CN1701651A

CN1701651A - Electronic part mounting apparatus and method therefor

Info

Publication number: CN1701651A
Application number: CN 200480000890
Authority: CN
Inventors: 土师宏
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2003-02-10
Filing date: 2004-02-09
Publication date: 2005-11-23
Anticipated expiration: 2024-02-09
Also published as: CN100366137C; CN101083901A; JP4147963B2; JP2004265921A

Abstract

In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially carried out as to all of the electronic components, in which the electronic components are sucked/held by the plural nozzles; an electronic component sucked/held by one of the plural nozzles is provisionally positioned above one electronic component mounting portion; both this electronic component and the electronic component mounting portion are observed by an observation head which is located between the board and the mounting head; a relative position detecting operation for detecting a relative positional relationship between this electronic component and the electronic component mounting portion is carried out as to all of the electronic components held by the mounting head; and the electronic component is positioned with respect to the electronic component mounting portion so as to be mounted thereon while the detected relative positional relationship is reflected.

Description

Electronic component mounting apparatus and electronic component mounting method

Technical field

The present invention relates to a kind of electronic component mounting apparatus and a kind of electronic component mounting method, be used for an electronic component is installed in a circuit board.

Background technology

In electronic component mounting apparatus, repeatedly carry out fitting operation, wherein, the electronic component of obtaining from the electronic component feed unit is mounted the head maintenance, and is installed on the circuit board then.In these fitting operations, because electronic component is required with hi-Fix more on circuit board, so this localization method is used widely.In this localization method, if be mounted electronic component that head keeps and the position of the mounting points on circuit board optically is detected, so, electronic component and circuit plate position-based result of detection relative to each other position.

In this optical position exploration operation, processed by two images taking pictures for electronic component and circuit plate to obtain by the mode of image recognition processing operation by means of camera, so that carry out this optical position exploration operation.In this image recognition processing operation, because the installation site of electronic component and circuit board is discerned based on different images, so that electronic component positions with high accuracy more with respect to the mounting points of circuit board, so, it is essential, correctly obtain about the relative position relation between these two images of optical coordinate system.

For this purpose, used this have on/camera (for example, seeing Japanese Laid-Open Patent Application NO.2001-77592) of downward view direction.In this camera, a board recognition camera and an electronic component identification camera constitute with integral form, and wherein, the visual field direction of taking pictures of described board recognition camera is directed down, on the visual field direction of taking pictures of described electronic component identification camera is directed.When this camera, in general, when under the installation head that keeps electronic component is positioned in this state on the circuit board, being used, this camera advances to a space that is formed between installation head and the circuit board, obtains simultaneously then about the image of the mounting points of circuit board with about being mounted the image of the electronic component that head keeps.As a result, along the visual field and kept continuously of taking pictures of the direction that makes progress, therefore, can realize the high precision position exploration operation along the relative position relation of taking pictures between the visual field of downward direction.

But in above-mentioned prior art, because have a restriction, promptly camera must be positioned between circuit board and the installation head, so limited the shortening of the pitch time (tact time) of fitting operation.In other words, because carry out above-mentioned position sensing operation with respect to each electronic component that is mounted the head installation, so in a fitting operation of an electronic component, when an electronic component being carried out above-mentioned fitting operation at every turn, just need to carry out one and be applicable to and camera advanced to just in time below installation head, and another is applicable to that after obtaining image the space above the circuit board withdraws camera so that avoid producing the operation of disturbing between the step-down operation of camera and installation head so that obtain the operation of image.

And when the installation head that keeps electronic component was carried out fitting operation on circuit board, the rising of installation head highly must be set to a low value that is allowed to as far as possible, so that its operating time can be shortened ideally.But, the same as previously explained, because must guarantee that camera can be by its this gap of advancing, so the slippage of the installation head that needs can not be reduced in fitting operation.The same as previously explained, in traditional electronic component mounting apparatus, better the installation site precision almost can not get both mutually with the electronic component installment work with highly-efficient implementation.

Summary of the invention

In this case, target of the present invention is that a kind of electronic component mounting apparatus and a kind of electronic component mounting method will be provided, and can realize following purpose, that is, better the installation site precision is taken into account mutually with electronic component installment work with highly-efficient implementation.

A kind of electronic component mounting apparatus according to the present invention is characterised in that, comprising: a holding unit that is used for the holding circuit plate; An installation head, it is equipped with and a plurality ofly is applicable to the installation nozzle that holds/keep electronic component, and has an installation nozzle rising mechanism that is applicable to the described a plurality of installation nozzles of independent rising; Electronic component supply device is applicable to electronic component is supplied to installation head; An installation head transport sector is used for transporting installation head between holding unit and electronic component supply device; A viewing head, be applicable to by install electronic component that nozzle holds/keeps be positioned at provisionally a plurality of electronic component mounting parts branches of being formed on the circuit board above state under, from the space of dividing and limiting between the positioning electronic components between electronic component mounting part temporarily, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides; A viewing head transport sector, be used for by mobile installation head by sequentially and the electronic component of locating provisionally synchronously transport viewing head, and be used for when electronic component is installed on the circuit board, viewing head being withdrawn from the holding unit upper space; And control device, be applicable to based on the image of the electronic component that has obtained by viewing head and the image that electronic component mounting part divides, control the installation head transport sector, so that will sequentially be located by each electronic component of nozzle is installed is held/keeping with respect to the electronic component mounting part branch corresponding with it.

