WO2018100807A1 - Compression molding device, compression molding method, and method for producing compression-molded article - Google Patents

Compression molding device, compression molding method, and method for producing compression-molded article Download PDF

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Publication number
WO2018100807A1
WO2018100807A1 PCT/JP2017/028752 JP2017028752W WO2018100807A1 WO 2018100807 A1 WO2018100807 A1 WO 2018100807A1 JP 2017028752 W JP2017028752 W JP 2017028752W WO 2018100807 A1 WO2018100807 A1 WO 2018100807A1
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WO
WIPO (PCT)
Prior art keywords
resin
mold
surplus
compression molding
substrate
Prior art date
Application number
PCT/JP2017/028752
Other languages
French (fr)
Japanese (ja)
Inventor
田村　孝司
高橋　範行
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020197007827A priority Critical patent/KR102259426B1/en
Priority to CN201780056077.2A priority patent/CN109689330B/en
Publication of WO2018100807A1 publication Critical patent/WO2018100807A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating

Definitions

  • the present invention relates to a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product.
  • the thickness of the package may also vary.
  • an object of the present invention is to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variation in package thickness.
  • the compression molding apparatus of the present invention comprises: Including molds, The mold is Upper mold, Lower mold, Mold cavity to which resin material is supplied; A positioning mechanism for holding the depth of the mold cavity at a predetermined depth during mold clamping; A surplus resin container for accommodating surplus resin that is not accommodated in the mold cavity at the time of mold clamping; An excess resin separating member, After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member is raised or lowered relative to one or both of the upper mold and the lower mold, so that the inside of the mold cavity The resin cured in step (b) is separated from the surplus resin cured in the surplus resin container.
  • the compression molding method of the present invention comprises: A resin material supply step of supplying a resin material into the mold cavity of the mold, A mold clamping step of clamping the upper mold and the lower mold of the mold; A surplus resin housing step of housing surplus resin that is not housed in the mold cavity in the mold clamping step; A mold opening step of opening the upper mold and the lower mold; A surplus resin separation step of separating the surplus resin from the resin cured in the mold cavity,
  • the surplus resin separation step is performed by raising or lowering the surplus resin separation member relative to one or both of the upper mold and the lower mold after the resin in the mold cavity and the surplus resin are cured. It is characterized by.
  • the method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention.
  • the present invention it is possible to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variation in package thickness.
  • FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a molding die in the compression molding apparatus of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing one step in an example of the compression molding method of the present invention using the mold of FIG.
  • FIG. 3 is a cross-sectional view schematically showing another step of the compression molding method of FIG.
  • FIG. 4 is a cross-sectional view schematically showing still another process of the compression molding method of FIG.
  • FIG. 5 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 6 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 7 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 8 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 9 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 10 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 11 is a cross-sectional view schematically showing another example of the configuration of the molding die in the compression molding apparatus of the present invention.
  • FIG. 12 is a cross-sectional view schematically showing still another example of the configuration of the molding die in the compression molding apparatus of the present invention.
  • FIG. 13 is a cross-sectional view schematically showing one step in another example of the compression molding method of the present invention using the mold of FIG. FIG.
  • FIG. 14 is a cross-sectional view schematically showing another step of the compression molding method of FIG.
  • FIG. 15 is a cross-sectional view schematically showing still another step of the compression molding method of FIG.
  • FIG. 16 is a plan view schematically showing an example of the configuration of the compression molding apparatus of the present invention.
  • FIGS. 17A to 17C are plan views schematically showing an example of the configuration of the compression molded product and surplus resin produced according to the present invention, respectively.
  • 18 (a) to 18 (c) are plan views schematically showing still another example of the configuration of the compression molded product and the surplus resin, respectively.
  • the molding die is a molding die for resin-sealing one surface of a substrate, and one of the upper die and the lower die has the die cavity.
  • the other mold may be a mold on which the substrate is fixed. In this case, for example, when the upper mold and the lower mold are clamped, the end portion of the substrate on the side of the surplus resin accommodating portion is the mold surface of the other mold and the end portion of the surplus resin separating member. It may be configured to be sandwiched between.
  • the mold is a mold for resin-sealing one surface of the substrate,
  • One of the upper mold and the lower mold has the mold cavity
  • the other mold is a mold on which the substrate is fixed.
  • the one mold has a bottom member and a side member, The bottom member is fixed to a base member;
  • the side member is connected to the base member via an elastic member,
  • the mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
  • the positioning mechanism includes a stopper fixed to the base member; When the upper mold and the lower mold are clamped, the side surface member may come into contact with the stopper, so that the depth of the mold cavity may be held at a predetermined depth.
  • the compression molding apparatus of the present invention may further include, for example, a control unit that controls the operation of the mold. Further, for example, the control unit may control clamping of the mold, and the positioning mechanism may include the control unit.
  • the compression molding apparatus of the present invention is, for example, And a control unit for controlling the operation of the mold.
  • the mold is a mold for resin-sealing one surface of the substrate, One of the upper mold and the lower mold has the mold cavity, and the other mold is a mold on which the substrate is fixed.
  • the one mold has a bottom member and a side member, The bottom member is fixed to a base member; The side member is connected to the base member via an elastic member, The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
  • the positioning mechanism includes the control unit; When the upper mold and the lower mold are clamped, one or both of the ascending position and the descending position of one or both of the upper mold and the lower mold are controlled by the control unit, so that the mold cavity The depth may be held at a predetermined depth.
  • the compression molding apparatus of the present invention further includes, for example, a resin pressurizing member that can move up and down with respect to the surplus resin containing portion, and the resin pressurizing member allows the inside of the mold cavity and the surplus resin containing portion.
  • the resin may be pressurized.
  • the compression molding apparatus of the present invention may further include, for example, a surplus resin housing portion resin material supply mechanism that supplies a resin material to the surplus resin housing portion.
  • the surplus resin separating member may be capable of being fixed by sandwiching the surplus resin between the surplus resin housing portion, for example.
  • the molding die is a molding die for resin-sealing one surface of a substrate, and one of the upper die and the lower die has the die cavity.
  • the other mold may be a mold on which the substrate is fixed.
  • the end portion of the substrate on the side of the surplus resin accommodating portion may be sandwiched between the mold surface of the other mold and the end portion of the surplus resin separating member. Good.
  • the mold is a mold for resin-sealing one surface of the substrate,
  • One of the upper mold and the lower mold has the mold cavity
  • the other mold is a mold on which the substrate is fixed.
  • the one mold has a bottom member and a side member, The bottom member is fixed to a base member;
  • the side member is connected to the base member via an elastic member,
  • the mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
  • the positioning mechanism includes a stopper fixed to the base member;
  • the mold cavity may be held at a predetermined depth by bringing the side member into contact with the stopper during the mold clamping step.
  • the mold has a resin pressure member that can move up and down with respect to the surplus resin container, and in the mold clamping step, the mold is formed by the resin pressure member.
  • the resin in the cavity and the excess resin container may be pressurized.
  • a resin material may be supplied also to the surplus resin container.
  • the apparatus for performing the compression molding method of the present invention is not particularly limited, and for example, the compression molding apparatus of the present invention can be used.
  • each step in the compression molding method of the present invention is not particularly limited. That is, as long as it can be performed, each step in the compression molding method of the present invention may be performed in any order, and a plurality of steps may be performed simultaneously.
  • the method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention.
  • the production method of the compression molded product of the present invention is not particularly limited, and includes, for example, other steps than the step of compression molding the resin by the compression molding method of the present invention (compression molding step). It does not have to be included.
  • the other steps are not particularly limited, and may be, for example, a cutting step in which an intermediate product manufactured by the compression molding step is cut to separate a final compression molded product.
  • an intermediate product is manufactured by compression molding (resin sealing) a plurality of chips arranged on one substrate by the compression molding step, and further, the intermediate product is cut by the cutting step. Then, individual chips may be separated into compression molded products (finished products) sealed with resin.
  • thermosetting resins such as an epoxy resin and a silicone resin
  • thermoplastic resin there may be.
  • it may be a composite material partially including a thermosetting resin or a thermoplastic resin.
  • the form of the resin supplied to the resin sealing device include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powder-like resin.
  • the “fluid resin” is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin.
  • the term “liquid” means fluidity at normal temperature (room temperature) and fluidity by applying a force, regardless of the degree of fluidity, in other words, the degree of viscosity. That is, in the present invention, the “liquid resin” refers to a resin that has fluidity at room temperature (room temperature) and flows when a force is applied.
  • the “molten resin” refers to a resin that is in a liquid or fluid state by melting, for example.
  • the form of the said molten resin is not specifically limited, For example, it is a form which can be supplied to the cavity etc. of a shaping
  • the term “electronic component” refers to a chip before resin-sealing and a state in which the chip is resin-sealed, but in the present invention, simply referred to as “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin.
  • the “chip” means a chip in which at least a part is exposed without being resin-sealed, and a chip before resin sealing, a chip partially sealed with resin, or a plurality of chips. A chip in which at least one of them is exposed without being resin-sealed is also included.
  • the “chip” in the present invention includes chips such as ICs, semiconductor chips, and semiconductor elements for power control.
  • the “chip” in the present invention includes a flip chip.
  • a chip in which at least a part is exposed without being resin-sealed is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin-sealing.
  • the “chip” in the present invention is not particularly limited as long as at least a part of the chip is exposed without being sealed with resin, and may not be in a chip shape.
  • the entire chip may be resin-encapsulated, but only a part may be resin-encapsulated.
  • the mold 10 includes an upper mold 100 and a lower mold 200.
  • the mold 10 is a mold for resin-sealing one surface of the substrate.
  • the lower mold 200 has a mold cavity (lower mold cavity) 204, and the upper mold 100 is a mold on which the substrate is fixed.
  • the lower mold 200 includes a bottom member (lower mold bottom member) 202 and a side member (lower mold side member) 203.
  • the lower mold bottom member 202 is fixed to the base member 201.
  • the lower mold side member 203 is connected to a base member (lower mold base member or lower mold base block) 201 via elastic members 208, 209 and 210.
  • each elastic member in the compression molding apparatus of FIG. 1 is not specifically limited, For example, a spring etc. may be sufficient.
  • a lower mold cavity 204 is formed by a space surrounded by the upper surface of the lower mold bottom surface member 202 and the inner peripheral surface of the lower mold side surface member 203. Stoppers 207 are fixed to both ends of the upper surface of the lower mold base member 201, respectively.
  • the stopper 207 corresponds to at least a part of the “positioning mechanism” of the compression molding apparatus including the molding die 10.
  • the lower mold side surface member 203 further has an excess resin accommodating portion 205 that accommodates an excess resin not accommodated in the lower mold cavity 204 when the mold is clamped.
  • the lower mold cavity 204 and the surplus resin container 205 are connected, and the resin can move.
  • the lower mold 200 further includes a resin pressure member 206 that can move up and down with respect to the surplus resin container 205.
  • the resin pressure member 206 is not particularly limited, but may be a resin pressure pin, for example.
  • the resin pressure member 206 is connected to the lower mold base member 201 via the elastic member 211.
  • the lower mold side member 203 has a through hole penetrating from the bottom surface of the surplus resin accommodating portion 205 to the lower surface (lower end) of the lower mold side member 203, and the resin pressure member 206 can move up and down in the through hole. Then, the resin pressurizing member 206 pressurizes the resin in the lower mold cavity 204 and the surplus resin accommodating portion 205.
  • the upper mold 100 includes an upper mold base member (upper mold base block) 101, a substrate set part (upper mold substrate set part) 102, and an excess resin separation member (excess resin separation block) 103.
  • the upper mold substrate setting portion 102 is fixed to the lower surface (lower end) of the upper mold base member 101.
  • a substrate can be fixed to the lower surface (lower end) of the upper mold substrate setting unit 102 by a substrate fixing member (not shown) or the like.
  • the substrate fixing member is not particularly limited, and examples thereof include a clamp.
  • the surplus resin separating member 103 is fixed to the lower surface (lower end) of the upper mold base member 101 via the elastic member 104, and can move up and down in a hole opened in the upper mold substrate setting portion 102.
  • the surplus resin separating member 103 is disposed immediately above the surplus resin accommodating portion 205, and the surplus resin can be pressed by the surplus resin separating member 103.
  • the lower substrate side (lower mold cavity 204 side) end of the excess resin separating member 103 forms a protruding portion that protrudes in the horizontal direction as shown in the figure.
  • the end portion of the substrate on the surplus resin housing portion 205 side is the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting section 102) and the surplus resin separating member.
  • the projection 103 (end portion) 103 is sandwiched between them.
  • compression molding method compression molding product manufacturing method using the compression molding apparatus of FIG. 1 can be performed, for example, as shown in the process cross-sectional views of FIGS.
  • the substrate 1 and the release film 2 are set on the mold 10. More specifically, it is as follows. That is, as illustrated, the substrate 1 is set on the lower surface of the upper mold substrate setting unit 102. At this time, for example, the substrate 1 may be transported to the position of the upper mold substrate setting unit 102 using a substrate transport mechanism (not shown). Further, for example, a substrate shifting mechanism (substrate shifting member) may be provided in the mold 10 or the substrate transport mechanism. Then, after the substrate 1 is transported, the substrate 1 may be pressed against the surplus resin separation member 103 by the substrate shifting mechanism.
  • a substrate shifting mechanism substrate shifting member
  • the substrate 1 can be fixed (set) to the lower surface of the upper mold substrate setting portion 102 by a substrate fixing member (not shown) or the like.
  • a substrate suction hole (not shown) is provided at an appropriate position on the lower surface of the upper mold substrate setting unit 102, and the inside of the substrate suction hole is sucked by a suction mechanism (a suction pump or the like, not shown).
  • the substrate 1 may be sucked and fixed to the lower surface of the upper mold substrate setting unit 102.
  • An arbitrary number of one or more types of arbitrary components may be mounted on the lower surface of the substrate 1 or may not be mounted.
  • the optional component include, but are not limited to, a chip, a wire, an electrode, and a capacitor (passive element). These parts may be resin-sealed by compression molding.
  • the release film 2 is adsorbed (set) to the entire upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203, and the resin pressure member 206).
  • the entire mold surfaces of the lower mold cavity 204 and the excess resin container 205 are covered with the release film 2.
  • suction holes are provided at appropriate locations on the upper surface of the lower mold 200, and the suction holes (suction pump, etc., not shown) are sucked into the suction holes to reduce the pressure.
  • the release film 2 may be adsorbed on the upper surface of the mold 200.
  • the substrate 1 and the release film 2 may be transported to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown), and then set as shown in FIG. Good.
  • the transport mechanism (substrate transport mechanism) for the substrate 1 is as described above.
  • a resin material (granular resin) 20a is supplied (set) into the lower mold cavity 204 (resin material supply step). At this time, the resin material 20a is supplied slightly more than the amount required for compression molding (the amount corresponding to the target package thickness or package volume).
  • the resin material 20a is a granular resin in a figure, as above-mentioned, it is not limited to this. 2 and 3 show an example in which the resin material 20a is supplied (set) after the release film is set, the present invention is not limited to this.
  • the transfer material conveys the resin material 20a together with the release film 2 to a position between the upper mold 100 and the lower mold 200. Then, the resin material 20 a may be supplied (set) by adsorbing the release film 2 to the upper surface of the lower mold 200.
  • the resin material (granular resin) 20a is melted to obtain a fluid resin (molten resin) 20b.
  • the melting of the resin material 20a can be performed, for example, by heating (heating) the lower mold 200 with a heating mechanism (heater, not shown).
  • the lower mold 200 may be heated (heated up) in advance.
  • the upper mold 100 may be heated (heated up) by a heating mechanism (heater, not shown). In this case, the upper mold 100 may be heated (heated up) prior to the process of FIG. 3 (resin material supply process).
  • FIGS. 5 to 7 a process (clamping process) of clamping the upper mold 100 and the lower mold 200 is performed.
  • the entire lower mold 200 is raised in the direction of the arrow X ⁇ b> 1, and the surplus resin separation member 103 and the surplus resin container 205 are brought into contact via the release film 2.
  • the entire lower mold 200 is further raised.
  • the excess resin separation member 103 is pushed up by the lower mold side member 203, and the elastic member 104 contracts.
  • the end portion of the substrate 1 on the surplus resin accommodating portion 205 side is the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting portion 102) and the protruding portion of the surplus resin separating member 103. (End). Accordingly, since the flowable resin is suppressed or prevented from flowing into the end portion of the substrate 1 on the surplus resin housing portion 205 side, it is possible to suppress or prevent the resin from adhering to the end portion.
  • the end portion of the substrate 1 opposite to the surplus resin housing portion 205 is sandwiched between the upper mold substrate setting portion 102 and the lower mold side member 203 as shown in FIG.
