TWI722702B - Mounting device for electronic parts - Google Patents

Abstract

The present invention is an electronic component mounting device, and its subject is to provide an electronic component mounting device that does not easily cause damage to the electronic component or the substrate, and can mount the electronic component on the substrate with high mounting accuracy. The solution is the electronic component mounting device of the present invention, which is provided with: a first type plate having singular or plural fixed members, and a second type plate having singular or plural movable members, and the first type plate and the second type plate Between the stencils, there are installation components for electronic parts and substrates, and a movement control part that controls the closeness and separation of the first and second stencils. The fixed component is for the first stencil to fix its position and move. For the second template, the position of the member can be changed. The position of each fixed member and movable member corresponds to the position of the electronic component installed via the installation member. At least one of the electronic parts and the substrate is provided with pressure, and the movable member can release the pressure from the fixed member through the movement. If the excess pressure is excessive, at least one of the first template and the second template is equipped with heat release External heat dissipation components.

Description

Mounting device for electronic parts

The present invention relates to an electronic component mounting device for mounting electronic components on a substrate.

Many electronic equipment, measuring equipment, conveying equipment, precision equipment, etc. are equipped with electronic components mainly including semiconductor integrated circuits. Processors, image processing circuits, sound processing circuits, various sensors, etc. are progressing in high integration, integrating many functions into electronic parts. This electronic part becomes necessary for these machines.

This electronic component must be installed on the lead frame, flexible frame, electronic substrate, metal substrate, heat sink and other substrates. In the case of introducing the substrate itself into electronic parts, etc., it is the substrate into which the electronic parts are mounted. Or, in the manufacturing process, the mounting of electronic parts may become a necessary substrate. For electronic devices and the like, when electronic parts are necessary, they must be mounted on a substrate.

In this way, electronic components such as semiconductor integrated circuits are often mounted on lead frames or electronic substrates, metal substrates, heat sinks, and other substrates.

Here, when mounting an electronic component on a substrate, there is a method of applying an adhesive between the substrate and the electronic component, and applying pressure and heat to perform mounting via the adhesive. Those who have an installation device that will pass this method are called a sintering device. However, the substrates here are those that have a single-layer composition stack, those that are made up of one sheet, those that are made up by laminating a plurality of sheets, and so on.

In the substrate, the mounting position of the position where the electronic parts are mounted is set. For this installation position, an adhesive is applied. Moreover, the electronic components are in contact with the adhesive, and the electronic components are arranged at the mounting position. In this state, pressure and heat are applied to the electronic parts.

Through the application of pressure and heat, the bonding of electronic components on the substrate through the adhesive is realized. As a result, an adhesive layer is formed between the substrate and the electronic component. With this bonding layer, the electronic components become those mounted on the substrate.

In this way, in order to realize the storage of electronic components in electronic equipment or the like, or to use the electronic components, in order to perform the next manufacturing process, the electronic components are mounted on the substrate. Because the adhesive is installed with pressure and heat, it is suitable for installing a large number of electronic parts.

There is a proposal for a technology of a mounting device for an electronic component called a sintering device (for example, refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2016-507164 Publication

[The problem to be solved by the invention]

Patent Document 1 is a semiconductor die encapsulation method or a semiconductor die carrier mounting method including: a step of providing a first tool part for holding a plurality of semiconductor dies and a step of providing a semiconductor die on the first tool part; The step of providing a second tool part, one of the first tool part and the second tool part has a step of plural movable insertion members that can be applied with pressure to the surface of the semiconductor die through each movable insertion member ; And for the prescribed space between the first tool part and the second tool part, the semiconductor product is arranged in the space, and the step of combining the first tool part and the second tool part is presented. The movable insertion member puts pressure on the surface area of the semiconductor die. The pressure applied via the movable insertion member is monitored and adjusted. Next, a semiconductor die mounting device in which the first tool part and the second tool part are separated to remove the processed semiconductor die is disclosed.

Patent Document 1 discloses a technique of simultaneously mounting a plurality of semiconductor dies on a substrate using resin. At this time, the semiconductor die and the substrate have a structure that sandwiches the movable member and the fixed member. According to this structure, the movable member that can move up and down applies pressure to the semiconductor die, and the fixed member receives this. As a result, the installation via the adhesive is realized.

However, the technology of Patent Document 1 applies pressure to the semiconductor die on the movable member. That is, the semiconductor die and the substrate received by the fixed member may be damaged due to the pressure applied by the moving movable member. There may be damage caused by excessive stress. Or, even if the pressure is not excessively applied, the moving movable member will directly apply pressure to the semiconductor die or substrate (the movable member is directly pressed or pressed by a thin film, etc.), and through this action, the semiconductor Die or substrate will be damaged.

On the contrary, when the pressure is reduced so as not to cause damage, there is also a problem of insufficient installation through resin. In order to show that it does not occur, the pressure that must be applied should be searched for the optimum value according to the type of semiconductor die or substrate. Exploring such an optimal value has the problem of increasing the burden on the manufacturing process.

In addition, when the pressure applied via the movable member becomes uncomfortable, the thickness of the adhesive layer between the semiconductor die and the substrate may become thicker and remain. In the case where the adhesive layer between the semiconductor die and the substrate is thick, the semiconductor die is used as a high-frequency semiconductor and a power semiconductor, which is also involved in the problem that its performance cannot be sufficiently guided.

Therefore, when the applied pressure is uncomfortable, the mounting accuracy becomes insufficient, which also involves the problem of insufficient performance of the mounted semiconductor die (electronic component). Or, it becomes a problem that the installation is insufficient, and it is also likely to be implicated in post-installation defects.

In addition, multiple electronic components must be mounted on the substrate, and multiple electronic components must be mounted once. For the efficiency of manufacturing process or cost reduction. At this time, in the stacking of substrates, adhesives, and electronic components, the thickness of each of the plural electronic components may become uneven.

When the thickness is uneven, when the pressure applied by the movable member corresponding to each electronic component corresponds, there is a problem of uneven mounting in the plural electronic components. The uneven installation is implicated in uneven performance or uneven durability, which is not ideal. In Patent Document 1, since the movable member directly applies pressure to the semiconductor die, there is a problem that it is difficult to absorb this unevenness.

In addition, in the electronic component mounting device, an adhesive such as a metal paste is used to mount the electronic component on the substrate. In order for the adhesive such as the metal paste to be sufficiently cured and installed reliably, it is also necessary to apply sufficient heating to the pressurization via the pressurizing member. Therefore, the pressurizing member itself has heat, and the pressurizing member having heat applies heat to the electronic parts and the substrate when pressurizing.

At this time, although it depends on the type of adhesive, it must be heated to about 300°C. In order to add heat of only this temperature to the pressing member, the template provided with the pressing member must also have heat. During installation, the mold plates are fitted with each other and pressurized, so it becomes a highly heated one in a closed narrow space.

Therefore, the electronic component mounting device itself and its interior become extremely hot. The electronic component mounting device installs the electronic components of a large number of installation objects in sequence. Therefore, the high temperature will also adversely affect the operating performance. Or, in the work space where the electronic component mounting device is used, there is a situation that is not good for the environment. This is because the temperature rise of the workshop involved in the work space, and the influence of heat conduction on other devices connected to the electronic component mounting device are also involved.

As such, in the electronic component mounting device called the above-mentioned sintering device, the inside of the device or the device itself (or the element of the device) also has a very high temperature in relation to the installation process.

As described above, the prior art starting from Patent Document 1 has problems such as damage to electronic parts or substrates, insufficient mounting accuracy, and the like.

