TWI664681B - Mounting head and mounting device using the same - Google Patents

Abstract

An object of the present invention is to provide a formal crimping head and a mounting device as a mounting head, which can continuously heat the accessory for formal crimping while reliably absorbing the positional difference in the pressing direction of the wafer part while suppressing the wafer. The mounting position of the component and the wiring board is shifted. The present invention is a formal crimping head 17 as a mounting head, which is connected to a specific position of the circuit substrate C by heating and pressing the wafer component D, and includes: an attachment 20 that is in contact with the wafer component D; The heating block 18 for formal crimping, which heats the accessory 20 for formal crimping; the rubber member 20a, which is arranged between the attachment 20 for formal crimping and the heating block 18 for formal crimping, The attachment 20 for formal crimping is compressed with the heating block 18 for formal crimping; and the spring 19 is connected to the attachment 20 for formal crimping and the heating block 18 for formal crimping, and deforms during pressing to follow Attachment 20 for official crimping.

Description

Mounting head and mounting device using the same

The invention relates to a mounting head and a mounting device using the same. Specifically, the present invention relates to a mounting head for mounting a wafer component or the like on a circuit board and a mounting device using the same.

Previously, there has been known a mounting device that includes the following steps in order to cope with increasing the precision and miniaturization of a pattern of a substrate having a circuit including a conductor such as copper wiring: a pre-compression step, which is a wafer including a semiconductor element The component is temporarily fixed to the pad formed on the circuit substrate by an adhesive; and a formal crimping step is to bond the bump of the wafer part temporarily fixed to the pad with the pad. For example, as in Patent Document 1.

In such a mounting device, a mounting head (heating and pressing head) of a formal crimping device is known: in order to avoid the influence of heat on adjacent wafer parts, a plurality of wafer parts are heated and pressed at the same time and connected to Circuit board. For example, as in Patent Document 2.

The mounting device described in Patent Document 1 is a method in which a plurality of wafer parts are aligned and temporarily fixed to a wiring substrate in a pre-crimping device, and the temporarily fixed plurality of wafer parts are simultaneously heated and pressurized in a formal crimping device. connection. The mounting head of the official crimping device described in Patent Document 2 is designed to absorb the positional differences in the pressing direction of the plurality of wafer parts temporarily fixed, and the plurality of attachments (heating and pressing tools) in contact with the wafer parts The holder which has the function of transmitting the heat from the heating block is maintained to slide freely in the pressurizing direction. The mounting head is configured in such a manner that the gap between the holder and the accessory is as small as possible, so that heat from the heating block is efficiently transmitted to the accessory through the holder.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-232234

[Patent Document 2] Japanese Patent Laid-Open No. 2010-34423

However, the mounting head described in Patent Document 2 is a force that presses the accessory to the holder during pressurization according to the state of the temporarily fixed wafer part. As a result, there is a possibility that the attachment head interferes with the holder and cannot slide, and cannot absorb the positional difference in the pressing direction of the wafer component. Furthermore, due to the tilt of the accessory, the mounting position of the wafer component may be shifted.

An object of the present invention is to provide a mounting head and a mounting device, which can continuously heat the accessory and absorb the positional difference in the pressing direction of the wafer part, and can suppress the mounting position deviation of the wafer part and the wiring substrate.

The problems to be solved by the present invention are as described above, and then the steps to solve these problems are explained.

That is, the present invention relates to a mounting head, which heats and pressurizes a wafer part to be connected to a specific position on a circuit board, and includes: an accessory that contacts the wafer part; a heating block that heats the accessory; elasticity A component which is arranged between the accessory and the heating block and is compressed by the accessory and the heating block when pressurized; and a heat conductive member which is connected to the accessory and the heating block and deforms and follows when pressed On attachments.

In the present invention, the heat conductive member includes a spring and holds the accessory.

In the present invention, the elastic member is a plate-shaped member having a thickness of 0.1 mm to 1 mm.

In the present invention, a portion contacted by the wafer component in the accessory is configured as The thickness is 0.5 mm or more and 5 mm or less.

In the present invention, the interior space of the spring is formed in the heating block, and the spring is disposed in the interior space in a bent state.

The present invention is a mounting device that heats a wafer part by the mounting head of the present invention, and connects the wafer part to a circuit board by applying pressure with a specific load.

The effects of the present invention exhibit the following effects.

In the present invention, no relative movement occurs between the accessory and the heat-conducting member during pressurization. Thereby, the attachment can be continuously heated, and the positional difference in the pressing direction of the wafer component can be absorbed, and the mounting position deviation of the wafer component and the wiring substrate can be suppressed.

In the present invention, the spring is elastically deformed in a state in which the accessory is held while being pressed. Thereby, the attachment can be continuously heated, and the positional difference in the pressing direction of the wafer component can be absorbed, and the mounting position deviation of the wafer component and the wiring substrate can be suppressed.

In the present invention, the positional displacement of the accessory caused by the deviation of the compression amount of the elastic member during compression is suppressed, and the compression amount of the elastic member necessary to absorb the positional difference in the compression direction is ensured. Thereby, the attachment can be continuously heated, and the positional difference in the pressing direction of the wafer component can be absorbed, and the mounting position deviation of the wafer component and the wiring substrate can be suppressed.

In the present invention, the attachment is prevented from being deformed when pressurized. Thereby, the attachment can be continuously heated, and the positional difference in the pressing direction of the wafer component can be absorbed, and the mounting position deviation of the wafer component and the wiring substrate can be suppressed.

