JP2010232234A - Mounting device and mounting method - Google Patents

Mounting device and mounting method Download PDF

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JP2010232234A
JP2010232234A JP2009075325A JP2009075325A JP2010232234A JP 2010232234 A JP2010232234 A JP 2010232234A JP 2009075325 A JP2009075325 A JP 2009075325A JP 2009075325 A JP2009075325 A JP 2009075325A JP 2010232234 A JP2010232234 A JP 2010232234A
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chip
height
circuit board
chip component
bonding
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Katsumi Terada
勝美 寺田
Hajime Hirata
肇 平田
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device and a monitoring method capable of preventing mounting failures of chip components even if variations are generated in thicknesses of the chip components in the mounting device for temporarily compression-bonding the chip components on each circuit pattern of a circuit board having a plurality of circuit patterns formed thereon via resin, and pressing and heating the plurality of chip components and the circuit board to compression-bond and mount the chip components on the circuit board in a step subsequent to the temporarily compression-bonding step. <P>SOLUTION: In the mounting device, a press applying head for mounting chip components according to circuit patterns one by one and a height detecting means for detecting heights of the chip components temporarily compression-bonded on the circuit board are provided in a temporarily compression-bonding portion for temporarily compression-bonding the plurality of chip components via the resin on the circuit board having the plurality of circuit patterns formed thereon. The mounting device has a chip repair determining means for checking variations of the heights detected by the height detecting means in units of the number of the plurality of chip components to be integrally compression-bonded in a step subsequent to the temporarily compression-bonding step, and determining the detachment of chip components on the basis of the variation of the heights. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、集積回路素子などのチップ部品を基板に実装する実装装置および実装方法に関するものである。   The present invention relates to a mounting apparatus and a mounting method for mounting a chip component such as an integrated circuit element on a substrate.

近年、エレクトロニクス製品の軽量化、小型化に伴い、回路基板のパターンのファインピッチ化(高精度化・微細化)が進められている。このような回路基板への集積回路などのチップ部品の実装は、チップ部品を位置合わせして樹脂を介して回路パターンに実装する仮圧着工程と、回路パターンに実装されたチップ部品を加圧し加熱して接合させる本圧着工程とが行われている。   In recent years, with the reduction in weight and size of electronic products, finer pitches (higher precision / miniaturization) of circuit board patterns have been promoted. Mounting of chip parts such as integrated circuits on such circuit boards includes a temporary crimping process in which the chip parts are aligned and mounted on a circuit pattern via a resin, and the chip parts mounted on the circuit pattern are pressurized and heated. And a main press-bonding step to be joined.

チップ部品を回路基板に本圧着して実装する装置として、本出願人は特許文献1の実装装置を出願している。   The present applicant has applied for a mounting apparatus of Patent Document 1 as an apparatus for mounting a chip component on a circuit board by subjecting the chip component to a circuit board.

特許文献1の実装装置300は図8に示すように、回路基板2を水平保持する可動テーブル303と、チップ部品4を上方から加圧するヘッド312を備えた加圧手段305と、チップ部品4と加圧手段305との間に介在させる弾性材306と、回路基板2の下方から樹脂を加熱硬化させる加熱手段308とを備えている。   As shown in FIG. 8, the mounting apparatus 300 of Patent Document 1 includes a movable table 303 that horizontally holds the circuit board 2, a pressure unit 305 that includes a head 312 that pressurizes the chip component 4 from above, a chip component 4, and the like. An elastic member 306 interposed between the pressurizing unit 305 and a heating unit 308 for heating and curing the resin from below the circuit board 2 are provided.

そして、回路基板2に整列した複数個のチップ部品4を覆うように、これらチップ部品4と加圧手段305に設けられたヘッド312との間に弾性材306を介在し、弾性材306の上方からヘッド312を加圧している。このとき、弾性材306がチップ部品4ごとの厚みのバラツキを吸収して均等に加圧するとともに、回路基板2の下方の加熱手段308から加熱されてチップ部品4の実装された回路基板2の裏面部分のみ加熱して回路基板2とチップ部品4の間に塗布された樹脂を加熱硬化するようになっている。   Then, an elastic material 306 is interposed between the chip components 4 and the head 312 provided in the pressure unit 305 so as to cover the plurality of chip components 4 aligned on the circuit board 2, and above the elastic material 306. The head 312 is pressurized. At this time, the elastic material 306 absorbs the thickness variation of each chip component 4 and pressurizes evenly, and is heated from the heating means 308 below the circuit board 2 to be mounted on the back surface of the circuit board 2 on which the chip component 4 is mounted. Only a portion is heated to heat and cure the resin applied between the circuit board 2 and the chip component 4.

これにより、複数個のチップ部品4を同時に回路基板2に本圧着して実装することができるようにしている。   As a result, a plurality of chip components 4 can be simultaneously bonded to the circuit board 2 and mounted.

特開2004−259917号公報JP 2004-259917 A

一方、回路基板に実装されるチップ部品は、ウエハに形成された電子回路をダイシングなどにより個片状に切り出したものであるため、個々のウエハの厚みがそのままチップ部品の厚みとなる。一枚の回路基板に複数のチップ部品を実装する場合、複数のウエハから切り出されたチップ部品が混在して仮圧着される。一方、ウエハの厚みはバラツキを持っており、仮圧着されたチップ部品の高さもバラツキを生じることになる。   On the other hand, since the chip component mounted on the circuit board is obtained by cutting an electronic circuit formed on the wafer into individual pieces by dicing or the like, the thickness of each wafer becomes the thickness of the chip component as it is. When a plurality of chip components are mounted on one circuit board, chip components cut out from a plurality of wafers are mixed and temporarily pressed. On the other hand, the thickness of the wafer varies, and the height of the temporarily bonded chip parts also varies.

このようなチップ部品の高さにバラツキが発生している回路基板を、特許文献1のような構成の実装装置で一括に本圧着すると、チップ部品とボンディングヘッドの間に介在した弾性材ではチップ部品の高さのバラツキを吸収することができずに、チップ部品の実装不良を招くことがあった。   When circuit boards with such variations in the height of chip components are collectively pressure bonded together by a mounting apparatus having a configuration as in Patent Document 1, an elastic material interposed between the chip components and the bonding head is used as a chip. The variation in the height of the components cannot be absorbed, and the mounting failure of the chip components may be caused.

