WO2016031806A1 - Mounting head and mounting device in which same is used - Google Patents

Mounting head and mounting device in which same is used Download PDF

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Publication number
WO2016031806A1
WO2016031806A1 PCT/JP2015/073821 JP2015073821W WO2016031806A1 WO 2016031806 A1 WO2016031806 A1 WO 2016031806A1 JP 2015073821 W JP2015073821 W JP 2015073821W WO 2016031806 A1 WO2016031806 A1 WO 2016031806A1
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WO
WIPO (PCT)
Prior art keywords
main
attachment
pressure bonding
crimping
bonding
Prior art date
Application number
PCT/JP2015/073821
Other languages
French (fr)
Japanese (ja)
Inventor
昇 朝日
芳範 宮本
進平 青木
将次 仁村
Original Assignee
東レエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to JP2016545540A priority Critical patent/JP6591426B2/en
Priority to KR1020177007367A priority patent/KR20170076652A/en
Publication of WO2016031806A1 publication Critical patent/WO2016031806A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the present invention relates to a mounting head and a mounting apparatus using the same. Specifically, the present invention relates to a mounting head for mounting a chip component or the like on a circuit board and a mounting apparatus using the same.
  • a mounting head heat-pressure head of the main-crimping apparatus that simultaneously heats and presses a plurality of chip parts and connects them to the circuit board It has been known. For example, it is like patent document 2.
  • the mounting head of the present crimping device described in Patent Document 2 has a plurality of attachments (heating and pressing tools) that come into contact with the chip components in order to absorb variations in position in the pressing direction of the plurality of temporarily fixed chip components. Is slidably held in the pressurizing direction by a holder that also serves to transmit heat from the heater block.
  • the mounting head is configured such that the gap between the holder and the attachment is as small as possible so that heat from the heater block is efficiently transmitted to the attachment through the holder.
  • An object of the present invention is to provide a mounting head capable of absorbing the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and suppressing the displacement of the mounting position of the chip component and the wiring board. And to provide a mounting device.
  • the present invention is a mounting head that heats and pressurizes a chip component and connects the chip component to a predetermined position on a circuit board, and includes an attachment that contacts the chip component, a heater block that heats the attachment, an attachment and a heater block, And an elastic member that is disposed between the elastic member and is compressed by the attachment and the heater block at the time of pressurization, and a heat conduction member that is connected to the attachment and the heater block and deforms at the time of pressurization to follow the attachment. It is.
  • the heat conducting member is formed of a spring and holds the attachment.
  • the elastic member is composed of a plate-like member having a thickness of 0.1 mm to 1 mm.
  • a portion of the attachment that is in contact with the chip component is configured to have a thickness of 0.5 mm or more and 5 mm or less.
  • an interior space of the spring is configured in the heater block, and the spring is bent and disposed in the interior space.
  • the present invention is a mounting apparatus that heats a chip component with the mounting head according to the present invention and pressurizes the chip component with a predetermined load to connect the chip component to a circuit board.
  • the spring is elastically deformed while holding the attachment during pressurization. Therefore, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
  • the displacement of the attachment due to the bias in the amount of compression of the elastic member during pressurization is suppressed, and the amount of compression of the elastic member necessary to absorb the variation in the position in the pressure direction is ensured.
  • the amount of compression of the elastic member necessary to absorb the variation in the position in the pressure direction is ensured.
  • the deflection of the attachment is suppressed during pressurization. Therefore, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
  • the mounting apparatus 1 which is one embodiment in the mounting apparatus 1 according to the present invention will be described with reference to FIGS.
  • the direction in which the circuit board C is conveyed from the temporary crimping apparatus 2 to the final crimping apparatus 12 is the X-axis direction, the Y-axis direction orthogonal thereto, and the circuit boards of the temporary crimping head 7 and the final crimping head 17 described later.
  • the direction of movement perpendicular to C is the Z-axis direction
  • the direction of rotation about the Z-axis is the ⁇ direction.
  • compression-bonding apparatus 12 are each comprised as one Embodiment of the mounting apparatus 1, it is not limited to this.
  • a non-conductive film (hereinafter simply referred to as “NCF”) made of a thermosetting resin, which is an adhesive for bonding the circuit board C and the chip component D, is preliminarily soldered to the chip component D.
  • NCF non-conductive film
  • the present invention is not limited to this, and may be attached to the circuit board C side.
  • the mounting apparatus 1 mounts a chip component D on a circuit board C.
  • the mounting device 1 includes a provisional pressure bonding device 2, a main pressure bonding device 12, a conveying device 22 (see FIG. 4), and a control device 23 (see FIG. 4).
  • the temporary press-bonding device 2 aligns and temporarily fixes the chip component D on the circuit board C with NCF which is an adhesive.
  • the temporary pressure bonding apparatus 2 includes a temporary pressure bonding base 3, a temporary pressure bonding stage 4, a temporary pressure bonding support frame 5, a temporary pressure bonding unit 6, a temporary pressure bonding head 7, a temporary pressure bonding heater 8 (see FIG. 2), A crimping attachment 9 (see FIG. 2), a displacement sensor 10 as distance measuring means, and a temporary crimping image recognition device 11 (see FIG. 4) are provided.
  • the temporary press-bonding base 3 is a main structure constituting the temporary press-bonding device 2.
  • the temporary press-bonding base 3 is configured by combining pipe materials and the like so as to have sufficient rigidity.
  • the temporary pressure bonding base 3 supports a temporary pressure bonding stage 4 and a temporary pressure bonding support frame 5.
  • the temporary crimping stage 4 moves the circuit board C to an arbitrary position while holding the circuit board C.
  • the temporary press-bonding stage 4 is configured by attaching a suction table 4b that can hold the circuit board to the drive unit 4a.
  • the temporary press-bonding stage 4 is attached to the temporary press-bonding base 3 and is configured so that the suction table 4b can be moved in the X-axis direction, the Y-axis direction, and the ⁇ -direction by the drive unit 4a.
  • the temporary press-bonding stage 4 is configured to be able to move the circuit board C sucked by the suction table 4b on the temporary press-bonding base 3 in the X-axis direction, the Y-axis direction, and the ⁇ -direction.
  • the temporary press-bonding stage 4 holds the circuit board C by suction, but is not limited thereto.
  • the temporary pressure-bonding support frame 5 supports the temporary pressure-bonding unit 6.
  • the temporary press-bonding support frame 5 is formed in a plate shape and is configured to extend from the vicinity of the temporary press-bonding stage 4 of the temporary press-bonding base 3 toward the Z-axis direction.
  • the temporary pressure bonding unit 6 which is a pressure unit moves the temporary pressure bonding head 7.
  • the temporary crimping unit 6 includes a servo motor and a ball screw (not shown).
  • the temporary pressure bonding unit 6 is attached to the temporary pressure bonding support frame 5 so that the moving direction of the temporary pressure bonding head 7 is in the Z-axis direction perpendicular to the circuit board C.
  • the temporary crimping unit 6 is configured to generate a driving force in the axial direction of the ball screw by rotating the ball screw by a servo motor, and to move the temporary crimping head 7 in the Z-axis direction. That is, the temporary crimping unit 6 is configured to generate a driving force (pressing force) in the Z-axis direction.
  • the temporary crimping unit 6 is configured such that a temporary crimping load Ft, which is a pressing force in the Z-axis direction, can be arbitrarily set.
  • the provisional pressure bonding unit 6 is composed of a servo motor and a ball screw, but is not limited to this, and may be composed of a pneumatic actuator or a hydraulic actuator.
  • the temporary pressure bonding head 7 transmits the driving force of the temporary pressure bonding unit 6 to the chip component D.
  • the temporary crimping head 7 is attached to a ball screw nut (not shown) constituting the temporary crimping unit 6.
  • the temporary crimping unit 6 is disposed so as to face the temporary crimping stage 4. That is, the temporary press-bonding head 7 is configured to be close to the temporary press-bonding stage 4 by being moved in the Z-axis direction by the temporary press-bonding unit 6.
  • the temporary pressure bonding head 7 is provided with a temporary pressure bonding heater 8, a temporary pressure bonding attachment 9, and a displacement sensor 10.
  • the temporary crimping heater 8 is for heating the chip component D.
  • the temporary pressure bonding heater 8 is constituted by a cartridge heater, and is incorporated in a hole or the like formed in the temporary pressure bonding head 7.
  • the provisional pressure bonding heater 8 is composed of a cartridge heater, but is not limited to this, and may be any material that can heat the chip component D, such as a rubber heater.
  • the provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding head 7, but is not limited thereto.
  • the provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding stage 4, and the circuit board C is interposed from the provisional pressure bonding stage 4 side.
  • the NCF may be heated.
  • the temporary crimping attachment 9 holds the chip part D.
  • the temporary crimping attachment 9 is provided on the temporary crimping head 7 so as to face the temporary crimping stage 4.
  • the temporary crimping attachment 9 is configured so that the chip component D can be sucked and held while being positioned.
  • the temporary crimping attachment 9 is configured to be heated by the temporary crimping heater 8. That is, the temporary crimping attachment 9 is configured to position and hold the chip component D and to heat the NCF attached to the chip component D by heat transfer from the temporary crimping heater 8.
  • the displacement sensor 10 measures the distance in the Z-axis direction of the temporary press-bonding head 7 from an arbitrary reference position.
  • the displacement sensor 10 includes a displacement sensor 10 that uses various laser beams.
  • the displacement sensor 10 is configured to measure a distance L (see FIG. 5) from an arbitrary reference position in the Z-axis direction of the pre-bonding head 7 when the pre-bonding is completed.
  • the displacement sensor 10 is configured by using a laser beam, but is not limited to this.
  • the displacement sensor 10 is calculated by using an ultrasonic wave, a linear scale, or a servo motor encoder. You may be comprised from things.
  • the temporary pressure bonding image recognition apparatus 11 acquires position information of the chip component D and the circuit board C from the image.
  • the temporary pressure bonding image recognition device 11 recognizes an image of the alignment mark of the circuit board C held by suction and holding on the temporary pressure bonding stage 4 and the alignment mark of the chip component D held on the temporary pressure bonding attachment 9. Thus, the positional information between the circuit board C and the chip component D is acquired.
  • the present crimping apparatus 12 connects the chip component D to the circuit board C by welding the solder of the chip component D.
  • the main pressure bonding device 12 includes a main pressure bonding base 13, a main pressure bonding stage 14, a main pressure bonding support frame 15, a main pressure bonding unit 16, a main pressure bonding head 17, and a main pressure bonding image recognition device 21 (see FIG. 4). It has.
  • the main press bonding base 13 is a main structure constituting the main press bonding device 12.
  • the main base 13 for pressure bonding is configured by combining pipe materials or the like so as to have sufficient rigidity.
  • the main pressure bonding base 13 supports a main pressure bonding stage 14 and a main pressure bonding support frame 15.
  • the main crimping stage 14 moves the circuit board C to an arbitrary position while holding the circuit board C.
  • the main crimping stage 14 is configured by attaching a suction table 14b capable of sucking and holding a circuit board to a drive unit 14a.
  • the main press-bonding stage 14 is attached to the main press-bonding base 13 and is configured so that the suction table 14b can be moved in the X-axis direction, the Y-axis direction, and the ⁇ -direction by the drive unit 14a.
  • the main press-bonding stage 14 is configured to be able to move the circuit board C sucked by the suction table 14b on the main press-bonding base 13 in the X-axis direction, the Y-axis direction, and the ⁇ -direction.
  • the final press-bonding stage 14 holds the circuit board C by suction, but is not limited thereto.
  • the main pressing support frame 15 supports the main pressing unit 16.
  • the main pressure bonding support frame 15 is formed in a substantially plate shape, and is configured to extend from the vicinity of the main pressure bonding stage 14 of the main pressure bonding base 13 toward the Z-axis direction.
  • the main pressure bonding unit 16 which is a pressure unit moves the main pressure bonding head 17.
  • the main crimping unit 16 includes a servo motor, a ball screw, and a mounting portion 16a (see FIG. 3) (not shown).
  • the main crimping unit 16 is configured to generate a driving force (pressing force) in the axial direction of the ball screw by rotating the ball screw by a servo motor, and to move a ball screw nut (not shown) in the Z-axis direction. Yes.
  • the main crimping unit 16 is provided with a mounting portion 16a on a ball screw nut.
  • the main pressure bonding unit 16 is attached to the main pressure bonding support frame 15 so that the moving direction of the attachment portion 16a is in the Z-axis direction perpendicular to the circuit board C. That is, the main crimping unit 16 is configured such that the driving force (pressing force) in the Z-axis direction is transmitted to the mounting portion 16a.
  • the main crimping unit 16 is configured so that a final crimping load Fp, which is a pressing force in the Z-axis direction, can be arbitrarily set.
  • the main crimping unit 16 is composed of a servo motor and a ball screw, but is not limited thereto, and may be composed of a pneumatic actuator or a hydraulic actuator.
  • the main crimping head 17 which is a mounting head, transmits the driving force (pressing force) of the main crimping unit 16 to the chip component D.
  • the main pressure bonding head 17 is attached to the attachment portion 16 a of the main pressure bonding unit 16. Further, the main pressure bonding head 17 is disposed so as to face the main pressure bonding stage 14. That is, the main press-bonding head 17 is configured to be close to the main press-bonding stage 14 by being moved in the Z-axis direction by the main press-bonding unit 16.
  • the main pressure bonding head 17 is provided with a main pressure bonding heater block 18, a spring 19 that is a heat conducting member, and a plurality of main pressure bonding attachments 20.
  • the main heater block 18 is used to store heat.
  • the main-compression heater block 18 is made of a metal such as iron, which is a heat conducting member.
  • the main pressure bonding heater block 18 is formed in a rectangular parallelepiped shape, and one side surface thereof is attached to the attachment portion 16 a of the main pressure bonding unit 16. Further, the main pressure bonding heater block 18 incorporates a main pressure bonding heater 18a formed of a cartridge heater in the vicinity of the other side surface on the back side of the one side surface. Thereby, the main pressure bonding heater block 18 is configured to be heated to an arbitrary temperature by the main pressure bonding heater 18a.
  • the main crimping heater 18a is composed of a cartridge heater, but is not limited to this, and may be any one that can heat the main crimping attachment 20, such as a rubber heater.
  • the spring 19 made of metal as a heat conducting member holds the main crimping attachment 20 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 20.
  • the spring 19 is composed of a plate spring formed so that the plate material surrounds the main crimping attachment 20.
  • the spring 19 is configured to be elastically deformed in a direction in which the top portion and the bottom portion approach each other.
  • the bottom of the spring 19 is connected to the other side surface of the main pressure bonding heater block 18.
  • a main crimping attachment 20 is held at the top of the spring 19. That is, the spring 19 is configured such that the main crimping attachment 20 held on the top by elastic deformation moves in the moving direction of the main crimping unit 16. Further, the spring 19 is disposed in the vicinity of the main crimping heater 18a.
  • the spring 19 is a leaf spring, but is not limited to this, and a laminated leaf spring or the like may be used.
  • the main attachment 20 for pressure bonding contacts the chip part D and transmits pressure and heat.
  • the main crimping attachment 20 is held by the spring 19 so as to fit into the opening portion at the top of the spring 19.
  • the main crimping attachment 20 is connected to the main crimping heater block 18 via the spring 19.
  • the main crimping attachment 20 is disposed so that the surface that contacts the chip component D faces the final crimping stage 14.
  • the main attachment 20 is configured so that the thickness of the portion with which the chip component D contacts is 0.5 mm or more and 5 mm or less.
  • the main pressure bonding attachment 20 is configured such that the rubber member 20 a is compressed by the main pressure bonding heater block 18 and the main pressure bonding attachment 20 in accordance with mounting errors of the plurality of chip components D.
  • the rubber member 20a is composed of a plate-like member having a thickness of 0.1 mm to 1 mm.
  • the main pressure bonding attachment 20 secures a compression amount of the rubber member 20a necessary for absorbing a mounting error and suppresses a positional shift due to an uneven compression amount of the rubber member 20a.
  • the rubber member 20 a may not be fixed to the main pressure bonding heater block 18 and the main pressure bonding attachment 20.
  • the main press-bonding image recognition device 21 acquires position information between the main press-bonding head 17 and the circuit board C based on images.
  • the main press bonding image recognition device 21 recognizes an image of the alignment mark of the main press bonding head 17 and the alignment mark of the circuit board C sucked and held on the main press bonding stage 14, and the circuit board C and the chip component. It is comprised so that position information with D may be acquired.
  • the acquisition of the positional information between the main pressure bonding head 17 and the circuit board C is performed using the main pressure bonding image recognition device 21, but the present invention is not limited to this and is not essential.
  • the transport device 22 delivers the circuit board C between the temporary crimping device 2 and the final crimping device 12.
