JP2019031051A - Conveying mechanism, resin molding apparatus, method of delivering molding object to molding die, and production method of resin molded article - Google Patents

Abstract

To provide a conveying mechanism capable of suppressing or preventing deformation of an object to be molded before resin molding.SOLUTION: A conveying mechanism of a molding object in the present invention has a molding object placement member 1013 on which a molding object 2 before resin molding is placed, and a vertical movement mechanism 1011 for vertically moving the molding object placement member 1013. The conveying mechanism conveys the molding object 2 in a state of being placed on the molding object placing member 1013 and delivers it to a mold 100, and the molding object 2 can be stopped at a position in a vicinity of the mold 100 where it does not contact the mold 100 due to vertical movement of the molding object placing member 1013.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a transport mechanism, a resin molding apparatus, a method for delivering a molding object to a molding die, and a method for manufacturing a resin molded product.

  In a resin molding die of a die-down method (a molding method in which a chip mounting surface faces downward and an upper molding die holds a molding object such as a substrate), the molding object such as a substrate is held by the upper molding die (Patent Document 1). etc).

Japanese Patent Laid-Open No. 2017-024398

  As a method for delivering a molding object such as a substrate to a molding die, for example, the methods shown in FIGS. That is, first, as shown in FIG. 21, in a state where the substrate (interposer) 2 that is a molding object is placed on the transport mechanism 1000, the transport mechanism 1000 is moved between the upper mold 100 and the lower mold 100. It is made to enter between molds (not shown). As illustrated, the transport mechanism 1000 includes a main body 1010, an actuator 1014, and a plate 1013 as main components. For example, an air cylinder including a cylinder 1011 and a piston rod 1012 can be used as the actuator 1014. The cylinder 1011 is connected to the upper surface of the main body 1010. The plate 1013 is located above the cylinder 1011 and is connected to the cylinder 1011 via the piston rod 1012. As shown in the figure, the substrate 2 can be placed on the plate 13. 21 to 23, the substrate 2 has a chip mounting surface facing downward, and the chip 1 and the wire 3 are mounted (fixed) on the chip mounting surface. A pilot pin 101 is fixed to the lower surface of the upper mold 100, and the substrate 2 can be positioned by inserting the pilot pin 101 into the hole 4 of the substrate 2.

  Next, as shown in FIG. 22, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is pressed against the upper mold 100 and delivered.

  Further, as shown in FIG. 23, the substrate 2 is adsorbed and held on the lower surface of the upper mold 100 by a suction mechanism (not shown) provided in the upper mold 100. Thereafter, the plate 1013 is lowered by contracting the piston rod 1012 with the cylinder 1011 as illustrated. Then, after the transport mechanism 1000 is retracted outside the molding die (press), the molding object (substrate) 2 is resin-molded by the molding die.

  21 to 23, the molding object (substrate) 2 can be preheated to a predetermined temperature by a heater (not shown) included in the transport mechanism 1000, for example, until entering the molding die. The substrate 2 is thermally expanded by this preheating. As a result, since the diameter of the pilot pin 101 of the upper mold 100 and the inner side of the hole of the substrate 2 are positioned, the transfer of the substrate 2 to the upper mold 100 becomes smooth.

  However, in the process of pressing and transferring the molding object to the upper mold, there is a possibility that the thermal expansion of the molding object is insufficient due to the difference between the temperature of the molding tool and the temperature of the preheating unit of the transport mechanism 1000. Due to this insufficient thermal expansion, the molding object before resin molding may be deformed.

  Accordingly, the present invention provides a transport mechanism, a resin molding apparatus, a method for delivering a molding target to a molding die, a resin molding method, and a method for manufacturing a resin molded product, which can suppress or prevent deformation of the molding target before resin molding. The purpose is to provide.

In order to achieve the above object, the conveyance mechanism of the molding object of the present invention comprises:
A molding object mounting member for mounting a molding object before resin molding;
A vertical movement mechanism for moving the molding object placing member up and down,
Conveying the molding object in a state of being placed on the molding object placing member,
The molding object can be transferred to the molding die after being stopped at a position near the molding die that does not contact the molding die by the vertical movement of the molding object placing member.

The resin molding apparatus of the present invention includes the transport mechanism and the mold.
By the transport mechanism, the molding object is transferred to the mold,
The molding object is resin-molded by the molding die.

The first delivery method of the molding object of the present invention to the mold is as follows:
A step of transporting a molding object before resin molding to the vicinity of the mold;
And moving the molding object up and down,
In the step of moving up and down, the molding object is stopped at a position near the molding die that does not contact the molding die,
The molding object is transferred to the mold.

The second delivery method of the molding object of the present invention to the mold is as follows:
A step of transporting a molding object before resin molding to the vicinity of the mold;
And moving the molding object up and down,
The step of moving up and down comprises
Contacting the molding object with the mold and stopping the molding object;
Separating the molding object from the mold again and stopping at a position near the mold; and
Bringing the molding object into contact with the mold again and stopping;
It is characterized by including. In the following, the first delivery method of the molding object to the molding die and the second delivery method of the molding object to the molding die will be summarized as “the molding object of the present invention. The delivery method of the product to the mold ”or simply the“ delivery method of the present invention ”.

The method for producing the resin molded product of the present invention is as follows.
A molding object delivery step of delivering the molding object to the mold by the delivery method of the present invention;
A resin molding step of resin molding the molding object with the molding die;
It is characterized by including.

  According to the present invention, it is possible to provide a transport mechanism, a resin molding apparatus, a method for delivering a molding object to a molding die, and a method for producing a resin molded product that can suppress or prevent deformation of the molding object before resin molding. Can do.

