JP2008108888A - Device and method for mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device capable of raising positioning accuracy, so as to densely performing mounting even in a wiring substrate with an electronic component previously mounted thereon, by performing mounting while reliably keeping the bent shape of a flexible substrate, and to provide a substrate mounting method. <P>SOLUTION: The substrate mounting device includes a suction keeping means 8 for absorbing and holding the whole body of the flexible substrate 2 in the bent shape. The flexible substrate 2, which is kept in shape, is mounted on the wiring substrate 1 by positioning. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an apparatus and method for mounting a flexible substrate with high accuracy.

  In recent years, in order to reduce the size of home appliances, wireless devices, and the like, high-density mounting is often performed in which a flexible substrate is mounted on a wiring substrate so that the shape of the entire substrate is three-dimensional. Further, as an example of using a flexible substrate, there is one in which a flexible substrate is mounted at a central portion where electronic components are mounted around a wiring substrate. When such mounting is performed, there is an advantage that a connector for connecting the substrates can be eliminated, and the degree of freedom in design is increased.

  Patent Document 1 shows an example in which one end of a plurality of flexible boards on which semiconductor memories are mounted is mounted on a wiring board while maintaining an acute inclination angle θ. When mounting one end of the flexible board on the wiring board, the flexible board is tilted while holding the joints other than the flexible board, and the joints formed with a long wiring pattern of a conductive paste system or metal foil are opposed to each other. After pressing this joint with a glass plate, the joint was irradiated with a laser beam to connect the wires by thermal welding. Only the portion irradiated with the laser beam in the joint portion in which the long wiring pattern is formed is wire-joined, thereby forming a good connection with hardly causing thermal deformation between the flexible substrate and the wiring substrate. Such a connection method is also performed at the central portion of the wiring board to mount a plurality of semiconductor memories.

JP-A-6-227188 (FIGS. 2 and 4)

  In the conventional mounting method as described above, when the flexible substrate is tilted and held, other than the bonding portion is held and the bonding portion is pressed and fixed by the glass plate. A position shift of several microns occurs in the end direction on the part side. That is, there is a problem in that the alignment accuracy from the bent portion to the end portion on the joint portion side cannot be sufficiently increased. Therefore, the wiring corresponding to the electrodes on the flexible substrate side or the junction portion of the wiring substrate must be formed long from the bent portion to the end portion on the junction portion, so sufficient high-density mounting with a shortened junction portion must be performed. There was a problem that could not be. Furthermore, when a plurality of electrodes are provided in the direction from the bent part to the end part on the joint part side, a wide joint part that separates the electrodes is necessary, and high-density mounting cannot be performed sufficiently. there were.

  The present invention has been made to solve the above-described problems. By mounting while keeping the bent shape of the flexible substrate securely, alignment accuracy can be improved even on a wiring substrate on which electronic components are already mounted. It is an object of the present invention to obtain a mounting apparatus and a substrate mounting method that perform high-density mounting.

  The mounting apparatus according to the present invention includes suction holding means for holding the flexible substrate in a bent shape. Then, the flexible substrate is aligned with the wiring substrate and mounted while maintaining the shape.

  According to the present invention, mounting can be performed at a high density with high alignment accuracy even on a wiring board on which electronic components have already been mounted, by mounting while keeping the shape of the flexible board securely.

Embodiment 1 FIG.
FIG. 1 is a schematic configuration diagram of a mounting apparatus according to Embodiment 1 of the present invention. An electronic component 3 is mounted on the wiring substrate 1 in addition to the region where the flexible substrate 2 is mounted. The wiring substrate 1 is fixed on the substrate stage 4 by means (not shown) such as vacuum suction or a clamp mechanism. The substrate stage 4 is supported by a relative position moving means 7 having a θ table 5 for adjusting the inclination and an XY table 6 driven in the XY directions, and is relatively moved with respect to the suction holding means 8 for sucking and holding the flexible substrate 2. it can.

  The suction holding means 8 has a horizontal plane 9 parallel to the substrate stage 4 and an inclined surface 10 inclined with respect to the substrate stage 4. The horizontal surface 9 and the inclined surface 10 constitute a bent surface. Suction holes 11 are provided in the horizontal and inclined surfaces of the suction holding means 8 so that the flexible substrate 2 can be sucked and held in a bent shape. The suction holding means 8 is guided by the linear guide 12 and is driven by the actuator 13 to move in the Z-axis direction. The suction holding means 8 is supported by the load detection means 14. The load detection means 14 detects a load that presses the flexible substrate 2 against the wiring substrate 1 through the anisotropic conductive resin 15.

