JP6578755B2 - Substrate manufacturing method, optical device manufacturing method, and substrate manufacturing apparatus - Google Patents

Description

  The present invention relates to a substrate manufacturing method, an optical device manufacturing method, and a substrate manufacturing apparatus.

  Patent Document 1 discloses a semiconductor element mounting structure in which a stress suppression substrate is disposed between a semiconductor element and a semiconductor element mounting substrate on which a wiring pattern is formed. The stress suppressing substrate is provided with a conducting portion that conducts the semiconductor element and the wiring pattern through a paste or film adhesive.

JP 2002-76208 A

  In a method of manufacturing a substrate in which a long substrate and a bonding target are thermocompression bonded, a method of performing thermocompression bonding between the long substrate and the bonding target in a state in which warpage in the thickness direction of the long substrate is corrected is known. ing. According to the above method, since the warpage in the plate thickness direction of the long substrate is corrected during the thermocompression bonding of the long substrate and the bonding target, the long substrate is in the plate thickness direction during the period. It is difficult to heat deform. Therefore, the long substrate is more likely to be thermally deformed in the short direction intersecting the plate thickness direction than in the plate thickness direction.

  The present invention is a method in which the warpage of the long substrate in the short direction is suppressed as compared with the case where the correction of the warp in the thickness direction of the long substrate is canceled after the thermocompression bonding between the long substrate and the bonding target. The purpose is to provide.

Method for producing a substrate according to claim 1, there is provided a long substrate which is configured to include a glass epoxy, terminals a row on the surface of one end portion in the lateral direction along the longitudinal direction are formed the with contacting the entire short-side direction of the other end face of the long substrate in a trapezoidal wall, pressing a rear surface of the long continuous substrate該台, the step of correcting the thickness direction of the warp of the elongated substrate A step of attaching an anisotropic conductive material to the terminal, a step of facing the terminal to which the conductive material is attached and a bonding target, and thermocompression bonding the long substrate and the bonding target. And a step of releasing the correction after the start and before the end of the thermocompression bonding.

  In the method for manufacturing an optical device according to claim 2, the long substrate has a long terminal formed along the longitudinal direction on the back surface, and the long terminal of the substrate manufactured by the method according to claim 1 has a longitudinal direction. A plurality of optical elements are arranged along the long substrate, and the substrate and the optical parts are mounted so that the plurality of optical elements and the optical parts face each other. A process of fixing to a long casing in which a long through hole is formed, wherein both end surfaces of the long substrate in the short direction of the substrate are brought into contact with opposite surfaces of the through hole in the short direction And positioning and fixing the substrate to the housing.

The substrate manufacturing apparatus according to claim 3 is a long substrate including a base on which a wall surface is formed and glass epoxy, and a line is formed along the longitudinal direction on the surface of one end in the lateral direction. a plurality of terminals, the whole other end face of the short-side direction of the long continuous substrate which long terminal are formed along the longitudinal direction with contacting to the wall surface to the back surface, the back surface of the elongated substrate said forming A straightening part that presses against a base to correct warpage in the thickness direction of the long substrate, an attachment part that attaches an anisotropic conductive material to the terminal, and the terminal to which the conductive material is attached A thermocompression bonding section that heats and pressurizes the object to be joined from the opposite side of the terminal with the object to be faced in between, and thermocompression-bonds the long substrate and the object to be joined; and the correction Before and after the thermocompression bonding by the thermocompression bonding part while pressing the back surface against the table It comprises a control unit for releasing the correction by the correcting unit.

  In the substrate manufacturing method according to claim 1, compared with the case where the correction of the warp in the thickness direction of the long substrate is canceled after completion of the thermocompression bonding between the long substrate and the bonding target, Warpage is suppressed.

  The method for manufacturing an optical device according to claim 2 is compared with the case of using a substrate manufactured including a step of releasing correction of warpage in the thickness direction of the long substrate after completion of thermocompression bonding between the long substrate and the bonding target. Thus, positional deviation between the plurality of optical elements and the optical component is suppressed.