The object of the present invention is to provide an electronic component mounting device that does not easily cause damage to the electronic component or the substrate, and can mount the electronic component on the substrate with high mounting accuracy. [Means to solve the problem]

In view of the above-mentioned problems, the electronic component mounting device of the present invention is provided with: a first type plate having singular or plural fixing members, And the second type plate with singular or plural movable members, And between the first type board and the second type board, the installation member of the electronic parts and the substrate is installed, And the movement control part that controls the closeness and isolation of the first type plate and the second type plate, The fixing member is to fix the position of the first type plate, For the second type plate, the movable member can change its position, Each position of the fixed member and the movable member corresponds to the position of the electronic component installed via the installation member, According to the approach of the movement control unit, the fixed member exerts pressure on at least one of the electronic component and the substrate, and the movable member can release the excess pressure from the pressure exerted by the fixed member through movement, At least one of the first type plate and the second type plate is provided with a heat dissipation member that releases heat to the outside. [Effects of the invention]

The electronic component mounting device of the present invention applies pressure from the fixed member while the movable member is configured to release excess pressure, which can prevent excess pressure from being applied to the electronic component or the substrate. At this time, since the optimal value control of the pressure imparted by the pressure via the fixing member is also reduced, the load on the device is reduced.

In addition, since the pressure is also prevented from becoming too low, the adhesive layer is thickened, and it can also prevent the performance of the electronic parts after installation from being insufficient.

In addition, when a plurality of electronic components are installed at the same time, the excessive part of the pressure exerted by the movable member from the fixed member is released by the movable member, and there is no need for pressure control corresponding to each electronic component. As a result, the control of the device becomes simple, and the load or cost in the manufacturing process can be reduced.

In addition, the electronic component mounting device of the present invention is equipped with a mechanism for releasing heat or a mechanism for cooling among various elements. As a result, the excessive temperature rise of the mounting device (and its elements) can be suppressed by heating that becomes necessary during mounting, and the durability, continuous workability, and maintenance of the electronic component mounting device can be improved.

The electronic component mounting device of the first invention related to the present invention is provided with: a first type plate having singular or plural fixing members, And the second type plate with singular or plural movable members, And between the first type board and the second type board, the installation member of the electronic parts and the substrate is installed, And the movement control part that controls the closeness and isolation of the first type plate and the second type plate, The fixing member is to fix the position of the first type plate, For the second type plate, the movable member can change its position, Each position of the fixed member and the movable member corresponds to the position of the electronic component installed via the installation member, According to the approach of the movement control unit, the fixed member exerts pressure on at least one of the electronic component and the substrate, and the movable member can release the excess pressure from the pressure exerted by the fixed member through movement,

With this configuration, when pressure is applied for mounting via bonding, etc., it is possible to prevent the electronic parts from being damaged by applying excessive pressure.

In the electronic component mounting device according to the second invention of the present invention, in addition to the first invention, the movement control unit brings the first template and the second template close to each other so that the fixing member can contact the electronic component or the substrate. Through this contact, the fixing member can apply pressure to at least one of the electronic component and the substrate.

With this structure, the fixing member can be given pressure for installation.

In the electronic component mounting device according to the third invention of the present invention, in addition to the first or second invention, the pressure is applied to at least one of the electronic component and the electronic substrate via the fixing member, and the excess pressure is passed through the movable Those who have been liberated from components install electronic components on the board.

With this structure, it can be installed with the best pressure for installation. In addition, since there is no excess pressure, damage to electronic parts, etc., can be prevented.

In the electronic component mounting device related to the fourth invention of the present invention, in addition to any one of the first to third inventions, the fixing member is made by pressing the electronic component or the substrate, and can apply pressure to at least one of the electronic component and the substrate .

With this structure, the pressure can be applied by pressing.

In the electronic component mounting device related to the fifth invention of the present invention, in addition to any one of the first to fourth inventions, the second template is at a position corresponding to the fixing member, and has singular or plural insertion holes, each The singular or plural movable members are inserted into the insertion holes respectively, and the position of the second plate can be changed.

With this configuration, the movable member can release excessive pressure through position changes.

In the electronic component mounting device according to the sixth invention of the present invention, in addition to the fifth invention, the movable member changes the position of the insertion hole by the pressure from the fixed member received by the electronic component and the substrate.

With this structure, the movable member can release excess pressure.

In the electronic component mounting device according to the seventh invention of the present invention, in addition to the sixth invention, the movable member is changed in position inside the insertion hole to relieve excess pressure.

With this structure, the movable member can release excess pressure.

In the electronic component mounting device according to the eighth invention of the present invention, in addition to the seventh invention, the amount of excess pressure released by the movable member can be adjusted via the amount of position change inside the insertion hole.

With this configuration, the movable member can absorb the difference in excess pressure through the movable amount.

In the electronic component mounting device related to the ninth invention of the present invention, in addition to any one of the first to eighth inventions, each fixed member, insertion hole, and movable member correspond to the singular or plural electronic components provided in the mounting member The number and location of parts.

With this structure, electronic components can be installed.

In the electronic component mounting device according to the tenth invention of the present invention, in addition to any one of the first to ninth inventions, a sheet is provided between the fixing member and the electronic component.

With this structure, it becomes possible to protect electronic parts when pressure is applied.

In the electronic component mounting device of the eleventh invention related to the present invention, in addition to the tenth invention, an intermediate mold for holding the outer periphery of the electronic component is further provided between the first mold plate and the installation member. The middle mold system can maintain the state of electronic parts when the sheet is peeled off.

With this structure, when the sheet is peeled off, the electronic parts can be prevented from being stretched.

In the electronic component mounting device according to the twelfth invention of the present invention, in addition to any one of the first to eleventh inventions, each plural movable member can be individually realized in its movable state.

With this configuration, it is also possible to optimally cope with the unevenness of the plural electronic components and install it.

In the electronic component mounting device of the thirteenth invention related to the present invention, in addition to any one of the first to twelfth inventions, each plural movable member can be movable under at least one of fluid pressure, elastic pressure and motor drive status.

By this structure, it is suitable for the movable member to release the excess pressure.

In the electronic component mounting device according to the fourteenth invention of the present invention, in addition to any one of the first to thirteenth inventions, it is further provided with a pressure detection unit that detects the pressure applied to at least one of the electronic component and the substrate. The movable member is the one that can change the movable state according to the pressure.

With this structure, the excess pressure can be grasped from the actual pressure applied by the fixed member, and the movable member can release the excess pressure. As a result, the actual pressure can be given.

In the electronic component mounting device according to the fifteenth invention of the present invention, in addition to any one of the first to fourteenth inventions, it is further provided with a movable member control unit that controls at least one of the movable amount and the movable speed of the plurality of movable members. The movable member control unit is based on the movable control instruction table memorized in advance, and can control at least one of the movable amount, the operating time, and the movable speed for each of the plural movable members.

With this structure, based on the actual pressure through the fixed member and the correlation between the pressure and the excess pressure, the excess pressure based on the reality can be liberated.

The electronic component mounting device of the sixteenth aspect of the present invention is provided with: a first type plate having singular or plural fixing members, And the second type plate with singular or plural movable members, And between the first template and the second template, an installation member for electronic parts and a substrate is provided, And the movement control part that controls the closeness and isolation of the first type plate and the second type plate, The aforementioned fixing member fixes the position of the aforementioned first type plate, The position of the movable member can be changed with respect to the second type plate, The position of each of the fixed member and the movable member corresponds to the position of the electronic component installed via the installation member, Through the proximity of the movement control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can release excess pressure from the pressure applied by the fixed member through movement , At least one of the first mold plate and the second mold plate is provided with a heat dissipation member that releases heat to the outside.

With this configuration, it is possible to prevent excessive heat generation in the first or second stencil through heat generated by heating that becomes necessary at the time of installation.

In the electronic component mounting device of the 17th invention related to the present invention, in addition to the 16th invention, at least one of the first template and the second template is provided with an internal space and an opening communicating from the internal space to the outside unit.

With this structure, the heat generated in the first or second stencil can be discharged to the outside.

In the electronic component mounting device of the 18th invention related to the present invention, in addition to the 17th invention, it is provided that at least one of the internal space of the first template and the internal space of the second template is released to External vacuum device.

With this configuration, the internal heat can be discharged more compulsorily and positively.