A kind of electronic component mounting apparatus according to the present invention is characterised in that, comprise: an interim positioning action processing section, be used for sequentially to be navigated to the upper space that electronic component mounting part divides by the electronic component that a plurality of installation nozzles hold/keep by control installation head transport sector; Finder, be equipped with a viewing head, organize interim positioning electronic components and electronic component mounting part branch for each, described viewing head is used for the space from limiting to the electronic component of every group of interim location and electronic component mounting part branch between interim positioning electronic components and electronic component mounting part branch, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides; An interim positioning position information storage compartment, when carrying out interim positioning action to every group, the position of installation head is stored in this storage compartment as interim positioning position information; A relative position relation computing part, be used for based on the image of the electronic component that has obtained by viewing head and above the image that the electronic component mounting part of electronic component divides is installed, calculate every group of electronic component that is mounted nozzle and holds/keeps and the relative position relation between the electronic component mounting part branch; A relative position relation storage compartment is used for storing therein the every group of relative position relation that is partly calculated by the relative position relation computing; An alignment information calculating section, be used for the interim positioning position information and the relative position relation that are stored into interim positioning position information storage compartment and relative position relation storage compartment respectively based on every group, calculate alignment information, described alignment information is used to locate to installation head; With a fitting operation processing section, be used for based on alignment information, control installation head transport sector, so that with respect to corresponding electronic component mounting part branch, to sequentially locate by each electronic component of nozzle is installed is held/keeping, and positioning electronic components is installed in corresponding electronic component mounting part divides.

A kind of electronic component mounting apparatus according to the present invention is characterised in that, comprise: an interim positioning action processing section, be used for sequentially to navigate to the upper space that electronic component mounting part divides by the electronic component that a plurality of installation nozzles hold/keep by control installation head transport sector; Finder, be equipped with a viewing head, be used for every group of interim positioning electronic components and electronic component mounting part branch,, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides from the space that between interim positioning electronic components and electronic component mounting part branch, limits; A relative position relation computing part, be used for the image that electronic component mounting part based on the image of the electronic component that obtains by viewing head and top installation electronic component divides, calculate every group of electronic component that is mounted nozzle and holds/keeps and the relative position relation between the electronic component mounting part branch; An alignment information calculating section, the position and the relative position information of installation head calculate alignment information when being used for based on the interim positioning action of execution, and described alignment information is used to the location and installation head; An alignment information storage compartment is used for storing therein every group of alignment information that is calculated by the alignment information calculating section; With a fitting operation processing section, be used for based on alignment information, control installation head transport sector, so that with respect to corresponding electronic component mounting part branch, sequentially locate for the electronic component that holds/keep by each installation nozzle, and positioning electronic components is installed on the corresponding electronic component mounting part branch.

A kind of electronic component mounting method according to the present invention is characterised in that a kind of like this electronic component mounting method, wherein, electronic component is set at that each holds/keeps in a plurality of installation nozzles in the installation head, divide so that be installed in the electronic component mounting part of circuit board, and this method comprises: element keeps step, is used for holding/keep electronic component by a plurality of installation nozzles of installation head; Interim positioning step, the electronic component that is suitable for being held/to be kept by one of a plurality of installation nozzles are positioned at electronic component mounting part provisionally and divide; Observe step, wherein, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides by viewing head, described viewing head is located in the space that limits between interim positioning electronic components and the electronic component mounting part branch; The relative position relation detection steps is used for the image that divides based on the electronic component that obtains and electronic component mounting part in observing step, survey interim positioning electronic components and the electronic component mounting part relative position relation between dividing; To all electronic components that nozzle holds/keeps being installed by other, sequentially carry out interim positioning step, observe the step of step and relative position relation detection steps; Viewing head is withdrawn step, is suitable for withdrawing viewing head from the upper space of circuit board; And, a step, in this step, with respect to all electronic components, carry out this fitting operation, promptly the electronic component that is held/keep by a plurality of installation nozzles is oriented to, and can reflex to wherein by the relative position relation that the transmission installation head will detect in the relative position relation detection steps simultaneously, divides and be installed in electronic component mounting part.

A kind of electronic component mounting method according to the present invention is characterised in that, comprising: an element keeps step, and a plurality of installation nozzles that are adapted to pass through installation head hold/keep electronic component; An interim positioning step, the electronic component that is used for being held/to be kept by one of a plurality of installation nozzles are positioned at an electronic component mounting part provisionally and divide; Observe step for one, wherein, the image that the image of one group of interim positioning electronic components and electronic component mounting part divide obtains by viewing head, and described viewing head is located in the space that limits between interim positioning electronic components and the electronic component mounting part branch; A relative position relation detection steps is used for the image that divides based on the electronic component that obtains and electronic component mounting part in observing step, survey interim positioning electronic components and the electronic component mounting part relative position relation between dividing; A storing step is suitable for storing therein relative position relation and corresponding to the interim positioning position information of the positional information of interim location and installation head; A step, wherein, because organize all electronic components that held/keep by other installation nozzle and the electronic component mounting part branch that electronic component is installed on it for each, all sequentially carry out interim positioning step, observe step, relative position relation detection steps and storing step, so, for each group, interim positioning position information and relative position relation have all been stored; A viewing head is withdrawn step, is used for withdrawing viewing head from the upper space of circuit board; And, a step is in this step, based on the interim positioning position information that stores and the relative position information of storage, each is organized calculate alignment information, then, each group is all carried out this fitting operation, wherein, based on alignment information, electronic component is oriented to, and can install with respect to the electronic component mounting part branch by the transmission installation head.

A kind of electronic component mounting method according to the present invention is characterised in that, comprising: an element keeps step, is used for holding/keep electronic component by a plurality of installation nozzles of installation head; An interim positioning step, the electronic component that is used for being held/to be kept by one of a plurality of installation nozzles are positioned at an electronic component mounting part provisionally and divide; Observe step for one, wherein, the image that the image of one group of interim positioning electronic components and electronic component mounting part divide obtains by viewing head, and described viewing head is located in the space that limits between interim positioning electronic components and the electronic component mounting part branch; A relative position relation detection steps is used for the image that divides based on the electronic component that obtains and electronic component mounting part in observing step, survey interim positioning electronic components and the electronic component mounting part relative position relation between dividing; An alignment information calculation procedure is used for calculating alignment information based on relative position relation with corresponding to the interim positioning position information of the positional information of interim location and installation head; A storing step is used for storing therein the alignment information that calculates; A step, wherein, because organize all electronic components that held/keep by other installation nozzle and the electronic component mounting part branch that electronic component is installed on it for each, all sequentially carry out interim positioning step, observe step, the relative position relation detection steps, alignment information calculation procedure, and storing step, so, for each group, all store alignment information; A viewing head is withdrawn step, is used for withdrawing viewing head from the upper space of circuit board; And a step in this step, is all carried out this fitting operation to each group, and wherein, electronic component is oriented to, and can by the transmission installation head, install with respect to the electronic component mounting part branch based on the alignment information that stores.

