lower mold 200 and the resin molded product 1b are moved together to the discharge stage. Then, as shown in (m) and (n) of FIG. 1, in the discharge stage, the resin molded article 1b is released from the lower mold 200 (second demolding step).

As shown in (m) of FIG. 1, the discharge stage of the resin molding apparatus includes a cooling stage 5000. The cooling stage 5000 is provided with a cooling mechanism (cold flow path) 5001 therein. Further, the cooling stage 5000 includes an air supply hole 5002 that penetrates from the upper surface to the lower surface of the cooling stage 5000 at a position corresponding to the residual portion 202 of the lower mold 200 and the gate 203.

As shown in (m) of FIG. 1, the lower mold 200 and the resin molded product 1b are placed together on the cooling stage 5000. In this state, the lower mold 200 and the resin molded product 1b are cooled by the cooling stage 5000 and the cold flow path 5001.

In the case of the present embodiment, the resin molded article (package) 1b is larger than the lower mold 200 in terms of shrinkage due to cooling. Therefore, when cooling is performed in the state of (m) of FIG. 1, a gap is formed between the cured resin 20 of the resin molded product 1b and the lower mold cavity 201. Thereby, the resin molded product 1b is easily released from the lower mold 200. However, the invention is not limited thereto. For example, in the present invention, in the demolding step of the method for producing a resin molded article, heating (heating) of the molding die can be performed in addition to or in place of cooling of the molding die. Further, the resin molded article may be cooled or heated (heated) in the demolding step. Further, in the demolding step, the molding die and the resin molded article may or may not be cooled, and may be heated (heated) or not heated (warmed). And, as described above, in the present embodiment, the shrinkage rate due to cooling is In other words, the resin molded article (package) 1b is larger than the lower mold 200. However, the present invention is not limited thereto, and the shrinkage ratio due to cooling may be different from the above depending on the thermal expansion coefficient of the molding die and the resin after resin molding. In this case, for example, in the demolding step, a method different from the present embodiment can be used.

Further, as shown in FIG. 1(n), air is supplied from the air supply hole 5002 in the direction of the arrow x1, that is, the resin molded article 1b is blown from the bottom to the top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thereby, the resin molded product 1b is released from the lower mold 200.

In the present embodiment, the resin molded article 1b can be produced as described above.

Next, Fig. 1C shows a modification of the method of manufacturing the resin molded article of the present embodiment. In this modification, first, the steps up to (a) to (l) of FIG. 1 are performed in the same manner as described above (not shown). Thereafter, the second demolding step is performed as shown in steps (l1) to (o1) shown in FIG. 1C. details as follows.

First, (l1) of Fig. 1 indicates the state of the lower mold 200 immediately after the step of (l) of Fig. 1 is completed. As shown in the figure, a resin molded article 1b is placed on the lower mold 200. The unnecessary resin portion 20d is separated and removed from the resin molded article 1b. The molding die (lower die 200) and the resin molded article 1b are moved to the discharge stage, and the resin molded article 1b is released from the lower die 200 as shown in (m1) to (o1) of Fig. 1 .

As shown in (m1) of FIG. 1, the discharge stage includes a temperature rising stage 5100 instead of the cooling stage 5000. The heating stage 5100 is provided with a heater 5101 therein. The heater 5101 is not particularly limited and may be, for example, a cartridge heater. Further, the temperature increasing stage 5100 is in the residual material portion 202 corresponding to the lower mold 200 and the gate 203. The air supply hole 5102 penetrates from the upper surface of the temperature riser 5100 to the lower surface.

As shown in (m1) of FIG. 1, the lower mold 200 and the resin molded product 1b are placed together on the temperature rising table 5100. In this state, the lower mold 200 and the resin molded product 1b are heated by the temperature rising stage 5100 and the heater 5101 (temperature rising mechanism).

Then, in this state, as shown in (n1) of FIG. 1, the resin molded article 1b is cooled. Specifically, as shown in the figure, the cooling unit 6001 of the unloader (transport mechanism) 6000 including the cooling unit (resin molded product cooling mechanism) 6001 is brought into contact with the resin molded product 1b and cooled. The cooling portion 6001 is not particularly limited, and may be, for example, a Peltier element or the like. By cooling the molded product 1b while raising the temperature of the molding die (the lower die 200), the lower die 200 is expanded, and the resin molded article 1b is shrunk. Thereby, a gap can be formed between the cured resin 20 of the resin molded product 1b and the lower mold cavity 201. Therefore, the resin molded article 1b is easily released from the lower mold 200. In this state, as shown in the drawing, air is supplied from the air supply hole 5102 in the direction of the arrow x2, that is, the resin molded article 1b is blown from the bottom to the top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thereby, the resin molded product 1b is released from the lower mold 200 (second demolding step).

Then, as shown in (o1) of FIG. 1, the resin molded product 1b which is released from the lower mold 200 is transported to the outside of the discharge stage by using the unloader 6000.

[Embodiment 2]

Next, another embodiment of the present invention will be described.

In Embodiment 1, it is shown that the upper mold (another mold) 100 is fixed to the resin molding stage, and the lower mold (one mold) 200 can be attached and detached with respect to each stage of the resin molding apparatus, and can be moved between stages. example of. On the other hand, in the present embodiment (Embodiment 2), both the lower mold (one mold) 200 and the upper mold (the other mold) 100 showing the molding die 1000 can be attached and detached with respect to each stage of the resin molding apparatus. An example of being able to move between stages.

Steps (a) to (f) of FIG. 2A, steps (g) to (m) of FIG. 2B, and steps (n) to (s) of FIG. 2C schematically show a part of the structure of the resin molding apparatus of the present embodiment. And a step of a method of producing a resin molded article using the resin molding apparatus. Further, (q1) of FIG. 2C shows a modification. 2A, 2B, and 2C are diagrams in which FIG. 2 is divided into three parts for the sake of convenience. Some or all of FIGS. 2A, 2B, and 2C are sometimes referred to as "FIG. 2" hereinafter.

The method for producing a resin molded article shown in steps (a) to (s) of Fig. 2 can be carried out as follows. First, as shown in FIG. 2(a), a molding die 1000 is prepared. This molding die 1000 includes the upper die (another die) 100 and the lower die (one die) 200 in the same manner as in the first embodiment, and has the same configuration as that of the first embodiment. Further, as shown in the figure, the configurations of the upper mold 100 and the lower mold 200 are also the same as those of the first embodiment.