  The molding die 16 which is a bending molding means is formed so that the flexible substrate 2 is bent in a predetermined state. The molding die 16 is formed with a recess 17 in which the tip of the suction holding means 8 including a part of the horizontal surface 9 and the inclined surface 10 can enter and exit with a certain gap. The concave portion 17 has a bent surface facing the bent surface of the suction holding means 8 on the inner surface. Further, the molding die 16 is formed with a gentle slope portion 18 that is connected to the slope portion 17a of the concave portion 17 and sloped at an angle gentler than the slope angle of the slope portion 17a. The molding die 16 is supported by the θ table 5 and the XY table 6 and can be moved relative to the suction holding means 8.

  FIG. 2 is a detailed view of the joint in FIG. 1, and FIG. 3 is a diagram showing the electrode arrangement of the flexible substrate 2. In the drawings, the same symbols are the same or equivalent. Two rows of electrodes 19 arranged in the Y-axis direction are arranged in the X-axis direction at the joint portion 2 a of the flexible substrate 2. 2b is a bent portion of the flexible substrate 2, and 2c is an inclined surface bent by the bent portion 2b of the flexible substrate 2. The same number of electrodes 20 as the electrodes 19 are arranged at the joint 1 a of the wiring board 1 facing the joint 2 a of the flexible substrate 2. Conductive particles 21 are mixed in the anisotropic conductive resin 15. Commonly used conductive particles 21 are spheres having a diameter of 3 to 5 microns with a nickel layer, a gold plating layer from the inside, and an insulating layer on the outermost side. When pressure is applied to the joint portion 1a and the joint portion 2a, the conductive particles 21 dispersed in the resin overlap while contacting between the two electrode surfaces, and the plated layers are attracted to each other to conduct electricity between the two electrode surfaces. Form a pathway. Since the conductive particles 21 in the resin part to which no pressure is applied hold the insulating layer, the insulation between the electrodes arranged side by side is held. Thereby, even if the space | interval of electrodes is narrow, an electronic component can be mounted, without raise | generating a short circuit.

Next, the operation will be described.
Step 1: FIG. 4 is a diagram showing a state before the flexible substrate 2 is bent, in which the wiring substrate 1 and the flexible substrate 2 are set. The wiring substrate 1 is placed on the substrate stage 4 so that the electrode 20 to be bonded is facing upward, and is fixed by means (not shown) such as vacuum suction or a clamp mechanism. The flexible substrate 2 is placed at a predetermined position of the molding die 16 so that the electrode 19 to be joined is directed downward. If necessary, a suction hole may be provided in the molding die 16 and a part of the flexible substrate 2 may be fixed by suction.

  Step 2: The θ table 5 and the XY table 6 are driven by θ direction driving means and XY direction driving means (not shown) to move the molding die 16 directly below the suction holding means 8.

  Step 3: As shown in FIG. 5, the actuator 13 is driven, the suction holding means 8 is lowered, and the flexible substrate 2 in the molding die 16 is pressed. The actuator 13 also functions as a pressurizing unit. At this time, the force for pressing the flexible substrate 2 against the molding die 16 is detected by the load detecting means 14 and fed back to the actuator 13 by a control means (not shown). By performing feedback control, it can be stably pressed with a predetermined load. When the suction holding means 8 sucks the flexible substrate 2 as described above, the flexible substrate 2 is bent according to the shape of the horizontal plane and the inclined surface of the suction holding means 8 using the suction holding means 8 and the molding die 16. The suction holding means 8 can be sucked and held by the suction holding means 8 in a state where the flexible substrate 2 is bent by evacuating the suction holding means 8 with a pump (not shown).

  Step 4: Recognize alignment marks on the wiring board 1 and the flexible board 2 by a recognition means (not shown). Further, the necessary movement amounts of the θ table 5 and the XY table 6 are calculated by a calculation means (not shown), and the θ table 5 and the XY table 6 are driven by a control means (not shown) to align the wiring board 1 and the flexible board 2.