  • type side surface member 203 do not contact directly, but contact
  • a resin passage 205 a is formed between the lower mold cavity 204 and the surplus resin container 205.
  • the fluid resin 20b can move between the lower mold cavity 204 and the surplus resin container 205 through the resin passage 205a.
  • the lower mold base member 201 is further raised.
  • the lower mold side member 203 is in direct or indirect contact with the upper mold 100 as described above, it does not rise any further.
  • the lower mold bottom member 202 and the resin pressure member 206 rise together with the lower mold base member 201, and the elastic members 208, 209, 210, and 211 contract.
  • the stopper 207 contacts the lower mold side surface member 203, so that the lower mold base member 201 does not rise any further and is fixed at that position. Therefore, the depth of the lower mold cavity 204 is a predetermined depth. Retained.
  • the lower mold cavity 204 is filled with the fluid resin 20b.
  • the surplus fluid resin 20b (surplus resin) flows into the surplus resin container 205 through the resin passage 205a, and is filled as the surplus fluid resin (surplus resin) 20c.
  • the extension force of the elastic member 211 is transmitted to the resin pressure member 206, so that the resin pressure member 206 causes the fluid resin 20b in the lower mold cavity 204 and the fluid resin in the excess resin container 205 (surplus) Resin) 20c is pressurized.
  • the elastic member 211 can be expanded and contracted, the resin pressure member 206 can be moved up and down, whereby the capacity of the surplus resin container 205 can be changed.
  • a process of opening the upper mold 100 and the lower mold 200 is performed.
  • a process of separating the excess resin in the excess resin housing portion 205 from the resin cured in the lower mold cavity 204 is performed substantially simultaneously.
  • the lower mold base member 201 is lowered in the direction of the arrow X4.
  • the cured resin (sealing resin) cured in the lower mold cavity 204 is indicated by reference numeral 20, and the excess resin cured at other locations (in the excess resin accommodating portion 205 and in the resin passage 205 a) , 20d.
  • the fluidizing resins 20b and 20c are cured (solidified) when the fluidizing resins 20b and 20c are thermosetting resins. And 20c may be continued.
  • the fluid resins 20b and 20c are thermoplastic resins, for example, the fluid resins 20b and 20c can be solidified by stopping the heating of the mold 10 and leaving it for a while. Then, as the lower mold base member 201 descends, as shown in FIG. 8, the lower mold bottom surface member 202 and the resin pressure member 206 descend together with the lower mold base member 201, and from the bottom surface of the cured resin 20 and the cured excess resin 20 d. Torn apart.
  • the entire lower mold 200 is further lowered.
  • the lower mold side member 203 is separated from the cured resin 20 cured in the lower mold cavity 204.
  • the surplus resin separation block 103 is lowered together with the lower mold 200 by the restoring force (extension force) of the elastic member 104. That is, the surplus resin separation block 103 is lowered relative to the upper mold 100.
  • the cured surplus resin 20d is also lowered together with the lower mold 200 and the surplus resin separation block 103.
  • the cured resin (sealing resin) 20 cured in the lower mold cavity 204 remains separated from the excess resin 20d because it remains fixed to the upper mold substrate set portion 102 together with the substrate 1.
  • the compression molded product (resin molded product) 30 formed from the cured resin (sealing resin, package) 20 and the substrate 1 can be separated from the surplus resin 20d.
  • the entire lower mold 200 is further lowered to a predetermined position (the same position as in FIGS. 1 to 4, before the mold clamping).
  • the surplus resin 20d is separated from the surplus resin container 205.
  • the cured surplus resin 20d may be removed from the mold 10 by separating (releasing) from the surplus resin separation block 103 and then transporting it to the outside of the mold 10 using a transport mechanism (not shown). Good.
  • the compression molding method using the compression molding apparatus of FIG. 1 can be performed. This compression molding method is also a method for manufacturing the compression molded product 30.
  • FIGS. 1 to 10 show an example in which the release film 2 is set in the lower mold 200, but the compression molding method can be performed without using the release film.
  • compression molding is used as the resin molding method.
  • Transfer molding has the advantage that the resin thickness (package thickness) of the resin molded product can be easily maintained because the amount of resin in the mold cavity during molding is easily kept constant.
  • the resin flow since resin flows into the mold cavity during molding, the resin flow causes defective parts of the resin molded product (for example, deformation, cutting, contact, etc. of the wire), voids (bubbles), unfilled There is a risk of problems such as parts.
  • the following methods can be considered. That is, a molding resin containing a surplus amount in addition to the amount necessary for compression molding is previously stored in the mold cavity of the compression mold. Then, at the time of compression molding (die clamping), the excess resin flows out from the mold cavity so that only the amount of the resin necessary for compression molding remains in the mold cavity. After the compression molding, the compression molded product (resin molded product) is removed from the mold together with the excess resin. Thereafter, the excess resin is separated from the compression molded product outside the mold.
  • the resin molded product and the excess resin can be separated in the molding die without taking out the resin molded product and the excess resin from the molding die. That is, according to the present invention, a compression molding method including a step of separating the excess resin can be easily performed. Thereby, as above-mentioned, it is possible to suppress the dispersion
  • FIGS. 11 (a) and 11 (b) show another example of a molding die in the compression molding apparatus of the present invention.
  • this mold 10a is the same as the mold 10 of FIGS. 1 to 10 except that it has an ejector pin 105.
  • 210 of the elastic members 208, 209, and 210 connecting the lower mold side member 203 and the lower mold base member 201 is omitted, but is not limited to this, and is the same as in FIGS.
  • the elastic member 210 may be provided.
  • the ejector pin 105 can move up and down in a through-hole penetrating from the upper end (upper surface) of the upper mold substrate setting portion 102 to the lower end (lower surface) of the surplus resin separating member 103.
  • An ejector pin support member (brim) 106 is fixed to the upper end of the ejector pin 105.
  • the upper mold base member 101 is partially cut out to form an accommodating portion for the ejector pin support member 106.
  • the lower end (lower surface) of the ejector pin support member 106 is connected to the upper mold base member 101 and the upper mold substrate setting section 102 via the elastic member 107 at the bottom surface of the housing section.
  • the ejector pin 105 passes through the elastic members 104 and 107.
  • FIG. 11A shows a state after performing the same steps as in FIGS. That is, FIG. 11A shows a state where the entire lower mold 200 is lowered to a predetermined position as indicated by an arrow X6 in FIG. As illustrated, the cured excess resin 20 d is attached to the lower end (lower surface) of the excess resin separation member 103 in a state of being separated from the resin molded product 30. From this state, as shown in FIG. 11B, the ejector pin support member 106 is pushed down in the direction of the arrow Y1, and the ejector pin 105 is lowered.
  • the excess resin 20d can be pushed down and separated (released) from the excess resin separation member 103.
  • the surplus resin 20d after being separated (released) from the surplus resin separation block 103 may be removed from the mold 10 by, for example, transporting it outside the mold 10 using a transport mechanism (not shown).
  • FIG. 12 shows still another example of the configuration of the molding die in the compression molding apparatus of the present invention.
  • This mold 10b has two lower mold cavities and can compress and mold two substrates substantially simultaneously. More specifically, as shown in the figure, the molding die 10 b has two lower mold cavities 204, which are arranged on both sides with the surplus resin accommodating portion 205 interposed therebetween. The two lower mold cavities 204 are respectively connected to the surplus resin accommodating portion 205, and the resin can move between the lower mold cavity 204 and the surplus resin accommodating portion 205.
  • Two substrates can be set by setting (fixing) the substrates on the lower surface (lower end) of the upper mold substrate setting portion 102 at positions just above the two lower mold cavities 204, respectively. Except for these, the mold 10b in FIG. 12 is the same as the mold 10 in FIGS.
  • FIG. 12 shows a state in which the granular resin 20a is supplied (set) into the lower mold cavity 204 without using a release film, but the present invention is not limited to this, and the mold release is performed as in FIGS. A film may be used.
  • FIG. 13 to 15 schematically show a resin material supply process in another example of the compression molding method using the mold of Example 1 (FIGS. 1 to 10).
  • the resin material supply step step of supplying the resin material into the mold cavity of the mold
  • the surplus resin container resin material supply mechanism is used in addition to supplying the resin material into the mold cavity. Resin material is supplied to the surplus resin container.
  • the substrate 1 and the release film 2 are set as in FIG.
  • two resin supply mechanisms 40 containing a resin material (granular resin) 20 a are inserted between the upper mold 100 and the lower mold 200.
  • One of the two resin supply mechanisms 40 functions as a “mold cavity resin material supply mechanism” that supplies the resin material 20 a into the mold cavity 204, and the other supplies the resin material 20 a into the surplus resin container 205. It functions as a “surplus resin container resin material supply mechanism”.
  • the resin supply mechanism 40 is comprised from the resin supply part 41 and the lower shutter 42 as shown in the figure.
  • the resin supply unit 41 has a frame shape in which openings are formed at the upper end and the lower end.
  • the opening at the lower end of the resin supply unit (frame) 41 is closed by a lower shutter 42. Accordingly, as shown in FIG. 13, the resin material 20 a can be accommodated in a space surrounded by the resin supply part (frame) 41 and the lower shutter 42.
  • the lower shutter 42 is pulled (horizontally) in the directions of arrows a1 and a2 to open the lower end of the resin supply unit (frame) 41, thereby dropping the resin material 20a from the opening. .
  • the resin material 20a can be supplied (placed) in the lower mold cavity 204 and the excess resin container 205.
  • the resin material 20a is supplied into the lower mold cavity 204 and the excess resin storage portion 205 as shown in FIG. It will be in the state.
  • compression molding can be performed by the same steps as in FIGS.
  • the flow of the resin can be suppressed to a smaller level in the compression molding process.
  • problems such as defective parts of the resin molded product (for example, wire deformation / cutting / contact, chip shift, etc.), voids (bubbles), unfilled portions, etc. can be more effectively suppressed or prevented. .
  • the resin material is supplied almost simultaneously using the “mold cavity resin material supply mechanism” and the “surplus resin container resin material supply mechanism”, but the method of supplying the resin material to the surplus resin container is shown. Is not limited to this.
  • the order of supplying the resin material 20a to the lower mold cavity 204 and the surplus resin container 205 is substantially the same in FIGS. 13 to 15, but is not limited to this, and either one may be first.
  • 13 to 15 use two resin supply mechanisms 40, the present invention is not limited to this.
  • only one resin supply mechanism 40 may be used, and thereby the resin material 20a may be supplied to the lower mold cavity 204 and the surplus resin container 205 over time rather than substantially simultaneously.
  • the resin supply mechanism 40 including the resin supply unit 41 and the lower shutter 42 is used. May be used.
  • FIG. 16 is a plan view schematically showing a configuration of another example of the compression molding apparatus of the present invention.
  • the compression molding apparatus 1000 includes a molding unit 1100, a substrate supply unit 1200, a resin material supply unit 1300, and a control unit 1400.
  • the substrate supply unit 1200 and the resin material supply unit 1300 are arranged on opposite sides of the molding unit 1100.
  • a substrate supply mechanism 1210 is disposed in the substrate supply unit 1200.
  • a resin material supply mechanism 1310 is arranged in the resin material supply unit 1300.
  • the controller 1400 is disposed in the substrate supply unit 1200.
  • a molding die (not shown) is arranged in the molding unit 1100.
  • molding die is not specifically limited except having the characteristic as a shaping
  • the mold may be the same as the mold 10 of Example 1 (FIGS. 1 to 10), the mold 10a of Example 2 (FIG. 11), or the mold 10b of Example 3 (FIG. 12).
  • the 16 can be used in the compression molding method or the method of manufacturing a compression molded product of the present invention.
  • the specific method of use is not particularly limited, and for example, it can be used in the compression molding method or the method of manufacturing a compression molded product described in Examples 1 to 4.
  • the compression molding apparatus of FIG. 16 can be used as follows, for example.
  • a substrate for compression molding can be placed in the substrate supply mechanism 1210 in the substrate supply unit 1200, and the substrate can be supplied to the mold.
  • the substrate may be transported to the position of the mold by a substrate transport mechanism (not shown).
  • the substrate transport mechanism may be disposed in the substrate supply unit 1200, for example.
  • a resin material can be placed in the resin material supply mechanism 1310 in the resin material supply unit 1300, and the resin material can be supplied into the mold cavity of the mold (resin material supply process).
  • the resin material may be transported to the position of the mold by a resin material transport mechanism (not shown). What is necessary is just to arrange
  • the resin material transport mechanism may transport the resin material using, for example, the resin supply mechanism 40 described in the fourth embodiment (FIGS. 13 to 15).
  • control unit 1400 controls part or all of the operation of the compression molding apparatus 1000 of FIG.
  • the operation controlled by the control unit 1400 may be, for example, part or all of the steps in the compression molding method or compression molding product manufacturing method of the present invention.
  • one or both of mold clamping and mold opening of the molding die may be performed.
  • a process may be included.
  • the mold clamping may be controlled by the control unit 1400, and the depth of the mold cavity at the time of mold clamping may be held at a predetermined depth.
  • the control unit 1400 functions as at least a part of the “positioning mechanism” in the compression molding apparatus of the present invention.
  • the “positioning mechanism” may use, for example, a stopper fixed to the base member as described in the first to fourth embodiments in addition to the mold clamping control by the control unit.
  • the operation controlled by the control unit 1400 includes, for example, substrate supply to the mold by the substrate supply unit 1200 (substrate supply process), and resin material into the mold cavity of the mold by the resin material supply unit 1300.
  • the supply (resin material supply step) may or may not be included.
  • the arrangement of the molding unit 1100, the substrate supply unit 1200, the resin material supply unit 1300, and the control unit 1400 is not limited to the arrangement shown in FIG.
  • the number of the forming units 1100 is three in FIG. 16, the number is not limited to this and is arbitrary, and may be one, two, or four or more.
  • a plurality of molding units 1100 are provided as shown in FIG. 16, for example, a plurality of substrates can be compression-molded substantially simultaneously, and compression molding efficiency is good.
  • the other surface of the substrate can be compression-molded by another molding unit 1100. That is, it can cope with compression molding on both sides of the substrate.
  • the compression molding apparatus 1000 in FIG. 16 may or may not have any other unit or mechanism not shown.
  • Examples of the other arbitrary unit or mechanism include a release film supply unit that supplies a release film to a mold.
  • the release film supply unit may include, for example, a release film supply mechanism in which the release film is disposed, and a release film transport mechanism that transports the release film to the position of the mold.
  • FIGS. 17 (a) to 17 (c) each show an example of the structure of the compression molded product and excess resin produced according to the present invention.
  • FIGS. 17A to 17C the state before the excess resin is separated from the resin molded product including the substrate 1 and the cured resin 20 (for example, the state of FIG. 8 in the first embodiment).
  • the state before the excess resin is separated from the resin molded product including the substrate 1 and the cured resin 20 (for example, the state of FIG. 8 in the first embodiment).
  • FIG. 17A to FIG. 17C one surface of the substrate 1 is resin-sealed with a cured resin 20 except for its peripheral edge. Further, the cured surplus resin 20 d is connected to the cured resin 20 and protrudes from the outer periphery of the substrate 1.
  • FIG. 17A shows a form in which the excess resin 20 d protrudes from one side of the substrate 1.
  • FIG. 17B shows a form in which the excess resin 20 d protrudes from the left and right sides of the substrate 1.
  • FIG. 17 (c) shows an example in which two compression molded products are connected to each other at a portion of the cured resin 20 via an excess resin 20d.
  • FIG. 17A can be manufactured using, for example, the mold of Example 1 (FIGS. 1 to 10).
  • FIG. 17B can be manufactured using, for example, a mold (not shown) in which surplus resin containing portions are arranged on both the left and right sides of the mold cavity.
  • FIG.17 (c) can be manufactured using the shaping
  • FIGS. 18 (a) to 18 (c) show examples of configurations of compression molded products and surplus resin that can be manufactured by the present invention or a general resin molding method, respectively.
  • FIG. 18A shows an example of the configuration of a resin molded product that can be manufactured by a general resin molding method.
  • one surface of the substrate 1 is resin-molded with a cured resin 20.
  • the cured resin 20 includes excess resin at the peripheral edge.
  • the surplus resin does not protrude from the outer periphery of the substrate 1.
  • the surplus resin is not separated from the resin molded product and constitutes a part of the resin molded product (product).
  • FIG. 18B shows another example of the configuration of a resin molded product that can be manufactured by a general resin molding method.
  • one surface of the substrate 1 is resin-molded with a cured resin 20.
  • An excess resin 20 d is connected to the outer periphery of the cured resin 20.
  • the surplus resin 20 d protrudes from the outer periphery of the substrate 1.
