JP5857848B2 - Electromagnetic shielding structure manufacturing apparatus, manufacturing method, and electromagnetic shielding structure - Google Patents

Description

  The present invention relates to an electromagnetic shielding structure manufacturing apparatus, a manufacturing method, and an electromagnetic shielding structure.

  Among electronic components mounted on a wiring board, there are electronic components that radiate electromagnetic noise and hinder the operation of other electronic components, or receive an electromagnetic noise from the outside to cause malfunction. Therefore, for such an electronic component, it is necessary to perform electromagnetic shielding by interposing a conductive material between other electronic components.

  Conventionally, it is known to use a box-shaped shield case arranged so as to cover a target electronic component as electromagnetic shielding on a wiring board (see, for example, Patent Document 1). The shield case is formed of a thin metal plate having a thickness of about 0.1 to 0.2 mm, and is mounted on the GND connection pad provided on the wiring board and electrically connected to the GND (ground terminal) of the circuit. Is connected using.

JP-A-8-32265

  A dimensional error of about ± 50 to 100 μm occurs in the shield case as described above, and such a shield case is positioned and arranged with high accuracy with respect to the wiring board (GND connection pad). There are limits. Furthermore, in order to obtain the bonding strength between the shield case and the wiring board, it is necessary to form a fillet at the bonding portion. For this reason, the width of the GND connection pad inevitably needs to be wider (0.2 to 0.3 mm or more) than the width of the metal plate constituting the shield case. This is a factor that hinders high-density mounting.

  Accordingly, an object of the present invention is to provide an electromagnetic shielding structure manufacturing apparatus, a manufacturing method, and an electromagnetic shielding structure that can minimize the influence on high-density mounting.

  In order to solve the above-described problems, an electromagnetic shielding structure manufacturing apparatus according to the present invention is an electromagnetic shielding structure manufacturing apparatus that forms a box-shaped electromagnetic shielding structure on a wiring board, and a stage that supports the wiring board; A side plate adsorption heating device configured to be relatively movable with respect to the stage, wherein at least one side plate constituting the electromagnetic shielding structure is adsorbed and held on the wiring board supported by the stage. The side which heats the thermosetting or thermosoftening conductive bonding material positioned between the wiring board and at least one side plate through the positioned at least one side plate A top plate adsorption heating device configured to be relatively movable between the face plate adsorption heating device and the stage, and at least joined to the wiring board while adsorbing and holding the top plate constituting the electromagnetic shielding structure 1 A top plate adsorption heating device that heats a bonding material disposed between at least one side plate and the top plate via the positioned top plate. Yes.

  Moreover, the manufacturing method of the electromagnetic shielding structure of the present invention using the manufacturing apparatus described above includes a step of adsorbing and holding at least one side plate to the side plate adsorption heating device, and a side plate adsorption heating device. A step of supplying a bonding material to at least one of the side plate held by the stage and the wiring board supported by the stage, and at least one side plate held by the side plate adsorption heating device, Positioning the bonding material between the wiring substrate supported by the stage with respect to the wiring substrate via the bonding material, and at least one side plate positioned by the side plate adsorption heating device By heating, the step of bonding at least one side plate to the wiring board, the step of adsorbing and holding the top plate to the top plate adsorption heating device, and the side plate adsorption heating device are held. Supplying a bonding material to at least one of the top plate and the at least one side plate joined to the wiring board; and joining the top board held by the top board adsorption heating device to the wiring board. Positioning at least one side plate with a bonding material between at least one side plate, and at least a bonding material with a top plate positioned by the top plate adsorption heating device. Joining the top plate to at least one side plate by heating.

  Moreover, one aspect of the electromagnetic shielding structure of the present invention manufactured using the manufacturing apparatus described above is formed by a plurality of side plates arranged in a cylindrical shape on a wiring board and a plurality of side plates. And a plurality of side plates are connected to the connection pads of the wiring board in a state in which the adjacent side plates are in contact with each other or bonded with a conductive bonding material. It is joined.

  In addition, another aspect of the electromagnetic shielding structure of the present invention manufactured using the manufacturing apparatus described above is an opening formed by a belt-shaped side plate disposed in a cylindrical shape on a wiring board and a side plate. The side plate is bonded to the connection pad of the wiring board in a state where both ends of the side plate are in contact with each other or are bonded with a conductive bonding material. Yes.

