JP6624472B1 - Electronic component mounting equipment - Google Patents

Abstract

Provided is an electronic component mounting apparatus that hardly causes breakage of an electronic component or a substrate and that can mount an electronic component on a substrate with high mounting accuracy. An electronic component mounting apparatus according to the present invention includes a first mold having one or more fixed members, a second mold having one or more movable members, a first mold and a second mold. A mounting member for mounting the electronic component and the substrate, and a movement control unit for controlling the proximity and separation of the first mold and the second mold. The movable member is capable of changing its position with respect to the second mold, and the positions of the fixed member and the movable member are determined by the positions of the electronic components installed by the installation member. According to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member releases the excess pressure which is excessive among the pressures applied by the fixed member by moving. Can reduce the number of first and second forms Also one is provided with a heat radiating member for emitting heat to the outside. [Selection diagram] FIG.

Description

  The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a substrate.

  Many electronic devices, measuring devices, transportation devices, precision devices, and the like have many electronic components such as semiconductor integrated circuits. Processors, image processing circuits, audio processing circuits, various sensors, and the like have been increasingly integrated, and many functions have been integrated in electronic components. This electronic component is needed for these devices.

  This electronic component needs to be mounted on a substrate such as a lead frame, a flexible frame, an electronic substrate, a metal base, and a heat sink. When the substrate itself is incorporated in an electronic device or the like, electronic components are mounted on the incorporated substrate. Alternatively, an electronic component may be mounted on a substrate required in a manufacturing process. This is because when an electronic device or the like needs an electronic component, it needs to be mounted via a substrate.

  As described above, an electronic component such as a semiconductor integrated circuit is often mounted on a substrate such as a lead frame, an electronic substrate, a metal base, and a heat sink.

  Here, when mounting an electronic component on a substrate, there is a method of applying an adhesive between the substrate and the electronic component, applying pressure and heat, and performing mounting with the adhesive. A mounting device using this method may be called a sintering device. Note that the substrate here includes a single-layer substrate, a laminated substrate, a single substrate, and a substrate formed by laminating a plurality of substrates.

  On the board, a mounting position at which electronic components are mounted is set. An adhesive is applied to this mounting position. Further, the electronic component is placed at the mounting position so that the electronic component contacts the adhesive. In this state, pressure and heat are applied to the electronic component.

  By applying the pressure and the heat, the bonding of the electronic component to the substrate by the adhesive is realized. As a result, an adhesive layer is formed between the substrate and the electronic component. The electronic component is mounted on the substrate via the adhesive layer.

  As described above, the electronic component is mounted on the board in order to realize storage of the electronic component in the electronic device or the like, or for the next manufacturing process using the electronic component. Since it is mounted with pressure and heat via an adhesive, it is suitable for mounting a large number of electronic components.

  A technique for such an electronic component mounting apparatus called a sintering apparatus has been proposed (for example, see Patent Document 1).

JP 2006-507164 A

  Patent Document 1 discloses a semiconductor die encapsulation method or a semiconductor die carrier mounting method, wherein a step of providing a first tool unit for holding a plurality of semiconductor dies and a step of providing a semiconductor die on the first tool unit; Providing a tool portion, wherein one of the first tool portion and the second tool portion includes a plurality of movable inserts that allow each movable insert to apply pressure on a surface area of the semiconductor die. And defining a space between the first tool portion and the second tool portion, and combining the first tool portion and the second tool portion such that the semiconductor product is arranged in the space; including. The movable insert exerts pressure on the surface area of the semiconductor die. The pressure applied by the movable insert is monitored and adjusted. Subsequently, a semiconductor die mounting apparatus is disclosed in which the first tool part and the second tool part are separated and the processed semiconductor die is removed.

  Patent Literature 1 discloses a technique for simultaneously mounting a plurality of semiconductor dies on a substrate using a resin. At this time, the semiconductor die and the substrate have a configuration in which the movable member and the fixed member sandwich the semiconductor die and the substrate. Based on this configuration, the movable member that can move up and down applies pressure to the semiconductor die, and the fixed member receives the pressure. As a result, mounting with an adhesive is realized.

  However, in the technique of Patent Document 1, the movable member applies pressure to the semiconductor die. That is, since the moving movable member applies pressure to the semiconductor die and the substrate received by the fixed member, there is a concern that the semiconductor die and the substrate may be damaged. This is because breakage due to too much pressure may occur. Alternatively, even if the pressure is not excessively applied, the moving movable member directly applies pressure to the semiconductor die or the substrate (directly pressed by the movable member or pressed through a film or the like), and this This is because the operation may damage the semiconductor die or the substrate.

  Conversely, if the pressure is reduced so as not to cause damage, there is also a problem that mounting with resin becomes insufficient. In order not to cause any of these, it is necessary to find an optimum value for the applied pressure according to the type of the semiconductor die or the substrate. Searching for such an optimum value has a problem of increasing the burden in the manufacturing process.

  In addition, if the pressure applied by the movable member is inappropriate, the thickness of the adhesive layer between the semiconductor die and the substrate may remain large. In the case where the adhesive layer between the semiconductor die and the substrate is thick, if the semiconductor die is a high-frequency semiconductor or a power semiconductor, the performance of the semiconductor die may not be sufficiently brought out.

  For this reason, if the applied pressure is inappropriate, the mounting accuracy becomes insufficient, which leads to a problem that the performance of the mounted semiconductor die (electronic component) becomes insufficient. Alternatively, there is a problem that the mounting becomes insufficient and may lead to a failure after the mounting.

  Further, it is necessary to mount a plurality of electronic components on the substrate, and it is necessary to mount the plurality of electronic components at once. This is to increase the efficiency of the manufacturing process and reduce costs. At this time, in the lamination of the substrate, the adhesive, and the electronic component, the thickness of each of the plurality of electronic components may be uneven.

  When the thickness is not uniform, if the application of the pressure by the movable member corresponding to each of the electronic components does not correspond, there is a problem that a variation in mounting occurs in each of the plurality of electronic components. Variations in mounting are undesirable because they lead to variations in performance and durability. In Patent Document 1, there is a problem that it is difficult to absorb this variation because the movable member directly applies pressure to the semiconductor die.

  Further, in an electronic component mounting apparatus, mounting is performed in which an electronic component is bonded to a substrate with an adhesive such as a metal paste. In order to sufficiently cure the adhesive such as the metal paste and to surely mount the adhesive, it is necessary to perform sufficient heating in addition to the pressing by the pressing member. For this reason, the pressing member itself has heat, and when the pressing member having heat presses, heat is also applied to the electronic component and the substrate.

  At this time, it is necessary to heat up to about 300 ° C., depending on the type of the adhesive. In order for the pressing member to apply heat at such a temperature, the mold provided with the pressing member also needs to have heat. In mounting, since the molds are fitted and pressurized, high heating is performed in a closed narrow space.

  For this reason, the electronic component mounting apparatus itself and the inside thereof become extremely high in temperature. The electronic component mounting apparatus sequentially mounts a large number of mounting targets, such as electronic components. Therefore, a high temperature may adversely affect the operation performance. Alternatively, in a work space in which the electronic component mounting apparatus is used, unfavorable environment is caused. This is because this may lead to an increase in the temperature of the factory, which is a work space, or may have an effect of heat conduction to other devices connected to the electronic component mounting device.

  As described above, in the above-described electronic component mounting apparatus called a sintering apparatus, there is also a problem that the temperature inside the apparatus or the apparatus itself (or elements of the apparatus) becomes extremely high due to the mounting process.

  As described above, the related arts including Patent Literature 1 have problems such as breakage of electronic components and boards and insufficient mounting accuracy.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that hardly causes damage to an electronic component or a substrate and that can mount an electronic component on a substrate with high mounting accuracy.