  According to the substrate manufacturing apparatus of the third aspect, compared with the case where the control unit cancels the correction of the warp in the thickness direction of the long substrate after completion of the thermocompression bonding between the long substrate and the bonding target. A substrate in which warpage in the short direction is suppressed can be manufactured.

It is a fragmentary perspective view of the exposure apparatus manufactured by the manufacturing method of the exposure apparatus of embodiment. It is sectional drawing in the longitudinal direction of the exposure apparatus of embodiment. It is the top view which looked at the elongate board | substrate of embodiment from the surface side. It is the top view which looked at a part of flexible substrate of an embodiment from the back side. It is a partial figure of the board | substrate manufacturing apparatus of embodiment, Comprising: (A) is the schematic (top view) of the board | substrate manufacturing apparatus in the state which is correcting the curvature of the board | substrate thickness direction of a elongate board | substrate, (B) FIG. 4 is a cross-sectional view taken along the line AA. It is the top view which looked at the long board | substrate of embodiment from the surface side, Comprising: It is a figure explaining the part (inside dashed-dotted line) which attaches an anisotropic conductive material to the terminal of a long board | substrate. BRIEF DESCRIPTION OF THE DRAWINGS It is a partial figure of the board | substrate manufacturing apparatus of embodiment, Comprising: (A) is the schematic (top view) and (B) of the board | substrate manufacturing apparatus in the state which heat-pressed the elongate board | substrate and the flexible substrate. It is sectional drawing cut by the AA sectional line. In the board | substrate of embodiment, it is a schematic diagram which shows the state by which the elongate board | substrate and the flexible substrate are thermocompression bonded with the anisotropic electrically-conductive material. It is a figure (plan view) of a substrate manufactured using the substrate manufacturing apparatus of an embodiment. It is a mimetic diagram showing timing of suction operation and thermocompression operation in the 1st process (method of manufacturing a substrate) of an embodiment. It is a figure which shows the light emission board | substrate (what mounted the some optical element on the back surface of the board | substrate manufactured using the board | substrate manufacturing apparatus of embodiment) of embodiment. It is a schematic diagram which shows the timing of the attraction | suction operation | movement and thermocompression bonding operation | movement in the 1st process (method of manufacturing a board | substrate) of a comparison form. It is a figure (plan view) of the board manufactured with the manufacturing method of the board of a comparative form.

≪Overview≫
Hereinafter, modes (embodiments) for carrying out the invention will be described. First, an exposure apparatus manufactured by the exposure apparatus manufacturing method of the embodiment will be described. Next, a method for manufacturing the exposure apparatus according to the embodiment will be described. Next, the operation of the embodiment will be described. In addition, since the manufacturing method of the exposure apparatus of embodiment includes the manufacturing method of the board | substrate of embodiment, it demonstrates in the description of the manufacturing method of the exposure apparatus of embodiment about the manufacturing method of the board | substrate of embodiment. In addition, since the substrate manufacturing method of the embodiment is performed using a substrate manufacturing apparatus described later as an example, the substrate manufacturing apparatus of the embodiment will be described in the description of the substrate manufacturing method of the embodiment.

≪Exposure equipment≫
First, an exposure apparatus 10 manufactured by an exposure apparatus manufacturing method according to an embodiment described later will be described with reference to the drawings. The exposure apparatus 10 has a function of forming a latent image by irradiating the photosensitive drum PD constituting the image forming apparatus (not shown) with the light LB (see FIG. 2). As illustrated in FIGS. 1 and 2, the exposure apparatus 10 includes a light emitting substrate 20, a lens array 30, and a housing 40. Here, the exposure apparatus 10 is an example of an optical apparatus. The lens array 30 is an example of an optical component. The following description of the components of the exposure apparatus 10 is for each component in the state that constitutes the exposure apparatus 10 unless otherwise specified.

<Light emitting substrate>
The light emitting substrate 20 has a function of irradiating light LB in accordance with image data sent from a control unit (not shown) of the image forming apparatus. The light emitting substrate 20 includes a substrate 22, a plurality of LED arrays 24, and a driver 26 (see FIGS. 1 and 2). Here, the LED array 24 is an example of an optical element. As shown in FIG. 2, the substrate 22 includes a long substrate 50 and a flexible substrate 60 (hereinafter referred to as an FPC 60).