In the electronic component mounting device of the 19th invention related to the present invention, in addition to the 17th or 18th invention, in the second stencil, the internal space is provided between the surface of the second stencil and the movable member between.

With this configuration, the heat caused by the movable member can be easily discharged to the outside.

In the electronic component mounting device of the twentieth invention related to the present invention, in addition to any one of the sixteenth to nineteenth inventions, at least one of the first template and the second template is provided with a heat insulating material on its outside At least part of the surface.

With this configuration, it is possible to suppress heat conduction from the template to the electronic component mounting device or its frame.

In the electronic component mounting device according to the 21st invention of the present invention, in addition to any one of the 16th to 20th inventions, the second form plate is further provided with a refrigerant circulation path in which a refrigerant circulates.

With this configuration, the template can be cooled more actively.

In the electronic component mounting device of the 22nd invention related to the present invention, in addition to the 21st invention, the aforementioned refrigerant is any one of a liquid refrigerant, a colloidal refrigerant, and a gas refrigerant.

With this configuration, the ability to diffuse the refrigerant circulation path varies.

In the electronic component mounting device of the 23rd invention related to the present invention, in addition to the 22nd invention, the movable member is provided with a singular or plural number of heat dissipation holes.

With this configuration, the heat from the movable member can be released to the outside.

In the electronic component mounting device of the 24th invention related to the present invention, in addition to the 20th invention, the heat dissipating member is further provided with a cooling control unit that controls the operation of at least one of the vacuum device and the refrigerant circulation path, And a temperature measuring part that measures the temperature of at least one of the first and second mold plates, Based on the measurement result in the temperature measurement unit, the cooling control unit controls the operation of at least one of the heat dissipation member, the vacuum device, and the refrigerant circulation path.

With this configuration, it is possible to achieve cooling control that matches the temperature rise of the template, etc.

In the electronic component mounting device related to the 25th invention of the present invention, in addition to any one of the 17th to 24th inventions, at least one of the first and second forms is provided in the inner space and further has an interior heat sink.

With this configuration, it is possible to more easily release the heat accumulated in the second mold plate.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(For the installation of electronic components on electronic substrates) In the present invention, the mounting of electronic components on the substrate will be described. Figure 1 is a front view of a substrate on which electronic components are mounted. Fig. 2 is a side view of a substrate on which electronic components are mounted. The substrate 100 is a lead frame, a metal base, a heat sink or an electronic substrate, etc., and also includes a flexible wiring substrate, a strip substrate, a thin substrate, and the like. In addition, it has a variety of structures such as single layer, layered, etc.

FIG. 1 shows the state of the substrate 100 as viewed from above. On the substrate 100, singular or plural electronic components 200 are mounted. In FIG. 1, a plurality of electronic components 200 are mounted, and the substrate 100 may be stored in an electronic device or the like while maintaining this state, and it may also be divided into individual electronic components 200 for use.

As shown in FIG. 2, the electronic component 200 is mounted on the substrate 100 through the adhesive layer 210. The adhesive layer 210 is an adhesive or the like, and the electronic component 200 is mounted on the substrate 100 through the bonding function of the adhesive. Before mounting, an adhesive or the like is applied, and after mounting is applied with pressure for mounting, the adhesive layer 210 is formed.

The electronic component mounting device of the present invention realizes the mounting as shown in Fig. 1 and Fig. 2.

(Embodiment 1) The first embodiment will be described. Fig. 3 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. The electronic component mounting apparatus 1 performs mounting of the electronic component 200 on the substrate 100 described in FIG. 1 and FIG. 2.

The electronic component mounting device 1 is provided with a first mold plate 2, a second mold plate 3, an installation member 4, and a movement control unit 5.

The first form plate 2 has singular or plural fixing members 21. The fixing member 21 is a state in which the first form 2 is fixed, and the relative positional relationship with the first form 2 is not changed. For the first form plate 2, the fixing member 21 is a fixed position. That is, the fixing member 21 moves the position at the same time as the first template 2. In addition, as will be described later, when the distance between the first template 2 and the second template 3 is shortened, the fixing member 21 applies pressure to the electronic components 200 and between the first template 2 and the second template 3 At least one of the substrate 100.

The second form plate 3 is a pair of the first form plate 2. In FIG. 3, the first form 2 is shown on the upper side, and the second form 3 is shown on the lower side, but the vertical relationship or the left-right relationship is not limited to this. The second mold plate 3 is a pair with the first mold plate 2, and the application of pressure to the electronic component 200 and the like via the fixing member 21 is achieved by the positional relationship close to each other.

The second form 3 has a singular or plural movable member 31. The movable member 31 can change its position with respect to the second form 3. That is, when the second mold 3 is close to the first mold 2, the movable member 31 can change its position with respect to the second mold 3 through the contact state with the electronic component 200 or the like.

As shown in FIG. 3, the movable member 31 is inserted in the recessed part provided in the 2nd template 3, and the one which moves in this recessed part can be moved by the position change.

The installation member 4 is located between the first template 2 and the second template 3, and the electronic component 200 and the substrate 100 are installed. As shown in FIG. 3, the installation member 4 is installed by sandwiching the electronic component 200 and the substrate 100. The electronic component 200 is installed at the position to be mounted on the substrate 100. Alternatively, the position of the electronic component 200 and the substrate 100 is determined and the position is fixed by an adhesive. The structure in this state is placed on the installation member 4 and then installed between the first form plate 2 and the second form plate 3.

The setting member 4 is placed at the position to be mounted on the substrate 100, and the electronic component 200 is installed (or the electronic component 200 fixed to the substrate 100 is installed on the setting member 4), and then installed on the first plate 2 and the second type Between plates 3. The installer installs the electronic component 200 by applying pressure based on the first template 2 and the second template 3. At this time, an adhesive or the like is applied between the electronic component 200 and the substrate 100.

The movement control unit 5 controls the closeness and isolation of the first form plate 2 and the second form plate 3 in response to this pressure application. The movement control unit 5 is capable of moving at least one of the first form plate 2 and the second form plate 3 to control the closeness and isolation of the first form plate 2 and the second form plate 3.

Here, each of the fixed member 21 and the movable member 31 has a positional relationship corresponding to the position of the electronic component 200 installed via the installation member 4. That is, for the electronic component 200 installed via the installation member 4, the fixed member 21 and the movable member 31 are located in opposite positions.

The movement control unit 5 brings the first form plate 2 and the second form plate 3 close to each other. By this approach, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100. With the application of this pressure, the electronic component 200 is fixed to the substrate 100 by the action of the adhesive. When the pressure is applied again, the movable member 31 can release the excess pressure from the pressure applied by the fixed member 21 through the movement.

The excess pressure is released through the movable member 31, and only the pressure necessary for mounting is applied to the electronic component 200 and the substrate 100, and no excess pressure is applied. As a result, as in the prior art, no damage to the electronic component 200 or the substrate 100 occurred.

In addition, when a plurality of electronic components 200 are installed at the same time, for each electronic component 200, there is a different excess pressure corresponding to each, and the movable member 31 can be released. As a result, the optimal pressure can be applied to the plural electronic components 200 with uneven height or mounting surface. Excessive pressure is not applied, and breakage can be prevented. In addition, since the movable member 31 only releases excess pressure, the pressure necessary for installation is given by each electronic component 200, and the installation can be performed reliably.

However, each fixed member 21, the insertion hole 32, and the movable member 31 correspond to the positions of the number and positions of the electronic components 200 provided in the installation member 4.

(Action description) Next, the operation will be explained.

(Initial state: Figure 3) Figure 3 above shows the initial state. In the initial state, the first form plate 2 and the second form plate 3 are isolated. In addition, a substrate 100 and an electronic component 200 are installed between the first template 2 and the second template 3 via the installation member 4. At this time, the electronic component 200 is mounted on the mounting position of the substrate 100 via the mounting member 4 (or, the electronic component 200 is fixed in position on the mounting position of the substrate 100 with an adhesive, and the mounting member 4 is mounted on the first Between the template 2 and the second template 3), an adhesive or the like is applied to the electronic component 200 between the substrates 100.