  • the excess resin 20d is separated from the resin molded product after the resin molded product in FIG. 18B is removed (released) from the mold.
  • FIG. 18C shows an example of the configuration of a resin molded product (compression molded product) that can be manufactured according to the present invention.
  • the configuration of the resin molded product in the figure is the same as that in FIG. 17B except that the horizontal direction on the paper surface and the vertical direction on the paper surface are reversed.
  • the surplus resin accommodating portion when the surplus resin accommodating portion is set at a position inside the substrate, for example, as shown in FIG. 18A, surplus resin that cannot be separated from the resin molded product (product) exists inside the substrate. . In this case, the product area (package area) of the substrate is reduced, and the number of products per substrate (the number of electronic components that can be mounted on the substrate) is reduced.
  • the size of the substrate viewed in plan is substantially larger by the surplus resin in the molded substrate than in the substrate before molding. That is, the substrate size changes substantially before and after molding.
  • two substrate transport mechanisms are prepared, or a substrate transport mechanism having a variable size is prepared in one system.
  • the apparatus size of a compression molding apparatus becomes large or complicated.
  • the size of the compression molding apparatus becomes large or complicated.
  • the process in the compression molding method becomes complicated.
  • the surplus resin can be removed from the molded substrate in the mold even if the surplus resin container is set at a position outside the substrate. For this reason, it can prevent or suppress efficiently that the apparatus size of a compression molding apparatus becomes large or becomes complicated. Further, as described above, it is possible to easily suppress variation in package thickness.
  • the configurations of the compression molded product and the surplus resin are not limited to those shown in FIGS. 17A to 17C and FIG. 18C, and are arbitrary, for example, as shown in FIG. Etc. However, it is preferable that the compression molded product and the excess resin be easily separated in the mold.

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Abstract

Provided is a compression molding device that makes it possible to easily suppress variation in package thickness. In order to achieve this objective, this compression molding device includes a mold (10) comprising: an upper mold (100); a lower mold (200); a mold cavity (204) to which a resin material is supplied; a positioning mechanism (207) that maintains the depth of the mold cavity (204) at a predetermined depth during mold clamping; a surplus resin accommodation section (205) for accommodating surplus resin not accommodated within the mold cavity (204) during mold clamping; and a surplus resin separating member (103). The compression molding device is characterized in that after curing of the resin within the mold cavity (204) and the surplus resin, the resin cured within the mold cavity (204) and the surplus resin cured within the surplus resin accommodation section (205) are separated as a result of the surplus resin separating member (103) raising or lowering one or both of the upper mold (100) and the lower mold (200) relative to one another.

Description

圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法Compression molding apparatus, compression molding method, and method of manufacturing compression molded product
　本発明は、圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法に関する。 The present invention relates to a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product.
　樹脂成形品の製造方法としては、圧縮成形（例えば特許文献１）が用いられている。 As a method for producing a resin molded product, compression molding (for example, Patent Document 1) is used.
特開２００７－３０１９５０号公報JP 2007-301950 A
　しかし、圧縮成形は、成形型のキャビティに供給する樹脂量がばらついた場合、パッケージ（樹脂成形品における樹脂の部分）厚みもばらつきが生じるおそれがある。 However, in compression molding, when the amount of resin supplied to the mold cavity varies, the thickness of the package (resin portion in the resin molded product) may also vary.
　そこで、本発明は、簡便にパッケージ厚みのばらつきを抑制することが可能な圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法の提供を目的とする。 Therefore, an object of the present invention is to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variation in package thickness.
　前記目的を達成するために、本発明の圧縮成形装置は、
　成形型を含み、
　前記成形型は、
　上型と、
　下型と、
　樹脂材料が供給される型キャビティと、
　型締め時における前記型キャビティの深さを所定深さで保持する位置決め機構と、
　型締め時に前記型キャビティ内に収容されていない余剰樹脂を収容する余剰樹脂収容部と、
　余剰樹脂分離部材と、を有し、
　前記型キャビティ内の樹脂と前記余剰樹脂との硬化後に、前記余剰樹脂分離部材が、前記上型及び前記下型の一方又は両方に対し相対的に上昇又は下降されることで、前記型キャビティ内で硬化した樹脂と、前記余剰樹脂収容部内で硬化した前記余剰樹脂とが分離されることを特徴とする。 In order to achieve the above object, the compression molding apparatus of the present invention comprises:
Including molds,
The mold is
Upper mold,
Lower mold,
Mold cavity to which resin material is supplied;
A positioning mechanism for holding the depth of the mold cavity at a predetermined depth during mold clamping;
A surplus resin container for accommodating surplus resin that is not accommodated in the mold cavity at the time of mold clamping;
An excess resin separating member,
After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member is raised or lowered relative to one or both of the upper mold and the lower mold, so that the inside of the mold cavity The resin cured in step (b) is separated from the surplus resin cured in the surplus resin container.
　本発明の圧縮成形方法は、
　成形型の型キャビティ内に樹脂材料を供給する樹脂材料供給工程と、
　前記成形型の上型及び下型を型締めする型締め工程と、
　前記型締め工程において前記型キャビティ内に収容されない余剰樹脂を収容する余剰樹脂収容工程と、
　前記上型及び前記下型を型開きする型開き工程と、
　前記余剰樹脂を、前記型キャビティ内で硬化した樹脂から分離する余剰樹脂分離工程とを含み、
　前記余剰樹脂分離工程は、前記型キャビティ内の樹脂と前記余剰樹脂との硬化後に、余剰樹脂分離部材を前記上型及び前記下型の一方又は両方に対し相対的に上昇又は下降させて行うことを特徴とする。 The compression molding method of the present invention comprises:
A resin material supply step of supplying a resin material into the mold cavity of the mold,
A mold clamping step of clamping the upper mold and the lower mold of the mold;
A surplus resin housing step of housing surplus resin that is not housed in the mold cavity in the mold clamping step;
A mold opening step of opening the upper mold and the lower mold;
A surplus resin separation step of separating the surplus resin from the resin cured in the mold cavity,
The surplus resin separation step is performed by raising or lowering the surplus resin separation member relative to one or both of the upper mold and the lower mold after the resin in the mold cavity and the surplus resin are cured. It is characterized by.
　本発明の圧縮成形品の製造方法は、前記本発明の圧縮成形方法により樹脂を圧縮成形することを特徴とする。 The method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention.
　本発明によれば、簡便にパッケージ厚みのばらつきを抑制することが可能な圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法を提供することができる。 According to the present invention, it is possible to provide a compression molding apparatus, a compression molding method, and a method for manufacturing a compression molded product that can easily suppress variation in package thickness.
図１は、本発明の圧縮成形装置における成形型の構成の一例を模式的に示す断面図である。FIG. 1 is a cross-sectional view schematically showing an example of the configuration of a molding die in the compression molding apparatus of the present invention. 図２は、図１の成形型を用いた本発明の圧縮成形方法の一例における一工程を模式的に示す断面図である。FIG. 2 is a cross-sectional view schematically showing one step in an example of the compression molding method of the present invention using the mold of FIG. 図３は、図２の圧縮成形方法の別の一工程を模式的に示す断面図である。FIG. 3 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 図４は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 4 is a cross-sectional view schematically showing still another process of the compression molding method of FIG. 図５は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 5 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図６は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 6 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図７は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 7 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図８は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 8 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図９は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 9 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図１０は、図２の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 10 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図１１は、本発明の圧縮成形装置における成形型の構成の別の一例を模式的に示す断面図である。FIG. 11 is a cross-sectional view schematically showing another example of the configuration of the molding die in the compression molding apparatus of the present invention. 図１２は、本発明の圧縮成形装置における成形型の構成のさらに別の一例を模式的に示す断面図である。FIG. 12 is a cross-sectional view schematically showing still another example of the configuration of the molding die in the compression molding apparatus of the present invention. 図１３は、図１の成形型を用いた本発明の圧縮成形方法の別の一例における一工程を模式的に示す断面図である。FIG. 13 is a cross-sectional view schematically showing one step in another example of the compression molding method of the present invention using the mold of FIG. 図１４は、図１３の圧縮成形方法の別の一工程を模式的に示す断面図である。FIG. 14 is a cross-sectional view schematically showing another step of the compression molding method of FIG. 図１５は、図１３の圧縮成形方法のさらに別の一工程を模式的に示す断面図である。FIG. 15 is a cross-sectional view schematically showing still another step of the compression molding method of FIG. 図１６は、本発明の圧縮成形装置の構成の一例を模式的に示す平面図である。FIG. 16 is a plan view schematically showing an example of the configuration of the compression molding apparatus of the present invention. 図１７（ａ）～（ｃ）は、それぞれ、本発明により製造される圧縮成形品及び余剰樹脂の構成の一例を模式的に示す平面図である。FIGS. 17A to 17C are plan views schematically showing an example of the configuration of the compression molded product and surplus resin produced according to the present invention, respectively. 図１８（ａ）～（ｃ）は、それぞれ、圧縮成形品及び余剰樹脂の構成のさらに別の例を模式的に示す平面図である。18 (a) to 18 (c) are plan views schematically showing still another example of the configuration of the compression molded product and the surplus resin, respectively.
　つぎに、本発明について、例を挙げてさらに詳細に説明する。ただし、本発明は、以下の説明により限定されない。 Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.
　本発明の圧縮成形装置において、例えば、前記成形型は、基板の一方の面を樹脂封止する成形型であり、前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型であってもよい。この場合において、例えば、前記上型と前記下型との型締め時に、前記基板の前記余剰樹脂収容部側の端部が、前記他方の型の型面と前記余剰樹脂分離部材の端部とで挟まれるように構成されていてもよい。 In the compression molding apparatus of the present invention, for example, the molding die is a molding die for resin-sealing one surface of a substrate, and one of the upper die and the lower die has the die cavity. The other mold may be a mold on which the substrate is fixed. In this case, for example, when the upper mold and the lower mold are clamped, the end portion of the substrate on the side of the surplus resin accommodating portion is the mold surface of the other mold and the end portion of the surplus resin separating member. It may be configured to be sandwiched between.
　本発明の圧縮成形装置において、例えば、
　前記成形型は、基板の一方の面を樹脂封止する成形型であり、
　前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型であり、
　前記一方の型は、底面部材及び側面部材を有し、
　前記底面部材は、ベース部材に固定され、
　前記側面部材は、弾性部材を介して前記ベース部材に接続され、
　前記底面部材と前記側面部材とに囲まれた空間により、前記型キャビティが形成され、
　前記位置決め機構が、前記ベース部材に固定されたストッパを含み、
　前記上型と前記下型との型締め時に、前記側面部材が前記ストッパに接触することで、前記型キャビティの深さが所定深さで保持されてもよい。 In the compression molding apparatus of the present invention, for example,
The mold is a mold for resin-sealing one surface of the substrate,
One of the upper mold and the lower mold has the mold cavity, and the other mold is a mold on which the substrate is fixed.
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes a stopper fixed to the base member;
When the upper mold and the lower mold are clamped, the side surface member may come into contact with the stopper, so that the depth of the mold cavity may be held at a predetermined depth.
　本発明の圧縮成形装置は、例えば、さらに、前記成形型の動作を制御する制御部を含んでいてもよい。また、例えば、前記制御部が、前記成形型の型締めを制御し、前記位置決め機構が、前記制御部を含んでいてもよい。 The compression molding apparatus of the present invention may further include, for example, a control unit that controls the operation of the mold. Further, for example, the control unit may control clamping of the mold, and the positioning mechanism may include the control unit.
　本発明の圧縮成形装置は、例えば、
　さらに、前記成形型の動作を制御する制御部を含み、
　前記成形型は、基板の一方の面を樹脂封止する成形型であり、
　前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型であり、
　前記一方の型は、底面部材及び側面部材を有し、
　前記底面部材は、ベース部材に固定され、
　前記側面部材は、弾性部材を介して前記ベース部材に接続され、
　前記底面部材と前記側面部材とに囲まれた空間により、前記型キャビティが形成され、
　前記位置決め機構が、前記制御部を含み、
　前記上型と前記下型との型締め時に、前記上型及び前記下型の一方又は両方における上昇位置及び下降位置の一方又は両方が、前記制御部により制御されることで、前記型キャビティの深さが所定深さで保持されてもよい。 The compression molding apparatus of the present invention is, for example,
And a control unit for controlling the operation of the mold.
The mold is a mold for resin-sealing one surface of the substrate,
One of the upper mold and the lower mold has the mold cavity, and the other mold is a mold on which the substrate is fixed.
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes the control unit;
When the upper mold and the lower mold are clamped, one or both of the ascending position and the descending position of one or both of the upper mold and the lower mold are controlled by the control unit, so that the mold cavity The depth may be held at a predetermined depth.
　本発明の圧縮成形装置は、例えば、さらに、前記余剰樹脂収容部に対して上下動可能な樹脂加圧部材を有し、前記樹脂加圧部材により、前記型キャビティ内及び前記余剰樹脂収容部内の樹脂が加圧されてもよい。 The compression molding apparatus of the present invention further includes, for example, a resin pressurizing member that can move up and down with respect to the surplus resin containing portion, and the resin pressurizing member allows the inside of the mold cavity and the surplus resin containing portion. The resin may be pressurized.
　本発明の圧縮成形装置は、例えば、さらに、前記余剰樹脂収容部に樹脂材料を供給する余剰樹脂収容部樹脂材料供給機構を有していてもよい。 The compression molding apparatus of the present invention may further include, for example, a surplus resin housing portion resin material supply mechanism that supplies a resin material to the surplus resin housing portion.
　本発明の圧縮成形装置において、前記余剰樹脂分離部材は、例えば、前記余剰樹脂を、前記余剰樹脂収容部との間に挟んで固定することが可能であってもよい。 In the compression molding apparatus of the present invention, the surplus resin separating member may be capable of being fixed by sandwiching the surplus resin between the surplus resin housing portion, for example.
　本発明の圧縮成形方法において、例えば、前記成形型は、基板の一方の面を樹脂封止する成形型であり、前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型であってもよい。この場合において、例えば、前記型締め工程の際に、前記基板の前記余剰樹脂収容部側の端部が、前記他方の型の型面と前記余剰樹脂分離部材の端部とで挟まれてもよい。 In the compression molding method of the present invention, for example, the molding die is a molding die for resin-sealing one surface of a substrate, and one of the upper die and the lower die has the die cavity. The other mold may be a mold on which the substrate is fixed. In this case, for example, in the mold clamping step, the end portion of the substrate on the side of the surplus resin accommodating portion may be sandwiched between the mold surface of the other mold and the end portion of the surplus resin separating member. Good.
　本発明の圧縮成形方法において、例えば、
　前記成形型は、基板の一方の面を樹脂封止する成形型であり、
　前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型であり、
　前記一方の型は、底面部材及び側面部材を有し、
　前記底面部材は、ベース部材に固定され、
　前記側面部材は、弾性部材を介して前記ベース部材に接続され、
　前記底面部材と前記側面部材とに囲まれた空間により、前記型キャビティが形成され、
　前記位置決め機構が、前記ベース部材に固定されたストッパを含み、
　前記型締め工程時に、前記側面部材を前記ストッパに接触させることで、前記型キャビティの深さを所定深さで保持してもよい。 In the compression molding method of the present invention, for example,
The mold is a mold for resin-sealing one surface of the substrate,
One of the upper mold and the lower mold has the mold cavity, and the other mold is a mold on which the substrate is fixed.
The one mold has a bottom member and a side member,
The bottom member is fixed to a base member;
The side member is connected to the base member via an elastic member,
The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
The positioning mechanism includes a stopper fixed to the base member;
The mold cavity may be held at a predetermined depth by bringing the side member into contact with the stopper during the mold clamping step.
　本発明の圧縮成形方法において、例えば、前記成形型が、前記余剰樹脂収容部に対して上下動可能な樹脂加圧部材を有し、前記型締め工程において、前記樹脂加圧部材により、前記型キャビティ内及び前記余剰樹脂収容部内の樹脂が加圧されてもよい。 In the compression molding method of the present invention, for example, the mold has a resin pressure member that can move up and down with respect to the surplus resin container, and in the mold clamping step, the mold is formed by the resin pressure member. The resin in the cavity and the excess resin container may be pressurized.
　本発明の圧縮成形方法は、例えば、前記樹脂材料供給工程において、前記余剰樹脂収容部にも樹脂材料を供給してもよい。 In the compression molding method of the present invention, for example, in the resin material supply step, a resin material may be supplied also to the surplus resin container.
　本発明の圧縮成形方法を行うための装置は、特に限定されないが、例えば、前記本発明の圧縮成形装置を用いることができる。 The apparatus for performing the compression molding method of the present invention is not particularly limited, and for example, the compression molding apparatus of the present invention can be used.