そこで、上記問題点に鑑み、複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を樹脂を介して仮圧着した後、仮圧着の次の工程で複数チップ部品と回路基板を加圧および加熱してチップ部品を回路基板に本圧着して実装させる実装装置において、チップ部品の厚さにバラツキが生じていても、チップ部品の実装不良が発生しない実装装置および実装方法を提供することを目的とする。   In view of the above problems, a chip component is temporarily bonded to each circuit pattern of a circuit board on which a plurality of circuit patterns are formed via a resin, and then the plurality of chip components and the circuit substrate are added in the next step of the temporary bonding. Provided are a mounting apparatus and a mounting method in which a chip component is not mounted poorly even if the thickness of the chip component varies, in a mounting apparatus in which the chip component is mounted on the circuit board by pressure bonding and heating. For the purpose.

以上の課題を解決するために、請求項1に記載の発明は、
複数の回路パターンが形成された回路基板に、複数のチップ部品を樹脂を介して仮圧着する仮圧着部に、
回路パターンにチップ部品を一つずつ実装する加圧ヘッドと、回路基板に仮圧着されたチップ部品の高さを検出する高さ検出手段を備え、
仮圧着の次の工程でチップ部品を一括して本圧着を行う、複数のチップ部品の個数を単位として、前記高さ検出手段が検出した高さのバラツキを調べて、前記高さのバラツキに基づいてチップ部品の取り外しを判断するチップリペア判断手段を備えたことを特徴とする実装装置である。
In order to solve the above problems, the invention described in claim 1
In a temporary press-bonding part that temporarily press-bonds a plurality of chip components to a circuit board on which a plurality of circuit patterns are formed via a resin,
A pressure head for mounting chip components one by one on the circuit pattern, and a height detection means for detecting the height of the chip components temporarily bonded to the circuit board,
In the next step of pre-bonding, the chip components are collectively bonded together. The variation in the height detected by the height detecting means is examined in units of the number of chip components, and the variation in the height is determined. A mounting apparatus comprising chip repair determining means for determining removal of a chip component based on the chip component.

請求項2に記載の発明は、
請求項1に記載の発明において、
チップ部品の高さを検出する前記高さ検出手段が、前記加圧ヘッドに備えられ、前記加圧ヘッドとともに移動する構成であり、
チップ部品の仮圧着の完了した状態で、前記加圧ヘッドと回路基板との距離を測定することにより、チップ部品の高さを検出する高さ検出手段からなる実装装置である。
The invention described in claim 2
In the invention of claim 1,
The height detecting means for detecting the height of the chip component is provided in the pressure head, and moves with the pressure head,
A mounting apparatus comprising height detection means for detecting the height of the chip component by measuring the distance between the pressure head and the circuit board in a state where the temporary bonding of the chip component is completed.

請求項3に記載の発明は、
請求項1に記載の発明において、
チップ部品の高さを検出する前記高さ検出手段が、前記加圧ヘッドを駆動する昇降手段に備えられ、昇降手段の駆動部にマウントされた駆動部の位置検出器の位置検出信号を測定することにより、チップ部品の高さを検出する高さ検出手段からなる実装装置である。
The invention according to claim 3
In the invention of claim 1,
The height detecting means for detecting the height of the chip component is provided in an elevating means for driving the pressure head, and measures a position detection signal of a position detector of a driving unit mounted on the driving unit of the elevating means. Thus, the mounting device includes a height detecting means for detecting the height of the chip component.

請求項4に記載の発明は、
請求項1から3のいずれかに記載の発明において、
前記チップリペア判断手段の判断結果に基づいて、チップリペア箇所を指示する表示部を有した実装装置である。
The invention according to claim 4
In the invention according to any one of claims 1 to 3,
The mounting apparatus includes a display unit for instructing a chip repair location based on a determination result of the chip repair determination unit.

請求項5に記載の発明は、
複数の回路パターンが形成された回路基板に、樹脂を介して複数のチップ部品を仮圧着する実装方法であって、
加圧ヘッドに吸着保持されたチップ部品を、基板保持ステージに保持された回路基板に押圧し仮圧着するステップと、
前記回路基板に仮圧着されたチップ部品の高さを検出し記憶するステップと、
仮圧着の次の工程における、チップ部品を一括して本圧着する複数のチップ部品の個数を単位として、前記記憶されたチップ部品の高さの最大値と最小値との範囲が、予め設定されているチップ部品の高さの許容値の範囲内であるかを判断するステップと、
を有する実装方法である。
The invention described in claim 5
A mounting method in which a plurality of chip parts are temporarily bonded to a circuit board on which a plurality of circuit patterns are formed via a resin,
A step of pressing and temporarily pressing the chip component sucked and held by the pressure head against the circuit board held by the substrate holding stage;
Detecting and storing the height of the chip part temporarily bonded to the circuit board;
A range between the maximum value and the minimum value of the height of the stored chip parts is set in advance in units of the number of chip parts to which the chip parts are subjected to final pressure bonding in a batch in the next step of the temporary pressure bonding. Determining whether the height of the chip component is within a tolerance range;
Is a mounting method.

請求項1に記載の発明によれば、複数の回路パターンが形成された回路基板の各回路パターンにチップ部品を実装する仮圧着部において、チップ部品の厚さにバラツキが許容範囲を外れていても、チップ部品の仮圧着実装の際に、高さ検出手段によりチップ部品の高さを検出し、回路基板に実装されたチップ部品を取り外すチップリペア判断手段を備えているので、チップ部品の厚さにバラツキを許容範囲内に納めることができ、良好なチップ部品の実装ができる。   According to the first aspect of the present invention, in the temporary press-bonding portion for mounting the chip component on each circuit pattern of the circuit board on which a plurality of circuit patterns are formed, the thickness of the chip component is not within an allowable range. In addition, when the chip component is temporarily crimped and mounted, the height detection unit detects the height of the chip component and includes a chip repair determination unit that removes the chip component mounted on the circuit board. In addition, the variation can be kept within an allowable range, and a good chip component can be mounted.

請求項2に記載の発明によれば、チップ部品の高さを検出する高さ検出手段が、加圧ヘッドに備えられ、加圧ヘッドとともに移動する構成である。そして、チップ部品の仮圧着の完了した状態で、加圧ヘッドと回路基板との距離を測る。そのため、仮圧着が完了した時点のチップ部品の高さバラツキを正確に測定することができる。   According to the second aspect of the present invention, the height detecting means for detecting the height of the chip component is provided in the pressure head and moves together with the pressure head. Then, the distance between the pressure head and the circuit board is measured in a state where the temporary pressure bonding of the chip component is completed. Therefore, it is possible to accurately measure the height variation of the chip component at the time when the temporary pressure bonding is completed.