In addition, if necessary, the sheet 110 may be installed. The sheet 110 is arranged to be sandwiched between the fixing member 21 and the electronic component 200. As described later, the fixing member 21 applies pressure to the electronic component 200 (the positional relationship of the electronic component 200 on the substrate 100 is reversed from the top and bottom of FIG. 3, and the fixing member 21 applies pressure to the substrate 100). At this time, if the sheet 110 is provided, it is easy to isolate the fixing member 21 after the pressure is applied. The sheet 110 may also be arranged between the movable member 31 and the substrate 100 or the electronic component 200.

As explained below, the movement control unit 5 brings the first form plate 2 and the second form plate 3 close to each other. By being close by this, the fixing member 21 can directly or indirectly contact at least one of the electronic component 200 and the substrate 100. Through this contact, the fixing member 21 can apply pressure to at least one of the electronic component 200 and the substrate 100.

The fixing member 21 can be given pressure by pressing the electronic component 200 and the substrate 100

With the application of this pressure, the electronic component 200 is mounted on the substrate 100. At this time, the movable member 31 can release the pressure from the fixed member 21, which becomes redundant during installation. The movable member 31 can move along the pressure application direction, and the excess pressure causes this movement.

After moving by this, it turns out to be a person who relieves excess pressure. If the excess pressure is released, only the pressure necessary for installation remains, and installation can be performed without causing damage, etc.

(Movement of setting member: Figure 4) Fig. 4 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Displayed in a mode. The elements of the movement control unit 5 shown in FIG. 3 and the like are similarly provided, but these are omitted in order to make the figure easy to recognize. The movement through the movement control unit 5 is also performed in FIG. 4.

As shown in FIG. 4, after the initial state, the installation member 4 of the electronic component mounting device 1 descends to approach the second form 3. The setting member 4 is to mount the electronic component 200 and the substrate 100, and the electronic component 200 to be mounted is close to the second stencil 3.

When the installation member 4 is close to the second form 3, the electronic components 200 and the substrate 100 installed in the installation member 4 are close to the movable member 31. When it gets closer, it becomes a state in which it can contact the movable member 31. Figure 4 shows this state.

When this contact is possible, when pressure from the fixed member 21 is applied, the movable member 31 becomes capable of releasing excess pressure.

Here, the electronic component mounting device 1 is provided with a driving part for operating each element, and this driving part may move the installation member 4.

(The movement of the middle mold and the sheet: Figure 5) Fig. 5 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. In the electronic component mounting device 1, the intermediate mold 6 and the sheet 110 are moved close to the installation member 4. The intermediate mold 6 and the sheet 110 may be lowered and may be close to the installation member 4, and the second form plate 3 may be raised, and the installation member 4 may be close to the middle mold 6 and the like.

The middle mold 6 and the sheet 110 are close to the installation member 4, and the middle mold 6 is close to the electronic component 200. The same applies to the sheet 110. The sheet 110 is provided between the fixing member 21 and the electronic component 200 as described above. The same applies to the middle mold 6.

The intermediate mold 6 is a member that holds the outer periphery of the electronic component 200 in the process of applying pressure via the fixing member 21. When applying pressure via the fixing member 21, the electronic component 200 is in contact with the sheet 110. The sheet 110 protects the self-fixing member 21 as the fixing member 21 comes into contact with the electronic component 200.

When the application of pressure is completed and the fixing member 21 is separated from the electronic component 200, the sheet 110 is peeled from the electronic component 200. At this time, the sheet 110 and the electronic component 200 are subjected to pressure from the fixing member 21, and the sheet 110 is attached to the electronic component 200.

In this state, when the sheet 110 is peeled off, the electronic component 200 has a problem of being pulled by the sheet 110. The intermediate mold 6 surrounds and holds the outer periphery of the electronic component 200 when pressure is applied via the fixing member 21. With this maintenance, even when the sheet 110 is peeled off, the problem that the electronic component 200 is peeled off by the sheet 110 can be alleviated.

In the stage of FIG. 5, the intermediate mold 6 and the sheet 110 are in contact with the electronic component 200 and approached. Those who prepare for this state can alleviate various problems that will be dealt with after installation.

(The closeness of the first type plate 2 and the second type plate 3: Figure 6) Fig. 6 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Fig. 6 shows the state where the first form plate 2 and the second form plate 3 are close to each other. Here, as an example, the movement control unit 5 raises the second form 3 to bring the first form 2 and the second form 3 close to each other.

When the first stencil 2 and the second stencil 3 are close to each other, the fixing member 21 is brought into contact with the electronic component 200 through the sheet 110. Through this contact state, the fixing member 21 becomes capable of applying pressure to at least one of the electronic component 200 and the substrate 100.

In addition, as shown in FIG. 6, the fixing member 21 enters the opening of the part corresponding to the electronic component 200 in the intermediate mold 6. Through this entry, it becomes an opening that enters the middle mold 6, and pressure can be applied to the electronic component 200.

In addition, with the contact of the fixing member 21, the sheet 110 is also pushed in. Imitating the outer shape of the fixing member 21, the intermediate mold 6 and the electronic component 200, the sheet 110 is closely adhered to the surface of the electronic component 200. Through this sheet 110, the electronic component 200 can be protected from the fixing member 21.

When the first form plate 2 and the second form plate 3 are brought into close contact with each other by the movement operation via the movement control unit 5, the pressure from the fixing member 21 can be applied. Here, in FIG. 6, the movement control part 5 is connected to the second form 3, and the movement control part 5 raises the second form 3, but the first form 2 may be lowered. In any case, it is sufficient if the first form plate 2 and the second form plate 3 are close to each other.

The movement control unit 5 can control the closeness of the first form plate 2 and the second form plate 3 (applied by the pressure of the fixing member 21) with sufficient intensity or time for mounting the electronic component 200 on the substrate 100. This intensity or time can be programmed in the movement control part 5 in advance, and can be adjusted in any operation. Or, it can be controlled by the results of experience learning.

(Applying pressure via the fixing member 21: Fig. 7) Fig. 7 is a block diagram showing the application of pressure via a fixing member in the electronic component mounting device according to the first embodiment of the present invention. From the state in FIG. 6, the state in which the movement control unit 5 makes the first form plate 2 and the second form plate 3 close to each other is shown in FIG. 7. In addition to being closer, the fixing member 21 is the state in which pressure is applied to the electronic component 200 and the substrate 100 is in the state of FIG. 7.

The movement control part 5 moves at least one of the first form plate 2 and the second form plate 3, and as a fixed member 21, a pressure can be applied. Moreover, it is maintained for a certain period of time. In this state, as shown by arrow A in FIG. 7, the fixing member 21 can apply pressure to the electronic component 200.

At this time, the fixing member 21 is fixed to the first form 2. In addition, the movable member 31 subjected to pressure is relatively movable with respect to the second template 3. As a result, among the pressure of the arrow A given by the fixed member 21, the excess pressure that becomes excessive during installation is released by the movable member 31 as a person who moves away from the electronic component 200.

The arrow B in FIG. 7 shows the excess pressure released by the movable member 31. The difference between the arrow A and the arrow B is an appropriate pressure necessary for mounting the substrate 100 of the electronic component 200, and through this appropriate pressure, the electronic component 200 or the substrate 100 can be reliably mounted without damage or the like.

Here, the second mold plate 3 has a singular or plural insertion hole 32 at a position corresponding to the fixing member. The movable member 31 is inserted into this insertion hole 32. The movable member 31 has a position inside the insertion hole 32 as the upper and lower positions, and the movable member 31 can change the position with respect to the second form 3.

When receiving the excess pressure indicated by the arrow B in FIG. 7 (when receiving the pressure applied from the fixed member 21 to the electronic component 200 and the substrate 100 ), the movable member 31 moves in the insertion hole 32. Through this movement, the excess pressure can be released. Therefore, the excess pressure caused by the position change can be released.