　また、本発明の圧縮成形方法における各工程を行う順序は、特に限定されない。すなわち、それを行うことが可能である限り、本発明の圧縮成形方法における各工程は、どのような順序で行ってもよいし、複数の工程を同時に行ってもよい。 Further, the order of performing each step in the compression molding method of the present invention is not particularly limited. That is, as long as it can be performed, each step in the compression molding method of the present invention may be performed in any order, and a plurality of steps may be performed simultaneously.
　本発明の圧縮成形品の製造方法は、前述のとおり、前記本発明の圧縮成形方法により樹脂を圧縮成形することを特徴とする。これ以外は、本発明の圧縮成形品の製造方法は、特に限定されず、例えば、前記本発明の圧縮成形方法により樹脂を圧縮成形する工程（圧縮成形工程）以外の他の工程を含んでいてもよいし、含んでいなくてもよい。前記他の工程も、特に限定されないが、例えば、前記圧縮成形工程により製造した中間製品を切断して完成品の圧縮成形品を分離する切断工程であってもよい。より具体的には、例えば、１つの基板上に配置された複数のチップを前記圧縮成形工程により圧縮成形（樹脂封止）した中間製品を製造し、さらに、前記切断工程により前記中間製品を切断し、個別のチップが樹脂封止された圧縮成形品（完成品）に分離してもよい。 As described above, the method for producing a compression molded product of the present invention is characterized in that a resin is compression molded by the compression molding method of the present invention. Other than this, the production method of the compression molded product of the present invention is not particularly limited, and includes, for example, other steps than the step of compression molding the resin by the compression molding method of the present invention (compression molding step). It does not have to be included. The other steps are not particularly limited, and may be, for example, a cutting step in which an intermediate product manufactured by the compression molding step is cut to separate a final compression molded product. More specifically, for example, an intermediate product is manufactured by compression molding (resin sealing) a plurality of chips arranged on one substrate by the compression molding step, and further, the intermediate product is cut by the cutting step. Then, individual chips may be separated into compression molded products (finished products) sealed with resin.
　なお、本発明において、前記樹脂材料（樹脂封止するための樹脂）としては、特に制限されず、例えば、エポキシ樹脂やシリコーン樹脂などの熱硬化性樹脂であってもよいし、熱可塑性樹脂であってもよい。また、熱硬化性樹脂あるいは熱可塑性樹脂を一部に含んだ複合材料であってもよい。樹脂封止装置に供給する樹脂の形態としては、例えば、顆粒樹脂、流動性樹脂、シート状の樹脂、タブレット状の樹脂、粉状の樹脂等が挙げられる。 In addition, in this invention, it does not restrict | limit especially as said resin material (resin for resin sealing), For example, thermosetting resins, such as an epoxy resin and a silicone resin, may be sufficient as thermoplastic resin. There may be. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. Examples of the form of the resin supplied to the resin sealing device include a granular resin, a fluid resin, a sheet-like resin, a tablet-like resin, and a powder-like resin.
　また、本発明において、「流動性樹脂」は、流動性を有する樹脂であれば、特に制限されず、例えば、液状樹脂、溶融樹脂等が挙げられる。また、本発明において、「液状」とは、常温（室温）で流動性を有し、力を作用させることにより流動することを意味し、流動性の高低、言い換えれば粘度の程度を問わない。すなわち、本発明において、「液状樹脂」は、常温（室温）で流動性を有し、力を作用させることにより流動する樹脂をいう。また、本発明において、「溶融樹脂」は、例えば、溶融により、液状又は流動性を有する状態となった樹脂をいう。前記溶融樹脂の形態は、特に限定されないが、例えば、成形型のキャビティ等に供給可能な形態である。 In the present invention, the “fluid resin” is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the term “liquid” means fluidity at normal temperature (room temperature) and fluidity by applying a force, regardless of the degree of fluidity, in other words, the degree of viscosity. That is, in the present invention, the “liquid resin” refers to a resin that has fluidity at room temperature (room temperature) and flows when a force is applied. In the present invention, the “molten resin” refers to a resin that is in a liquid or fluid state by melting, for example. Although the form of the said molten resin is not specifically limited, For example, it is a form which can be supplied to the cavity etc. of a shaping | molding die.
　また、一般に、「電子部品」は、樹脂封止する前のチップをいう場合と、チップを樹脂封止した状態をいう場合とがあるが、本発明において、単に「電子部品」という場合は、特に断らない限り、前記チップが樹脂封止された電子部品（完成品としての電子部品）をいう。本発明において、「チップ」は、少なくとも一部が樹脂封止されずに露出した状態のチップをいい、樹脂封止する前のチップも、一部が樹脂封止されたチップも、複数のチップのうちの少なくとも一つが樹脂封止されずに露出した状態のチップも含む。本発明における「チップ」は、具体的には、例えば、ＩＣ、半導体チップ、電力制御用の半導体素子等のチップが挙げられる。また、本発明における「チップ」には、フリップチップも含まれる。本発明において、少なくとも一部が樹脂封止されずに露出した状態のチップは、樹脂封止後の電子部品と区別するために、便宜上「チップ」という。しかし、本発明における「チップ」は、少なくとも一部が樹脂封止されずに露出した状態のチップであれば、特に限定されず、チップ状でなくてもよい。また、本発明の電子部品（樹脂封止電子部品）において、チップは、その全体が樹脂封止されていてもよいが、一部のみが樹脂封止されていてもよい。すなわち、チップの一部が樹脂封止されない状態が、製品としての電子部品（樹脂封止電子部品）の完成品である場合は、そのような状態も、本発明における「電子部品（樹脂封止電子部品）」に含まれる。 In general, the term “electronic component” refers to a chip before resin-sealing and a state in which the chip is resin-sealed, but in the present invention, simply referred to as “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, the “chip” means a chip in which at least a part is exposed without being resin-sealed, and a chip before resin sealing, a chip partially sealed with resin, or a plurality of chips. A chip in which at least one of them is exposed without being resin-sealed is also included. Specific examples of the “chip” in the present invention include chips such as ICs, semiconductor chips, and semiconductor elements for power control. The “chip” in the present invention includes a flip chip. In the present invention, a chip in which at least a part is exposed without being resin-sealed is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin-sealing. However, the “chip” in the present invention is not particularly limited as long as at least a part of the chip is exposed without being sealed with resin, and may not be in a chip shape. Moreover, in the electronic component (resin-encapsulated electronic component) of the present invention, the entire chip may be resin-encapsulated, but only a part may be resin-encapsulated. That is, when a state in which a part of the chip is not resin-sealed is a finished product of an electronic component (resin-sealed electronic component) as a product, such a state is also referred to as “electronic component (resin-sealed) in the present invention. Electronic components) ”.
　以下、本発明の具体的な実施例を図面に基づいて説明する。各図は、説明の便宜のため、適宜省略、誇張等をして模式的に描いている。 Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.
　図１の断面図に、本発明の圧縮成形装置における成形型の構成の一例を示す。図示のとおり、この成形型１０は、上型１００と、下型２００とを含む。また、この成形型１０は、基板の一方の面を樹脂封止する成形型である。下型２００は、型キャビティ（下型キャビティ）２０４を有し、上型１００は、前記基板が固定される型である。 1 shows an example of the configuration of a molding die in the compression molding apparatus of the present invention. As illustrated, the mold 10 includes an upper mold 100 and a lower mold 200. The mold 10 is a mold for resin-sealing one surface of the substrate. The lower mold 200 has a mold cavity (lower mold cavity) 204, and the upper mold 100 is a mold on which the substrate is fixed.
　下型２００は、底面部材（下型底面部材）２０２及び側面部材（下型側面部材）２０３を有する。下型底面部材２０２は、ベース部材２０１に固定されている。下型側面部材２０３は、弾性部材２０８、２０９及び２１０を介してベース部材（下型ベース部材、又は下型ベースブロック）２０１に接続されている。なお、図１の圧縮成形装置における各弾性部材は、特に限定されないが、例えば、バネ等でも良い。そして、下型底面部材２０２の上面と下型側面部材２０３の内周面とに囲まれた空間により、下型キャビティ２０４が形成されている。下型ベース部材２０１の上面の両端には、それぞれストッパ２０７が固定されている。ストッパ２０７は、この成形型１０を含む圧縮成形装置の「位置決め機構」の少なくとも一部に該当する。上型１００と下型２００との型締め時に、下型側面部材２０３がストッパ２０７に接触することで、下型キャビティ２０４の深さが所定深さで保持される。 The lower mold 200 includes a bottom member (lower mold bottom member) 202 and a side member (lower mold side member) 203. The lower mold bottom member 202 is fixed to the base member 201. The lower mold side member 203 is connected to a base member (lower mold base member or lower mold base block) 201 via elastic members 208, 209 and 210. In addition, each elastic member in the compression molding apparatus of FIG. 1 is not specifically limited, For example, a spring etc. may be sufficient. A lower mold cavity 204 is formed by a space surrounded by the upper surface of the lower mold bottom surface member 202 and the inner peripheral surface of the lower mold side surface member 203. Stoppers 207 are fixed to both ends of the upper surface of the lower mold base member 201, respectively. The stopper 207 corresponds to at least a part of the “positioning mechanism” of the compression molding apparatus including the molding die 10. When the upper mold 100 and the lower mold 200 are clamped, the lower mold side surface member 203 comes into contact with the stopper 207, whereby the depth of the lower mold cavity 204 is held at a predetermined depth.
　下型側面部材２０３は、その上部に、さらに、型締め時に下型キャビティ２０４内に収容されていない余剰樹脂を収容する余剰樹脂収容部２０５を有する。下型キャビティ２０４と余剰樹脂収容部２０５とはつながっており、樹脂が移動可能である。下型２００は、さらに、余剰樹脂収容部２０５に対して上下動可能な樹脂加圧部材２０６を有する。樹脂加圧部材２０６は、特に限定されないが、例えば、樹脂加圧ピンであってもよい。樹脂加圧部材２０６は、弾性部材２１１を介して下型ベース部材２０１に接続されている。下型側面部材２０３は、余剰樹脂収容部２０５底面から下型側面部材２０３下面（下端）まで貫通する貫通孔を有し、その貫通孔内を、樹脂加圧部材２０６が上下動可能である。そして、樹脂加圧部材２０６により、下型キャビティ２０４内及び余剰樹脂収容部２０５内の樹脂が加圧される。 The lower mold side surface member 203 further has an excess resin accommodating portion 205 that accommodates an excess resin not accommodated in the lower mold cavity 204 when the mold is clamped. The lower mold cavity 204 and the surplus resin container 205 are connected, and the resin can move. The lower mold 200 further includes a resin pressure member 206 that can move up and down with respect to the surplus resin container 205. The resin pressure member 206 is not particularly limited, but may be a resin pressure pin, for example. The resin pressure member 206 is connected to the lower mold base member 201 via the elastic member 211. The lower mold side member 203 has a through hole penetrating from the bottom surface of the surplus resin accommodating portion 205 to the lower surface (lower end) of the lower mold side member 203, and the resin pressure member 206 can move up and down in the through hole. Then, the resin pressurizing member 206 pressurizes the resin in the lower mold cavity 204 and the surplus resin accommodating portion 205.
　また、上型１００は、上型ベース部材（上型ベースブロック）１０１と、基板セット部（上型基板セット部）１０２と、余剰樹脂分離部材（余剰樹脂分離ブロック）１０３とを有する。上型基板セット部１０２は、上型ベース部材１０１の下面（下端）に固定されている。上型基板セット部１０２の下面（下端）には、例えば、基板固定部材（図示せず）等により、基板を固定することが可能である。前記基板固定部材は、特に限定されないが、例えば、クランプ等があげられる。余剰樹脂分離部材１０３は、弾性部材１０４を介して、上型ベース部材１０１の下面（下端）に固定されており、上型基板セット部１０２に開けられた孔の中を上下動可能である。余剰樹脂分離部材１０３は、余剰樹脂収容部２０５の真上に配置され、余剰樹脂分離部材１０３によって前記余剰樹脂を押さえつけることができる。余剰樹脂分離部材１０３の下部の基板側（下型キャビティ２０４側）端部は、図示のとおり、水平方向に突出した突出部を形成している。そして、上型１００と下型２００との型締め時に、前記基板の余剰樹脂収容部２０５側の端部が、上型１００の型面（上型基板セット部１０２の下面）と余剰樹脂分離部材１０３の前記突出部（端部）とで挟まれるようになっている。 The upper mold 100 includes an upper mold base member (upper mold base block) 101, a substrate set part (upper mold substrate set part) 102, and an excess resin separation member (excess resin separation block) 103. The upper mold substrate setting portion 102 is fixed to the lower surface (lower end) of the upper mold base member 101. For example, a substrate can be fixed to the lower surface (lower end) of the upper mold substrate setting unit 102 by a substrate fixing member (not shown) or the like. The substrate fixing member is not particularly limited, and examples thereof include a clamp. The surplus resin separating member 103 is fixed to the lower surface (lower end) of the upper mold base member 101 via the elastic member 104, and can move up and down in a hole opened in the upper mold substrate setting portion 102. The surplus resin separating member 103 is disposed immediately above the surplus resin accommodating portion 205, and the surplus resin can be pressed by the surplus resin separating member 103. The lower substrate side (lower mold cavity 204 side) end of the excess resin separating member 103 forms a protruding portion that protrudes in the horizontal direction as shown in the figure. When the upper mold 100 and the lower mold 200 are clamped, the end portion of the substrate on the surplus resin housing portion 205 side is the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting section 102) and the surplus resin separating member. The projection 103 (end portion) 103 is sandwiched between them.
　図１の圧縮成形装置を用いた圧縮成形方法（圧縮成形品の製造方法）は、例えば、図２～１０の工程断面図に示すようにして行うことができる。 The compression molding method (compression molding product manufacturing method) using the compression molding apparatus of FIG. 1 can be performed, for example, as shown in the process cross-sectional views of FIGS.
　まず、図２に示すとおり、成形型１０に、基板１及び離型フィルム２をセットする。より具体的には、以下のとおりである。すなわち、図示のとおり、基板１を、上型基板セット部１０２の下面にセットする。このとき、例えば、基板搬送機構（図示せず）を用いて基板１を上型基板セット部１０２の位置まで搬送してもよい。また、例えば、成形型１０又は前記基板搬送機構に、基板寄せ機構（基板寄せ部材）を設けてもよい。そして、基板１の搬送後に、前記基板寄せ機構により、基板１を寄せて余剰樹脂分離部材１０３に押し当ててもよい。これにより、基板１の余剰樹脂収容部２０５側の端部（端面）と、余剰樹脂分離部材１０３との間の隙間をなくすことができる。そうすると、後述する前記端部への樹脂の付着を、より効果的に抑制又は防止することが可能である。また、基板１は、例えば、前述のとおり、基板固定部材（図示せず）等により上型基板セット部１０２の下面に固定（セット）することができる。また、例えば、上型基板セット部１０２の下面の適宜な箇所に基板吸着穴（図示せず）を設け、吸着機構（吸引ポンプ等、図示せず）によって前記基板吸着穴の内部を吸引して減圧にすることで、上型基板セット部１０２の下面に基板１を吸着し、固定してもよい。基板１の下面には、１種類又は複数種類の任意の部品が、任意の個数、装着されていてもよいし、装着されていなくてもよい。前記任意の部品としては、特に限定されないが、例えば、チップ、ワイヤ、電極、コンデンサ（受動素子）等があげられる。そして、これらの部品を、圧縮成形により樹脂封止してもよい。一方、離型フィルム２を、下型２００の上面（下型底面部材２０２、下型側面部材２０３及び樹脂加圧部材２０６の上面）全体に吸着（セット）させる。これにより、下型キャビティ２０４及び余剰樹脂収容部２０５の型面全体を離型フィルム２で覆う。例えば、下型２００上面の適宜な箇所に吸着穴（図示せず）が設けられ、吸着機構（吸引ポンプ等、図示せず）によって前記吸着穴の内部を吸引して減圧にすることで、下型２００の上面に離型フィルム２を吸着してもよい。なお、基板１及び離型フィルム２は、それぞれ、搬送機構（図示せず）により、上型１００と下型２００との間の位置まで搬送し、その後、図２に示すようにセットしてもよい。基板１の搬送機構（基板搬送機構）については前述のとおりである。 First, as shown in FIG. 2, the substrate 1 and the release film 2 are set on the mold 10. More specifically, it is as follows. That is, as illustrated, the substrate 1 is set on the lower surface of the upper mold substrate setting unit 102. At this time, for example, the substrate 1 may be transported to the position of the upper mold substrate setting unit 102 using a substrate transport mechanism (not shown). Further, for example, a substrate shifting mechanism (substrate shifting member) may be provided in the mold 10 or the substrate transport mechanism. Then, after the substrate 1 is transported, the substrate 1 may be pressed against the surplus resin separation member 103 by the substrate shifting mechanism. Thereby, the clearance gap between the edge part (end surface) by the side of the excess resin storage part 205 of the board | substrate 1 and the excess resin separation member 103 can be eliminated. If it does so, it is possible to suppress or prevent the adhesion of the resin to the said edge part mentioned later more effectively. Further, as described above, the substrate 1 can be fixed (set) to the lower surface of the upper mold substrate setting portion 102 by a substrate fixing member (not shown) or the like. Further, for example, a substrate suction hole (not shown) is provided at an appropriate position on the lower surface of the upper mold substrate setting unit 102, and the inside of the substrate suction hole is sucked by a suction mechanism (a suction pump or the like, not shown). By reducing the pressure, the substrate 1 may be sucked and fixed to the lower surface of the upper mold substrate setting unit 102. An arbitrary number of one or more types of arbitrary components may be mounted on the lower surface of the substrate 1 or may not be mounted. Examples of the optional component include, but are not limited to, a chip, a wire, an electrode, and a capacitor (passive element). These parts may be resin-sealed by compression molding. On the other hand, the release film 2 is adsorbed (set) to the entire upper surface of the lower mold 200 (the upper surfaces of the lower mold bottom surface member 202, the lower mold side surface member 203, and the resin pressure member 206). As a result, the entire mold surfaces of the lower mold cavity 204 and the excess resin container 205 are covered with the release film 2. For example, suction holes (not shown) are provided at appropriate locations on the upper surface of the lower mold 200, and the suction holes (suction pump, etc., not shown) are sucked into the suction holes to reduce the pressure. The release film 2 may be adsorbed on the upper surface of the mold 200. The substrate 1 and the release film 2 may be transported to a position between the upper mold 100 and the lower mold 200 by a transport mechanism (not shown), and then set as shown in FIG. Good. The transport mechanism (substrate transport mechanism) for the substrate 1 is as described above.