FIG. 1 is a schematic diagram illustrating one step of a method for transferring a molding object to a molding die by the transport mechanism according to the first embodiment. FIG. 2 is a schematic diagram showing another process of the same delivery method as FIG. FIG. 3 is a schematic diagram showing still another step of the same delivery method as in FIG. FIG. 4 is a schematic diagram illustrating a partial structure of the transport mechanism according to the first embodiment. FIG. 5 is a diagram illustrating an operation flow of the transport mechanism according to the first embodiment. FIG. 6 is a schematic diagram illustrating one step of a method for transferring a molding object to a mold by the transport mechanism according to the second embodiment. FIG. 7 is a schematic diagram showing another process of the same delivery method as FIG. FIG. 8 is a schematic diagram showing still another process of the same delivery method as FIG. FIG. 9 is a diagram illustrating an operation flow of the transport mechanism according to the second embodiment. FIG. 10 is a schematic diagram illustrating one process of a method for delivering a molding target to a mold according to a modification of the transport mechanism of the second embodiment. FIG. 11 is a schematic diagram showing another process of the same delivery method as FIG. FIG. 12 is a schematic diagram showing still another process of the same delivery method as FIG. FIG. 13 is a schematic diagram illustrating one step of a method for delivering a molding object to a molding die according to another modification of the transport mechanism according to the second embodiment. FIG. 14 is a schematic diagram showing another process of the same delivery method as FIG. FIG. 15 is a schematic diagram showing still another process of the same delivery method as FIG. FIG. 16 is a plan view schematically illustrating the outline of the resin molding apparatus of the present invention. FIG. 17: is sectional drawing which shows typically an example of the process in the resin molding process in the manufacturing method of the resin molded product of this invention. 18 is a cross-sectional view schematically showing another step in the same resin molding step as FIG. FIG. 19 is a cross-sectional view schematically showing still another step in the same resin molding step as FIG. FIG. 20 is a cross-sectional view schematically showing still another step in the same resin molding step as FIG. FIG. 21 is a schematic diagram showing one step of a method for delivering a molding object to a molding die by a transport mechanism related to the present invention. FIG. 22 is a schematic diagram showing another process of the same delivery method as FIG. FIG. 23 is a schematic diagram showing still another process of the same delivery method as FIG.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

  The conveyance mechanism of this invention may be able to stop the said molding target object mounting member in the position which contacts the said shaping | molding die by the vertical motion of the said molding target object mounting member, for example.

  The conveyance mechanism of the present invention may further include, for example, a positioning mechanism that determines a position to stop the molding object placing member.

  In the transport mechanism of the present invention, for example, the positioning mechanism may be a positioning member that can be moved up and down by the vertical movement mechanism.

  The conveyance mechanism of this invention may be able to determine the stop position of the said molding target object mounting member, for example, when the said positioning member contacts the said shaping | molding die.

  The transport mechanism of the present invention may further include, for example, an elastic member, and the positioning member may be moved up and down by expansion and contraction of the elastic member.

  The transport mechanism of the present invention further includes, for example, an actuator that moves the positioning member up and down, and determines the stop position of the positioning member by setting the pressure of the actuator, thereby determining the stop position of the molding object mounting member. It may be possible to decide.

  The conveyance mechanism of the present invention can stop the molding object mounting member at a position near the molding die that does not contact the molding die, for example, by the vertical movement of the molding object placement member. The molding object placing member can be stopped at a position in contact with the mold, and the pressure of the actuator can be set to two types of pressures corresponding to the two types of stop positions. May be.

The first delivery method of the molding object to the molding die of the present invention is, for example,
The step of moving up and down comprises
Stopping the molding object at a position near the molding die that does not contact the molding die;
Contacting the molding object with the mold and stopping the molding object;
Separating the molding object from the mold again and stopping at a position near the mold; and
Bringing the molding object into contact with the mold again and stopping;
May be included.

  In the present invention, the “molding object” means a product before molding or an intermediate product (semi-finished product) of the product. In the present invention, the molding object is, for example, a product molded by a resin material or a product intermediate (semi-finished product). In the present invention, the molding object is, for example, a substrate, and more specifically, for example, a substrate, a resin substrate, a wiring substrate, an interposer such as an L / F. However, the molding object in the present invention is not limited to these, and is arbitrary. Moreover, in this invention, although members, such as a chip | tip, may be mounted in the one or both surfaces, the molding target object does not need to be mounted.

  In the present invention, a product manufactured by molding a molding object is not particularly limited, and may be, for example, an electronic component. In general, "electronic component" may refer to a chip before resin-sealing or a chip-resin-sealed state, but in the present invention, simply referred to as "electronic component" Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, the “chip” means a chip in which at least a part is exposed without being resin-sealed, and a chip before resin sealing, a chip partially sealed with resin, or a plurality of chips. A chip in which at least one of them is exposed without being resin-sealed is also included. Specific examples of the “chip” in the present invention include chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, a chip in which at least a part is exposed without being resin-sealed is referred to as a “chip” for convenience in order to distinguish it from an electronic component after resin-sealing. However, the “chip” in the present invention is not particularly limited as long as at least a part of the chip is exposed without being sealed with resin, and may not be in a chip shape.

  In the present invention, “resin molding” may be, for example, “resin sealing” in which a member such as the chip is sealed with resin. However, in the present invention, “resin molding” is not limited to this, and may be, for example, simple resin molding in which the member is not sealed with resin.

  In the present invention, “resin sealing” means, for example, that the resin is cured (solidified), but is not limited thereto. That is, in the present invention, the “resin sealing” may be at least a state in which the resin is filled in the mold cavity at the time of mold clamping, and the resin is not cured (solidified) and may be in a fluid state. .

  In the present invention, the mold, the resin molding apparatus, and the resin molding method are not particularly limited and are arbitrary. For example, the mold may be a mold including an upper mold and a lower mold. Further, for example, the resin molding method may be any molding method such as compression molding or transfer molding. Further, the resin molding apparatus may be an arbitrary resin molding apparatus such as a compression molding apparatus or a transfer molding apparatus.

As a method for transferring a molding object such as a substrate before resin molding to a molding die, for example, the methods shown in FIGS. However, in the process of pressing the molding object against the upper mold and delivering it, the difference between the temperature of the molding mold and the temperature of the preheating part of the transport mechanism causes insufficient thermal expansion of the molding object, resulting in problems. There is a fear. Specifically, for example, the following (1) and (2) can be considered. The problem (2) below may be particularly noticeable as the molding object (substrate or the like) becomes thinner.