  • the transport device 22 is configured to be able to transport the circuit board C on which the plurality of chip components D are temporarily fixed by the temporary crimping stage 4 of the temporary crimping apparatus 2 to the final crimping stage 14 of the final crimping apparatus 12.
  • the control device 23 controls the temporary pressure bonding device 2, the main pressure bonding device 12, the conveying device 22, and the like.
  • the control device 23 may actually be configured such that a CPU, ROM, RAM, HDD, or the like is connected by a bus, or may be configured by a one-chip LSI or the like.
  • the control device 23 stores various programs and data for controlling the temporary pressure bonding device 2, the main pressure bonding device 12, the conveying device 22, and the like.
  • the control device 23 is connected to the temporary crimping stage 4 and the final crimping stage 14 and controls the movement amounts of the temporary crimping stage 4 and the final crimping stage 14 in the X, Y, and ⁇ directions, respectively. can do.
  • the control device 23 is connected to the temporary pressure bonding heater 8 and the main pressure bonding heater 18a, and can control the temperatures of the temporary pressure bonding heater 8 and the main pressure bonding heater 18a, respectively.
  • the control device 23 can maintain the average temperature at the time of pressurization of the main press-bonding head 17 within a certain range including a temperature equal to or higher than the NCF curing temperature and equal to or higher than the melting point of the solder.
  • the control device 23 is connected to the temporary crimping unit 6 and the main crimping unit 16 and can control the applied pressure in the Z-axis direction between the temporary crimping unit 6 and the final crimping unit 16.
  • the control device 23 is connected to the temporary crimping attachment 9 and can control the suction state of the temporary crimping attachment 9.
  • the control device 23 is connected to the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 21, and controls the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 21, respectively.
  • the positional information on the circuit board C, the main pressure bonding head 17 and the circuit board C can be acquired.
  • the control device 23 is connected to the transport device 22 and can control the transport device 22.
  • the control device 23 is connected to the displacement sensor 10 and can acquire the distance in the Z-axis direction at the time of completion of provisional pressure bonding from the displacement sensor 10. In particular, the control device 23 can determine whether or not the variation in the Z-axis direction of the chip component D at the time of temporary fixing is out of a predetermined range.
  • the mounting apparatus 1 adsorbs the circuit board C to the temporary pressure bonding stage 4 of the temporary pressure bonding apparatus 2 as a temporary pressure bonding process for temporarily fixing the chip component D to the circuit board C.
  • the chip component D is temporarily fixed at a predetermined position on the circuit board C by being pressed against the circuit board C with a temporary pressure bonding load Ft while being heated to the temporary pressure bonding temperature Tt (see FIG. 6) by the temporary pressure bonding unit 6.
  • the mounting apparatus 1 conveys the circuit board C from the temporary crimping stage 4 of the temporary crimping apparatus 2 to the final crimping stage 14 of the final crimping apparatus 12 by the transport device 22. Then, as shown in FIG.
  • the mounting apparatus 1 sucks and holds the circuit board C on the final crimping stage 14 of the final crimping apparatus 12 as a final crimping process for connecting the chip component D to the circuit board C.
  • the plurality of chip components D are simultaneously connected to the circuit board C by being pressurized to the final press bonding temperature Tp (see FIG. 6) by the main press bonding unit 16 and being subjected to the main press load Fp.
  • the mounting apparatus 1 temporarily fixes the chip components D at predetermined positions on the circuit board C continuously with the temporary crimping apparatus 2, and then simultaneously circuits a plurality of chip components D with the final crimping apparatus 12. It can be connected to the substrate C. For this reason, as shown in FIG. 6, the mounting apparatus 1 only needs to maintain the temperature of the main press-bonding head 17 during the main press-bonding of the main press-bonding apparatus 12 at the main press-bonding temperature Tp. Therefore, the mounting apparatus 1 does not need to cool the main press-bonding head 17 for each mounting cycle, and temperature management is facilitated, the throughput is improved, and the occurrence of defective bonding in the main press-bonding can be suppressed.
  • the control device 23 of the mounting apparatus 1 causes the main pressure bonding heater 18a of the main pressure bonding head 17 to generate heat.
  • the main pressure bonding heater block 18 is heated by the heat generated by the main pressure bonding heater 18a.
  • the main pressure bonding heater block 18 is heated to a predetermined temperature determined from the heat generation amount of the main pressure bonding heater block 18a, the heat radiation amount from the surface of the main pressure bonding heater block 18, the volume of the main pressure bonding heater block 18 and the specific heat capacity. .
  • the heat accumulated in the main press-bonding heater block 18 that has been heated to a predetermined temperature is transmitted to the main press-fit attachment 20 through the spring 19 (see FIG. 7 (a) thin ink arrow).
  • the main crimping attachment 20 is heated to a predetermined temperature determined from the amount of heat supplied through the spring 19, the amount of heat released from the surface of the main crimping attachment 20, the volume of the main crimping attachment 20, and the specific heat capacity.
  • the control device 23 controls the main pressure bonding heater 18a so that the temperature of the main pressure bonding attachment 20 becomes the main pressure bonding temperature Tp (see FIG. 6).
  • the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 17 in a direction close to the main pressure bonding stage 14.
  • the rubber member 20a is compressed by the pressure applied by the main crimping unit 16 to move in the Z-axis direction with reference to the main crimping heater block 18 (FIG. 5). (See (b)).
  • the main crimp attachment 20 is integrally held by the spring 19 so as to fit into the opening of the top of the spring 19. For this reason, the main-bonding attachment 20 moves in the Z-axis direction without moving relative to the spring 19 which is a heat conducting member. That is, the spring 19 is elastically deformed so as to follow the movement of the main crimping attachment 20 while being connected to the main crimping heater block 18. As a result, heat is supplied to the main crimping attachment 20 from the main crimping heater block 18 via the spring 19 even if the main crimping attachment 20 moves in the Z-axis direction due to the compression of the rubber member 20a. ing.
  • the mounting apparatus 1 causes the final crimping unit 16 to abut on the temporarily fixed chip component D in the final crimping step.
  • the chip component D is heated to a predetermined main press bonding temperature Tp by the main press bonding heater 18a via the main press attachment 20.
  • the NCF and the solder Da attached to the chip component D are heated to the main press bonding temperature Tp substantially the same as that of the chip component D because the heat of the heated chip component D is transmitted.
  • the mounting apparatus 1 pressurizes the chip component D heated to the main press bonding temperature Tp by the main press bonding unit 16 in the Z-axis direction with the main press bonding load Fp.
  • the chip component D is pressed toward the circuit board C by the main crimping unit 16 so as to be close to each other so as to eliminate the gap between the solder and the pad of the circuit board C.
  • the mounting apparatus 1 brings the pad Ca of the circuit board C and the solder Da of the chip component D into contact with each other until the NCF of the chip component D is completely cured in the main crimping process. That is, the mounting apparatus 1 suppresses the bonding failure between the circuit board C and the chip component D due to the hardening of the NCF.
  • Each chip component D has a different distance from the surface on which the main crimping attachment 20 contacts to the circuit board C due to a mounting error. Accordingly, in the main pressure bonding head 17, the rubber member 20 a disposed between the main pressure bonding attachment 20 and the main pressure bonding heater block 18 is compressed to have different thicknesses depending on the distance in the main pressure bonding attachment 20. ing. For this reason, among the plurality of chip components D that are simultaneously pressed by the main crimping head 17, the chip component D in which the gap between the pad Ca of the circuit board C and the solder Da is larger than that of the other chip components D is: Pressurization is performed with a load Fp2 larger than the load Fp1 applied to the other chip component D. However, as shown in FIG. 8 (b), since one chip component D receives the load Fp2 dispersed by the solder Da and the NCF that has started to cure when the NCF is cured, the solder Da is applied by pressurization. It won't be crushed too much.
  • the spring 19 is elastically deformed while the main pressure bonding attachment 20 is held at the time of pressurization. Movement does not occur. Further, by limiting the thickness of the rubber member 20a, the positional displacement of the main pressure bonding attachment 20 due to the bias of the compression amount of the rubber member 20a during pressing is suppressed, and the rubber member 20a necessary for absorbing mounting errors. The amount of compression is ensured. Further, by limiting the thickness of the main crimping attachment 20, the deflection of the main crimping attachment 20 during pressurization is suppressed. Thereby, the variation in the position of the chip component D in the pressing direction can be absorbed by the rubber member 20a while heating the main pressure bonding attachment 20.
  • the main crimping head 24 which is a mounting head, transmits the driving force (pressing force) of the main crimping unit 16 (see FIG. 1) to the chip component D.
  • the main pressure bonding head 24 is provided with a main pressure bonding heater block 18, an aluminum sheet 25 which is a heat conducting member, and a plurality of main pressure bonding attachments 26.
  • the aluminum sheet 25 made of an aluminum alloy serving as a heat conducting member wraps and holds the main crimping attachment 26 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 26.
  • the aluminum sheet 25 is a sheet of aluminum alloy having a predetermined thickness.
  • the aluminum sheet 25 is configured to be deformable into an arbitrary shape.
  • the aluminum sheet 25 is connected to the other side surface of the main pressure bonding heater block 18 by a fixture 25 a so as to wrap the main pressure bonding attachment 26 provided in the main pressure bonding heater block 18. That is, the aluminum sheet 25 is connected to the main pressure bonding heater block 18 and the main pressure bonding attachment 26.
  • the aluminum sheet 25 is disposed so as to wrap the main crimping attachment 26, the aluminum sheet 25 can be deformed so as to follow the movement of the main crimping attachment 26.
  • the aluminum sheet 25 is disposed in the vicinity of the main pressure bonding heater 18 a of the main pressure bonding heater block 18.
  • the aluminum sheet 25 is made of an aluminum alloy, but is not limited thereto, and may be a copper foil or the like.
  • the main attachment 26 is for contacting the chip part D and transmitting pressure and heat.
  • the main attachment 26 is connected to a heat-resistant rubber member 26a, which is an elastic member.
  • the main crimping attachment 26 is connected to the main crimping heater block 18 via a rubber member 26a.
  • the main crimping attachment 26 is configured such that the rubber member 26 a is compressed by the main crimping heater block 18 and the main crimping attachment 26 in accordance with mounting errors of the plurality of chip components D. Thereby, the main attachment 26 can absorb the mounting error of the temporarily pressed chip part D.
  • the main crimping attachment 26 is covered so as to be wrapped by an aluminum sheet 25 that can be deformed into an arbitrary shape.
  • the controller 23 of the mounting apparatus 1 causes the main crimping heater 18a of the main crimping head 24 to generate heat.
  • the heat accumulated in the main press-bonding heater block 18 that has been heated to a predetermined temperature is transmitted to the main press-fit attachment 26 through the aluminum sheet 25 (see thin ink arrows).
  • the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 24 in a direction close to the main pressure bonding stage 14.
  • the rubber member 26a is compressed by the pressure applied by the main crimping unit 16, and moves in the Z-axis direction with reference to the main crimping heater block 18 (FIG. 9). (See (a)).
  • the main crimp attachment 26 is integrally held by the aluminum sheet 25 so as to be wrapped in the aluminum sheet 25. For this reason, the main-bonding attachment 26 moves in the Z-axis direction without moving relative to the aluminum sheet 25 that is a heat conducting member. That is, the aluminum sheet 25 is deformed so as to follow the movement of the main crimping attachment 26 while being connected to the main crimping heater 18. As a result, heat is supplied to the main crimping attachment 26 from the main crimping heater block 18 via the aluminum sheet 25 even if the main crimping attachment 26 moves in the Z-axis direction due to the compression of the rubber member 26a. Has been.
  • the main pressure bonding head 27 which is a mounting head, transmits the driving force (pressing force) of the main pressure bonding unit 16 (see FIG. 1) to the chip component D.
  • the main pressure bonding head 27 is provided with a main pressure bonding heater block 18, a frame body 28 which is a heat conducting member, and a plurality of main pressure bonding attachments 29.
  • the frame 28 made of a metal that is a heat conducting member holds the main crimping attachment 29 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 29.
  • the frame body 28 is formed with a through hole 28a having a stepped portion in a rectangular block.
  • the frame body 28 is screwed or the like so that the side surface on which the larger opening portion is formed out of the side surfaces on which the opening portion of the through hole 28a is formed contacts the other side surface of the main crimping heater block 18. It is concluded.
  • the frame body 28 is disposed so that the smaller opening of the through hole 28 a faces the main crimping stage 14.
  • the frame body 28 is disposed in the vicinity of the main pressure bonding heater 18 a of the main pressure bonding heater block 18.
  • the frame body 28 has a rectangular shape, but the present invention is not limited to this and may be a cylindrical shape.
  • the main attachment 29 is for contacting the chip part D and transmitting pressure and heat.
  • the main press-bonding attachment 29 is disposed inside the frame body 28 (inside the through hole 28a) surrounded by the other side surface of the main press-bonding heater block 18 and the frame body 28.
  • a heat-resistant rubber member 29a which is an elastic member, is disposed between the main-compression heater block 18 and the main-compression attachment 29.
  • the main crimping attachment 29 is configured such that the rubber member 29 a is compressed by the main crimping heater block 18 and the main crimping attachment 29 in accordance with mounting errors of the plurality of chip components D. As a result, the main-bonding attachment 29 can absorb the mounting error of the temporarily pressed chip component D.
  • the main crimping attachment 29 is slidably inserted into the smaller opening of the through holes 28 a of the frame 28. Further, the main attachment 29 is provided with a protruding portion 29b protruding from the side surface in the X direction or the Y direction, and the protruding portion 29b is in contact with the stepped portion of the through hole 28a of the frame body 28. That is, the main crimping attachment 29 is held by the frame body 28 when the protruding portion 29 b contacts the stepped portion of the through hole 28 a of the frame body 28. Further, the main crimp attachment 29 is configured to be movable in the Z-axis direction while being in contact with the frame body 28 by being slidably inserted into the through hole 28a.
  • the control device 23 of the mounting apparatus 1 causes the main crimping heater 18a of the main crimping head 27 to generate heat.
  • the heat accumulated in the main crimping heater block 18 heated to a predetermined temperature is transmitted through the frame 28 to the main crimping attachment 29 inserted in the through hole 28a of the frame 28 (see thin ink arrow). .
  • the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 27 in a direction close to the main pressure bonding stage 14.
  • the rubber member 29a is compressed by the pressure of the main crimping unit 16 to move in the Z-axis direction with respect to the main crimping heater block 18 (FIG. 10). (See (a)).
  • the main crimp attachment 29 is held in contact with the smaller opening of the frame 28. For this reason, the main-bonding attachment 29 moves in the Z-axis direction in a state where heat can be transferred to and from the frame body 28 which is a heat conducting member. As a result, heat is supplied to the main crimping attachment 29 from the main crimping heater block 18 via the frame 28 even if the main crimping attachment 29 moves in the Z-axis direction due to the compression of the rubber member 19a. Has been.
  • the main pressure bonding head 30 which is a mounting head transmits the driving force (pressing force) of the main pressure bonding unit 16 (see FIG. 1) to the chip component D.
  • the main pressure bonding head 30 is provided with a main pressure bonding heater block 31, a spring 32 made of metal which is a heat conducting member, and a plurality of main pressure bonding attachments 33.
  • the main pressure bonding heater block 31 is formed in a rectangular parallelepiped shape, and one side surface thereof is attached to the attachment portion 16a of the main pressure bonding unit 16 (see FIG. 3). Further, the main pressure bonding heater block 31 incorporates a main pressure bonding heater 31a formed of a cartridge heater in the vicinity of the other side surface on the back side of the one side surface. An interior space 31 b of the spring 32 is formed on the other side surface of the main pressure bonding heater block 31. The interior space 31b is configured by a recess or a hole formed on the other side surface of the main pressure bonding heater block 31. The interior space 31b is formed in such a size that the spring 32 can be arranged.
  • an engagement portion 31c that supports the spring 32 is formed in the opening portion of the interior space 31b on the side facing the main crimping stage 14.
  • the engaging part 31c is composed of a convex part protruding inward from the opening part of the interior space 31b.
  • the engaging portion 31c is formed in a size capable of supporting the spring 32.
  • the interior space 31b and the engaging portion 31c are formed by processing the main crimping heater block 31, but the present invention is not limited to this, and a plurality of main crimping heater blocks 31 are provided.
  • the interior space 31b may be configured by being arranged at a predetermined interval.
  • you may comprise the engaging part 31c from the plate-shaped member attached to the heater block 31 for this press-fit.
  • the spring 32 made of metal which is a heat conducting member holds the main pressure bonding attachment 33 and transmits heat accumulated in the main pressure bonding heater block 31 to the main pressure bonding attachment 33.
  • the spring 32 is composed of a compression spring.