　つぎに、図３に示すように、下型キャビティ２０４内に樹脂材料（顆粒樹脂）２０ａを供給（セット）する（樹脂材料供給工程）。このとき、樹脂材料２０ａは、圧縮成形に必要な量（目的とするパッケージ厚み又はパッケージ体積に相当する量）よりも若干多く供給する。なお、樹脂材料２０ａは、図では顆粒樹脂であるが、前述のとおり、これに限定されない。また、図２及び３では、離型フィルムのセット後に樹脂材料２０ａを供給（セット）する例を示しているが、本発明は、これに限定されない。例えば、離型フィルム２上に樹脂材料２０ａを載置した状態で、搬送機構（図示せず）により、樹脂材料２０ａを離型フィルム２とともに上型１００と下型２００との間の位置まで搬送し、その後、離型フィルム２を下型２００の上面に吸着させることで、樹脂材料２０ａを供給（セット）してもよい。 Next, as shown in FIG. 3, a resin material (granular resin) 20a is supplied (set) into the lower mold cavity 204 (resin material supply step). At this time, the resin material 20a is supplied slightly more than the amount required for compression molding (the amount corresponding to the target package thickness or package volume). In addition, although the resin material 20a is a granular resin in a figure, as above-mentioned, it is not limited to this. 2 and 3 show an example in which the resin material 20a is supplied (set) after the release film is set, the present invention is not limited to this. For example, in a state where the resin material 20a is placed on the release film 2, the transfer material (not shown) conveys the resin material 20a together with the release film 2 to a position between the upper mold 100 and the lower mold 200. Then, the resin material 20 a may be supplied (set) by adsorbing the release film 2 to the upper surface of the lower mold 200.
　つぎに、図４に示すように、樹脂材料（顆粒樹脂）２０ａを溶融させて、流動性樹脂（溶融樹脂）２０ｂとする。樹脂材料２０ａの溶融は、例えば、下型２００を、加熱機構（ヒータ、図示せず）により加熱（昇温）して行うことができる。例えば、図３の工程（樹脂材料供給工程）に先立ち、あらかじめ下型２００を加熱（昇温）しておいてもよい。また、例えば、下型２００に代えて、又は下型２００に加え、上型１００を、加熱機構（ヒータ、図示せず）により加熱（昇温）してもよい。この場合、上型１００は、図３の工程（樹脂材料供給工程）に先立ち加熱（昇温）しておいてもよい。 Next, as shown in FIG. 4, the resin material (granular resin) 20a is melted to obtain a fluid resin (molten resin) 20b. The melting of the resin material 20a can be performed, for example, by heating (heating) the lower mold 200 with a heating mechanism (heater, not shown). For example, prior to the step of FIG. 3 (resin material supply step), the lower mold 200 may be heated (heated up) in advance. For example, instead of the lower mold 200 or in addition to the lower mold 200, the upper mold 100 may be heated (heated up) by a heating mechanism (heater, not shown). In this case, the upper mold 100 may be heated (heated up) prior to the process of FIG. 3 (resin material supply process).
　つぎに、図５～７に示すように、上型１００及び下型２００を型締めする工程（型締め工程）を行う。まず、図５に示すように、下型２００全体を矢印Ｘ１の方向に上昇させて、余剰樹脂分離部材１０３と余剰樹脂収容部２０５とを、離型フィルム２を介して接触させる。 Next, as shown in FIGS. 5 to 7, a process (clamping process) of clamping the upper mold 100 and the lower mold 200 is performed. First, as shown in FIG. 5, the entire lower mold 200 is raised in the direction of the arrow X <b> 1, and the surplus resin separation member 103 and the surplus resin container 205 are brought into contact via the release film 2.
　つぎに、図６の矢印Ｘ２に示すように、下型２００全体を、さらに上昇させる。このとき、余剰樹脂分離部材１０３は、下型側面部材２０３により押し上げられ、弾性部材１０４は収縮する。これにより、図６に示すように、基板１の余剰樹脂収容部２０５側の端部が、上型１００の型面（上型基板セット部１０２の下面）と余剰樹脂分離部材１０３の前記突出部（端部）とで挟まれる。これにより、基板１の余剰樹脂収容部２０５側の端部に流動性樹脂が流れ込むことが抑制又は防止されるので、前記端部に樹脂が付着することを抑制又は防止できる。一方、基板１の余剰樹脂収容部２０５と反対側の端部は、図６に示すように、上型基板セット部１０２と下型側面部材２０３との間に挟まれる。このとき、基板１と下型側面部材２０３とは、直接接触せず、図示のとおり、離型フィルム２を介して接する。また、図６に示すように、この状態で、下型キャビティ２０４と余剰樹脂収容部２０５との間に樹脂通路２０５ａが形成される。流動性樹脂２０ｂは、樹脂通路２０５ａを通って下型キャビティ２０４と余剰樹脂収容部２０５との間を移動できる。 Next, as shown by the arrow X2 in FIG. 6, the entire lower mold 200 is further raised. At this time, the excess resin separation member 103 is pushed up by the lower mold side member 203, and the elastic member 104 contracts. As a result, as shown in FIG. 6, the end portion of the substrate 1 on the surplus resin accommodating portion 205 side is the mold surface of the upper mold 100 (the lower surface of the upper mold substrate setting portion 102) and the protruding portion of the surplus resin separating member 103. (End). Accordingly, since the flowable resin is suppressed or prevented from flowing into the end portion of the substrate 1 on the surplus resin housing portion 205 side, it is possible to suppress or prevent the resin from adhering to the end portion. On the other hand, the end portion of the substrate 1 opposite to the surplus resin housing portion 205 is sandwiched between the upper mold substrate setting portion 102 and the lower mold side member 203 as shown in FIG. At this time, the board | substrate 1 and the lower mold | type side surface member 203 do not contact directly, but contact | connect through the release film 2 as shown in the figure. Further, as shown in FIG. 6, in this state, a resin passage 205 a is formed between the lower mold cavity 204 and the surplus resin container 205. The fluid resin 20b can move between the lower mold cavity 204 and the surplus resin container 205 through the resin passage 205a.
　さらに、図７の矢印Ｘ３に示すように、下型ベース部材２０１をさらに上昇させる。このとき、下型側面部材２０３は、前述のとおり、上型１００に直接又は間接的に接触しているため、これ以上上昇しない。一方、下型底面部材２０２及び樹脂加圧部材２０６は、下型ベース部材２０１とともに上昇し、弾性部材２０８、２０９、２１０及び２１１は、収縮する。図示のとおり、ストッパ２０７が下型側面部材２０３に接触することで、下型ベース部材２０１がそれ以上上昇せず、その位置で固定されるので、下型キャビティ２０４の深さが所定深さで保持される。そして、このとき、図示のとおり、下型キャビティ２０４が流動性樹脂２０ｂにより充填される。それとともに、余剰の流動性樹脂２０ｂ（余剰樹脂）が、樹脂通路２０５ａを通って余剰樹脂収容部２０５に流れ込み、余剰樹脂収容部２０５に余剰の流動性樹脂（余剰樹脂）２０ｃとして充填される。このとき、弾性部材２１１の伸長力が樹脂加圧部材２０６に伝わることで、樹脂加圧部材２０６により、下型キャビティ２０４内の流動性樹脂２０ｂ及び余剰樹脂収容部２０５内の流動性樹脂（余剰樹脂）２０ｃが加圧される。また、このとき、弾性部材２１１が伸縮可能であることにより、樹脂加圧部材２０６が上下動可能で、これにより、余剰樹脂収容部２０５の容量が変化可能である。したがって、余剰樹脂収容部２０５内の樹脂量がばらついても、余剰樹脂収容部２０５内に樹脂の未充填が発生する（樹脂圧がかからなくなる）ことを抑制又は防止できる。これにより、例えば、パッケージに樹脂の未充填（ボイド、欠け等）が発生する等の成型不具合を抑制又は防止可能である。 Furthermore, as shown by an arrow X3 in FIG. 7, the lower mold base member 201 is further raised. At this time, since the lower mold side member 203 is in direct or indirect contact with the upper mold 100 as described above, it does not rise any further. On the other hand, the lower mold bottom member 202 and the resin pressure member 206 rise together with the lower mold base member 201, and the elastic members 208, 209, 210, and 211 contract. As shown in the figure, the stopper 207 contacts the lower mold side surface member 203, so that the lower mold base member 201 does not rise any further and is fixed at that position. Therefore, the depth of the lower mold cavity 204 is a predetermined depth. Retained. At this time, as shown, the lower mold cavity 204 is filled with the fluid resin 20b. At the same time, the surplus fluid resin 20b (surplus resin) flows into the surplus resin container 205 through the resin passage 205a, and is filled as the surplus fluid resin (surplus resin) 20c. At this time, the extension force of the elastic member 211 is transmitted to the resin pressure member 206, so that the resin pressure member 206 causes the fluid resin 20b in the lower mold cavity 204 and the fluid resin in the excess resin container 205 (surplus) Resin) 20c is pressurized. At this time, since the elastic member 211 can be expanded and contracted, the resin pressure member 206 can be moved up and down, whereby the capacity of the surplus resin container 205 can be changed. Therefore, even if the amount of resin in the surplus resin container 205 varies, it is possible to suppress or prevent the resin from being unfilled in the surplus resin container 205 (resin pressure is not applied). Thereby, for example, molding defects such as occurrence of unfilled resin (voids, chips, etc.) in the package can be suppressed or prevented.
　さらに、図８～１０に示すとおり、上型１００及び下型２００を型開きする工程（型開き工程）を行う。また、このとき、略同時に、余剰樹脂収容部２０５内の余剰樹脂を、下型キャビティ２０４内で硬化した樹脂から分離する工程（余剰樹脂分離工程）を行う。まず、図８に示すように、流動性樹脂２０ｂ及び２０ｃをそれぞれ硬化（固化）させて硬化樹脂２０及び２０ｄとした後に、下型ベース部材２０１を、矢印Ｘ４の方向に下降させる。図示のとおり、下型キャビティ２０４内で硬化した硬化樹脂（封止樹脂）は符号２０で示しており、それ以外の箇所（余剰樹脂収容部２０５内及び樹脂通路２０５ａ内）で硬化した余剰樹脂は、符号２０ｄで表している。なお、流動性樹脂２０ｂ及び２０ｃの硬化（固化）は、流動性樹脂２０ｂ及び２０ｃが熱硬化性樹脂である場合は、例えば、型締め状態において、昇温された成形型１０により流動性樹脂２０ｂ及び２０ｃの加熱を続けることで行ってもよい。また、流動性樹脂２０ｂ及び２０ｃが熱可塑性樹脂である場合は、例えば、成形型１０の加熱を停止してしばらく放置することにより流動性樹脂２０ｂ及び２０ｃの固化を行うことができる。そして、下型ベース部材２０１の下降により、図８に示すとおり、下型底面部材２０２及び樹脂加圧部材２０６が下型ベース部材２０１とともに下降し、硬化樹脂２０及び硬化した余剰樹脂２０ｄの底面から引き離される。 Further, as shown in FIGS. 8 to 10, a process of opening the upper mold 100 and the lower mold 200 (mold opening process) is performed. At this time, a process of separating the excess resin in the excess resin housing portion 205 from the resin cured in the lower mold cavity 204 (surplus resin separation process) is performed substantially simultaneously. First, as shown in FIG. 8, after the fluid resins 20b and 20c are cured (solidified) to be cured resins 20 and 20d, the lower mold base member 201 is lowered in the direction of the arrow X4. As shown in the figure, the cured resin (sealing resin) cured in the lower mold cavity 204 is indicated by reference numeral 20, and the excess resin cured at other locations (in the excess resin accommodating portion 205 and in the resin passage 205 a) , 20d. The fluidizing resins 20b and 20c are cured (solidified) when the fluidizing resins 20b and 20c are thermosetting resins. And 20c may be continued. When the fluid resins 20b and 20c are thermoplastic resins, for example, the fluid resins 20b and 20c can be solidified by stopping the heating of the mold 10 and leaving it for a while. Then, as the lower mold base member 201 descends, as shown in FIG. 8, the lower mold bottom surface member 202 and the resin pressure member 206 descend together with the lower mold base member 201, and from the bottom surface of the cured resin 20 and the cured excess resin 20 d. Torn apart.
　つぎに、図９の矢印Ｘ５に示すとおり、下型２００全体をさらに下降させる。これにより、下型側面部材２０３が、下型キャビティ２０４内で硬化した硬化樹脂２０から引き離される。これに伴い、弾性部材１０４の復原力（伸長力）で、余剰樹脂分離ブロック１０３が下型２００とともに下降する。すなわち、余剰樹脂分離ブロック１０３が上型１００に対し相対的に下降する。これにより、硬化した余剰樹脂２０ｄも、下型２００及び余剰樹脂分離ブロック１０３とともに下降する。このとき、図示のとおり、下型キャビティ２０４内で硬化した硬化樹脂（封止樹脂）２０は、基板１とともに上型基板セット部１０２に固定されたままなので、余剰樹脂２０ｄと分離される。このようにして、硬化樹脂（封止樹脂、パッケージ）２０及び基板１から形成された圧縮成形品（樹脂成形品）３０と余剰樹脂２０ｄとを分離することができる。 Next, as shown by an arrow X5 in FIG. 9, the entire lower mold 200 is further lowered. As a result, the lower mold side member 203 is separated from the cured resin 20 cured in the lower mold cavity 204. Accordingly, the surplus resin separation block 103 is lowered together with the lower mold 200 by the restoring force (extension force) of the elastic member 104. That is, the surplus resin separation block 103 is lowered relative to the upper mold 100. As a result, the cured surplus resin 20d is also lowered together with the lower mold 200 and the surplus resin separation block 103. At this time, as shown in the figure, the cured resin (sealing resin) 20 cured in the lower mold cavity 204 remains separated from the excess resin 20d because it remains fixed to the upper mold substrate set portion 102 together with the substrate 1. In this manner, the compression molded product (resin molded product) 30 formed from the cured resin (sealing resin, package) 20 and the substrate 1 can be separated from the surplus resin 20d.
　そして、図１０の矢印Ｘ６に示すとおり、下型２００全体を、さらに、所定位置（図１～４と同じ、型締め前の位置）まで下降させる。これにより、余剰樹脂２０ｄが、余剰樹脂収容部２０５から分離される。硬化した余剰樹脂２０ｄは、例えば、余剰樹脂分離ブロック１０３から分離（離型）後、搬送機構（図示せず）を用いて成形型１０の外に搬送することにより、成形型１０から取り除いてもよい。以上のようにして、図１の圧縮成形装置を用いた圧縮成形方法を行うことができる。また、この圧縮成形方法は、圧縮成形品３０の製造方法でもある。 Then, as indicated by an arrow X6 in FIG. 10, the entire lower mold 200 is further lowered to a predetermined position (the same position as in FIGS. 1 to 4, before the mold clamping). Thereby, the surplus resin 20d is separated from the surplus resin container 205. The cured surplus resin 20d may be removed from the mold 10 by separating (releasing) from the surplus resin separation block 103 and then transporting it to the outside of the mold 10 using a transport mechanism (not shown). Good. As described above, the compression molding method using the compression molding apparatus of FIG. 1 can be performed. This compression molding method is also a method for manufacturing the compression molded product 30.