In FIG. 7, a state in which the fixed member 21 applies pressure to the electronic component 200 while releasing excess pressure via the movable member 31 is shown. As a result, no excessive pressure is applied to cause damage to the electronic component 200, and reliable mounting can be achieved.

In addition, the movable member 31 can be adjusted by adjusting the amount of position change inside the insertion hole 32, and can also adjust the excess pressure to be released. According to circumstances, when the excess pressure to be released is zero, the movable member 31 does not cause a change in the position of the second mold plate 3.

(Separation between the first type plate and the second type plate) For example, at the end of installation, the first type plate 2 and the second type plate 3 are isolated. The mobile control unit 5 performs this isolation. When the isolation is performed and the sheet 110 and the like are removed, the component in the state where the electronic component 200 is mounted on the substrate 100 is taken out. Become used in the next project.

The removal of the sheet 110 and the like may be realized by a driving part or another mechanism, and it may be a mechanism assembled in the electronic component mounting device 1 or another mechanism. Since these are not directly related to the present invention, the description is omitted.

As described above, the electronic component mounting apparatus 1 of the first embodiment reduces the risk of damage to the electronic component 200 or the substrate 100 through pressure application, and can realize reliable mounting. In addition, since the optimal pressure can be applied, the thickness of the adhesive layer between the substrate 100 and the electronic component 200 can also be optimized.

However, the positional relationship between the top and bottom of the first template 2 and the second template 3 described in FIG. 3 and later may be reversed. The descending or ascending may be the opposite, and it may not be moving up and down but left and right.

(Embodiment 2)

Next, the second embodiment will be described. In the second embodiment, various changes and the like will be described.

(Through the treatment of the excess pressure of the movable member) Fig. 8 is a block diagram of the electronic component mounting apparatus in the second embodiment of the present invention.

A movable member 31 is provided in the second mold plate 3 system. The second template 3 is provided with an insertion hole 32, and the movable member 31 is inserted into the insertion hole 32 to move. By this movement, it becomes a movable state. When the movable member 31 applies pressure to the electronic component 200 from the fixed member 21, for example, a person who moves downward can release excess pressure.

In the insertion hole 32, the movable member 31 is in a movable state by air pressure or hydraulic pressure. The excess pressure released for this air pressure or oil pressure can be measured. At this time, as shown in FIG. 8, it is preferable that the excess pressure adjusting part 52 is further provided.

The excess pressure adjusting part 52 can adjust the movement amount (movement amount, movement time, movement speed) of the movable member 31. The excess pressure to be released is determined by the amount or mode of movement of the movable member 31. The excess pressure adjustment part 52 sets the excess pressure to be released by the excess pressure adjustment part 52. In response to the set excess pressure, the excess pressure adjusting part 52 controls the movement amount or the movement mode of the movable member 31.

When the movable member 31 is operated according to this control, the movable member 31 can release the necessary excess pressure.

Here, the movable member 31 can achieve a movable state by at least one of hydraulic pressure, elastic pressure and motor driving.

In addition, the fixing member 21 includes a pressure detection unit 7. The pressure detecting part 7 detects the magnitude of the pressure applied to the electronic component 200 by the fixing member 21. The pressure detection unit 7 outputs the magnitude of the detected pressure to the movable member control unit 53.

The movable member control unit 53 can read the data of the movable control instruction table 54 set in advance. The movable control instruction table 54 memorizes the relativity between the pressure applied by the fixed member 21 and the excess pressure to be released by the movable member 31.

The movable member control unit 53 can calculate the excess pressure to be released by the movable member 31 based on the pressure of the fixed member 21 notified from the pressure detecting unit 7. The result of this calculation is output to the excess pressure adjustment unit 52. The excess pressure adjustment part 52 controls the movement of the movable member 31 through excess pressure based on the actual pressure of the fixed member 21 based on the calculation result.

As such, according to the value of the pressure actually applied by the fixed member 21, the excess pressure can be released via the movable member 31. As a result, the installation through the optimal pressure is realized, and the damage of the electronic component 200 can also be prevented.

(Plural installation) Fig. 9 is a block diagram of the electronic component mounting apparatus in the second embodiment of the present invention. FIG. 9 shows the electronic component mounting device 1 in which a plurality of electronic components 200 are mounted at once.

The first form plate 2 is provided with a plurality of fixing members 21. The second mold plate 3 is provided with a plurality of movable members 31 at a position corresponding to this. The setting member 4 and the intermediate mold 6 also correspond to this form. In this way, the electronic component mounting device 1 is capable of mounting a plurality of electronic components 200 at a time.

In addition, in the case of FIG. 9, the fixed member 21 or the movable member 31 performs the operation as described above, and can be installed with an optimal pressure.

Here, there is a possibility that the thickness of the plural electronic components 200 or the coating amount of the adhesive may be uneven. Regardless of the uneven thickness, it is better to install with the same pressure. In addition, there are cases in which the electronic components 200 are installed under different pressures individually.

Therefore, it is preferable that each plurality of movable members 31 can be individually realized in a movable state. As shown in FIG. 9, each of the plurality of movable members 31 is individually controlled in a movable state via the excess pressure adjusting portion 52. Through this individual control, each of the plurality of movable members 31 can be individually realized in a movable state. Even if the amount of movement or inclination to be released is different, each movable member 31 can act in accordance with each. In addition, you can also individually change the excess pressure you want to release.

The excess pressure adjusting portion 52 and the movable member control portion 53 control at least one of the movable amount, movable time, and movable speed of the plurality of movable members 31 based on the pressure values of the plurality of fixed members 21 and the movable control indicator table. Through this control, the excess pressure of each electronic component 200 can be released.

Alternatively, the excess pressure adjustment unit 52 and the movable member control unit 53 may also control the timing of movement, and at least one of the stepwise increase and decrease operations. Therefore, the control of these conditions is also linked to the control corresponding to the optimal excess pressure to be released by each electronic component 200.

As a result, the optimal pressure can be applied to each electronic component 200. Even in the case where the thickness of the electronic component 200 or the coating amount of the adhesive is uneven, the problem of applying the optimal pressure to each electronic component 200 can be prevented.

As described above, in the electronic component mounting device 1 of the second embodiment, it is possible to process the optimal excess pressure in accordance with the actual pressure application situation. In addition, it is also possible to install a plurality of electronic components 200 at the optimal pressure at a time.

(Embodiment 3) Next, the third embodiment will be described. Fig. 10 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention. It is easy to grasp the structure, elements, etc. of the electronic component mounting device, and display them as a visible state. In addition, some elements that overlap with those described in Embodiments 1 and 2 in FIG. 3 etc. are omitted as necessary. However, the actual electronic component mounting device 1 may also be surrounded by an external frame or the like.

The electronic component mounting apparatus of the third embodiment shown in FIG. 10 is provided with the first form 2 and the second form 3 as explained in the first embodiment using FIG. 3 and the like. The first form plate 2 has singular or plural fixing members 21. The second form 3 has a singular or plural movable member 31. The electronic component mounting device 1 includes a movement control unit 5.

The first template 2 with the fixed member 21 and the second template 3 with the movable member 31 are combined in a state of facing each other. That is, the first form plate 2 and the second form plate 3 face each other and become a pair. Although not shown in FIG. 10, as described in the first embodiment, the movement control unit 5 is further provided. The movement control part 5 makes the first form plate 2 and the second form plate 3 close to and isolate each other.

Although the ones shown in FIG. 10 are omitted, there is an installation member 4 at a position between the first form 2 and the second form 3. The installation member 4 is positioned so as to be clamped between the first form plate 2 and the second form plate 3. The installation member 4 is not always positioned between the first form plate 2 and the second form plate 3, but is arranged during the process of mounting the electronic component 200 on the substrate 100.