Next, the molding die 1000 is moved to the temperature rising stage of the resin molding apparatus, and as shown in FIGS. 2(b) to 2(f), the molding die 1000 is heated in the temperature rising phase (heating step).

As shown in FIG. 2(b), the temperature rising stage of the resin molding apparatus An upper platen (another platen) 2110 and a lower platen (one platen) 2210 are included. The upper platen 2110 is provided with a heater 2111 inside thereof. The lower pressing plate 2210 is provided with a heater 2211 inside thereof. The heater 2111 and the heater 2211 are not particularly limited, and may be, for example, a cartridge heater.

First, as shown in FIG. 2(b), the lower mold 200 is fixed to the lower pressing plate 2210. At this time, the upper mold 100 is in a state of being placed on the lower mold 200. That is, the molding die 1000 is entirely placed on the lower pressing plate 2210.

Next, as shown in FIG. 2(c), the lower pressing plate 2210 is raised in the direction of the arrow A1. Then, as shown, the upper mold 100 is fixed to the lower surface of the upper platen 2110. Further, a method of fixing the lower mold 200 to the lower pressing plate 2210 and a method of fixing the upper mold 100 to the lower surface of the upper pressing plate 2110 are not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Further, as shown in FIG. 2(d), the lower pressing plate 2210 is lowered in the direction of the arrow B1, and the molding die 1000 is opened, and the substrate (frame) 1 is supplied to the molding die 1000. Further, in the same figure, the substrate 1 is fixed to the lower surface of the upper mold 100, but is not limited thereto, and may be placed, for example, on the upper surface of the lower mold 200. As shown in the figure, in the case where the substrate 1 is fixed to the lower surface of the upper mold 100, the method thereof is not particularly limited. For example, the upper mold 100 can be provided with an upper mold substrate holding portion (not shown) to fix the substrate 1. The upper mold substrate holding portion is not particularly limited, and may be, for example, a substrate holding member (substrate clip) that holds the substrate 1. Alternatively, for example, a suction hole is provided in the upper mold, and a suction mechanism (not shown) is connected to the suction hole, and the substrate 1 is suction-fixed and fixed to the upper mold 100 by suction from the suction hole. The suction mechanism is also not particularly limited, and may be, for example, a decompression pump or the like. And, the substrate 1 can be, for example, the embodiment 1 the same.

Then, as shown in FIG. 2(e), the lower pressing plate 2210 is raised in the direction of the arrow A2 to close the molding die 1000. In this state, the heaters 2111 and 2211 can be operated to raise the temperature of the molding die 1000 and the substrate 1. Alternatively, the heaters 2111 and 2211 may be operated in advance before the molding die 1000 is placed on the lower pressing plate 2210, and the molding die 1000 and the substrate 1 are heated.

Next, the fixing on the lower mold 200 and the lower pressing plate 2210 and the fixing of the upper mold 100 and the upper pressing plate 2110 are released. Then, as shown in (f) of FIG. 2, the lower pressing plate 2210 is lowered and the lower pressing plate 2210 and the upper pressing plate 2110 are opened to move the molding die 1000 to the resin molding stage.

Next, as shown in (g) to (m) of Fig. 2, resin molding (resin molding step) is performed in the resin molding stage.

As shown in (g) of FIG. 2, the resin molding stage of the resin molding apparatus includes an upper platen (another platen) 3100 and a lower platen (one platen) 3210. The upper pressing plate 3100 is the same as the upper pressing plate 3100 of the first embodiment except that the upper mold 100 is not fixed. The upper platen 3100 includes a heater 3101 in its interior as in the first embodiment, and the lower platen 3210 includes a heater 3211 therein. The heaters 3101 and 3211 are not particularly limited, and may be, for example, a cartridge heater. The lower pressing plate 3210 is provided with a can body 3214 as shown in the drawing, and can accommodate a plate (resin material) 20a therein. The lower pressing plate 3210 has a resin input port 3219 connected to the can body 3214 on the side surface thereof. Further, for example, a heat insulating material may be disposed around the resin inlet port 3219 for heat insulation. Further, as shown in the figure, the resin molding stage of the figure further includes a plunger drive mechanism (flowable resin injection member drive mechanism) 3212 and a plunger (flowable resin injection structure). Pieces) 3213. By driving the plunger 3213 with the plunger driving mechanism 3212, the fluid mold can be injected into the lower mold cavity (one mold cavity) 201 as will be described later. Further, unlike the plunger 3203 of the first embodiment, the abutting surface of the plunger 3213 and the fluid resin has no groove (concave portion) and is flat.

First, as shown in FIG. 2(g), the plate (resin material) 20a is supplied (input) from the resin supply port 3219 to the can body 3214 by the resin input rod 3216. Further, as shown in the drawing, the molding die 1000 and the substrate 1 are conveyed in the direction of the arrow a11, and moved between the lower pressing plate 3210 and the upper pressing plate 3100.

Next, as shown in FIG. 2(h), the molding die 1000 is fixed to the lower pressing plate 3210. Further, as shown in the figure, the plunger 3213 is raised in the direction of the arrow b11, and the plate (resin material) 20a is pushed up to the upper side of the resin inlet 3219. At this time, since the resin input rod 3216 is still inserted into the resin inlet port 3219, the plate (resin material) 20a does not overflow from the resin inlet port 3219. Further, the shape of the resin input rod 3216 is not particularly limited. For example, as shown in the figure, when the front end of the resin input rod 3216 is circular, when the plunger 3213 is raised in the direction of the arrow b11, the plunger 3213 can be suppressed or prevented from being caught at the front end of the resin input rod 3216.

Next, as shown in FIG. 2(i), the lower pressing plate 3210 is raised in the direction of the arrow C1. Thereby, as shown in the drawing, the molding die 1000 is sandwiched by the lower pressing plate 3210 and the upper pressing plate 3100. In this state, since the molding die 1000 is heated by the temperature rising stage, and the heaters 3101 and 3211 are heated by the upper platen 3100 and the lower platen 3210, the resin material 20a is heated to a temperature at which melting is possible. Thereby, as shown in the figure, the resin material 20a in the can body 3214 is melted into a molten resin (flowable resin) 20b.

Next, as shown in FIG. 2(j), the plunger 3213 is raised in the direction of the arrow b12 by the plunger drive mechanism 3212. Thereby, as shown, the fluid resin 20b is filled into the lower mold cavity 201 and in the upper mold cavity 101. The mechanism in which the fluid resin 20b is filled into the lower mold cavity 201 and in the upper mold cavity 101 is the same as that of Embodiment 1, for example.