　なお、図１～１０に示した圧縮成形装置及び圧縮成形方法は、本発明の趣旨を逸脱しない範囲内で、適宜変更が可能である。例えば、図２～１０では、離型フィルム２を下型２００にセットする例を示したが、離型フィルムを用いずに圧縮成形方法を実施することもできる。 It should be noted that the compression molding apparatus and the compression molding method shown in FIGS. 1 to 10 can be changed as appropriate without departing from the spirit of the present invention. For example, FIGS. 2 to 10 show an example in which the release film 2 is set in the lower mold 200, but the compression molding method can be performed without using the release film.
　本発明では、樹脂成形方法として、圧縮成形を用いる。 In the present invention, compression molding is used as the resin molding method.
　一般に、樹脂成形方法としては、圧縮成形及びトランスファ成形が用いられている。トランスファ成形は、成形時の型キャビティ内の樹脂量を一定に保ちやすいため、樹脂成形品の樹脂厚み（パッケージ厚み）が一定に保たれやすいという利点がある。一方、トランスファ成形は、成形時に樹脂を型キャビティ内に流し込むため、前記樹脂の流動により、樹脂成形品の部品の不良（例えば、ワイヤの変形・切断・接触等）、ボイド（気泡）、未充填部等の問題が生じるおそれがある。 Generally, compression molding and transfer molding are used as resin molding methods. Transfer molding has the advantage that the resin thickness (package thickness) of the resin molded product can be easily maintained because the amount of resin in the mold cavity during molding is easily kept constant. On the other hand, in transfer molding, since resin flows into the mold cavity during molding, the resin flow causes defective parts of the resin molded product (for example, deformation, cutting, contact, etc. of the wire), voids (bubbles), unfilled There is a risk of problems such as parts.
　圧縮成形における樹脂量のばらつき（パッケージ厚みのばらつき）の問題点を解決するためには、以下の方法が考えられる。すなわち、あらかじめ、圧縮成形に必要な分量に加え、さらに余剰の分量を含む成形用樹脂を、圧縮成形型の型キャビティ内に収容しておく。そして、圧縮成形時（型締め時）に、前記余剰の樹脂が、前記型キャビティ内から流れだし、前記型キャビティ内に、圧縮成形に必要な分量の前記樹脂のみが残るようにしておく。そして、圧縮成形後に、圧縮成形品（樹脂成形品）を、前記余剰樹脂ごと成形型から取り外す。その後に、前記余剰樹脂を成形型の外で前記圧縮成形品から分離する。しかし、この方法では、成形済み基板から余剰樹脂を取り除く機構（工程）を、成形型以外に別途用意する必要があるので、圧縮成形装置の装置サイズが大きくなったり、複雑化する。また、この方法では、前記余剰樹脂の分離操作のために、圧縮成形品の製造工程が煩雑になる。さらに、この方法では、余剰樹脂との分離前の圧縮成形品を、余剰樹脂とともに成形型外に搬送する必要がある。そして、前記圧縮成形品は、例えば、後述する図１８（ｂ）のように、成形済みの基板の外周に余剰樹脂が貼り付くことになる。そうすると、実質的に基板を平面視したサイズが、成形前の基板よりも成形済み基板の方が余剰樹脂の分だけ大きくなる。すなわち、成形前と後とで、基板サイズが実質的に変わることになる。これにより、例えば、基板搬送機構を２系統用意するか、又は、１系統でサイズ可変の基板搬送機構を用意することになる。このため、さらに圧縮成形装置の装置サイズが大きくなったり、複雑化する。 In order to solve the problem of variation in resin amount (variation in package thickness) in compression molding, the following methods can be considered. That is, a molding resin containing a surplus amount in addition to the amount necessary for compression molding is previously stored in the mold cavity of the compression mold. Then, at the time of compression molding (die clamping), the excess resin flows out from the mold cavity so that only the amount of the resin necessary for compression molding remains in the mold cavity. After the compression molding, the compression molded product (resin molded product) is removed from the mold together with the excess resin. Thereafter, the excess resin is separated from the compression molded product outside the mold. However, in this method, it is necessary to separately prepare a mechanism (process) for removing excess resin from the molded substrate in addition to the mold, so that the apparatus size of the compression molding apparatus becomes large or complicated. Moreover, in this method, the manufacturing process of the compression molded product becomes complicated due to the separation operation of the surplus resin. Furthermore, in this method, it is necessary to transport the compression molded product before separation from the surplus resin to the outside of the mold together with the surplus resin. And as for the said compression molded product, as shown in FIG.18 (b) mentioned later, surplus resin adheres to the outer periphery of the shape | molded board | substrate. As a result, the size of the substrate viewed in plan is substantially larger by the surplus resin in the molded substrate than in the substrate before molding. That is, the substrate size changes substantially before and after molding. Thereby, for example, two substrate transport mechanisms are prepared, or a substrate transport mechanism having a variable size is prepared in one system. For this reason, the apparatus size of the compression molding apparatus further increases or becomes complicated.
　これに対し、本発明では、圧縮成形後に、樹脂成形品及び余剰樹脂を成形型内から取り出すことなく、成形型内で樹脂成形品と余剰樹脂とを分離することができる。すなわち、本発明によれば、前記余剰樹脂の分離工程を含む圧縮成形方法を簡便に行うことができる。これにより、前述のとおり、簡便にパッケージ（樹脂成形品における樹脂の部分）厚みのばらつきを抑制することが可能である。また、本発明によれば、例えば、成形前の基板と成形済み基板（圧縮成形品）とで、実質的に基板を平面視したサイズの変化を抑制又は防止することができる。これによれば、基板搬送機構を２系統用意するか、又は、１系統でサイズ可変の基板搬送機構を用意する必要がなくなり、基板搬送機構の構成を単純化できる。 On the other hand, in the present invention, after the compression molding, the resin molded product and the excess resin can be separated in the molding die without taking out the resin molded product and the excess resin from the molding die. That is, according to the present invention, a compression molding method including a step of separating the excess resin can be easily performed. Thereby, as above-mentioned, it is possible to suppress the dispersion | variation in the thickness of a package (resin part in a resin molded product) simply. Further, according to the present invention, for example, it is possible to suppress or prevent a change in size when the substrate is viewed in plan between the substrate before molding and the molded substrate (compression molded product). According to this, it is not necessary to prepare two systems of substrate transport mechanisms or to prepare a substrate transport mechanism having a variable size in one system, and the configuration of the substrate transport mechanism can be simplified.
　図１１（ａ）及び（ｂ）に、本発明の圧縮成形装置における成形型の別の一例を示す。同図において、図１～１０と同じ構成要素は、同一の符号で示している。図示のとおり、この成形型１０ａは、エジェクターピン１０５を有すること以外は、図１～１０の成形型１０と同様である。なお、図１１では、下型側面部材２０３と下型ベース部材２０１とを接続する弾性部材２０８、２０９及び２１０のうち２１０が省略されているが、これに限定されず、図１～１０と同様に弾性部材２１０を有していてもよい。 11 (a) and 11 (b) show another example of a molding die in the compression molding apparatus of the present invention. In the figure, the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals. As shown in the figure, this mold 10a is the same as the mold 10 of FIGS. 1 to 10 except that it has an ejector pin 105. In FIG. 11, 210 of the elastic members 208, 209, and 210 connecting the lower mold side member 203 and the lower mold base member 201 is omitted, but is not limited to this, and is the same as in FIGS. The elastic member 210 may be provided.
　図１１に示すとおり、エジェクターピン１０５は、上型基板セット部１０２の上端（上面）から余剰樹脂分離部材１０３の下端（下面）まで貫通する貫通孔内を上下動可能である。エジェクターピン１０５の上端には、エジェクターピン支持部材（つば）１０６が固定されている。上型ベース部材１０１は、その上部の一部がくり抜かれ、エジェクターピン支持部材１０６の収容部を形成している。エジェクターピン支持部材１０６の下端（下面）は、弾性部材１０７を介して、前記収容部の底面で、上型ベース部材１０１及び上型基板セット部１０２に接続されている。エジェクターピン１０５は、弾性部材１０４及び１０７の内部を貫通している。 As shown in FIG. 11, the ejector pin 105 can move up and down in a through-hole penetrating from the upper end (upper surface) of the upper mold substrate setting portion 102 to the lower end (lower surface) of the surplus resin separating member 103. An ejector pin support member (brim) 106 is fixed to the upper end of the ejector pin 105. The upper mold base member 101 is partially cut out to form an accommodating portion for the ejector pin support member 106. The lower end (lower surface) of the ejector pin support member 106 is connected to the upper mold base member 101 and the upper mold substrate setting section 102 via the elastic member 107 at the bottom surface of the housing section. The ejector pin 105 passes through the elastic members 104 and 107.
　図１１の成形型１０ａ及びそれを含む圧縮成形装置を用いた圧縮成形方法は、例えば、図２～１０と同様にして行うことができる。図１１（ａ）は、図２～１０と同様の工程を行った後の状態である。すなわち、図１１（ａ）は、同図の矢印Ｘ６に示すとおり、下型２００全体を、所定位置まで下降させた状態である。図示のとおり、硬化した余剰樹脂２０ｄは、樹脂成形品３０から分離された状態で、余剰樹脂分離部材１０３の下端（下面）に付着している。この状態から、図１１（ｂ）に示すように、エジェクターピン支持部材１０６を矢印Ｙ１の方向に押し下げ、エジェクターピン１０５を下降させる。これにより、図示のとおり、余剰樹脂２０ｄを押し下げて余剰樹脂分離部材１０３から分離（離型）することができる。余剰樹脂分離ブロック１０３から分離（離型）後の余剰樹脂２０ｄは、例えば、搬送機構（図示せず）を用いて成形型１０の外に搬送することにより、成形型１０から取り除いてもよい。 A compression molding method using the molding die 10a of FIG. 11 and a compression molding apparatus including the same can be performed, for example, in the same manner as in FIGS. FIG. 11A shows a state after performing the same steps as in FIGS. That is, FIG. 11A shows a state where the entire lower mold 200 is lowered to a predetermined position as indicated by an arrow X6 in FIG. As illustrated, the cured excess resin 20 d is attached to the lower end (lower surface) of the excess resin separation member 103 in a state of being separated from the resin molded product 30. From this state, as shown in FIG. 11B, the ejector pin support member 106 is pushed down in the direction of the arrow Y1, and the ejector pin 105 is lowered. Thereby, as shown in the figure, the excess resin 20d can be pushed down and separated (released) from the excess resin separation member 103. The surplus resin 20d after being separated (released) from the surplus resin separation block 103 may be removed from the mold 10 by, for example, transporting it outside the mold 10 using a transport mechanism (not shown).
　なお、図１１では、離型フィルムを用いない例を示したが、これに限定されず、例えば、図２～１０と同様に、離型フィルムを用いてもよい。 In addition, although the example which does not use a release film was shown in FIG. 11, it is not limited to this, For example, you may use a release film similarly to FIGS.
　図１２に、本発明の圧縮成形装置における成形型の構成のさらに別の一例を示す。この成形型１０ｂは、下型キャビティを２つ有し、２枚の基板を略同時に圧縮成形可能である。より具体的には、図示のとおり、成形型１０ｂは、下型キャビティ２０４を２つ有し、それらが、余剰樹脂収容部２０５を挟んで両側に配置されている。２つの下型キャビティ２０４は、それぞれ、余剰樹脂収容部２０５とつながっており、下型キャビティ２０４と余剰樹脂収容部２０５との間を樹脂が移動可能である。上型基板セット部１０２の下面（下端）には、２つの下型キャビティ２０４の真上の位置に、それぞれ基板をセット（固定）することで、２枚の基板をセット可能である。これら以外は、図１２の成形型１０ｂは、図１～１０の成形型１０と同様である。 FIG. 12 shows still another example of the configuration of the molding die in the compression molding apparatus of the present invention. This mold 10b has two lower mold cavities and can compress and mold two substrates substantially simultaneously. More specifically, as shown in the figure, the molding die 10 b has two lower mold cavities 204, which are arranged on both sides with the surplus resin accommodating portion 205 interposed therebetween. The two lower mold cavities 204 are respectively connected to the surplus resin accommodating portion 205, and the resin can move between the lower mold cavity 204 and the surplus resin accommodating portion 205. Two substrates can be set by setting (fixing) the substrates on the lower surface (lower end) of the upper mold substrate setting portion 102 at positions just above the two lower mold cavities 204, respectively. Except for these, the mold 10b in FIG. 12 is the same as the mold 10 in FIGS.
　図１２の圧縮成形装置の使用方法は特に限定されず、例えば、図１～１０の圧縮成形装置と同様にして使用できる。図１２の圧縮成形装置によれば、２枚の基板を略同時に圧縮成形可能なので、圧縮成形方法（圧縮成形品の製造方法）を効率よく実施できる。なお、図１２では、離型フィルムを用いずに下型キャビティ２０４内に顆粒樹脂２０ａを供給（セット）した状態を示しているが、これに限定されず、図２～１０と同様に離型フィルムを用いてもよい。 12 is not particularly limited, and for example, the compression molding apparatus can be used in the same manner as the compression molding apparatus of FIGS. According to the compression molding apparatus of FIG. 12, two substrates can be compression-molded substantially simultaneously, so that the compression molding method (a method for producing a compression-molded product) can be efficiently performed. FIG. 12 shows a state in which the granular resin 20a is supplied (set) into the lower mold cavity 204 without using a release film, but the present invention is not limited to this, and the mold release is performed as in FIGS. A film may be used.
　図１３～１５の工程断面図に、実施例１（図１～１０）の成形型を用いた圧縮成形方法の別の一例における樹脂材料供給工程を、模式的に示す。この例では、前記樹脂材料供給工程（成形型の型キャビティ内に樹脂材料を供給する工程）において、型キャビティ内への樹脂材料の供給に加え、余剰樹脂収容部樹脂材料供給機構を用いて、余剰樹脂収容部に樹脂材料を供給する。 13 to 15 schematically show a resin material supply process in another example of the compression molding method using the mold of Example 1 (FIGS. 1 to 10). In this example, in the resin material supply step (step of supplying the resin material into the mold cavity of the mold), in addition to supplying the resin material into the mold cavity, the surplus resin container resin material supply mechanism is used. Resin material is supplied to the surplus resin container.
　まず、図２と同様に基板１及び離型フィルム２をセットする。その状態で、図１３に示すとおり、上型１００と下型２００との間に、樹脂材料（顆粒樹脂）２０ａを収容した樹脂供給機構４０を２つ侵入させる。２つの樹脂供給機構４０のうち一方は、型キャビティ２０４内に樹脂材料２０ａを供給する「型キャビティ樹脂材料供給機構」として機能し、他方は、余剰樹脂収容部２０５内に樹脂材料２０ａを供給する「余剰樹脂収容部樹脂材料供給機構」として機能する。樹脂供給機構４０は、図示のとおり、樹脂供給部４１と、下部シャッタ４２とから構成されている。樹脂供給部４１は、上端及び下端に開口が形成された枠状の形状である。樹脂供給部（枠）４１下端の開口は、下部シャッタ４２により閉じられている。これにより、図１３に示すとおり、樹脂供給部（枠）４１と下部シャッタ４２とに囲まれた空間内に、樹脂材料２０ａを収容可能である。 First, the substrate 1 and the release film 2 are set as in FIG. In this state, as shown in FIG. 13, two resin supply mechanisms 40 containing a resin material (granular resin) 20 a are inserted between the upper mold 100 and the lower mold 200. One of the two resin supply mechanisms 40 functions as a “mold cavity resin material supply mechanism” that supplies the resin material 20 a into the mold cavity 204, and the other supplies the resin material 20 a into the surplus resin container 205. It functions as a “surplus resin container resin material supply mechanism”. The resin supply mechanism 40 is comprised from the resin supply part 41 and the lower shutter 42 as shown in the figure. The resin supply unit 41 has a frame shape in which openings are formed at the upper end and the lower end. The opening at the lower end of the resin supply unit (frame) 41 is closed by a lower shutter 42. Accordingly, as shown in FIG. 13, the resin material 20 a can be accommodated in a space surrounded by the resin supply part (frame) 41 and the lower shutter 42.