  Step 5: As shown in FIG. 1, the actuator 13 is driven to lower the suction holding means 8 to bring the flexible substrate 2 into contact with the wiring substrate 1 coated with the anisotropic conductive resin 15. Further, by pressing with a predetermined pressure, the electrode 19 of the flexible substrate 2 and the electrode 20 of the wiring substrate 1 are bonded by pressure, and the flexible substrate 2 is mounted on the wiring substrate 1. The actuator 13 acts as a bonding forming means for bonding the electrode 20 of the wiring board 1 and the electrode 19 of the flexible board 2.

  As described above, when the two rows of the electrodes 19 of the flexible substrate 2 and the two rows of the electrodes 20 of the wiring substrate 1 are bonded by pressure bonding, the flexible substrate 2 is bent at the joints and inclined surfaces on both sides of the bent portion. Since the suction holding means 8 holds the suction, the shape of the flexible substrate 2 does not change even when pressure is applied by the suction holding means 8, and no positional deviation occurs between the electrodes. Thereby, highly accurate mounting can be performed. Moreover, since the flexible substrate 2 is adsorbed and held in a bent state, each electrode can be pressurized with an equal force. As a result, a highly reliable and good bond can be formed.

  As described above, in the substrate actual device and the substrate mounting method of the present embodiment, the wiring corresponding to the electrodes on the flexible substrate side or the junction portion of the wiring substrate is formed long from the bent portion to the end portion on the junction portion side. Unlike the case where the electrodes of the joint portion are short, by mounting while keeping the bent shape of the flexible substrate 2 securely, the alignment accuracy can be improved even on the wiring substrate on which the electronic component is already mounted. Mounting can be performed with high density. Moreover, even when a plurality of electrode arrays are arranged, by mounting while keeping the shape of the flexible substrate 2 securely, the alignment accuracy can be improved even on a wiring substrate on which electronic components are already mounted. Can be implemented.

  In addition, although the electrode arrangement of the flexible substrate 2 has been described in the case of two rows as shown in FIG. 3, the alignment accuracy can be obtained even when the three rows of electrodes are arranged in a staggered pattern as shown in FIG. Can be mounted with high density. Further, the present invention can be applied to other shapes of electrode arrangement. Further, the material and size of the conductive particles 21 are not limited to those given as examples.

  The relative movement between the suction holding means 8 and the molding die 16 and the relative movement between the suction holding means 8 and the substrate stage 4 as the relative position moving means 7 are the θ table 5 and the XY table 6 and the substrate stage 4 and the molding die. Although the structure for moving the mold 16 has been described, the relative position moving means 7 is not limited to this. For example, a structure in which a Z-axis base that performs Z-axis driving is moved in the θ direction and the XY direction by a driving means (not shown). It is good. Here, the Z-axis base is composed of the suction holding means 8, the load detection means 14, the linear guide 12 and the actuator 13 in FIG. 1.

  Further, although the pressurizing means for driving and pressurizing in the Z-axis direction has been described with the actuator 13, a servo motor, linear motor, or cylinder may be used. Further, the load detecting means 14 is not always necessary, and the load detecting means 14 may be pressed with a constant thrust of the actuator 13 without using the load detecting means 14.

Embodiment 2. FIG.
In the first embodiment, the case where a molding die is used as the bending molding means has been described. However, the flexible substrate 2 may be provided with a movable portion having a facing surface that can face the bending surface of the suction holding means. Can be bent according to the shape of the suction surface of the suction holding means, and the flexible substrate 2 can be bent and held in a bent state. This will be described below.

  FIG. 7 is a diagram for explaining the bending and adsorption of the substrate according to the second embodiment of the present invention. FIGS. 7A and 7B show the state before bending the flexible substrate 2 and the bending of the flexible substrate 2, respectively. The state of being sucked and held by the suction holding means 8 is shown. In the drawings, the same symbols are the same or equivalent. Reference numeral 22 denotes a bending molding means. 23 is a supply base for the bending molding means 22 for placing the flexible substrate 2, 23 a and 23 b are guides for positioning one side of the flexible substrate 2 and the joining end surface, and 24 is capable of facing the inclined surface 10 of the suction holding means 8. This is a bending tool of the bending molding means 22 provided with an opposing surface 24a. When the flexible substrate 2 is bent, the bending surface of the bending molding means 22 is constituted by the upper surface of the supply base 23 on the guide 23b side and the facing surface 24a. The bending tool 24 is guided so as to move linearly by a guide (not shown), and is linearly driven by a bending tool driving means 25 (not shown).