Then, as shown in FIG. 2(k), the fluid resin 20b is cured (cured), and is used as the cured resin 20 and the unnecessary resin portion 20d in the same manner as in the first embodiment. The method of curing (hardening) the fluid resin 20b is, for example, the same as in the first embodiment. Thereafter, as shown in the drawing, the lower pressing plate 3210 is lowered in the direction of the arrow D1 to separate the upper mold 100 and the upper pressing plate 3100.

Then, as shown in FIG. 2(l), the molding die 1000 and the resin molded article 1b (the substrate 1 and the cured resin 20) are lifted together in the direction of the arrow E1 by a transport mechanism (not shown) or the like. At this time, as shown in the figure, the unnecessary resin portion 20d remains on the lower pressing plate 3210 and is separated from the resin molded article 1b. This is because the bottom surface of the unnecessary resin portion 20d (the surface on which the lower pressing plate 3210 and the plunger 3213 are in contact with the unnecessary resin portion 20d) is set to be larger than the surface of the unnecessary resin portion 20d that is in contact with the cured resin 20, and the residue portion 202 is provided. The shape of the gate 203 is set to a tapered shape that expands toward the bottom surface of the unnecessary resin portion 20d. Then, as shown in the drawing, the molding die 1000 and the resin molded article 1b are moved together in the direction of the arrow a12 and conveyed to the outside of the molding stage, thereby moving to the discharge stage.

On the other hand, as shown in (m) of FIG. 2, the plunger 3213 is lowered in the direction of the arrow b13 and separated from the unnecessary resin portion 20d. The unnecessary resin portion 20d is conveyed and discharged outside the molding stage by a transport mechanism (not shown) or the like.

Further, as shown in (n) to (s) of FIG. 2, the resin molded article 1b is released from the molding die 1000 in the discharge stage. This step, as will be described later, includes a first demolding step of demolding the resin-formed cured resin 20 from the upper mold (another mold) 100 in a state of being fixed to the lower mold (one mold) 200, and in the discharge stage. The second mold release step of releasing the resin molded article 1b from the molding die 1000 (the lower die 200).

As shown in FIG. 2(n), the discharge stage provided in the resin molding apparatus includes a cooling stage 5000 and an upper mold lifting mechanism (upper mold lifting portion) 7000. Similarly to the first embodiment, the cooling stage 5000 includes a cooling mechanism (cold flow path) 5001 and an air supply hole 5002, and has the same configuration as the cooling stage 5000 of the first embodiment.

Further, as shown in FIG. 2(n), in the molding die 1000, the inclination angle of the side surface 101a of the upper mold cavity 101 is gentler and closer to the horizontal than the side surface 201a of the lower mold cavity 201. Thereby, the resin molded article is easily fixed to the lower mold 200 as compared with the upper mold 100. Therefore, the resin-molded cured resin 20 can be released from the upper mold (another mold) 100 in a state of being fixed to the lower mold (one mold) 200 as will be described later.

The demolding step (the first demolding step and the second demolding step) of (n) to (s) of FIG. 2 first fixes the lower surface of the lower mold 200 to the cooling stage 5000 as shown in FIG. 2(n). on. In this state, the molding die 1000 and the resin molded article 1b are cooled by the cooling stage 5000 and the cold runner 5001. At this time, in the same manner as in the first embodiment, the resin molded article (package) 1b is larger than the lower mold 200 in terms of shrinkage due to cooling. Therefore, when cooling is performed in the state of (n) of FIG. 2, it can be between the cured resin 20 of the resin molded product 1b and the upper mold cavity 101, and A gap is formed between the cured resin 20 and the lower mold cavity 201. Thereby, the resin molded product 1b is easily released from the molding die 1000. However, as explained in Embodiment 1, the present invention is not limited thereto.

Then, as shown in FIG. 2(n), the upper mold lifting mechanism 7000 is lowered in the direction of the arrow F1. Thereby, as shown in (o) of FIG. 2, the upper mold 100 is brought into contact with and fixed to the lower surface of the upper mold lifting mechanism 7000. Further, as shown in FIG. 2(o), the upper mold lifting mechanism 7000 is raised in the direction of the arrow F2. Thereby, as shown in (p) of FIG. 2, the upper mold 100 is lifted up. At this time, as described above, since the inclination angle of the side surface 101a of the upper mold cavity 101 is gentler than that of the side surface 201a of the lower mold cavity 201, the resin molded article 1b is easily fixed to the lower mold 200. And, as shown in the figure, the bottom surface of the lower model cavity 201 (in the lower model) is compared with the area of the upper surface of the upper mold cavity 101 (the surface on the upper mold cavity 101 opposite to the lower mold 200 and perpendicular to the mold opening direction) The area of the cavity 201 opposite to the upper mold 100 and perpendicular to the mold opening direction is larger, so that the cured resin 20a on the lower mold 200 side is more easily fixed than the cured resin 20a on the upper mold 100 side, and as a result, the resin The molded article 1b is easily fixed to the lower mold 200. Therefore, as shown in FIG. 2(p), the resin-molded cured resin 20 can be released from the upper mold (another mold) 100 in a state of being fixed to the lower mold (one mold) 200 (first release step). .

Further, as shown in (q) of FIG. 2, air is supplied from the air supply hole 5002 in the direction of the arrow x11, that is, the resin molded article 1b is blown from the bottom to the top. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thereby, the resin molded product 1b is released from the lower mold 200 (second demolding step). After that, by the unloader (transport mechanism, not shown) The resin molded article 1b is conveyed to the outside of the discharge stage. The resin molded article 1b can be produced in the above manner.

On the other hand, after the resin molded product 1b is transported to the outside of the discharge stage, the upper mold lifting mechanism 7000 is lowered. Then, as shown in (r) of FIG. 2, the upper mold 100 and the lower mold 200 are again closed.

Thereafter, only the upper mold lifting mechanism 7000 is raised and separated from the upper mold 100 as shown in (s) of FIG. 2 . Thereafter, the molding die 1000 is conveyed to the outside of the discharge stage by a transport mechanism (not shown) or the like. The method of manufacturing the resin molded article which is the same as the steps (a) to (s) of FIG. 2 can be performed again by the transfer of the molding die 1000 to the temperature rising step.