請求項3に記載の発明によれば、チップ部品の高さを検出する高さ検出手段が、加圧ヘッドを駆動する昇降手段に備えられ、昇降手段の駆動部にマウントされた駆動部の位置検出器の位置検出信号を測定することにより、チップ部品の高さを検出する高さ検出手段である。そのため、専用の高さ検出手段を加圧ヘッドに設けなくても、仮圧着が完了した時点のチップ部品の高さバラツキを正確に測定することができる。   According to the third aspect of the present invention, the height detecting means for detecting the height of the chip component is provided in the elevating means for driving the pressure head, and the position of the driving section mounted on the driving section of the elevating means. This is a height detection means for detecting the height of the chip component by measuring the position detection signal of the detector. Therefore, it is possible to accurately measure the height variation of the chip component at the time when the temporary pressure bonding is completed without providing a dedicated height detection means in the pressure head.

請求項4に記載の発明によれば、チップリペア判断手段の判断結果に基づいて、チップリペア箇所を指示する表示部を有しているので、効率よくチップ部品のリペアを行うことができる。   According to the fourth aspect of the present invention, since the display unit for indicating the chip repair location is provided based on the determination result of the chip repair determination means, the chip parts can be repaired efficiently.

請求項5に記載の発明によれば、仮圧着において、チップ部品の高さを検出し、チップ部品を一括して本圧着する複数のチップ部品の個数を単位として、本圧着の許容範囲かどうかを判断する。そのため、チップ部品の高さバラツキを許容範囲内に納めることができ良好なチップ部品と回路基板の実装ができるようになる。   According to the fifth aspect of the present invention, in the temporary crimping, whether or not the height of the chip component is detected, and whether or not the allowable range of the final crimping is in the unit of the number of the plurality of chip components that are final crimped together. Judging. As a result, the height variation of the chip components can be kept within an allowable range, and a good chip component and circuit board can be mounted.

本発明の実施の形態に係る実装装置の概略斜視図である。1 is a schematic perspective view of a mounting apparatus according to an embodiment of the present invention. 本発明の仮圧着部の概略構成を示す側面図である。It is a side view which shows schematic structure of the temporary crimping | compression-bonding part of this invention. 本発明の仮圧着部におけるチップ部品高さを測定する概略側面図である。It is a schematic side view which measures the chip component height in the temporary crimping | compression-bonding part of this invention. 回路基板の概略平面図である。It is a schematic plan view of a circuit board. 回路基板の概略側面図である。It is a schematic side view of a circuit board. 本発明の実装装置の動作を説明するフローチャートである。It is a flowchart explaining operation | movement of the mounting apparatus of this invention. チップリペア判断手段の構成を説明するブロック図である。It is a block diagram explaining the structure of a chip repair determination means. 従来の実装装置の概略斜視図である。It is a schematic perspective view of the conventional mounting apparatus.

以下、図面を参照して本発明の実施の形態を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1は、本実施の形態に係る実装装置1の概略斜視図である。図1において、実装装置1に向かって左右方向をX軸、手前方向をY軸、X軸とY軸で構成されるXY平面に直交する軸をZ軸、Z軸を中心として回転する方向をθ方向とする。実装装置1は、回路基板2にチップ部品4を仮圧着する仮圧着部100と、回路基板2にチップ部品4を本圧着する本圧着部200と、実装装置1の全体を制御する制御部150とから構成されている。   FIG. 1 is a schematic perspective view of a mounting apparatus 1 according to the present embodiment. In FIG. 1, the direction toward the mounting apparatus 1 is the X axis as the left and right direction, the Y axis as the front direction, the Z axis as the axis perpendicular to the XY plane composed of the X axis and the Y axis, and the direction rotating around the Z axis. The direction is θ. The mounting apparatus 1 includes a temporary crimping unit 100 that temporarily crimps the chip component 4 to the circuit board 2, a final crimping unit 200 that crimps the chip component 4 to the circuit board 2, and a control unit 150 that controls the entire mounting apparatus 1. It consists of and.

仮圧着部100は、基台101上に載置された基板保持ステージ102と、基台101のY方向後方に設けられた支持フレーム103と、支持フレーム103に設けられ回路基板2にチップ部品4を仮圧着する加圧手段104と、チップ部品4を回路基板2から取り外すリペアステージ105とから構成されている。   The temporary pressure bonding unit 100 includes a substrate holding stage 102 placed on the base 101, a support frame 103 provided behind the base 101 in the Y direction, and a chip component 4 on the circuit board 2 provided on the support frame 103. Is composed of a pressurizing means 104 for temporarily press-fitting and a repair stage 105 for removing the chip component 4 from the circuit board 2.

基板保持ステージ102には、図示していない搬送手段により回路基板2が供給される。基板保持ステージ102は、XY方向およびθ方向に移動可能な位置調整手段106が備えられている。位置調整手段106は、サーボモータに連結されたボールねじなどの機構により基板保持ステージ102をXY方向およびθ方向に駆動するように構成されている。   The circuit board 2 is supplied to the substrate holding stage 102 by a conveying means (not shown). The substrate holding stage 102 is provided with position adjusting means 106 that can move in the XY direction and the θ direction. The position adjusting means 106 is configured to drive the substrate holding stage 102 in the XY direction and the θ direction by a mechanism such as a ball screw connected to a servo motor.

加圧手段104と基板保持ステージ102をY方向手前から参照した場合の構成図を図2に示す。図2に示すように、支持フレーム103に設けられた加圧手段104は、Z方向に駆動する加圧ヘッド107と、加圧ヘッド107の回路基板2側に接続されたチップ部品4を吸着保持するアタッチメント109と、加圧ヘッド107を駆動する昇降手段108と、昇降手段108に設けられたトルク検出器110と、加圧ヘッド107の側面に設けられた距離センサ111とから構成されている。   FIG. 2 shows a configuration diagram when the pressing unit 104 and the substrate holding stage 102 are referenced from the front in the Y direction. As shown in FIG. 2, the pressing means 104 provided on the support frame 103 sucks and holds the pressing head 107 driven in the Z direction and the chip component 4 connected to the circuit board 2 side of the pressing head 107. An attachment 109 for driving the pressure head 107, a torque detector 110 provided on the lift means 108, and a distance sensor 111 provided on a side surface of the pressure head 107.