(1) Generation of flaws due to poor positioning of positioning pilot pin and hole of molding object (2) Generation of wrinkles on molding object due to suction holding by upper mold with insufficient thermal expansion

As the causes of the problems (1) and (2), for example, the following causes are conceivable.

(1) Causes of scratches due to poor position In the process of transferring the molding object to the upper mold, if the molding object is not preheated to the same temperature as the mold, thermal expansion will be insufficient. The position of the positioning hole and the pilot pin of the upper mold (the member that determines the holding position of the mold) are shifted. If the positioning hole of the molding object is pressed against the pilot pin in the shifted state, stress is generated on the molding object (the positioning hole), and the positioning hole is damaged.

(2) Cause of wrinkle generation If the molding object is not preheated to the same temperature as the molding die before the molding object is transferred to the upper mold, the thermal expansion further occurs due to the heat received from the molding die. However, since the molding object is adsorbed and held by the suction mechanism of the molding die, it cannot expand in the horizontal direction and wrinkles are generated.

  In the present invention, the deformation of the molding object before resin molding can be suppressed or prevented by stopping the molding object at a position in the vicinity of the molding die that does not contact the molding die. Specifically, by stopping the molding object at a position in the vicinity of the mold, heat reception of the molding object from the molding mold at that position is promoted, and the molding object is further thermally expanded. it can. Thereby, when the molding object is brought into contact with the molding die, the further expansion of the molding object can be suppressed or prevented, so that deformation of the molding object before resin molding can be suppressed or prevented.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  1 to 3 show an example of a method for delivering a molding object to a mold by the transport mechanism of the present embodiment.

  First, as shown in FIG. 1, in a state where a substrate (interposer) 2 that is an object to be molded is placed on a transport mechanism 1000, the transport mechanism 1000 is made up of an upper mold 100 and a lower mold of a mold (press). (Not shown). Thereby, the board | substrate 2 is conveyed between the upper mold 100 and the lower mold (near the mold). As illustrated, the transport mechanism 1000 includes a main body 1010, an actuator 1014, a plate (resin molded product placement member) 1013, a set block 1100, and an upper mold set block 1120 as main components. As the actuator 1014, for example, an air cylinder including a cylinder 1011 and a piston rod 1012 can be used as illustrated. The cylinder 1011 is connected to the upper surface of the main body 1010. The plate 1013 is located above the cylinder 1011 and is connected to the cylinder 1011 via the piston rod 1012. As shown in the figure, the substrate 2 can be placed on the plate 1013. In FIG. 1, the substrate 2 has a chip mounting surface facing downward, and the chip 1 and wires 3 are mounted (fixed) on the chip mounting surface. A pilot pin 101 is fixed to the lower surface of the upper mold 100, and the substrate 2 can be positioned by inserting the pilot pin 101 into the hole 4 of the substrate 2. A set block 1100 is installed on the outer periphery of the upper surface of the plate 1013 at a position surrounding the substrate 2. Further, an upper mold set block 1120 is installed on the outer peripheral portion of the lower surface of the upper mold 100 at a position corresponding to the set block 1100.

  Next, as shown in FIG. 2, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100.

  Next, as shown in FIG. 3, the cylinder 1011 further extends the piston rod 1012 to further raise the plate 1013. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is pressed against the upper mold 100 and delivered. Further, the substrate 2 is adsorbed and held on the lower surface of the upper mold 100 by a suction mechanism (not shown, for example, a vacuum pump) provided in the upper mold 100. In this manner, the molding object (substrate) 2 is transferred to a molding die including the upper molding die 100.

  Thereafter, similarly to FIG. 23, the plate 1013 is lowered by contracting the piston rod 1012 with the cylinder 1011. Then, after the transport mechanism 1000 is retracted outside the molding die (press), the molding object (substrate) 2 is resin-molded by the molding die.

  1 to 3, the molding object (substrate) 2 is preheated to a predetermined temperature by a heater (not shown) included in the transport mechanism 1000 until entering the molding die. The substrate 2 is thermally expanded by this preheating. As a result, since the diameter of the pilot pin 101 of the upper mold and the inside of the hole of the substrate 2 are positioned, the transfer of the substrate 2 to the upper mold 100 is smooth. Further, in this embodiment, as shown in FIG. 2, the molding object (substrate) 2 is stopped at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100 of the mold. Thereby, the heat receiving from the upper shaping | molding die 100 to the molding target object (board | substrate) 2 in that position can be accelerated | stimulated, and the molding target object (board | substrate) 2 can be further thermally expanded. Therefore, when the molding object (substrate) 2 is brought into contact with the upper mold 100, it is possible to suppress or prevent the molding object (substrate) 2 from further expanding, so that the molding object (substrate) before resin molding. 2 deformation can be suppressed or prevented.

  1-3, a mechanism for stopping the molding object (substrate) 2 at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100 of the mold (that is, the “positioning mechanism”). ) Etc. are not particularly limited. For example, as the “positioning mechanism”, as will be described later, the molding object (substrate) 2 is positioned at a position in the vicinity of the upper mold 100 (not in contact with the upper mold 100) and a position in contact with the upper mold 100. In order to stop at two types of positions, a mechanism capable of setting the pressure of the cylinder 1011 to two types of pressures corresponding to the two types of stop positions (not shown, hereinafter, sometimes referred to as “two-pressure mechanism”). ). Further, in addition to or instead of the two-pressure mechanism, a positioning member for determining the stop position of the plate 1013 may be provided as in Example 2 described later.

  Thereafter, the substrate 2 is resin-molded by a mold including the upper mold 100. In the present invention, the mold, the resin molding apparatus, and the resin molding method are not particularly limited as described above.