  As described above, according to the present invention, it is possible to provide an electromagnetic shielding structure manufacturing apparatus, a manufacturing method, and an electromagnetic shielding structure that can minimize the influence on high-density mounting.

It is a schematic perspective view which shows the manufacturing apparatus of the electromagnetic shielding structure in the 1st Embodiment of this invention. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 1st Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 2nd Embodiment of this invention using the manufacturing apparatus of FIG. It is a conceptual diagram for demonstrating the manufacturing method in the 2nd Embodiment of this invention using the manufacturing apparatus of FIG. It is the schematic which shows the structural example of the side plate adsorption | suction heating tool in the 3rd Embodiment of this invention. It is the schematic which shows another structural example of the side plate adsorption | suction heating tool in the 3rd Embodiment of this invention. It is the schematic which shows another structural example of the side plate adsorption | suction heating tool in the 3rd Embodiment of this invention. It is the schematic which shows another structural example of the side plate adsorption | suction heating tool in the 3rd Embodiment of this invention. It is the schematic which shows another structural example of the side plate adsorption | suction heating tool in the 3rd Embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  Unlike the conventional shield case formed by bending a single metal plate, the electromagnetic shielding structure manufactured by the manufacturing apparatus and the manufacturing method of the present invention is formed in a box shape by a plurality of plate-like members. That is, the electromagnetic shielding structure is formed in a box shape by at least one side plate arranged in a cylindrical shape on the wiring board and a top plate arranged so as to close the opening formed by the side plate. Yes. The manufacturing apparatus and the manufacturing method of the present invention are greatly characterized in that such a plate-like member is formed in a box shape on a wiring board.

(First embodiment)
First, the manufacturing apparatus of the electromagnetic shielding structure in the 1st Embodiment of this invention is demonstrated. The manufacturing apparatus of this embodiment forms an electromagnetic shielding structure with four side plates and one top plate, and between the connection pads on the wiring board and the side plates and between the side plates and the top plate. Are joined by a thermosetting conductive paste.

  FIG. 1 is a perspective view schematically showing a configuration of an electromagnetic shielding structure manufacturing apparatus according to the present embodiment.

  The manufacturing apparatus 1 of this embodiment includes a stage 2 having a support surface 2a for supporting a wiring board (not shown in FIG. 1) and a side plate suction having a suction surface 3a for sucking and holding the side plate. The heating tool 3 and the top plate adsorption heating tool 4 provided with the adsorption surface 4a which adsorbs and holds the top plate are provided.

  The side plate adsorption heating tool 3 and the top plate adsorption heating tool 4 are each formed in a rectangular parallelepiped shape, and are arranged so that one surface (lower surface) faces the support surface 2 a of the stage 2. In the side plate adsorption heating tool 3, four side surfaces parallel to the normal direction of the support surface 2a of the stage 2 constitute the adsorption surface 3a. In the top plate adsorption heating tool 4, the lower surface parallel to the support surface 2a of the stage 2 Constitutes the suction surface 4a. Each adsorption surface 3a of the side plate adsorption heating tool 3 is provided with an adsorption hole 3b, and the side plate is adsorbed and held on the adsorption surface 3a by the adsorption pressure generated in the adsorption hole 3b. . In the illustrated embodiment, each suction surface 3a is provided with two suction holes 3b. However, one or three or more suction holes may be provided. Further, a similar suction hole (not shown) is also provided on the suction surface 4a of the top plate suction heating tool 4.

  Further, the side plate adsorption heating tool 3 and the top plate adsorption heating tool 4 are configured to be movable relative to the stage 2. Specifically, the stage 2 is configured to be movable in the XY directions (see arrows in the figure) parallel to the support surface 2a, and the side plate adsorption heating tool 3 and the top plate adsorption heating tool 4 are provided on the support surface of the stage 2. It is configured to be movable in the Z direction (see arrow in the figure) perpendicular to 2a.

  Therefore, in the manufacturing apparatus 1 of the present embodiment, the side plate sucked and held by the side plate suction heating tool 3 is accurately placed at a predetermined position on the wiring board while maintaining a state perpendicular to the wiring board supported by the stage 2. It becomes possible to position and arrange well. In addition, the top plate attracted and held by the top plate adsorption heating tool 4 can also be accurately positioned with respect to the side plate arranged on the wiring board.