  A plurality of terminals 52 arranged in a row along the longitudinal direction are formed at the center in the longitudinal direction on one side (front surface) of the long substrate 50 and at one end portion in the lateral direction (see FIG. 3). On the other side (back surface) of the long substrate 50, a long terminal 54 extending in the longitudinal direction is formed from one end side to the other end side in the longitudinal direction. FIG. 3 shows a single state of the long substrate 50 (a state before the light emitting substrate 20 is configured). Moreover, the long board | substrate 50 of embodiment is made into the printed circuit board comprised including glass epoxy and copper foil as an example.

  As shown in FIG. 4, the FPC 60 includes a flexible base material 62 and a plurality of wirings 64 arranged in the base material 62. The ends of the plurality of wirings 64 constitute a plurality of terminals 64 </ b> A that form a column in a direction intersecting the direction in which the plurality of wirings 64 are arranged. In the FPC 60, a plurality of terminals 64A are opposed to a plurality of terminals 52 of the long substrate 50, and an anisotropic conductive material (hereinafter referred to as ACP) with the long substrate 50. ACP is an anisotropic conductive paste. And is thermocompression-bonded with the sandwiched between them (see FIGS. 2 and 8). The FPC 60 is an example of a joining target. Note that the FPC 60 has a function as an electrical path of electrical signals of image data and other data sent from the control unit (not shown) of the image forming apparatus in the exposure apparatus 10.

  Each LED array 24 is long as shown in FIGS. 1 and 11. The plurality of LED arrays 24 are arranged and mounted in a staggered manner on the long terminals 54 of the long substrate 50 along the longitudinal direction of the long substrate 50. Each LED array 24 has a plurality of LEDs (not shown) arranged in the longitudinal direction. The LED is a light emitting diode. Further, as shown in FIG. 2, the driver 26 is disposed at the center in the short direction on the surface of the long substrate 50.

<Lens array>
The lens array 30 has a function of refracting the light LB emitted from the plurality of LED arrays 24 and forming an image on the photosensitive drum PD. As shown in FIG. 2, the lens array 30 is disposed between the light emitting substrate 20 and the photosensitive drum PD when attached to the image forming apparatus. The lens array 30 is long.

<Case>
The housing 40 has a function of fixing the light emitting substrate 20 and the lens array 30 so that the light emitting substrate 20 and the lens array 30 face each other. The housing 40 is long. Further, as shown in FIG. 2, the casing 40 penetrates in the height direction (a direction intersecting the longitudinal direction and the short direction of the casing 40) and has a long penetration along the longitudinal direction. A hole 42 is formed.

  The housing 40 positions the lens array 30 in the housing 40 by bringing both end surfaces of the lens array 30 in the short-side direction into contact with the upper facing surface in the short-side direction in the through hole 42, and the lens array in the housing 40. 30 is fixed. In addition, the housing 40 is configured such that the light emitting substrate 20 is attached to the housing 40 by bringing both end surfaces in the short direction of the long substrate 50 constituting the light emitting substrate 20 into contact with the opposed surfaces in the lower short direction of the through holes 42. The light emitting substrate 20 is fixed to the housing 40 by positioning.

  The above is the description of the configuration of the exposure apparatus 10.

<< Manufacturing method of exposure apparatus >>
Next, a method for manufacturing the exposure apparatus 10 will be described with reference to the drawings. The manufacturing method of the exposure apparatus includes a first step, a second step, and a third step.

  The first step is a step of manufacturing the substrate 22 by thermocompression bonding the long substrate 50 and the FPC 60, and is performed using a substrate manufacturing apparatus 70 described later. That is, the first step is a method for manufacturing the substrate 22. The second step is a step of manufacturing the light emitting substrate 20 by mounting the plurality of LED arrays 24 on the substrate 22 manufactured in the first step. The third step is a step of fixing the light emitting substrate 20 manufactured in the second step and the lens array 30 described above to the housing 40. Then, when the first step, the second step, and the third step are performed in the order of description, the exposure apparatus 10 is manufactured.