昇降手段108は、サーボモータとボールねじの機構により加圧ヘッド107をZ方向に駆動するように構成されている。サーボモータとボールねじの構成に限らず、圧空シリンダとピストンの構成にしてもよい。加圧ヘッド107に加わる加圧力は、トルク検出器110で検出できるようになっている。   The elevating means 108 is configured to drive the pressure head 107 in the Z direction by a mechanism of a servo motor and a ball screw. Not only the configuration of the servo motor and the ball screw, but also the configuration of a pneumatic cylinder and a piston may be used. The pressure applied to the pressure head 107 can be detected by the torque detector 110.

アタッチメント109に吸着保持されたチップ部品4には回路基板2の電極と接続されるバンプ5が設けられている。また、回路基板2には、チップ部品4のバンプ5と接続する電極3が設けられている。回路基板2の電極3には樹脂6が塗布されている。   The chip component 4 sucked and held by the attachment 109 is provided with bumps 5 connected to the electrodes of the circuit board 2. The circuit board 2 is provided with electrodes 3 connected to the bumps 5 of the chip component 4. Resin 6 is applied to the electrodes 3 of the circuit board 2.

回路基板2へのチップ部品4の実装は、回路基板2に付された位置合わせマークとチップ部品4に付された位置合わせマークとを図示しない画像認識手段により画像認識した後、位置合わせを行い、アタッチメント109に吸着保持されたチップ部品4を回路基板2側に押し付けることにより行われる。具体的には、加圧ヘッド107はトルク検出器110が所定のトルクを検出する位置まで下降し、チップ部品4を回路基板2に押し付けた後(仮圧着工程)、アタッチメント109のチップ部品4の吸着保持を解除し、加圧ヘッド107を上昇させる。仮圧着部100では、所定時間、チップ部品4を回路基板2に押し付け樹脂6により仮固定される工程までが行われる。   The chip component 4 is mounted on the circuit board 2 after the image recognition means (not shown) recognizes the alignment mark attached to the circuit board 2 and the alignment mark attached to the chip component 4, and then the alignment is performed. This is done by pressing the chip component 4 sucked and held by the attachment 109 against the circuit board 2 side. Specifically, the pressure head 107 is lowered to a position where the torque detector 110 detects a predetermined torque, and after pressing the chip component 4 against the circuit board 2 (temporary pressure bonding step), the chip component 4 of the attachment 109 is pressed. The suction holding is released and the pressure head 107 is raised. In the temporary press-bonding portion 100, a process up to a predetermined time is performed until the chip component 4 is pressed against the circuit board 2 and temporarily fixed by the resin 6.

図3にチップ部品4を回路基板2に押し付け、トルク検出器110が所定のトルクを検出した状態を示す。チップ部品4のバンプ5と回路基板2の電極3が接触した状態となる。この状態で、チップ部品4と回路基板2は樹脂6によって仮固定される。   FIG. 3 shows a state where the chip component 4 is pressed against the circuit board 2 and the torque detector 110 detects a predetermined torque. The bump 5 of the chip component 4 and the electrode 3 of the circuit board 2 are in contact with each other. In this state, the chip component 4 and the circuit board 2 are temporarily fixed by the resin 6.

加圧ヘッド107の側面に設けられた距離センサ111は、チップ部品4を回路基板2に押し付け、トルク検出器110が所定のトルクを検出した時の、加圧ヘッド107と回路基板2との距離からチップ部品4の高さHを検出し、制御部150の記憶部151に検出結果を記憶させる。   The distance sensor 111 provided on the side surface of the pressure head 107 presses the chip component 4 against the circuit board 2 and the distance between the pressure head 107 and the circuit board 2 when the torque detector 110 detects a predetermined torque. Then, the height H of the chip component 4 is detected, and the detection result is stored in the storage unit 151 of the control unit 150.

距離センサ111は、本発明の高さ検出手段に相当する。距離センサ111は、赤外線レーザ光を利用した距離センサや、超音波信号を利用した距離センサなどが適用できる。また、サーボモータとボールねじで構成された昇降手段で、サーボモータにマウントされたエンコーダなどの位置検出器の信号を利用しても良い。具体的には、生産開始に先だって、回路基板2を基板保持ステージ102に保持させる前に、チップ部品4の吸着保持されていない加圧ヘッド107を下降させて、基板保持ステージ102にアタッチメント109を接地させる。この状態の時のエンコーダの位置検出信号を基準位置として制御部150の記憶部151に記憶させる。次に、生産を開始し、回路基板2を基板保持ステージ102に保持し、アタッチメント109にチップ部品4を吸着保持する。仮圧着部100でチップ部品4を回路基板2に押し付け、トルク検出器110が所定のトルクを検出した時の、エンコーダの位置検出信号を測定する。測定された値と前記基準位置との差からチップ部品4の高さHを求める。   The distance sensor 111 corresponds to the height detection means of the present invention. As the distance sensor 111, a distance sensor using an infrared laser beam, a distance sensor using an ultrasonic signal, or the like can be applied. In addition, a lifting / lowering means constituted by a servo motor and a ball screw may use a signal from a position detector such as an encoder mounted on the servo motor. Specifically, prior to the start of production, before the circuit board 2 is held on the substrate holding stage 102, the pressure head 107 on which the chip component 4 is not sucked and held is lowered to attach the attachment 109 to the substrate holding stage 102. Ground. The position detection signal of the encoder in this state is stored in the storage unit 151 of the control unit 150 as a reference position. Next, production is started, the circuit board 2 is held on the board holding stage 102, and the chip component 4 is sucked and held on the attachment 109. The chip component 4 is pressed against the circuit board 2 by the temporary crimping unit 100, and the position detection signal of the encoder when the torque detector 110 detects a predetermined torque is measured. The height H of the chip component 4 is obtained from the difference between the measured value and the reference position.

図4に、回路基板2をZ方向上側から参照した状態、図5に回路基板2をY方向側面から参照した状態、を示す。図4に示すように、回路基板2には、複数の回路パターン7が形成されており、各回路パターン7にチップ部品4が仮圧着部100で仮圧着される。回路パターン7はXY平面で縦横に整列して配置されている。X方向を列とし、チップ部品4は列に従って順次仮圧着が行われ、列毎に仮圧着が完了するとY方向に一列移動し、順次仮圧着が続行される。例として、図4では7列7行の場合を示した。   4 shows a state in which the circuit board 2 is referenced from the upper side in the Z direction, and FIG. 5 shows a state in which the circuit board 2 is referenced from the side in the Y direction. As shown in FIG. 4, a plurality of circuit patterns 7 are formed on the circuit board 2, and the chip component 4 is temporarily crimped to each circuit pattern 7 by a temporary crimping portion 100. The circuit pattern 7 is aligned in the vertical and horizontal directions on the XY plane. The X direction is a row, and the chip components 4 are sequentially subjected to temporary pressure bonding in accordance with the rows. When the temporary pressure bonding is completed for each row, the chip components 4 are moved one row in the Y direction, and the temporary pressure bonding is continued. As an example, FIG. 4 shows the case of 7 columns and 7 rows.