  In addition, in FIG. 4, an example of a structure of the set block 1100 and the upper shaping | molding die set block 1120 is shown typically. As illustrated, the set block 1100 includes a loader set block 1110, an elastic member (spring) 1132, a fixing bolt 1133, a bushing 1134, and a vertically movable pin 1135. As shown in the figure, the loader set block 1110 is fixed to the upper surface of the plate 1013 and can be fitted to the upper mold set block 1120. The bush 1134 is fixed to the upper surface of the plate 1013 by a fixing bolt 1133. The vertically movable pin 1135 passes through the bush 1134. The lower part of the vertically movable pin 1135 can move up and down in an escape hole 1131 provided on the upper surface of the plate 1013. Further, the elastic member 1132 is sandwiched between the periphery of the hole 1131 on the upper surface of the plate 1013 and a collar provided in the middle of the vertically movable pin 1135. An upward force due to the extension force of the elastic member 1132 is acting on the collar of the vertically movable pin 1135. Further, in FIG. 4, the upper end of the collar of the up and down movable pin 1135 is prevented from further rising by being caught by the bush 1134. The vertically movable pin 1135 is vertically movable by the expansion and contraction of the elastic member 1132.

  In the set block 1100 and the upper mold set block 1120 shown in FIG. 4, the loader set block 1110 does not fit into the upper mold set block 1120 in the state shown in FIG. Yes. Further, when the upper end of the vertically movable pin 1135 comes into contact with the upper mold 100, the transport mechanism 1100 is in the state shown in FIG. 2, that is, the molding object (substrate) 2 is not in contact with the upper mold 100. It can be set as the state stopped at the position near the mold 100. That is, the vertically movable pin 1135 corresponds to a “positioning member” that determines the position at which the plate (molding object placing member) 1013 is stopped. Further, in the state of FIG. 3, that is, in the state where the molding object (substrate) 2 is in contact with the upper mold 100, the vertical movable pin 1135 is pushed down by the upper mold set block 1120, and the lower part of the vertical movable pin 1135 is the escape hole 1131. It will be in a state of descending.

  The configuration of the transport mechanism 1000 of the present embodiment is not limited to the configurations of FIGS. For example, the transport mechanism 1000 may not have the set block 1100 and the upper mold set block 1120, and may be the same as the transport mechanism 1000 in FIGS.

  FIG. 5 shows an example of an operation flow of the transport mechanism 1000 of the present embodiment. The figure is also an example of a flow of a method for delivering a molding object to a mold using the transport mechanism 1000 of the present embodiment. In the same figure, each operation | movement is represented by code | symbol S101-S106, S201-S209, and S302-S307.

  1 to 3 show an example in which the molding object (substrate) 2 is brought into contact with the upper mold 100 and then sucked by the upper mold 100 as it is (adsorbed to the upper mold 100). On the other hand, in FIG. 5, as described later, after the molding object (substrate) 2 is brought into contact with the upper mold 100, the table 1013 is once lowered to place the molding object (substrate) 2 into the upper mold 100. Move away from. Thereby, the shaping | molding target object (board | substrate) 2 is released from the stress by thermal expansion, and a deformation | transformation of the shaping | molding target object (board | substrate) 2 can be suppressed or prevented still more effectively.

  As shown in FIG. 5, first, the cylinder 1011 is operated at a low pressure (S101). Thus, the plate 1013 starts to rise (S201). Next, the molding object (substrate) 2 is stopped at a position near the upper mold 100 that does not contact the upper mold 100 (S202). At this time, the cylinder 1011 is adjusted to a pressure that does not hold the molding object (substrate) 2 against the upper mold 100 (S302). On the other hand, a timer (not shown) is operated from the time when it is stopped at a position in the vicinity of the upper mold 100, and a molding object (substrate) 2 is held for a predetermined time by a heater (not shown) provided in the mold. Heat (S102). Upper Mold Upper Mold Upper Mold Next, the cylinder 1011 is operated at a high pressure (S103). Thereby, the plate 1013 is raised again (S203). Next, a preheating timer of a heater (not shown) provided in the mold (mold) is activated (S104). On the other hand, the pressure of the cylinder 1011 is increased to bring the molding object (substrate) 2 into contact with the upper mold 100, but at this time, suction (adsorption) by the upper mold 100 of the molding object is not performed (S304). By these S104 and S304, the plate 1013 is stopped at a position (upper end) where the molding object (substrate) 2 contacts the upper mold 100 (S204). Thereby, the molding object (substrate) 2 is thermally expanded by the heat of the upper mold 100 (S205). Next, the pressure of the cylinder 1011 is lowered, and the plate 1013 is once lowered (S206). Thereby, the molding object (substrate) 2 is released from the stress due to thermal expansion (S306), and the pressure of the cylinder 1011 is immediately increased again, and the plate 1013 is increased again (S107). As a result, the thermally expanded molding object (substrate) 2 is brought into contact with the upper mold 100 again and finally set (S307). Then, the molding object (substrate) 2 is adsorbed to the upper mold 100 by a suction mechanism (not shown, for example, a vacuum pump) provided in the upper mold 100 (S208). Then, the plate 1013 is lowered again to complete the delivery of the molding object (substrate) 2 to the molding die (S209).

  In the present invention, the overall configuration of the resin molding apparatus is not particularly limited and is arbitrary, but may be as shown in FIG. 16, for example. FIG. 16 is a plan view schematically showing the resin molding apparatus 3000 of this example. More specifically, this figure is a schematic plan view showing the resin molding apparatus 3000 assuming that the member on the upper mold side is removed. As illustrated, the resin molding apparatus 3000 includes one material receiving module 400, four molding modules 2000, and one dispensing module 500. The molding module 2000 has a molding die therein. The configuration of the molding die is not particularly limited, and may be the same as that of a general resin molding device (for example, a compression molding device or the like), but may be the same as, for example, FIGS. In addition, the resin molding apparatus 3000 includes a power supply 401 that supplies electric power and a control unit 402 that controls each component for the entire resin molding apparatus 3000.