The setting member 4 has a singular or plural division, and in accordance with this division, the substrate 100 and the electronic component 200 are disposed. That is, in the partition where the member 4 is installed, the substrate 100 and the electronic component 200 to be mounted are arranged. The installation member 4 is installed between the first template 2 and the second template 3. In the subsequent process, the pressure applied through the close proximity of the first template 2 and the second template 3 is applied to install electronic parts. 200 on the substrate 100. During installation, an adhesive or an adhesive paste (including metal paste, etc.) is used.

Here, the electronic component mounting apparatus 1 continuously installs the installation member 4 in which the electronic component 200 and the like are installed between the first form plate 2 and the second form plate 3. The installed installation member 4 is as described above, and the electronic component 200 and the substrate 100 are arranged in a row.

When the installation member 4 is installed, each fixed member 21, each electronic component 200 (and substrate 100) arranged in the division of the installation member 4, and each movable member 31 are in a series of positional relationships. As a series of positional relationships, when the first template 2 and the second template 3 are close to each other, the fixed member 21 applies pressure to the electronic component 200 (and the substrate 100) while the movable member 31 releases excess pressure. By inserting the fixed member 21 and the movable member 31 with appropriate pressure, the electronic component 200 and the substrate 100 are mounted. This is as explained in the first embodiment.

Here, the mounting of the electronic component 200 and the substrate 100 is used for bonding through an adhesive. For example, an adhesive such as a metal paste is applied between the electronic component 200 and the substrate 100, and the adhesive such as a metal paste is applied to the electronic component 200 and the substrate by a pressure based on the insertion of the fixed member 21 and the movable member 31 100.

Through the movement control according to the movement control unit 5, when the first template 2 and the second template 3 are close to each other, the fixing member 21 applies pressure to at least one of the electronic component 200 and the substrate 100 in this way. The movable member 31 releases the excess pressure from the applied pressure. As a result, at least one of the electronic component 200 and the substrate 100 is given the most suitable pressure for mounting (adhesion). The most suitable one is not too strong pressure that affects the electronic component 200 and the substrate 100, and not too weak pressure that is insufficient for mounting (following).

In this way, the electronic component 200 and the substrate 100 are reliably mounted through the insertion of the fixed member 21 and the movable member 31 with the most suitable pressure. When mounting a plurality of electronic components 200 at the same time, even if the thickness of the electronic components 200 is uneven, it is not easy to cause uneven mounting accuracy through the movement of the movable member 31 of each electronic component 200.

Here, the electronic component 200 and the substrate 100 are mounted via an adhesive such as a metal paste. Therefore, in the installation member 4, an adhesive is applied in advance between the electronic component 200 and the substrate 100.

On the other hand, in the mounting by applying pressure (pressurization) between the fixed member 21 and the movable member 31, bonding with this adhesive is performed. In order to perform this bonding efficiently and reliably, pressure is applied to the fixed member 21 and the movable member 31, and heat is also applied. Therefore, it is appropriate to apply both pressure and heat during bonding via an adhesive such as a metal paste.

Therefore, the fixed member 21 and the movable member 31 are equipped with a heating mechanism. For example, the first form plate 2 is provided with a heating mechanism that applies heat to the fixed member 21, and the second form plate 3 is provided with a heating mechanism that applies heat to the movable member 31. With this heating mechanism, the fixed member 21 and the movable member 31 can be heated. In this hot state, the electronic component 200 and the substrate 100 are then pressed by the pressure sandwiched between the fixed member 21 and the movable member 31. By applying pressure and heating, the adhesive such as metal paste is hardened, and the electronic component 200 and the substrate 100 are bonded.

After this, the installation is then realized.

Here, the electronic component mounting device 1 continuously performs mounting of the electronic component 200 and the substrate 100. In order to perform this continuity, the heating mechanism always heats the fixed member 21 and the movable member 31. Therefore, the fixed member 21 and the movable member 31 are always in a hot state. In addition, if the fixed member 21 and the movable member 31 are in a hot state, the first mold plate 2 and the second mold plate 3 are also in a hot state. The whole or the inside of the electronic component mounting apparatus 1 which accommodates the 1st form 2 or the 2nd form 3 is also in the state of heat.

If the temperature becomes too high, there is a possibility of adversely affecting the durability or operability of the electronic component mounting device 1. For example, problems such as the deterioration of hydraulic oil, rubber and plastic components, and the deterioration of electrical relations. Or, there is also a concern that it will become an obstacle to the operator's work.

In the electronic component mounting device 1 of the third embodiment, at least one of the first mold plate 2 and the second mold plate 3 is provided with a heat dissipation member that releases heat to the outside. In FIG. 10, the first form plate 2 is provided with a first heat dissipation member 26, and the second form plate 3 is provided with a second heat dissipation member 36. In FIG. 10, each of the first form plate 2 and the second form plate member 3 is provided with a heat dissipation member, but any one of them may be provided.

The first heat dissipation member 26 is made of a material with high thermal conductivity, and is in thermal contact with the first mold plate 2. Through this thermal contact, the first heat dissipation member 26 can release the heat of the first mold plate 2 generated by heating the fixing member 21 to the outside. Similarly, the second heat dissipation member 36 is made of a material with high thermal conductivity, and is in thermal contact with the second stencil 3. Through this thermal contact, the second heat dissipation member 36 can release the heat of the second mold plate 3 generated by heating the movable member 31 to the outside.

Here, as a material with high thermal conductivity, there are metals or alloys. For example, copper, aluminum, gold, silver, or these alloys may be used. In addition, the first heat dissipating member 26 and the second heat dissipating member 36 may be members having a plate member or a heat sink.

Via such first heat dissipation member 26 and second heat dissipation member 36, the heat of the first form plate 2 or the second form plate 3 can be released to the outside. Since the heat can be released to the outside, the excess heat generated by heating through the heating mechanism can be released to the outside. The electronic component mounting device 1 continuously mounts the electronic component 200 and the substrate 100. Therefore, the heating mechanism operates continuously. That is, the first mold plate 2 and the second mold plate 3 are continuously heated.

The first heat dissipating member 26 continuously releases the heat that the first template 2 continues to have. Similarly, the second heat dissipating member 36 continuously releases the heat that the second template 3 continues to have. By doing so, the first mold plate 2 and the second mold plate 3 can prevent those with excess heat.

(Internal space and opening) It is also preferable that at least one of the first form plate 2 and the second form plate 3 has an internal space and an opening communicating from the internal space to the outside. Fig. 11 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention. FIG. 11 shows the state of the electronic component mounting device in view 1 from the horizontal direction.

In each of FIGS. 10 and 11, the first form plate 2 includes a first internal space 24. The first internal space 24 is a space provided inside the first form plate 2, and it is not easy to directly conduct the heat of the fixing member 21 to the first form plate 2. That is, the heated fixing member 21 will reduce the part directly contacting the member or element of the first form plate 2 and realize the first internal space 24.

Therefore, the heat system of the fixing member 21 is reduced to be transmitted to the first mold plate 2 and conducted to the first internal space 24. As a result, the amount of heat conduction to the first type plate 2 is reduced, and the heat rise of the first type plate 2 can be prevented.

In addition, the first internal space 24 includes a first opening 27. The first opening 27 communicates with the outside. By communicating with the outside, the first opening 27 can release the heat of the first internal space 24 to the outside. That is, the heat from the fixing member 21 is conducted to the first internal space 24 and is discharged to the first opening 27.

In addition, it is also preferable that the first opening 27 releases heat to the outside or is connected to the first pipe 28 connected to the vacuum device 600 described later. The first opening 27 may directly release the heat of the first internal space 24 to the outside, or may be released to the outside through the first pipe 28. In addition, in the case of using the first pipe 28, the heat of the first internal space 24 may be released to the outside through the vacuum device 600 connected to the first pipe 28.

In this way, among the heat generated by heating the fixing member 21 as a base point, the heat received by the first mold plate 2 is discharged from the first heat dissipation member 26 to the outside. On the other hand, the heat conducted to the first internal space 24 is discharged from the first opening 27 to the outside. In particular, the first internal space 24 and the first opening 27 can suppress heat conduction to the first mold plate 2 and can discharge heat to the outside. With these adjustments, the heat starting from the heating of the fixing member 21 is discharged to the outside.