  Hereinafter, the configuration of the substrate manufacturing apparatus 70 will be described, and then the first step, the second step, and the third step will be described.

<Board manufacturing equipment>
The substrate manufacturing apparatus 70 is for manufacturing the substrate 22 by thermocompression bonding the long substrate 50 and the FPC 60. As shown in FIGS. 5A and 5B and FIGS. 7A and 7B, the substrate manufacturing apparatus 70 includes a table 80, a suction unit 90, an attachment unit 100, and a moving unit (not shown). ), A thermocompression bonding part 110, and a control part 120. In the description of the substrate manufacturing apparatus 70, the direction indicated by the arrow X and the arrow -X in the drawings (FIGS. 5 and 7) is the apparatus width direction, and the direction indicated by the arrow Z and the arrow -Z is the apparatus height direction. A direction (direction indicated by an arrow Y and an arrow -Y) orthogonal to the apparatus width direction and the apparatus height direction is defined as an apparatus depth direction.

[Stand]
The base 80 is elongated in the apparatus width direction. A long flat surface 82 and an L-shaped protrusion 84 are formed on the upper side of the table 80. In the plane 82, a long groove 82A along the longitudinal direction is formed. In addition, a plurality of through holes 82B penetrating the table 80 in the apparatus height direction are formed at the bottom of the groove 82A. The plurality of through holes 82B are arranged along the longitudinal direction of the groove 82A. The L-shaped protrusion 84 protrudes above the plane 82 in the apparatus height direction. The L-shaped protrusion 84 has wall surfaces 84A and 84B that are longer than the long substrate 50 and wider than the width. The wall surfaces 84 </ b> A and 84 </ b> B are configured to position the long substrate 50 disposed on the flat surface 82 by contacting the short side end surface and the long side end surface of the long substrate 50 in the first step. 5A and 5B and FIGS. 7A and 7B show a state in which the long substrate 50 is positioned on the table 80 with the back surface thereof facing the flat surface 82. In this state, the opening of the groove 82 </ b> A is closed by the long substrate 50.

[Suction part]
As shown in FIGS. 5B and 7B, the suction unit 90 is a pump connected to the plurality of through holes 82 </ b> B of the base 80, and the opening is blocked by the long substrate 50. The air in the groove 82A is sucked. As a result, the suction unit 90 presses the back surface of the long substrate 50 against the flat surface 82 of the table 80 to correct the warp in the plate thickness direction of the long substrate 50. Here, the suction unit 90 is an example of a correction unit.

[Adhering part]
The attaching portion 100 has a function of attaching ACP to the plurality of terminals 52 of the long substrate 50. Adhering portion 100 has a long flat surface 100A on the lower side in the apparatus height direction, and is movable between a storage box (not shown) for storing ACP and a base 80 by a moving mechanism (not shown). Yes. The attachment portion 100 is moved by the moving mechanism so that the ACP of the storage box is applied to the flat surface 100A, and further, is moved to the upper side of the plurality of terminals 52 by the moving mechanism, so that the ACP is applied to the plurality of terminals 52. It is made to adhere (transfer). In addition, the area | region within the dashed-dotted line of FIG.

[Moving part]
The moving unit (not shown) moves the FPC 60 from the position where the FPC 60 is arranged (supplied) so that the plurality of terminals 64 </ b> A of the FPC 60 face the plurality of terminals 52 of the long substrate 50 positioned on the base 80. It has a function to move. Note that the moving unit sucks and moves the FPC 60.