According to the present invention, in this electronic component fitting operation, corresponding a plurality of nozzles that electronic component is set on the installation head hold/keep, and the electronic component mounting part that is installed in circuit board 9 divides, this relative position exploration operation carries out with respect to all electronic components that held by nozzle/keep, simultaneously, in this relative position exploration operation, interim positioning electronic components and electronic component mounting part branch are observed by viewing head, in the space that described viewing head limits between this electronic component and electronic component mounting part branch.Then, sequentially carry out fitting operation with respect to all electronic components, described fitting operation is used for the relative position relation that calculates by reaction, divides the location with electronic component with respect to electronic component mounting part, so that this positioning electronic components is mounted thereto.As a result, better the installation site precision can get both with the installment work of high efficiency element.

Description of drawings

Fig. 1 is the plane graph according to the electronic component mounting apparatus of one embodiment of the invention 1;

Fig. 2 is the sectional view according to the electronic component mounting apparatus of the embodiment of the invention 1;

Fig. 3 is the section plan according to the electronic component mounting apparatus of the embodiment of the invention 1;

Fig. 4 is the functional interpretation figure that is used to explain according to the viewing head of the electronic component mounting apparatus of the embodiment of the invention 1;

Fig. 5 (a) and 5 (b) are the key-drawings that is used to explain a kind of observational technique, and this method is adapted to pass through according to the viewing head of the electronic component mounting apparatus of the embodiment of the invention 1 and observes electronic component and circuit board;

Fig. 6 is the key-drawing that is used to explain a kind of observational technique, and this method is adapted to pass through according to the viewing head of the electronic component mounting apparatus of the embodiment of the invention 1 and observes electronic component and circuit board;

Fig. 7 is the perspective view according to the reversing objective table (stage) of the electronic component mounting apparatus of the embodiment of the invention 1;

Fig. 8 (a) and 8 (b) are the operation key-drawings according to the reversing objective table of the electronic component mounting apparatus of the embodiment of the invention 1;

Fig. 9 is the calcspar that is used to illustrate according to the structure of the control system of the electronic component mounting apparatus of the embodiment of the invention 1;

Figure 10 is the functional block diagram that is used to be presented at according to the processing capacity under the situation of the mode standard of the electronic component mounting apparatus of the embodiment of the invention 1;

Figure 11 is the flow chart of the electronic component mounting method (mode standard) that is used to explain the embodiment of the invention 1;

Figure 12 (a) and 12 (b) are the step key-drawings of the electronic component mounting method (mode standard) that is used to explain the embodiment of the invention 1;

Figure 13 (a) and 13 (b) are the step key-drawings of the electronic component mounting method (mode standard) that is used to explain the embodiment of the invention 1;

Figure 14 (a) and 14 (b) are the step key-drawings of the electronic component mounting method (mode standard) that is used to explain the embodiment of the invention 1;

Figure 15 (a) and 15 (b) are the step key-drawings of the electronic component mounting method (mode standard) that is used to explain the embodiment of the invention 1;

Figure 16 is the functional block diagram that is used to be presented at the processing capacity under the situation of operating with high precision mode according to the electronic component mounting apparatus of the embodiment of the invention 1;

Figure 17 is the flow chart of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 18 (a) and 18 (b) are the step key-drawings of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 19 (a) and 19 (b) are the step key-drawings of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 20 (a) and 20 (b) are the step key-drawings of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 21 (a) and 21 (b) are the step key-drawings of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 22 (a) and 22 (b) are the step key-drawings of the electronic component mounting method (high precision mode) that is used to explain the embodiment of the invention 1;

Figure 23 is used to be presented at according to the electronic component mounting apparatus of the embodiment of the invention 1 functional block diagram of the processing capacity under the pattern situation of operating at full speed;

Figure 24 is the flow chart of the electronic component mounting method that is used to explain the embodiment of the invention 1 (high-speed pattern);

Figure 25 is the functional block diagram that is used to be presented at the processing capacity under the situation of operating with mode standard according to the electronic component mounting apparatus of the embodiment of the invention 2.

Embodiment

(embodiment 1)

In patent specification of the present invention, can think so that promptly, the carrier body (carrier anchor clamps) that is fixed with the polylith circuit board also is " circuit board ".In this case, can so suppose, that is, be formed on electronic component installation unit on the circuit board that is fixed to carrier body corresponding to " being formed on the electronic component mounting part branch on the circuit board ".

At first with reference to figure 1, Fig. 2 and Fig. 3 explain the overall structure of electronic component mounting apparatus now.Fig. 2 is the cutaway view that is used to show the electronic component mounting apparatus that the arrow " A-A " along Fig. 1 obtains.Fig. 3 is another cutaway view that is used to show the electronic component mounting apparatus that the arrow " B-B " along Fig. 2 obtains.In Fig. 1, electronic component feed unit 2 is arranged in the substrate 1.Shown in Fig. 2 and 3, electronic component feed unit 2 is equipped with an anchor clamps keeper 3, and this anchor clamps keeper 3 has been equipped with a bonding seat 5 separably with 4 maintenances of anchor clamps thereon on the described anchor clamps.

The state that separates separately with these semiconductor chips corresponding to the semiconductor chip 6 of an electronic component (below abbreviate " chip 6 " as) is bonded on the bonding seat 5.A plurality of grand piece 6a (seeing Fig. 8 (a)) corresponding to projection electrode is formed on the last plane of chip 6.Under the state that anchor clamps 4 are kept by anchor clamps keeper 3, electronic component feed unit 2 with its form the plane of grand piece directed upward to state supply with a plurality of chips 6.