  Next, the operation will be described. The flexible substrate 2 is supplied so that the electrode 19 to be bonded is directed downward, and set to the guides 23a and 23b of the supply base 23 so as to contact one side of the side surface of the flexible substrate 2 and the bonding end surface. Next, when the bending tool 24 is driven in the direction of the suction holding means 8, the upper part of the bending tool 24 pushes up a part of the flexible substrate 2. Then, as shown in FIG. 7B, the opposing surface 24a of the bending tool 24 presses the flexible substrate 2 with the suction holding means 8 so that the flexible substrate 2 is bent, and the suction holding means is pumped by a pump (not shown). The suction holding means 8 can be sucked and held in a state where the inside of 8 is evacuated and the flexible substrate 2 is bent.

  As described above, the bending molding means of the present embodiment can be sucked and held by the sucking and holding means at the joint portions and the inclined surfaces on both sides of the bending portion in a state where the flexible substrate 2 is bent. The board mounting apparatus provided with the bending molding means can be mounted at high density on the wiring board on which electronic components have already been mounted in the same manner as in the first embodiment with high alignment accuracy. Further, unlike the first embodiment, the bending molding means of the present embodiment is configured so that the opposed surface 24a of the bending tool 24 covers almost the entire area of the inclined surface 2c of the flexible substrate 2 to the inclined surface 10 of the suction holding means 8. Since it can be pressed, the flexible substrate 2 can be adsorbed even with a pump having a small capacity. Therefore, the pump can be miniaturized.

  In the above description, the driving direction of the bending tool 24 is different from the vertical direction of the facing surface 24a of the bending tool 24. However, the bending tool 24 is driven in a direction substantially coincident with the vertical direction of the facing surface 24a of the bending tool 24. It doesn't matter. By doing so, the flexible substrate 2 can be bent using the force for driving the bending tool 24 efficiently.

Embodiment 3 FIG.
In the second embodiment, the case where the bending tool of the bending molding means is linearly driven has been described. However, even when the bending tool is rotationally driven, the flexible substrate 2 is bent in accordance with the shape of the suction surface of the suction holding means. In addition, the flexible substrate 2 can be sucked and held by the suction holding means in a bent state. This will be described below.

  FIG. 8 is a diagram for explaining the bending and adsorption of the substrate according to the third embodiment of the present invention. FIGS. 8A and 8B show the state before bending the flexible substrate 2 and the bending of the flexible substrate 2, respectively. The state of being sucked and held by the suction holding means 8 is shown. In the drawings, the same symbols are the same or equivalent. Reference numeral 26 denotes a bending molding means. 27 is a supply base for the bending molding means 26 on which the flexible substrate 2 is placed, 27a and 27b are guides for positioning one side of the flexible substrate 2 and the joining end surface, and 28 is capable of facing the inclined surface 10 of the suction holding means 8. This is a bending tool of the bending molding means 26 provided with a simple facing surface 28a. When the flexible substrate 2 is bent, the bent surface of the bending molding means 26 is constituted by the upper surface of the supply base 27 on the guide 27b side and the facing surface 28a. The bending tool 28 is guided to rotate by a guide (not shown) and is driven to rotate by a bending tool driving means 25 (not shown).

  Next, the operation will be described. As in the second embodiment, the flexible substrate 2 is supplied so that the electrode 19 to be bonded is directed downward, and is set to the guides 27a and 27b of the supply table 27 so as to contact one side of the flexible substrate 2 and the bonding end surface. . Next, when the bending tool 28 is driven in the direction of the suction holding means 8, the facing surface 28 a of the bending tool 28 pushes up the flexible substrate 2. Then, as shown in FIG. 8B, the opposing surface 28a of the bending tool 28 presses the flexible substrate 2 with the suction holding means 8 so that the flexible substrate 2 is bent, and the suction holding means is driven by a pump (not shown). The suction holding means 8 can be sucked and held in a state where the inside of 8 is evacuated and the flexible substrate 2 is bent. When the flexible substrate 2 is sandwiched, the driving direction of the bending tool 28 and the inclined surface 10 of the suction holding means 8 are substantially perpendicular, and the driving force of the bending tool 28 can be used efficiently when the flexible substrate 2 is bent. it can.