[Thermocompression bonding part]
The thermocompression bonding section 110 heats and presses the FPC 60 from the opposite side of the plurality of terminals 52 with the FPC 60 sandwiched between the long terminals 50 and the FPC 60 with the FPC 60 sandwiched therebetween. And have a function of thermocompression bonding. As shown in FIGS. 7A and 7B, the thermocompression bonding part 110 includes a contact part 110A that contacts the FPC 60, a moving mechanism (not shown) that moves the contact part 110A in the vertical direction, and a contact part 110A. And a heating source (not shown) for heating. 110 A of contact parts are arrange | positioned in the stand-by position of the apparatus height direction upper side with respect to the base 80, when thermocompression bonding is not performed, and when thermocompression bonding is performed, it is moved to the apparatus height direction lower side by the moving mechanism. Thus, the FPC 60 is pressurized from the upper side in the apparatus height direction. Further, the contact portion 110A is heated by a heating source while the FPC 60 is being pressurized. As a result, the thermocompression bonding part 110 is configured to thermocompression bond the long substrate 50 and the FPC 60. FIG. 8 shows a state where the long substrate 50 and the FPC 60 are thermocompression bonded, and the plurality of terminals 52 of the long substrate 50 and the plurality of terminals 64A of the FPC 60 are joined by ACP.

[Control unit]
The control unit 120 has a function of controlling each component other than the control unit 120 configuring the substrate manufacturing apparatus 70. The function of the control unit 120 will be described in the description of the first step described later.

  The above is the description of the configuration of the substrate manufacturing apparatus 70.

<First step>
As described above, the first step is a step of manufacturing the substrate 22 by thermocompression bonding the long substrate 50 and the FPC 60 and is performed using the substrate manufacturing apparatus 70. Specifically, the first step is performed as follows.

  First, the operator positions the long substrate 50 on the table 80 with the back surface of the long substrate 50 facing the flat surface 82 (see FIGS. 5A and 5B). When the operator presses a start switch (not shown) provided in the substrate manufacturing apparatus 70, the control unit 120 starts the operation of the substrate manufacturing apparatus 70. When the operator presses the start switch, first, the control unit 120 operates the suction unit 90 to suck the air in the groove 82 </ b> A whose opening is closed by the long substrate 50. As a result, when the back surface of the long substrate 50 is pressed against the flat surface 82 of the base 80, the warp in the thickness direction that the long substrate 50 has in a natural state (no load state) is corrected.

  Next, the control unit 120 operates the adhering unit 100 while operating the suction unit 90 to adhere the ACP to the plurality of terminals 52 of the long substrate 50 (see FIG. 5B).

  Next, the control unit 120 operates the moving unit (not shown) in a state where the suction unit 90 is continuously operated, moves the FPC 60 from the arrangement position where the FPC 60 is arranged, and a plurality of ACPs are attached. A plurality of terminals 64 </ b> A of the FPC 60 are opposed to the terminal 52. That is, the control unit 120 operates the moving unit to face the plurality of terminals 52 to which the ACP is attached and the FPC 60.

  Next, the control unit 120 continues to operate the suction unit 90 and operates the thermocompression bonding unit 110 in a state where the plurality of terminals 52 to which the ACP is attached and the FPC 60 face each other. Thermocompression bonding with the FPC 60 is started (see FIGS. 7A and 7B). Then, the control unit 120 stops the operation of the suction unit 90 before the thermocompression bonding by the thermocompression bonding unit 110 is completed. As a result, the correction of the warp in the plate thickness direction of the long substrate 50 is canceled before the end of the thermocompression bonding between the long substrate 50 and the FPC 60 (while the thermocompression bonding is being performed) (see FIG. 10). Further, the long substrate 50 is sucked by the suction unit 90 during a part of the period in which the long substrate 50 and the FPC 60 are thermocompression bonded. Therefore, even if the long substrate 50 is heated by thermocompression bonding and tries to be thermally deformed, the long substrate 50 is unlikely to warp on the surface side in the plate thickness direction (upper side in the apparatus height direction). When the thermocompression bonding by the thermocompression bonding part 110 is completed, the first process is completed, and the substrate 22 is manufactured (see FIG. 9).

<Second step>
As described above, the second step is a step of manufacturing the light emitting substrate 20 by mounting the plurality of LED arrays 24 on the substrate 22 manufactured in the first step. The second step is performed using a mounting apparatus (not shown). Specifically, in the second step, a plurality of LED arrays 24 are arranged along the longitudinal direction on the long terminals 54 formed on the back surface of the long substrate 50 of the substrate 22 manufactured in the first step. A plurality of LED arrays 24 are mounted on the scale substrate 50. The mounting apparatus mounts the plurality of LED arrays 24 on the long substrate 50 without correcting the warp in the short direction even if the substrate 22 manufactured in the first step is along the short direction. When the second step is completed, the light emitting substrate 20 is manufactured (see FIG. 11).