As shown in Figure 2, injector 8 is arranged at below the bonding seat 5 that is kept by anchor clamps keeper 3 by this way, that is, injector 8 can move along horizontal direction by injector XY platform 7.Injector 8 is equipped with a pin rising mechanism, can the raise injector pin (not shown) of a setting of this pin rising mechanism.When chip 6 by an installation head (below will discuss) when bonding seat 5 picks up, chip 6 by injector pin from the lower one of bonding seat 5 to rise, so that chip 6 comes off from bonding seat 5.Injector 8 constitutes one and is applicable to chip 6 from bonding 5 bonding the mechanism that comes off that comes off.

As shown in Figure 3, holding unit 10 is arranged at one on Y direction (being first direction) and the position that separates at the electronic component feed unit 2 on the plane on the base 1.Circuit

board input transporter

11 and 12 is arranged on the upstream side of holding unit 10 along directions X (being second direction) with serial arrangement, and circuit

board output transporter

13 and 14 is arranged on the downstream of holding unit 10 along directions X with serial arrangement.Circuit

board input transporter

11 and 12 receives the circuit board of supplying with from upstream side 9, then the circuit board 9 that receives is delivered to holding unit 10.Holding unit 10 will be transmitted the circuit board that comes and be kept thereon, and this circuit board 9 is positioned at a package position.The circuit board 9 that is mounted outwards is transported to the downstream.

In this case, holding unit 10 can pass through holding unit rising mechanism 16 (see figure 2)s, just freely is raised on predetermined rising stroke.Equal to be installed in element setting height(from bottom) under the state on the circuit board 9 by installation head 33 (below will explain) at the height of the circuit board 9 of (seeing Fig. 2 and Figure 13) under the state that holding unit 10 has risen at chip 6.The height of the circuit board 9 of (seeing Figure 12 and Figure 13) equals to divide 9a to pass through height of observation under the observed state of viewing head 34 (below will discuss) at chip 6 and electronic component mounting part under the state that holding unit 10 descends.

In Fig. 1, on two marginal portions on plane in the substrate 1, the first Y-axis line substrate 20A and the second Y-axis line substrate 20B are arranged by this way, the i.e. directed Y direction of longitudinal direction of the first Y-axis line substrate 20A and the second Y-axis line substrate 20B, this Y direction is crossing with circuit board transporting direction (directions X).Y traversing guide 21 is on plane on the first Y-axis line substrate 20A and the second Y-axis line substrate 20B, and (Y direction) in a longitudinal direction is arranged on its whole basically length.A pair of Y traversing guide 21 is arranged with this pattern, that is, paired Y traversing guide 21 is parallel to location each other, and the centre accompanies electronic component feed unit 2 and holding unit 10.

Three crossbeams are placed on these paired Y traversing guides 21 by this way slidably along the Y direction, that is each crossbeam (that is first beam part 31, in these three crossbeams,, the center beam part 30 and second beam part 32) the two edges part supported by Y traversing guide 21.

When nut part 23b is arranged on the right side edge part of center crossbeam 30 highlightedly, rotate by a Y-axis line motor 22 with the feed screw 23a of this nut part 23b engagement, described motor is arranged on the first Y-axis line substrate 20A along horizontal direction.Because Y-axis line motor 22 is driven, so center beam part 30 flatly moves on the Y direction along Y traversing guide 21.

In addition, nut part 25b and another nut part 27b are arranged on respectively on the left side edge part of first beam part 31 and second beam part 32 highlightedly.Feed screw 25a and another feed screw 27a with

nut part

25b and 27b engagement rotate by a Y-axis line motor 24 and another Y-axis line motor 26, and these motors are arranged on the second Y-axis line substrate 20B along horizontal direction.Because Y-

axis line motor

24 and 26 is driven, so first beam part 31 and second beam part 32 flatly move on the Y direction along Y traversing guide 21.

When installation head 33 is installed on the center beam part 30, rotate by an X-axis line motor 40 with the feed screw 41a that is attached to the nut part 41b engagement on the installation head 33.By the guiding of directions X guide rail 42 (see figure 2)s, directions X guide rail 42 is set on the side plane of center beam part 30 along directions X installation head 33 along directions X.

Installation head 33 is equipped with a plurality of (being four in this case) nozzles (installation nozzle) 33a, these nozzles hold separately and keep a chip 6.Installation head 33 can move in this state, that is and, each chip 6 held by respective nozzles 33a/and when keeping, this installation head 33 keeps a plurality of chips 6.In addition, installation head 33 has one nozzle rising mechanism is installed, these nozzles 33a that raises individually of this rising mechanism, and can pick up these chips 6 individually by each nozzle 33a, thus chip 6 is installed.

Because Y-axis line motor 22 and X-axis line motor 40 are driven, so installation head 33 can flatly move along directions X and Y direction.The chip 6 of electronic component feed unit 2 is held/keeps by a plurality of nozzle 33a, and installation head 33 is installed in these chips 6 on a plurality of electronic components supply part 9a (see figure 5)s, described supply unit branch is formed on the circuit board 9, and described circuit board is held unit 10 and keeps.

A pair of Y traversing guide 21, center beam part 30, a Y direction driving mechanism (is a Y-axis line motor 22, feed screw 23a and nut part 23b), with a directions X driving mechanism (be X-axis line motor 40, feed screw 41a and nut part 41b) constitute installation head transport sector 59 (see figure 10)s, this transport sector transports installation head 33 between electronic component feed unit 2 and holding unit 10.Y direction driving mechanism is along Y traversing guide 21 Shipping Center's beam parts 30.The directions X driving mechanism transports installation head 33 along directions X guide rail 42.

The viewing head 43 that is equipped with lens barrel part 34a is installed on first beam part 31, and described lens barrel part 34a is long in the horizontal direction, and nut part 44b is incorporated into carriage 34b, and carriage 34b keeps viewing head 34.Rotate by X-axis line motor 43 with the feed screw 44a of nut part 44b engagement, and because X-axis line motor 43 is driven, so viewing head 34 is directed by directions X guide rail 45 (see figure 2)s, described guide rail 45 is set on the side plane of first beam part 31, so that transport along directions X.