  • the spring 32 is disposed in the interior space 31 b of the main pressure bonding heater block 31. At this time, one end of the spring 32 is supported by the engaging portion 31 c of the main crimping heater block 31. That is, the spring 32 is connected to the main crimping heater block 31.
  • the main attachment 33 is for contacting the chip part D and transmitting pressure and heat.
  • the main bonding attachment 33 includes a processing part 33a that pressurizes and heats the chip part D and a heat transfer part 33b that transfers heat from the spring 32 to the processing part 33a.
  • the processing part 33a is formed in a shape corresponding to the shape of the chip part D.
  • the heat transfer part 33b is formed from a rod-shaped member.
  • the main-bonding attachment 33 is configured by connecting a processing portion 33a to one end portion of the heat transfer portion 33b. Further, the main pressure bonding attachment 33 is configured such that the other end portion of the heat transfer portion 33b is enlarged in diameter so that the spring 32 can be engaged therewith.
  • the main pressure bonding attachment 33 has a heat transfer portion 33b slidably inserted into the interior space 31b of the main pressure bonding heater block 31. Further, the other end of the heat transfer part 33 b is engaged with the other end of the spring 32. That is, the main pressure bonding attachment 33 is connected to the spring 32. Thereby, the main press-bonding attachment 33 is supported by the spring 32 provided in the main press-bonding heater block 31.
  • a heat resistant rubber member 33c which is an elastic member, is disposed between the main pressure bonding heater block 31 and the main pressure bonding attachment 33.
  • the rubber member 33c is formed with a hole into which the heat transfer portion 33b of the main pressure bonding attachment 33 is inserted at a substantially center. That is, the rubber member 33c is disposed so as to surround the heat transfer portion 33b.
  • the main-bonding attachment 33 secures a compression amount of the rubber member 33c necessary to absorb mounting errors and suppresses a positional shift due to an uneven compression amount of the rubber member 33c.
  • the rubber member 33 c may not be fixed to the main pressure bonding heater block 31 and the main pressure bonding attachment 33.
  • the rubber member 33c may be divided
  • the heat transfer portion 33b of the main pressure bonding attachment 33 is a length by which the spring 32 disposed between the engaging portion 31c of the main pressure bonding heater block 31 and the other end of the heat transfer portion 33b bends by a predetermined amount. It is configured. That is, the main pressure bonding attachment 33 is supported by the main pressure bonding heater block 31 in a state where the rubber member 33 c is compressed by the deflection of the spring 32.
  • the main-bonding attachment 33 is configured to be movable in the Z-axis direction while being in contact with the spring 32 by being slidably inserted into the interior space 31b.
  • the spring 32 is constituted by a compression spring.
  • the present invention is not limited to this, and a configuration in which a tension spring is disposed so as to attract the main pressure bonding attachment 33 to the main pressure bonding heater block 31 may be employed.
  • one heat transfer part 33b and the spring 32 are provided in one main pressure bonding attachment 33, but the present invention is not limited to this.
  • the heat transfer part 33b and the spring 32 may be provided.
  • the control device 23 of the mounting apparatus 1 causes the main crimping heater 30a of the main crimping head 30 to generate heat.
  • the heat accumulated in the main pressure bonding heater block 31 that has been heated to a predetermined temperature is transmitted to the heat transfer portion 33b of the main pressure bonding attachment 33 supported by the spring 32 (see thin ink arrow).
  • the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 30 in a direction close to the main pressure bonding stage 14 (see FIG. 1).
  • the rubber member 33c is compressed by the pressing force of the main pressing unit 16 to move in the Z-axis direction with reference to the main pressing heater block 31 (FIG. 11). (See (a)).
  • the main attachment 33 is held in a state where the heat transfer portion 33 b is in contact with the spring 32. For this reason, the main-bonding attachment 33 moves in the Z-axis direction in a state in which heat conduction is possible between the heat transfer section 33 b and the spring 32. As a result, heat is supplied to the main crimping attachment 33 from the main crimping heater block 31 via the spring 32 even if the main crimping attachment 33 moves in the Z-axis direction due to the compression of the rubber member 33c. ing.
  • the main pressure bonding attachment 33 is supported in a state in which the spring 32 is bent. Therefore, even when the rubber member 33c is compressed during pressurization, the main pressure bonding attachment is provided. There is no relative movement between 33 and the spring 32.
  • the main press-bonding head 30 has the spring 32 built in the main-compression-bonding heater block 31, it is not necessary to arrange a spring or the like around the main-bonding attachment 33. Thereby, the some attachment 33 for main press-bonding can be arrange
  • the present invention relates to a mounting head and a mounting apparatus using the same. Specifically, it can be used for a mounting head for mounting a chip component or the like on a circuit board and a mounting apparatus using the mounting head.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The purpose of the present invention is to provide: a final-compression head, which is a mounting head with which it is possible to reliably absorb variation in the position of a chip component in the pressurization direction and to minimize the deviation in the mounting position between the chip component and a wired substrate while a final-compression attachment is continuously heated; and a mounting device. A final-compression head (17), which is a mounting head for heating and applying pressure to a chip component (D) and connecting the chip component (D) to a predetermined position on a circuit board (C), wherein the final-compression head (17) is provided with: a final-compression attachment (20) that comes into contact with the chip component (D); a final-compression heater block (18) for heating the final-compression attachment (20); a rubber member (20a) that is disposed between the final-compression attachment (20) and the final-compression heater block (18), and is compressed by the final-compression attachment (20) and the final-compression heater block (18) during pressurization; and a spring (19) connected to the final-compression attachment (20) and the final-compression heater block (18), the spring (19) undergoing deformation during pressurization and following the final-compression attachment (20).

Description

実装用ヘッドおよびそれを用いた実装装置Mounting head and mounting apparatus using the same
　本発明は、実装用ヘッドおよびそれを用いた実装装置に関する。詳しくは、チップ部品等を回路基板に実装する実装用ヘッドおよびそれを用いた実装装置に関する。 The present invention relates to a mounting head and a mounting apparatus using the same. Specifically, the present invention relates to a mounting head for mounting a chip component or the like on a circuit board and a mounting apparatus using the same.
　従来、銅配線等の導電体からなる回路を有する基板のパターンの高精度化、微細化に対応するため、半導体素子からなるチップ部品を回路基板に形成されたパッドに接着剤によって仮固定する仮圧着工程と、パッドに仮固定されたチップ部品のバンプとパッドとを接合させる本圧着工程とから構成される実装装置が知られている。例えば特許文献１の如くである。 Conventionally, in order to cope with higher precision and miniaturization of a pattern of a substrate having a circuit made of a conductor such as copper wiring, a temporary provision is made to temporarily fix a chip component made of a semiconductor element to a pad formed on the circuit board with an adhesive. 2. Description of the Related Art There is known a mounting apparatus including a crimping process and a main crimping process for joining a bump and a pad of a chip component temporarily fixed to a pad. For example, it is like patent document 1.
　このような実装装置において、隣接するチップ部品に対する熱の影響を回避するために、複数のチップ部品を同時に加熱および加圧して回路基板に接続する本圧着装置の実装用ヘッド（加熱加圧ヘッド）が知られている。例えば特許文献２の如くである。 In such a mounting apparatus, in order to avoid the influence of heat on adjacent chip parts, a mounting head (heat-pressure head) of the main-crimping apparatus that simultaneously heats and presses a plurality of chip parts and connects them to the circuit board It has been known. For example, it is like patent document 2.
　特許文献１に記載の実装装置は、仮圧着装置において複数のチップ部品をアライメントして配線基板に仮固定した後、本圧着装置において仮固定された複数のチップ部品を同時に加熱および加圧して接続する。特許文献２に記載の本圧着装置の実装用ヘッドは、仮固定された複数のチップ部品の加圧方向の位置のばらつきを吸収するためにチップ部品と接触する複数のアタッチメント（加熱加圧ツール）がヒーターブロックからの熱を伝える役割をかねたホルダによって加圧方向に摺動自在に保持されている。実装用ヘッドは、ヒーターブロックからの熱がホルダを介してアタッチメントに効率よく伝わるように、ホルダとアタッチメントとの隙間ができるだけ小さくなるように構成されている。 In the mounting device described in Patent Document 1, after a plurality of chip components are aligned and temporarily fixed to a wiring board in a temporary pressure bonding device, the plurality of chip components temporarily fixed in the pressure bonding device are simultaneously heated and pressurized to be connected. To do. The mounting head of the present crimping device described in Patent Document 2 has a plurality of attachments (heating and pressing tools) that come into contact with the chip components in order to absorb variations in position in the pressing direction of the plurality of temporarily fixed chip components. Is slidably held in the pressurizing direction by a holder that also serves to transmit heat from the heater block. The mounting head is configured such that the gap between the holder and the attachment is as small as possible so that heat from the heater block is efficiently transmitted to the attachment through the holder.
特開２０１０－２３２２３４号公報JP 2010-232234 A 特開２０１０－３４４２３号公報JP 2010-34423 A
　しかし、特許文献２に記載の実装用ヘッドは、仮固定されたチップ部品の状態によって、加圧時にアタッチメントをホルダに押し付ける力が作用する。この結果、実装用ヘッドは、アタッチメントがホルダ内で干渉して摺動不能になり、チップ部品の加圧方向の位置のばらつきを吸収できなくなる可能性があった。さらには、アタッチメントが傾くことにより、チップ部品の実装位置にズレが生じることがあった。
　本発明の目的は、アタッチメントを継続的に加熱しつつ、チップ部品の加圧方向の位置のばらつきを吸収することができ、チップ部品と配線基板の実装位置ズレを抑制することができる実装用ヘッドおよび実装装置の提供を目的とする。 However, the mounting head described in Patent Document 2 is subjected to a force that presses the attachment against the holder during pressurization depending on the state of the temporarily fixed chip component. As a result, the mounting head could not slide due to the interference of the attachment in the holder, and there was a possibility that the variation in the position of the chip component in the pressing direction could not be absorbed. Further, the mounting position of the chip component may be shifted due to the tilt of the attachment.
An object of the present invention is to provide a mounting head capable of absorbing the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and suppressing the displacement of the mounting position of the chip component and the wiring board. And to provide a mounting device.
　本発明の解決しようとする課題は以上の如くであり、次にこれらの課題を解決するための手段を説明する。 The problems to be solved by the present invention are as described above. Next, means for solving these problems will be described.
　即ち、本発明は、チップ部品を加熱および加圧して回路基板の所定位置に接続する実装用ヘッドであって、チップ部品と接触するアタッチメントと、アタッチメントを加熱するヒーターブロックと、アタッチメントとヒーターブロックとの間に配置され、加圧時にアタッチメントとヒーターブロックとによって圧縮される弾性部材と、アタッチメントとヒーターブロックとに接続され、加圧時に変形してアタッチメントに追従する熱伝導部材と、を具備するものである。 That is, the present invention is a mounting head that heats and pressurizes a chip component and connects the chip component to a predetermined position on a circuit board, and includes an attachment that contacts the chip component, a heater block that heats the attachment, an attachment and a heater block, And an elastic member that is disposed between the elastic member and is compressed by the attachment and the heater block at the time of pressurization, and a heat conduction member that is connected to the attachment and the heater block and deforms at the time of pressurization to follow the attachment. It is.
　本発明は、前記熱伝導部材がばねから構成され、前記アタッチメントを保持するものである。 In the present invention, the heat conducting member is formed of a spring and holds the attachment.
　本発明は、前記弾性部材が０．１ｍｍ以上１ｍｍ以下の厚さの板状部材から構成されるものである。 In the present invention, the elastic member is composed of a plate-like member having a thickness of 0.1 mm to 1 mm.
　本発明は、前記アタッチメントのうち前記チップ部品が接触している部分が０．５ｍｍ以上５ｍｍ以下の厚さに構成されるものである。 In the present invention, a portion of the attachment that is in contact with the chip component is configured to have a thickness of 0.5 mm or more and 5 mm or less.
　本発明は、前記ヒーターブロックに前記ばねの内装空間が構成され、ばねがたわんだ状態で内装空間に配置されるものである。 In the present invention, an interior space of the spring is configured in the heater block, and the spring is bent and disposed in the interior space.
　本発明は、本発明に係る実装用ヘッドによってチップ部品を加熱するとともに所定の荷重で加圧してチップ部品を回路基板に接続する実装装置である。 The present invention is a mounting apparatus that heats a chip component with the mounting head according to the present invention and pressurizes the chip component with a predetermined load to connect the chip component to a circuit board.
　本発明の効果として、以下に示すような効果を奏する。 As the effects of the present invention, the following effects are obtained.
　本発明においては、加圧時にアタッチメントと熱伝導部材との間に相対的な移動が生じない。これにより、アタッチメントを継続的に加熱しつつ、チップ部品の加圧方向の位置のばらつきを吸収することができ、チップ部品と配線基板の実装位置ズレを抑制することができる。 In the present invention, there is no relative movement between the attachment and the heat conducting member during pressurization. Thereby, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
　本発明においては、加圧時にアタッチメントを保持した状態でばねが弾性変形する。これにより、アタッチメントを継続的に加熱しつつ、チップ部品の加圧方向の位置のばらつきを吸収することができ、チップ部品と配線基板の実装位置ズレを抑制することができる。 In the present invention, the spring is elastically deformed while holding the attachment during pressurization. Thereby, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
　本発明においては、加圧時に弾性部材の圧縮量の偏りによるアタッチメントの位置ズレを抑制するとともに、加圧方向の位置のばらつきを吸収するために必要な弾性部材の圧縮量が確保される。これにより、アタッチメントを継続的に加熱しつつ、チップ部品の加圧方向の位置のばらつきを吸収することができ、チップ部品と配線基板の実装位置ズレを抑制することができる。 In the present invention, the displacement of the attachment due to the bias in the amount of compression of the elastic member during pressurization is suppressed, and the amount of compression of the elastic member necessary to absorb the variation in the position in the pressure direction is ensured. Thereby, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
　本発明においては、加圧時にアタッチメントのたわみが抑制される。これにより、アタッチメントを継続的に加熱しつつ、チップ部品の加圧方向の位置のばらつきを吸収することができ、チップ部品と配線基板の実装位置ズレを抑制することができる。 In the present invention, the deflection of the attachment is suppressed during pressurization. Thereby, it is possible to absorb the variation in the position of the chip component in the pressing direction while continuously heating the attachment, and to suppress the mounting position deviation between the chip component and the wiring board.
本発明の第一実施形態に係る実装装置の全体構成を示す概略図。Schematic which shows the whole structure of the mounting apparatus which concerns on 1st embodiment of this invention. 本発明の第一実施形態に係る実装装置の仮圧着用ヘッドの構成を示す概略側面図。The schematic side view which shows the structure of the head for temporary crimping | compression-bonding of the mounting apparatus which concerns on 1st embodiment of this invention. （ａ）本発明の第一実施形態に係る本圧着用ヘッドの構成を示す概略斜視図（ｂ）本発明の第一実施形態に係る本圧着用ヘッドの構成を示す側面の部分断面図。(A) The schematic perspective view which shows the structure of the head for final pressure bonding which concerns on 1st embodiment of this invention. (B) The partial sectional view of the side which shows the structure of the head for pressure bonding which concerns on 1st embodiment of this invention. 本発明の第一実施形態に係る実装装置の制御構成を表すブロック図。The block diagram showing the control structure of the mounting apparatus which concerns on 1st embodiment of this invention. （ａ）本発明の第一実施形態に係る実装装置の仮圧着工程におけるチップ部品の仮固定の態様を示す仮圧着用ヘッドの側面図（ｂ）同じく本圧着工程におけるチップ部品の接続の態様を示す本圧着用ヘッドの側面の部分断面図。(A) Side view of the head for temporary crimping showing a mode of temporarily fixing the chip component in the temporary crimping process of the mounting apparatus according to the first embodiment of the present invention. (B) Similarly, a mode of connecting the chip component in the final crimping process. The fragmentary sectional view of the side surface of the head for this press-fit shown. 本発明の第一実施形態に係る本圧着用ヘッドの加圧時の温度状態を表すグラフを示す図。The figure which shows the graph showing the temperature state at the time of pressurization of the head for main press-bonding which concerns on 1st embodiment of this invention. （ａ）本発明の第一実施形態に係る本圧着用ヘッドの熱の伝導を表す側面の部分断面図（ｂ）同じくアタッチメントが移動した場合の態様を表す側面の部分断面図。(A) Partial sectional view of the side surface representing the heat conduction of the main pressure bonding head according to the first embodiment of the present invention (b) Similarly, a partial sectional view of the side surface representing an aspect when the attachment is moved. （ａ）本発明の第一実施形態に係る実装装置の本圧着工程においてチップ部品が回路基板に加圧される態様を示す側面の部分断面図（ｂ）同じく本圧着工程においてチップ部品への荷重が硬化したＮＣＦによって分散される態様を示す側面の部分断面図。(A) Partial sectional view of a side surface showing a state in which the chip component is pressed against the circuit board in the final crimping step of the mounting apparatus according to the first embodiment of the present invention. (B) Similarly, the load on the chip component in the final crimping step. The fragmentary sectional view of the side which shows the aspect disperse | distributed by NCF which hardened. （ａ）本発明の第二実施形態に係る実装装置の本圧着工程におけるチップ部品の接続の態様を示す側面の部分断面図（ｂ）本発明の第二実施形態に係る本圧着用ヘッドの熱の伝導を表す側面の部分断面図。(A) Partial sectional view of a side surface showing a chip component connection mode in the final crimping step of the mounting apparatus according to the second embodiment of the present invention (b) Heat of the final crimping head according to the second embodiment of the present invention The fragmentary sectional view of the side surface showing conduction of. （ａ）本発明の第三実施形態に係る実装装置の本圧着工程におけるチップ部品の接続の態様を示す側面の部分断面図（ｂ）本発明の第三実施形態に係る本圧着用ヘッドの熱の伝導を表す側面の部分断面図。(A) Partial cross-sectional view of a side surface showing how chip components are connected in the final crimping step of the mounting apparatus according to the third embodiment of the present invention (b) Heat of the final crimping head according to the third embodiment of the present invention The fragmentary sectional view of the side surface showing conduction of. （ａ）本発明の第四実施形態に係る実装装置の本圧着工程におけるチップ部品の接続の態様を示す側面の側面図（ｂ）本発明の第四実施形態に係る本圧着用ヘッドの熱の伝導を表す側面の側面図。(A) Side view of the side surface showing the connection state of chip components in the final crimping step of the mounting apparatus according to the fourth embodiment of the present invention (b) The heat of the final crimping head according to the fourth embodiment of the present invention The side view of the side showing conduction.