In addition, as a modification of the discharge stage and the mold release step (the first mold release step and the second mold release step) shown in (n) to (s) of FIG. 2, as shown in (q1) of FIG. 2, Instead of the cooling stage 5000, the temperature rising stage 5100 and the cooling part 6001 are used. The heating stage 5100 shown in (q1) of FIG. 2 is provided with the heater 5101 and the air supply hole 5102 in the same manner as in the first embodiment, and has the same configuration as the temperature rising stage 5100 of the first embodiment. In addition, the unloader (transport mechanism) 6000 shown in (q1) of FIG. 2 includes the cooling unit 6001 in the same manner as in the first embodiment, and has the same configuration as the unloader (transport mechanism) 6000 of the first embodiment. First, the same steps as (n) to (p) of Fig. 2 are performed except that the temperature rising stage 5100 is used instead of the cooling stage 5000. Then, as shown in (q1) of FIG. 2, the cooling unit 6001 of the unloader (transport mechanism) 6000 is brought into contact with the resin molded product 1b and cooled. When the molding die (lower die 200) is heated as described above and the resin molded article 1b is cooled, the lower die 200 is expanded, and the resin molded article 1b is shrunk. Thereby, a seam can be formed between the cured resin 20 of the resin molded article 1b and the lower mold cavity 201. Gap. Therefore, the resin molded article 1b is easily released from the lower mold 200. In this state, as shown in the figure, in the direction from the air supply hole 5102 to the arrow x11,

In other words, air is supplied from the bottom to the bottom of the resin molded article 1b. The air supply mechanism (not shown) is not particularly limited, and for example, an air pump or the like can be used. Thereby, the resin molded product 1b is released from the lower mold 200 (second demolding step). Thereafter, the resin molded product 1b that has been released from the lower mold 200 by the unloader 6000 is transported to the outside of the discharge stage (not shown).

[Example 3]

Next, other embodiments of the present invention will be described.

In the present embodiment, an example in which the curing stage is further used will be described. Further, an example in which the mold opening suppressing member is further used will be described.

Steps (a) to (z2) of FIGS. 3A to 3F schematically show a part of the structure of the resin molding apparatus of the present embodiment and the steps of the method of manufacturing the resin molded article using the resin molding apparatus. In addition, FIGS. 3A to 3F are diagrams in which FIG. 3 is divided into six parts for convenience. Hereinafter, some or all of FIGS. 3A to 16F will be referred to as "FIG. 3".

The method for producing a resin molded article shown in steps (a) to (z2) of Fig. 3 can be carried out in the following manner. First, as shown in FIG. 3(a), a molding die 1010 is prepared. As shown, the molding die 1010 includes an upper die (another die) 110 and a lower die (one die) 210. The upper mold 110 is provided with an upper mold cavity (another mold cavity) 111 on the lower surface side thereof, and the lower mold 210 has a lower mold cavity (a mold cavity) 211 on the upper surface side thereof. The lower mold 210 is provided on the lower surface side thereof Residue portion (residual resin housing portion) 212. Further, the lower mold 210 is provided with a flow path 214 on the upper surface side thereof. The residue portion 212 is connected to the lower surface of the flow path 214 by the first gate (resin flow path) 213. The flow path 214 is connected to the side surface of the lower mold cavity 211 by a second gate (resin flow path) 215. Further, the upper mold 110 and the lower mold 210 are provided with grooves (open mold suppression member mounting grooves) 119 and 219 on the left and right side surfaces, respectively.

Next, the molding die 1010 is moved to the temperature rising stage of the resin molding apparatus, and as shown in FIGS. 3(b) to 3(f), the molding die 1010 is heated in the temperature rising phase (heating step).

As shown in (b) of FIG. 3, the temperature rising stage of the resin molding apparatus includes an upper platen (another platen) 2110 and a lower platen (one platen) 2210. Similarly to the second embodiment, the upper platen 2110 is provided with a heater 2111 therein, and the lower platen 2210 is provided with a heater 2211 therein.

First, as shown in FIG. 3(b), the lower mold 210 is fixed to the lower pressing plate 2210. At this time, the upper mold 110 is in a state of being placed on the lower mold 210. That is, the molding die 1010 is entirely placed on the lower pressing plate 2210.

Next, as shown in FIG. 3(c), the lower pressing plate 2210 is raised in the direction of the arrow A11. Then, as shown, the upper mold 110 is fixed to the lower surface of the upper platen 2110. Further, a method of fixing the lower mold 210 to the lower pressing plate 2210 and a method of fixing the upper mold 110 to the lower surface of the upper pressing plate 2110 are not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Further, as shown in FIG. 3(d), the lower pressing plate 2210 is lowered in the direction of the arrow B11, and the molding die 1010 is opened, and the substrate (frame) is supplied into the molding die 1010. In the figure, the substrate 1 is fixed to the lower mold 210 although it is fixed. The upper surface, but is not limited thereto, for example, may be fixed to the lower surface of the upper mold 110. Further, the substrate 1 can be the same as the first embodiment and the second embodiment, for example.

Then, as shown in FIG. 3(e), the lower pressing plate 2210 is raised in the direction of the arrow A12 to close the molding die 1010. In this state, the heaters 2111 and 2211 can be operated to raise the temperature of the molding die 1010 and the substrate 1. Alternatively, the heaters 2111 and 2211 may be operated in advance to raise the temperature of the molding die 1010 and the substrate 1 before the molding die 1010 is placed on the lower pressing plate 2210.

Next, the fixing on the lower mold 210 and the lower pressing plate 2210 and the fixing of the upper mold 110 and the upper pressing plate 2110 are released. Then, as shown in (f) of FIG. 3, the lower pressing plate 2210 is lowered and the lower pressing plate 2210 and the upper pressing plate 2110 are opened to move the molding die 1010 to the resin molding stage.

Next, as shown in (g) to (n) of FIG. 3, resin molding (resin molding step) is performed in the resin molding stage.