1‧‧‧Installation device

2‧‧‧ pre-crimping device

3‧‧‧ abutment for pre-crimping

4‧‧‧Pre-crimping platform

4a‧‧‧Drive unit

4b‧‧‧Adsorption station

5‧‧‧ Support frame for pre-crimping

6‧‧‧Pre-crimping unit

7‧‧‧ head for pre-crimping

8‧‧‧Pre-Pressure Heater

9‧‧‧ Accessories for pre-crimping

10‧‧‧ Displacement Sensor

11‧‧‧Image recognition device for pre-crimping

12‧‧‧ formal crimping device

13‧‧‧ abutment for official crimping

14‧‧‧formal crimping platform

14a‧‧‧Drive unit

14b‧‧‧Adsorption Station

15‧‧‧ Official support frame for crimping

16‧‧‧formal crimping unit

16a‧‧‧Mounting Department

17‧‧‧formal crimping head

18‧‧‧ Official heating block for crimping

18a‧‧‧formal crimping heater

19‧‧‧Spring

20‧‧‧ official accessories for crimping

20a‧‧‧rubber member

21‧‧‧ formal image recognition device for crimping

22‧‧‧ transport device

23‧‧‧Control device

24‧‧‧formal crimping head

25‧‧‧ aluminum sheet

25a‧‧‧Fixture

26‧‧‧Accessories for official crimping

26a‧‧‧rubber member

27‧‧‧formal crimping head

28‧‧‧Frame

28a‧‧‧through hole

29‧‧‧ official accessories for crimping

29a‧‧‧rubber member

29b‧‧‧ protrusion

30‧‧‧formal crimping head

31‧‧‧ Official heating block for crimping

31a‧‧‧formal crimping heater

31b‧‧‧ Interior space

31c‧‧‧Locking Department

32‧‧‧Spring

33‧‧‧Accessories for official crimping

33a‧‧‧Processing Department

33b‧‧‧Heat transfer department

33c‧‧‧Rubber member

C‧‧‧circuit board

Ca‧‧‧ pad

D‧‧‧Chip parts

Da‧‧‧Solder

Fp‧‧‧ Official Crimp Load

Ft‧‧‧Pre-Crimping Load

L‧‧‧ Distance

Tp‧‧‧Official crimping temperature

Tt‧‧‧Pre-crimping temperature

X‧‧‧ axis direction

Y‧‧‧ axis direction

Z‧‧‧ axis direction

FIG. 1 is a schematic diagram showing the overall configuration of a mounting apparatus according to a first embodiment of the present invention.

Fig. 2 is a schematic side view showing the structure of a pre-crimping head of a mounting device according to a first embodiment of the present invention.

Fig. 3 (a) is a schematic diagram showing the structure of a formal crimping head according to the first embodiment of the present invention. A perspective view, (b) is a partial cross-sectional view showing a side surface of a structure of a formal crimping head according to the first embodiment of the present invention.

Fig. 4 is a block diagram showing a control structure of a mounting device according to a first embodiment of the present invention.

Fig. 5 (a) is a side view of a pre-compression head showing a state in which wafer parts are temporarily fixed in the pre-compression bonding step of the mounting apparatus according to the first embodiment of the present invention, and (b) shows the same as the official compression A partial cross-sectional view of a side surface of a formal crimping head in a connection state of a wafer part in a joining step.

FIG. 6 is a diagram showing a graph showing a temperature state when the head for formal crimping according to the first embodiment of the present invention is pressurized.

Fig. 7 (a) is a partial cross-sectional view showing the side surface of the heat conduction of the formal crimping head according to the first embodiment of the present invention, and (b) is a partial cross-sectional view showing the side surface when the accessory is also moved.

8 (a) is a partial cross-sectional view showing a side surface of a state where a wafer component is pressed to a circuit board in a formal crimping step of a mounting apparatus according to a first embodiment of the present invention, and (b) is a drawing showing the same in a crimping step A partial cross-sectional view of a side surface of a wafer part in which the load is dispersed by the hardened NCF.

Fig. 9 (a) is a partial cross-sectional side view showing a connection state of a wafer part in a formal crimping step of a mounting apparatus of a second embodiment of the present invention, and (b) is a formal crimping of a second embodiment of the present invention Partial cross-sectional view of the side with heat conduction from the head.

Fig. 10 (a) is a partial cross-sectional side view showing a connection state of a wafer component in a formal crimping step of a mounting apparatus of a third embodiment of the present invention, and (b) is a formal crimping of a third embodiment of the present invention. Partial cross-sectional view of the side with heat conduction from the head.

FIG. 11 (a) is a side view showing a side view of a wafer component connection state in a formal crimping step of a mounting apparatus of a fourth embodiment of the present invention, and (b) is a formal crimping of a fourth embodiment of the present invention. Side view of the side with heat conduction from the head.

First, a mounting device 1 according to an embodiment of the mounting device 1 of the present invention will be described with reference to FIGS. 1 to 4. In the following description, the direction in which the circuit board C is transported from the pre-crimping device 2 to the final crimping device 12 is referred to as the X-axis direction, the direction orthogonal to this is referred to as the Y-axis direction, and a head for pre-crimping described later The moving direction of 7 and the main crimping head 17 perpendicular to the circuit board C is defined as the Z-axis direction, and the direction of rotation around the Z-axis is described as the θ direction. In addition, in this embodiment, the pre-crimping device 2 and the main-compression-bonding device 12 are respectively constituted as one embodiment of the mounting device 1, but it is not limited to this. In this embodiment, a non-conductive film (hereinafter, simply referred to as "NCF") containing a thermosetting resin as an adhesive for bonding the circuit board C and the wafer part D is a solder that covers the wafer part D in advance. The method of attaching is not limited to this, and it may be attached to the circuit board C side.

As shown in FIG. 1, the mounting apparatus 1 is a person who mounts a wafer component D on a circuit board C. The mounting apparatus 1 includes a pre-crimping apparatus 2, a main-crimping apparatus 12, a conveying apparatus 22 (see FIG. 4), and a control apparatus 23 (see FIG. 4).

The pre-crimping device 2 aligns and temporarily fixes the chip component D to the circuit substrate C by using NCF as an adhesive. The pre-crimping device 2 includes a pre-crimping abutment 3, a pre-crimping platform 4, a pre-crimping support frame 5, a pre-crimping unit 6, a pre-crimping head 7, and a pre-crimping heater 8. (Refer to FIG. 2), a pre-crimp attachment 9 (refer to FIG. 2), a displacement sensor 10 as a distance measuring mechanism, and an image recognition device 11 for pre-compression (refer to FIG. 4).

The pre-crimping abutment 3 constitutes a main structure of the pre-crimping device 2. The pre-compression abutment 3 is composed of a combination of pipe materials and the like to have sufficient rigidity. The pre-compression base 3 supports the pre-compression platform 4 and the pre-compression support frame 5.