In view of the above problems, an electronic component mounting apparatus of the present invention includes a first mold having one or more fixing members,
A second form having one or more movable members,
An installation member for installing the electronic component and the board between the first mold and the second mold;
A movement control unit that controls proximity and separation of the first mold and the second mold;
The fixing member fixes its position with respect to the first formwork,
The movable member is capable of changing its position with respect to the second mold,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can move and release excess excess pressure among the pressure applied by the fixed member,
At least one of the first mold frame and the second mold frame includes a heat radiation member that emits heat to the outside.

  The electronic component mounting apparatus of the present invention has a configuration in which the movable member releases excess pressure while the fixed member applies pressure, so that it is possible to prevent the electronic component and the substrate from being applied with excessive pressure. At this time, the optimal value control of the pressure in applying the pressure by the fixing member is also reduced, so that the load on the device is reduced.

  In addition, since the pressure can be prevented from being too low, it is possible to prevent the adhesive layer from becoming too thick and from causing insufficient performance of the mounted electronic component.

  Further, even when a plurality of electronic components are mounted at the same time, the excess of the pressure applied to the movable member from the fixed member is released by the movable member, so that pressure control corresponding to each electronic component is not required. As a result, the control of the apparatus is simplified, and the load and cost in the manufacturing process can be reduced.

  In addition, the electronic component mounting apparatus of the present invention includes a mechanism for radiating heat and a mechanism for cooling in various elements. As a result, it is possible to suppress an excessive rise in temperature of the mounting device (and components thereof) due to heating required for mounting, and to enhance durability, continuous workability, and maintenance of the electronic component mounting device.

FIG. 2 is a front view of a board on which electronic components are mounted. FIG. 3 is a side view of a board on which electronic components are mounted. FIG. 2 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 2 is a block diagram showing an electronic component mounting apparatus according to Embodiment 1 of the present invention, showing pressure application by a fixing member. FIG. 9 is a block diagram of an electronic component mounting apparatus according to a second embodiment of the present invention. FIG. 9 is a block diagram of an electronic component mounting apparatus according to a second embodiment of the present invention. FIG. 10 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. FIG. 10 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. It is a schematic diagram of a second formwork in Embodiment 3 of the present invention. FIG. 10 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention.

An electronic component mounting apparatus according to a first aspect of the present invention includes a first mold having one or more fixing members,
A second form having one or more movable members,
An installation member for installing the electronic component and the board between the first mold and the second mold;
A movement control unit that controls proximity and separation of the first mold and the second mold;
The fixing member fixes its position with respect to the first formwork,
The movable member is capable of changing its position with respect to the second mold,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can move and release excess excess pressure out of the pressure applied by the fixed member.

  With this configuration, it is possible to prevent the electronic components and the like from being damaged by applying excessive pressure when mounting is performed by bonding or the like by applying pressure.

In the electronic component mounting apparatus according to the second aspect of the present invention, in addition to the first aspect, the movement control unit brings the first mold and the second mold close to each other and moves the fixing member to the electronic component or the board. Can be contacted,
By this contact, the fixing member can apply pressure to at least one of the electronic component and the substrate.

  With this configuration, the fixing member can apply pressure for mounting.

  In the electronic component mounting apparatus according to a third aspect of the present invention, in addition to the first or second aspect, a pressure is applied to at least one of the electronic component and the electronic substrate by the fixing member, and an extra pressure is applied to the movable member. The electronic component is mounted on the substrate by being released by the electronic component.

  With this configuration, mounting is performed at an optimal pressure for mounting. In addition, since there is no extra pressure, breakage of electronic components can be prevented.

  In the electronic component mounting apparatus according to the fourth invention of the present invention, in addition to any one of the first to third inventions, the fixing member presses the electronic component or the substrate, so that the fixing member is attached to at least one of the electronic component and the substrate. Pressure can be applied.

  With this configuration, pressure can be applied by pressing.

  In the electronic component mounting apparatus according to a fifth aspect of the present invention, in addition to any one of the first to fourth aspects, the second mold has one or more insertion holes at positions corresponding to the fixing members. Then, each of the one or more movable members can be inserted into the insertion hole to change the position with respect to the second mold.

  With this configuration, the movable member can release extra pressure due to the position change.

  In the electronic component mounting apparatus according to a sixth aspect of the present invention, in addition to the fifth aspect, the movable member changes its position in the insertion hole due to pressure from the fixed member received via the electronic component and the substrate. Let it.

  With this configuration, the movable member can release excess pressure.

  In the electronic component mounting apparatus according to the seventh aspect of the present invention, in addition to the sixth aspect, the movable member releases extra pressure by changing its position inside the insertion hole.

  With this configuration, the movable member can release excess pressure.

  In the electronic component mounting apparatus according to an eighth aspect of the present invention, in addition to the seventh aspect, the movable member can adjust the amount of extra pressure to be released by changing the position inside the insertion hole.

  With this configuration, the movable member can absorb a difference in excess pressure depending on the amount of movement.

  In the electronic component mounting apparatus according to a ninth aspect of the present invention, in addition to any one of the first to eighth aspects, each of the fixed member, the insertion hole, and the movable member is singly or plurally installed on the installation member. Corresponding to the number and position of electronic components.

  With this configuration, electronic components can be mounted.

  In the electronic component mounting apparatus according to a tenth aspect of the present invention, in addition to any one of the first to ninth aspects, a sheet is provided between the fixing member and the electronic component.

  With this configuration, protection can be achieved when pressure is applied to the electronic component.

The electronic component mounting apparatus according to an eleventh aspect of the present invention, in addition to the tenth aspect, further includes an intermediate mold that holds an outer periphery of the electronic component between the first mold and the installation member,
The intermediate mold can maintain a state in which the electronic component is held when the sheet is peeled.

  With this configuration, it is possible to prevent the electronic component from being pulled when the sheet is peeled off.

  In the electronic component mounting apparatus according to a twelfth aspect of the present invention, in addition to any one of the first to eleventh aspects, each of the plurality of movable members can individually realize its movable state.

  With this configuration, it is possible to optimally mount a plurality of electronic components even with variations.

  In the electronic component mounting apparatus according to a thirteenth aspect of the present invention, in addition to any one of the first to twelfth aspects, each of the plurality of movable members has at least one of a fluid pressure, an elastic pressure, and a motor drive. A movable state can be realized.

  With this configuration, the movement of the movable member is suitable for releasing excess pressure.

In the electronic component mounting apparatus according to a fourteenth aspect of the present invention, in addition to any one of the first to thirteenth aspects, the electronic component mounting apparatus further includes a pressure detecting unit that detects a pressure applied to at least one of the electronic component and the substrate.
The movable member can change the movable state based on the pressure.

  With this configuration, the extra pressure can be grasped from the pressure actually applied by the fixed member, and the movable member can release the extra pressure. As a result, it is possible to realize the application of the pressure in accordance with the actual situation.

In the electronic component mounting apparatus according to a fifteenth aspect of the present invention, in addition to any one of the first to fourteenth aspects, a movable member control unit for controlling at least one of the movable amount and the movable speed of the plurality of movable members is provided. In addition,
The movable member control unit can control at least one of the movable amount, the operating time, and the movable speed of each of the plurality of movable members based on a movable control instruction table stored in advance.

  With this configuration, the actual excess pressure can be released based on the actual pressure by the fixing member and the correlation between the pressure and the excess pressure.

An electronic component mounting apparatus according to a sixteenth aspect of the present invention includes a first form having one or more fixing members,
A second form having one or more movable members,
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit that controls proximity and separation of the first mold and the second mold;
The fixing member fixes its position with respect to the first formwork,
The movable member is capable of changing its position with respect to the second mold,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member moves an excess pressure which is excessive among the pressures applied by the fixed member. Can escape,
At least one of the first mold and the second mold includes a heat radiating member that emits heat to the outside.