As shown in (g) of FIG. 3, the resin molding stage of the resin molding apparatus includes an upper platen (another platen) 3120 and a lower platen (one platen) 3220. The upper platen 3120 contains a heater 3121 inside thereof. The lower platen 3220 includes a heater 3221 therein. The heaters 3121 and 3221 are not particularly limited, and may be, for example, a cartridge heater. The lower pressing plate 3220 is provided with a can body 3224 as shown in the drawing, and can accommodate a plate (resin material) 20a therein. The lower pressing plate 3220 has a resin inlet port 3229 connected to the can body 3224 on its side surface. Further, for example, a heat insulating material may be disposed around the resin inlet port 3229 for heat insulation. Further, as shown in the figure, the resin molding stage of the figure further includes a plunger drive mechanism (fluid resin injection member drive mechanism) 3222 and a plunger (flowable resin injection member) 3223. Driven by the plunger drive mechanism 3222 The movable plunger 3223 can inject a fluid resin into the lower mold cavity (one mold cavity) 211 as will be described later. Further, as shown in the drawing, the plunger 3223 is provided with a groove (concave portion) 3225 on the contact surface with the fluid resin.

First, as shown in FIG. 3(g), the plate (resin material) 20a is supplied (input) from the resin supply port 3229 to the can body 3224 by the resin input rod 3226. Further, as shown in the drawing, the molding die 1010 and the substrate 1 are conveyed in the direction of the arrow a22, and moved between the lower pressing plate 3220 and the upper pressing plate 3120.

Next, as shown in FIG. 3(h), the molding die 1010 is fixed to the lower pressing plate 3220. Further, as shown in the figure, the plunger 3223 is raised in the direction of the arrow b21, and the plate (resin material) 20a is pushed up to the upper side of the resin inlet port 3229. At this time, since the resin input rod 3226 is still inserted into the resin inlet port 3229, the plate (resin material) 20a does not overflow from the resin inlet port 3229. Further, the shape of the resin input rod 3226 is not particularly limited. For example, as shown in the figure, when the tip end of the resin input rod 3226 is circular, when the plunger 3223 is raised in the direction of the arrow b21, the plunger 3223 can be prevented or prevented from being caught at the tip end of the resin input rod 3226.

Next, as shown in (i) of FIG. 3, the lower pressing plate 3220 is raised in the direction of the arrow C11. Thus, as shown, the lower platen 3220 and the upper platen 3120 sandwich the molding die 1010. In this state, the molding die 1010 is heated by the temperature rising step, and the heaters 3121 and 3221 are heated by the upper platen 3120 and the lower platen 3220 to raise the temperature of the resin material 20a to a temperature at which melting is possible. Thereby, the resin material 20a in the can body 3224 is melted into a molten resin (flowable resin).

Next, as shown in (j) of FIG. 3, by the plunger driving mechanism 3222 raises the plunger 3223 in the direction of arrow b22. Thereby, as shown in the drawing, the molten resin (flowable resin) 20b is filled in the lower mold cavity 211 and in the upper mold cavity 111. Specifically, the fluid resin 20b flows in the order of the inside of the residual portion (the unnecessary resin containing portion) 212, the first gate (resin flow path) 213, the flow path 214, and the second gate (resin flow path) 215. It is filled into the lower mold cavity 211. Further, the fluid resin 20b is also filled into the upper mold cavity 111 by a through hole (not shown) of the substrate 1. In this case, the residual portion (unused resin containing portion) 212, the first gate (resin flow path) 213, the flow path 214, and the second gate (resin flow path) 215 are present, even if the volume of the fluid resin 20b is The deviation can also suppress or prevent a change in the resin pressure in the upper mold cavity 111 and in the lower mold cavity 211.

In addition, the flow path 214 and the second gate (resin flow path) 215 function as a "resin molded product fixing means" for fixing the resin molded resin to the lower mold 210 as will be described later.

Next, as shown in FIG. 3(k), one mold opening suppressing member 300 is prepared on each of the left and right sides. As shown in the figure, the mold opening suppression member 300 is provided with " In the shape of the word, the front end can be inserted into the groove 119 of the upper mold 110 and the groove of the lower mold 210 (open mold suppression member mounting groove) 219. As shown in (k) of Fig. 3, the left and right mold opening suppressing members 300 are directed to the arrow. The e1 direction (that is, toward the molding die 1010) is moved. Then, as shown in (l) of FIG. 3, the opening of the upper die 110 and the lower die 210 (opening mold suppressing member mounting groove) 219 is inserted and installed. The front end of the member 300. Thereby, it is possible to suppress or prevent the upper mold 110 and the lower mold 210 from opening.

Then, as shown in FIG. 3(m), the fluid resin 20b is cured (hardened) to become the cured resin 20 and the unnecessary resin portions 20d and 20e, and 20f. As shown in the figure, the resin solidified in the upper mold cavity 111 and the lower mold cavity 211 becomes the cured resin 20. The resin solidified in the residue portion (residual resin accommodating portion) 212 and the first gate (resin flow path) 213 becomes a residual resin (unused resin portion) 20d. The resin solidified in the plunger groove (concave portion) 3225 becomes a protruding unnecessary resin portion (protrusion) 20e. Further, the resin solidified in the flow path 214 and the second gate (resin flow path) 215 becomes the remaining resin (unused resin portion) 20f. The method of curing (hardening) the fluid resin 20b is the same as that of the first embodiment and the second embodiment, for example. Further, in the present embodiment, the curing of the resin is further performed using the curing stage as will be described later. Therefore, in the stages (m) and (n) of FIG. 3 (in the resin molding stage), the cured resin 20 and the unnecessary resin portions 20d, 20e, and 20f are cured to the extent that they can be transported together with the molding die 1010. The status is OK. Thereafter, the fixing of the upper mold 110 and the upper pressing plate 3120 is released, and further, as shown, the lower pressing plate 3220 is lowered and the upper mold 110 and the upper pressing plate 3120 are separated.

Then, as shown in FIG. 3(n), the molding die 1010, the resin molded article 1b (the substrate 1 and the cured resin 20), and the unnecessary resin portions 20d, 20e, and 20f are brought together by a transport mechanism (not shown) or the like. Lift in the direction of arrow E11. Then, as shown in the figure, the molding die 1010, the resin molded article 1b, and the unnecessary resin portions 20d, 20e, and 20f are moved in the direction of the arrow a23 and transported to the outside of the molding stage, and moved to the curing stage.

Next, as shown in (o) and (p) of FIG. 3, the resin in the molding die 1010 is cured in the curing stage (resin curing step).

As shown in (o) of FIG. 3, the curing stage of the resin molding apparatus includes a temperature rising stage 8000. The heating stage 8000 has a heater 8001 inside. The heater 8001 is not particularly limited and may be, for example, a cartridge heater. Further, the temperature rising table 8000 is provided with an exit groove 8002 at a position corresponding to the unnecessary resin portions 20d and 20e at the upper portion thereof.