The pre-crimping stage 4 is moved to an arbitrary position while holding the circuit board C. The pre-crimping platform 4 is configured by attaching a suction stage 4b capable of suction-holding a circuit board to the drive unit 4a. The pre-crimping platform 4 is mounted on the pre-crimping base 3 so that the driving unit 4a can The adsorption table 4b is configured to move in the X-axis direction, the Y-axis direction, and the θ direction. That is, the pre-crimping platform 4 is configured so that the circuit board C adsorbed on the adsorption table 4 b can be moved on the pre-crimping base 3 in the X-axis direction, the Y-axis direction, and the θ direction. In this embodiment, the pre-crimping stage 4 holds the circuit board C by suction, but it is not limited to this.

The pre-crimp support frame 5 supports 6 pre-crimp units. The pre-crimp support frame 5 is formed in a plate shape and is configured to extend from the vicinity of the pre-compression platform 4 of the pre-compression base 3 in the Z-axis direction.

The pre-crimping unit 6 as a pressing unit is a person who moves the pre-crimping head 7. The pre-crimping unit 6 includes a servo motor and a ball screw (not shown). The pre-crimping unit 6 is mounted on the pre-crimping support frame 5 so that the moving direction of the pre-crimping head 7 becomes the Z-axis direction perpendicular to the circuit board C. The pre-compression-bonding unit 6 is configured such that an axial driving force of the ball screw is generated by rotating the ball screw with a servo motor, thereby moving the pre-compression-bonding head 7 in the Z-axis direction. That is, the pre-crimping unit 6 is configured to generate a driving force (pressurizing force) in the Z-axis direction. The pre-crimping unit 6 is configured to arbitrarily set a pre-crimping load Ft as a pressing force in the Z-axis direction. Furthermore, in the present embodiment, the pre-compression-bonding unit 6 is configured by using a servo motor and a ball screw, but it is not limited to this, and may include an air pressure actuator or a hydraulic pressure actuator.

The pre-compression head 7 transmits the driving force of the pre-compression unit 6 to the wafer component D. The pre-crimping head 7 is attached to a ball screw nut (not shown) constituting the pre-crimping unit 6. The pre-crimping unit 6 is disposed so as to face the pre-crimping platform 4. That is, the pre-compression-bonding head 7 is configured so that the pre-compression-bonding unit 6 can approach the pre-compression-bonding platform 4 by moving the pre-compression-bonding unit 6 in the Z-axis direction. As shown in FIG. 2, the pre-compression head 7 is provided with a pre-compression heater 8, a pre-compression attachment 9, and a displacement sensor 10.

The pre-compression heater 8 is used to heat the wafer component D. The pre-compression heater 8 includes a cartridge heater, and incorporates a hole or the like formed in the pre-compression head 7. In this embodiment In the above, the pre-compression heater 8 includes a cartridge heater, but it is not limited to this, as long as it can heat the wafer component D such as a rubber heater. In addition, the pre-compression heater 8 is assembled in the pre-compression head 7, but the invention is not limited to this. The pre-compression platform 4 may be incorporated in the pre-compression platform 4 through the circuit board C. Composition of heating NCF.

The pre-crimping attachment 9 holds the wafer component D. The pre-crimp attachment 9 is provided on the pre-crimp head 7 so as to face the pre-crimp platform 4. The pre-crimping attachment 9 is configured so that the wafer component D is positioned and the wafer component D can be sucked and held. The pre-crimping attachment 9 is configured to be heated by the pre-crimping heater 8. That is, the pre-crimping attachment 9 is configured to hold and position the wafer component D, and is configured to heat-attach the NCF of the wafer component D by heat transfer from the heater 8 for pre-crimping.

The displacement sensor 10 measures the distance of the pre-crimping head 7 from an arbitrary reference position in the Z-axis direction. The displacement sensor 10 includes a displacement sensor 10 using various laser light. The displacement sensor 10 is configured to measure the distance L (see FIG. 5) from the arbitrary reference position in the Z-axis direction of the pre-compression head 7 when the pre-compression is completed. Furthermore, in the present embodiment, the displacement sensor 10 includes a person using laser light, but is not limited thereto, and may include a person using ultrasonic waves, or a person using a linear scale or an encoder calculated by a servo motor.

As shown in FIG. 4, the image recognition device 11 for pre-compression bonding is a person who obtains the position information of the wafer component D and the circuit board C from the image. The image recognition device 11 for pre-compression is used to image the alignment marks of the circuit substrate C held on the pre-compression platform 4 and the alignment marks of the wafer part D held on the attachment 9 for pre-compression. It is constructed by identifying and obtaining the position information of the circuit board C and the chip component D.

As shown in FIG. 1, the formal crimping device 12 connects the wafer component D to the circuit substrate C by welding the solder of the wafer component D. The formal crimping device 12 includes a base 13 for formal crimping, a platform 14 for formal crimping, a support frame 15 for formal crimping, a unit 16 for formal crimping, a head 17 for formal crimping, and image recognition for formal crimping. Device 21 (see Fig. 4).

The abutment 13 for main crimping is the main structure of the main crimping device 12. formal The crimp base 13 is composed of a combination of pipe materials and the like to have sufficient rigidity. The base 13 for formal crimping supports the platform 14 for formal crimping and the support frame 15 for formal crimping.

The main crimping platform 14 moves the circuit board C to an arbitrary position while holding the circuit board C. The main crimping platform 14 is configured by attaching a suction table 14b capable of holding a circuit board to the drive unit 14a. The main crimping platform 14 is mounted on the main crimping base 13 and is configured so that the suction table 14b can be moved in the X-axis direction, the Y-axis direction, and the θ direction by the drive unit 14a. That is, the main crimping platform 14 is configured so that the circuit board C adsorbed on the suction table 14 b can be moved on the main crimping base 13 in the X-axis direction, the Y-axis direction, and the θ direction. Furthermore, in this embodiment, the stage 14 for formal crimping is to hold the circuit board C by suction, but it is not limited to this.

The support frame 15 for formal crimping supports 16 units for full crimping. The support frame 15 for full compression bonding is formed in a substantially plate shape, and is configured to extend in the Z-axis direction from the vicinity of the full compression bonding platform 14 of the full compression bonding base 13.