　つぎに、図１４に示すとおり、下部シャッタ４２を矢印ａ１及びａ２の方向に（水平に）引いて樹脂供給部（枠）４１下端の開口を開くことにより、前記開口から樹脂材料２０ａを落下させる。これにより、図示のとおり、下型キャビティ２０４内及び余剰樹脂収容部２０５内に樹脂材料２０ａを供給（載置）することができる。その後、２つの樹脂供給機構４０を上型１００と下型２００との間から退出させると、図１５に示すように、下型キャビティ２０４内及び余剰樹脂収容部２０５内にそれぞれ樹脂材料２０ａが供給された状態となる。その後は、例えば、図４～１０と同様の工程により、圧縮成形を行うことができる。 Next, as shown in FIG. 14, the lower shutter 42 is pulled (horizontally) in the directions of arrows a1 and a2 to open the lower end of the resin supply unit (frame) 41, thereby dropping the resin material 20a from the opening. . Thereby, as shown in the figure, the resin material 20a can be supplied (placed) in the lower mold cavity 204 and the excess resin container 205. Thereafter, when the two resin supply mechanisms 40 are withdrawn from between the upper mold 100 and the lower mold 200, the resin material 20a is supplied into the lower mold cavity 204 and the excess resin storage portion 205 as shown in FIG. It will be in the state. Thereafter, for example, compression molding can be performed by the same steps as in FIGS.
　本実施例のように、樹脂材料供給工程において、型キャビティに加えて余剰樹脂収容部にも樹脂材料を供給すると、圧縮成形の工程において、樹脂の流動を、より少なく抑えることができる。これにより、前述した樹脂成形品の部品の不良（例えば、ワイヤの変形・切断・接触、チップのシフト等）、ボイド（気泡）、未充填部等の問題を、さらに効果的に抑制又は防止できる。 As in this embodiment, when the resin material is supplied to the surplus resin container in addition to the mold cavity in the resin material supply process, the flow of the resin can be suppressed to a smaller level in the compression molding process. As a result, problems such as defective parts of the resin molded product (for example, wire deformation / cutting / contact, chip shift, etc.), voids (bubbles), unfilled portions, etc. can be more effectively suppressed or prevented. .
　なお、図１３～１５では、「型キャビティ樹脂材料供給機構」及び「余剰樹脂収容部樹脂材料供給機構」を用いて略同時に樹脂材料を供給したが、余剰樹脂収容部に樹脂材料を供給する方法は、これに限定されない。例えば、下型キャビティ２０４及び余剰樹脂収容部２０５への樹脂材料２０ａの供給の順序は、図１３～１５では略同時であるが、これに限定されず、どちらかが先でもよい。また、図１３～１５では樹脂供給機構４０を２つ用いているが、これに限定されない。例えば、樹脂供給機構４０を１つのみ用い、これにより、下型キャビティ２０４及び余剰樹脂収容部２０５への樹脂材料２０ａの供給を、略同時でなく経時的に行ってもよい。 13 to 15, the resin material is supplied almost simultaneously using the “mold cavity resin material supply mechanism” and the “surplus resin container resin material supply mechanism”, but the method of supplying the resin material to the surplus resin container is shown. Is not limited to this. For example, the order of supplying the resin material 20a to the lower mold cavity 204 and the surplus resin container 205 is substantially the same in FIGS. 13 to 15, but is not limited to this, and either one may be first. 13 to 15 use two resin supply mechanisms 40, the present invention is not limited to this. For example, only one resin supply mechanism 40 may be used, and thereby the resin material 20a may be supplied to the lower mold cavity 204 and the surplus resin container 205 over time rather than substantially simultaneously.
　また、例えば、実施例１の圧縮成形方法（図２～１０）における樹脂材料供給工程において、図１３～１５と同様に、樹脂供給部４１と、下部シャッタ４２とから構成された樹脂供給機構４０を用いても良い。 Further, for example, in the resin material supply step in the compression molding method of the first embodiment (FIGS. 2 to 10), as in FIGS. 13 to 15, the resin supply mechanism 40 including the resin supply unit 41 and the lower shutter 42 is used. May be used.
　図１６の平面図に、本発明の圧縮成形装置の別の一例の構成を模式的に示す。図示のとおり、この圧縮成形装置１０００は、成形ユニット１１００と、基板供給ユニット１２００と、樹脂材料供給ユニット１３００と、制御部１４００とを有する。基板供給ユニット１２００と、樹脂材料供給ユニット１３００とは、成形ユニット１１００を挟んで互いに反対側に配置されている。基板供給ユニット１２００内には、基板供給機構１２１０が配置されている。樹脂材料供給ユニット１３００内には、樹脂材料供給機構１３１０が配置されている。制御部１４００は、基板供給ユニット１２００内に配置されている。成形ユニット１１００内には、成形型（図示せず）が配置されている。前記成形型は、本発明の圧縮成形装置における成形型としての特徴を有すること以外は、特に限定されず、任意である。例えば、前記成形型は、実施例１（図１～１０）の成形型１０、実施例２（図１１）の成形型１０ａ、又は実施例３（図１２）の成形型１０ｂと同じでもよい。 FIG. 16 is a plan view schematically showing a configuration of another example of the compression molding apparatus of the present invention. As illustrated, the compression molding apparatus 1000 includes a molding unit 1100, a substrate supply unit 1200, a resin material supply unit 1300, and a control unit 1400. The substrate supply unit 1200 and the resin material supply unit 1300 are arranged on opposite sides of the molding unit 1100. A substrate supply mechanism 1210 is disposed in the substrate supply unit 1200. A resin material supply mechanism 1310 is arranged in the resin material supply unit 1300. The controller 1400 is disposed in the substrate supply unit 1200. A molding die (not shown) is arranged in the molding unit 1100. The said shaping | molding die is not specifically limited except having the characteristic as a shaping | molding die in the compression molding apparatus of this invention, It is arbitrary. For example, the mold may be the same as the mold 10 of Example 1 (FIGS. 1 to 10), the mold 10a of Example 2 (FIG. 11), or the mold 10b of Example 3 (FIG. 12).
　図１６の圧縮成形装置は、本発明の圧縮成形方法又は圧縮成形品の製造方法に用いることができる。具体的な使用方法は、特に限定されないが、例えば、実施例１～４で説明した圧縮成形方法又は圧縮成形品の製造方法に用いることができる。 16 can be used in the compression molding method or the method of manufacturing a compression molded product of the present invention. The specific method of use is not particularly limited, and for example, it can be used in the compression molding method or the method of manufacturing a compression molded product described in Examples 1 to 4.
　図１６の圧縮成形装置は、より具体的には、例えば、以下のように使用できる。例えば、基板供給ユニット１２００内の基板供給機構１２１０には、圧縮成形用の基板を配置しておき、前記基板を成形型に供給することができる。前記基板は、例えば、基板搬送機構（図示せず）により成形型の位置まで搬送してもよい。前記基板搬送機構は、例えば、基板供給ユニット１２００内に配置すればよい。また、樹脂材料供給ユニット１３００内の樹脂材料供給機構１３１０には、樹脂材料を配置しておき、前記樹脂材料を成形型の型キャビティ内に供給することができる（樹脂材料供給工程）。前記樹脂材料は、例えば、樹脂材料搬送機構（図示せず）により成形型の位置まで搬送してもよい。前記樹脂材料搬送機構は、例えば、樹脂材料供給ユニット１３００内に配置すればよい。前記樹脂材料搬送機構は、例えば、実施例４（図１３～１５）で説明した樹脂供給機構４０を用いて樹脂材料を搬送してもよい。 More specifically, the compression molding apparatus of FIG. 16 can be used as follows, for example. For example, a substrate for compression molding can be placed in the substrate supply mechanism 1210 in the substrate supply unit 1200, and the substrate can be supplied to the mold. For example, the substrate may be transported to the position of the mold by a substrate transport mechanism (not shown). The substrate transport mechanism may be disposed in the substrate supply unit 1200, for example. In addition, a resin material can be placed in the resin material supply mechanism 1310 in the resin material supply unit 1300, and the resin material can be supplied into the mold cavity of the mold (resin material supply process). For example, the resin material may be transported to the position of the mold by a resin material transport mechanism (not shown). What is necessary is just to arrange | position the said resin material conveyance mechanism in the resin material supply unit 1300, for example. The resin material transport mechanism may transport the resin material using, for example, the resin supply mechanism 40 described in the fourth embodiment (FIGS. 13 to 15).
　また、制御部１４００は、図１６の圧縮成形装置１０００の動作の一部又は全部を制御する。制御部１４００が制御する動作は、例えば、前記本発明の圧縮成形方法又は圧縮成形品の製造方法における工程の一部又は全部でもよく、例えば、成形型の型締め及び型開きの一方又は両方の工程を含んでいてもよい。例えば、制御部１４００により型締めを制御し、型締め時における型キャビティの深さを所定深さで保持してもよい。この場合、制御部１４００は、本発明の圧縮成形装置における前記「位置決め機構」の少なくとも一部として機能する。また、前記「位置決め機構」は、例えば、制御部による型締めの制御に加え、実施例１～４で説明したような、ベース部材に固定されたストッパを用いてもよい。さらに、制御部１４００が制御する動作は、例えば、基板供給ユニット１２００による成形型への基板の供給（基板供給工程）、及び、樹脂材料供給ユニット１３００による成形型の型キャビティ内への樹脂材料の供給（樹脂材料供給工程）を、それぞれ含んでもよいし、含まなくてもよい。 Further, the control unit 1400 controls part or all of the operation of the compression molding apparatus 1000 of FIG. The operation controlled by the control unit 1400 may be, for example, part or all of the steps in the compression molding method or compression molding product manufacturing method of the present invention. For example, one or both of mold clamping and mold opening of the molding die may be performed. A process may be included. For example, the mold clamping may be controlled by the control unit 1400, and the depth of the mold cavity at the time of mold clamping may be held at a predetermined depth. In this case, the control unit 1400 functions as at least a part of the “positioning mechanism” in the compression molding apparatus of the present invention. The “positioning mechanism” may use, for example, a stopper fixed to the base member as described in the first to fourth embodiments in addition to the mold clamping control by the control unit. Furthermore, the operation controlled by the control unit 1400 includes, for example, substrate supply to the mold by the substrate supply unit 1200 (substrate supply process), and resin material into the mold cavity of the mold by the resin material supply unit 1300. The supply (resin material supply step) may or may not be included.
　また、成形ユニット１１００と、基板供給ユニット１２００と、樹脂材料供給ユニット１３００と、制御部１４００との配置は、図１６の配置に限定されず、任意である。さらに、成形ユニット１１００の数は、図１６では３つであるが、これに限定されず任意であり、１つ、２つ、又は４つ以上でもよい。図１６のように成形ユニット１１００を複数有すると、例えば、複数の基板を略同時に圧縮成形することが可能で、圧縮成形の効率がよい。または、例えば、基板の一方の面を１つの成形ユニット１１００で圧縮成形した後に、前記基板の他方の面を他の成形ユニット１１００で圧縮成形することができる。すなわち、基板の両面の圧縮成形に対応できる。 Further, the arrangement of the molding unit 1100, the substrate supply unit 1200, the resin material supply unit 1300, and the control unit 1400 is not limited to the arrangement shown in FIG. Furthermore, although the number of the forming units 1100 is three in FIG. 16, the number is not limited to this and is arbitrary, and may be one, two, or four or more. When a plurality of molding units 1100 are provided as shown in FIG. 16, for example, a plurality of substrates can be compression-molded substantially simultaneously, and compression molding efficiency is good. Alternatively, for example, after one surface of the substrate is compression-molded by one molding unit 1100, the other surface of the substrate can be compression-molded by another molding unit 1100. That is, it can cope with compression molding on both sides of the substrate.
　さらに、図１６の圧縮成形装置１０００は、図示していない他の任意のユニット又は機構を有していてもよいし、有していなくてもよい。前記他の任意のユニット又は機構としては、例えば、離型フィルムを成形型に供給する離型フィルム供給ユニット等があげられる。前記離型フィルム供給ユニットは、例えば、離型フィルムが配置される離型フィルム供給機構と、その離型フィルムを成形型の位置まで搬送する離型フィルム搬送機構とを含んでいてもよい。 Furthermore, the compression molding apparatus 1000 in FIG. 16 may or may not have any other unit or mechanism not shown. Examples of the other arbitrary unit or mechanism include a release film supply unit that supplies a release film to a mold. The release film supply unit may include, for example, a release film supply mechanism in which the release film is disposed, and a release film transport mechanism that transports the release film to the position of the mold.
　つぎに、本発明により圧縮成形品を製造した場合の、余剰樹脂の形態の例について説明する。 Next, an example of the form of the surplus resin when a compression molded product is produced according to the present invention will be described.
　図１７（ａ）～（ｃ）のそれぞれの平面図に、本発明により製造される圧縮成形品及び余剰樹脂の構成の一例を、それぞれ示す。図示のとおり、図１７（ａ）～（ｃ）は、それぞれ、基板１及び硬化樹脂２０を含む樹脂成形品から余剰樹脂が分離される前の状態（例えば、実施例１における図８の状態）を表している。図示のとおり、図１７（ａ）～（ｃ）のそれぞれにおいて、基板１の一方の面は、その周縁部以外が、硬化樹脂２０で樹脂封止されている。また、硬化した余剰樹脂２０ｄは、硬化樹脂２０に連結しており、基板１の外周から突出している。図１７（ａ）は、余剰樹脂２０ｄが基板１の一辺から突出している形態を示す。図１７（ｂ）は、余剰樹脂２０ｄが基板１の左右の二辺から突出している形態を示す。図１７（ｃ）は、２つの圧縮成形品が、それぞれの硬化樹脂２０の部分で、余剰樹脂２０ｄを介して連結して一体となっている例を示している。図１７（ａ）は、例えば、実施例１（図１～１０）の成形型を用いて製造できる。図１７（ｂ）は、例えば、型キャビティの左右の両側に余剰樹脂収容部を配置した成形型（図示せず）を用いて製造できる。図１７（ｃ）は、例えば、実施例３（図１２）の成形型を用いて製造できる。 FIGS. 17 (a) to 17 (c) each show an example of the structure of the compression molded product and excess resin produced according to the present invention. As shown in FIGS. 17A to 17C, the state before the excess resin is separated from the resin molded product including the substrate 1 and the cured resin 20 (for example, the state of FIG. 8 in the first embodiment). Represents. As shown in FIG. 17A to FIG. 17C, one surface of the substrate 1 is resin-sealed with a cured resin 20 except for its peripheral edge. Further, the cured surplus resin 20 d is connected to the cured resin 20 and protrudes from the outer periphery of the substrate 1. FIG. 17A shows a form in which the excess resin 20 d protrudes from one side of the substrate 1. FIG. 17B shows a form in which the excess resin 20 d protrudes from the left and right sides of the substrate 1. FIG. 17 (c) shows an example in which two compression molded products are connected to each other at a portion of the cured resin 20 via an excess resin 20d. FIG. 17A can be manufactured using, for example, the mold of Example 1 (FIGS. 1 to 10). FIG. 17B can be manufactured using, for example, a mold (not shown) in which surplus resin containing portions are arranged on both the left and right sides of the mold cavity. FIG.17 (c) can be manufactured using the shaping | molding die of Example 3 (FIG. 12), for example.
　また、図１８（ａ）～（ｃ）に、本発明又は一般的な樹脂成形方法により製造可能な圧縮成形品及び余剰樹脂の構成の一例を、それぞれ示す。 FIGS. 18 (a) to 18 (c) show examples of configurations of compression molded products and surplus resin that can be manufactured by the present invention or a general resin molding method, respectively.
　図１８（ａ）は、一般的な樹脂成形方法により製造可能な樹脂成形品の構成の一例を示す。同図の樹脂成形品は、基板１の一方の面が、硬化樹脂２０で樹脂成形されている。硬化樹脂２０は、その周縁部に余剰樹脂を含む。前記余剰樹脂は、基板１の外周から突出していない。また、前記余剰樹脂は、樹脂成形品から分離されず、樹脂成形品（製品）の一部を構成する。 FIG. 18A shows an example of the configuration of a resin molded product that can be manufactured by a general resin molding method. In the resin molded product of the figure, one surface of the substrate 1 is resin-molded with a cured resin 20. The cured resin 20 includes excess resin at the peripheral edge. The surplus resin does not protrude from the outer periphery of the substrate 1. The surplus resin is not separated from the resin molded product and constitutes a part of the resin molded product (product).