  Further, the side plate adsorption heating tool 3 and the top plate adsorption heating tool 4 incorporate heating means (not shown) such as a heater for heating the side plate or the top plate adsorbed and held on the adsorption surfaces 3a and 4a, respectively. ing. Therefore, by heating the side plate by the heating means of the side plate adsorption heating tool 3, the thermosetting conductive paste disposed between the connection pad of the wiring board and the side plate can be heated and cured. The side plate can be bonded to the wiring board. Similarly, by heating the top plate by the heating means of the top plate adsorption heating tool 4, the thermosetting conductive paste disposed between the side plate and the top plate can be heated and cured, The face plate can be joined to the side plate.

  Next, with reference to FIG. 2 to FIG. 14, a method for manufacturing an electromagnetic shielding structure using the manufacturing apparatus of this embodiment will be described. 2 to 14 are conceptual diagrams for explaining the manufacturing method of the present embodiment.

  First, as shown in FIG. 2, the side plate 5 made of a metal plate is adsorbed to each adsorption surface 3 a of the side plate adsorption heating tool 3. At this time, the side plate 5 is adsorbed on the adsorption surface 3 a so that a part of the side plate 5 protrudes from the lower surface of the side plate adsorption heating tool 3.

  In the present embodiment, each suction surface 3a of the side plate suction heating tool 3 is configured to be able to suck the side plate 5 independently. That is, each suction hole 3b is configured to be able to generate suction pressure independently. 3A and 3B are top views schematically showing the side plate adsorption heating tool 3. FIG. In the present embodiment, as shown in FIG. 3 (a), the side plates 5 are simultaneously attracted to the four suction surfaces 3a, but it is not always necessary to simultaneously attract the four side plates, and at least one The side plate 5 may be adsorbed on the adsorption surface 3a. For example, as shown in FIG. 3B, the two side plates 5 can be adsorbed to the adsorption surface 3a.

  Next, the lower end of the side plate 5, that is, the end protruding from the lower surface of the side plate adsorption heating tool 3 is aligned in parallel. Specifically, as shown in FIG. 4, the lower end of the side plate 5 is pressed against an abutment stage 6 provided in parallel with the stage 2 that supports the wiring board. Thereby, the lower end of the side plate 5 can be aligned in parallel with the wiring board supported by the stage 2. At this time, the suction pressure is weakened to such an extent that the side plate 5 is not detached from the side plate suction heating tool 3. After aligning the lower ends of the side plates 5, the suction pressure is returned to the original strong state, and the side plates 5 are held on the suction surface 3a. The abutting stage 6 is driven by the same moving mechanism as the stage 2, that is, can be moved in the XY directions (see arrows in the figure) in the same manner as the stage 2.

  Next, a thermosetting conductive paste is applied to the lower ends of the side plates 5 aligned in parallel. Specifically, as shown in FIG. 5, the lower end of the side plate 5 is brought into contact with the conductive paste 8 on the transfer stage 7 provided in parallel with the stage 2, and the conductive paste 8 is moved to the lower end of the side plate 5. Transcript to. The transfer stage 7 is driven by the same moving mechanism as the stage 2, similarly to the abutting stage 6, that is, can be moved in the XY directions (see the arrows in the figure) similarly to the stage 2.

  Next, as shown in FIG. 6, the side plate 5 is aligned with respect to the GND connection pad 10 formed in a frame shape on the wiring board 9 and electrically connected to the GND (ground terminal) of the circuit. I do. Specifically, the stage 2 that supports the wiring board 9 is moved in the XY directions, and the side plate suction heating tool 3 that holds the side plates 5 by suction is moved in the Z direction. Then, as shown in FIG. 7, the lower end of the side plate 5 is brought into contact with the GND connection pad 10.

  Next, a heater (not shown) of the side plate adsorption heating tool 3 is operated in a state where the GND connection pad 10 of the wiring board 9 and the lower end of the side plate 5 are in contact with each other. Then, the side plate 5 is heated, and the thermosetting conductive paste applied to the lower end of the side plate 5 is heated and cured via the heated side plate 5. Thereafter, the adsorption of the side plate 5 by the side plate adsorption heating tool 3 is released, and the side plate adsorption heating tool 3 is detached from the side plate 5. In this way, the side plate 5 is bonded onto the GND connection pad 10 of the wiring board 9 as shown in FIG.