<Third step>
The third step is a step of fixing the light emitting substrate 20 and the lens array 30 manufactured in the second step to the housing 40 as described above. The third step is performed by a worker using a fixing jig (not shown) for fixing the light emitting substrate 20 and the lens array 30 to the housing 40. Specifically, in the third step, the operator brings both end surfaces of the lens array 30 in the short direction into contact with the upper surface in the short direction of the through hole 42 (positions the lens array 30 on the housing 40). ). Next, the worker applies an adhesive (not shown) to a plurality of locations on the upper peripheral edge of the long through hole 42 so as to straddle the casing 40 and the lens array 30, and the casing 40. The lens array 30 is fixed to (see FIGS. 1 and 2). In addition, the operator brings both end surfaces in the short direction of the long substrate 50 constituting the light emitting substrate 20 into contact with the opposing surfaces in the lower short direction of the through holes 42 (positioning the light emitting substrate 20 on the housing 40). To do). Next, the operator applies an adhesive (not shown) to a plurality of locations on the lower peripheral edge of the long through hole 42 so as to straddle the housing 40 and the long substrate 50, and The light emitting substrate 20 is fixed to the body 40 (see FIGS. 1 and 2). When the third step is completed, the exposure apparatus 10 is manufactured (see FIGS. 1 and 2).

  The above is the description of the manufacturing method of the exposure apparatus 10.

≪Action≫
Next, the operation of the embodiment will be described in comparison with a comparative embodiment described below. In the following description, it is assumed that the substrate, the light emitting substrate, and the exposure apparatus manufactured by the method of the comparative embodiment are a substrate 22A (see FIG. 13), a light emitting substrate 20A (not shown), and an exposure apparatus 10A (not shown), respectively. A substrate manufacturing apparatus according to the comparative example is referred to as a substrate manufacturing apparatus 70A. In addition, in description of a comparison form, when using components etc. equivalent to the components used by embodiment, the names of the components etc. shall be used as they are.

  In the embodiment, the method of manufacturing the substrate 22A of the comparative embodiment cancels the correction of the warp in the plate thickness direction of the long substrate 50 before the end of the thermocompression bonding of the long substrate 50 and the FPC 60 (FIG. 10). (Refer to FIG. 12). The difference is that the correction of the warp in the thickness direction of the long substrate 50 is canceled after completion of the thermocompression bonding. The manufacturing method of the substrate 22A (exposure apparatus 10A) of the comparative form is the same as that of the embodiment except for the above points. The substrate manufacturing apparatus 70A of the comparative form is the same as that of the embodiment except that the control unit 120 performs the control as described above.

  In the case of the manufacturing method of the substrate 22A of the comparative form, the long substrate 50 is sucked by the suction unit 90 during the period from the start to the end of the thermocompression bonding of the long substrate 50 and the FPC 60 (see FIG. 12). That is, during the period in which the long substrate 50 and the FPC 60 are thermocompression bonded, the long substrate 50 is warped on the surface side in the plate thickness direction (upper side in the apparatus height direction) even if it is heated by thermocompression bonding and tries to be thermally deformed. Difficult (difficult to deform). Therefore, the long substrate 50 has a portion in which the plurality of terminals 52 are formed pressed in the thermocompression bonding part 110, and the one side end surface in the longitudinal direction and the one side end surface in the short direction are pressed in the plate thickness direction. Thermally deforms in the intersecting direction (longitudinal direction or short direction). As a result, as shown in FIG. 13, the long substrate 50 after completion of the thermocompression bonding is shifted at the opposite ends of the protruding portion 84 on the side opposite to the wall 84 </ b> A side. That is, in the comparative example, the long substrate 50 constituting the substrate 22A is warped in the short direction. In addition, when the amount of warpage in the short direction in the comparative example (the amount of movement in the short direction of the end portion with respect to the central portion in the longitudinal direction) was measured, the amount of warpage in the short direction was about 0.3 mm as an example. Met.