As shown in Figure 3, locate temporarily camera 15 and the reversing objective table 17 all be arranged between electronic component feed unit 2 and the holding unit 10.Camera 15 is equipped with under the situation of a linear camera in interim location, because chip 6 is being transported above the camera 15 of interim location by the installation head 33 that nozzle 33a remains on wherein, so locate the image that camera 15 can obtain the chip 6 that kept by nozzle 33a temporarily.Then, the image that this obtained is discerned processing by the interim recognition unit 57 of electronic component (Figure 10 will explain below), so that identify the position of chip 6.As following to explain, this location identification divides interim identification on the 9a corresponding to a kind of electronic component mounting part that is used for chip 6 being navigated to circuit board 9 temporarily.

Now, will explain the function of viewing head 34 with reference to figure 4.As shown in Figure 4, viewing head 34 constitutes by this way, promptly observes the electronic component imaging camera 36A of chip 6 and the electronic component mounting part of observation circuit board 9 and divides the circuit board imaging camera 36B of 9a to combine with lens barrel part 34a by means of lens 37A and another lens 37B.

On plane and lower plane on the lens barrel part 34a, all be provided with a luminescence unit 39A and another luminescence unit 39B.These luminescence units 39A and 39B are luminous with respect to chip 6 and circuit board 9 corresponding to object observing.

A speculum 38A is arranged to go up in place with another speculum 38B, so that incident light is transmitted on the position of lens 37A in lens barrel part 34a and 37B, and, in this lens barrel part 34a, be built with a prism 38C.This prism 38C is to reflecting to the incident light that enters arbitrary speculum 38A and 38B from upper and lower.

Because lens barrel part 34a advances in an interval that limits between two object observings of last/following direction location, and then, prism 38C is positioned to object observing, so a light path " A " and another " B " are formed simultaneously.Light path " A " is by means of prism 38C, and speculum 38A and lens 37A are limited to camera 36A from last object observing, and light path " B " is by means of prism 38C, and speculum 38B and lens 37B are limited to camera 36B from object observing down.

In other words, observing camera 34 is arranged by this way, each light path " A " and the light path " B " that are electronic component imaging camera 36A and circuit board imaging camera 36B are flatly provided, simultaneously, include prism 38C, this prism causes the directed direction that makes progress of light path " A " of electronic component imaging camera 36A, and the light path " B " that also causes circuit board imaging camera 36B in addition is directed downward direction in same position.In this case, the light path " B " of light path of the directed direction that makes progress " A " and directed downward direction is positioned on the identical vertical curve by regulating optical system.

The result, as shown in Figure 4, lens barrel part 34a advances to the circuit board 9 that is kept by holding unit 10 and is positioned in by the mode that holds/keep chip 6 in the such space that limits between the nozzle 33a of these circuit board 9 tops, in addition, the electronic component mounting part that prism 38C is positioned to chip 6 and circuit board 9 divides 9a, so that the electronic component mounting part of the image of chip 6 and circuit board 9 divides the image of 9a to be obtained by electronic component imaging camera 36A and circuit board imaging camera 36B respectively simultaneously, therefore, can obtain chip 6 and electronic component mounting part and divide relative position relation between the 9a.

In other words, be positioned in electronic component mounting part and divide under this state above the 9a being mounted 33 chip that hold/keep 6, viewing head 34 divides image that 9a obtains chip 6 and the image that electronic component mounting part divides 9a from the chip 6 of interim location and electronic component mounting part.

Because Y-axis line motor 24 and X-axis line motor 43 are driven, viewing head 34 is flatly transported along directions X and Y direction.As a result, viewing head 34 can move above holding unit 10, so that take pictures for the circuit board 9 that is kept by holding unit 10, viewing head also can move in addition, so that withdraw from the upper space of holding unit 10.

A pair of Y traversing guide 21, first beam part 31, Y direction driving mechanism (that is, Y-axis line motor 24, a feed screw 25a, with nut part 25b), with a directions X driving mechanism (that is, X-axis line motor 43, feed screw 44a, with nut part 44b) constitute viewing head transport sector 58 (see figure 10)s, this transport sector transports viewing head 34.Y direction driving mechanism transports first beam part 31 along Y traversing guide 21.The directions X driving mechanism transports viewing head 34 along directions X guide rail 45.

In the electronic component fitting operation, as detailed below, viewing head transport sector 58 synchronously transports viewing head 34 with chip 6, chip 6 sequentially and is provisionally located by transporting installation head 33, in addition, when chip 6 is installed on the circuit board 9, viewing head 34 is withdrawn from holding unit 10 upper spaces.The space of horizontal (the Y direction) of holding unit 10 constitutes an evacuation situation, and viewing head 34 is here withdrawn from the upper space of holding unit 10.

The same as previously explained, holding unit 10 can be held unit rising mechanism 16 and raise.Holding unit rising mechanism 16 can respond the operation that will carry out and change interval between holding unit 10 and the installation head.In other words, advance in the space that limits between installation head 33 and the circuit board 9 so that carry out under the situation of observing operation at viewing head 34, holding unit rising mechanism 16 prolongs the interval that limits between holding unit 10 and installation head 33, and after finishing the observation operation, this holding unit rising mechanism 16 narrows down this at interval.The result, the effect of modifier at interval can be played by holding unit rising mechanism 16, described interval modifier is used at viewing head 34 changing the interval that limits after withdraw in the space that limits between self viewing head 34 and the installation head 33 between installation head 33 and holding unit 10.

Wafer imaging camera 35 is installed on second beam part 32, and a nut part 47b is incorporated into carriage 35a, and this carriage keeps wafer imaging camera 35.Feed screw 47a with nut part 47b engagement rotates by an X-axis line motor 46.Because this X-axis line motor 46 is driven, thus wafer imaging camera 35 be directed by directions X guide rail 48 (see figure 2)s on the side plane that is set at second beam part 32 so that be transported along directions X.

Because Y-axis line motor 26 and X-axis line motor 46 are driven, wafer imaging camera 35 flatly is transported along directions X and Y direction.The result, wafer imaging camera 35 can be transported above electronic component feed unit 2, so that the chip 6 that is kept by electronic component feed unit 2 is taken pictures, and wafer imaging camera 35 can be transported, so that withdrawn from the upper space of electronic component feed unit 2.