As shown in FIG. 3(o), the molding die 1010, the resin molded article 1b, and the unnecessary resin portions 20d, 20e, and 20f are placed together on the temperature rising table 8000. At this time, the projection 20e of the unnecessary resin portion is housed in the exit groove 8002. Then, the molding die 1010 is heated by the heater 8001 by the temperature rising stage 8000. Thereby, the curing of the cured resin 20 and the unnecessary resin portions 20d, 20e, and 20f is further promoted, and the cured resin 20 and the unnecessary resin portions 20d, 20e, and 20f are cured to such an extent that the shape can be maintained even if the molding die 1010 is opened.

Then, as shown in FIG. 3(p), the molding die 1010, the resin molded article 1b, and the unnecessary resin portions 20d, 20e, and 20f are lifted together in the direction of the arrow E12 by a transport mechanism (not shown) or the like. Further, the molding die 1010, the resin molded article 1b, and the unnecessary resin portions 20d, 20e, and 20f are moved together in the direction of the arrow a24 (that is, outside the curing step) and further conveyed to the residue discharge stage (the unnecessary resin portion removal stage). in.

Further, as shown in (q) to (s) of FIG. 3, in the residual material discharge stage (the unnecessary resin portion removal stage), the unnecessary resin portion 20d is removed from the resin molded article.

As shown in (q) of FIG. 3, the residue discharge stage (the unnecessary resin portion removal stage) of the resin molding apparatus includes a residue discharge rod (unused resin removal member) 4000. Similarly to the first embodiment, the residual material discharge lever 4000 has the same shape as the plunger groove 3225 on the contact surface with the unnecessary resin portion 20d. Small groove (recess) 4001.

As shown in (q) of FIG. 3, the residual material discharge lever 4000 is raised in the direction of the arrow c21. As a result, as shown in FIG. 3(r), the residue discharge lever 4000 is brought into contact with the unnecessary resin portion 20d. At this time, as shown in the figure, the unnecessary resin portion (protrusion) 20e is fitted into the groove (concave portion) 4001 of the residual material discharge rod. In this state, as shown in the figure, the residual material discharge lever 4000 is rotated in the direction of the arrow d21. Thereby, the unnecessary resin portion 20d is twisted and separated from the unnecessary resin portion 20f in the lower mold cavity 211.

Thereafter, as shown in (s) of FIG. 3, the residual material discharge lever 4000 is lowered in the direction of the arrow c22. As a result, the unnecessary resin portions 20d and 20e connected to the residual material discharge lever 4000 are lowered as shown in the drawing, and are completely separated from the unnecessary resin portion 20f in the lower mold cavity 211. Further, as shown in the figure, the molding die 1010, the resin molded article 1b, and the unnecessary resin portion 20f are moved together in the direction of the arrow a25 (that is, outside the residue discharge step) by a transport mechanism (not shown) or the like, and Further transport to the discharge stage.

Further, as shown in (t) to (z2) of FIG. 3, the resin molded article 1b is released from the molding die 1010 in the discharge step (release step). As will be described later, the demolding step includes a first demolding step of demolding the cured resin 20 from the upper mold (another mold) 110 in a state of being fixed to the lower mold (one mold) 210, and a resin in the discharge stage. The second mold release step of releasing the molded product 1b from the molding die 1010 (lower die 210).

As shown in FIG. 3(t), the discharge stage provided in the resin molding apparatus includes a cooling stage 5010 and an upper mold lifting mechanism (upper mold lifting portion) 7000. The cooling stage 5010 has a cooling mechanism (cold flow) inside thereof Road) 5011. Further, the cooling stage 5010 includes an air supply hole 5012 that penetrates from the upper surface to the lower surface of the cooling stage 5010 at a position corresponding to the residual portion 212 of the lower mold 210 and the gate 213.

The demolding step (the first demolding step and the second demolding step) of (t) to (z2) of FIG. 3 first fixes the lower surface of the lower mold 210 to the cooling stage 5010 as shown in FIG. 3(t). . In this state, the molding die 1010 and the resin molded article 1b are cooled by the cooling stage 5010 and the cold runner 5011. This method is not particularly limited. For example, as shown in the figure, the discharge stage may further include a coolant supply mechanism 5200 and a pipe (coolant supply pipe) 5201. Then, by supplying and circulating the coolant from the coolant supply mechanism 5200 to the cold runner 5011 via the pipe 5201, the cooling stage 5010 can be cooled. At this time, in the same manner as in the first embodiment and the second embodiment, the resin molded article (package) 1b is larger than the lower mold 210 in terms of the shrinkage rate due to cooling. Therefore, when cooling is performed in the state of (t) of FIG. 3, a gap can be formed between the cured resin 20 of the resin molded article 1b and the upper mold cavity 111 and between the cured resin 20 and the lower mold cavity 211. Thereby, the resin molded product 1b is easily released from the molding die 1010. However, as described in Embodiment 1 and Embodiment 2, the present invention is not limited thereto.

Next, as shown in FIG. 3(u), the left and right mold opening suppressing members 300 are moved in the direction of the arrow e2 (that is, the direction separated from the molding die 1010), and are detached from the molding die 1010.

Then, as shown in (v) of FIG. 3, the upper mold lifting mechanism 7000 is lowered in the direction of the arrow F11. Thereby, as shown in (w) of FIG. 3, the upper mold 110 is brought into contact with and fixed to the lower surface of the upper mold lifting mechanism 7000. Further, as shown in (w) of FIG. 3, the upper mold lifting mechanism 7000 is raised in the direction of the arrow F12. by Thus, as shown in (x) of FIG. 3, the upper mold 110 is lifted up. At this time, since the unnecessary resin portion 20f remains in the flow path 214 and the second gate 215, the resin molded article 1b is easily fixed to the lower mold 210. In other words, in the molding die 1010 of the present embodiment, since the lower mold (one mold) 210 is provided with the flow path 214 and the second gate 215, and the lower mold (one mold) on the upper mold (the other mold) 110 The surface of the lower mold (one mold) 210 opposite to the upper mold (the other mold) 110 and the resin is in contact with the surface of the surface in contact with the resin (that is, the upper surface of the upper mold 110) 210 (also That is, the area of the bottom surface of the lower mold 210 is larger. That is, since the lower mold (one mold) 210 is provided with the flow path 214 and the second gate 215, the area on the upper mold 110 perpendicular to the mold opening direction and in contact with the resin (the upper surface of the upper mold 110) In contrast, the area on the lower mold 210 that is perpendicular to the mold opening direction and in contact with the resin (the bottom surface of the lower mold 210) is larger. Therefore, as shown in (x) of FIG. 3, the resin-molded cured resin 20 can be released from the upper mold (another mold) 110 in a state of being fixed to the lower mold (one mold) 210 (first demolding step) ).