  Next, when manufacturing the light emitting substrate 20 </ b> A using the substrate 22 </ b> A, the plurality of LED arrays 24 are arranged on the long terminals 54 along the longitudinal direction and mounted on the long substrate 50. Specifically, the plurality of LED arrays 24 are arranged at a portion indicated by a two-dot chain line in FIG. 13 (in a state along the two-dot chain line).

  Next, when the exposure apparatus 10A is manufactured using the light emitting substrate 20A, the lens array 30, and the housing 40, the following problems may occur in the exposure apparatus 10A. That is, when the rigidity of the long substrate 50 constituting the light emitting substrate 20A is higher than the rigidity of the housing 40, the housing 40 fixing the light emitting substrate 20A corresponds to the warp in the thickness direction of the light emitting substrate 20A. Will be warped. Therefore, the lens array 30 may be warped corresponding to the warp in the thickness direction of the housing 40 (first case). Further, when the rigidity of the long substrate 50 constituting the light emitting substrate 20A is lower than the rigidity of the housing 40, the light emitting substrate 20A is fixed to the housing 40 and the warpage in the short direction is corrected. Therefore, there exists a possibility that the some LED array 24 arrange | positioned along the longitudinal direction of the elongate board | substrate 50 may warp in a transversal direction (it forms a row | line | column in the bent state) (2nd case). As described above, the exposure apparatus 10 </ b> A of the comparative form has the plurality of LED arrays 24 and the lens array 30 arranged on the light emitting substrate 20 </ b> A in any case (first and second cases). The positional relationship deviates from the determined position (problem of positional deviation).

On the other hand, in the case of the embodiment, the operation of the suction unit 90 is stopped before the end of thermocompression bonding, so that the warpage of the long substrate 50 in the thickness direction before the end of thermocompression bonding between the long substrate 50 and the FPC 60 is performed. Is corrected (see FIG. 10). That is, even after the correction of the warp in the plate thickness direction of the long substrate 50 is released, the thermocompression bonding between the long substrate 50 and the FPC 60 is performed.


For this reason, the long substrate 50 is thermally deformed during the period in which the thermocompression bonding is performed after the correction of the warp in the plate thickness direction of the long substrate 50 is released, and the surface side in the plate thickness direction (the upper side in the apparatus height direction). ) Easily warp (deforms easily). From another point of view, the long substrate 50 is in a direction (longitudinal direction or direction intersecting the plate thickness direction) during a period in which thermocompression bonding is performed after the correction of the warp in the plate thickness direction of the long substrate 50 is released. Hard to heat deform in the short direction). In addition, when the amount of warpage in the short direction in the case of the embodiment was measured, the amount of warpage in the short direction was 0.01 mm or more and 0.03 mm or less as an example.

  Therefore, according to the manufacturing method of the substrate 22 of the embodiment, the long substrate is compared with the case where the correction of the warp in the thickness direction of the long substrate 50 is canceled after the thermocompression bonding of the long substrate 50 and the FPC 60 is completed. The warp in the short direction of 50 is suppressed. Accordingly, the manufacturing method of the exposure apparatus 10 according to the embodiment includes a step of canceling the correction of warpage in the thickness direction of the long substrate 50 after completion of the thermocompression bonding of the long substrate 50 and the FPC 60. Compared to the case of using 22A, the positional deviation between the plurality of LED arrays 24 and the lens array 30 is suppressed. Furthermore, according to the substrate manufacturing apparatus 70 of the embodiment, compared with the case where the control unit 120 cancels the correction of warpage in the plate thickness direction of the long substrate 50 after the end of the thermocompression bonding of the long substrate 50 and the FPC 60, The board | substrate 22 with which the curvature of the transversal direction of the elongate board | substrate 50 was suppressed can be manufactured.

  As described above, the present invention has been described in detail for specific embodiments, but the technical scope of the present invention is not limited to the above-described embodiments. For example, the following forms are also included in the technical scope of the present invention.