  With this configuration, it is possible to prevent excessive heat generation in the first mold frame and the second mold frame due to heat generated by heating required for mounting.

  In the electronic component mounting apparatus according to a seventeenth aspect of the present invention, in addition to the sixteenth aspect, at least one of the first mold and the second mold communicates with the outside from the internal space and the internal space. It has an opening.

  With this configuration, heat generated in the first mold and the second mold can be discharged to the outside.

  In the electronic component mounting apparatus according to an eighteenth aspect of the present invention, in addition to the seventeenth aspect, heat of at least one of the internal space of the first mold and the internal space of the second mold is directed to the outside. A vacuum device for discharging is provided.

  With this configuration, the internal heat can be more forcibly and positively discharged.

  In the electronic component mounting apparatus according to a nineteenth aspect of the present invention, in addition to the seventeenth or eighteenth aspect, in the second mold, the internal space includes the surface of the second mold, the movable member, It is provided between.

  With this configuration, heat generated by the movable member can be easily discharged to the outside.

  In the electronic component mounting apparatus according to a twentieth aspect of the present invention, in addition to any one of the sixteenth to nineteenth aspects, at least one of the first mold and the second mold has at least one of an outer surface thereof. Partly equipped with heat insulating material.

  With this configuration, it is possible to suppress conduction of heat from the mold to the electronic component mounting apparatus and its housing.

  In the electronic component mounting apparatus according to a twenty-first aspect of the present invention, in addition to any one of the sixteenth to twentieth aspects, the second mold further includes a refrigerant circulation path through which the refrigerant circulates.

  With this configuration, the mold can be more actively cooled.

  In the electronic component mounting apparatus according to a twenty-second aspect of the present invention, in addition to the twenty-first aspect, the refrigerant is any one of a liquid refrigerant, a gel refrigerant, and a gas refrigerant.

  With this configuration, it is possible to widen the variation in the capacity of the refrigerant circuit.

  In an electronic component mounting apparatus according to a twenty-third aspect of the present invention, in addition to the twenty-second aspect, the movable member includes one or more heat radiation holes.

  With this configuration, heat from the movable member can be released to the outside.

In the electronic component mounting apparatus according to a twenty-fourth aspect of the present invention, in addition to the twentieth aspect, a cooling control unit that controls at least one operation of the heat dissipation member, the vacuum device, and the refrigerant circuit,
A temperature measuring unit that measures a temperature of at least one of the first mold and the second mold;
The cooling control unit controls at least one operation of the heat radiating member, the vacuum device, and the refrigerant circulation path based on a measurement result of the temperature measuring unit.

  With this configuration, it is possible to realize cooling control in accordance with a rise in temperature of a mold or the like.

  In the electronic component mounting apparatus according to a twenty-fifth aspect of the present invention, in addition to any one of the seventeenth to twenty-fourth aspects, at least one of the first mold and the second mold has an internal space inside the internal space. The fin is further provided.

  With this configuration, the heat accumulated in the second mold can be released more easily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Mounting of electronic components on electronic boards)
The mounting of an electronic component on a substrate according to the present invention will be described. FIG. 1 is a front view of a board on which electronic components are mounted. FIG. 2 is a side view of a board on which electronic components are mounted. The substrate 100 is a lead frame, a metal base, a heat sink, an electronic substrate, or the like, and includes a flexible substrate, a tape substrate, a sheet substrate, and the like. In addition, it has various structures such as a single layer and a lamination.

  FIG. 1 shows a state in which the substrate 100 is viewed from above. One or more electronic components 200 are mounted on the substrate 100. In FIG. 1, a plurality of electronic components 200 are mounted, and the board 100 may be stored in an electronic device or the like in this state, or may be divided and used for each electronic component 200.

  As shown in FIG. 2, the electronic component 200 is mounted on the substrate 100 via an adhesive layer 210. The adhesive layer 210 is an adhesive or the like, and the electronic component 200 is mounted on the substrate 100 by a bonding function of the adhesive. Before mounting, an adhesive is applied or the like, and after applying pressure for mounting to this, the bonding layer 210 is formed.

  The electronic component mounting apparatus of the present invention realizes mounting as shown in FIGS.

(Embodiment 1)
Embodiment 1 will be described. FIG. 3 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. The electronic component mounting apparatus 1 executes mounting of the electronic component 200 on the substrate 100 described with reference to FIGS.

  The electronic component mounting apparatus 1 includes a first mold 2, a second mold 3, an installation member 4, and a movement control unit 5.

  The first form 2 has a single or a plurality of fixing members 21. The fixing member 21 is fixed to the first mold 2 and does not change its relative positional relationship with the first mold 2. The position of the fixing member 21 is fixed to the first mold 2. That is, the position of the fixing member 21 is moved together with the first mold 2. In addition, as described later, the distance between the first mold 2 and the second mold 3 is reduced, so that the fixing member 21 is attached to the electronic component 200 between the first mold 2 and the second mold 3. And pressure on at least one of the substrates 100.

  The second mold 3 is a member that is paired with the first mold 2. In FIG. 3, the first mold frame 2 is shown on the upper side and the second mold frame 3 is shown on the lower side, but the up-down relationship and the left-right relationship are not limited thereto. The second mold frame 3 is paired with the first mold frame 2, and realizes the application of pressure to the electronic component 200 and the like by the fixing member 21 by bringing the relative positional relationship closer to each other.

  The second mold 3 has one or more movable members 31. The position of the movable member 31 can be changed with respect to the second mold 3. That is, when the second mold 3 approaches the first mold 2, the position of the movable member 31 with respect to the second mold 3 can be changed depending on the state of contact with the electronic component 200 or the like.

  As shown in FIG. 3, the movable member 31 is in a state of being inserted into a concave portion provided in the second mold 3, and can move in position by moving in the concave portion.

  The installation member 4 installs the electronic component 200 and the substrate 100 between the first mold 2 and the second mold 3. As shown in FIG. 3, the installation member 4 is installed with the electronic component 200 and the substrate 100 sandwiched therebetween. The electronic component 200 is installed at a position where the electronic component 200 is to be mounted on the substrate 100. Alternatively, the electronic component 200 and the substrate 100 are positioned and fixed in position via an adhesive. The object in this state is placed on the installation member 4 and installed between the first mold 2 and the second mold 3.

  The installation member 4 installs the electronic component 200 at a position where the substrate 100 is to be mounted (or the electronic component 200 already fixed on the substrate 100 is installed on the installation member 4), and the first mold 2 and It is installed between the second form 3. By being installed, the electronic component 200 is mounted by applying pressure by the first mold 2 and the second mold 3. At this time, an adhesive is applied between the electronic component 200 and the substrate 100.

  The movement control unit 5 controls the approach and separation between the first mold 2 and the second mold 3 in relation to the application of the pressure. The movement control unit 5 can control the approach and separation between the first mold 2 and the second mold 3 by moving at least one of the first mold 2 and the second mold 3.

  Here, each of the fixed member 21 and the movable member 31 has a positional relationship corresponding to the position of the electronic component 200 installed by the installation member 4. That is, the fixed member 21 and the movable member 31 are located at positions facing the electronic component 200 installed by the installation member 4.

  The movement control unit 5 brings the first mold 2 and the second mold 3 close to each other. Due to this proximity, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100. By applying the pressure, the electronic component 200 is fixed to the substrate 100 by the function of the adhesive. At the time of applying pressure, the movable member 31 is able to move and release extra pressure which is excessive among the pressure applied by the fixed member 21.

  When the movable member 31 releases the excess pressure, only the pressure necessary for mounting is applied to the electronic component 200 and the substrate 100, and no excessive pressure is applied. As a result, unlike the related art, damage to the electronic component 200 and the substrate 100 does not occur.