図5は、図4における1列分のチップ部品4と回路基板2の断面を示している。チップ部品4の回路基板2からの高さHは、ウエハの厚さバラツキの影響を受けて、図5に示すH1〜H7のようにばらついてしまう。これらの高さデータH1〜H7は制御部150の記憶部151に記憶される。また、記憶部151には、後述する本圧着部200に備えられた加圧ヘッド207が一度に加圧する回路基板2上のチップ部品4の加圧数データPDが記憶される。加圧数データPDは、チップ部品の個数の単位となる。また、記憶部151には本圧着部200で一括圧着する際に加圧が可能なチップ部品4の高さバラツキの許容範囲Vが記憶される。   FIG. 5 shows a cross section of the chip component 4 and the circuit board 2 for one row in FIG. The height H of the chip component 4 from the circuit board 2 varies as indicated by H1 to H7 shown in FIG. 5 due to the influence of wafer thickness variation. These height data H1 to H7 are stored in the storage unit 151 of the control unit 150. In addition, the storage unit 151 stores the number-of-pressing data PD of the chip component 4 on the circuit board 2 that is pressurized at once by the pressing head 207 provided in the main press-bonding unit 200 described later. The pressurization number data PD is a unit of the number of chip parts. In addition, the storage unit 151 stores an allowable range V of the height variation of the chip component 4 that can be pressurized when the main crimping unit 200 performs the batch crimping.

図5の場合、加圧数データPDは、7個が対応する(図5の高さデータH1〜H7で範囲を示した部分)。また、許容範囲Vは、チップ部品4の高さが最大となっているH4の位置から回路基板2側にVの範囲としている。   In the case of FIG. 5, the pressurization number data PD corresponds to 7 pieces (the portion whose range is indicated by the height data H <b> 1 to H <b> 7 in FIG. 5). The allowable range V is a range of V from the position of H4 where the height of the chip component 4 is maximum to the circuit board 2 side.

制御部150の演算部152では、高さデータH1〜H7から、最大高さHmaxと最小高さHminを求める。次に、最大高さHmaxと最小高さHminの差Hdifを求める(計算式はHdif=|Hmax−Hmin|となる)。次に、差Hdifと許容範囲Vとを比較し、差Hdifが許容範囲Vの範囲外ならば、高さデータH1〜H7から、許容範囲Vから外れたチップ部品4を求める。次に、許容範囲Vから外れるチップ部品4を表示部153に表示し、回路基板2をリペアステージ105に搬送を指示する。そのため、回路基板2に仮圧着されるチップ部品4の厚みがばらついていても、チップ部品4のリペアが行われ、本圧着部200で実装不良を発生することがない。   The calculation unit 152 of the control unit 150 obtains the maximum height Hmax and the minimum height Hmin from the height data H1 to H7. Next, a difference Hdif between the maximum height Hmax and the minimum height Hmin is obtained (the calculation formula is Hdif = | Hmax−Hmin |). Next, the difference Hdif is compared with the allowable range V. If the difference Hdif is outside the allowable range V, the chip component 4 that is out of the allowable range V is obtained from the height data H1 to H7. Next, the chip component 4 that is out of the allowable range V is displayed on the display unit 153, and the circuit board 2 is instructed to be transported to the repair stage 105. For this reason, even if the thickness of the chip component 4 temporarily bonded to the circuit board 2 varies, the chip component 4 is repaired, and mounting failure does not occur in the main bonding portion 200.

なお、制御部150の記憶部151および演算部152の一連の機能は、本発明のチップリペア判断手段に相当する。   A series of functions of the storage unit 151 and the calculation unit 152 of the control unit 150 corresponds to the chip repair determination unit of the present invention.

図7に、チップリペア判断手段の構成をブロック図で示す。チップリペア判断手段(B01)には、高さデータH1〜H7(B01)と、一括圧着の加圧数データPD(B03)と、一括圧着の許容範囲V(B04)とが入力される。そして、チップ部品の高さの最大値Hmaxおよび最小値Hminを求め(B05)、最大値Hmaxと最小値Hminの差Hdifを求め(B06)、許容範囲Vとの比較を行う(B07)。比較の結果、許容範囲Vを外れる場合は、リペアの指示信号(B08)が出力される。   FIG. 7 is a block diagram showing the configuration of the chip repair determination unit. The chip repair determination means (B01) is inputted with height data H1 to H7 (B01), press-fitting number data PD (B03) for batch crimping, and an allowable range V (B04) for batch crimping. Then, a maximum value Hmax and a minimum value Hmin of the height of the chip component are obtained (B05), a difference Hdif between the maximum value Hmax and the minimum value Hmin is obtained (B06), and a comparison with the allowable range V is performed (B07). As a result of the comparison, if the allowable range V is not satisfied, a repair instruction signal (B08) is output.

制御部150は、タッチパネル等の入出力装置、メモリチップやマイクロプロセッサなどを主体とした適当なハードウエア、このハードウエアを動作させるためのプログラムを組み込んだハードディスク装置、及び各構成部とデータ通信を行う適当なインターフェイス回路などから構成され、記憶部151はハードディスク装置、演算部152はメモリチップやマイクロプロセッサ、表示部153はタッチパネル等の入出力装置が対応する。   The control unit 150 communicates data with an input / output device such as a touch panel, appropriate hardware mainly including a memory chip and a microprocessor, a hard disk device incorporating a program for operating the hardware, and each component. The storage unit 151 corresponds to a hard disk device, the calculation unit 152 corresponds to a memory chip or a microprocessor, and the display unit 153 corresponds to an input / output device such as a touch panel.

図1にもどり、リペアステージ105は、基板保持ステージ102の近傍に配置され、リペアの必要となったチップ部品4を取り外すステージである。リペアは、ロボットなどにより自動で行っても良いし、人が介在して手動で行っても良い。また、リペアステージ105に回路基板2を搬送せずに、仮圧着部100の運転を停止して、基板保持ステージ102上でリペアを行っても良い。   Returning to FIG. 1, the repair stage 105 is a stage that is disposed in the vicinity of the substrate holding stage 102 and removes the chip component 4 that needs to be repaired. The repair may be performed automatically by a robot or the like, or may be performed manually with human intervention. Further, the operation of the temporary pressure bonding unit 100 may be stopped and the repair may be performed on the substrate holding stage 102 without conveying the circuit board 2 to the repair stage 105.