  As described above, the bending molding means of the present embodiment can be sucked and held by the sucking and holding means at the joint portions and the inclined surfaces on both sides of the bending portion in a state where the flexible substrate 2 is bent. The board mounting apparatus provided with the bending molding means can be mounted at high density on the wiring board on which electronic components have already been mounted in the same manner as in the first embodiment with high alignment accuracy. Further, the bending molding means of the present embodiment is different from that which is bent only by a component perpendicular to the inclined surface 10 which is a part of the driving force of the tool 24 shown in the second embodiment. Since the direction in which the bending tool 28 of the bending molding means is driven and the inclined surface 10 of the suction holding means 8 can be made substantially perpendicular to each other and the total driving force becomes the bending force, the bending can be efficiently performed. There is. Further, compared to the case of driving in the vertical direction or the oblique direction as in the second embodiment, the bending molding means of the present embodiment has an advantage that the vertical direction can be shortened.

Embodiment 4 FIG.
In the first to third embodiments, the number of the bent portions 2b of the flexible substrate 2 is one. However, even if a plurality of bent portions are provided, the suction holding means can hold the flexible substrate 2 in a bent state. it can. This will be described below.

  FIG. 9 is a diagram for explaining the bending and suction of the substrate according to the fourth embodiment of the present invention. FIGS. 9A and 9B show the state before bending the flexible substrate 2 and the bending of the flexible substrate 2, respectively. The state of being sucked and held by the suction holding means 29 is shown. In the drawings, the same symbols are the same or equivalent. The suction holding means 29 is for holding the flexible substrate 2 in a bent state at two locations. Reference numeral 30 denotes a horizontal plane parallel to the substrate stage 4 (not shown), and reference numeral 31 denotes a second horizontal plane that is away from the joint portion of the flexible substrate 2 and contacts the plane 2e far from the second bent portion 2d. Reference numeral 32 denotes a wall surface in contact with the wall surface 2c bent at the bent portion 2b connected to the joint portion of the flexible substrate 2. Adsorption holes 11 are provided in the horizontal plane 30 and the second horizontal plane, and the flexible substrate 2 can be adsorbed and held in a bent shape. Reference numeral 33 denotes a bending molding means. 34 is a supply base for the bending molding means 33 on which the flexible substrate 2 is placed, 34a and 34b are guides for positioning one side of the flexible substrate 2 and the joint end surface, and 35 is bent at two bent portions and held by suction. This is a bending tool of the bending molding means 33 having a facing surface that can face the means 29. 35 a is a third facing surface that can face the second horizontal surface of the suction holding means 29, 35 b is a second facing surface that can face the wall surface 32 of the suction holding means 29, and 35 c is a horizontal surface 30 of the suction holding means 29. It is the 1st opposing surface which can oppose. When the flexible substrate 2 is bent, the upper surface of the supply base 34 on the guide 34b side and the first opposing surface 35c, the second opposing surface 35b, and the third opposing surface 35a constitute the bending surface of the bending molding means 33. To do. The bending tool 35 is guided so as to move linearly by a guide (not shown) and is linearly driven by a bending tool driving means 25 (not shown).

  Next, the operation will be described. The flexible substrate 2 is supplied so that the electrode 19 to be bonded is directed downward, and set to the guides 34a and 34b of the supply base 34 so as to contact one side of the side surface of the flexible substrate 2 and the bonding end surface. Next, when the bending tool 35 is driven in the direction of the suction holding means 29, the third facing surface 35 a of the bending tool 35 pushes up a part of the flexible substrate 2. 9B, the third facing surface 35a of the bending tool 35 presses the flexible substrate 2 with the second horizontal surface of the suction holding means 29, whereby the flexible substrate 2 is bent. The suction holding means 29 can be sucked and held by the suction holding means 29 in a state where the inside of the suction holding means 29 is evacuated by a pump (not shown) and the flexible substrate 2 is bent.

  As described above, the suction holding means and the bending molding means of the present embodiment cause the suction holding means to suck and hold at the joints and planes on both sides of the wall surface sandwiched between the bent portions in a state where the flexible substrate 2 is bent. Therefore, the board mounting apparatus provided with the suction holding means and the bending molding means according to the present embodiment can increase the alignment accuracy on the wiring board on which the electronic components are already mounted as in the first embodiment, thereby increasing the density. Can be implemented. Further, since the suction holding means and the bending molding means of the present embodiment mold a plurality of bent portions on the flexible substrate 2, wiring after mounting the components by shortening the wall surface 2c connected to the joint portion 2a of the flexible substrate 2 is possible. The height of the substrate 1 can be reduced. In addition, since there are a plurality of bent portions in the flexible substrate 2, even if something hits at a place away from the joint portion of the flexible substrate 2, the area of the flexible substrate 2 divided by the bent portion to which force is applied Since the force can be absorbed, the reliability of the joint can be improved.