  In the side plates 5 joined in this way, the dimensional accuracy between the opposing side plates 5 is determined by the dimensional accuracy between the opposing side surfaces (suction surfaces) of the side plate adsorption heating tool 3. In a conventional shield case that is generally manufactured at low cost by bending a metal plate, the dimensional accuracy between opposing side surfaces is about ± 50 to 100 μm as described above. On the other hand, the side plate adsorption heating tool 3 can be manufactured with a dimensional accuracy between the side surfaces of ± 5 μm or less. Therefore, according to the present embodiment, the side plate 5 can be bonded to the GND connection pad 10 of the wiring board 9 while ensuring higher dimensional accuracy. Therefore, the width of the GND connection pad 10 can be narrowed compared to the case of the conventional shield case having an integral structure, and the influence on high-density mounting can be suppressed.

  In the present embodiment, the four side plates 5 are collectively bonded to the GND connection pads 10 of the wiring board 9, but depending on the number of the side plates 5 to be adsorbed by the side plate adsorption heating tool 3 at a time, The process from adsorption to bonding can be performed in multiple steps. For example, as shown in FIG. 3B, the side plates 5 can be adsorbed by the side plate adsorption heating tool 3 two by two and bonded to the wiring board 9, or can be bonded one by one.

  Next, a thermosetting conductive paste is applied to the upper end of the side plate 5. Specifically, as shown in FIG. 9A, a conductive paste is applied along the upper end of the side plate 5 using the dispenser 11 (see FIG. 9B). In addition, the arrow in Fig.9 (a) represents the motion of the front-end | tip of the dispenser 11. FIG.

  Next, another SMT (Surface Mounting Technology) component is mounted on the wiring board 9 by the SMT mounter. Then, as shown in FIG. 10, the top plate 12 made of a metal plate is sucked and held on the suction surface 4 a of the top plate suction heating tool 4, and is aligned with the side plate 5. Specifically, as in the case of the side plate 5, the stage 2 that supports the wiring board 9 is moved in the XY direction, and the top plate adsorption heating tool 4 that holds the top plate 12 by suction is moved in the Z direction. As shown in FIG. 11, the lower surface of the top plate 12 is brought into contact with the upper end of the side plate 5.

  The thermosetting conductive paste only needs to be applied to at least one of the upper end of the side plate 5 and the lower surface of the top plate. Therefore, in the above-described embodiment, the conductive paste is applied only to the upper end of the side plate 5, but instead, the conductive paste may be applied only to the lower surface of the top plate 12 or applied to both. You can also. The conductive paste is applied by a transfer method or a method using a dispenser. Mainly, the upper end of the side plate 5 is applied by a dispenser method (see FIG. 9A), The lower surface of the face plate is transferred by a transfer method (see FIG. 5).

  Next, a heater (not shown) of the top plate adsorption heating tool 4 is operated in a state where the upper end of the side plate 5 and the top plate 12 are in contact (see FIG. 11). Then, the top plate 12 is heated, and the thermosetting conductive paste applied to the upper end of the side plate 5 is heated and cured via the heated top plate 12. Thereafter, the suction of the top plate 12 by the top plate suction heating tool 4 is released, and the top plate suction heating tool 4 is detached from the top plate 12. In this way, the top plate 12 is joined to the side plate 5 as shown in FIG. As a result, an electromagnetic shielding structure 13 composed of four side plates 5 and one top plate 12 is completed.

  Further, if necessary, a thermosetting conductive paste is applied to the gap generated between the adjacent side plates 5 by the dispenser 11 as shown in FIG. An arrow in FIG. 13A represents the movement of the tip of the dispenser 11. Thereafter, the conductive paste is heated and cured to form a conductive portion 14 between adjacent side plates 5 as shown in FIG. Thereby, the damage by the heat cycle which arises by the difference of the linear expansion coefficient of the wiring board 9 and the electromagnetic shielding structure 13 can be made small, and the reliability of the electromagnetic shielding structure 13 can be improved. Instead of forming the conductive portion 14 between the adjacent side plates 5, the side plates 5 may be joined to the wiring board 9 in a state where the side plates 5 are in contact with each other.