In each of FIG. 10 and FIG. 11, the second mold plate 3 is provided with a second internal space 34. The second internal space 34 is a space provided inside the second form 3, and it is not easy to directly conduct the heat of the movable member 31 to the second form 3. In other words, the heated movable member 31 will reduce the part directly contacting the member or element of the second form 3 to realize the second internal space 34.

Therefore, the heat system of the movable member 31 is reduced to be transmitted to the second mold plate 3 and conducted to the second internal space 34. As a result, the amount of heat conduction to the second stencil 3 is reduced, and the heat rise of the second stencil 3 can be prevented.

In addition, the second internal space 34 includes a second opening 37. The second opening 37 communicates with the outside. By communicating with the outside, the second opening 37 can release the heat of the second internal space 34 to the outside. That is, the heat from the movable member 31 is conducted to the second internal space 34 and is discharged to the second opening 37. The second opening 37 discharges the heat of the second internal space 34 to the outside.

In addition, it is also preferable that the second opening 37 releases heat to the outside or is connected to the second pipe 38 connected to the vacuum device 600 described later. The second opening 37 may directly release the heat of the second internal space 34 to the outside, or may be released to the outside through the second pipe 38. In addition, in the case of using the second pipe 38, the heat of the second internal space 34 may be released to the outside through the vacuum device 600 connected to the second pipe 38.

In this way, among the heat generated by heating the movable member 31 as a base point, the heat received by the second mold plate 3 is discharged from the second heat dissipation member 36 to the outside. On the other hand, the heat conducted to the second internal space 34 is discharged from the second opening 37 or the second pipe 38 to the outside. In particular, the second internal space 34 and the second opening 37 can suppress heat conduction to the second mold plate 3 and can discharge heat to the outside. With these adjustments, the heat starting from the heating of the movable member 31 is discharged to the outside.

Since the internal space and the opening part are provided, the heat which is easy to accumulate in the inside of the 1st formwork 2 and the 2nd formwork 3 becomes easy to be discharged to the outside. In addition, it is possible to suppress an excessive increase in heat of the first mold plate 2 or the second mold plate 3 formed of metal, alloy, or the like.

Here, in the second form 3, the second internal space 34 is provided between the surface of the second form 3 and the movable member 31. Figure 10 and Figure 11 show its morphology. By setting it at this position, the heat of the movable member 31 that directly conducts heat and rises through heating is reduced to the second template 3 itself, and at the same time, it becomes the heat that can dissipate the movable member 31 through the second opening 37 and is discharged to the external. With such a positional relationship, the heat from the heating of the movable member 31 as a starting point is efficiently discharged.

(Vacuum device) As shown in FIG. 11, it is best to provide the vacuum device 600 which releases the heat of at least one of the 1st space 24 and the 2nd space 34 to the outside. In FIG. 11, the vacuum device 600 is shown as a form connected to the 1st pipe 28 and the 2nd pipe 38. As shown in FIG.

The vacuum device 600 has a suction function and can discharge the internal air of at least one of the first internal space 24 and the second space 34 to the outside. The internal air has heat as described above. By forcibly exhausting the internal air having this heat by the suction of the vacuum device 600, the heat of at least one of the first internal space 24 and the second internal space 34 can be effectively exhausted.

Heat is conducted to the first internal space 24 through heating of the fixed member 21 (from the heated fixed member 21, or a self-heating mechanism, or in the process of heating). The vacuum device 600 reduces the heat of the first form plate 2 through the function of exhausting the air in the first internal space 24 to the outside.

In addition, it interacts with the above-mentioned first heat dissipation member 26, and can release the heat of the first form plate 2 to the outside, which can be carried out from many aspects. As a result, it is possible to prevent excessive heat rise in the first mold plate 2.

Similarly, heat is conducted to the second internal space 34 via overheating of the movable member 31 (from the heated movable member 31, or a self-heating mechanism, or in the process of heating). The vacuum device 600 reduces the heat of the second form plate 3 through the function of exhausting the air inside the second internal space 34 to the outside.

In addition, it interacts with the above-mentioned second heat dissipation member 36 to release the heat of the second form plate 3 to the outside, which is carried out from many aspects. As a result, it is possible to prevent excessive heat rise in the second mold plate 3.

(Internal heat sink) As shown in FIG. 11, the first type plate 2 is provided with internal heat sink 29. The second type plate 3 is equipped with internal heat sink 39. The internal heat sink 39 is arranged inside the second plate 3. In addition, if necessary, it is provided as a surface that is also exposed on the surface of the second stencil 3. The internal radiating fins 29 of the first type plate 2 and the internal radiating fins 39 of the second type plate 3 are shown in FIG. 11, and they can be provided separately, or only one of them can be provided.

The internal heat sink 39 is installed in the second internal space 34 of the second form 3. The internal heat sink 39 is formed of a material such as a metal or alloy with high thermal conductivity, and can diffuse the heat of the second internal space 34. In addition, it is possible to efficiently conduct heat from the second mold plate 3 to the second internal space 34, and to discharge the heat from the second opening 37 and the second exhaust fan 38 as an efficient means. The same applies to the internal heat sink 29 provided on the first type plate 2.

(Insulation material) At least one of the first form plate 2 and the second form plate 3 is on at least a part of its outer surface, and it is also best to have an insulating material.

As shown in FIG. 10 and FIG. 11, at least a part of the outer surface of the first form plate 2 is provided with a first heat insulating material 25. The provision of the first heat insulating material 25 can suppress heat conduction from the first mold plate 2 to the housing of the electronic component mounting device 1 and the like. The heat of the first mold plate 2 is released to the outside via the first heat dissipation member 26 or the vacuum device 600. In this release, it is released in a path that does not easily conduct heat to the housing of the electronic component mounting device 1.

On the other hand, the first mold plate 2 is assumed to have heat as a whole. Here, the first template 2 is assembled in the electronic component mounting device 1. When assembled, it can also be in thermal contact with the frame of the electronic component mounting device 1. Through this thermal contact, the heat of the first housing 2 can be conducted to the housing of the electronic component mounting device 1 and the like.

The electronic component mounting device 1 is used for work by an operator or other operations. Therefore, the heat from the first stencil 2 causes the housing and the like of the electronic component mounting device 1 to heat up, which is not ideal.

The first heat insulating material 25 can suppress heat conduction to the housing and the like of the electronic component mounting device 1 as described above. With this suppression, it is possible to prevent excessive heat rise of the electronic component mounting device 1 itself.

Similarly, as shown in FIG. 10 and FIG. 11, at least a part of the outer surface of the second mold plate 3 is provided with a second heat insulating material 35. The provision of the second heat insulating material 35 can suppress heat conduction from the second form 3 to the housing of the electronic component mounting device 1 and the like. The heat of the second mold plate 3 is released to the outside via the second heat dissipation member 36 or the vacuum device 600. In this release, it is released in a path that does not easily conduct heat to the housing of the electronic component mounting device 1.

On the other hand, the second mold plate 3 is assumed to have heat as a whole. Here, the second stencil 3 is assembled in the electronic component mounting device 1. When assembled, it can also be in thermal contact with the frame of the electronic component mounting device 1. Through this thermal contact, the heat of the second housing 3 can be conducted to the housing of the electronic component mounting device 1 and the like.

The electronic component mounting device 1 is used for work by an operator or other operations. Therefore, the heat from the second stencil 3 causes the housing and the like of the electronic component mounting device 1 to heat up, which is not ideal.

The second heat insulating material 35 can suppress heat conduction to the housing and the like of the electronic component mounting device 1 as described above. With this suppression, it is possible to prevent excessive heat rise of the electronic component mounting device 1 itself.

(Vents) As shown in FIG. 10, it is also best that the movable member 31 has a singular or plural number of heat dissipation holes 32. The movable member 31 is provided in the second form 3 and is movable so as to relieve excess pressure.