  In addition, even when a plurality of electronic components 200 are mounted at the same time, the movable member 31 can be released corresponding to each of the different excess pressures for each electronic component 200. As a result, an optimal pressure can be applied to each of the plurality of electronic components 200 having variations in height and mounting surface. Excessive pressure is not applied, and damage can be prevented. Further, since the movable member 31 only releases excess pressure, the pressure required for mounting is applied by each electronic component 200, and mounting can be performed reliably.

  In addition, each of the fixed member 21, the insertion hole 32, and the movable member 31 is a position corresponding to the number and position of the electronic components 200 installed on the installation member 4.

(Operation explanation)
Next, the operation will be described.

(Initial state: Fig. 3)
FIG. 3 described above shows an initial state. In the initial state, the first mold 2 and the second mold 3 are separated from each other. The substrate 100 and the electronic component 200 are installed between the first mold frame 2 and the second mold frame 3 by the installation member 4. At this time, the electronic component 200 is set at the mounting position of the substrate 100 by the mounting member 4 (or the electronic component 200 is fixed at the mounting position of the substrate 100 with an adhesive, and the mounting member 4 An adhesive or the like is applied between the electronic component 200 and the substrate 100 (set between the first mold frame 2 and the second mold frame 3).

Further, the sheet 110 may be set as needed. The sheet 110 is installed so as to be sandwiched between the fixing member 21 and the electronic component 200. As will be described later, the fixing member 21 applies pressure to the electronic component 200 (if the positional relationship between the electronic component 200 and the substrate 100 is upside down in FIG. 3, the fixing member 21 applies pressure to the substrate 100). . At this time, since the sheet 110 is provided, it becomes easy to separate the fixing member 21 after applying the pressure.
The sheet 110 may be provided between the movable member 31 and the substrate 100 or the electronic component 200.

  As described below, the movement control unit 5 brings the first mold 2 and the second mold 3 close to each other. Due to this proximity, the fixing member 21 can directly or indirectly contact at least one of the electronic component 200 and the substrate 100. With this contact, the fixing member 21 can apply pressure to at least one of the electronic component 200 and the substrate 100.

  This is because the fixing member 21 can apply pressure by pressing the electronic component 200 and the substrate 100.

  By applying the pressure, the electronic component 200 is mounted on the substrate 100. At this time, of the pressure from the fixed member 21, the movable member 31 can release an extra pressure that is excessive in mounting. The movable member 31 is movable along the pressure application direction, and the extra pressure causes this movement.

  This movement results in the release of extra pressure. If the excess pressure is released, only the pressure necessary for mounting remains, and mounting can be performed without causing damage or the like.

(Moving the installation member: Fig. 4)
FIG. 4 is a block diagram of the electronic component mounting apparatus according to Embodiment 1 of the present invention. It is shown schematically. Elements such as the movement control unit 5 shown in FIG. 3 are similarly provided, but are omitted for the sake of clarity of the drawing. The operation by the movement control unit 5 is also performed in FIG.

  As shown in FIG. 4, after the initial state, the mounting member 4 of the electronic component mounting apparatus 1 descends and approaches the second form 3. The installation member 4 sets the electronic component 200 and the substrate 100, and the set electronic component 200 and the like approach the second form 3.

  When the installation member 4 approaches the second mold 3, the electronic component 200 and the substrate 100 installed on the installation member 4 approach the movable member 31. When the user approaches further, the movable member 31 can be brought into contact. FIG. 4 shows this state.

  By being in this contactable state, the movable member 31 can release excess pressure when pressure is applied from the fixed member 21.

  Here, the electronic component mounting apparatus 1 includes a drive unit that operates each element, and the drive unit may move the installation member 4.

(Movement of intermediate mold and sheet: Fig. 5)
FIG. 5 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. In the electronic component mounting apparatus 1, the intermediate mold 6 and the sheet 110 are moved so as to approach the installation member 4. The intermediate mold 6 and the sheet 110 may be lowered to approach the installation member 4, or the second mold 3 may be raised to bring the installation member 4 closer to the intermediate mold 6 or the like.

  When the intermediate mold 6 and the sheet 110 approach the installation member 4, the intermediate mold 6 approaches the electronic component 200. The same applies to the sheet 110. The sheet 110 is provided between the fixing member 21 and the electronic component 200 as described above. The same applies to the intermediate mold 6.

  The intermediate mold 6 is a member that holds the outer periphery of the electronic component 200 in the process of applying pressure by the fixing member 21. When pressure is applied by the fixing member 21, the electronic component 200 comes into contact with the sheet 110. The sheet 110 protects the fixing member 21 when the fixing member 21 comes into contact with the electronic component 200.

  When the application of the pressure is completed and the fixing member 21 is separated from the electronic component 200, the sheet 110 is peeled off from the electronic component 200. At this time, since the sheet 110 and the electronic component 200 are receiving the pressure from the fixing member 21, the sheet 110 is stuck to the electronic component 200.

  If the sheet 110 is peeled off in this state, there is a problem that the electronic component 200 is pulled by the sheet 110. The intermediate mold 6 surrounds and holds the outer periphery of the electronic component 200 when pressure is applied by the fixing member 21. This holding can reduce the problem that the electronic component 200 is pulled by the sheet 110 even when the sheet 110 is removed.

  At the stage of FIG. 5, the intermediate mold 6 and the sheet 110 come close to contact with the electronic component 200. By providing this state, various problems in post-processing after mounting can be reduced.

(Proximity between the first mold 2 and the second mold 3: FIG. 6)
FIG. 6 is a block diagram of the electronic component mounting apparatus according to the first embodiment of the present invention. FIG. 6 shows a state where the first mold 2 and the second mold 3 are close to each other. Here, as an example, the movement control unit 5 raises the second mold 3 to bring the first mold 2 and the second mold 3 close to each other.

  When the first mold frame 2 and the second mold frame 3 come close to each other, a state where the fixing member 21 can contact the electronic component 200 via the sheet 110 is created. With this contact state, the fixing member 21 can apply pressure to at least one of the electronic component 200 and the substrate 100.

  Further, as shown in FIG. 6, the fixing member 21 enters the opening corresponding to the electronic component 200 in the intermediate mold 6. With this entry, it is possible to enter the opening of the intermediate mold 6 and apply pressure to the electronic component 200.

  Further, the sheet 110 is pushed in with the contact of the fixing member 21. The sheet 110 adheres to the surface of the electronic component 200 following the outer shapes of the fixing member 21, the intermediate mold 6 and the electronic component 200. The electronic component 200 can be protected from the fixing member 21 by the sheet 110.

  When the first mold 2 and the second mold 3 come close to each other in the movement operation by the movement control unit 5, the state where the pressure from the fixing member 21 can be applied is brought about. Here, in FIG. 6, the movement control unit 5 is connected to the second form 3, and the movement control unit 5 raises the second form 3, but it is also possible to lower the first form 2. Good. In any case, the first mold 2 and the second mold 3 only need to be in a state of approaching each other.

  The movement control unit 5 controls the proximity (application of pressure by the fixing member 21) between the first mold 2 and the second mold 3 in accordance with the strength and time sufficient for mounting the electronic component 200 on the substrate 100. do it. The intensity and the time may be programmed in advance in the movement control unit 5 or may be adjusted by an arbitrary operation. Alternatively, it may be controlled based on the result of empirical learning.

(Pressure application by fixing member 21: FIG. 7)
FIG. 7 is a block diagram showing an electronic component mounting apparatus according to Embodiment 1 of the present invention, in which pressure is applied by a fixing member. FIG. 7 shows a state in which the movement control unit 5 further brings the first mold 2 and the second mold 3 closer to each other from the state shown in FIG. FIG. 7 shows a state in which the fixing member 21 applies pressure to the electronic component 200 and the substrate 100 in addition to the proximity.