  The material receiving module 400 and the leftmost molding module 2000 in FIG. 16 can be mounted and separated from each other. Also, adjacent molding modules 2000 can be mounted and separated from each other. The rightmost molding module 2000 and dispensing module 500 in FIG. 16 can be mounted and separated from each other. The positioning method for mounting the above-described components is not particularly limited, and can be performed by known means such as positioning holes and positioning pins, for example. The mounting method is not particularly limited, but can be performed by a known means including, for example, screwing using a bolt and a nut.

  The material receiving module 400 includes a substrate material receiving unit 403, a resin material receiving unit 404, and a material transfer mechanism 405. The substrate material receiving unit 403 receives a substrate (pre-molding substrate) from the outside of the resin molding apparatus 3000. The resin material receiving unit 404 receives the resin material 20a made of a solid resin from the outside of the resin molding apparatus 3000. FIG. 16 shows a granular resin as the resin material 20a.

  The resin molding apparatus 3000 is provided with an X direction guide rail 406 along the X direction from the material receiving module 400 through the four molding modules 2000 to the dispensing module 500. The X-direction guide rail 406 is provided so that the transport mechanism 1000 can move along the X direction. The transport mechanism 1000 is provided with a Y-direction guide rail 408 along the Y direction. The Y-direction guide rail 408 is provided so that the transport mechanism 1000 and the sub-transport mechanism 501 can move along the Y direction. As described above, the transport mechanism 1000 can transport the substrate (pre-molding substrate, molding object) 2. The sub transport mechanism 501 can accommodate and transport the resin material 20a. The transport mechanism 1000 and the sub transport mechanism 501 reciprocate between the upper side of the X-direction guide rail 406 in one molding module 2000 and the upper side of the lower mold cavity 201 in the lower mold 200. The lower mold 200 and the lower mold cavity 201 are shown in FIGS. The transport mechanism 1000 and the sub transport mechanism 501 supply the substrate 2 to the lower surface of the upper mold (not shown) and supply the resin material 20a to the lower mold cavity 201 of the lower mold 200.

  The resin molding device 3000 has a control unit 402. The rotation direction, the number of rotations, and the torque of a motor included in a resin molding mechanism (not shown) that performs resin molding using a molding die are controlled by a control driver signal included in the control unit 402. The control unit 402 also controls operations of the transport mechanism 1000 and the sub transport mechanism 501.

  In this embodiment, for example, the transport mechanism 1000 and the sub-transport mechanism 501 are formed by sealing the substrate (pre-molding substrate) 2 and the chip 2 (see FIG. 1) mounted on the substrate 2 with resin sealing. Both the molded product (post-molding substrate) 2B may be transported. According to this configuration, since the transport mechanism 1000 and the sub-transport mechanism 501 serve both as a carry-in mechanism and a carry-out mechanism, the configuration of the resin molding apparatus 3000 is simplified. As a modification, in the resin molding apparatus 3000, the transport mechanism 1000 and the sub transport mechanism 501 may be used as a transport mechanism, and a transport mechanism may be provided separately from the transport mechanism. In this case, since the carry-in mechanism and the carry-out mechanism operate independently, the efficiency of the molding operation in the resin molding apparatus 3000 is improved.

  The dispensing module 500 includes a resin molded product transfer mechanism 502 that conveys the resin molded product 2B, and a magazine 503 that houses the resin molded product 2B. The dispensing module 500 has a vacuum pump (not shown). The vacuum pump is a reduced pressure source for adsorbing the substrate 2, the resin molded product 2 </ b> B, and the like for the entire resin molding apparatus 3000. The vacuum pump may be provided in the material receiving module 400.

  The vacuum pump is also used as a pressure reducing source for sucking an outside air blocking space including a lower mold cavity 201 which is a space between an upper mold (not shown) and a lower mold 200. The outside air blocking space is a space between the upper mold and the lower mold 200 after the resin material 20a is supplied to the lower mold cavity 201 and until the mold clamping of the mold 10 is completed. And formed in a space including the lower mold cavity 201. Specifically, the space between the upper mold 200 and the lower mold 200 and including the lower mold cavity 201 is made to be shielded from the outside air by using a seal member (not shown). . By sucking the outside air blocking space, generation of bubbles in the cured resin is suppressed. As a decompression source, a decompression tank sucked by the vacuum pump and having a large capacity may be used.

  According to the resin molding apparatus of FIG. 16, adjacent molding modules 2000 among the four molding modules 2000 can be mounted and separated from each other. Accordingly, the number of molding modules 2000 can be increased in accordance with an increase in demand, and the number of molding modules 2000 can be decreased in accordance with a decrease in demand. For example, when the demand for a specific product increases in the area where the factory A is located, the resin molding apparatus 3000 of the factory B located in the area where the demand is not increasing is used for the production of the specific product. The forming module 2000 is separated. The separated molding module 2000 is transported to the factory A, and the transported molding module 2000 is mounted on a resin molding apparatus included in the factory A. In other words, the molding module 2000 is added to the resin molding apparatus. This makes it possible to meet the increased demand in the area where the factory A is located. Therefore, according to the resin molding apparatus of FIG. 16, a resin molding apparatus that can flexibly cope with an increase or decrease in demand is realized.

  Next, an example of a resin molding step in the method for producing a resin molded product of the present invention will be described with reference to FIGS. In the resin molding step shown in FIGS. 17 to 20, a resin molding mechanism including a mold 300 is used. The resin molding mechanism is not particularly limited, and may be, for example, a general resin molding mechanism (for example, a compression molding mechanism). However, in FIGS. 17-20, illustration is abbreviate | omitting parts other than the shaping | molding die 300 for the simplification.