The main crimping unit 16 as a pressurizing unit is a person who moves the main crimping head 17. The main crimping unit 16 includes a servo motor (not shown), a ball screw, and a mounting portion 16 a (see FIG. 3). The main crimping unit 16 is configured to generate an axial driving force (pressure) of the ball screw by rotating the ball screw with a servo motor, thereby moving a ball screw nut (not shown) in the Z-axis direction. The main crimping unit 16 is connected to the ball screw nut installation mounting portion 16a. The main crimping unit 16 is mounted on the main crimping support frame 15 so that the moving direction of the mounting portion 16 a becomes the Z-axis direction perpendicular to the circuit board C. That is, the main crimping unit 16 is configured to transmit a driving force (pressurizing force) in the Z-axis direction to the mounting portion 16a. The main crimping unit 16 is configured so that the main crimping load Fp, which is the pressing force in the Z-axis direction, can be arbitrarily set. Furthermore, in this embodiment, the formal crimping unit 16 is configured using a servo motor and a ball screw, but it is not limited thereto, and may include an air pressure actuator or a hydraulic pressure actuator.

As shown in Figures 1 and 3, the official crimping head 17 as the mounting head will be officially crimped. The driving force (pressurizing force) of the connecting unit 16 is transmitted to the wafer component D. The main crimping head 17 is attached to the mounting portion 16 a of the main crimping unit 16. The main crimping head 17 is arranged to face the main crimping platform 14. That is, the main crimping head 17 is configured so that the main crimping unit 16 can be moved closer to the main crimping platform 14 by moving the main crimping unit 16 in the Z-axis direction. The main crimping head 17 is provided with a main crimping heating block 18, a spring 19 as a heat conduction member, and a plurality of full crimping attachments 20.

As shown in FIG. 3, the heating block 18 for formal crimping is a person who performs heat storage. The main heat-bonding block 18 includes a metal such as iron as a heat conductive member. The heating block 18 for the main crimping is formed in a rectangular parallelepiped, and one side surface thereof is mounted on the mounting portion 16 a of the unit 16 for the main crimping. In addition, a main pressure heating heater 18a made of a cartridge heater is assembled on the main pressure heating block 18 in the vicinity of the side surface on the side of the back side and the other side surface. Thereby, the heating block 18 for main crimping is comprised so that it may heat up to arbitrary temperature by the heater 18a for main crimping. In the present embodiment, the main pressure heater 18a includes a cartridge heater, but it is not limited to this, as long as it is a heater such as a rubber heater that can heat the main pressure attachments 20a.

The metal-containing spring 19 as the heat-conducting member holds the attachment 20 for formal crimping and transmits the heat accumulated by the heating block 18 for formal crimping to the attachment 20 for formal crimping. As shown in FIG. 3 (a), the spring 19 includes a leaf spring formed so that a plate member surrounds the attachment 20 for formal crimping. The spring 19 is configured to be elastically deformed in a direction approaching the top and the bottom. The bottom of the spring 19 is connected to the other side surface of the heating block 18 for formal crimping. On the top of the spring 19, an attachment 20 for formal crimping is held. That is, the spring 19 is configured to move the attachment member 20 for full compression bonding held at the top portion in the moving direction of the full compression bonding unit 16 by elastic deformation. Moreover, the spring 19 is arrange | positioned near the heater 18a for regular crimping | compression-bonding. In addition, in this embodiment, the spring 19 is a leaf spring, but it is not limited to this, and it may be a laminated leaf spring or the like.

The attachment 20 for full crimping is in contact with the wafer component D and transmits pressure and heat. Such as As shown in FIG. 3 (b), the accessory 20 for formal crimping is held by the spring 19 so as to fit into the opening portion of the top of the spring 19. As a result, the attachment 20 for full compression bonding is connected to the heating block 18 for full compression bonding via the spring 19. At this time, the attachments 20 for formal crimping are arranged so that the surface in contact with the wafer component D is opposed to the platform 14 for formal crimping. The accessory 20 for full crimping is configured so that the thickness of the portion in contact with the wafer component D becomes 0.5 mm or more and 5 mm or less. With such a configuration, the attachment 20 for the main crimping suppresses bending and tilting during pressurization.

Between the heating block 18 for formal crimping and the accessory 20 for formal crimping, an elastic member is arranged to absorb the difference in the Z-axis direction of the pre-crimped wafer component D (hereinafter referred to as "installation error") That is, the heat-resistant rubber member 20a. The attachment 20 for formal crimping is configured by compressing the rubber member 20a by the heating block 18 for formal crimping and the attachment 20 for formal crimping according to mounting errors of the plurality of wafer parts D. The rubber member 20a is a plate-like member having a thickness of 0.1 mm to 1 mm. With such a configuration, the accessory 20 for formal crimping secures the compression amount of the rubber member 20a required to absorb the mounting error, and suppresses positional shift caused by the deviation of the compression amount of the rubber member 20a. In addition, in this embodiment, the rubber member 20a may not be fixed to the heating block 18 for full pressure bonding and the attachment 20 for full pressure bonding.

As shown in FIG. 4, the image recognition device 21 for formal crimping is a person who obtains position information of the head 17 for formal crimping and the circuit board C from an image. The image recognition device 21 for formal crimping is configured to image-recognize the alignment mark of the head 17 for formal crimping and the alignment mark of the circuit substrate C that is held and held on the platform 14 for formal crimping, and obtain the circuit substrate C. And the position information of the chip part D. Furthermore, in this embodiment, the position identification information of the main crimp 17 and the circuit board C is obtained using the image recognition device 21 for the main crimp, but it is not limited to this and is not necessary.

The conveying device 22 is a person who transfers the circuit board C between the pre-crimping device 2 and the main crimping device 12. The conveying device 22 is used for the pre-crimping platform 4 of the pre-crimping device 2 The circuit board C to which the plurality of wafer parts D are temporarily fixed is transported to the formal crimping platform 14 of the formal crimping device 12.

The control device 23 controls the pre-crimping device 2, the formal crimping device 12, the conveying device 22, and the like. The control device 23 may have a configuration in which a CPU, a ROM, a RAM, an HDD, and the like are connected by a bus, or a configuration including a single-chip LSI or the like. The control device 23 stores various programs or data in order to control the pre-crimping device 2, the formal crimping device 12, the conveying device 22, and the like.

The control device 23 is connected to the pre-crimping platform 4 and the formal crimping platform 14 and can control the movement amount of the X-axis direction, Y-axis direction, and θ direction of the pre-crimping platform 4 and the formal crimping platform 14 respectively.