A pair of Y traversing guide 21, second beam part 32, a Y direction driving mechanism (is a Y-axis line motor 26, feed screw 27a and nut part 27b) and a directions X driving mechanism is (promptly, X-axis line motor 46, feed screw 47a and nut part 47b) constitute a wafer imaging camera transport sector, this transport sector is used to transport wafer imaging camera 35.Y direction driving mechanism transports second beam part 32 along Y traversing guide 21.The directions X driving mechanism transports wafer imaging camera 35 along directions X guide rail 48.

With reference now to Fig. 5 and Fig. 6,, these figure have described a kind of method that is adapted to pass through viewing head 31 identification circuit plates 9 and chip 6.Fig. 5 has shown a kind of 2 recognition methodss, wherein, because 2 points that are included in the target to be identified are identified, so the position of the entire portion of target to be identified can be identified.Under the situation that adopts 2 recognition methodss, the optical magnification of optical system is increased, use this optical magnification, so that carry out the operation of taking pictures by electronic component imaging camera 36A and circuit board imaging camera 36B, and the visual field of taking pictures is set to a narrow visual field " W1 ".

In Fig. 5 (a), circuit board 9 is installed on the holding unit 10, and two groups of electronic component mounting parts that chip 6 has been installed among a plurality of these electronic component units 9a that are formed on the circuit board 9 divide on the 9a.Chip 6 is positioned in holding unit 10 tops by the installation head 33 that nozzle 33a is maintained at wherein.At this moment, installation head 33 enters this state, and promptly this installation head 33 is positioned to basically just in time provisionally above electronic component mounting part divides 9a, and described mounting portion 9a is corresponding to the chip 6 that is kept by nozzle 33a.

Under the state of this interim location, viewing head 34 enters in the space that limits between circuit board 9 and chip 6, so that carry out the operation of taking pictures, thus while identification chip 6 and circuit board 9.At this moment, viewing head 34 moves at first by this way, that is, the visual field " W1 " of electronic component imaging camera 36A and circuit board imaging camera 36B can cover the grand piece 6a that is positioned on the chip 6 one side diagonal positions respectively, and is positioned at electronic component mounting part and divides electrode 9b on the 9a one side diagonal position.Then, be arranged in two images in each visual field " W1 " by electronic component imaging camera 36A and circuit board imaging camera 36B acquisition.

Next, shown in Fig. 5 (b), viewing head 34 is moved, this viewing head 34 is transported by this way then, promptly, the visual field " W1 " of electronic component imaging camera 36A and circuit board imaging camera 36B can cover the grand piece 6a that is positioned on the chip 6 opposite side diagonal positions respectively, and is positioned at electronic component mounting part and divides electrode 9b on the 9a opposite side diagonal position.Then, two images that are arranged in each visual field " W1 " obtain in a similar manner by electronic component imaging camera 36A and circuit board imaging camera 36B.

Then, because be processed by the view data that above-mentioned two operations of taking pictures obtain by identifying operation by viewing head 34, so the electronic component mounting part on the position of chip 6 and the circuit board 9 divides the position of 9a to be identified, simultaneously, this chip 6 is mounted 33 maintenance.This 2 recognition methodss are used in this case, that is, the size of the chip 6 of examine is very big, and the entire portion of this chip 6 can not be stored in the same field of view, in addition, need the high position accuracy of identification.

Under the situation of this 2 recognition methodss, because it is as described below, impact point need be positioned in the Narrow Field Of Vision " W1 " securely, so this interim identifying operation can be performed, by this interim identifying operation, be mounted the chip 6 that is placed under 33 state that keep at this chip 6 and can be located camera 15 identifications temporarily, and then, installation head 33 is located based on this interim recognition result temporarily.

Fig. 6 has shown recognition methods in groups, and this recognition methods can be by carrying out the single operation of taking pictures, and discerns the entire portion of dividing 9a about chip 6 and electronic component mounting part in mode in groups.In this case, if the visual field of taking pictures of electronic component imaging camera 36A and circuit board imaging camera 36B is set to the wide visual field " W2 ", viewing head 34 may be advanced to the space that limits between chip 6 and circuit board 9 so.Then, in this state, the entire image and the entire image that electronic component mounting part divides 9a that are arranged in the chip 6 in each visual field " W2 " can obtain by electronic component imaging camera 36A and circuit board imaging camera 36B.Should be understood that, when recognition methods is performed in groups, because chip 6 and electronic component mounting part divide arbitrary can easily being comprised by the wide visual field " W2 " among the 9a, so, do not need usually by using 15 pairs of chips of interim location camera 6 to carry out interim identifying operation.

Next, now will be with reference to figure 7 and Fig. 8, explain corresponding to the reversing objective table 17 of inverter up and down.In Fig. 7, two supporting pillars 72 that are attached to piece 71 are arranged on the horizontal substrate parts 70 with being highlighted.A reversing platform 73 rotatably is supported post 72 and keeps, and a reversing actuator 75 is incorporated into this trunnion axis 73a around trunnion axis 73a.Because reversing actuator 75 is driven, thus trunnion axis 73a Rotate 180 degree, so that reversing platform 73 is carried out reversing operation up and down.

Keeping under 74 situation about being set on the reversing platform 73, a plurality of chip holding unit 74a are arranged on and keep on 74.Be equipped with under the situation of sucking 74b at chip holding unit 74a, chip holding unit 74a is in this state by sucking 74b so, hold mode with vacuum and hold and keep chip 6, promptly its form the plane of grand piece directed upward to chip 6 be installed on each chip holding unit 74a.In other words, chip holding unit 74a keeps the back plane of chip 6, makes chip 6 be arranged to this state, that is, its plane that forms grand piece is directed upward to (seeing Fig. 8 (a)).

In this case, because chip 6 to keep 74 reception/supplys operation execution by this way, be that chip 6 is mounted a nozzle 33a of 33 and picks up from electronic component feed unit 2, the chip 6 that picks up then is transported to and keeps 74, the chip holding unit 74a of this place directed upward to, so it is so set, make to keep the chip holding unit 74a array in 74 overlap with the nozzle 33a array of installation head 33.