  As shown in the figure, the mold 300 includes an upper mold 100 and a lower mold 200. The upper mold 100 is the same as that of FIG. 1 except that the upper mold set block 1120 is not provided. The lower mold 200 includes a lower mold base member 202, a lower mold cavity side member 203, an elastic member 204, and a lower mold cavity bottom member 205, as shown. The lower mold base member 202 is placed on the upper surface of the movable platen 112. The lower mold cavity bottom member 205 is attached to the upper surface of the lower mold base member 202 and constitutes the bottom surface of the lower mold cavity 201. The lower mold cavity side surface member 203 is a frame-like member arranged so as to surround the lower mold cavity bottom surface member 205, and is attached to the upper surface of the lower mold base member 202 via the elastic member 204. A side surface of the mold cavity 201 is formed. In the lower mold 200, the lower mold cavity 201 is constituted by the lower mold cavity bottom member 205 and the lower mold cavity side member 203. The lower mold 200 is provided with a heating mechanism (not shown) for heating the lower mold 200, for example. By heating the lower mold 200 with the heating mechanism, for example, the resin in the lower mold cavity 201 is heated and melted or cured.

  First, as shown in FIG. 17, the substrate (pre-molding substrate, molding object) 2 is supplied and fixed to the lower surface of the upper mold 100. The substrate 2 can be fixed to the lower surface of the upper mold 100 by, for example, a clamp (not shown). The chip 1 is fixed to the lower surface of the substrate 2 (on the side opposite to the fixed surface with respect to the upper mold 100) as in FIG.

  Next, as shown in FIG. 17, the release film 11 on which the resin material (granular resin) 20 a is placed is transported to the mold 300 by the resin loader (resin transport mechanism) 521 (transport process). At this time, for example, as illustrated, the frame member 701 may be placed on the release film 11, and the resin material 20 a may be placed on the release film 11 in the opening of the frame member 701. Further, the resin loader 521 is not particularly limited, but for example, the sub-transport mechanism 501 shown in FIG. 16 may be used as the resin loader 521.

  Then, as shown in FIG. 18, the resin loader 521 places the release film 11 on which the resin material 20 a is placed in the cavity 201 of the lower mold 200. At this time, the release film 11 may be adsorbed to the cavity 201 by a suction mechanism (not shown). Thereby, the resin material 20a is supplied to the cavity 201 of the lower mold 200 together with the release film 11. At this time, the lower mold 200 may be heated and heated in advance by a heating mechanism (not shown).

  Next, as shown in FIGS. 19 to 20, the substrate 2 is resin-molded with the lower mold 200 of the mold 300. Specifically, for example, first, the resin material 20a is heated by the heat of the lower mold 200 to obtain a molten resin (flowable resin) 20b as shown in FIG. Next, as shown in FIG. 19, the lower mold 200 is raised in the direction of arrow Y <b> 1 by a mold clamping mechanism (not shown), and the substrate 2 is transferred to the fluid resin 20 b filled in the lower cavity 201. The chip 1 attached to the lower surface is immersed. Thereafter, the fluid resin 20b is heated and cured to become a resin (cured resin) 20 as shown in FIG. At this time, the fluid resin 20b may be heated by the lower mold 200 that has been heated in advance by the heating mechanism (not shown). Accordingly, as shown in FIG. 20, a resin-sealed substrate (resin molded product, electronic component) 2B in which the chip 1 fixed to the substrate 2 is sealed with the resin (cured resin) 20 can be manufactured. . Then, as shown in FIG. 20, the lower mold 200 is lowered in the direction of the arrow Y2 by the mold clamping mechanism (not shown) to perform mold opening.

  As mentioned above, although the example of the resin molding process was shown, the said resin molding process is not specifically limited, For example, you may carry out according to a general resin molding method (for example, compression molding method etc.).

  16 to 20 show an example in which the resin material 20a is a granular resin, in the present invention, the resin material before molding and the resin after molding are not particularly limited. For example, the resin material before molding and the resin after molding may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include granule resin, fluid resin, sheet-like resin, tablet-like resin, and powder-like resin. In the present invention, the fluid resin is not particularly limited as long as it is a resin having fluidity, and examples thereof include a liquid resin and a molten resin. In the present invention, the liquid resin refers to, for example, a resin that is liquid at room temperature or has fluidity. In the present invention, the molten resin refers to, for example, a resin that is in a liquid or fluid state by melting. The form of the resin may be other forms as long as it can be supplied to a cavity, pot, or the like of the mold.

  Next, another embodiment of the present invention will be described.

  6 to 8 show an example of a method for delivering a molding object to a molding die by the transport mechanism of the present embodiment. In the first embodiment, an example of a method for transferring the molding object to the mold when the two-pressure mechanism is used is shown. However, in this embodiment, an example in which the two-pressure mechanism is not used is shown.

  First, as shown in FIG. 6, with the substrate (interposer) 2, which is a molding object, placed on the transport mechanism 1000, the transport mechanism 1000 is made up of the upper mold 100 and the lower mold of the mold (press). (Not shown). Thereby, the board | substrate 2 is conveyed between the upper mold 100 and the lower mold (near the mold). As shown in the figure, this transport mechanism 1000 is the same as that in Example 1 except that it does not have the set block 1100 and the upper mold set block 1120, and has the stopper pin 1021 and the height adjusting shim 1022. ) Of the transport mechanism 1000 of FIG. The stopper pin 1021 and the height adjusting shim 1022 correspond to the “positioning member” of the transport mechanism of the present invention. As illustrated, the stopper pin 1021 is installed at a position outside the substrate 2 on the outer peripheral portion of the upper surface of the table 1013. The lower part of the stopper pin 1021 is attached to the upper end of the table 1013. The shim 1022 is installed between the lower part of the stopper pin 1021 and the plate 1013.

  Next, as shown in FIG. 7, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, the upper end of the stopper pin 1021 (positioning member) contacts the lower surface of the upper mold 100. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100. At this time, the shim 1022 fulfills the height adjusting function, so that the gap (gap, symbol G) between the upper surface of the substrate 2 and the lower surface of the upper mold 100 becomes equal to the thickness of the shim 1022 as shown. At this time, the upper mold 100 is heated in advance by a heater (not shown). Then, in the state of FIG. 7, the molding object (substrate) 2 is heated for a while by the heat of the upper mold 100 and thermally expanded.