  The movement control unit 5 moves at least one of the first mold 2 and the second mold 3 so that the fixing member 21 can apply pressure. Further, it is maintained for a certain time. In this state, the fixing member 21 can apply pressure to the electronic component 200 as indicated by an arrow A shown in FIG.

  At this time, the fixing member 21 is fixed to the first mold frame 2. Further, the movable member 31 that receives the pressure is relatively movable with respect to the second mold 3. As a result, of the pressure indicated by the arrow A applied by the fixed member 21, excess pressure that is excessive during mounting is released by moving the movable member 31 away from the electronic component 200.

  The arrow B in FIG. 7 indicates the extra pressure released by the movable member 31. The difference between the arrow A and the arrow B is an appropriate pressure required for mounting the electronic component 200 on the substrate 100. With this appropriate pressure, the electronic component 200 and the substrate 100 can be securely mounted without being damaged. Can be.

  Here, the second mold 3 has one or more insertion holes 32 at positions corresponding to the fixing members. The movable member 31 is inserted into the insertion hole 32. The position of the movable member 31 with respect to the second mold 3 is changed by raising and lowering the position inside the insertion hole 32.

  When an extra pressure indicated by an arrow B in FIG. 7 is received (when a pressure applied to the electronic component 200 and the substrate 100 from the fixed member 21), the movable member 31 moves in the insertion hole 32. By this movement, extra pressure can be released. This is because extra pressure due to the position change is released.

  FIG. 7 shows a state in which the fixed member 21 applies pressure to the electronic component 200 and excess pressure is released by the movable member 31. As a result, reliable mounting can be realized without applying excessive pressure to damage the electronic component 200 or the like.

  Further, the movable member 31 can also adjust the extra pressure to be released by adjusting the amount of position change inside the insertion hole 32. In some cases, when the extra pressure to be released is zero, the movable member 31 does not change its position with respect to the second mold 3.

(Separation between the first and second molds)
When the mounting is completed, the first mold 2 and the second mold 3 are separated from each other. The movement control unit 5 executes this separation. When the sheet 110 or the like is removed at a distance, the member with the electronic component 200 mounted on the substrate 100 is taken out. It will be used for the next step.

  The removal of the sheet 110 or the like may be realized by a drive unit or another mechanism, and may be a mechanism incorporated in the electronic component mounting apparatus 1 or another mechanism. Since these do not directly relate to the present invention, description thereof will be omitted.

  As described above, the electronic component mounting apparatus 1 according to the first embodiment can realize reliable mounting while reducing the risk of damaging the electronic component 200 and the substrate 100 by applying pressure. In addition, since an optimal pressure can be applied, the thickness of the adhesive layer between the substrate 100 and the electronic component 200 can be adjusted appropriately.

  Note that the vertical positional relationship between the first mold frame 2 and the second mold frame 3 described in FIG. 3 and thereafter may be reversed. The descent and the ascent may be reversed, and may be a lateral movement instead of a vertical movement.

  (Embodiment 2)

  Next, a second embodiment will be described. In the second embodiment, various variations will be described.

(Treatment of extra pressure by movable member)
FIG. 8 is a block diagram of an electronic component mounting apparatus according to Embodiment 2 of the present invention.

  The second form 3 has a movable member 31. The second mold 3 is provided with an insertion hole 32, and the movable member 31 is inserted into the insertion hole 32 and moves. By this movement, it is in a movable state. When the fixed member 21 applies pressure to the electronic component 200, the movable member 31 can release excess pressure, for example, by moving downward.

  In the insertion hole 32, the movable member 31 is in a state where it can be moved by air pressure, hydraulic pressure, or the like. It is possible to measure an extra pressure to be released for the air pressure or the hydraulic pressure. At this time, as shown in FIG. 8, it is preferable to further include an extra pressure adjusting unit 52.

  The extra pressure adjuster 52 can adjust the amount of movement (movable amount, movable time, movable speed) of the movable member 31. The extra pressure to be released is determined by the amount and manner of movement of the movable member 31. The extra pressure adjusting unit 52 sets an extra pressure to be released by the extra pressure adjusting unit 52. According to the set extra pressure, the extra pressure adjuster 52 controls the amount and manner of movement of the movable member 31.

  When the movable member 31 moves based on this control, the movable member 31 can release necessary extra pressure.

  Here, the movable member 31 can realize a movable state by at least one of liquid pressure, elastic pressure, and motor drive.

  Further, the fixing member 21 includes the pressure detecting unit 7. The pressure detector 7 detects the magnitude of the pressure applied by the fixing member 21 to the electronic component 200. The pressure detector 7 outputs the detected pressure magnitude to the movable member controller 53.

  The movable member control unit 53 can read data of a preset movable control instruction table 54. The movable control instruction table 54 stores the relative relationship between the pressure applied by the fixed member 21 and the extra pressure that the movable member 31 should release.

  The movable member control unit 53 can calculate an extra pressure that the movable member 31 should release based on the pressure of the fixed member 21 notified from the pressure detection unit 7. The calculation result is output to the extra pressure adjusting unit 52. The extra pressure adjusting unit 52 controls the movement of the movable member 31 with the extra pressure based on the actual pressure of the fixed member 21 which is the result of the calculation.

  In this way, the extra pressure can be released by the movable member 31 based on the value of the pressure actually applied by the fixed member 21. As a result, mounting with an optimal pressure is realized, and damage to the electronic component 200 can be prevented.

(Multiple implementations)
FIG. 9 is a block diagram of an electronic component mounting apparatus according to Embodiment 2 of the present invention. FIG. 9 shows an electronic component mounting apparatus 1 for mounting a plurality of electronic components 200 at one time.

  The first form 2 has a plurality of fixing members 21. The second form 3 includes a plurality of movable members 31 at positions corresponding to the second form. The installation member 4 and the intermediate mold 6 are also forms corresponding to this. As described above, the electronic component mounting apparatus 1 can mount a plurality of electronic components 200 at one time.

  Also in the case of FIG. 9, the fixed member 21 and the movable member 31 perform the above-described operations, and can be mounted with an optimum pressure.

Here, there is a possibility that the plurality of electronic components 200 vary in thickness, adhesive application amount, and the like. Regardless of the variation in the thickness or the like, it is preferable that the components are mounted under the same pressure.
In some cases, the electronic components 200 may be individually mounted at different pressures.

For this reason, it is preferable that each of the plurality of movable members 31 can individually realize a movable state. As shown in FIG. 9, the movable state of each of the plurality of movable members 31 is individually controlled by the extra pressure adjusting unit 52. With this individual control, each of the plurality of movable members 31 can individually realize a movable state. Even if the moving amount and the inclination to be escaped are different, the individual movable members 31 can operate according to each.
Also, the extra pressure to be released can be changed individually.

  The extra pressure adjusting unit 52 and the movable member control unit 53 determine at least the movable amount, the movable time, and the movable speed of the plurality of movable members 31 based on the respective pressure values of the plurality of fixed members 21 and the movable control instruction table. Control one. By this control, extra pressure adapted to each electronic component 200 can be released.

  Alternatively, the extra pressure adjusting unit 52 and the movable member control unit 53 may control at least one of the movable timing and the stepwise pressurizing operation. This is because controlling these also leads to control of an optimal extra pressure to be released corresponding to each of the electronic components 200.

  As a result, an optimal pressure can be applied to each electronic component 200. Even when there is a variation in the thickness of the electronic component 200 or the amount of the applied adhesive, it is possible to prevent a problem caused by applying an optimal pressure to each electronic component 200.