Further, as shown in (y) of FIG. 3, air is supplied from the air supply hole 5012 in the direction of the arrow x21, that is, the resin molded article 1b is blown from the bottom to the top. Specifically, for example, as shown in the figure, the air may be supplied by the air supply means 5300 through the pipe (air supply pipe) 5301. The air supply mechanism 5300 is not particularly limited, and for example, an air pump or the like can be used. Thereby, the resin molded product 1b is released from the lower mold 210 (second demolding step). Thereafter, the resin molded product 1b is conveyed to the outside of the discharge stage by an unloader (transport mechanism, not shown) or the like. The resin molded article 1b can be produced as described above. In addition, the unnecessary resin portion 20f can be molded from a resin in other stages, for example. Product 1b is separated.

On the other hand, after the resin molded product 1b is transported to the outside of the discharge stage, the upper mold lifting mechanism 7000 is lowered. Then, as shown in (z) of Fig. 3, the upper mold 110 and the lower mold 210 are again closed.

Thereafter, only the upper mold lifting mechanism 7000 is raised and separated from the upper mold 110 as shown in (z3) of FIG. Thereafter, the molding die 1010 is moved in the direction of the arrow a26 by a transport mechanism (not shown) or the like and transported to the outside of the discharge stage. The method of manufacturing the resin molded article which is the same as the steps (a) to (y) of FIG. 3 can be performed again by the transfer of the molding die 1010 to the temperature rising step. Further, for example, the molding die 1010 can be cleaned before the method of manufacturing the resin molded article is performed again.

An example in which the curing stage is used and the resin in the molding die is cured in the curing stage is shown in the present embodiment (Example 3). However, in the present invention, the curing stage is arbitrary as described above, and may or may not be present.

In the present invention, for example, as in the first embodiment, the other mold of the molding die is fixed in the resin molding stage, and the one mold can be attached and detached with respect to the respective stages, and at the same time Move between stages. Further, for example, as in the second embodiment and the third embodiment, both the one mold and the other mold can be attached and detached with respect to each of the stages, and can be moved between the respective stages. In the case of the former, there is an advantage that only the one mold can be moved between the respective stages. In the latter case, there is an advantage that it is not necessary to align the one mold and the other mold in the forming stage. And, in In the former case (in the case where only one mold is moved), the resin must be completely cured (hardened) in the resin molding stage. In the case of the latter (in the case where one mold and the other mold are moved), the resin may be in a semi-cured (semi-hardened) state in the resin molding stage. As a result, the use time of the resin molding step in one cycle of the method for producing a resin molded article is shortened, so that the cycle can be accelerated and the manufacturing efficiency of the resin molded article can be improved. In order to completely cure (harden) the semi-cured (semi-hardened) state of the resin, for example, as explained in Example 3 and FIG. 4, a curing stage can be used. Further, in this case, in order to suppress or prevent leakage of the semi-cured (semi-hardened) state of the resin from the molding die, for example, as described in Embodiment 3, an open mold suppressing member can be used.

Although the first to third embodiments have been described above, the present invention is not limited thereto, and various modifications can be made. For example, in the first to third embodiments, the lower mold is the "one mold" of the present invention, and the upper mold is an example of the "another mold" of the present invention. However, the present invention is not limited thereto, and for example, the upper mold may be the "one mold" of the present invention, and the lower mold may be the "another mold" of the present invention.

Further, some modifications of the present invention will be described using Figs.

In the first to third embodiments, an example in which both the upper mold and the lower mold have a model cavity is shown. However, the molding die in the present invention as described above is not limited thereto. For example, in the present invention, in the molding die, only one of the upper mold and the lower mold may have a mold cavity. Fig. 5 is a cross-sectional view schematically showing an example of such a molding die. The molding die 1000 of FIG. 5 and the formations of Embodiments 1 and 2 The mold 1000 is identical and includes an upper mold (another mold) 100 and a lower mold (one mold) 200. Further, the molding die 1000 of FIG. 5 is the same as the molding die 1000 of the first and second embodiments except that the upper mold 100 does not have the upper mold cavity (the other mold cavity) 101. Further, the molding die of the present invention may be, for example, opposite to that of Fig. 5, except that the upper die has a mold cavity, and the lower die does not have a mold cavity.

Further, Fig. 6 schematically shows a modification of the lower mold (one mold) 200 of the first and second embodiments. Fig. 6(a) is a plan view showing a part of the lower mold 200, and Fig. 6(b) is a cross-sectional view. As shown in the figure, a groove (burr countermeasure groove) 208 is provided around the resin injection port (casting port) of the residue portion 202. The leaked resin is accommodated in the groove 208 by having the groove 208 even if the resin leaks from around the resin injection port. Thereby, it is possible to suppress or prevent molding defects and the like due to the thin burr (unused resin portion) of the leaked resin.

FIG. 7 schematically shows an example of the structure of the unnecessary resin portions 20d and 20e. Fig. 7 (a) is a side view, and Fig. 7 (b) is a front view. As shown in the figure, the projection 20e of the unnecessary resin portion has a convex shape of a "- (minus)" shape. As described in the above-described embodiment, the plunger (fluid resin injection member) is provided with a groove on the contact surface with the fluid resin, and a protrusion (protrusion) similar to the unnecessary resin portion 20e is formed in the shape of the groove. . Thus, as described in the above embodiment, for example, it is easy to remove the unnecessary resin portion using the residual material discharge rod (unused resin portion removing member). However, the invention is not limited thereto. For example, in a case where the fluid resin injection member is provided with at least one of a convex portion and a concave portion on the contact surface with the fluid resin, the shape of at least one of the convex portion and the concave portion is not limited to the groove shape. Can be any shape. And corresponding to at least one of the convex portion and the concave portion of the fluid resin injection member The shape of at least one of the convex portion or the concave portion formed in the unnecessary resin portion is not limited to the shape of 20e in Fig. 7, and may be any shape. For example, the protrusion 20e of Fig. 7 has the aforementioned "- (minus sign)" shape. However, the fluid resin injection member is provided with a concave portion or a convex portion having a "+ (plus)" shape on the contact surface with the fluid resin, and the unnecessary resin portion 20e may be used. A convex or concave shape of the "+ (plus)" shape. In addition, the shape of at least one of the convex portion and the concave portion provided on the contact surface with the unnecessary resin portion can be appropriately changed as the residual material discharge rod (the unnecessary resin portion removing member).