  Further, as shown in FIG. 14A, an insulating paste is applied between the wiring board 9 and the side plate 5 by the dispenser 11. The arrow in FIG. 14A represents the movement of the tip of the dispenser 11. Thereafter, the insulating paste is cured, and an insulating portion 15 is formed between the wiring board 9 and the side plate 5 as shown in FIG. Thereby, the intensity | strength of the completed electromagnetic shielding structure 13 can be improved more.

  As described above, according to the manufacturing apparatus of the present embodiment, the side plate constituting the box-shaped electromagnetic shielding structure is positioned in a state where it is adsorbed on the side surface of the side plate adsorption heating tool that can be easily manufactured with high accuracy. By doing so, it is possible to bond to a connection pad on a fine wiring board with high accuracy. As described above, the side plate adsorption heating tool can be manufactured with a dimensional accuracy between opposing side surfaces of ± 5 μm or less. Therefore, depending on the mounting accuracy (positioning accuracy) of the side plate on the wiring board and the number of mountings (number of adsorption and bonding processes), an electromagnetic shielding structure with a maximum dimensional accuracy between the side surfaces of about ± 5 μm is used. Can be formed on top.

  As a result, for example, the thickness of the side plate is 20 to 100 μm, the mounting accuracy (positioning accuracy) of the side plate by the side plate adsorption heating tool is ± 5 to ± 25 μm, and the dimensional accuracy of the side plate adsorption heating tool is ± 5 μm. Then, the width of the connection pad on the wiring board can be set to 40 to 200 μm. That is, the width of the connection pad to which the side plate is bonded can be made narrower than when a conventional shield case is used. Thereby, even if an electromagnetic shielding structure is formed on the wiring board, the influence on high-density mounting can be minimized.

  In the present embodiment, the metal plate is used for the side plate and the top plate. However, the present invention is not limited to this, and one in which an insulating layer is formed on a part of the surface of the metal plate, a flexible wiring board, or a rigid wiring board. Can be used. In that case, in order to electrically connect the wiring board and the side plate, and the side plate and the top plate by bonding with a conductive paste, respectively, the connection portion with the connection pad of the side plate, and the side plate and the top plate A conductor is disposed at the connecting portion.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. 15 and 16. 15 and 16 are conceptual diagrams for explaining the method of manufacturing the electromagnetic shielding structure of the present embodiment.

  This embodiment is different from the first embodiment in that a solder paste is used as a conductive bonding material between the GND connection pad and the side plate on the wiring board and between the side plate and the top plate. Is different. In addition, the manufacturing process such as the application location and application method of the solder paste is slightly different. On the other hand, the manufacturing apparatus to be used and the electromagnetic shielding structure manufactured thereby are the same as those in the first embodiment, and the obtained effects are also the same as those in the first embodiment. Hereinafter, only points different from the first embodiment will be described.

  In the present embodiment, a solder paste is applied in advance on the GND connection pad 10 of the wiring board 9. Specifically, as shown in FIG. 15, a solder paste is printed on the GND connection pad 10 of the wiring board 9 using a metal mask 20. This solder paste printing is performed simultaneously with the solder paste printing of other SMT (Surface Mounting Technology) parts. Then, after positioning the side plate adsorbed by the side plate adsorption heating tool with respect to the wiring board 9 (GND connection pad 10), the heater of the side plate adsorption heating tool is heated. Then, after melting the solder, heating is stopped, and the side plate is joined to the wiring board by cooling the solder to the melting temperature or lower.

  Also, a solder paste for joining the side plate and the top plate is applied to the top plate. Specifically, as shown in FIG. 16, the solder paste 21 is transferred to the top plate 12 adsorbed by the top plate adsorption heating tool 4 by a transfer method. The transfer stage 7 is the same as in the first embodiment. Then, after positioning the top plate 12 with respect to the side plate, the top plate 12 is joined to the side plate by heating and cooling the solder with the top plate adsorption heating tool 4 in the same manner as the joining of the side plate.