  As described above, the electronic component mounting apparatus 1 according to the second embodiment can perform an optimal extra pressure process according to the actual pressure application situation. Further, a plurality of electronic components 200 can be mounted at an optimum pressure at a time.

(Embodiment 3)
Next, a third embodiment will be described. FIG. 10 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. These components are shown in a visible state so that the configuration, elements, and the like of the electronic component mounting apparatus can be easily grasped. In addition, some of the elements overlapping with those described in the first and second embodiments in FIG. 3 and the like are omitted as necessary. Note that the actual electronic component mounting apparatus 1 may be surrounded by an external housing or the like.

  The electronic component mounting apparatus according to the third embodiment shown in FIG. 10 includes the first mold 2 and the second mold 3 as described in the first embodiment with reference to FIG. The first form 2 has a single or a plurality of fixing members 21. The second mold 3 has one or more movable members 31. The electronic component mounting apparatus 1 includes a movement control unit 5.

  The first mold 2 having the fixed member 21 and the second mold 3 having the movable member 31 are combined in a state where they face each other. That is, the first mold frame 2 and the second mold frame 3 are paired so as to face each other. Although not shown in FIG. 10, the movement control unit 5 is further provided as described in the first embodiment. The movement control unit 5 moves the first mold 2 and the second mold 3 closer to or away from each other.

  Although not shown in FIG. 10, the installation member 4 is located between the first mold 2 and the second mold 3. The installation member 4 is positioned so as to be sandwiched between the first mold 2 and the second mold 3. The installation member 4 is not always located between the first mold 2 and the second mold 3, but is arranged at the time of mounting the electronic component 200 on the substrate 100.

  The installation member 4 has one or more sections, and the substrate 100 and the electronic component 200 are installed in accordance with the sections. That is, the board 100 to be mounted and the electronic components 200 are arranged in the section of the installation member 4. Since the installation member 4 is installed between the first mold 2 and the second mold 3, in a later step, pressure is applied by the proximity of the first mold 2 and the second mold 3. The electronic component 200 is mounted on the substrate 100. In mounting, an adhesive or an adhesive paste (including a metal paste or the like) is used.

  Here, the electronic component mounting apparatus 1 installs the installation member 4 on which the electronic components 200 and the like are continuously installed between the first mold frame 2 and the second mold frame 3. The installed installation member 4 has the electronic components 200 and the substrate 100 arranged and installed as described above.

  When the installation member 4 is installed, each of the fixed members 21, each of the electronic components 200 (and the substrate 100) arranged in the section of the installation member 4, and each of the movable members 31 are connected to a series of positional relationships. Become. When the first mold 2 and the second mold 3 approach each other due to the series of positional relationships, the fixed member 21 applies pressure to the electronic component 200 (substrate 100) while the movable member 31 Relieve pressure. The electronic component 200 and the board 100 are mounted by sandwiching the fixed member 21 and the movable member 31 with an appropriate pressure. This is as described in the first embodiment.

  Here, the electronic component 200 and the board 100 are mounted by using an adhesive. For example, an adhesive such as a metal paste is applied between the electronic component 200 and the substrate 100, and an adhesive such as a metal paste is applied to the electronic component 200 by pressure generated by sandwiching the fixed member 21 and the movable member 31. And the substrate 100 are bonded.

  When the first mold 2 and the second mold 3 approach each other due to the movement control by the movement control unit 5, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100 in this manner. Of the applied pressure, the movable member 31 releases excess pressure which is excessive. As a result, an optimal pressure for mounting (adhering) is applied to at least one of the electronic component 200 and the substrate 100. The term “optimal” does not mean a pressure that is too strong to affect the electronic component 200 or the substrate 100, nor a pressure that is too weak such that mounting (adhesion) is insufficient.

  In this manner, the electronic component 200 and the board 100 are securely mounted by sandwiching the fixed member 21 and the movable member 31 with the optimum pressure. Even when mounting a plurality of electronic components 200 at the same time, even if the thickness of the electronic components 200 varies, the movement of the movable member 31 of each electronic component 200 hardly causes variations in mounting accuracy.

  Here, the electronic component 200 and the substrate 100 are mounted with an adhesive such as a metal paste. For this reason, an adhesive is previously applied to the installation member 4 between the electronic component 200 and the substrate 100.

  On the other hand, in mounting by applying pressure (pressurization) sandwiched between the fixed member 21 and the movable member 31, bonding with this adhesive is performed. In order to make this bonding efficient and reliable, the fixed member 21 and the movable member 31 apply heat in addition to applying pressure. This is because it is appropriate to apply both pressure and heat in bonding with an adhesive such as a metal paste.

  For this reason, the fixed member 21 and the movable member 31 have a mechanism capable of heating. For example, the first mold 2 has a heating mechanism for applying heat to the fixed member 21, and the second mold 3 has a heating mechanism for applying heat to the movable member 31. With this heating mechanism, the fixed member 21 and the movable member 31 can have heat. The electronic component 200 is adhered to the substrate 100 by pressing while holding the heat between the fixed member 21 and the movable member 31. By being heated in addition to the pressure, the adhesive such as a metal paste is hardened, and the electronic component 200 and the substrate 100 are bonded.

  By this bonding, mounting is realized.

  Here, the electronic component mounting apparatus 1 continuously mounts the electronic component 200 and the substrate 100. For this continuous execution, the heating mechanism constantly heats the fixed member 21 and the movable member 31. Therefore, the fixed member 21 and the movable member 31 always have heat. In addition, since the fixed member 21 and the movable member 31 have heat, the first mold 2 and the second mold 3 provided with these also have heat. The entire electronic component mounting apparatus 1 that stores the first mold frame 2 and the second mold frame 3 and the inside thereof also have heat.

If the temperature becomes too high, the durability and operability of the electronic component mounting apparatus 1 may be adversely affected. For example, there are problems such as deterioration of hydraulic oil and rubber and plastic parts, and problems of deterioration of electrical relations. Alternatively, there is a concern that the operation of the operator is hindered.

  In electronic component mounting apparatus 1 according to the third embodiment, at least one of first mold 2 and second mold 3 includes a heat radiation member that emits heat to the outside. In FIG. 10, the first mold 2 includes a first heat dissipation member 26, and the second mold 3 includes a second heat dissipation member 36. In FIG. 10, each of the first mold frame 2 and the second mold frame member 3 is provided with a heat radiating member.

  The first heat radiation member 26 is formed of a material having high thermal conductivity, and is in thermal contact with the first mold 2. Due to this thermal contact, the first heat radiating member 26 can release the heat of the first mold frame 2 generated due to the heating of the fixing member 21 to the outside. Similarly, the second heat radiating member 36 is formed of a material having high thermal conductivity, and is in thermal contact with the second mold 3. Due to this thermal contact, the second heat radiating member 36 can release the heat of the second mold 3 generated due to the heating of the movable member 31 to the outside.

  Here, there are metals and alloys as materials having high thermal conductivity. For example, copper, aluminum, gold, silver, or an alloy thereof may be used. Further, the first heat radiating member 26 and the second heat radiating member 36 may be members having a plate member or a fin.

  With the first heat radiating member 26 and the second heat radiating member 36, the heat of the first mold frame 2 and the second mold frame 3 can be released to the outside. By being able to release to the outside, excess heat generated by heating by the heating mechanism can be released to the outside. The electronic component mounting apparatus 1 mounts the electronic component 200 and the board 100 continuously. Therefore, the heating mechanism operates continuously. That is, the first mold 2 and the second mold 3 are continuously in a state of having heat.

  The first heat radiating member 26 continues to emit the heat that the first mold 2 has. Similarly, the second heat radiation member 36 continues to emit the heat that the second form 3 has. Thus, the first mold 2 and the second mold 3 can be prevented from having excessive heat.