The control device 23 is connected to the pre-compression heater 8 and the main-compression heater 18a, and can control the temperature of the pre-compression heater 8 and the main-compression heater 18a, respectively. In particular, the control device 23 can maintain the average temperature of the main crimping head 17 under pressure within a certain range including a temperature higher than the hardening temperature of NCF and a temperature higher than the melting point of the solder.

The control device 23 is connected to the pre-crimping unit 6 and the main crimping unit 16 and can control the pressing force in the Z-axis direction of the pre-crimping unit 6 and the main crimping unit 16 respectively.

The control device 23 is connected to the pre-crimping attachment 9 and can control the adsorption state of the pre-crimping attachment 9.

The control device 23 is connected to the image recognition device 11 for pre-crimping and the image recognition device 21 for formal crimping, and can control the image recognition device 11 for pre-crimping and the image recognition device 21 for formal crimping to obtain Positional information of the wafer component D and the circuit board C, the head 17 for full crimping, and the circuit board C.

The control device 23 is connected to the transfer device 22 and can control the transfer device 22.

The control device 23 is connected to the displacement sensor 10 and can obtain a distance in the Z-axis direction from the displacement sensor 10 when the pre-compression is completed. In particular, the control device 23 can determine whether the difference in the Z-axis direction of the wafer component D when temporarily fixed is outside a specific range.

As can be seen from the above, as shown in FIG. 5 (a), as a pre-crimping step for temporarily fixing the wafer component D to the circuit substrate C, the mounting device 1 is a circuit for pre-crimping and holding the circuit substrate C to the pre-crimping device 2. The stage 4 is used, and the wafer component D is heated to the pre-crimping temperature Tt (refer to FIG. 6) by the pre-crimping unit 6 and pressurized to the circuit board C with the pre-compression load Ft to temporarily fix the circuit board C. Specific location. Next, the mounting device 1 transfers the circuit board C from the pre-crimping platform 4 of the pre-crimping device 2 to the formal crimping platform 14 of the formal crimping device 12 by the transfer device 22. Next, as shown in FIG. 5 (b), as a formal crimping step for connecting the wafer component D to the circuit substrate C, the mounting device 1 is a formal crimping platform 14 for holding and holding the circuit substrate C to the formal crimping device 12 The plurality of chip parts D are simultaneously heated to the official pressure bonding temperature Tp (see FIG. 6) by the official pressure bonding unit 16 and pressurized with the official pressure load Fp to be connected to the circuit board C.

With such a structure, the mounting device 1 can temporarily fix the wafer component D to a specific position on the circuit substrate C with the pre-crimping device 2 continuously, and then simultaneously connect the plurality of wafer components D to the circuit with the formal crimping device 12 Substrate C. Therefore, as shown in FIG. 6, the mounting device 1 only needs to maintain the temperature of the formal crimping head 17 during the formal crimping of the formal crimping device 12 at the formal crimping temperature Tp. Therefore, the mounting device 1 does not need to cool the main crimping head 17 in each mounting cycle, and it is easy to perform temperature management, which can increase the throughput and suppress the occurrence of poor bonding of the main crimping.

Hereinafter, the state of heat of the formal crimping head 17 during the formal crimping of the mounting device 1 of the present invention will be described in detail using FIG. 7.

As shown in FIG. 7 (a), the control device 23 of the mounting device 1 causes the main crimping heater 18a of the main crimping head 17 to generate heat. The main crimping head 17 heats the main crimping heating block 18 by the heat of the main crimping heater 18a. The heating block 18 for the main crimping is heated to a specific temperature determined by the heat generation amount of the heater 18a for the main crimping, the heat generation from the surface of the heating block 18 for the main crimping, the volume and specific heat capacity of the heating block 18 for the main crimping. . The heat accumulated in the official crimping heating block 18 that has been heated to a specific temperature is transmitted through the spring 19 Proceed to the attachment 20 for formal crimping (refer to the light ink arrow symbol in Fig. 7 (a)). The accessory 20 for formal crimping is heated up to a specific temperature determined by the heat supplied through the spring 19, the heat generation from the surface of the accessory 20 for formal crimping, the volume and specific heat capacity of the accessory 20 for formal crimping. At this time, the control device 23 controls the heater 18a for the full crimp so that the temperature of the accessory 20 for the full crimp reaches the full crimp temperature Tp (see FIG. 6).

Then, the control device 23 of the mounting device 1 drives the main crimping unit 16 to move the main crimping head 17 toward the main crimping platform 14. Attachment 20 for full crimping is in contact with the chip component D, and the rubber member 20a is compressed by the pressure of the main crimping unit 16 to move in the Z-axis direction based on the heating block 18 for the full crimping (see FIG. 5 (b)).

As shown in FIG. 7 (b), the accessory 20 for formal crimping is integrally held by the spring 19 so as to fit into the opening portion of the top of the spring 19. Therefore, the attachment 20 for full crimping does not move in the Z-axis direction relative to the spring 19 serving as a heat transfer member. That is, the spring 19 is elastically deformed so as to follow the operation of the attachment 20 for formal crimping while being connected to the heating block 18 for formal crimping. As a result, even if the accessory 20 for formal crimping is moved in the Z-axis direction due to the compression of the rubber member 20a, heat is supplied from the heating block 18 for formal crimping via the spring 19.

Hereinafter, a description will be given of the configuration of absorbing the positional difference in the Z-axis direction of the wafer component D using NCF at the time of the full compression bonding of the mounting device 1 of the present invention using FIG. 8.

As shown in FIG. 8 (a), in the main crimping step, the mounting device 1 causes the main crimping attachment 20 to abut against the temporarily fixed wafer component D by the main crimping unit 16. The wafer component D is heated to a specific official pressure-bonding temperature Tp by the official pressure-bonding heater 18a and the accessory 20 for normal pressure-bonding. Along with this, the NCF and the solder Da attached to the wafer part D are transferred to the heated wafer part D and heated to the official compression bonding temperature Tp substantially the same as the wafer part D.

The mounting device 1 heats the wafer part D to the official crimping temperature Tp by the formal crimping The unit 16 is used to apply pressure in the Z-axis direction with the full compression weight Fp. The wafer component D is approached by applying pressure to the circuit board C by the official crimping unit 16 to eliminate the gap between the solder and the pad of the circuit board C. At this time, the NCF of the wafer component D starts to be hardened because it is heated above the hardening temperature. The mounting device 1 contacts the pad Ca of the circuit board C with the solder Da of the wafer part D in the formal crimping step until the NCF of the wafer part D is completely hardened. That is, the mounting device 1 suppresses a poor bonding between the circuit board C and the wafer component D caused by the hardening of the NCF.