Embodiment 5. FIG.
In the above description, the electronic component is not mounted on the flexible substrate. However, even if the flexible substrate is mounted with the electronic component, the flexible substrate 2 is bent according to the shape of the bending surface of the suction holding means, and the flexible substrate 2 can be sucked and held by the suction holding means in a bent state. This will be described below.

  FIG. 10 is a diagram for explaining the substrate mounting in the fifth embodiment of the present invention. In the drawings, the same symbols are the same or equivalent. Reference numeral 36 denotes suction holding means, which includes a concave portion that is a component avoiding portion 38 for avoiding the electronic component 37 so that no force is applied to the electronic component 37 mounted on the flexible substrate 2. The method described in the first to fourth embodiments can be applied to the substrate mounting method of the flexible substrate 2. Therefore, by providing the component avoiding portion 38 in the suction holding means 36, even if the electronic substrate is a flexible substrate, the flexible substrate 2 is bent in accordance with the shape of the suction surface of the suction holding means 36 and flexible. The substrate 2 can be sucked and held by the suction holding means 36 in a bent state.

  As described above, since the suction holding unit of the present embodiment can hold the flexible substrate 2 on which the electronic component is mounted in a bent state, the board mounting provided with the suction holding unit of the present embodiment As in the first embodiment, the apparatus can be mounted with high density on the wiring board on which electronic components have already been mounted with high alignment accuracy.

  Although FIG. 10 shows the case where the flexible substrate 2 has one bent portion 2b, the invention can also be applied to a case where a plurality of bent portions are provided. Further, although the case where the component avoiding portion 38 is provided in the suction holding means has been described, the suction holding means bends the flexible substrate 2 on which the electronic component is mounted even when it is provided in the bending tool of the bending molding means. It can be adsorbed and held in a wet state. Even when electronic components are mounted on both surfaces of the flexible substrate 2, the component avoiding portion 38 is provided on the bending tool of the suction holding means and the bending molding means, so that the suction holding means bends the flexible substrate 2. Can be adsorbed and retained.

Embodiment 6 FIG.
Although the case where the suction holding means and the bending molding means are not provided with the heating means has been described so far, the flexibility of the flexible substrate can be improved by providing the suction holding means or the bending molding means with the heating means.

  FIG. 11 is a diagram for explaining the bending and adsorption of the substrate according to the sixth embodiment of the present invention. In the drawings, the same symbols are the same or equivalent. The suction holding means 39 and the molding die 40 which is a bending molding means are provided with heaters 41 and 42 which are heating means for heating the flexible substrate 2. Since the flexible substrate 2 is warmed by the heat of the heaters 41 and 42, the flexible substrate 2 can be easily bent and sucked and held by the suction holding means 39. The method described in the first to fifth embodiments can be applied to the substrate mounting method of the flexible substrate 2. Therefore, the suction holding means and the bending molding means of the present embodiment include the heating means, so that the flexible substrate 2 can be easily bent, and the suction holding means can hold the flexible substrate 2 in a bent state. Can do.

  As described above, the suction holding means and the bending molding means of the present embodiment can bend the flexible substrate 2, and the suction holding means can suck and hold the flexible substrate 2 in a bent state. The board mounting apparatus provided with the suction holding means and the bending molding means according to the embodiment performs mounting at a high density by increasing the alignment accuracy on the wiring board on which electronic components are already mounted as in the first embodiment. Can do.

  In FIG. 11, the bending molding means is shown by the molding die 40, but the invention is not limited to this example. The present invention can also be applied to those shown in Embodiment Modes 2 to 5. Moreover, although the case where the suction holding means and the bending molding means are provided with the heating means has been described, either one may include the heating means.

  In the second to fourth embodiments, the example is shown in which the guide is used for positioning the flexible substrate to the supply base of the bending molding means. However, the present invention is not limited to this example. An image recognition means may recognize the alignment mark and align the supply base of the bending means with the flexible substrate.

  In the first to sixth embodiments, the description has been given of the case where the electrode of the joint portion of the wiring board and the electrode of the joint portion of the flexible substrate are joined with an anisotropic conductive resin. I do not care. The adsorption holding means may be provided with a heating means capable of heating to a temperature at which the solder melts.