The movable member 31 is heated by a self-heating mechanism. Therefore, the movable member 31 generates heat. If the movable member 31 is provided with the heat dissipation hole 32, the heat of the movable member 31 can be released to the outside.

(Refrigerant circulation path) Fig. 12 is a schematic diagram of the second form in the third embodiment of the present invention. The upper side of Figure 12 is a cross-sectional view of a certain part of the second form. The lower side of Fig. 12 is a front view of the second type plate.

It is best that the second type plate 3 has a refrigerant circulation path 40 in which the refrigerant circulates. Fig. 12 shows this refrigerant circulation path 40.

The refrigerant circulation path 40 circulates refrigerant with a high heat exchange rate, for example, liquid refrigerant, gel refrigerant, gas refrigerant, and the like. Since the refrigerant circulation path 40 is provided inside the second mold plate 3, the refrigerant circulates inside the second mold plate 3. The circulation of the refrigerant through the refrigerant circulation path 40 here suppresses the temperature rise of the second form plate 3.

By using any one of liquid refrigerant, gel refrigerant, gas refrigerant, etc. as the refrigerant, the second form plate 3 is cooled efficiently. In parallel with the heating of the second mold plate 3 and cooling via the refrigerant circulation path 40, excessive temperature rise is suppressed.

Any one of liquid refrigerant, gel refrigerant, gas refrigerant, etc. can be selected as appropriate.

In addition, as shown on the upper side of FIG. 12, the refrigerant circulation path 40 may be formed in a meandering manner inside the second form plate 3. Through this meandering, the cooling medium circulation path 40 can cool the second plate 3 in a two-dimensional or a three-dimensional system. With this cooling capacity, the temperature rise of the second form plate 3 can be effectively suppressed.

(Thermometer measurement) Fig. 13 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention. The electronic component mounting device 1 shown in FIG. 13 further includes a cooling control unit 46 and a temperature measurement unit 45.

The temperature measurement unit 45 measures the temperature of at least one of the first form plate 2 and the second form plate 3. The temperature measurement unit 45 outputs the measured result to the cooling control unit 46.

The cooling control unit 46 controls the operation of at least one of the first heat dissipation member 26, the second heat dissipation member 36, the vacuum device 600, and the refrigerant circulation path 40. The cooling control unit 46 controls the operation of at least one of the first heat dissipation member 26, the second heat dissipation member 36, the vacuum device 600, and the refrigerant circulation path 40 based on the measurement result of the temperature measurement unit 45.

For example, when the temperature as a result of the temperature measurement is high, at least one of the first heat dissipation member 26, the second heat dissipation member 36, the vacuum device 600, and the refrigerant circulation path 40 is operated, or the operation capability is improved. Conversely, when the temperature as a result of the temperature measurement is low, at least one of the first heat dissipation member 26, the second heat dissipation member 36, the vacuum device 600, and the refrigerant circulation path 40 is stopped, or the operating capability is reduced.

In this way, the cooling capacity can be controlled in accordance with the actual temperature rise state. Through this control, more appropriate cooling can be achieved. By this cooling, the excessive temperature rise of the first form plate 2, the second form plate 3, and the electronic component mounting device 1 can be suppressed according to the heating necessary for installation.

It is still possible to control excessive temperature rise, to prevent adverse effects on adhesives or electronic components, or to improve the durability of the electronic component mounting device 1.

However, the electronic component mounting device described in Embodiments 1 to 3 is an example for explaining the content of the present invention, and includes modifications or alterations that do not deviate from the scope of the content of the present invention.

1: Electronic parts mounting device 2: Type 1 board 21: Fixed components 24: 1st interior space 25: The first thermal insulation material 26: The first heat dissipation member 27: The first opening 28: The first pipeline 29: Internal heat sink 3: Type 2 board 31: movable member 32: cooling holes 34: The second interior space 35: The second thermal insulation material 36: The second heat dissipation member 37: The second opening 38: Second line 39: Internal heat sink 4: Set up widgets 40: Refrigerant circulation path 45: Thermometer measurement department 46: Cooling Control Department 5: Mobility Control Department 6: Intermediate mold 7: Pressure detection department 52: Excess pressure adjustment section 53: Movable component control unit 54: Movable control indicator 100: substrate 110: flakes 200: electronic parts 600: Vacuum device

Figure 1 is a front view of a substrate on which electronic components are mounted. Fig. 2 is a side view of a substrate on which electronic components are mounted. Fig. 3 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Fig. 4 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Fig. 5 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Fig. 6 is a block diagram of the electronic component mounting apparatus in the first embodiment of the present invention. Fig. 7 is a block diagram showing the application of pressure via a fixing member in the electronic component mounting device according to the first embodiment of the present invention. Fig. 8 is a block diagram of the electronic component mounting apparatus in the second embodiment of the present invention. Fig. 9 is a block diagram of the electronic component mounting apparatus in the second embodiment of the present invention. Fig. 10 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention. Fig. 11 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention. Fig. 12 is a schematic diagram of the second form in the third embodiment of the present invention. Fig. 13 is a schematic diagram of an electronic component mounting apparatus in the third embodiment of the present invention.

2: Type 1 board

3: Type 2 board

21: Fixed components

24: 1st interior space

25: The first thermal insulation material

26: The first heat dissipation member

31: movable member

32: cooling holes

34: The second interior space

35: The second thermal insulation material

36: The second heat dissipation member

Claims (10)

An electronic component mounting device, characterized by comprising: a first type plate having singular or plural fixed members, and a second type plate having singular or plural movable members, and the combination of the first type plate and the second type plate Between the boards, there are installed components for electronic parts and substrates, and a movement control unit that controls the closeness and separation of the first and second templates. The fixing member fixes the first and second templates. The position of the movable member can be changed with respect to the second template. The position of each of the fixed member and the movable member corresponds to the position of the electronic component installed via the setting member, and the position of the movable member can be changed according to the aforementioned movement. In the proximity of the control unit, the fixed member applies pressure to at least one of the electronic component and the substrate, and the movable member can release the excess pressure from the pressure imparted by the fixed member through the movement, the above-mentioned first At least one of the template and the aforementioned second template is provided with a heat dissipation member that releases heat to the outside. For example, the electronic component mounting device described in item 1 of the scope of patent application, wherein at least one of the aforementioned first type plate and the aforementioned second type plate is provided with: The space and the opening connected to the outside from the aforementioned internal space. The electronic component mounting device described in item 2 of the scope of patent application, including: a vacuum device that releases heat from at least one of the internal space of the first template and the internal space of the second template to the outside . According to the electronic component mounting device described in item 2 or item 3 of the scope of patent application, in the second stencil, the internal space is provided between the surface of the second stencil and the movable member. For example, the electronic component mounting device described in any one of items 1 to 3 in the scope of the patent application, wherein at least one of the first and second forms is provided on at least a part of its outer surface, and is provided with a heat insulating material . For example, the electronic component mounting device described in any one of items 1 to 3 of the scope of the patent application, wherein the second type plate is further provided with a refrigerant circulation path in which the refrigerant circulates. For example, the electronic component mounting device described in item 6 of the scope of patent application, wherein the aforementioned refrigerant is any one of liquid refrigerant, gel refrigerant, gas refrigerant and the like. Such as the electronic parts listed in any one of items 1 to 3 of the scope of patent application The mounting device, wherein the movable member is provided with: singular or plural heat dissipation holes. The electronic component mounting device described in claim 6 further includes: a cooling control unit that controls at least one operation of the heat dissipation member, the vacuum device, and the refrigerant circulation path, and measures the first type plate and the aforementioned The temperature measuring part of at least one temperature of the second mold plate is based on the measurement result of the temperature measuring part, and the cooling control part controls the operation of at least one of the heat dissipation member, the vacuum device, and the refrigerant circulation path. For example, the electronic component mounting device described in item 2 or item 3 of the scope of patent application, wherein at least one of the first type plate and the second type plate is in the internal space, and further includes an internal heat sink.

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