In each wafer component D, the distance from the surface contacted by the official crimping attachment 20 to the circuit board C differs depending on the mounting error. For this reason, the head 17 for formal crimping compresses the rubber member 20a disposed between the accessory 20 for formal crimping and the heating block 18 for formal crimping to the thickness of the accessory 20 for formal crimping, which differs depending on the distance. Therefore, the gap between the pad Ca and the solder Da of the circuit board C in the plurality of wafer parts D that are simultaneously pressed by the head 17 for the official crimping is larger than the wafer parts with a larger gap between the pad Ca and the solder Da of the other wafer parts D D is pressurized with a load Fp2 larger than the load Fp1 applied to the other wafer parts D. However, as shown in FIG. 8 (b), since the load Fp2 is dispersed and resisted by the solder Da and the NCF that has begun to harden due to the NCF hardening of a wafer component D, the solder Da will not be excessively scattered due to pressure.

By using the formal crimping head 17 configured in this way, the spring 19 is elastically deformed while holding the formal crimping attachment 20 while being pressurized. Therefore, there is no difference between the formal crimping attachment 20 and the spring 19. Generate relative movement. In addition, by restricting the thickness of the rubber member 20a, the positional displacement of the official crimping attachment 20 caused by the deviation of the compression amount of the rubber member 20a during pressurization is suppressed, and the rubber member necessary to absorb mounting errors is ensured 20a compression. Furthermore, by restricting the thickness of the attachment member 20 for formal crimping, bending of the attachment member 20 for formal crimping at the time of pressurization is suppressed. Thereby, the positional difference in the pressing direction of the wafer component D can be absorbed by the rubber member 20a while heating the attachment 20 for formal crimping.

Hereinafter, using FIG. 9, the head 24 for full crimping of the second embodiment of the present invention will be advanced. Line description. In addition, in the following embodiments, the same points as the already described embodiments will be omitted, and detailed description will be focused on the different parts.

As shown in FIG. 9 (a), the main crimping head 24 as the mounting head transmits the driving force (pressurizing force) of the main crimping unit 16 (see FIG. 1) to the wafer component D. The head 24 for formal crimping is provided with a heating block 18 for formal crimping, an aluminum sheet 25 as a heat conduction member, and a plurality of attachments 26 for formal crimping.

The aluminum sheet 25 containing an aluminum alloy as a heat-conducting member encloses and holds the accessory 26 for formal crimping, and transfers the heat accumulated in the heating block 18 for formal crimping to the accessory 26 for formal crimping. The aluminum sheet 25 is a sheet having a specific thickness of an aluminum alloy. The aluminum sheet 25 is configured to be deformable into an arbitrary shape. The aluminum sheet 25 is connected to the other side surface of the heating block 18 for formal crimping by attaching the attachment 26 for fixing the crimping to the heating block 18 for formal crimping by the fixture 25a. That is, the aluminum sheet 25 is connected to the heating block 18 for full pressure bonding and the attachment 26 for full pressure bonding. Since the aluminum sheet 25 is arranged so as to enclose the accessory 26 for formal crimping, the aluminum sheet 25 can be deformed so as to follow the operation of the accessory 26 for formal crimping. The aluminum sheet 25 is arranged near the heater 18a for the main crimping of the heating block 18 for the main crimping. In the present embodiment, the material of the aluminum sheet 25 is an aluminum alloy, but it is not limited to this, and it may be a copper foil or the like.

The attachment 26 for the main crimping is in contact with the wafer component D and transmits pressure and heat. The heat-resistant rubber member 26a, which is an elastic member, is connected to the attachment member 26 for main crimping. In addition, the attachment member 26 for full compression bonding is connected to the heating block 18 for full compression bonding via the rubber member 26a. The attachment member 26 for the main crimping is configured by compressing the rubber member 26a by the heating block 18 for the main contact crimping and the auxiliary member 26 for the main contact crimping according to mounting errors of the plurality of wafer parts D. Thereby, the attachment member 26 for formal crimping can absorb the mounting error of the wafer component D which has been pre-crimped. The accessory 26 for full crimping is covered with an aluminum sheet 25 that can be formed into an arbitrary shape as a whole.

In the following, the head for full crimping when transferring the full crimping of the mounting device 1 of the present invention The state of heat of 24 is explained in detail.

As shown in FIG. 9 (b), the control device 23 of the mounting device 1 causes the main crimping heater 18a of the main crimping head 24 to generate heat. The heat accumulated in the heating block 18 for formal crimping, which has been heated to a specific temperature, is transmitted to the accessory 26 for formal crimping through the aluminum sheet 25 (see the light ink arrow symbol).

Then, the control device 23 of the mounting apparatus 1 drives the main crimping unit 16 to move the main crimping head 24 closer to the main crimping platform 14. Attachment 26 for full compression is moved in the Z-axis direction with reference to the heating block 18 for full compression when the rubber member 26a is compressed by the pressure of the full compression unit 16 when it comes into contact with the wafer component D (see the figure) 9 (a)).

The attachment member 26 for full crimping is integrally held on the aluminum sheet 25 so as to be enclosed by the aluminum sheet 25. Therefore, the attachment member 26 for formal crimping does not move relative to the aluminum sheet 25 as a heat conduction member but moves in the Z-axis direction. In other words, the aluminum sheet 25 is deformed in a state of being connected to the heater 18 for the main crimping to follow the operation of the accessory 26 for the main crimping. As a result, even if the accessory 26 for formal crimping is moved in the Z-axis direction due to the compression of the rubber member 26a, heat is supplied from the heating block 18 for formal crimping through the aluminum sheet 25.

Hereinafter, the head 27 for full pressure bonding according to the third embodiment of the present invention will be described using FIG. 10.

As shown in FIG. 10 (a), the main crimping head 27 as the mounting head transmits the driving force (pressurizing force) of the main crimping unit 16 (see FIG. 1) to the wafer component D. The head 27 for full crimping is provided with a heating block 18 for full crimping, a frame body 28 which is a heat conduction member, and a plurality of attachments 29 for full crimping.