本圧着部200は、基台201上に載置された基板保持ステージ202と、基台201のY方向後方に設けられた支持フレーム203と、支持フレーム203に設けられ回路基板2にチップ部品4を本圧着する加圧手段204と、チップ部品4と加圧手段204の間に介在させる弾性材209と、樹脂を加熱硬化させる加熱手段210とから構成されている。   The main press bonding part 200 includes a substrate holding stage 202 placed on the base 201, a support frame 203 provided behind the base 201 in the Y direction, and a chip component 4 on the circuit board 2 provided on the support frame 203. Is composed of a pressurizing means 204 for main-compression bonding, an elastic material 209 interposed between the chip component 4 and the pressurizing means 204, and a heating means 210 for heat-curing the resin.

基板保持ステージ202には、図示していない搬送手段によりチップ部品4が仮圧着された回路基板2が供給される。基板保持ステージ202は、XY方向およびθ方向に移動可能な位置調整手段206が備えられている。位置調整手段206は、サーボモータに連結されたボールねじなどの機構により基板保持ステージ202をXY方向およびθ方向に駆動するように構成されている。   The substrate holding stage 202 is supplied with the circuit board 2 on which the chip component 4 has been temporarily pressure-bonded by a conveying means (not shown). The substrate holding stage 202 is provided with position adjusting means 206 that can move in the XY direction and the θ direction. The position adjusting means 206 is configured to drive the substrate holding stage 202 in the XY and θ directions by a mechanism such as a ball screw connected to a servo motor.

支持フレーム203に設けられた加圧手段204は、Z方向に駆動する加圧ヘッド207と、加圧ヘッド207を駆動する昇降手段とから構成されている。加圧ヘッド207は概略凸形状断面であって回路基板2のチップ部品4の列方向に伸びた柱状物である。そして、凸部先端で弾性材209を介して複数個のチップ部品4を一括に加圧する。   The pressurizing unit 204 provided on the support frame 203 includes a pressurizing head 207 that drives in the Z direction and an elevating unit that drives the pressurizing head 207. The pressure head 207 is a columnar object having a substantially convex cross section and extending in the column direction of the chip components 4 of the circuit board 2. Then, the plurality of chip components 4 are collectively pressed through the elastic material 209 at the tip of the convex portion.

弾性材209は、加圧ヘッド207とチップ部品4との間に介在するように、待機位置にある加圧ヘッド207を挟み込むように配備された巻取ローラ213と繰り出しローラ214とに懸架されている。この弾性材209を巻取ローラ213で巻き取ることにより、繰り出しローラ214から新たな弾性材209が供給されるようになっている。なお、弾性材209には、例えばガラスクロス入りのシリコンシートなどが使用される。また、弾性材209の厚みは、使用する実装部材などによって適宜に変更される。   The elastic member 209 is suspended between a take-up roller 213 and a feed roller 214 disposed so as to sandwich the pressure head 207 at the standby position so as to be interposed between the pressure head 207 and the chip component 4. Yes. A new elastic material 209 is supplied from the feeding roller 214 by winding the elastic material 209 with the winding roller 213. As the elastic material 209, for example, a silicon sheet containing glass cloth is used. Further, the thickness of the elastic member 209 is appropriately changed depending on the mounting member used.

次に、本発明の実装装置1の動作について図6のフロチャートを用いて説明する。
まず、仮圧着部100の基板保持ステージ102に回路基板2が搬送される。回路基板2には、予め各回路パターン7の位置に樹脂6が塗布されている(ステップST01)。
Next, operation | movement of the mounting apparatus 1 of this invention is demonstrated using the flowchart of FIG.
First, the circuit board 2 is conveyed to the substrate holding stage 102 of the temporary pressure bonding unit 100. Resin 6 is applied to the circuit board 2 in advance at the position of each circuit pattern 7 (step ST01).

次に、加圧ヘッド107の回路基板2側に接続されたチップ部品4を吸着保持するアタッチメント109に、チップ部品5を搬送し吸着保持する。吸着保持は、チップ部品4のバンプ5が回路基板2側になるように行われる(ステップST02)。   Next, the chip component 5 is conveyed and sucked and held on the attachment 109 that sucks and holds the chip component 4 connected to the circuit board 2 side of the pressure head 107. The suction holding is performed so that the bump 5 of the chip component 4 is on the circuit board 2 side (step ST02).

次に、回路基板2に付された位置合わせマークと、チップ部品4の位置合わせマークを図示しない画像認識手段により画像認識する。画像認識データに基づいて、基板保持ステージ102を位置調整手段106で駆動し、チップ部品4と回路パターン7の位置合わせを行う(ステップST03)。   Next, the image recognition means (not shown) recognizes the alignment mark attached to the circuit board 2 and the alignment mark of the chip component 4. Based on the image recognition data, the substrate holding stage 102 is driven by the position adjusting means 106 to align the chip component 4 and the circuit pattern 7 (step ST03).

次に、加圧ヘッド107を下降し、回路パターン7にチップ部品4を仮圧着する。仮圧着は、トルク検知器110が所定のトルクを検出してから所定時間だけ加圧を行い、チップ部品4のバンプ5を回路パターン7に設けられた電極3に押し込む(ステップST04)。   Next, the pressure head 107 is lowered, and the chip component 4 is temporarily pressure-bonded to the circuit pattern 7. Temporary press-bonding is performed for a predetermined time after the torque detector 110 detects a predetermined torque, and the bump 5 of the chip component 4 is pushed into the electrode 3 provided on the circuit pattern 7 (step ST04).

次に、距離センサ111を用いて、加圧ヘッド107と回路基板2との距離を測定する。測定結果は、チップ部品4の高さデータHとして回路パターン7の位置情報と共に、制御部150の記憶部151に記憶する(ステップST05)。   Next, the distance between the pressure head 107 and the circuit board 2 is measured using the distance sensor 111. A measurement result is memorize | stored in the memory | storage part 151 of the control part 150 with the positional information on the circuit pattern 7 as the height data H of the chip component 4 (step ST05).

次に、チップ部品4の吸着保持を解除して加圧ヘッド107を上昇させる。回路基板2の全回路パターン7にチップ部品4が仮圧着を完了していない場合は、ステップST02に戻り、順次、図4に示す矢印の順の回路パターン7に位置合わせを行いチップ部品4を仮圧着していく(ステップST06)。   Next, the suction holding of the chip component 4 is released and the pressure head 107 is raised. If the chip component 4 has not been pre-bonded to all the circuit patterns 7 of the circuit board 2, the process returns to step ST02, and the chip components 4 are sequentially aligned with the circuit pattern 7 in the order of the arrows shown in FIG. Temporary pressure bonding is performed (step ST06).