(Internal space and opening)
It is also preferable that at least one of the first mold frame 2 and the second mold frame 3 includes an internal space and an opening communicating from the internal space to the outside. FIG. 11 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. FIG. 11 shows a state where the electronic component mounting apparatus of FIG. 1 is viewed from the side.

  In each of FIGS. 10 and 11, the first mold 2 has a first internal space 24. The first internal space 24 is a space provided inside the first mold 2 and makes it difficult to directly transfer the heat of the fixing member 21 to the first mold 2. That is, the first internal space 24 realizes that the heated fixing member 21 reduces the portion that directly contacts the members and elements of the first mold 2.

  For this reason, the heat of the fixing member 21 is transmitted to the first internal space 24 by reducing the transmission to the first mold 2. As a result, the amount of heat conduction to the first mold 2 is reduced, and the heat of the first mold 2 can be prevented from rising.

  The first internal space 24 has a first opening 27. The first opening 27 communicates with the outside. Due to the communication with the outside, the first opening 27 can release the heat of the first internal space 24 to the outside. That is, the heat from the fixing member 21 is transmitted to the first internal space 24 and discharged to the first opening 27.

  Further, it is also preferable that the first opening 27 is connected to a first conduit 28 that emits heat to the outside or connects to a vacuum device 600 described later. The first opening 27 may directly release the heat of the first internal space 24 to the outside, or may release the heat to the outside via the first conduit 28. In addition, when passing through the first conduit 28, the heat in the first internal space 24 may be released to the outside by the vacuum device 600 connected to the first conduit 28.

  As described above, of the heat generated based on the heating of the fixing member 21, the heat received by the first mold 2 is discharged to the outside from the first heat radiation member 26. On the other hand, heat transmitted to the first internal space 24 is discharged to the outside through the first opening 27. In particular, the first internal space 24 and the first opening 27 can discharge heat to the outside while suppressing heat conduction to the first mold 2. Together, the heat starting from the heating of the fixing member 21 is discharged to the outside.

  In each of FIGS. 10 and 11, the second mold 3 has a second internal space 34. The second internal space 34 is a space provided inside the second mold 3 and makes it difficult to directly transfer the heat of the movable member 31 to the second mold 3. That is, the second internal space 34 realizes that the heated movable member 31 reduces a portion in direct contact with the members and elements of the second mold 3.

  For this reason, the heat of the movable member 31 is transmitted to the second internal space 34 by reducing transmission of the heat to the second mold 3. As a result, the amount of heat conduction to the second mold 3 is reduced, and the heat of the second mold 3 can be prevented from rising.

  The second internal space 34 has a second opening 37. The second opening 37 communicates with the outside. Due to this communication with the outside, the second opening 37 can release the heat of the second internal space 34 to the outside. That is, heat from the movable member 31 is transmitted to the second internal space 34 and discharged to the second opening 37. The second opening 37 discharges the heat of the second internal space 34 to the outside.

  It is also preferable that the second opening 37 is connected to a second pipe 38 that emits heat to the outside or connects to a vacuum device 600 described later. The second opening 37 may release the heat of the second internal space 34 directly to the outside, or may release the heat to the outside via the second conduit 38. In addition, when passing through the second conduit 38, the heat in the second internal space 34 may be released to the outside by the vacuum device 600 connected to the second conduit 38.

  As described above, of the heat generated from the heating of the movable member 31 as a base point, the heat received by the second mold 3 is discharged to the outside from the second heat radiation member 36. On the other hand, heat transmitted to the second internal space 34 is discharged to the outside from the second opening 37 and the second conduit 38. In particular, the second internal space 34 and the second opening 37 can discharge heat to the outside while suppressing heat conduction to the second mold 3. Together, the heat starting from the heating of the movable member 31 is discharged to the outside.

  The provision of the internal space and the opening facilitates the heat that easily accumulates inside the first mold 2 and the second mold 3 to be discharged to the outside. Further, it is possible to suppress an excessive rise in heat of the first mold frame 2 and the second mold frame 3 formed of a metal, an alloy, or the like.

  Here, in the second mold 3, the second internal space 34 is provided between the surface of the second mold 3 and the movable member 31. FIG. 10 and FIG. 11 show this mode. By being provided at this position, the heat of the movable member 31, which heats up due to heating, is reduced directly to the second form 3 itself, and the heat of the movable member 31 is transferred to the outside through the second opening 37. Be able to drain. With this positional relationship, the heat is efficiently discharged from the movable member 31 as a starting point.

(Vacuum device)
As shown in FIG. 11, it is preferable that a vacuum device 600 that emits heat of at least one of the first space 24 and the second space 34 to the outside is provided. In FIG. 11, a vacuum device 600 is shown as a mode connected to the first pipe 28 and the second pipe 38.

  The vacuum device 600 can discharge the internal air of at least one of the first internal space 24 and the second space 34 to the outside by having the suction function. The internal air has heat as described above. By forcibly discharging the heated internal air by suction of the vacuum device 600, the heat of at least one of the first internal space 24 and the second internal space 34 can be efficiently discharged.

  Heat is transferred to the first internal space 24 by heating the fixing member 21 (from the heated fixing member 21, from the heating mechanism, or during the heating process). The vacuum device 600 reduces the heat of the first mold 2 by the function of discharging the air inside the first internal space 24 to the outside.

  Further, in combination with the above-described first heat radiating member 26, the heat of the first mold frame 2 can be released to the outside from various directions. As a result, excessive heat rise in the first mold 2 can be prevented.

  Similarly, due to overheating of the movable member 31 (from the heated movable member 31 or from the heating mechanism or in the process of heating), heat is transmitted to the second internal space 34. The vacuum device 600 reduces the heat of the second mold 3 by the function of discharging the air inside the second internal space 34 to the outside.

  Further, in combination with the above-described second heat radiation member 36, the heat of the second mold 3 can be released to the outside from various directions. As a result, an excessive heat rise in the second mold 3 can be prevented.

(Internal fin)
As shown in FIG. 11, the first form 2 has an internal fin 29. The second form 3 has an internal fin 39. The internal fin 39 is provided inside the second form 3. In addition, if necessary, it is provided so as to be exposed also on the surface of the second mold 3. The internal fins 29 of the first mold frame 2 and the internal fins 39 of the second mold frame 3 may be provided as shown in FIG. 11 or only one of them may be provided.

  The internal fin 39 is provided in the second internal space 34 of the second form 3. The internal fins 39 are formed of a material such as a metal or an alloy having high thermal conductivity, and can diffuse heat in the second internal space 34. Further, heat from the second mold 3 can be efficiently conducted to the second internal space 34, and heat can be efficiently discharged from the second opening 37 and the second exhaust fan 38. The same applies to the internal fins 29 provided on the first mold 2.

(Insulation material)
It is also preferable that at least one of the first mold frame 2 and the second mold frame 3 includes a heat insulating material on at least a part of the outer surface thereof.

  As shown in FIGS. 10 and 11, a first heat insulating material 25 is provided on at least a part of the outer surface of the first mold 2. By providing the first heat insulating material 25, heat conduction from the first mold frame 2 to the housing of the electronic component mounting apparatus 1 can be suppressed. The heat of the first mold 2 is released to the outside by the first heat radiation member 26 and the vacuum device 600. In this release, the heat is released through a path through which heat is not easily transmitted to the housing of the electronic component mounting apparatus 1.

  On the other hand, the first mold 2 has heat as a whole. Here, the first mold 2 is incorporated in the electronic component mounting apparatus 1. When assembled, the electronic component mounting apparatus 1 may come into thermal contact with the housing. Due to this thermal contact, the heat of the first mold frame 2 may be conducted to the housing of the electronic component mounting apparatus 1 or the like.