It is a schematic block diagram of the mounting apparatus in Embodiment 1 of this invention. 3 is a diagram showing details of a joint portion in Embodiment 1. FIG. 2 is an electrode arrangement of a flexible substrate in the first embodiment. FIG. 3 is a diagram showing a state before bending of the flexible substrate in the first embodiment. 5 is a diagram for explaining bending and adsorption of a flexible substrate in Embodiment 1. FIG. This is an electrode arrangement of another flexible substrate that can be used in the first embodiment. It is a figure explaining the bending | flexion and adsorption | suction of a board | substrate in Embodiment 2 of this invention. It is a figure explaining the bending | flexion and adsorption | suction of a board | substrate in Embodiment 3 of this invention. It is a figure explaining the bending | flexion and adsorption | suction of a board | substrate in Embodiment 4 of this invention. It is a figure explaining the board | substrate mounting in Embodiment 5 of this invention. It is a figure explaining the bending | flexion and adsorption | suction of a board | substrate in Embodiment 6 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2 Flexible board 8, 29, 36, 39 Adsorption holding means 9, 30 Horizontal surface 10 Inclined surface 13 Actuator 16, 22, 26, 33, 40 Bending molding means 17 Concave part 17a Inclined part 23, 27, 34, Supply stand 24, 28, 35 Bending tool 24a, 28a Opposing surface 25 Bending tool driving means 38 Parts avoiding part 31 Second horizontal surface 32 Wall surface 35a Third opposing surface 35b Second opposing surface 35c First opposing surface 41, 42 Heater

Claims (14)

Suction holding means for holding the flexible substrate in a bent shape; and
A relative position moving means for moving at least one of the wiring board on which the flexible board is mounted and the suction holding means;
A substrate mounting apparatus comprising: a bonding forming unit that drives the suction holding unit to bond the wiring substrate and the flexible substrate. Bending molding means for bending the flexible substrate;
Suction holding means for sucking and holding the bent flexible substrate;
A relative position moving means for moving at least one of the wiring board on which the flexible board is mounted and the suction holding means;
A substrate mounting apparatus comprising: a bonding forming unit that drives the suction holding unit to bond the wiring substrate and the flexible substrate.   3. The substrate according to claim 2, wherein the bending molding means and the suction holding means each have bending surfaces facing each other, and the flexible substrate is bent by sandwiching the flexible substrate between both bending surfaces. Mounting device.   4. The substrate mounting apparatus according to claim 3, wherein the bending molding means and the suction holding means have a plurality of bent portions. The bending molding means is
4. The substrate mounting apparatus according to claim 2, further comprising a concave portion surrounding a tip portion including a horizontal plane and a bent portion of the suction holding means. The bending molding means is
A supply base on which a flexible substrate is placed;
A bending tool that is movably disposed in an opening provided in the supply table and has a facing surface that can face the bending surface of the suction holding means;
The board mounting apparatus according to claim 2, further comprising a driving unit that drives the bending tool in the direction of the suction holding unit.   The board mounting apparatus according to claim 6, wherein the bending tool is rotationally driven.   The board mounting apparatus according to claim 6, wherein the bending tool is linearly driven.   The board mounting according to any one of claims 1 to 8, wherein the suction holding means includes a component avoiding unit that does not press the parts mounted on the flexible board when the flexible board is sucked. apparatus.   10. The board mounting apparatus according to claim 2, wherein the bending molding means includes a part avoiding part which is a concave part and is larger than a part mounted on the flexible board.   The substrate mounting apparatus according to claim 2, wherein the suction holding unit or the bending molding unit includes a heating unit that heats the flexible substrate.   The substrate mounting apparatus according to claim 1, wherein the bonding forming unit is a pressurizing unit that applies pressure between the wiring substrate and the suction holding unit. A step in which the suction holding means sucks and holds the flexible substrate in a bent shape;
A step of moving the joint portion of the flexible substrate and the joint portion of the wiring board on which the joint portion is mounted to face each other;
A substrate mounting method including a bonding step of driving the suction holding means to bond the wiring substrate and the flexible substrate. A step of bending and bending the flexible substrate;
A step of sucking and holding the flexible substrate with the suction holding means bent;
A step of moving the joint portion of the flexible substrate and the joint portion of the wiring board on which the joint portion is mounted to face each other;
A substrate mounting method including a bonding step of driving the suction holding means to bond the wiring substrate and the flexible substrate.

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