Two slide posts 76 are arranged on the substrate parts 70 highlightedly, and sliding part 77 is incorporated into a raised platform 78.These sliding parts 77 engage with slide post 76 slidably along last/following direction.The bar 84a of rising brake 84 is incorporated into raised platform 78.Because rising brake 84 is driven, so raised platform 78 is raised along slide post 76.

An objective table 79 is set on the last plane of raised platform 78.Described objective table 79 is corresponding to Flat bottom container, and this Flat bottom container has a flat plane 79a.This objective table 79 can have as an effect of transmitting objective table, and as another effect of (flatting) objective table that flattens.This transmits objective table and will transmit/be coated on the grand piece 6a of chip 6 for the solder flux (flux) 80 that supplies to the baseplane.When this transmission operation was done, the objective table that flattens was depressed grand piece 6a, made the top of grand piece 6a flatten.In addition, this objective table 79 has as the effect of arranging objective table, and described layout objective table is suitable for arranging with predetermined arrangement the chip 6 that transmits/be coated with solder flux 80, so that obtain operation by installation head 33 execution, and to obtain these chips 6.

Slip cylinder 81 flatly is arranged on the side plane of raised platform 78, and this slip cylinder 81 makes sliding shoe 82 reciprocating motions along horizontal direction.Be equipped with the extrusion unit 83 of two extrusion parts that can freely raise, be installed in by this way on the sliding shoe 82, promptly this extrusion unit 83 is with respect to upwards elongation of objective table 79.Because extrusion unit 83 flatly moves, the solder flux extrusion is operated and solder flux extends operation so that carry out, and is formed on the baseplane of objective table 79 so have the solder flux film of the thickness of selecting in advance, and the fluid level of described film flattens.

Fig. 8 (a) has shown this state, and promptly after forming the solder flux film, rising actuator 84 is driven, and descends so that cause raised platform 78.As a result, objective table 79 drops to one and transmits height and position, so that transmission/coating solder flux 80.Then, under this state, shown in Fig. 8 (b), reversing actuator 75 is driven, so that relative objective table 79 reversing reversing platforms 73.Next, when the weight that is suitable for depressing objective table 79 in the above was raised actuator 84 and applies, the lower plane of grand piece 6a was forced on the objective table 79, so that grand piece 6a is flattened, and also solder flux is transmitted/is coated to grand piece 6a.

When the placement operations that chip 6 is arranged into solder flux 80 by objective table 79 was finished, rising actuator 84 was driven, and rises so that cause raised platform 78, and objective table 79 is positioned at receptions/supply highly.In this state, be disposed in chip 6 on the objective table 79 and be mounted a nozzle 33a of 33 once more and keep, be installed in then on the circuit board 9 that keeps by holding unit 10.As a result, electronic component feed unit 2, reversing objective table 19 also has chip 6 is picked up the installation head 33 that is transported to reversing objective table 17 with the chip that will pick up from electronic component feed unit 2, constitutes an electronic component supply device.This electronic component supply device is supplied with this chip, make chip be in such state, in this state promptly, solder flux 80 is by transmission/coating, and flatten the operation be done with respect to installation head 33, described installation head 33 is suitable for electronic component is installed to circuit board.In addition, reversing objective table 17 is transported to installation head 33 that this reverse objective table 17 from electronic component feed unit 2 pick-up chips 6 with the chip 6 that will pick up with being suitable for, and constitutes an electronic component reversing/feedway.Chip 6 be to obtain from electronic component feed unit 2 and be along on/this state that following direction is reversed under, this electronic component reversing/feedway supplies to installation head 33 with the chip of reversing, is used for chip 6 is installed to circuit board.It should be noted that in addition in this embodiment,, realize by single installation head 33 as the function of installing mechanism as the function of electronic component transport sector and (2) (1).The electronic component transport sector then, is transported to reversing objective table 17 with the chip 6 that picks up from electronic component feed unit 2 pick-up chips 6.In installation function, picked from reversing objective table 17 chip 6 the other way around, then, these picked sheets are installed on the circuit board.In addition, the electronic component transport sector that is used for being transported to from electronic component feed unit 2 pick-up chips 6 and the chip 6 that is used for picking up reversing objective table 17 can be provided individually with respect to installation head 33.

Then, move in the step of circuit board 9 in installation head 33, the installation head 33 that has kept chip 6 moves along directions X above the camera 15 of interim location, so that as previously mentioned, locatees camera 15 temporarily and takes pictures for the chip 6 that is kept by installation head 33.

With reference now to Fig. 9,, the structure of the control system of using will explained subsequently in electronic component mounting apparatus.In Fig. 9, mechanism's driver element 50 drives the motor driver of the motor of above-mentioned each mechanism, control device of air pressure that a control is fed into each mechanism's cylinder or the like by electricity and constitutes.Because 50 Be Controlled unit, 53 controls of mechanism's driver element are so each driving element cited below can be driven.

X-axis line motor 40 and Y-axis line motor 22 drive the installation head transport sector that is used to transmit installation head 33.X-axis line motor 43 and Y-axis line motor 24 drive the viewing head transport sector 58 that is used to transport viewing head 34, and X-axis line motor 46 and Y-axis line motor 26 drive the wafer imaging camera transport sector that is used to transport wafer imaging camera 35.

In addition, mechanism's driver element 50 installation nozzle rising mechanism and described element absorbing mechanism by nozzle 33a (see figure 2) drive installation 33, but also the reversing actuator 75 of driving reversing objective table 17, rising actuator 84, the drive motors of the drive motors of injector and injector XY platform 7.In addition, mechanism's driver element 50 drive circuit

boards inputs carrier

11 and 12, circuit

board output carrier

13 and 14, the circuit board maintaining body of holding unit 10 is applicable to the holding unit rising mechanism 16 of rising holding unit 10.