　図１８（ｂ）は、一般的な樹脂成形方法により製造可能な樹脂成形品の構成の別の一例を示す。同図の樹脂成形品は、基板１の一方の面が、硬化樹脂２０で樹脂成形されている。硬化樹脂２０の外周には、余剰樹脂２０ｄが連結している。余剰樹脂２０ｄは、基板１の外周から突出している。余剰樹脂２０ｄは、図１８（ｂ）の樹脂成形品を成形型から取り外した（離型した）後に、前記樹脂成形品から分離される。 FIG. 18B shows another example of the configuration of a resin molded product that can be manufactured by a general resin molding method. In the resin molded product of the figure, one surface of the substrate 1 is resin-molded with a cured resin 20. An excess resin 20 d is connected to the outer periphery of the cured resin 20. The surplus resin 20 d protrudes from the outer periphery of the substrate 1. The excess resin 20d is separated from the resin molded product after the resin molded product in FIG. 18B is removed (released) from the mold.
　図１８（ｃ）は、本発明により製造可能な樹脂成形品（圧縮成形品）の構成の一例を示す。同図の樹脂成形品の構成は、紙面左右方向と紙面上下方向とを逆にしていること以外は、図１７（ｂ）と同様である。 FIG. 18C shows an example of the configuration of a resin molded product (compression molded product) that can be manufactured according to the present invention. The configuration of the resin molded product in the figure is the same as that in FIG. 17B except that the horizontal direction on the paper surface and the vertical direction on the paper surface are reversed.
　一般的な樹脂成形方法で基板を成形して樹脂成形品（例えば、前記基板上のチップを樹脂封止した、樹脂封止電子部品）を製造する場合、以下のような問題がある。 When manufacturing a resin molded product (for example, a resin-encapsulated electronic component in which a chip on the substrate is resin-sealed) by molding a substrate by a general resin molding method, there are the following problems.
　成形型において、基板の内側の位置に余剰樹脂収容部を設定すると、例えば図１８（ａ）のように、基板の内側に、樹脂成形品（製品）から分離できない余剰樹脂が存在することになる。この場合、基板の製品エリア（パッケージ面積）が小さくなり、基板１枚あたりの製品取数（基板に装着できる電子部品の数）が少なくなる。 In the molding die, when the surplus resin accommodating portion is set at a position inside the substrate, for example, as shown in FIG. 18A, surplus resin that cannot be separated from the resin molded product (product) exists inside the substrate. . In this case, the product area (package area) of the substrate is reduced, and the number of products per substrate (the number of electronic components that can be mounted on the substrate) is reduced.
　一方、成形型において、基板の外側の位置に余剰樹脂収容部を設定した場合、例えば図１８（ｂ）のように、成形済みの基板の外周に余剰樹脂が貼り付くことになる。そうすると、実質的に基板を平面視したサイズが、成形前の基板よりも成形済み基板の方が余剰樹脂の分だけ大きくなる。すなわち、成形前と後とで、基板サイズが実質的に変わることになる。これにより、例えば、基板搬送機構を２系統用意するか、又は、１系統でサイズ可変の基板搬送機構を用意することになる。このため、圧縮成形装置の装置サイズが大きくなったり、複雑化する。また、成形済み基板から余剰樹脂を取り除く機構（工程）を、成形型以外に別途用意する必要があるので、圧縮成形装置の装置サイズが大きくなったり、複雑化する。また、圧縮成形方法における工程が煩雑になる。 On the other hand, in the molding die, when the surplus resin container is set at a position outside the substrate, the surplus resin adheres to the outer periphery of the molded substrate, for example, as shown in FIG. As a result, the size of the substrate viewed in plan is substantially larger by the surplus resin in the molded substrate than in the substrate before molding. That is, the substrate size changes substantially before and after molding. Thereby, for example, two substrate transport mechanisms are prepared, or a substrate transport mechanism having a variable size is prepared in one system. For this reason, the apparatus size of a compression molding apparatus becomes large or complicated. Further, since it is necessary to prepare a mechanism (process) for removing excess resin from the molded substrate in addition to the mold, the size of the compression molding apparatus becomes large or complicated. Moreover, the process in the compression molding method becomes complicated.
　しかしながら、本発明によれば、基板の外側の位置に余剰樹脂収容部を設定しても、成形型内で、成形済み基板から余剰樹脂を取り除くことができる。このため、圧縮成形装置の装置サイズが大きくなったり、複雑化したりすることを効率良く防止又は抑制することができる。また、前述のとおり、簡便にパッケージ厚みのばらつきを抑制することが可能である。 However, according to the present invention, the surplus resin can be removed from the molded substrate in the mold even if the surplus resin container is set at a position outside the substrate. For this reason, it can prevent or suppress efficiently that the apparatus size of a compression molding apparatus becomes large or becomes complicated. Further, as described above, it is possible to easily suppress variation in package thickness.
　なお、本発明において、圧縮成形品及び余剰樹脂の構成は、図１７（ａ）～（ｃ）及び図１８（ｃ）に限定されず任意であり、例えば、図１８（ｂ）のような構成等でもよい。しかしながら、成形型内で圧縮成形品と余剰樹脂とを分離しやすい構成とすることが好ましい。 In the present invention, the configurations of the compression molded product and the surplus resin are not limited to those shown in FIGS. 17A to 17C and FIG. 18C, and are arbitrary, for example, as shown in FIG. Etc. However, it is preferable that the compression molded product and the excess resin be easily separated in the mold.
　さらに、本発明は、上述の各実施例に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。 Furthermore, the present invention is not limited to the above-described embodiments, and may be arbitrarily combined, changed, or selected as necessary without departing from the spirit of the present invention. It can be done.
　この出願は、２０１６年１１月２９日に出願された日本出願特願２０１６－２３１４９３を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2016-231493 filed on November 29, 2016, the entire disclosure of which is incorporated herein.
　１　基板
　２　離型フィルム
　１０、１０ａ、１０ｂ　成形型
　２０ａ　顆粒樹脂
　２０ｂ　溶融樹脂（流動性樹脂）
　２０ｃ　溶融した（流動性の）余剰樹脂
　２０ｄ　硬化した余剰樹脂
　２０　硬化樹脂（封止樹脂、パッケージ）
　３０　圧縮成形品
　４０　　樹脂供給機構
　４１　　樹脂供給部
　４２　　下部シャッタ
　１００　上型
　１０１　上型ベース部材（上型ベースブロック）
　１０２　上型基板セット部
　１０３　余剰樹脂分離部材（余剰樹脂分離ブロック）
　１０４　弾性部材
　１０５　エジェクターピン
　１０６　エジェクターピン支持部材
　１０７　弾性部材
　２００　下型
　２０１　ベース部材（下型ベース部材、下型ベースブロック）
　２０２　底面部材（下型底面部材）
　２０３　側面部材（下型側面部材）
　２０４　型キャビティ（下型キャビティ）
　２０５　余剰樹脂収容部
　２０５ａ　樹脂通路
　２０６　樹脂加圧部材（樹脂加圧ピン）
　２０７　ストッパ（位置決め機構）
　２０８、２０９、２１０、２１１　弾性部材
　１０００　圧縮成形装置
　１１００　成形ユニット
　１２００　基板供給ユニット
　１２１０　基板供給機構
　１３００　樹脂材料供給ユニット
　１３１０　樹脂材料供給機構
　１４００　制御部（位置決め機構）
　Ｘ１～Ｘ６　下型２００の移動方向を表す矢印
　Ｙ１　エジェクターピン１０５の移動方向を表す矢印
　ａ１、ａ２　下部シャッタ４２の移動方向を表す矢印 DESCRIPTION OF SYMBOLS 1 Substrate 2 Release film 10, 10a, 10b Mold 20a Granule resin 20b Molten resin (flowable resin)
20c Molten (fluid) surplus resin 20d Cured surplus resin 20 Cured resin (sealing resin, package)
30 Compression Molded Product 40 Resin Supply Mechanism 41 Resin Supply Unit 42 Lower Shutter 100 Upper Mold 101 Upper Mold Base Member (Upper Base Block)
102 Upper mold substrate set part 103 Surplus resin separation member (surplus resin separation block)
104 Elastic member 105 Ejector pin 106 Ejector pin support member 107 Elastic member 200 Lower mold 201 Base member (lower mold base member, lower mold base block)
202 Bottom member (lower die bottom member)
203 Side member (lower die side member)
204 mold cavity (lower mold cavity)
205 Excess resin housing portion 205a Resin passage 206 Resin pressure member (resin pressure pin)
207 Stopper (positioning mechanism)
208, 209, 210, 211 Elastic member 1000 Compression molding apparatus 1100 Molding unit 1200 Substrate supply unit 1210 Substrate supply mechanism 1300 Resin material supply unit 1310 Resin material supply mechanism 1400 Control unit (positioning mechanism)
X1 to X6 Arrows indicating the movement direction of the lower die 200 Y1 Arrows indicating the movement direction of the ejector pin 105 a1, a2 Arrows indicating the movement direction of the lower shutter 42

Claims (11)

  1. 　成形型を含み、
    　前記成形型は、
    　上型と、
    　下型と、
    　樹脂材料が供給される型キャビティと、
    　型締め時における前記型キャビティの深さを所定深さで保持する位置決め機構と、
    　型締め時に前記型キャビティ内に収容されていない余剰樹脂を収容する余剰樹脂収容部と、
    　余剰樹脂分離部材と、を有し、
    　前記型キャビティ内の樹脂と前記余剰樹脂との硬化後に、前記余剰樹脂分離部材が、前記上型及び前記下型の一方又は両方に対し相対的に上昇又は下降されることで、前記型キャビティ内で硬化した樹脂と、前記余剰樹脂収容部内で硬化した前記余剰樹脂とが分離されることを特徴とする圧縮成形装置。     Including molds,
    The mold is
    Upper mold,
    Lower mold,
    Mold cavity to which resin material is supplied;
    A positioning mechanism for holding the depth of the mold cavity at a predetermined depth during mold clamping;
    A surplus resin container for accommodating surplus resin that is not accommodated in the mold cavity at the time of mold clamping;
    An excess resin separating member,
    After the resin in the mold cavity and the surplus resin are cured, the surplus resin separating member is raised or lowered relative to one or both of the upper mold and the lower mold, so that the inside of the mold cavity The compression molding apparatus is characterized in that the resin cured in step (b) is separated from the surplus resin cured in the surplus resin container.
  2. 　前記成形型は、基板の一方の面を樹脂封止する成形型であり、
    　前記上型及び前記下型のうち、一方の型は、前記型キャビティを有し、他方の型は、前記基板が固定される型である、請求項１記載の圧縮成形装置。     The mold is a mold for resin-sealing one surface of the substrate,
    The compression molding apparatus according to claim 1, wherein one of the upper mold and the lower mold has the mold cavity, and the other mold is a mold to which the substrate is fixed.
  3. 　前記上型と前記下型との型締め時に、前記基板の前記余剰樹脂収容部側の端部が、前記他方の型の型面と前記余剰樹脂分離部材の端部とで挟まれる請求項２記載の圧縮成形装置。 The end portion of the substrate on the side of the surplus resin accommodating portion is sandwiched between the mold surface of the other mold and the end portion of the surplus resin separating member when the upper mold and the lower mold are clamped. The compression molding apparatus as described.
  4. 　前記一方の型は、底面部材及び側面部材を有し、
    　前記底面部材は、ベース部材に固定され、
    　前記側面部材は、弾性部材を介して前記ベース部材に接続され、
    　前記底面部材と前記側面部材とに囲まれた空間により、前記型キャビティが形成され、
    　前記位置決め機構が、前記ベース部材に固定されたストッパを含み、
    　前記上型と前記下型との型締め時に、前記側面部材が前記ストッパに接触することで、前記型キャビティの深さが所定深さで保持される請求項２又は３記載の圧縮成形装置。     The one mold has a bottom member and a side member,
    The bottom member is fixed to a base member;
    The side member is connected to the base member via an elastic member,
    The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
    The positioning mechanism includes a stopper fixed to the base member;
    The compression molding apparatus according to claim 2 or 3, wherein when the upper mold and the lower mold are clamped, the side surface member comes into contact with the stopper, whereby the depth of the mold cavity is held at a predetermined depth.
  5. 　さらに、前記成形型の動作を制御する制御部を含み、
    　前記一方の型は、底面部材及び側面部材を有し、
    　前記底面部材は、ベース部材に固定され、
    　前記側面部材は、弾性部材を介して前記ベース部材に接続され、
    　前記底面部材と前記側面部材とに囲まれた空間により、前記型キャビティが形成され、
    　前記位置決め機構が、前記制御部を含み、
    　前記上型と前記下型との型締め時に、前記上型及び前記下型の一方又は両方における上昇位置及び下降位置の一方又は両方が、前記制御部により制御されることで、前記型キャビティの深さが所定深さで保持される請求項２又は３記載の圧縮成形装置。     And a control unit for controlling the operation of the mold.
    The one mold has a bottom member and a side member,
    The bottom member is fixed to a base member;
    The side member is connected to the base member via an elastic member,
    The mold cavity is formed by a space surrounded by the bottom surface member and the side surface member,
    The positioning mechanism includes the control unit;
    When the upper mold and the lower mold are clamped, one or both of the ascending position and the descending position of one or both of the upper mold and the lower mold are controlled by the control unit, so that the mold cavity The compression molding apparatus according to claim 2 or 3, wherein the depth is maintained at a predetermined depth.
  6. 　さらに、前記余剰樹脂収容部に対して上下動可能な樹脂加圧部材を有し、
    　前記樹脂加圧部材により、前記型キャビティ内及び前記余剰樹脂収容部内の樹脂が加圧される請求項１から５のいずれか一項に記載の圧縮成形装置。     Furthermore, it has a resin pressure member that can move up and down with respect to the surplus resin container,
    6. The compression molding apparatus according to claim 1, wherein the resin pressurizing member pressurizes the resin in the mold cavity and the excess resin accommodating portion.
  7. 　さらに、前記余剰樹脂収容部に樹脂材料を供給する余剰樹脂収容部樹脂材料供給機構を有する請求項１から６のいずれか一項に記載の圧縮成形装置。 Furthermore, the compression molding apparatus as described in any one of Claim 1 to 6 which has a surplus resin accommodating part resin material supply mechanism which supplies a resin material to the said surplus resin accommodating part.
  8. 　成形型の型キャビティ内に樹脂材料を供給する樹脂材料供給工程と、
    　前記成形型の上型及び下型を型締めする型締め工程と、
    　前記型締め工程において前記型キャビティ内に収容されない余剰樹脂を収容する余剰樹脂収容工程と、
    　前記上型及び前記下型を型開きする型開き工程と、
    　前記余剰樹脂を、前記型キャビティ内で硬化した樹脂から分離する余剰樹脂分離工程とを含み、
    　前記余剰樹脂分離工程は、前記型キャビティ内の樹脂と前記余剰樹脂との硬化後に、余剰樹脂分離部材を前記上型及び前記下型の一方又は両方に対し相対的に上昇又は下降させて行うことを特徴とする圧縮成形方法。     A resin material supply step of supplying a resin material into the mold cavity of the mold,
    A mold clamping step of clamping the upper mold and the lower mold of the mold;
    A surplus resin housing step of housing surplus resin that is not housed in the mold cavity in the mold clamping step;
    A mold opening step of opening the upper mold and the lower mold;
    A surplus resin separation step of separating the surplus resin from the resin cured in the mold cavity,
    The surplus resin separation step is performed by raising or lowering the surplus resin separation member relative to one or both of the upper mold and the lower mold after the resin in the mold cavity and the surplus resin are cured. A compression molding method characterized by the above.
  9. 　前記成形型が、さらに、前記余剰樹脂収容部に対して上下動可能な樹脂加圧部材を有し、
    　前記型締め工程において、前記樹脂加圧部材により、前記型キャビティ内及び前記余剰樹脂収容部内の樹脂が加圧される請求項８記載の圧縮成形方法。     The molding die further has a resin pressure member that can move up and down with respect to the surplus resin container,
    The compression molding method according to claim 8, wherein in the mold clamping step, the resin in the mold cavity and the surplus resin container is pressurized by the resin pressing member.
  10. 　前記樹脂材料供給工程において、前記余剰樹脂収容部にも樹脂材料を供給する請求項８又は９記載の圧縮成形方法。 The compression molding method according to claim 8 or 9, wherein in the resin material supply step, a resin material is also supplied to the surplus resin container.
  11. 　請求項８から１０のいずれか一項に記載の圧縮成形方法により樹脂を圧縮成形することを特徴とする圧縮成形品の製造方法。 A method for producing a compression-molded article, wherein the resin is compression-molded by the compression molding method according to any one of claims 8 to 10.
PCT/JP2017/028752 2016-11-29 2017-08-08 Compression molding device, compression molding method, and method for producing compression-molded article WO2018100807A1 (en)

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