  In this embodiment, since the bonding material (solder paste) is not applied to the lower end side of the side plate, it is not always necessary to align the lower end of the side plate in parallel, but before contacting the lower end of the side plate to the ND connection pad, The lower ends of the side plates may be aligned in parallel.

(Third embodiment)
Next, a third embodiment of the present invention will be described.

  The manufacturing apparatus of the present embodiment forms an electromagnetic shielding structure by one side plate made of a flexible wiring board and one top plate, thereby forming various forms of electromagnetic shielding structures. It becomes possible to do. Therefore, the manufacturing apparatus of this embodiment can employ several configurations for the side plate adsorption heating tool, and these configurations are different from those of the first and second embodiments. Other than this, the manufacturing method is the same as in the first and second embodiments.

  FIG. 17A and FIG. 17B are top views schematically showing a side plate 30 formed in a cylindrical shape and a rectangular parallelepiped side plate adsorption heating tool 31 that adsorbs the side plate 30. FIG. 17A shows a state before the side plate 30 is adsorbed to the side plate adsorbing / heating tool 31, and FIG. 17B shows a state after the adsorbing. FIG. 17C is a schematic view of the side plate 30 of FIG.

  In such a configuration, when the side plate 30 is adsorbed to the side plate adsorption heating tool 31, the bending of the side plate (flexible wiring board) 30 near the corner of the side plate adsorption heating tool 31 is bent. Form. And the side plate 30 is made to adsorb | suck to the side plate adsorption | suction heating tool 31 with a sufficient precision in a part other than that. As shown in FIG. 17C, connection electrodes 30a for electrical connection with the GND connection pads of the wiring board and the top plate are arranged on the upper and lower ends of the side plate 30.

  When a cylindrical side plate is used, a configuration as shown in FIG. 18 is also possible. FIG. 18A is a top view schematically showing a side plate adsorption heating tool 32 having an L-shaped cross section to which a cylindrical side plate 30 is adsorbed. FIG. 18B shows an example of the layout of the GND connection pad 33 of the wiring board corresponding to this, and FIG. 18C is a schematic view of the side plate 30 of FIG. It is.

  Further, for the GND connection pad 33 as shown in FIG. 18B, a side plate adsorption heating tool whose adsorption surface is composed of a plurality of rod-shaped members can be used. FIG. 19A and FIG. 19B are schematic top views showing a configuration example of such a side plate adsorption heating tool, and show only a plurality of rod-shaped members 34 constituting the adsorption surface. FIG. 19C is a schematic side view of a side plate adsorption heating tool 35 provided with a plurality of rod-shaped members 34. According to such a side plate adsorption heating tool 35, mechanical interference with respect to a region surrounded by the side plate on the wiring board can be reduced.

  As a configuration for reducing mechanical interference on the wiring board, a configuration as shown in FIG. 20 is also possible. 20A is a schematic top view of the side plate adsorption heating tool 36, and FIG. 20B is a cross-sectional view taken along line AA ′ in FIG. 20A, and the cylindrical side plate The side plate adsorption heating tool 36 to which 30 is adsorbed is shown.

  Further, FIG. 21A is a top view schematically showing a cylindrical side plate adsorption heating tool 38 in which a side plate 37 formed in a band shape is adsorbed and held in a cylindrical shape so that both ends thereof overlap each other. is there. Here, both ends of the side plate 37 are in contact with each other or joined by a conductive bonding material, as in the case of the four side plates 5. FIG. 21B shows an example of the layout of the GND connection pad 39 of the wiring board corresponding to this. FIG.21 (c) is the schematic which looked at the side plate 37 of Fig.21 (a) from the side surface. Similar to the cylindrical side plate 30, connection electrodes 37 a are arranged on the upper and lower ends of the side plate 37.