  Further, from the state of FIG. 7, the suction mechanism (not shown, for example, a vacuum pump) provided in the upper mold 100 is operated with the position of the plate 1013 as it is. As a result, the substrate 2 is attracted to the upper mold 100 and is adsorbed and held by the upper mold 100 in contact with the lower surface of the upper mold 100 as shown in FIG. In this manner, the molding object (substrate) 2 is transferred to a molding die including the upper molding die 100.

  Thereafter, similarly to FIG. 23, the plate 1013 is lowered by contracting the piston rod 1012 with the cylinder 1011. Then, after the transport mechanism 1000 is retracted outside the molding die (press), the molding object (substrate) 2 is resin-molded by the molding die.

  FIG. 9 shows an example of an operation flow of the transport mechanism 1000 of the present embodiment. The figure is also an example of a flow of a method for delivering a molding object to a mold using the transport mechanism 1000 of the present embodiment. FIG. 5 shows a flow when the two-pressure mechanism is used, but FIG. 9 shows a flow when the two-pressure mechanism is not used. In FIG. 9, the same operations as those in FIG. 5 are denoted by the same reference numerals.

  As shown in FIG. 9, first, the actuator 1014 is operated to start the plate 1013 ascending (S201). When the plate 1013 continues to rise, the stopper pin 1021 connected to the plate 1013 via the height adjusting shim 1022 (positioning member) comes into contact with the upper mold 100 (S302). As a result, as shown in FIG. 7, the plate 1013 is stopped at a position near the upper mold 100 where the molding object (substrate) 2 does not contact the upper mold 100 (S202). Next, a preheating timer of a preheating mechanism (not shown) provided in the mold (mold) is operated (S104). Thereby, the molding object (substrate) 2 is thermally expanded by the heat of the upper mold 100 (S205). The molding object (substrate) 2 is adsorbed to the upper molding die 100 by a suction mechanism (not shown, for example, a vacuum pump) provided in the upper molding die 100 (S208). Then, the plate 1013 is lowered again to complete the delivery of the molding object (substrate) 2 to the molding die (S209).

  Moreover, the modification of a present Example is shown to FIGS. 10 to 12 can be performed in the same manner as FIGS. 6 to 8 except that the structure of the transport mechanism 1000 is slightly different. Specifically, it is as follows.

  First, as shown in FIG. 10, in a state where the substrate (interposer) 2 that is a molding object is placed on the transport mechanism 1000, the transport mechanism 1000 is made up of the upper mold 100 and the lower mold of the mold (press). (Not shown). Thereby, the board | substrate 2 is conveyed between the upper mold 100 and the lower mold (near the mold). As shown in the figure, this transport mechanism 1000 is the same as the transport mechanism 1000 in FIGS. 6 to 8 except that it has a height determining block 1031 instead of the stopper pin 1021 and the height adjusting shim 1022. The height determining block 1031 corresponds to a “positioning member” of the transport mechanism of the present invention. The height determining block 1031 is installed so as to be sandwiched between the piston rod 1012 and the table 1013.

  Next, as shown in FIG. 11, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100. At this time, the height determining block 1031 fulfills the height adjusting function, so that the distance (gap, symbol G) between the upper surface of the substrate 2 and the lower surface of the upper mold 100 is equal to the thickness of the height determining block 1031 as shown in the figure. Will be equal. At this time, the upper mold 100 is preheated by a preheating mechanism (not shown). Then, in the state of FIG. 11, the molding object (substrate) 2 is heated for a while by the heat of the upper mold 100 and thermally expanded.

  Furthermore, from the state of FIG. 12, the suction mechanism (not shown, for example, a vacuum pump) provided in the upper mold 100 is operated while the position of the plate 1013 remains unchanged. As a result, the substrate 2 is sucked to the upper mold 100 and is adsorbed and held by the upper mold 100 in contact with the lower surface of the upper mold 100 as shown in FIG. In this manner, the molding object (substrate) 2 is transferred to a molding die including the upper molding die 100.

  Thereafter, similarly to FIG. 23, the plate 1013 is lowered by contracting the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, after the transport mechanism 1000 is retracted outside the molding die (press), the molding object (substrate) 2 is resin-molded by the molding die. As in FIG. 5 (Example 1), after the molding object (substrate) 2 is brought into contact with the upper mold 100, the plate 1013 is once lowered to place the molding object (substrate) 2 into the upper mold 100. After the separation, the plate 1013 may be raised again to bring the molding object (substrate) 2 into contact with the upper mold 100.

  Further, FIGS. 13 to 15 show another modification of the present embodiment. 13 to 15 can be performed in the same manner as in FIGS. 6 to 8 or FIGS. 10 to 12 except that the structure of the transport mechanism 1000 is slightly different. Specifically, it is as follows.

  First, as shown in FIG. 13, in a state where the substrate (interposer) 2 that is a molding object is placed on the transport mechanism 1000, the transport mechanism 1000 is made up of the upper mold 100 and the lower mold of the mold (press). (Not shown). Thereby, the board | substrate 2 is conveyed between the upper mold 100 and the lower mold (near the mold). As shown in the figure, this transport mechanism 1000 is the same as the transport mechanism 1000 of FIGS. 6 to 8 except that it has bolts 1041 and nuts 1042 instead of the stopper pins 1021 and the height adjusting shims 1022. The bolt 1041 and the nut 1042 correspond to the “positioning member” of the transport mechanism of the present invention. As shown in the figure, the bolt 1041 is installed at a position outside the substrate 2 on the outer periphery of the upper surface of the plate 1013. The bolt 1041 is screwed into the tap hole 1043 of the plate 1013 and is fastened by the nut 1042 to be fixed to the table 1013.

  Next, as shown in FIG. 14, the plate 1013 is raised by extending the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, the upper end of the bolt 1041 (positioning member) contacts the lower surface of the upper mold 100. Thereby, as shown in the drawing, the substrate 2 placed on the plate 1013 is stopped at a position in the vicinity of the upper mold 100 that does not contact the upper mold 100. Note that a gap (gap) between the upper surface of the substrate 2 and the lower surface of the upper mold 100 is indicated by G. At this time, the upper mold 100 is heated in advance by a heater (not shown). Then, in the state of FIG. 7, the molding object (substrate) 2 is heated for a while by the heat of the upper mold 100 and thermally expanded.