  The electronic component mounting apparatus 1 is used for work and other operations by a worker. For this reason, it is not preferable that the heat of the first mold 2 heats the housing of the electronic component mounting apparatus 1 and the like.

  The first heat insulating material 25 can suppress heat conduction to the housing and the like of the electronic component mounting apparatus 1. Due to this suppression, an excessive heat rise of the electronic component mounting apparatus 1 itself can be prevented.

  Similarly, as shown in FIGS. 10 and 11, a second heat insulating material 35 is provided on at least a part of the outer surface of the second mold 3. By providing the second heat insulating material 35, heat conduction from the second mold 3 to the housing of the electronic component mounting apparatus 1 can be suppressed. The heat of the second mold 3 is released to the outside by the second heat radiation member 36 and the vacuum device 600. In this release, the heat is released through a path through which heat is not easily transmitted to the housing of the electronic component mounting apparatus 1.

  On the other hand, the second mold 3 has heat as a whole. Here, the second mold 3 is incorporated in the electronic component mounting apparatus 1. When assembled, the electronic component mounting apparatus 1 may come into thermal contact with the housing. Due to this thermal contact, the heat of the second mold 3 may be conducted to the housing of the electronic component mounting apparatus 1 or the like.

  The electronic component mounting apparatus 1 is used for work and other operations by a worker. For this reason, it is not preferable that the heat of the second mold 3 heats the housing and the like of the electronic component mounting apparatus 1.

  The second heat insulating material 35 can suppress heat conduction to the housing of the electronic component mounting apparatus 1 and the like. Due to this suppression, an excessive heat rise of the electronic component mounting apparatus 1 itself can be prevented.

(Heat radiation hole)
As shown in FIG. 10, it is preferable that the movable member 31 includes one or more heat radiation holes 32. The movable member 31 is provided in the second mold 3 and can move so as to release excess pressure.

  Heat is applied to the movable member 31 from the heating mechanism. Therefore, the movable member 31 generates heat. Since the movable member 31 has the heat radiating holes 32, the heat of the movable member 31 can be released to the outside.

(Refrigerant circuit)
FIG. 12 is a schematic diagram of a second mold according to Embodiment 3 of the present invention. The upper side of FIG. 12 is a cross-sectional view of a portion having the second mold. The lower side of FIG. 12 is a front view of the second formwork.

  It is preferable that the second mold 3 further includes a refrigerant circulation path 40 through which the refrigerant circulates. FIG. 12 shows the refrigerant circulation path 40.

  The refrigerant circulation path 40 circulates a refrigerant having a high heat exchange rate, such as a liquid refrigerant, a gel refrigerant, and a gas refrigerant. Since the refrigerant circulation path 40 is provided inside the second mold 3, the refrigerant is circulating inside the second mold 3. Due to the circulation of the refrigerant in the refrigerant circulation path 40, a rise in the temperature of the second mold 3 is suppressed.

  By using any of a liquid refrigerant, a gel refrigerant, a gas refrigerant, and the like as the refrigerant, the second mold 3 is efficiently cooled. The cooling by the refrigerant circulation path 40 is performed in parallel with the heating of the second mold 3, thereby suppressing an excessive rise in temperature.

  Which of a liquid refrigerant, a gel refrigerant, a gas refrigerant, and the like is selected may be appropriately selected.

  As shown in the upper part of FIG. 12, the refrigerant circulation path 40 may be formed so as to meander inside the second form 3. By this meandering, the refrigerant circulation path 40 can cool the second mold 3 two-dimensionally or three-dimensionally. With this cooling capacity, it is possible to efficiently suppress the temperature rise of the second mold 3.

(Temperature measurement)
FIG. 13 is a schematic diagram of an electronic component mounting apparatus according to Embodiment 3 of the present invention. The electronic component mounting apparatus 1 shown in FIG. 13 further includes a cooling control unit 46 and a temperature measurement unit 45.

  The temperature measuring unit 45 measures the temperature of at least one of the first mold 2 and the second mold 3. The temperature measurement unit 45 outputs the measurement result to the cooling control unit 46.

  The cooling control unit 46 controls at least one operation of the first heat radiating member 26, the second heat radiating member 36, the vacuum device 600, and the refrigerant circulation path 40. The cooling control unit 46 controls at least one operation of the first heat radiating member 26, the second heat radiating member 36, the vacuum device 600, and the refrigerant circulation path 40 based on the measurement result of the temperature measuring unit 45.

  For example, when the temperature as a result of the temperature measurement is high, at least one of the first heat radiating member 26, the second heat radiating member 36, the vacuum device 600, and the refrigerant circulation path 40 is operated, or the operation capability is increased. Conversely, when the temperature as a result of the temperature measurement is low, at least one of the first heat radiating member 26, the second heat radiating member 36, the vacuum device 600, and the refrigerant circulation path 40 is stopped or the operation capability is reduced.

  Thus, the cooling capacity can be controlled in accordance with the actual temperature rise state. With this control, more appropriate cooling can be realized. By this cooling, an excessive rise in temperature of the first mold 2, the second mold 3, and the electronic component mounting apparatus 1 based on the heating required for mounting can be suppressed.

  Since an excessive rise in temperature can be suppressed, there is an advantage in preventing an adverse effect on the adhesive and the electronic component and in improving the durability of the electronic component mounting apparatus 1.

  The electronic component mounting apparatus described in the first to third embodiments is an example for explaining the gist of the present invention, and includes modifications and modifications without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 1st form 21 Fixed member 24 1st internal space 25 1st heat insulating material 26 1st heat dissipation member 27 1st opening 28 1st channel 29 Internal fin 3 2nd form 31 Movable member 32 Heat radiating hole 34 Second internal space
35 second heat insulating material 36 second heat dissipating member 37 second opening 38 second conduit 39 inner fin 4 installation member 40 refrigerant circulation path 45 temperature measuring section 46 cooling control section 5 movement control section 6 intermediate mold 7 pressure detecting section 52 Extra pressure adjusting unit 53 Movable member control unit 54 Movable control instruction table 100 Board 110 Sheet 200 Electronic component 600 Vacuum device

Claims (9)

A first mold having one or more fixing members,
A second form having one or more movable members,
An installation member for installing an electronic component and a substrate between the first mold and the second mold;
A movement control unit that controls proximity and separation of the first mold and the second mold;
The fixing member fixes its position with respect to the first formwork,
The movable member is capable of changing its position with respect to the second mold,
Each position of the fixed member and the movable member corresponds to the position of the electronic component installed by the installation member,
Due to the proximity by the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member moves an excess pressure which is excessive among the pressures applied by the fixed member. Can escape,
An electronic component mounting apparatus, wherein at least one of the first mold and the second mold includes a heat radiating member that emits heat to the outside.   The electronic component mounting apparatus according to claim 1, wherein at least one of the first mold frame and the second mold frame includes an internal space and an opening communicating from the internal space to the outside.   The electronic component mounting device according to claim 2, further comprising a vacuum device that emits heat to at least one of the internal space of the first mold and the internal space of the second mold to the outside.   4. The electronic component mounting device according to claim 2, wherein in the second mold, the internal space is provided between the surface of the second mold and the movable member. 5.   The electronic component mounting apparatus according to claim 1, wherein at least one of the first mold and the second mold includes a heat insulating material on at least a part of an outer surface thereof.   The electronic component mounting device according to any one of claims 1 to 5, wherein the second mold further includes a refrigerant circulation path through which the refrigerant circulates.   The electronic component mounting device according to claim 6, wherein the refrigerant is one of a liquid refrigerant, a gel refrigerant, and a gas refrigerant.   The electronic component mounting device according to claim 1, wherein the movable member includes one or more heat radiation holes. 5. The electronic component mounting device according to claim 2 , wherein at least one of the first mold and the second mold further includes an internal fin in the internal space.