(a) and (b) of FIG. 8 each schematically show an example of the relationship between the form of the plunger (fluid resin injection member) and the form of the unnecessary resin portion. (a) of FIG. 8 is an example in which the unnecessary resin portion 20d (that is, the liquid resin cured) does not overflow from the outer periphery of the contact surface of the plunger 3213 with the unnecessary resin portion 20d. (b) of FIG. 8 is an example in which the unnecessary resin portion 20d overflows from the outer periphery of the abutting surface of the plunger 3213. In the case of (a) of FIG. 8, it is easy to suppress or prevent the fluid resin from overflowing from the outer periphery of the abutting surface of the plunger 3213. On the other hand, in the case of (b) of FIG. 8, it is easy to apply a force to the fluid resin by the plunger 3213.

According to the present invention, for example, since a member for taking out a resin molded article (for example, a jack or the like) can be omitted in the molding die, the molding die can be configured with a small number of components.

Further, the present invention is not limited to the above-described embodiments, and any and appropriate combinations, changes, or selections can be made as needed within the scope of the gist of the invention.

The priority of the Japanese Patent Application No. 2017-245620, filed on Dec. 21, 2011, the entire disclosure of which is incorporated herein by reference.

Claims (15)

A resin molding apparatus comprising a molding die, a temperature rising stage, a resin molding stage, and a discharging stage; the molding die includes one mold and another mold; and the resin molded product after the resin molding can be fixed in a state of the one mold The other mold is demolded; at least one of the one mold and the other mold can be mounted and detached with respect to each of the foregoing stages, and can be moved between the respective stages; the temperature rising stage heats the mold; the resin Resin molding is performed in the molding stage, and the resin molded article is released from the molding die in the discharge step, and the one mold includes a resin molded article fixing mechanism that fixes the resin molded article. A resin molding apparatus comprising a molding die, a temperature rising stage, a resin molding stage, and a discharging stage; the molding die includes one mold and another mold; and the resin molded product after the resin molding can be fixed in a state of the one mold The other mold is demolded; at least one of the one mold and the other mold can be installed and removed with respect to each of the foregoing stages, and can be moved between the respective stages; the temperature rising stage heats the forming mold; The resin molding stage is subjected to resin molding; the discharging step causes the resin molded article to be released from the molding die; compared with the area of the surface of the other die opposite to the one die and in contact with the resin, in the aforementioned one The area of the surface of the mold opposite to the other mold and which is in contact with the resin is larger, so that the resin molded article can be released from the other mold in a state of being fixed to the one mold. The resin molding apparatus according to claim 1 or 2, wherein the other mold is fixed to the resin molding stage; the one mold can be attached and detached with respect to each of the stages, and can be moved between the respective stages; In the resin molding stage, the resin molded article is further released from the other mold in a state of being fixed to the one mold, and the resin molded article is released from the one mold of the molding die in the discharge step. The resin molding apparatus according to claim 1 or 2, wherein the one mold and the other mold can be attached and detached with respect to each of the stages, and can be moved between the respective stages; and the discharging step causes the resin The molded article is released from the other mold in a state of being fixed to the one mold, and the resin molded article is further released from the one mold of the molding die. The resin molding apparatus according to claim 1 or 2, which further comprises a curing stage; the aforementioned curing stage cures the resin in the aforementioned molding die. The resin molding apparatus according to claim 1 or 2, further comprising a fluid resin injection member that injects a fluid resin into one mold cavity, and an unnecessary resin portion removal member that removes the unnecessary resin portion from which the fluid resin is cured; The fluid resin injection member includes at least one of a convex portion and a concave portion on a contact surface with the fluid resin, and the unnecessary resin removal member includes a convex portion and a concave portion on a contact surface with the unnecessary resin portion. at least one. The resin molding apparatus according to claim 1 or 2, further comprising a mold opening suppressing member that suppresses the mold opening and the mold opening of the other mold. The resin molding apparatus according to claim 1 or 2, further comprising a temperature rising mechanism for raising the temperature of the molding die and a resin molding product cooling mechanism for cooling the resin molded article. A method for producing a resin molded article, which comprises using a molding die comprising one mold and another mold, and comprising the steps of: a temperature increasing step of heating the forming mold in a temperature rising stage; and a resin molding resin forming in a resin molding stage a first demolding step of demolding the resin molded product from the other mold by fixing the resin molded article to the one mold by a resin molding fixing mechanism; and A second demolding step of releasing the resin molded article from the one mold in the discharge step. A method for producing a resin molded article, which comprises using a molding die comprising one mold and another mold, and comprising the steps of: a temperature increasing step of heating the forming mold in a temperature rising stage; and a resin molding resin forming in a resin molding stage a first demolding step of releasing the resin-molded resin molded article from the other mold in a state of being fixed to the one mold; and releasing the resin molded article from the one mold in the discharging step a second demolding step; an area of the surface of the one mold opposite to the other mold and in contact with the resin, compared with the area of the surface of the other mold opposite to the one mold and in contact with the resin Further, it is possible to release the resin molded article from the other mold in a state of being fixed to the one mold in the first demolding step. The method for producing a resin molded article according to claim 9 or 10, further comprising a resin curing step of curing the resin in the molding die in a curing stage. The method for producing a resin molded article according to claim 9 or 10, further comprising a fluid resin injection step of injecting a fluid resin into a mold cavity using a fluid resin injection member; and removing the fluidity by using a resin removal member Resin curing The unnecessary resin portion removing step of the unnecessary resin portion; the fluid resin injection member includes at least one of a convex portion and a concave portion on a contact surface with the fluid resin; and the unnecessary resin removing member and the unnecessary resin At least one of the convex portion and the concave portion is provided on the abutting surface of the portion. The method for producing a resin molded article according to claim 9 or 10, wherein in the resin molding step, the mold opening inhibiting member is used to suppress mold opening of the one mold and the other mold. The method for producing a resin molded article according to claim 9 or 10, wherein in the demolding step, the resin molded article is cooled while the molding die is heated. The method for producing a resin molded article according to claim 9 or 10, which is carried out by using the resin molding apparatus described above in claim 1 or 2.