　まず、図１から図４を用いて、本発明に係る実装装置１における一実施形態である実装装置１について説明する。以下の説明では仮圧着装置２から本圧着装置１２へ回路基板Ｃを搬送する方向をＸ軸方向、これに直交するＹ軸方向、後述の仮圧着用ヘッド７および本圧着用ヘッド１７の回路基板Ｃに垂直な移動方向をＺ軸方向、Ｚ軸を中心として回転する方向をθ方向として説明する。なお、本実施形態においては、実装装置１の一実施形態として仮圧着装置２と本圧着装置１２とがそれぞれ構成されているが、これに限定されるものではない。また、本実施形態において、回路基板Ｃとチップ部品Ｄとを接着する接着剤である熱硬化性樹脂からなる非導電性フィルム（以下、単に「ＮＣＦ」と記す）は、予めチップ部品Ｄのはんだを覆うように貼り付けられているものとするがこれに限定されるものではなく、回路基板Ｃ側に貼り付けられていてもよい。 First, the mounting apparatus 1 which is one embodiment in the mounting apparatus 1 according to the present invention will be described with reference to FIGS. In the following description, the direction in which the circuit board C is conveyed from the temporary crimping apparatus 2 to the final crimping apparatus 12 is the X-axis direction, the Y-axis direction orthogonal thereto, and the circuit boards of the temporary crimping head 7 and the final crimping head 17 described later. In the following description, the direction of movement perpendicular to C is the Z-axis direction, and the direction of rotation about the Z-axis is the θ direction. In addition, in this embodiment, although the temporary crimping | compression-bonding apparatus 2 and this crimping | compression-bonding apparatus 12 are each comprised as one Embodiment of the mounting apparatus 1, it is not limited to this. In this embodiment, a non-conductive film (hereinafter simply referred to as “NCF”) made of a thermosetting resin, which is an adhesive for bonding the circuit board C and the chip component D, is preliminarily soldered to the chip component D. However, the present invention is not limited to this, and may be attached to the circuit board C side.
　図１に示すように、実装装置１は、回路基板Ｃにチップ部品Ｄを実装するものである。実装装置１は、仮圧着装置２、本圧着装置１２、搬送装置２２（図４参照）および制御装置２３（図４参照）を具備している。 As shown in FIG. 1, the mounting apparatus 1 mounts a chip component D on a circuit board C. The mounting device 1 includes a provisional pressure bonding device 2, a main pressure bonding device 12, a conveying device 22 (see FIG. 4), and a control device 23 (see FIG. 4).
　仮圧着装置２は、接着剤であるＮＣＦによって回路基板Ｃにチップ部品Ｄをアライメントして仮固定するものである。仮圧着装置２は、仮圧着用基台３、仮圧着用ステージ４、仮圧着用支持フレーム５、仮圧着用ユニット６、仮圧着用ヘッド７、仮圧着用ヒーター８（図２参照）、仮圧着用アタッチメント９（図２参照）および距離測定手段である変位センサ１０、仮圧着用画像認識装置１１（図４参照）を具備している。 The temporary press-bonding device 2 aligns and temporarily fixes the chip component D on the circuit board C with NCF which is an adhesive. The temporary pressure bonding apparatus 2 includes a temporary pressure bonding base 3, a temporary pressure bonding stage 4, a temporary pressure bonding support frame 5, a temporary pressure bonding unit 6, a temporary pressure bonding head 7, a temporary pressure bonding heater 8 (see FIG. 2), A crimping attachment 9 (see FIG. 2), a displacement sensor 10 as distance measuring means, and a temporary crimping image recognition device 11 (see FIG. 4) are provided.
　仮圧着用基台３は、仮圧着装置２を構成する主な構造体である。仮圧着用基台３は、十分な剛性を有するようにパイプ材等を組み合わせて構成されている。仮圧着用基台３は、仮圧着用ステージ４と仮圧着用支持フレーム５とを支持している。 The temporary press-bonding base 3 is a main structure constituting the temporary press-bonding device 2. The temporary press-bonding base 3 is configured by combining pipe materials and the like so as to have sufficient rigidity. The temporary pressure bonding base 3 supports a temporary pressure bonding stage 4 and a temporary pressure bonding support frame 5.
　仮圧着用ステージ４は、回路基板Ｃを保持しつつ、任意の位置に移動させるものである。仮圧着用ステージ４は、駆動ユニット４ａに回路基板を吸着保持できる吸着テーブル４ｂが取り付けられて構成されている。仮圧着用ステージ４は、仮圧着用基台３に取り付けられ、駆動ユニット４ａによって吸着テーブル４ｂをＸ軸方向、Ｙ軸方向およびθ方向に移動できるように構成されている。すなわち、仮圧着用ステージ４は、仮圧着用基台３上において吸着テーブル４ｂに吸着された回路基板ＣをＸ軸方向、Ｙ軸方向、θ方向に移動できるように構成されている。なお、本実施形態において仮圧着用ステージ４は、吸着により回路基板Ｃを保持しているがこれに限定されるものではない。 The temporary crimping stage 4 moves the circuit board C to an arbitrary position while holding the circuit board C. The temporary press-bonding stage 4 is configured by attaching a suction table 4b that can hold the circuit board to the drive unit 4a. The temporary press-bonding stage 4 is attached to the temporary press-bonding base 3 and is configured so that the suction table 4b can be moved in the X-axis direction, the Y-axis direction, and the θ-direction by the drive unit 4a. In other words, the temporary press-bonding stage 4 is configured to be able to move the circuit board C sucked by the suction table 4b on the temporary press-bonding base 3 in the X-axis direction, the Y-axis direction, and the θ-direction. In the present embodiment, the temporary press-bonding stage 4 holds the circuit board C by suction, but is not limited thereto.
　仮圧着用支持フレーム５は、仮圧着用ユニット６を支持するものである。仮圧着用支持フレーム５は、板状に形成され、仮圧着用基台３の仮圧着用ステージ４の近傍からＺ軸方向にむかって延びるように構成されている。 The temporary pressure-bonding support frame 5 supports the temporary pressure-bonding unit 6. The temporary press-bonding support frame 5 is formed in a plate shape and is configured to extend from the vicinity of the temporary press-bonding stage 4 of the temporary press-bonding base 3 toward the Z-axis direction.
　加圧ユニットである仮圧着用ユニット６は、仮圧着用ヘッド７を移動させるものである。仮圧着用ユニット６は、図示しないサーボモータとボールねじとから構成される。仮圧着用ユニット６は、仮圧着用ヘッド７の移動方向が回路基板Ｃに対して垂直なＺ軸方向になるように仮圧着用支持フレーム５に取り付けられている。仮圧着用ユニット６は、サーボモータによってボールねじを回転させることによりボールねじの軸方向の駆動力を発生させ、仮圧着用ヘッド７をＺ軸方向に移動させるように構成されている。つまり、仮圧着用ユニット６は、Ｚ軸方向の駆動力（加圧力）を発生するように構成されている。仮圧着用ユニット６は、Ｚ軸方向の加圧力である仮圧着荷重Ｆｔを任意に設定できるように構成されている。なお、本実施形態において、仮圧着用ユニット６は、サーボモータとボールねじとの構成としたがこれに限定されるものではなく、空圧アクチュエータや油圧アクチュエータから構成してもよい。 The temporary pressure bonding unit 6 which is a pressure unit moves the temporary pressure bonding head 7. The temporary crimping unit 6 includes a servo motor and a ball screw (not shown). The temporary pressure bonding unit 6 is attached to the temporary pressure bonding support frame 5 so that the moving direction of the temporary pressure bonding head 7 is in the Z-axis direction perpendicular to the circuit board C. The temporary crimping unit 6 is configured to generate a driving force in the axial direction of the ball screw by rotating the ball screw by a servo motor, and to move the temporary crimping head 7 in the Z-axis direction. That is, the temporary crimping unit 6 is configured to generate a driving force (pressing force) in the Z-axis direction. The temporary crimping unit 6 is configured such that a temporary crimping load Ft, which is a pressing force in the Z-axis direction, can be arbitrarily set. In the present embodiment, the provisional pressure bonding unit 6 is composed of a servo motor and a ball screw, but is not limited to this, and may be composed of a pneumatic actuator or a hydraulic actuator.
　仮圧着用ヘッド７は、仮圧着用ユニット６の駆動力をチップ部品Ｄに伝達するものである。仮圧着用ヘッド７は、仮圧着用ユニット６を構成している図示しないボールねじナットに取り付けられている。また、仮圧着用ユニット６は、仮圧着用ステージ４と対向するように配置されている。つまり、仮圧着用ヘッド７は、仮圧着用ユニット６によってＺ軸方向に移動されることで仮圧着用ステージ４に近接できるように構成されている。図２に示すように、仮圧着用ヘッド７には、仮圧着用ヒーター８、仮圧着用アタッチメント９および変位センサ１０が設けられている。 The temporary pressure bonding head 7 transmits the driving force of the temporary pressure bonding unit 6 to the chip component D. The temporary crimping head 7 is attached to a ball screw nut (not shown) constituting the temporary crimping unit 6. The temporary crimping unit 6 is disposed so as to face the temporary crimping stage 4. That is, the temporary press-bonding head 7 is configured to be close to the temporary press-bonding stage 4 by being moved in the Z-axis direction by the temporary press-bonding unit 6. As shown in FIG. 2, the temporary pressure bonding head 7 is provided with a temporary pressure bonding heater 8, a temporary pressure bonding attachment 9, and a displacement sensor 10.
　仮圧着用ヒーター８は、チップ部品Ｄを加熱するためのものである。仮圧着用ヒーター８は、カートリッジヒータから構成され、仮圧着用ヘッド７に形成された孔等に組み込まれている。本実施形態において、仮圧着用ヒーター８は、カートリッジヒータから構成されているがこれに限定されるものではなく、ラバーヒーター等、チップ部品Ｄを加熱することができるものであればよい。また、仮圧着用ヒーター８は、仮圧着用ヘッド７に組み込まれているがこれに限定されるものではなく、仮圧着用ステージ４に組み込んで、仮圧着用ステージ４側から回路基板Ｃを介してＮＣＦを加熱する構成でもよい。 The temporary crimping heater 8 is for heating the chip component D. The temporary pressure bonding heater 8 is constituted by a cartridge heater, and is incorporated in a hole or the like formed in the temporary pressure bonding head 7. In the present embodiment, the provisional pressure bonding heater 8 is composed of a cartridge heater, but is not limited to this, and may be any material that can heat the chip component D, such as a rubber heater. Further, the provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding head 7, but is not limited thereto. The provisional pressure bonding heater 8 is incorporated in the provisional pressure bonding stage 4, and the circuit board C is interposed from the provisional pressure bonding stage 4 side. The NCF may be heated.
　仮圧着用アタッチメント９は、チップ部品Ｄを保持するものである。仮圧着用アタッチメント９は、仮圧着用ヘッド７に仮圧着用ステージ４と対向するように設けられている。仮圧着用アタッチメント９は、チップ部品Ｄを位置決めしながら吸着保持できるように構成されている。また、仮圧着用アタッチメント９は、仮圧着用ヒーター８によって加熱されるように構成されている。つまり、仮圧着用アタッチメント９は、チップ部品Ｄを位置決め保持するとともに、仮圧着用ヒーター８からの伝熱によってチップ部品Ｄに貼り付けられているＮＣＦを加熱できるように構成されている。 The temporary crimping attachment 9 holds the chip part D. The temporary crimping attachment 9 is provided on the temporary crimping head 7 so as to face the temporary crimping stage 4. The temporary crimping attachment 9 is configured so that the chip component D can be sucked and held while being positioned. The temporary crimping attachment 9 is configured to be heated by the temporary crimping heater 8. That is, the temporary crimping attachment 9 is configured to position and hold the chip component D and to heat the NCF attached to the chip component D by heat transfer from the temporary crimping heater 8.
　変位センサ１０は、任意の基準位置からの仮圧着用ヘッド７のＺ軸方向の距離を測定するものである。変位センサ１０は、各種レーザー光を利用した変位センサ１０から構成される。変位センサ１０は仮圧着完了時の仮圧着用ヘッド７のＺ軸方向の任意の基準位置からの距離Ｌ（図５参照）を測定できるように構成されている。なお、本実施形態において、変位センサ１０はレーザー光を利用したものから構成されているがこれに限定されるものではなく、超音波を利用したものや、リニアスケール、サーボモータのエンコーダから算出するものから構成されていてもよい。 The displacement sensor 10 measures the distance in the Z-axis direction of the temporary press-bonding head 7 from an arbitrary reference position. The displacement sensor 10 includes a displacement sensor 10 that uses various laser beams. The displacement sensor 10 is configured to measure a distance L (see FIG. 5) from an arbitrary reference position in the Z-axis direction of the pre-bonding head 7 when the pre-bonding is completed. In the present embodiment, the displacement sensor 10 is configured by using a laser beam, but is not limited to this. The displacement sensor 10 is calculated by using an ultrasonic wave, a linear scale, or a servo motor encoder. You may be comprised from things.
　図４に示すように、仮圧着用画像認識装置１１は、画像によってチップ部品Ｄと回路基板Ｃとの位置情報を取得するものである。仮圧着用画像認識装置１１は、仮圧着用ステージ４に吸着保持されている回路基板Ｃの位置合わせマークと仮圧着用アタッチメント９に保持されているチップ部品Ｄの位置合わせマークとを画像認識して、回路基板Ｃとチップ部品Ｄとの位置情報を取得するように構成されている。 As shown in FIG. 4, the temporary pressure bonding image recognition apparatus 11 acquires position information of the chip component D and the circuit board C from the image. The temporary pressure bonding image recognition device 11 recognizes an image of the alignment mark of the circuit board C held by suction and holding on the temporary pressure bonding stage 4 and the alignment mark of the chip component D held on the temporary pressure bonding attachment 9. Thus, the positional information between the circuit board C and the chip component D is acquired.
　図１に示すように、本圧着装置１２は、チップ部品Ｄのはんだの溶着によってチップ部品Ｄを回路基板Ｃに接続するものである。本圧着装置１２は、本圧着用基台１３、本圧着用ステージ１４、本圧着用支持フレーム１５、本圧着用ユニット１６、本圧着用ヘッド１７および本圧着用画像認識装置２１（図４参照）を具備している。 As shown in FIG. 1, the present crimping apparatus 12 connects the chip component D to the circuit board C by welding the solder of the chip component D. The main pressure bonding device 12 includes a main pressure bonding base 13, a main pressure bonding stage 14, a main pressure bonding support frame 15, a main pressure bonding unit 16, a main pressure bonding head 17, and a main pressure bonding image recognition device 21 (see FIG. 4). It has.