次に、全回路パターン7にチップ部品4が仮圧着させると、記憶部151に記憶されている各回路パターン7毎のチップ部品4の高さデータHと、本圧着部200の加圧ヘッド207が加圧できるチップ部品4の加圧数データPDと、加圧ヘッド207が一括加圧できる高さバラツキの許容範囲Vとから、許容範囲Vを超えるチップ部品4と回路パターン7の位置を求める(ステップST07)。   Next, when the chip components 4 are temporarily crimped to all the circuit patterns 7, the height data H of the chip components 4 for each circuit pattern 7 stored in the storage unit 151 and the pressure head 207 of the main crimping unit 200. The positions of the chip component 4 and the circuit pattern 7 that exceed the allowable range V are obtained from the pressing number data PD of the chip component 4 that can be pressed and the allowable range V of the height variation that the pressurizing head 207 can collectively press. (Step ST07).

具体的には、制御部150の演算部152において、加圧数データPDに対応するチップ部品4の高さデータH(例えば図5のH1〜H7)から、最大高さHmaxと最小高さHminを求める。次に、最大高さHmaxと最小高さHminの差Hdifを求める(計算式はHdif=|Hmax−Hmin|となる)。次に、差Hdifと許容範囲Vとを比較し、差Hdifが許容範囲Vの範囲外ならば、高さデータH1〜H7から、許容範囲Vから外れたチップ部品4を求める。   Specifically, in the calculation unit 152 of the control unit 150, the maximum height Hmax and the minimum height Hmin are calculated from the height data H (for example, H1 to H7 in FIG. 5) of the chip component 4 corresponding to the pressurization number data PD. Ask for. Next, a difference Hdif between the maximum height Hmax and the minimum height Hmin is obtained (the calculation formula is Hdif = | Hmax−Hmin |). Next, the difference Hdif is compared with the allowable range V. If the difference Hdif is outside the allowable range V, the chip component 4 that is out of the allowable range V is obtained from the height data H1 to H7.

次に、許容範囲Vを外れるチップ部品4が存在する場合は、回路基板2をリペアステージ105に搬送する。リペア箇所が無い場合は、仮圧着工程が完了する(ステップST08)。   Next, when there is a chip component 4 outside the allowable range V, the circuit board 2 is transferred to the repair stage 105. When there is no repair location, the temporary press-bonding process is completed (step ST08).

次に、リペアステーション105で高さ異常となったチップ部品4を取り外す(ステップST09)。   Next, the chip component 4 whose height is abnormal at the repair station 105 is removed (step ST09).

次に、取り外した回路パターン7の取り外し位置情報TIを記憶部151に記憶させ、ステップST01に戻る(ステップST10)。ステップST01以降の動作では、取り外し位置情報TIに基づき、チップ部品4の仮圧着が行われる。すなわち、すでに仮圧着されている回路パターン7にはチップ部品4を仮圧着しない。さらに、同じ回路パターン7の位置が複数回にリペアが行われていた場合は、チップ部品4の仮圧着の対象箇所から除く除外情報EXを記憶部151に記憶させる。除外情報EXの回路パターン7には以後、チップ部品4の仮圧着を行わない。   Next, the removal position information TI of the removed circuit pattern 7 is stored in the storage unit 151, and the process returns to step ST01 (step ST10). In the operation after step ST01, the chip component 4 is temporarily crimped based on the removal position information TI. That is, the chip component 4 is not temporarily bonded to the circuit pattern 7 that has already been temporarily bonded. Furthermore, when the position of the same circuit pattern 7 has been repaired a plurality of times, exclusion information EX that is excluded from the provisional press-bonding locations of the chip component 4 is stored in the storage unit 151. Thereafter, the temporary compression bonding of the chip component 4 is not performed on the circuit pattern 7 of the exclusion information EX.

次に、ステップST08で仮圧着工程が完了すると、回路基板2を本圧着部200の基板保持ステージ202に搬送する(ステップST11)。   Next, when the provisional pressure bonding process is completed in step ST08, the circuit board 2 is transferred to the substrate holding stage 202 of the main pressure bonding part 200 (step ST11).

次に、回路基板2の本圧着する列と加圧ヘッド207の凸部との位置合わせを行う。そして、弾性材209を介在させて加圧ヘッド207を回路基板4の列毎に一括圧着を行い、チップ部品4を回路基板4に本圧着する。一括圧着の際に、除外情報EXの含まれている回路パターン7が存在する場合は、加圧力を所定の加圧力よりも低めに設定して加圧を行う(ステップST12)。   Next, alignment of the circuit board 2 to which the main press bonding is performed and the convex portion of the pressure head 207 is performed. Then, the pressure head 207 is collectively pressure-bonded for each row of the circuit boards 4 with the elastic material 209 interposed therebetween, and the chip component 4 is finally pressure-bonded to the circuit board 4. When the circuit pattern 7 including the exclusion information EX is present during the collective crimping, pressurization is performed by setting the pressurizing force lower than a predetermined pressurizing force (step ST12).

次に、図4に示す列毎に回路基板2の本圧着する列と加圧ヘッド207の凸部との位置合わせを行い、順次、ステップST12に基づき本圧着を行う(ステップST13)。   Next, for each row shown in FIG. 4, the row of the circuit board 2 to be pressure-bonded and the convex portion of the pressure head 207 are aligned, and the pressure bonding is sequentially performed based on step ST12 (step ST13).

次に、全列の本圧着が完了すると、回路基板4を搬出し本圧着工程を完了し、続けてステップST01に戻り、次の回路基板2へのチップ部品4の仮圧着工程を開始する(ステップST14)。   Next, when the main press-bonding of all the rows is completed, the circuit board 4 is unloaded and the main press-bonding process is completed. Then, the process returns to step ST01 to start the temporary press-bonding process of the chip component 4 to the next circuit board 2 ( Step ST14).

このように、回路基板2の各回路パターン7に仮圧着されているチップ部品4の高さ位置が、本圧着部200の加圧ヘッド207の一括圧着できる高さバラツキの許容範囲Vにすることができるので、チップ部品4の実装不良のない回路基板4を提供することができる。   As described above, the height position of the chip component 4 that is temporarily press-bonded to each circuit pattern 7 of the circuit board 2 is set to the allowable range V of the height variation in which the pressurizing head 207 of the main press-bonding portion 200 can be collectively pressed. Therefore, it is possible to provide the circuit board 4 free from defective mounting of the chip component 4.