The metal-containing frame 28 as a heat-conducting member holds the attachment 29 for formal crimping and transfers the heat accumulated by the heating block 18 for formal crimping to the attachment 29 for formal crimping. The frame body 28 is formed with a through hole 28 a having a stepped portion in a rectangular block. Frame 28 Of the side surfaces of the opening portion where the through hole 28a is formed, the side surface having the larger opening portion is brought into contact with the other side surface of the heating block 18 for crimping by a screw or the like. That is, the frame body 28 is arranged so that the small opening portion in the through hole 28a faces the platform 14 for formal crimping. The housing 28 is disposed near the main pressure heater 18 a of the main pressure heating block 18. In addition, in this embodiment, although the frame body 28 is made into a rectangular shape, it is not limited to this, A cylindrical shape etc. may be sufficient.

The accessory 29 for the main crimping is in contact with the wafer component D and transmits pressure and heat. The attachment member 29 for formal crimping is disposed inside the frame body 28 (inside the through hole 28 a) surrounded by the other side surface of the heating block 18 for formal crimping and the frame body 28. Further, a heat-resistant rubber member 29a as an elastic member is disposed between the heat-bonding block 18 for the main pressure-bonding and the attachment 29 for the main pressure-bonding. The attachment 29 for formal crimping is configured by compressing the rubber member 29a by the heating block 18 for formal crimping and the attachment 29 for formal crimping according to mounting errors of the plurality of wafer parts D. Thereby, the attachment member 29 for formal crimping can absorb the mounting error of the wafer component D which has been pre-crimped. The attachment member 29 for formal crimping is slidably inserted into a small opening in the through hole 28 a of the frame body 28. Furthermore, the attachment member 29 for formal crimping is provided with a protruding portion 29 b protruding from the side surface in the X direction or the Y direction, and the protruding portion 29 b is in contact with the stepped portion of the through hole 28 a of the frame body 28. That is, the attachment member 29 for formal crimping is held by the frame body 28 by bringing the protruding portion 29 b into contact with the stepped portion of the through hole 28 a of the frame body 28. Furthermore, the attachment member 29 for formal crimping is configured to be movable in the Z-axis direction in a state in which the attachment member 29 is slidably inserted into the through-hole 28a and is in contact with the frame body 28.

Hereinafter, a detailed description will be given of the state of the heat of the formal crimping head 27 during the formal crimping of the mounting device 1 of the present invention.

As shown in FIG. 10 (b), the control device 23 of the mounting device 1 generates heat of the main crimping heater 18a of the main crimping head 27. The heat accumulated in the formal pressure-welding heating block 18 that has been heated to a specific temperature is transmitted through the frame 28 to the attachment 29 for formal pressure-welding that is inserted into the through-hole 28a of the frame 28 (see the light-ink arrow symbol).

Then, the control device 23 of the mounting device 1 drives the main crimping unit 16 to move the main crimping head 27 toward the main crimping platform 14. Attachment 29 for full crimping is moved in the Z-axis direction based on the heating block 18 for full crimping when the rubber member 29a is compressed by the pressure of the full crimping unit 16 when it comes into contact with the wafer component D (see reference) Figure 10 (a)).

The attachment member 29 for full crimping is held in contact with the small opening portion of the frame 28. Therefore, the attachment member 29 for formal crimping is moved in the Z-axis direction in a state where heat conduction is possible with the frame body 28 as a heat conduction member. Thereby, even if the attachment for attachment 29 is moved in the Z-axis direction due to the compression of the rubber member 19a, the attachment for attachment 29 is supplied with heat from the heating block 18 for attachment through the housing 28.

Hereinafter, the head 30 for full pressure bonding according to the fourth embodiment of the present invention will be described using FIG. 11.

As shown in FIG. 11 (a), the main crimping head 30 as a mounting head transmits the driving force (pressurizing force) of the main crimping unit 16 (see FIG. 1) to the wafer component D. The main crimping head 30 is provided with a main crimping heating block 31, a metal-containing spring 32 as a heat conduction member, and a plurality of full crimping attachments 33.

The heating block 31 for the main crimping is formed in a rectangular parallelepiped, and one side surface thereof is attached to the mounting portion 16 a of the unit 16 for the main crimping (see FIG. 3). In addition, a main pressure heating heater 31a composed of a cartridge heater is assembled in the main pressure bonding heating block 31 near the other side surface of the back side of one side surface. The inner side space 31b of the spring 32 is constituted on the other side surface of the heating block 31 for formal crimping. The built-in space 31b is formed by a recessed portion or a hole formed in the other side surface of the heating block 31 for full compression bonding. The built-in space 31b is formed in a size where the spring 32 can be arranged. In addition, an opening portion on the side of the interior space 31b opposite to the main crimping platform 14 constitutes an engaging portion 31c that supports the spring 32. The engaging portion 31c is formed of a convex portion that protrudes inward from an opening portion of the built-in space 31b. The engaging portion 31 c is formed in a size capable of supporting the spring 32. In addition, in this embodiment, the internal space 31b and the engaging portion 31c are used for processing and crimping. The heating block 31 is formed, but it is not limited to this, and a plurality of heating blocks 31 for official crimping may be arranged at a specific interval to constitute the interior space 31b. In addition, the engaging portion 31c may be constituted by a plate-like member or the like attached to the heating block 31 for formal crimping.

The metal-containing spring 32 as the heat-conducting member holds the attachment 33 for formal crimping and transmits the heat accumulated by the heating block 31 for formal crimping to the attachment 33 for formal crimping. The spring 32 is composed of a compression spring. The spring 32 is arranged in the built-in space 31b of the heating block 31 for full crimping. At this time, one side end of the spring 32 is supported by the engaging portion 31 c of the heating block 31 for full crimping. That is, the spring 32 is connected to the heating block 31 for full compression bonding.