　本圧着用基台１３は、本圧着装置１２を構成する主な構造体である。本圧着用基台１３は、十分な剛性を有するようにパイプ材等を組み合わせて構成されている。本圧着用基台１３は、本圧着用ステージ１４と本圧着用支持フレーム１５とを支持している。 The main press bonding base 13 is a main structure constituting the main press bonding device 12. The main base 13 for pressure bonding is configured by combining pipe materials or the like so as to have sufficient rigidity. The main pressure bonding base 13 supports a main pressure bonding stage 14 and a main pressure bonding support frame 15.
　本圧着用ステージ１４は、回路基板Ｃを保持しつつ、任意の位置に移動させるものである。本圧着用ステージ１４は、駆動ユニット１４ａに回路基板を吸着保持できる吸着テーブル１４ｂが取り付けられて構成されている。本圧着用ステージ１４は、本圧着用基台１３に取り付けられ、駆動ユニット１４ａによって吸着テーブル１４ｂをＸ軸方向、Ｙ軸方向およびθ方向に移動できるように構成されている。すなわち、本圧着用ステージ１４は、本圧着用基台１３上において吸着テーブル１４ｂに吸着された回路基板ＣをＸ軸方向、Ｙ軸方向、θ方向に移動できるように構成されている。なお、本実施形態において本圧着用ステージ１４は、吸着により回路基板Ｃを保持しているがこれに限定されるものではない。 The main crimping stage 14 moves the circuit board C to an arbitrary position while holding the circuit board C. The main crimping stage 14 is configured by attaching a suction table 14b capable of sucking and holding a circuit board to a drive unit 14a. The main press-bonding stage 14 is attached to the main press-bonding base 13 and is configured so that the suction table 14b can be moved in the X-axis direction, the Y-axis direction, and the θ-direction by the drive unit 14a. That is, the main press-bonding stage 14 is configured to be able to move the circuit board C sucked by the suction table 14b on the main press-bonding base 13 in the X-axis direction, the Y-axis direction, and the θ-direction. In the present embodiment, the final press-bonding stage 14 holds the circuit board C by suction, but is not limited thereto.
　本圧着用支持フレーム１５は、本圧着用ユニット１６を支持するものである。本圧着用支持フレーム１５は、略板状に形成され、本圧着用基台１３の本圧着用ステージ１４の近傍からＺ軸方向にむかって延びるように構成されている。 The main pressing support frame 15 supports the main pressing unit 16. The main pressure bonding support frame 15 is formed in a substantially plate shape, and is configured to extend from the vicinity of the main pressure bonding stage 14 of the main pressure bonding base 13 toward the Z-axis direction.
　加圧ユニットである本圧着用ユニット１６は、本圧着用ヘッド１７を移動させるものである。本圧着用ユニット１６は、図示しないサーボモータ、ボールねじおよび取り付け部１６ａ（図３参照）から構成される。本圧着用ユニット１６は、サーボモータによってボールねじを回転させることによりボールねじの軸方向の駆動力（加圧力）を発生させ、図示しないボールねじナットをＺ軸方向に移動させるように構成されている。本圧着用ユニット１６は、ボールねじナットに取り付け部１６ａが設けられている。本圧着用ユニット１６は、取り付け部１６ａの移動方向が回路基板Ｃに対して垂直なＺ軸方向になるように本圧着用支持フレーム１５に取り付けられている。つまり、本圧着用ユニット１６は、Ｚ軸方向の駆動力（加圧力）が取り付け部１６ａに伝わるように構成されている。本圧着用ユニット１６は、Ｚ軸方向の加圧力である本圧着荷重Ｆｐを任意に設定できるように構成されている。なお、本実施形態において、本圧着用ユニット１６は、サーボモータとボールねじとの構成としたがこれに限定されるものではなく、空圧アクチュエータや油圧アクチュエータから構成してもよい。 The main pressure bonding unit 16 which is a pressure unit moves the main pressure bonding head 17. The main crimping unit 16 includes a servo motor, a ball screw, and a mounting portion 16a (see FIG. 3) (not shown). The main crimping unit 16 is configured to generate a driving force (pressing force) in the axial direction of the ball screw by rotating the ball screw by a servo motor, and to move a ball screw nut (not shown) in the Z-axis direction. Yes. The main crimping unit 16 is provided with a mounting portion 16a on a ball screw nut. The main pressure bonding unit 16 is attached to the main pressure bonding support frame 15 so that the moving direction of the attachment portion 16a is in the Z-axis direction perpendicular to the circuit board C. That is, the main crimping unit 16 is configured such that the driving force (pressing force) in the Z-axis direction is transmitted to the mounting portion 16a. The main crimping unit 16 is configured so that a final crimping load Fp, which is a pressing force in the Z-axis direction, can be arbitrarily set. In the present embodiment, the main crimping unit 16 is composed of a servo motor and a ball screw, but is not limited thereto, and may be composed of a pneumatic actuator or a hydraulic actuator.
　図１と図３とに示すように、実装用ヘッドである本圧着用ヘッド１７は、本圧着用ユニット１６の駆動力（加圧力）をチップ部品Ｄに伝達するものである。本圧着用ヘッド１７は、本圧着用ユニット１６の取り付け部１６ａに取り付けられている。また、本圧着用ヘッド１７は、本圧着用ステージ１４と対向するように配置されている。つまり、本圧着用ヘッド１７は、本圧着用ユニット１６によってＺ軸方向に移動されることで本圧着用ステージ１４に近接できるように構成されている。本圧着用ヘッド１７は、本圧着用ヒーターブロック１８、熱伝導部材であるばね１９および複数の本圧着用アタッチメント２０が設けられている。 As shown in FIGS. 1 and 3, the main crimping head 17, which is a mounting head, transmits the driving force (pressing force) of the main crimping unit 16 to the chip component D. The main pressure bonding head 17 is attached to the attachment portion 16 a of the main pressure bonding unit 16. Further, the main pressure bonding head 17 is disposed so as to face the main pressure bonding stage 14. That is, the main press-bonding head 17 is configured to be close to the main press-bonding stage 14 by being moved in the Z-axis direction by the main press-bonding unit 16. The main pressure bonding head 17 is provided with a main pressure bonding heater block 18, a spring 19 that is a heat conducting member, and a plurality of main pressure bonding attachments 20.
　図３に示すように、本圧着用ヒーターブロック１８は、蓄熱するものである。本圧着用ヒーターブロック１８は、熱伝導部材である鉄等の金属から構成されている。本圧着用ヒーターブロック１８は直方体に形成され、その一側側面が本圧着用ユニット１６の取り付け部１６ａに取り付けられている。また、本圧着用ヒーターブロック１８には、一側側面の裏側の他側側面の近傍にカートリッジヒータから構成されている本圧着用ヒーター１８ａが組み込まれている。これにより、本圧着用ヒーターブロック１８は、本圧着用ヒーター１８ａによって任意の温度に昇温するように構成されている。本実施形態において、本圧着用ヒーター１８ａは、カートリッジヒータから構成されているがこれに限定されるものではなく、ラバーヒーター等、本圧着用アタッチメント２０を加熱することができるものであればよい。 As shown in FIG. 3, the main heater block 18 is used to store heat. The main-compression heater block 18 is made of a metal such as iron, which is a heat conducting member. The main pressure bonding heater block 18 is formed in a rectangular parallelepiped shape, and one side surface thereof is attached to the attachment portion 16 a of the main pressure bonding unit 16. Further, the main pressure bonding heater block 18 incorporates a main pressure bonding heater 18a formed of a cartridge heater in the vicinity of the other side surface on the back side of the one side surface. Thereby, the main pressure bonding heater block 18 is configured to be heated to an arbitrary temperature by the main pressure bonding heater 18a. In the present embodiment, the main crimping heater 18a is composed of a cartridge heater, but is not limited to this, and may be any one that can heat the main crimping attachment 20, such as a rubber heater.
　熱伝導部材である金属からなるばね１９は、本圧着用アタッチメント２０を保持するとともに本圧着用ヒーターブロック１８が蓄積した熱を本圧着用アタッチメント２０に伝えるものである。図３（ａ）に示すように、ばね１９は、板材が本圧着用アタッチメント２０を取り囲むように形成された板ばねから構成されている。ばね１９は、頂部と底部とが近接する方向に弾性変形するように構成されている。ばね１９の底部は、本圧着用ヒーターブロック１８の他側側面に接続されている。ばね１９の頂部には、本圧着用アタッチメント２０が保持されている。つまり、ばね１９は、弾性変形により頂部に保持されている本圧着用アタッチメント２０が本圧着用ユニット１６の移動方向に移動するように構成されている。また、ばね１９は、本圧着用ヒーター１８ａの近傍に配置されている。なお、本実施形態において、ばね１９を板ばねとしたがこれに限定されるものではなく、重ね板ばねなどでもよい。 The spring 19 made of metal as a heat conducting member holds the main crimping attachment 20 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 20. As shown in FIG. 3A, the spring 19 is composed of a plate spring formed so that the plate material surrounds the main crimping attachment 20. The spring 19 is configured to be elastically deformed in a direction in which the top portion and the bottom portion approach each other. The bottom of the spring 19 is connected to the other side surface of the main pressure bonding heater block 18. A main crimping attachment 20 is held at the top of the spring 19. That is, the spring 19 is configured such that the main crimping attachment 20 held on the top by elastic deformation moves in the moving direction of the main crimping unit 16. Further, the spring 19 is disposed in the vicinity of the main crimping heater 18a. In the present embodiment, the spring 19 is a leaf spring, but is not limited to this, and a laminated leaf spring or the like may be used.
　本圧着用アタッチメント２０は、チップ部品Ｄに接触して圧力と熱とを伝えるものである。図３（ｂ）に示すように、本圧着用アタッチメント２０は、ばね１９の頂部の開口部分にはまり込むようにしてばね１９に保持されている。これにより、本圧着用アタッチメント２０は、ばね１９を介して本圧着用ヒーターブロック１８に接続されている。この際、本圧着用アタッチメント２０は、チップ部品Ｄと接触する面が本圧着用ステージ１４と対向するように配置されている。本圧着用アタッチメント２０は、チップ部品Ｄが接触する部分の厚さが０．５ｍｍ以上５ｍｍ以下になるように構成されている。このように構成することで、本圧着用アタッチメント２０は、加圧時のたわみの発生と傾きの発生とが抑制される。 The main attachment 20 for pressure bonding contacts the chip part D and transmits pressure and heat. As shown in FIG. 3B, the main crimping attachment 20 is held by the spring 19 so as to fit into the opening portion at the top of the spring 19. Thereby, the main crimping attachment 20 is connected to the main crimping heater block 18 via the spring 19. At this time, the main crimping attachment 20 is disposed so that the surface that contacts the chip component D faces the final crimping stage 14. The main attachment 20 is configured so that the thickness of the portion with which the chip component D contacts is 0.5 mm or more and 5 mm or less. By comprising in this way, the main-bonding attachment 20 suppresses the generation | occurrence | production of the bending at the time of pressurization, and generation | occurrence | production of inclination.
　本圧着用ヒーターブロック１８と本圧着用アタッチメント２０との間には、仮圧着されたチップ部品ＤのＺ軸方向のばらつき（以下、単に「実装誤差」と記す）を吸収するための弾性部材である耐熱性のゴム部材２０ａが配置されている。本圧着用アタッチメント２０は、複数のチップ部品Ｄの実装誤差に応じてゴム部材２０ａが本圧着用ヒーターブロック１８と本圧着用アタッチメント２０によって圧縮されるように構成されている。ゴム部材２０ａは、厚さが０．１ｍｍ以上１ｍｍ以下の板状部材から構成されている。このように構成することで、本圧着用アタッチメント２０は、実装誤差を吸収するために必要なゴム部材２０ａの圧縮量を確保するとともにゴム部材２０ａの圧縮量の偏りによる位置ズレが抑制される。なお、本実施形態において、ゴム部材２０ａは、本圧着用ヒーターブロック１８と本圧着用アタッチメント２０とに固定されていなくてもよい。 Between the main pressure bonding heater block 18 and the main pressure bonding attachment 20, there is an elastic member for absorbing the variation in the Z-axis direction (hereinafter, simply referred to as “mounting error”) of the temporarily pressed chip part D. A certain heat-resistant rubber member 20a is disposed. The main pressure bonding attachment 20 is configured such that the rubber member 20 a is compressed by the main pressure bonding heater block 18 and the main pressure bonding attachment 20 in accordance with mounting errors of the plurality of chip components D. The rubber member 20a is composed of a plate-like member having a thickness of 0.1 mm to 1 mm. By configuring in this way, the main pressure bonding attachment 20 secures a compression amount of the rubber member 20a necessary for absorbing a mounting error and suppresses a positional shift due to an uneven compression amount of the rubber member 20a. In the present embodiment, the rubber member 20 a may not be fixed to the main pressure bonding heater block 18 and the main pressure bonding attachment 20.
　図４に示すように、本圧着用画像認識装置２１は、画像によって本圧着用ヘッド１７と回路基板Ｃとの位置情報を取得するものである。本圧着用画像認識装置２１は、本圧着用ヘッド１７の位置合わせマークと本圧着用ステージ１４に吸着保持されている回路基板Ｃの位置合わせマークとを画像認識して、回路基板Ｃとチップ部品Ｄとの位置情報を取得するように構成されている。なお、本実施形態において本圧着ヘッド１７と回路基板Ｃとの位置情報の取得を本圧着用画像認識装置２１を用いたがこれに限定されるものではなく、必須ではない。 As shown in FIG. 4, the main press-bonding image recognition device 21 acquires position information between the main press-bonding head 17 and the circuit board C based on images. The main press bonding image recognition device 21 recognizes an image of the alignment mark of the main press bonding head 17 and the alignment mark of the circuit board C sucked and held on the main press bonding stage 14, and the circuit board C and the chip component. It is comprised so that position information with D may be acquired. In the present embodiment, the acquisition of the positional information between the main pressure bonding head 17 and the circuit board C is performed using the main pressure bonding image recognition device 21, but the present invention is not limited to this and is not essential.
　搬送装置２２は、仮圧着装置２と本圧着装置１２との間で回路基板Ｃの受け渡しを行うものである。搬送装置２２は、仮圧着装置２の仮圧着用ステージ４で複数のチップ部品Ｄが仮固定された回路基板Ｃを本圧着装置１２の本圧着用ステージ１４に搬送できるように構成されている。 The transport device 22 delivers the circuit board C between the temporary crimping device 2 and the final crimping device 12. The transport device 22 is configured to be able to transport the circuit board C on which the plurality of chip components D are temporarily fixed by the temporary crimping stage 4 of the temporary crimping apparatus 2 to the final crimping stage 14 of the final crimping apparatus 12.
　制御装置２３は、仮圧着装置２、本圧着装置１２および搬送装置２２等を制御するものである。制御装置２３は、実体的には、ＣＰＵ、ＲＯＭ、ＲＡＭ、ＨＤＤ等がバスで接続される構成であってもよく、あるいはワンチップのＬＳＩ等からなる構成であってもよい。制御装置２３は、仮圧着装置２、本圧着装置１２および搬送装置２２等を制御するために種々のプログラムやデータが格納されている。 The control device 23 controls the temporary pressure bonding device 2, the main pressure bonding device 12, the conveying device 22, and the like. The control device 23 may actually be configured such that a CPU, ROM, RAM, HDD, or the like is connected by a bus, or may be configured by a one-chip LSI or the like. The control device 23 stores various programs and data for controlling the temporary pressure bonding device 2, the main pressure bonding device 12, the conveying device 22, and the like.
　制御装置２３は、仮圧着用ステージ４と本圧着用ステージ１４とに接続され、仮圧着用ステージ４と本圧着用ステージ１４とのＸ軸方向、Ｙ軸方向、θ方向の移動量をそれぞれ制御することができる。 The control device 23 is connected to the temporary crimping stage 4 and the final crimping stage 14 and controls the movement amounts of the temporary crimping stage 4 and the final crimping stage 14 in the X, Y, and θ directions, respectively. can do.
　制御装置２３は、仮圧着用ヒーター８と本圧着用ヒーター１８ａとに接続され、仮圧着用ヒーター８と本圧着用ヒーター１８ａとの温度をそれぞれ制御することができる。特に、制御装置２３は、本圧着用ヘッド１７の加圧時における平均温度をＮＣＦの硬化温度以上かつはんだの融点以上の温度からなる一定範囲内に維持することができる。 The control device 23 is connected to the temporary pressure bonding heater 8 and the main pressure bonding heater 18a, and can control the temperatures of the temporary pressure bonding heater 8 and the main pressure bonding heater 18a, respectively. In particular, the control device 23 can maintain the average temperature at the time of pressurization of the main press-bonding head 17 within a certain range including a temperature equal to or higher than the NCF curing temperature and equal to or higher than the melting point of the solder.