  Further, from the state of FIG. 14, the suction mechanism (not shown, for example, a vacuum pump) provided in the upper mold 100 is operated while the position of the plate 1013 remains unchanged. As a result, the substrate 2 is attracted to the upper mold 100 and is adsorbed and held by the upper mold 100 in contact with the lower surface of the upper mold 100 as shown in FIG. In this manner, the molding object (substrate) 2 is transferred to a molding die including the upper molding die 100.

  Thereafter, similarly to FIG. 23, the plate 1013 is lowered by contracting the piston rod 1012 by the cylinder 1011 of the actuator 1014. Then, after the transport mechanism 1000 is retracted outside the molding die (press), the molding object (substrate) 2 is resin-molded by the molding die.

  In the present embodiment, the overall view of the resin molding apparatus, the configuration of the mold, and the method for manufacturing the resin molded product are not particularly limited, but may be the same as, for example, Example 1 (FIGS. 16 to 20).

  According to the present invention, as described above, deformation of the molding object before resin molding can be suppressed or prevented. The present invention is particularly effective for a thin molding object (such as a substrate) that is easily deformed, but is not limited to this, and can be widely applied to any molding object.

  Furthermore, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. Is.

1 Chip 2 Substrate (molding object)
3 Wire 4 Hole 11 Release film 20a Resin material (granular resin)
20b Molten resin (flowable resin)
20 Resin (cured resin)
100 Upper mold (Upper mold)
101 Pilot pin 200 Lower mold (lower mold)
201 Lower mold cavity 202 Lower mold base member 203 Lower mold cavity side member 204 Elastic member 205 Lower mold cavity bottom member 300 Mold 400 Material receiving module 401 Power supply 402 Control unit 403 Substrate material receiving unit 404 Resin material receiving unit 405 Material transfer mechanism 406 X-direction guide rail 408 Y-direction guide rail 500 Discharge module 501 Sub-transport mechanism 502 Resin molded product transport mechanism 503 Magazine 521 Resin loader (resin transport mechanism)
701 Frame member 1000 Transport mechanism 1010 Main body 1011 of transport mechanism Cylinder 1012 Piston rod 1014 Actuator (vertical movement mechanism)
1013 Plate (resin molded product placement member)
1021 Stopper pin (positioning member)
1022 Shim (positioning member)
1031 Height determining block (positioning member)
1041 Bolt (positioning member)
1042 Nut 1043 Tap hole 1100 Set block 1110 Loader set block 1120 Upper mold set block 1131 Relief hole 1132 Elastic member (spring)
1133 Fixing bolt 1134 Bush 1135 Vertically movable pin (positioning member)
2000 Molding module 3000 Resin molding device Y1 Arrow indicating mold clamping direction Y2 Arrow indicating mold opening direction

Claims (13)

A molding object mounting member for mounting a molding object before resin molding;
A vertical movement mechanism for moving the molding object placing member up and down,
Conveying the molding object in a state of being placed on the molding object placing member,
The molding object can be transferred to the molding die after being stopped at a position near the molding die that does not contact the molding die by the vertical movement of the molding object placing member. Conveyance mechanism for molding objects.   The transport mechanism according to claim 1, wherein the molding object mounting member can be stopped at a position in contact with the molding die by the vertical movement of the molding object mounting member.   Furthermore, the conveyance mechanism of Claim 1 or 2 containing the positioning mechanism which determines the position which stops the said molding object mounting member.   The transport mechanism according to claim 3, wherein the positioning mechanism is a positioning member that can be moved up and down by the vertical movement mechanism.   The transport mechanism according to claim 3 or 4, wherein a stop position of the molding object placing member can be determined by contacting the positioning member with the molding die. Furthermore, an elastic member is included,
The transport mechanism according to claim 4 or 5, wherein the positioning member is movable up and down by expansion and contraction of the elastic member. And an actuator for moving the positioning member up and down,
The transport mechanism according to any one of claims 4 to 6, wherein the stop position of the molding object placing member can be determined by determining the stop position of the positioning member by setting the pressure of the actuator. The molding object placing member can be stopped at a position near the molding die that does not contact the molding die by the vertical movement of the molding object placing member, and the molding object placing member is , It is possible to stop at a position in contact with the mold,
The transport mechanism according to claim 7, wherein the pressure of the actuator can be set to two types of pressures corresponding to the two types of stop positions. Including the transport mechanism according to any one of claims 1 to 8 and the mold.
By the transport mechanism, the molding object is transferred to the mold,
A resin molding apparatus, wherein the molding object is resin-molded by the molding die. A step of transporting a molding object before resin molding to the vicinity of the mold;
And moving the molding object up and down,
In the step of moving up and down, the molding object is stopped at a position near the molding die that does not contact the molding die,
A method for delivering a molding object to a molding die, wherein the molding object is delivered to the molding die. The step of moving up and down comprises
Stopping the molding object at a position near the molding die that does not contact the molding die;
Contacting the molding object with the mold and stopping the molding object;
Separating the molding object from the mold again and stopping at a position near the mold; and
Bringing the molding object into contact with the mold again and stopping;
The delivery method according to claim 10, comprising: A step of transporting a molding object before resin molding to the vicinity of the mold;
And moving the molding object up and down,
The step of moving up and down comprises
Contacting the molding object with the mold and stopping the molding object;
Separating the molding object from the mold again and stopping at a position near the mold; and
Bringing the molding object into contact with the mold again and stopping;
A method for delivering a molding object to a mold, comprising: A molding object delivery step of delivering the molding object to the mold by the delivery method according to any one of claims 10 to 12,
A resin molding step of resin molding the molding object with the molding die;
The manufacturing method of the resin molded product characterized by including.

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