The attachment 33 for the main crimping is in contact with the wafer component D and transmits pressure and heat. The attachment 33 for the main crimping includes a processing portion 33 a that presses and heats the wafer component D, and a heat transfer portion 33 b that transmits heat from the spring 32 to the processing portion 33 a. The processing portion 33a is formed in a shape corresponding to the shape of the wafer component D. The heat transfer portion 33b is formed of a rod-shaped member. The attachment 33 for full crimping is comprised by connecting the processing part 33a to one side end part of the heat transfer part 33b. In addition, the attachment member 33 for formal crimping is configured to expand the diameter of the other end portion of the heat transfer portion 33b to engage the spring 32. The heat transfer portion 33b of the attachment 33 for formal crimping is slidably inserted into the interior space 31b of the heating block 31 for formal crimping. In addition, the other end portion of the heat transfer portion 33 b of the official crimping attachment 33 is fastened to the other end of the spring 32. In other words, the attachment 33 for full pressure contact is connected to the spring 32. Thereby, the attachment member 33 for formal crimping is supported by the spring 32 built in the heating block 31 for formal crimping.

A heat-resistant rubber member 33c, which is an elastic member, is disposed between the heat-bonding block 31 for the full-compression-bonding and the attachment 33 for the full-compression-bonding. The rubber member 33c is formed at a substantially center with a hole into which the heat transfer portion 33b of the attachment member 33 for formal crimping is inserted. That is, the rubber member 33c is arranged so as to surround the heat transfer portion 33b. With such a configuration, the accessory 33 for formal crimping secures the compression amount of the rubber member 33c necessary to absorb mounting errors, and suppresses positional displacement caused by deviations in the compression amount of the rubber member 33c. In addition, in this embodiment, the rubber member 33c may not be fixed to the heating block 31 for formal crimping and the heating block 31 for formal crimping. Attachment 33. Moreover, the rubber member 33c may be divided and arranged around the heat transfer part 33b.

The heat transfer portion 33b of the attachment 33 for formal crimping is formed by a length of a certain amount of bending of the spring 32 disposed between the engaging portion 31c of the heating block 31 for formal crimping and the other end of the heat transfer portion 33b. . That is, the attachment member 33 for full compression bonding is supported by the heating block 31 for full compression bonding in a state where the rubber member 33c is compressed by the bending of the spring 32. The attachment 33 for full crimping is configured to be movable in the Z-axis direction in a state where it is in contact with the spring 32 by being slidably inserted into the built-in space 31b. Furthermore, in this embodiment, the spring 32 is constituted by a compression spring, but it is not limited to this, and the tension spring may be arranged so as to attract the attachment 33 for formal compression to the heating block 31 for formal compression. Make up. Moreover, in this embodiment, a heat transfer part 33b and a spring 32 are provided in one attachment 33 for formal crimping, but it is not limited thereto, and a plurality of heat transfers may be provided in one attachment 33 for formal crimping. The structure of the part 33b and the spring 32.

Hereinafter, a detailed description will be given of the state of the heat of the formal crimping head 30 during the formal crimping of the mounting device 1 of the present invention.

As shown in FIG. 11 (b), the control device 23 (see FIG. 4) of the mounting device 1 causes the main crimp heater 30 a of the main crimp head 30 to generate heat. The heat accumulated in the formal crimping heating block 31 heated to a specific temperature is transmitted to the heat transfer portion 33b of the formal crimping attachment 33 supported by the spring 32 (refer to the light ink arrow symbol).

Then, the control device 23 of the mounting device 1 drives the main crimping unit 16 to move the main crimping head 30 closer to the main crimping platform 14 (see FIG. 1). Attachment 33 for full crimping is in contact with the wafer component D, and the rubber member 33c is compressed by the pressure of the main crimping unit 16 to move in the Z-axis direction based on the heating block 31 for the full crimping (refer to the figure). 11 (a)).

The attachment 33 for full crimping is held in a state where the heat transfer portion 33b is in contact with the spring 32. Therefore, the attachment 33 for formal crimping is moved in the Z-axis direction in a state where heat conduction is possible between the heat transfer portion 33b and the spring 32. With this, the accessory 33 for full crimping is The attachment member 33 for the type crimping is moved in the Z-axis direction due to the compression of the rubber member 33c, and heat is also supplied from the heating block 31 for regular crimping via the spring 32.

By using the formal crimping head 30 configured as described above, the accessory 33 for formal crimping is supported in a state where the spring 32 is bent. Therefore, even when the rubber member 33c is compressed during pressurization, the accessory 33 for formal crimping and There is also no relative movement between the springs 32. In addition, since the head 32 for the main crimping is provided with the spring 32 inside the heating block 31 for the main crimping, it is not necessary to arrange a spring or the like around the attachment 33 for the main crimping. Thereby, a plurality of attachments 33 for official crimping can be arranged close to each other. Thereby, the positional difference in the pressing direction of the wafer component D can be absorbed by the rubber member 33c while heating the attachment 33 for formal crimping.

[Industrial availability]

The invention relates to a mounting head and a mounting device using the same. In detail, it can be used for the mounting head which mounts a chip part etc. on a circuit board, and a mounting apparatus using the same.

Claims (10)

A mounting head is used for heating and pressurizing a wafer part to be connected to a specific position on a circuit board, and includes: an accessory part that contacts the wafer part; a heating block that heats the accessory part; an elastic member that is disposed on Between the accessory and the heating block, and compressed by the accessory and the heating block when pressurized; and a heat conductive member, which is connected to the accessory and the heating block, deforms and follows the accessory when pressurized. The mounting head according to claim 1, wherein the heat-conducting member includes a spring and holds the accessory. The mounting head according to claim 1 or 2, wherein the elastic member is a plate-shaped member having a thickness of 0.1 mm to 1 mm. For example, the mounting head of claim 1 or 2, wherein a portion of the accessory which is in contact with the wafer component is configured to have a thickness of 0.5 mm or more and 5 mm or less. For example, the mounting head of claim 3, wherein the portion of the accessory that is in contact with the wafer component is configured to have a thickness of 0.5 mm to 5 mm. For example, the mounting head of claim 1 or 2, wherein the built-in space of the spring is formed in the heating block, and the spring is arranged in the built-in space in a bent state. For example, the mounting head of claim 3, wherein the interior space of the spring is formed in the heating block, and the spring is disposed in the interior space in a bent state. For example, the mounting head of claim 4, wherein the built-in space of the spring is formed in the heating block, and the spring is arranged in the built-in space in a bent state. For example, the mounting head of claim 5, wherein the built-in space of the spring is formed in the heating block, and the spring is arranged in the built-in space in a bent state. A mounting device that heats a wafer part by a mounting head according to any one of claims 1 to 9 and connects the wafer part to a circuit board by applying pressure with a specific load.