　制御装置２３は、仮圧着用ユニット６と本圧着用ユニット１６とに接続され、仮圧着用ユニット６と本圧着用ユニット１６とのＺ軸方向の加圧力をそれぞれ制御することができる。 The control device 23 is connected to the temporary crimping unit 6 and the main crimping unit 16 and can control the applied pressure in the Z-axis direction between the temporary crimping unit 6 and the final crimping unit 16.
　制御装置２３は、仮圧着用アタッチメント９に接続され、仮圧着用アタッチメント９の吸着状態を制御することができる。 The control device 23 is connected to the temporary crimping attachment 9 and can control the suction state of the temporary crimping attachment 9.
　制御装置２３は、仮圧着用画像認識装置１１と本圧着用画像認識装置２１とに接続され、仮圧着用画像認識装置１１と本圧着用画像認識装置２１とをそれぞれ制御し、チップ部品Ｄと回路基板Ｃ、本圧着用ヘッド１７と回路基板Ｃとの位置情報を取得することができる。 The control device 23 is connected to the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 21, and controls the temporary pressure-bonding image recognition device 11 and the main pressure-bonding image recognition device 21, respectively. The positional information on the circuit board C, the main pressure bonding head 17 and the circuit board C can be acquired.
　制御装置２３は、搬送装置２２に接続され、搬送装置２２を制御することができる。 The control device 23 is connected to the transport device 22 and can control the transport device 22.
　制御装置２３は、変位センサ１０に接続され、変位センサ１０から仮圧着完了時のＺ軸方向の距離を取得することができる。特に、制御装置２３は、仮固定時のチップ部品ＤのＺ軸方向ばらつきが所定範囲外か否か判定することができる。 The control device 23 is connected to the displacement sensor 10 and can acquire the distance in the Z-axis direction at the time of completion of provisional pressure bonding from the displacement sensor 10. In particular, the control device 23 can determine whether or not the variation in the Z-axis direction of the chip component D at the time of temporary fixing is out of a predetermined range.
　以上より、図５（ａ）に示すように、実装装置１は、回路基板Ｃにチップ部品Ｄを仮固定する仮圧着工程として、仮圧着装置２の仮圧着用ステージ４に回路基板Ｃを吸着保持し、チップ部品Ｄを仮圧着用ユニット６によって仮圧着温度Ｔｔ（図６参照）に加熱しつつ仮圧着荷重Ｆｔで回路基板Ｃに加圧することで回路基板Ｃの所定位置に仮固定する。次に、実装装置１は、搬送装置２２で回路基板Ｃを仮圧着装置２の仮圧着用ステージ４から本圧着装置１２の本圧着用ステージ１４に搬送する。そして、実装装置１は、図５（ｂ）に示すように、回路基板Ｃにチップ部品Ｄを接続する本圧着工程として、本圧着装置１２の本圧着用ステージ１４に回路基板Ｃを吸着保持し、複数のチップ部品Ｄを同時に本圧着用ユニット１６によって本圧着温度Ｔｐ（図６参照）に加熱しつつ本圧着荷重Ｆｐで加圧することで回路基板Ｃに接続する。 From the above, as shown in FIG. 5A, the mounting apparatus 1 adsorbs the circuit board C to the temporary pressure bonding stage 4 of the temporary pressure bonding apparatus 2 as a temporary pressure bonding process for temporarily fixing the chip component D to the circuit board C. The chip component D is temporarily fixed at a predetermined position on the circuit board C by being pressed against the circuit board C with a temporary pressure bonding load Ft while being heated to the temporary pressure bonding temperature Tt (see FIG. 6) by the temporary pressure bonding unit 6. Next, the mounting apparatus 1 conveys the circuit board C from the temporary crimping stage 4 of the temporary crimping apparatus 2 to the final crimping stage 14 of the final crimping apparatus 12 by the transport device 22. Then, as shown in FIG. 5B, the mounting apparatus 1 sucks and holds the circuit board C on the final crimping stage 14 of the final crimping apparatus 12 as a final crimping process for connecting the chip component D to the circuit board C. The plurality of chip components D are simultaneously connected to the circuit board C by being pressurized to the final press bonding temperature Tp (see FIG. 6) by the main press bonding unit 16 and being subjected to the main press load Fp.
　このように構成することで、実装装置１は、仮圧着装置２で連続的にチップ部品Ｄを回路基板Ｃの所定位置に仮固定した後に、本圧着装置１２で同時に複数のチップ部品Ｄを回路基板Ｃに接続することができる。このため、図６に示すように、実装装置１は、本圧着装置１２の本圧着時における本圧着用ヘッド１７の温度を本圧着温度Ｔｐに維持するだけでよい。従って、実装装置１は、一実装サイクル毎に本圧着用ヘッド１７の冷却を行う必要がなく温度管理が容易になり、スループットが向上するとともに本圧着の接合不良の発生を抑制することができる。 With this configuration, the mounting apparatus 1 temporarily fixes the chip components D at predetermined positions on the circuit board C continuously with the temporary crimping apparatus 2, and then simultaneously circuits a plurality of chip components D with the final crimping apparatus 12. It can be connected to the substrate C. For this reason, as shown in FIG. 6, the mounting apparatus 1 only needs to maintain the temperature of the main press-bonding head 17 during the main press-bonding of the main press-bonding apparatus 12 at the main press-bonding temperature Tp. Therefore, the mounting apparatus 1 does not need to cool the main press-bonding head 17 for each mounting cycle, and temperature management is facilitated, the throughput is improved, and the occurrence of defective bonding in the main press-bonding can be suppressed.
　以下では、図７を用いて、本発明に係る実装装置１の本圧着時における本圧着用ヘッド１７の熱が伝達される態様について詳細に説明する。 Hereinafter, with reference to FIG. 7, a mode in which heat of the main press-bonding head 17 during the main press-bonding of the mounting apparatus 1 according to the present invention is transmitted will be described in detail.
　図７（ａ）に示すように、実装装置１の制御装置２３は、本圧着用ヘッド１７の本圧着用ヒーター１８ａを発熱させる。本圧着用ヘッド１７は、本圧着用ヒーター１８ａの発熱により本圧着用ヒーターブロック１８が加熱される。本圧着用ヒーターブロック１８は、本圧着用ヒーター１８ａの発熱量、本圧着用ヒーターブロック１８の表面からの放熱量、本圧着用ヒーターブロック１８の体積および比熱容量から定まる所定の温度まで昇温する。所定の温度まで昇温された本圧着用ヒーターブロック１８に蓄積されている熱は、ばね１９を通じて本圧着用アタッチメント２０に伝わる（図７（ａ）薄墨矢印参照）。本圧着用アタッチメント２０は、ばね１９を通じて供給される熱量、本圧着用アタッチメント２０の表面からの放熱量、本圧着用アタッチメント２０の体積および比熱容量から定まる所定の温度まで昇温する。この際、制御装置２３は、本圧着用アタッチメント２０の温度が本圧着温度Ｔｐ（図６参照）になるように本圧着用ヒーター１８ａを制御する。 As shown in FIG. 7A, the control device 23 of the mounting apparatus 1 causes the main pressure bonding heater 18a of the main pressure bonding head 17 to generate heat. In the main pressure bonding head 17, the main pressure bonding heater block 18 is heated by the heat generated by the main pressure bonding heater 18a. The main pressure bonding heater block 18 is heated to a predetermined temperature determined from the heat generation amount of the main pressure bonding heater block 18a, the heat radiation amount from the surface of the main pressure bonding heater block 18, the volume of the main pressure bonding heater block 18 and the specific heat capacity. . The heat accumulated in the main press-bonding heater block 18 that has been heated to a predetermined temperature is transmitted to the main press-fit attachment 20 through the spring 19 (see FIG. 7 (a) thin ink arrow). The main crimping attachment 20 is heated to a predetermined temperature determined from the amount of heat supplied through the spring 19, the amount of heat released from the surface of the main crimping attachment 20, the volume of the main crimping attachment 20, and the specific heat capacity. At this time, the control device 23 controls the main pressure bonding heater 18a so that the temperature of the main pressure bonding attachment 20 becomes the main pressure bonding temperature Tp (see FIG. 6).
　次に、実装装置１の制御装置２３は、本圧着用ユニット１６を駆動させて本圧着用ヘッド１７を本圧着用ステージ１４に近接する方向に移動させる。本圧着用アタッチメント２０は、チップ部品Ｄに接触すると、本圧着用ユニット１６の加圧力によってゴム部材２０ａが圧縮されることで本圧着用ヒーターブロック１８を基準としてＺ軸方向に移動する（図５（ｂ）参照）。 Next, the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 17 in a direction close to the main pressure bonding stage 14. When the main crimping attachment 20 comes into contact with the chip component D, the rubber member 20a is compressed by the pressure applied by the main crimping unit 16 to move in the Z-axis direction with reference to the main crimping heater block 18 (FIG. 5). (See (b)).
　図７（ｂ）に示すように、本圧着用アタッチメント２０は、ばね１９の頂部の開口部分にはまり込むようにして一体的にばね１９に保持されている。このため、本圧着用アタッチメント２０は、熱伝導部材であるばね１９との間で相対移動することなくＺ軸方向に移動する。つまり、ばね１９は、本圧着用ヒーターブロック１８に接続された状態で本圧着用アタッチメント２０の動きに追従するように弾性変形する。これにより、本圧着用アタッチメント２０には、ゴム部材２０ａが圧縮されることによって本圧着用アタッチメント２０がＺ軸方向に移動してもばね１９を介して本圧着用ヒーターブロック１８から熱が供給されている。 As shown in FIG. 7 (b), the main crimp attachment 20 is integrally held by the spring 19 so as to fit into the opening of the top of the spring 19. For this reason, the main-bonding attachment 20 moves in the Z-axis direction without moving relative to the spring 19 which is a heat conducting member. That is, the spring 19 is elastically deformed so as to follow the movement of the main crimping attachment 20 while being connected to the main crimping heater block 18. As a result, heat is supplied to the main crimping attachment 20 from the main crimping heater block 18 via the spring 19 even if the main crimping attachment 20 moves in the Z-axis direction due to the compression of the rubber member 20a. ing.
　以下では、図８を用いて、本発明に係る実装装置１の本圧着時におけるＮＣＦを用いたチップ部品ＤのＺ軸方向の位置のばらつきを吸収する構成について説明する。 Hereinafter, a configuration that absorbs variation in the position in the Z-axis direction of the chip component D using the NCF at the time of the main press bonding of the mounting apparatus 1 according to the present invention will be described with reference to FIG.
　図８（ａ）に示すように、実装装置１は、本圧着工程において、仮固定されたチップ部品Ｄに本圧着用ユニット１６によって本圧着用アタッチメント２０を当接させる。チップ部品Ｄは、本圧着用ヒーター１８ａによって本圧着用アタッチメント２０を介して所定の本圧着温度Ｔｐまで加熱される。これに伴って、チップ部品Ｄに貼り付けられているＮＣＦとはんだＤａとは、加熱されたチップ部品Ｄの熱が伝わりチップ部品Ｄと略同一の本圧着温度Ｔｐに加熱される。 As shown in FIG. 8A, the mounting apparatus 1 causes the final crimping unit 16 to abut on the temporarily fixed chip component D in the final crimping step. The chip component D is heated to a predetermined main press bonding temperature Tp by the main press bonding heater 18a via the main press attachment 20. Along with this, the NCF and the solder Da attached to the chip component D are heated to the main press bonding temperature Tp substantially the same as that of the chip component D because the heat of the heated chip component D is transmitted.
　実装装置１は、本圧着温度Ｔｐに加熱されたチップ部品Ｄを本圧着用ユニット１６によってＺ軸方向に本圧着加重Ｆｐで加圧する。チップ部品Ｄは、本圧着用ユニット１６によって回路基板Ｃに向かって加圧されることで、はんだと回路基板Ｃのパッドとの間隙をなくすように近接する。この際、チップ部品ＤのＮＣＦは、硬化温度以上に加熱されているため硬化が始まる。実装装置１は、本圧着工程においてチップ部品ＤのＮＣＦが完全に硬化するまでに回路基板ＣのパッドＣａとチップ部品ＤのはんだＤａとを接触させる。つまり、実装装置１は、ＮＣＦの硬化による回路基板Ｃとチップ部品Ｄとの接合不良を抑制する。 The mounting apparatus 1 pressurizes the chip component D heated to the main press bonding temperature Tp by the main press bonding unit 16 in the Z-axis direction with the main press bonding load Fp. The chip component D is pressed toward the circuit board C by the main crimping unit 16 so as to be close to each other so as to eliminate the gap between the solder and the pad of the circuit board C. At this time, since the NCF of the chip part D is heated to the curing temperature or higher, curing starts. The mounting apparatus 1 brings the pad Ca of the circuit board C and the solder Da of the chip component D into contact with each other until the NCF of the chip component D is completely cured in the main crimping process. That is, the mounting apparatus 1 suppresses the bonding failure between the circuit board C and the chip component D due to the hardening of the NCF.
　各チップ部品Ｄは、実装誤差により本圧着用アタッチメント２０が接触する面から回路基板Ｃまでの距離がそれぞれ異なる。従って、本圧着用ヘッド１７は、本圧着用アタッチメント２０と本圧着用ヒーターブロック１８との間に配置されているゴム部材２０ａが本圧着用アタッチメント２０における距離に応じてそれぞれ異なる厚さに圧縮されている。このため、本圧着用ヘッド１７に同時に加圧される複数のチップ部品Ｄのうち、回路基板ＣのパッドＣａとはんだＤａとの間隙が他のチップ部品Ｄのそれと比べて大きいチップ部品Ｄは、他のチップ部品Ｄに加わる荷重Ｆｐ１よりも大きい荷重Ｆｐ２で加圧される。しかし、図８（ｂ）に示すように、一のチップ部品Ｄは、ＮＣＦが硬化することにより荷重Ｆｐ２をはんだＤａと硬化を開始したＮＣＦとで分散して受けとめるため、加圧によりはんだＤａが潰れ過ぎることがない。 Each chip component D has a different distance from the surface on which the main crimping attachment 20 contacts to the circuit board C due to a mounting error. Accordingly, in the main pressure bonding head 17, the rubber member 20 a disposed between the main pressure bonding attachment 20 and the main pressure bonding heater block 18 is compressed to have different thicknesses depending on the distance in the main pressure bonding attachment 20. ing. For this reason, among the plurality of chip components D that are simultaneously pressed by the main crimping head 17, the chip component D in which the gap between the pad Ca of the circuit board C and the solder Da is larger than that of the other chip components D is: Pressurization is performed with a load Fp2 larger than the load Fp1 applied to the other chip component D. However, as shown in FIG. 8 (b), since one chip component D receives the load Fp2 dispersed by the solder Da and the NCF that has started to cure when the NCF is cured, the solder Da is applied by pressurization. It won't be crushed too much.
　このように構成される本圧着用ヘッド１７を用いることで、加圧時に本圧着用アタッチメント２０を保持した状態でばね１９が弾性変形するので本圧着用アタッチメント２０とばね１９との間に相対的な移動が生じない。また、ゴム部材２０ａの厚さを制限することで加圧時にゴム部材２０ａの圧縮量の偏りによる本圧着用アタッチメント２０の位置ズレが抑制するとともに、実装誤差を吸収するために必要なゴム部材２０ａの圧縮量が確保される。さらに、本圧着用アタッチメント２０の厚さを制限することで加圧時の本圧着用アタッチメント２０のたわみが抑制される。これにより、本圧着用アタッチメント２０を加熱しつつ、チップ部品Ｄの加圧方向の位置のばらつきをゴム部材２０ａで吸収することができる。 By using the main pressure bonding head 17 configured as described above, the spring 19 is elastically deformed while the main pressure bonding attachment 20 is held at the time of pressurization. Movement does not occur. Further, by limiting the thickness of the rubber member 20a, the positional displacement of the main pressure bonding attachment 20 due to the bias of the compression amount of the rubber member 20a during pressing is suppressed, and the rubber member 20a necessary for absorbing mounting errors. The amount of compression is ensured. Further, by limiting the thickness of the main crimping attachment 20, the deflection of the main crimping attachment 20 during pressurization is suppressed. Thereby, the variation in the position of the chip component D in the pressing direction can be absorbed by the rubber member 20a while heating the main pressure bonding attachment 20.
　以下に、図９を用いて、本発明の第二実施形態に係る本圧着用ヘッド２４について説明する。なお、以下の実施形態において、既に説明した実施形態と同様の点に関してはその具体的説明を省略し、相違する部分を中心に説明する。 Hereinafter, the main pressure bonding head 24 according to the second embodiment of the present invention will be described with reference to FIG. In the following embodiments, the same points as those of the above-described embodiments will not be specifically described, and different portions will be mainly described.