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 2 Stage 3, 31, 32, 35, 36, 38 Side plate adsorption heating tool 3a Adsorption surface 3b Adsorption hole 4 Top plate adsorption heating tool 4a Adsorption surface 5, 30, 37 Side plate 6 Abutting stage 7 For transfer Stage 8 Conductive paste 9 Wiring substrate 10, 33, 39 GND connection pad 11 Dispenser 12 Top plate 13 Electromagnetic shielding structure 14 Conductive portion 15 Insulating portion 20 Metal mask 21 Solder paste 20 Flexible substrate 30a, 37a Connection electrode 34 Bar-shaped member

Claims (9)

An electromagnetic shielding structure manufacturing apparatus for forming a box-shaped electromagnetic shielding structure on a wiring board,
A stage for supporting the wiring board;
A side plate adsorption heating device configured to be relatively movable with respect to the stage, wherein the at least one side plate constituting the electromagnetic shielding structure is adsorbed and held while being supported by the stage. Positioning with respect to the wiring board, and thermosetting or thermosoftening conductivity disposed between the wiring board and the at least one side board via the positioned at least one side board. A side plate adsorption heating device for heating the bonding material;
A top plate adsorption heating device configured to be relatively movable with respect to the stage, wherein the at least one piece joined to the wiring board while adsorbing and holding the top plate constituting the electromagnetic shielding structure A top plate adsorption heating device that heats the bonding material disposed between the at least one side plate and the top plate via the positioned top plate,
An apparatus for manufacturing an electromagnetic shielding structure.   The side plate adsorption heating device has at least one adsorption surface that adsorbs and holds the side plate arranged substantially parallel to a normal direction of a support surface that supports the wiring board of the stage. The manufacturing apparatus of the electromagnetic shielding structure according to claim 1, wherein the top plate adsorption heating device has an adsorption surface arranged to oppose the support surface of the stage to adsorb and hold the top plate. . An electromagnetic shielding structure manufacturing method using the manufacturing apparatus according to claim 1,
Adsorbing and holding the at least one side plate on the side plate adsorption heating device;
Supplying the bonding material to at least one of the at least one side plate held by the side plate adsorption heating device and the wiring board supported by the stage;
Positioning the at least one side plate held by the side plate adsorption heating device with respect to the wiring board via the bonding material between the side board and the wiring board supported by the stage;
Bonding the at least one side plate to the wiring board by heating at least the bonding material via the at least one side plate positioned by the side plate adsorption heating device;
Adsorbing and holding the top plate to the top plate adsorption heating device;
Said top plate held in the top surface plate suction heating device, at least one of said at least one side plate is bonded to the wiring substrate, and supplying the bonding material,
With respect to the at least one side plate, the top plate held by the top plate adsorbing and heating device is interposed between the at least one side plate bonded to the wiring board and the bonding material. A positioning step;
Bonding the top plate to the at least one side plate by heating at least the bonding material via the top plate positioned by the top plate adsorption heating device;
A method for manufacturing an electromagnetic shielding structure.   The electromagnetic shielding structure according to claim 3, wherein the step of sucking and holding the at least one side plate includes sucking and holding the plurality of side plates to the side plate suction heating device in a cylindrical shape. Manufacturing method.   The step of adsorbing and holding the at least one side plate includes adsorbing the side plate formed in a belt shape to the side plate adsorption heating device and holding it in a cylindrical shape. The manufacturing method of the electromagnetic shielding structure as described in any one of. As the bonding material, a thermosetting conductive paste is used,
6. The electromagnetic wave according to claim 3, wherein the step of bonding the at least one side plate and the step of bonding the top plate each include heating and curing the conductive paste. 6. Manufacturing method of shielding structure. As the bonding material, a heat softening solder paste is used,
6. The method according to claim 3, wherein the step of bonding the at least one side plate and the step of bonding the top plate each include heating the solder paste and then cooling and hardening the solder paste. The manufacturing method of the electromagnetic shielding structure of description. An electromagnetic shielding structure manufactured using the manufacturing apparatus according to claim 1 or 2,
A plurality of side plates arranged in a cylindrical shape on the wiring board, and a top plate arranged so as to close an opening formed by the plurality of side plates,
The electromagnetic shielding structure in which the plurality of side plates are joined to connection pads of the wiring board in a state where the adjacent side plates are in contact with each other or are joined with a conductive bonding material. An electromagnetic shielding structure manufactured using the manufacturing apparatus according to claim 1 or 2,
A strip-shaped side plate arranged in a cylindrical shape on the wiring board, and a top plate arranged so as to close an opening formed by the side plate,
The electromagnetic shielding structure, wherein the side plate is bonded to the connection pad of the wiring board in a state where both ends of the side plate are in contact with each other or bonded with a conductive bonding material.

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