1 実装装置
2 回路基板
3 電極
4 チップ部品
5 バンプ
6 樹脂
7 回路パターン
100 仮圧着部
101 基台
102 基板保持ステージ
102 手段
103 支持フレーム
104 加圧手段
105 リペアステージ
106 位置調整手段
107 加圧ヘッド
108 昇降手段
109 アタッチメント
110 トルク検出器
111 距離センサ
150 制御部
151 記憶部
152 演算部
153 表示部
200 本圧着部
201 基台
202 基板保持ステージ
203 フレーム
204 加圧手段
206 位置調整手段
207 加圧ヘッド
209 弾性材
210 加熱手段
213 巻取ローラ
214 繰り出しローラ
300 実装装置
303 可動テーブル
305 加圧手段
306 弾性材
308 加熱手段
312 ヘッド
H チップ部品の高さ
H1〜H7 高さデータ
PD 加圧数データ
V 許容値
TI 取り外し位置情報
EX 除外情報
Hmax 最大高さ
Hmin 最小高さ
Hdif 差
DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Circuit board 3 Electrode 4 Chip component 5 Bump 6 Resin 7 Circuit pattern 100 Temporary pressure bonding part 101 Base 102 Substrate holding stage 102 Means 103 Support frame 104 Pressure means 105 Repair stage 106 Position adjustment means 107 Pressure head 108 Lifting means 109 Attachment 110 Torque detector 111 Distance sensor 150 Control part 151 Storage part 152 Calculation part 153 Display part 200 Crimping part 201 Base 202 Substrate holding stage 203 Frame 204 Pressure means 206 Position adjustment means 207 Pressure head 209 Elasticity Material 210 Heating means 213 Winding roller 214 Feeding roller 300 Mounting device 303 Movable table 305 Pressurizing means 306 Elastic material 308 Heating means 312 Head H Height of chip parts H1 to H7 Height Data PD Pressure data V Allowable value TI Removal position information EX Exclusion information Hmax Maximum height Hmin Minimum height Hdif Difference

Claims (5)

複数の回路パターンが形成された回路基板に、複数のチップ部品を樹脂を介して仮圧着する仮圧着部に、
回路パターンにチップ部品を一つずつ実装する加圧ヘッドと、回路基板に仮圧着されたチップ部品の高さを検出する高さ検出手段を備え、
仮圧着の次の工程でチップ部品を一括して本圧着を行う、複数のチップ部品の個数を単位として、前記高さ検出手段が検出した高さのバラツキを調べて、前記高さのバラツキに基づいてチップ部品の取り外しを判断するチップリペア判断手段を備えたことを特徴とする実装装置。
In a temporary press-bonding part that temporarily press-bonds a plurality of chip components to a circuit board on which a plurality of circuit patterns are formed via a resin,
A pressure head for mounting chip components one by one on the circuit pattern, and a height detection means for detecting the height of the chip components temporarily bonded to the circuit board,
In the next step of pre-bonding, the chip components are collectively bonded together. The variation in the height detected by the height detecting means is examined in units of the number of chip components, and the variation in the height is determined. A mounting apparatus comprising chip repair determination means for determining removal of a chip part based on the chip repair.
請求項1に記載の発明において、
チップ部品の高さを検出する前記高さ検出手段が、前記加圧ヘッドに備えられ、前記加圧ヘッドとともに移動する構成であり、
チップ部品の仮圧着の完了した状態で、前記加圧ヘッドと回路基板との距離を測定することにより、チップ部品の高さを検出する高さ検出手段からなる実装装置。
In the invention of claim 1,
The height detecting means for detecting the height of the chip component is provided in the pressure head, and moves with the pressure head,
A mounting apparatus comprising height detecting means for detecting the height of the chip component by measuring the distance between the pressure head and the circuit board in a state where the temporary bonding of the chip component is completed.
請求項1に記載の発明において、
チップ部品の高さを検出する前記高さ検出手段が、前記加圧ヘッドを駆動する昇降手段に備えられ、昇降手段の駆動部にマウントされた駆動部の位置検出器の位置検出信号を測定することにより、チップ部品の高さを検出する高さ検出手段からなる実装装置。
In the invention of claim 1,
The height detecting means for detecting the height of the chip component is provided in an elevating means for driving the pressure head, and measures a position detection signal of a position detector of a driving unit mounted on the driving unit of the elevating means. Thus, a mounting apparatus comprising a height detecting means for detecting the height of the chip component.
請求項1から3のいずれかに記載の発明において、
前記チップリペア判断手段の判断結果に基づいて、チップリペア箇所を指示する表示部を有した実装装置。
In the invention according to any one of claims 1 to 3,
A mounting apparatus having a display unit for instructing a chip repair location based on a determination result of the chip repair determination means.
複数の回路パターンが形成された回路基板に、樹脂を介して複数のチップ部品を仮圧着する実装方法であって、
加圧ヘッドに吸着保持されたチップ部品を、基板保持ステージに保持された回路基板に押圧し仮圧着するステップと、
前記回路基板に仮圧着されたチップ部品の高さを検出し記憶するステップと、
仮圧着の次の工程における、チップ部品を一括して本圧着する複数のチップ部品の個数を単位として、前記記憶されたチップ部品の高さの最大値と最小値との範囲が、予め設定されているチップ部品の高さの許容値の範囲内であるかを判断するステップと、
を有する実装方法。
A mounting method in which a plurality of chip components are temporarily crimped via a resin to a circuit board on which a plurality of circuit patterns are formed,
A step of pressing and temporarily pressing the chip component sucked and held by the pressure head against the circuit board held by the substrate holding stage;
Detecting and storing the height of the chip part temporarily bonded to the circuit board;
A range between the maximum value and the minimum value of the height of the stored chip parts is set in advance in units of the number of chip parts to which the chip parts are subjected to final pressure bonding in a batch in the next step of the temporary pressure bonding. Determining whether the height of the chip component is within a tolerance range;
Mounting method.
JP2009075325A 2009-03-26 2009-03-26 Mounting device and mounting method Pending JP2010232234A (en)

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US20220412733A1 (en) * 2020-07-30 2022-12-29 Shinkawa Ltd. Mounting apparatus and parallelism detection method in mounting apparatus
US12018936B2 (en) * 2020-07-30 2024-06-25 Shinkawa Ltd. Mounting apparatus and parallelism detection method in mounting apparatus
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