　図９（ａ）に示すように、実装用ヘッドである本圧着用ヘッド２４は、本圧着用ユニット１６（図１参照）の駆動力（加圧力）をチップ部品Ｄに伝達するものである。本圧着用ヘッド２４は、本圧着用ヒーターブロック１８、熱伝導部材であるアルミシート２５および複数の本圧着用アタッチメント２６が設けられている。 As shown in FIG. 9A, the main crimping head 24, which is a mounting head, transmits the driving force (pressing force) of the main crimping unit 16 (see FIG. 1) to the chip component D. The main pressure bonding head 24 is provided with a main pressure bonding heater block 18, an aluminum sheet 25 which is a heat conducting member, and a plurality of main pressure bonding attachments 26.
　熱伝導部材であるアルミニウム合金からなるアルミシート２５は、本圧着用アタッチメント２６を包み込んで保持するとともに本圧着用ヒーターブロック１８が蓄積した熱を本圧着用アタッチメント２６に伝えるものである。アルミシート２５は、アルミニウム合金を所定の厚さのシート状にしたものである。アルミシート２５は、任意の形状に変形できるように構成されている。アルミシート２５は、本圧着用ヒーターブロック１８に設けられている本圧着用アタッチメント２６を包み込むようにして本圧着用ヒーターブロック１８の他側側面に固定具２５ａによって接続されている。すなわち、アルミシート２５は、本圧着用ヒーターブロック１８と本圧着用アタッチメント２６とに接続されている。アルミシート２５は、本圧着用アタッチメント２６を包み込むように配置されているため本圧着用アタッチメント２６の動きに追従するように変形することができる。アルミシート２５は、本圧着用ヒーターブロック１８の本圧着用ヒーター１８ａの近傍に配置されている。なお、本実施形態において、アルミシート２５の材質をアルミニウム合金としたがこれに限定されるものではなく銅箔などでもよい。 The aluminum sheet 25 made of an aluminum alloy serving as a heat conducting member wraps and holds the main crimping attachment 26 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 26. The aluminum sheet 25 is a sheet of aluminum alloy having a predetermined thickness. The aluminum sheet 25 is configured to be deformable into an arbitrary shape. The aluminum sheet 25 is connected to the other side surface of the main pressure bonding heater block 18 by a fixture 25 a so as to wrap the main pressure bonding attachment 26 provided in the main pressure bonding heater block 18. That is, the aluminum sheet 25 is connected to the main pressure bonding heater block 18 and the main pressure bonding attachment 26. Since the aluminum sheet 25 is disposed so as to wrap the main crimping attachment 26, the aluminum sheet 25 can be deformed so as to follow the movement of the main crimping attachment 26. The aluminum sheet 25 is disposed in the vicinity of the main pressure bonding heater 18 a of the main pressure bonding heater block 18. In the present embodiment, the aluminum sheet 25 is made of an aluminum alloy, but is not limited thereto, and may be a copper foil or the like.
　本圧着用アタッチメント２６は、チップ部品Ｄに接触して圧力と熱とを伝えるものである。本圧着用アタッチメント２６は、弾性部材である耐熱性のゴム部材２６ａが接続されている。そして、本圧着用アタッチメント２６は、ゴム部材２６ａを介して本圧着用ヒーターブロック１８に接続されている。本圧着用アタッチメント２６は、複数のチップ部品Ｄの実装誤差に応じてゴム部材２６ａが本圧着用ヒーターブロック１８と本圧着用アタッチメント２６によって圧縮されるように構成されている。これにより、本圧着用アタッチメント２６は、仮圧着されたチップ部品Ｄの実装誤差を吸収することができる。本圧着用アタッチメント２６は、その全体が任意の形状に変形可能なアルミシート２５で包み込まれるように覆われている。 The main attachment 26 is for contacting the chip part D and transmitting pressure and heat. The main attachment 26 is connected to a heat-resistant rubber member 26a, which is an elastic member. The main crimping attachment 26 is connected to the main crimping heater block 18 via a rubber member 26a. The main crimping attachment 26 is configured such that the rubber member 26 a is compressed by the main crimping heater block 18 and the main crimping attachment 26 in accordance with mounting errors of the plurality of chip components D. Thereby, the main attachment 26 can absorb the mounting error of the temporarily pressed chip part D. The main crimping attachment 26 is covered so as to be wrapped by an aluminum sheet 25 that can be deformed into an arbitrary shape.
　以下では、本発明に係る実装装置１の本圧着時における本圧着用ヘッド２４の熱が伝達される態様について詳細に説明する。 Hereinafter, a mode in which heat of the main press-bonding head 24 during the main press-bonding of the mounting apparatus 1 according to the present invention is transmitted will be described in detail.
　図９（ｂ）に示すように、実装装置１の制御装置２３は、本圧着用ヘッド２４の本圧着用ヒーター１８ａを発熱させる。所定の温度まで昇温された本圧着用ヒーターブロック１８に蓄積されている熱は、アルミシート２５を通じて本圧着用アタッチメント２６に伝わる（薄墨矢印参照）。 As shown in FIG. 9B, the controller 23 of the mounting apparatus 1 causes the main crimping heater 18a of the main crimping head 24 to generate heat. The heat accumulated in the main press-bonding heater block 18 that has been heated to a predetermined temperature is transmitted to the main press-fit attachment 26 through the aluminum sheet 25 (see thin ink arrows).
　次に、実装装置１の制御装置２３は、本圧着用ユニット１６を駆動させて本圧着用ヘッド２４を本圧着用ステージ１４に近接する方向に移動させる。本圧着用アタッチメント２６は、チップ部品Ｄに接触すると、本圧着用ユニット１６の加圧力によってゴム部材２６ａが圧縮されることで本圧着用ヒーターブロック１８を基準としてＺ軸方向に移動する（図９（ａ）参照）。 Next, the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 24 in a direction close to the main pressure bonding stage 14. When the main crimping attachment 26 comes into contact with the chip component D, the rubber member 26a is compressed by the pressure applied by the main crimping unit 16, and moves in the Z-axis direction with reference to the main crimping heater block 18 (FIG. 9). (See (a)).
　本圧着用アタッチメント２６は、アルミシート２５に包み込まれるようにして一体的にアルミシート２５に保持されている。このため、本圧着用アタッチメント２６は、熱伝導部材であるアルミシート２５との間で相対移動することなくＺ軸方向に移動する。つまり、アルミシート２５は、本圧着用ヒーター１８に接続された状態で本圧着用アタッチメント２６の動きに追従するように変形する。これにより、本圧着用アタッチメント２６には、ゴム部材２６ａが圧縮されることによって本圧着用アタッチメント２６がＺ軸方向に移動してもアルミシート２５を介して本圧着用ヒーターブロック１８から熱が供給されている。 The main crimp attachment 26 is integrally held by the aluminum sheet 25 so as to be wrapped in the aluminum sheet 25. For this reason, the main-bonding attachment 26 moves in the Z-axis direction without moving relative to the aluminum sheet 25 that is a heat conducting member. That is, the aluminum sheet 25 is deformed so as to follow the movement of the main crimping attachment 26 while being connected to the main crimping heater 18. As a result, heat is supplied to the main crimping attachment 26 from the main crimping heater block 18 via the aluminum sheet 25 even if the main crimping attachment 26 moves in the Z-axis direction due to the compression of the rubber member 26a. Has been.
　以下に、図１０を用いて、本発明の第三実施形態に係る本圧着用ヘッド２７について説明する。 Hereinafter, the main pressure bonding head 27 according to the third embodiment of the present invention will be described with reference to FIG.
　図１０（ａ）に示すように、実装用ヘッドである本圧着用ヘッド２７は、本圧着用ユニット１６（図１参照）の駆動力（加圧力）をチップ部品Ｄに伝達するものである。本圧着用ヘッド２７は、本圧着用ヒーターブロック１８、熱伝導部材である枠体２８および複数の本圧着用アタッチメント２９が設けられている。 As shown in FIG. 10A, the main pressure bonding head 27, which is a mounting head, transmits the driving force (pressing force) of the main pressure bonding unit 16 (see FIG. 1) to the chip component D. The main pressure bonding head 27 is provided with a main pressure bonding heater block 18, a frame body 28 which is a heat conducting member, and a plurality of main pressure bonding attachments 29.
　熱伝導部材である金属からなる枠体２８は、本圧着用アタッチメント２９を保持するとともに本圧着用ヒーターブロック１８が蓄積した熱を本圧着用アタッチメント２９に伝えるものである。枠体２８は、矩形状のブロックに段つき部を有する貫通孔２８ａが形成されている。枠体２８は、貫通孔２８ａの開口部が形成されている側面のうち大きい方の開口部が形成されている側面が本圧着用ヒーターブロック１８の他側側面に接触するようにしてねじ等で締結されている。つまり、枠体２８は、貫通孔２８ａのうち小さい方の開口部が本圧着用ステージ１４と対向するように配置されている。また、枠体２８は、本圧着用ヒーターブロック１８の本圧着用ヒーター１８ａの近傍に配置されている。なお、本実施形態において、枠体２８を矩形状としたがこれに限定されるものではなく、円柱形などでもよい。 The frame 28 made of a metal that is a heat conducting member holds the main crimping attachment 29 and transmits the heat accumulated in the main crimping heater block 18 to the main crimping attachment 29. The frame body 28 is formed with a through hole 28a having a stepped portion in a rectangular block. The frame body 28 is screwed or the like so that the side surface on which the larger opening portion is formed out of the side surfaces on which the opening portion of the through hole 28a is formed contacts the other side surface of the main crimping heater block 18. It is concluded. In other words, the frame body 28 is disposed so that the smaller opening of the through hole 28 a faces the main crimping stage 14. Further, the frame body 28 is disposed in the vicinity of the main pressure bonding heater 18 a of the main pressure bonding heater block 18. In the present embodiment, the frame body 28 has a rectangular shape, but the present invention is not limited to this and may be a cylindrical shape.
　本圧着用アタッチメント２９は、チップ部品Ｄに接触して圧力と熱とを伝えるものである。本圧着用アタッチメント２９は、本圧着用ヒーターブロック１８の他側側面と枠体２８とで囲われた枠体２８の内部（貫通孔２８ａ内）に配置されている。また、本圧着用ヒーターブロック１８と本圧着用アタッチメント２９との間には、弾性部材である耐熱性のゴム部材２９ａが配置されている。本圧着用アタッチメント２９は、複数のチップ部品Ｄの実装誤差に応じてゴム部材２９ａが本圧着用ヒーターブロック１８と本圧着用アタッチメント２９とによって圧縮されるように構成されている。これにより、本圧着用アタッチメント２９は、仮圧着されたチップ部品Ｄの実装誤差を吸収することができる。本圧着用アタッチメント２９は、枠体２８の貫通孔２８ａのうち小さい方の開口部に摺動自在に挿入されている。さらに、本圧着用アタッチメント２９は、側面からＸ方向またはＹ方向に突出する突出部２９ｂが設けられ、枠体２８の貫通孔２８ａの段つき部分に突出部２９ｂが接触している。つまり、本圧着用アタッチメント２９は、突出部２９ｂが枠体２８の貫通孔２８ａの段つき部分に接触することで枠体２８に保持されている。さらに、本圧着用アタッチメント２９は、貫通孔２８ａに摺動自在に挿入されることで枠体２８に接触した状態でＺ軸方向に移動可能に構成されている。 The main attachment 29 is for contacting the chip part D and transmitting pressure and heat. The main press-bonding attachment 29 is disposed inside the frame body 28 (inside the through hole 28a) surrounded by the other side surface of the main press-bonding heater block 18 and the frame body 28. In addition, a heat-resistant rubber member 29a, which is an elastic member, is disposed between the main-compression heater block 18 and the main-compression attachment 29. The main crimping attachment 29 is configured such that the rubber member 29 a is compressed by the main crimping heater block 18 and the main crimping attachment 29 in accordance with mounting errors of the plurality of chip components D. As a result, the main-bonding attachment 29 can absorb the mounting error of the temporarily pressed chip component D. The main crimping attachment 29 is slidably inserted into the smaller opening of the through holes 28 a of the frame 28. Further, the main attachment 29 is provided with a protruding portion 29b protruding from the side surface in the X direction or the Y direction, and the protruding portion 29b is in contact with the stepped portion of the through hole 28a of the frame body 28. That is, the main crimping attachment 29 is held by the frame body 28 when the protruding portion 29 b contacts the stepped portion of the through hole 28 a of the frame body 28. Further, the main crimp attachment 29 is configured to be movable in the Z-axis direction while being in contact with the frame body 28 by being slidably inserted into the through hole 28a.
　以下では、本発明に係る実装装置１の本圧着時における本圧着用ヘッド２７の熱が伝達される態様について詳細に説明する。 Hereinafter, a mode in which heat of the main press-bonding head 27 is transmitted during the main press-bonding of the mounting apparatus 1 according to the present invention will be described in detail.
　図１０（ｂ）に示すように、実装装置１の制御装置２３は、本圧着用ヘッド２７の本圧着用ヒーター１８ａを発熱させる。所定の温度まで昇温された本圧着用ヒーターブロック１８に蓄積されている熱は、枠体２８を通じて枠体２８の貫通孔２８ａに挿入されている本圧着用アタッチメント２９に伝わる（薄墨矢印参照）。 As shown in FIG. 10B, the control device 23 of the mounting apparatus 1 causes the main crimping heater 18a of the main crimping head 27 to generate heat. The heat accumulated in the main crimping heater block 18 heated to a predetermined temperature is transmitted through the frame 28 to the main crimping attachment 29 inserted in the through hole 28a of the frame 28 (see thin ink arrow). .
　次に、実装装置１の制御装置２３は、本圧着用ユニット１６を駆動させて本圧着用ヘッド２７を本圧着用ステージ１４に近接する方向に移動させる。本圧着用アタッチメント２９は、チップ部品Ｄに接触すると、本圧着用ユニット１６の加圧力によってゴム部材２９ａが圧縮されることで本圧着用ヒーターブロック１８を基準としてＺ軸方向に移動する（図１０（ａ）参照）。 Next, the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 27 in a direction close to the main pressure bonding stage 14. When the main crimping attachment 29 comes into contact with the chip component D, the rubber member 29a is compressed by the pressure of the main crimping unit 16 to move in the Z-axis direction with respect to the main crimping heater block 18 (FIG. 10). (See (a)).
　本圧着用アタッチメント２９は、枠体２８の小さい方の開口部に接触した状態で保持されている。このため、本圧着用アタッチメント２９は、熱伝導部材である枠体２８との間で熱伝導可能な状態でＺ軸方向に移動する。これにより、本圧着用アタッチメント２９には、ゴム部材１９ａが圧縮されることによって本圧着用アタッチメント２９がＺ軸方向に移動しても枠体２８を介して本圧着用ヒーターブロック１８から熱が供給されている。 The main crimp attachment 29 is held in contact with the smaller opening of the frame 28. For this reason, the main-bonding attachment 29 moves in the Z-axis direction in a state where heat can be transferred to and from the frame body 28 which is a heat conducting member. As a result, heat is supplied to the main crimping attachment 29 from the main crimping heater block 18 via the frame 28 even if the main crimping attachment 29 moves in the Z-axis direction due to the compression of the rubber member 19a. Has been.
　以下に、図１１を用いて、本発明の第四実施形態に係る本圧着用ヘッド３０について説明する。 Hereinafter, a main pressure bonding head 30 according to a fourth embodiment of the present invention will be described with reference to FIG.
　図１１（ａ）に示すように、実装用ヘッドである本圧着用ヘッド３０は、本圧着用ユニット１６（図１参照）の駆動力（加圧力）をチップ部品Ｄに伝達するものである。本圧着用ヘッド３０は、本圧着用ヒーターブロック３１、熱伝導部材である金属からなるばね３２および複数の本圧着用アタッチメント３３が設けられている。 As shown in FIG. 11A, the main pressure bonding head 30 which is a mounting head transmits the driving force (pressing force) of the main pressure bonding unit 16 (see FIG. 1) to the chip component D. The main pressure bonding head 30 is provided with a main pressure bonding heater block 31, a spring 32 made of metal which is a heat conducting member, and a plurality of main pressure bonding attachments 33.