  The exposure apparatus 10 of the embodiment has been described as an example of an optical apparatus. However, for example, when a plurality of light emitting elements (LED array 24) constituting the light emitting substrate 20 of the exposure apparatus 10 are changed to light receiving elements, an image reading apparatus of a contact image sensor is obtained. In this case, the light receiving element is an example of an optical element. The image reading apparatus is an example of an optical apparatus.

  Further, it has been described that the correction of the warp in the thickness direction of the long substrate 50 in the embodiment is performed by suction using the suction unit 90. However, as long as the warpage in the thickness direction of the long substrate 50 can be corrected, the correction may be performed by a method other than suction. For example, the long substrate 50 may be pressed against the table 80 by pressing the surface of the long substrate 50 toward the table 80.

  Also, an example of the anisotropic conductive material of the embodiment has been described as being ACP. However, as long as the long substrate 50 and the FPC 60 can be thermocompression bonded, an example of the anisotropic conductive material may not be ACP. For example, an example of an anisotropic conductive material may be ACF (Anisotropic Conductive Paste).

  Moreover, it demonstrated as an example of the joining object of embodiment being a flexible substrate (FPC). However, as long as it is thermocompression bonded to the long substrate 50, an example of the bonding target may not be the FPC. For example, an example of a joining target may be a flexible flat cable (FFC).

  Moreover, in the manufacturing method of the exposure apparatus 10 of the embodiment, a part of the process has been described as being performed by an operator. However, as long as the same content as each step can be executed, all the steps may be automatically performed by a machine.

DESCRIPTION OF SYMBOLS 10 Exposure apparatus 22 Board | substrate 24 LED array (an example of an optical element)
30 Lens array (an example of an optical component)
40 long casing 42 long through hole 50 long substrate 52 terminal 54 long terminal 60 flexible substrate (an example of a bonding target)
70 Substrate manufacturing apparatus 80 units 90 Suction unit 100 Adhering unit 110 Thermocompression bonding unit 120 Control unit

Claims (3)

A long substrate configured to include glass epoxy, the short direction of the long substrate having a plurality of terminals formed in a row along the longitudinal direction on the surface of one end portion in the short direction the entire other end surface with contacting the base of the wall of, by pressing the back surface of the long continuous substrate該台, a step of correcting the thickness direction of the warp of the long substrate,
Attaching an anisotropic conductive material to the terminal;
The step of facing the terminal to which the conductive material is attached and the object to be bonded, and thermocompression bonding the long substrate and the object to be bonded, wherein the correction is released after the start and before the end of the thermocompression bonding When,
The manufacturing method of the board | substrate containing this. In the long substrate, a long terminal along the longitudinal direction is formed on the back surface,
Disposing a plurality of optical elements along the longitudinal direction on the long terminal of the substrate manufactured by the method of claim 1, and mounting the plurality of optical elements on the long substrate;
A step of fixing the substrate and the optical component to a long casing in which a long through hole is formed so that the plurality of optical elements and the optical component face each other; A step of positioning and fixing the substrate to the housing by bringing both end surfaces of the short substrate in contact with the opposite surfaces of the through hole in the short direction; and
A method for manufacturing an optical device. A table with a wall ,
A long substrate composed of glass epoxy, a plurality of terminals arranged in a row along the longitudinal direction on the surface of one end portion in the short direction, and a long terminal along the longitudinal direction on the back surface. the whole other end face of the short-side direction of the long continuous substrate which causes contact with the wall surface, by pressing the back surface of the long substrate in該台, the thickness direction of the warp of the long length substrate A correction section to correct,
An attachment part for attaching an anisotropic conductive material to the terminal;
In a state where the terminal to which the conductive material is attached and the object to be bonded face each other, the long object and the object to be bonded are heated and pressed from the opposite side of the terminal with the object to be bonded interposed therebetween. A thermocompression bonding part for thermocompression bonding,
A control unit that releases the correction by the correction unit after the thermocompression unit starts and ends before pressing the back surface against the table by the correction unit;
A board manufacturing apparatus comprising:

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