　本圧着用ヒーターブロック３１は、直方体に形成され、その一側側面が本圧着用ユニット１６の取り付け部１６ａに取り付けられている（図３参照）。また、本圧着用ヒーターブロック３１には、一側側面の裏側の他側側面の近傍にカートリッジヒータから構成されている本圧着用ヒーター３１ａが組み込まれている。本圧着用ヒーターブロック３１の他側側面には、ばね３２の内装空間３１ｂが構成されている。内装空間３１ｂは、本圧着用ヒーターブロック３１の他側側面に形成された凹部または穴から構成されている。内装空間３１ｂは、ばね３２が配置可能な大きさに形成されている。また、内装空間３１ｂの本圧着用ステージ１４と対向する側の開口部には、ばね３２を支持する係合部３１ｃが構成されている。係合部３１ｃは、内装空間３１ｂの開口部から内側に突出した凸部から構成されている。係合部３１ｃは、ばね３２を支持可能な大きさに形成されている。なお、本実施形態において、内装空間３１ｂ、係合部３１ｃは、本圧着用ヒーターブロック３１を加工して形成されているがこれに限定されるものではなく、複数の本圧着用ヒーターブロック３１を所定の間隔で配置して内装空間３１ｂを構成してもよい。また、係合部３１ｃを、本圧着用ヒーターブロック３１に取り付けた板状部材等から構成してもよい。 The main pressure bonding heater block 31 is formed in a rectangular parallelepiped shape, and one side surface thereof is attached to the attachment portion 16a of the main pressure bonding unit 16 (see FIG. 3). Further, the main pressure bonding heater block 31 incorporates a main pressure bonding heater 31a formed of a cartridge heater in the vicinity of the other side surface on the back side of the one side surface. An interior space 31 b of the spring 32 is formed on the other side surface of the main pressure bonding heater block 31. The interior space 31b is configured by a recess or a hole formed on the other side surface of the main pressure bonding heater block 31. The interior space 31b is formed in such a size that the spring 32 can be arranged. In addition, an engagement portion 31c that supports the spring 32 is formed in the opening portion of the interior space 31b on the side facing the main crimping stage 14. The engaging part 31c is composed of a convex part protruding inward from the opening part of the interior space 31b. The engaging portion 31c is formed in a size capable of supporting the spring 32. In the present embodiment, the interior space 31b and the engaging portion 31c are formed by processing the main crimping heater block 31, but the present invention is not limited to this, and a plurality of main crimping heater blocks 31 are provided. The interior space 31b may be configured by being arranged at a predetermined interval. Moreover, you may comprise the engaging part 31c from the plate-shaped member attached to the heater block 31 for this press-fit.
　熱伝導部材である金属からなるばね３２は、本圧着用アタッチメント３３を保持するとともに本圧着用ヒーターブロック３１が蓄積した熱を本圧着用アタッチメント３３に伝えるものである。ばね３２は、圧縮ばねから構成されている。ばね３２は、本圧着用ヒーターブロック３１の内装空間３１ｂに配置されている。この際、ばね３２は、一側端が本圧着用ヒーターブロック３１の係合部３１ｃに支持されている。つまり、ばね３２は、本圧着用ヒーターブロック３１に接続されている。 The spring 32 made of metal which is a heat conducting member holds the main pressure bonding attachment 33 and transmits heat accumulated in the main pressure bonding heater block 31 to the main pressure bonding attachment 33. The spring 32 is composed of a compression spring. The spring 32 is disposed in the interior space 31 b of the main pressure bonding heater block 31. At this time, one end of the spring 32 is supported by the engaging portion 31 c of the main crimping heater block 31. That is, the spring 32 is connected to the main crimping heater block 31.
　本圧着用アタッチメント３３は、チップ部品Ｄに接触して圧力と熱とを伝えるものである。本圧着用アタッチメント３３は、チップ部品Ｄを加圧および加熱する加工部３３ａとばね３２から加工部３３ａに熱を伝える伝熱部３３ｂとから構成されている。加工部３３ａは、チップ部品Ｄの形状に対応した形状に形成されている。伝熱部３３ｂは、棒状部材から形成されている。本圧着用アタッチメント３３は、伝熱部３３ｂの一側端部に加工部３３ａが接続されて構成されている。また、本圧着用アタッチメント３３は、伝熱部３３ｂの他側端部が拡径されてばね３２が係合可能に構成されている。本圧着用アタッチメント３３は、伝熱部３３ｂが本圧着用ヒーターブロック３１の内装空間３１ｂに摺動自在に挿入されている。そして、本圧着用アタッチメント３３は、伝熱部３３ｂの他側端部がばね３２の他側端に係合している。つまり、本圧着用アタッチメント３３は、ばね３２に接続されている。これにより、本圧着用アタッチメント３３は、本圧着用ヒーターブロック３１に内装されているばね３２に支持されている。 The main attachment 33 is for contacting the chip part D and transmitting pressure and heat. The main bonding attachment 33 includes a processing part 33a that pressurizes and heats the chip part D and a heat transfer part 33b that transfers heat from the spring 32 to the processing part 33a. The processing part 33a is formed in a shape corresponding to the shape of the chip part D. The heat transfer part 33b is formed from a rod-shaped member. The main-bonding attachment 33 is configured by connecting a processing portion 33a to one end portion of the heat transfer portion 33b. Further, the main pressure bonding attachment 33 is configured such that the other end portion of the heat transfer portion 33b is enlarged in diameter so that the spring 32 can be engaged therewith. The main pressure bonding attachment 33 has a heat transfer portion 33b slidably inserted into the interior space 31b of the main pressure bonding heater block 31. Further, the other end of the heat transfer part 33 b is engaged with the other end of the spring 32. That is, the main pressure bonding attachment 33 is connected to the spring 32. Thereby, the main press-bonding attachment 33 is supported by the spring 32 provided in the main press-bonding heater block 31.
　本圧着用ヒーターブロック３１と本圧着用アタッチメント３３との間には、弾性部材である耐熱性のゴム部材３３ｃが配置されている。ゴム部材３３ｃは、略中央に本圧着用アタッチメント３３の伝熱部３３ｂが挿入される孔が形成されている。つまり、ゴム部材３３ｃは、伝熱部３３ｂを囲うようにして配置されている。このように構成することで、本圧着用アタッチメント３３は、実装誤差を吸収するために必要なゴム部材３３ｃの圧縮量を確保するとともにゴム部材３３ｃの圧縮量の偏りによる位置ズレが抑制される。なお、本実施形態において、ゴム部材３３ｃは、本圧着用ヒーターブロック３１と本圧着用アタッチメント３３とに固定されていなくてもよい。また、ゴム部材３３ｃは、伝熱部３３ｂの周囲に分割して配置されていてもよい。 Between the main pressure bonding heater block 31 and the main pressure bonding attachment 33, a heat resistant rubber member 33c, which is an elastic member, is disposed. The rubber member 33c is formed with a hole into which the heat transfer portion 33b of the main pressure bonding attachment 33 is inserted at a substantially center. That is, the rubber member 33c is disposed so as to surround the heat transfer portion 33b. With this configuration, the main-bonding attachment 33 secures a compression amount of the rubber member 33c necessary to absorb mounting errors and suppresses a positional shift due to an uneven compression amount of the rubber member 33c. In the present embodiment, the rubber member 33 c may not be fixed to the main pressure bonding heater block 31 and the main pressure bonding attachment 33. Moreover, the rubber member 33c may be divided | segmented and arrange | positioned around the heat-transfer part 33b.
　本圧着用アタッチメント３３の伝熱部３３ｂは、本圧着用ヒーターブロック３１の係合部３１ｃと伝熱部３３ｂの他側端部との間に配置されているばね３２が所定量だけたわむ長さに構成されている。つまり、本圧着用アタッチメント３３は、ばね３２のたわみによってゴム部材３３ｃが圧縮された状態で本圧着用ヒーターブロック３１に支持されている。本圧着用アタッチメント３３は、内装空間３１ｂに摺動自在に挿入されることでばね３２に接触した状態でＺ軸方向に移動可能に構成されている。なお、本実施形態において、ばね３２を圧縮ばねから構成したがこれに限定するものではなく、本圧着用アタッチメント３３を本圧着用ヒーターブロック３１に引き付けるように引っ張りばねを配置する構成でもよい。また、本実施形態において、一つの本圧着用アタッチメント３３に一つの伝熱部３３ｂとばね３２とを設けているがこれに限定されるものではなく、一つの一つの本圧着用アタッチメント３３に複数の伝熱部３３ｂとばね３２とを設ける構成でもよい。 The heat transfer portion 33b of the main pressure bonding attachment 33 is a length by which the spring 32 disposed between the engaging portion 31c of the main pressure bonding heater block 31 and the other end of the heat transfer portion 33b bends by a predetermined amount. It is configured. That is, the main pressure bonding attachment 33 is supported by the main pressure bonding heater block 31 in a state where the rubber member 33 c is compressed by the deflection of the spring 32. The main-bonding attachment 33 is configured to be movable in the Z-axis direction while being in contact with the spring 32 by being slidably inserted into the interior space 31b. In the present embodiment, the spring 32 is constituted by a compression spring. However, the present invention is not limited to this, and a configuration in which a tension spring is disposed so as to attract the main pressure bonding attachment 33 to the main pressure bonding heater block 31 may be employed. Further, in the present embodiment, one heat transfer part 33b and the spring 32 are provided in one main pressure bonding attachment 33, but the present invention is not limited to this. The heat transfer part 33b and the spring 32 may be provided.
　以下では、本発明に係る実装装置１の本圧着時における本圧着用ヘッド３０の熱が伝達される態様について詳細に説明する。 Hereinafter, a mode in which heat of the main press-bonding head 30 during the main press-bonding of the mounting apparatus 1 according to the present invention is transmitted will be described in detail.
　図１１（ｂ）に示すように、実装装置１の制御装置２３は（図４参照）、本圧着用ヘッド３０の本圧着用ヒーター３０ａを発熱させる。所定の温度まで昇温された本圧着用ヒーターブロック３１に蓄積されている熱は、ばね３２に支持されている本圧着用アタッチメント３３の伝熱部３３ｂに伝わる（薄墨矢印参照）。 As shown in FIG. 11B, the control device 23 of the mounting apparatus 1 (see FIG. 4) causes the main crimping heater 30a of the main crimping head 30 to generate heat. The heat accumulated in the main pressure bonding heater block 31 that has been heated to a predetermined temperature is transmitted to the heat transfer portion 33b of the main pressure bonding attachment 33 supported by the spring 32 (see thin ink arrow).
　次に、実装装置１の制御装置２３は、本圧着用ユニット１６を駆動させて本圧着用ヘッド３０を本圧着用ステージ１４に近接する方向に移動させる（図１参照）。本圧着用アタッチメント３３は、チップ部品Ｄに接触すると、本圧着用ユニット１６の加圧力によってゴム部材３３ｃが圧縮されることで本圧着用ヒーターブロック３１を基準としてＺ軸方向に移動する（図１１（ａ）参照）。 Next, the control device 23 of the mounting apparatus 1 drives the main pressure bonding unit 16 to move the main pressure bonding head 30 in a direction close to the main pressure bonding stage 14 (see FIG. 1). When the main pressing attachment 33 comes into contact with the chip component D, the rubber member 33c is compressed by the pressing force of the main pressing unit 16 to move in the Z-axis direction with reference to the main pressing heater block 31 (FIG. 11). (See (a)).
　本圧着用アタッチメント３３は、伝熱部３３ｂがばね３２に接触した状態で保持されている。このため、本圧着用アタッチメント３３は、伝熱部３３ｂとばね３２との間で熱伝導可能な状態でＺ軸方向に移動する。これにより、本圧着用アタッチメント３３には、ゴム部材３３ｃが圧縮されることによって本圧着用アタッチメント３３がＺ軸方向に移動してもばね３２を介して本圧着用ヒーターブロック３１から熱が供給されている。 The main attachment 33 is held in a state where the heat transfer portion 33 b is in contact with the spring 32. For this reason, the main-bonding attachment 33 moves in the Z-axis direction in a state in which heat conduction is possible between the heat transfer section 33 b and the spring 32. As a result, heat is supplied to the main crimping attachment 33 from the main crimping heater block 31 via the spring 32 even if the main crimping attachment 33 moves in the Z-axis direction due to the compression of the rubber member 33c. ing.
　このように構成される本圧着用ヘッド３０を用いることで、ばね３２がたわんだ状態で本圧着用アタッチメント３３を支持しているので、加圧時にゴム部材３３ｃが圧縮されても本圧着用アタッチメント３３とばね３２との間に相対的な移動が生じない。また、本圧着用ヘッド３０は、本圧着用ヒーターブロック３１の内部にばね３２が内装されているので本圧着用アタッチメント３３の周囲にばね等を配置する必要がない。これにより、複数の本圧着用アタッチメント３３を近接して配置することができる。これにより、本圧着用アタッチメント３３を加熱しつつ、チップ部品Ｄの加圧方向の位置のばらつきをゴム部材３３ｃで吸収することができる。 By using the main pressure bonding head 30 configured as described above, the main pressure bonding attachment 33 is supported in a state in which the spring 32 is bent. Therefore, even when the rubber member 33c is compressed during pressurization, the main pressure bonding attachment is provided. There is no relative movement between 33 and the spring 32. In addition, since the main press-bonding head 30 has the spring 32 built in the main-compression-bonding heater block 31, it is not necessary to arrange a spring or the like around the main-bonding attachment 33. Thereby, the some attachment 33 for main press-bonding can be arrange | positioned closely. Thereby, the variation in the position of the chip component D in the pressing direction can be absorbed by the rubber member 33c while heating the main pressure bonding attachment 33.
　本発明は、実装用ヘッドおよびそれを用いた実装装置に関する。詳しくは、チップ部品等を回路基板に実装する実装用ヘッドおよびそれを用いた実装装置に利用することができる。 The present invention relates to a mounting head and a mounting apparatus using the same. Specifically, it can be used for a mounting head for mounting a chip component or the like on a circuit board and a mounting apparatus using the mounting head.
　　　１　　実装装置
　　１７　　本圧着ヘッド
　　１８　　本圧着用ヒーターブロック
　　１９　　ばね
　　２０　　本圧着用アタッチメント
　　２０ａ　ゴム部材
　　　Ｃ　　回路基板
　　　Ｄ　　チップ部品 DESCRIPTION OF SYMBOLS 1 Mounting apparatus 17 This crimping head 18 This crimping heater block 19 Spring 20 This crimping attachment 20a Rubber member C Circuit board D Chip component

Claims (6)

  1. 　チップ部品を加熱および加圧して回路基板の所定位置に接続する実装用ヘッドであって、
    　チップ部品と接触するアタッチメントと、
    　アタッチメントを加熱するヒーターブロックと、
    　アタッチメントとヒーターブロックとの間に配置され、加圧時にアタッチメントとヒーターブロックとによって圧縮される弾性部材と、
    　アタッチメントとヒーターブロックとに接続され、加圧時に変形してアタッチメントに追従する熱伝導部材と、を具備する実装用ヘッド。     A mounting head that heats and pressurizes a chip component and connects it to a predetermined position on a circuit board,
    An attachment that contacts the chip component;
    A heater block for heating the attachment;
    An elastic member that is disposed between the attachment and the heater block and is compressed by the attachment and the heater block when pressurized;
    A mounting head comprising: a heat conduction member connected to the attachment and the heater block and deformed when pressed to follow the attachment.
  2. 　前記熱伝導部材がばねから構成され、前記アタッチメントを保持する請求項１に記載の実装用ヘッド。 The mounting head according to claim 1, wherein the heat conducting member is formed of a spring and holds the attachment.
  3. 　前記弾性部材が０．１ｍｍ以上１ｍｍ以下の厚さの板状部材から構成される請求項１または請求項２に記載の実装用ヘッド。 The mounting head according to claim 1 or 2, wherein the elastic member is formed of a plate-like member having a thickness of 0.1 mm or more and 1 mm or less.
  4. 　前記アタッチメントのうち前記チップ部品が接触している部分が０．５ｍｍ以上５ｍｍ以下の厚さに構成される請求項１から請求項３のいずれか一項に記載の実装用ヘッド。 The mounting head according to any one of claims 1 to 3, wherein a portion of the attachment that is in contact with the chip component is configured to have a thickness of 0.5 mm or more and 5 mm or less.
  5. 　前記ヒーターブロックに前記ばねの内装空間が構成され、ばねがたわんだ状態で内装空間に配置される請求項１から請求項４のいずれか一項に記載の実装用ヘッド。 The mounting head according to any one of claims 1 to 4, wherein an interior space of the spring is configured in the heater block, and the spring is bent and disposed in the interior space.
  6. 　請求項１から請求項５のいずれか一項に記載の実装用ヘッドによってチップ部品を加熱するとともに所定の荷重で加圧してチップ部品を回路基板に接続する実装装置。 A mounting apparatus for connecting a chip component to a circuit board by heating the chip component with the mounting head according to any one of claims 1 to 5 and pressurizing the chip component with a predetermined load.
PCT/JP2015/073821 2014-08-25 2015-08-25 Mounting head and mounting device in which same is used WO2016031806A1 (en)

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JP2020107621A (en) * 2018-12-26 2020-07-09 アサヒ・エンジニアリング株式会社 Mounting device of electronic component
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CN113793894B (en) * 2021-08-20 2024-03-29 宁波大学 SQUID chip pressure welding device and pressure welding method
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