The images that 54 pairs of electronic component recognition units are taken pictures by the electronic component imaging camera 36A of viewing head 34 are carried out identification and are handled operation, so that identify the position that is mounted the chip 6 that a nozzle 33a of 33 holds/keep.The 55 pairs of images of being taken pictures by the circuit board imaging camera 36B of viewing head 34 in board recognition unit are carried out identification and are handled operation, so that identify the position that the electronic component mounting part of the circuit board 9 that is kept by holding unit 10 divides 9a.In circuit board 9, the grand piece 6a of chip 6 connects electrode 9b thereon, handle in chip unit, and electronic component mounting part divides 9a can use image recognition processing method of operating detecting location.

The image of being taken pictures by wafer imaging camera 35 is handled in wafer identification unit 56, so that the position of the chip 6 of electron gain component feeding unit 2.Operation is handled in 57 pairs of images execution identifications of being taken pictures by interim location camera 15 of the interim recognition unit of electronic component, so that obtain the position by the chip 6 of installation head 33 maintenances.As previously mentioned, this location recognition is to adopt under installation head 33 is positioned at situation on the circuit board 9 temporarily.

By electronic component recognition unit 54, board recognition unit 55, the recognition result that the interim recognition unit 57 of wafer identification unit 56 and electronic component obtains is provided for control unit 53.Operating unit 51 is corresponding to input equipment for example keyboard and mouse.These operating unit 51 input data, input of control commands, and setting operation pattern (below will discuss).Display unit 52 shows thereon by viewing head 34, wafer imaging camera 35 and temporarily locate the image that camera 15 is taken pictures, and when operating unit 51 is carried out input operations, also show the guiding screen thereon.

Under the situation that this electronic component mounting apparatus is arranged as mentioned above, the operator scheme of electronic component mounting apparatus in each operator scheme and electronic component fitting operation can be by description below: promptly, in electronic component mounting apparatus according to this embodiment, by high precision mode, three operator schemes that mode standard and high-speed pattern constitute can be selected in response to the installation accuracy of needs.By operating operation unit 51, can set the switching of these operator schemes.

Next, with reference now to Figure 10 to Figure 15, processing capacity and electronic component fitting operation that electronic component mounting apparatus is carried out are described in mode standard.Electronic component fitting operation in the mode standard comprises: a step, its chips (electronic component) 6 are mounted a plurality of nozzles (installation nozzle) 33a of 33 and hold/keep; An interim positioning step, wherein, the chip 6 that is held/keep by a nozzle among a plurality of nozzle 33a is positioned at an electronic component mounting part provisionally and is divided 9a the top; Observe step for one, wherein the image of interim positioning chip 6 and image that electronic component mounting part divides 9a obtain by viewing head 34, and described viewing head 34 is positioned in this interim positioning chip 6 and electronic component mounting part divides in the space that limits between the 9a; A relative position relation detection steps, the image that divides 9a based on the image and the electronic component mounting part of chip 6 wherein, detection chip 6 and electronic component mounting part divide the relative position relation between the 9a, and these images are obtained in observing step; An interim positioning step is used for all chips that held/keep by other nozzle 33a are located provisionally; Observe step for one; A step is used to carry out the relative position relation detection steps; A viewing head is withdrawn step, is used for withdrawing viewing head 34 from the upper space of circuit board 9; With such step, promptly wherein, by being reflected in the relative position relation that obtains in the relative position relation detection steps, to position with respect to the electronic component mounting part branch by the chip that a plurality of nozzle 33a hold/keep so that transport such operation of installation head 33, sequentially carry out with respect to all sheets that held/keep by nozzle 33a.

In Figure 10, rectangular frame 53 is illustrated in the processing capacity of the control unit 53 in the mode standard.As following will the explanation, control unit 53 has the function as control device.Promptly, this control device is based on the image of the chip 6 that obtains by viewing head 34 and the image that electronic component mounting part divides 9a, control installation head transport sector 59, and sequentially will navigate to electronic component mounting part corresponding with it by the chip 6 that each nozzle 33a holds/keeps and divide 9a.

The detailed functions of explained later control unit 53.Comprise at control unit 53 under the situation of a memory function, this control unit 53 is provided with three storage compartments, i.e. circuit board information storage part 53e, an interim positioning position information storage compartment 53f and a relative position relation storage compartment 53g.Circuit board information storage part 53e stores this information that the pass is installed the circuit board 9 of chip thereon therein, it is the size of circuit board, the electronic component mounting part of with respect to circuit board 9 chip 6 being installed on it divides the array information (vertical/transverse pitch and pitch quantity) of 9a (seeing Fig. 5 and Fig. 6), and the position that is formed on the identification mark on the circuit board 9.

Interim positioning position information storage compartment 53f stores this positional information therein, this positional information is represented when electronic component mounting part that chip 6 that a nozzle 33a who is mounted 33 holds/keeps is positioned at circuit board 9 provisionally divides the 9a top, a stop position of installation head 33.In other words, divide the interim positioning position information of 9a to be stored in the interim positioning position information storage compartment 53f from the installation head positional information (p) of installation head transport sector 59 outputs as each group (set) chip 6 and electronic component mounting part.Relative position relation storage compartment 53g storage chip 6 and electronic component mounting part therein divides relative position relation between the 9a, and this position relation is a relative position relation computing part 53i (below will the explain) acquisition that divides 9a by each core assembly sheet 6 and electronic component mounting part.

This relative position relation is illustrated in this chip 6 under the state like this and divides relative position relation between the 9a corresponding to the electronic component mounting part of this chip 6, this state is: installation head 33 is located provisionally with respect to circuit board 9, in described installation head 33, this chip 6 is kept by nozzle 33a.In other words, on behalf of chip 6, this relative position relation divide the displacement of 9a with respect to electronic component mounting part along horizontal direction.This relative position relation obtains by taking pictures for chip 6 and circuit board 9 by means of viewing head 34.

Because by discerning/handle for chip 6 view data that obtains of taking pictures by electronic component recognition unit 54, so positional information that can obtained this chip 6 by means of electronic component imaging camera 36A.In addition, because by discerning/handle for circuit board 9 view data that obtains of taking pictures by board recognition unit 55, so the positional information of can obtained electronic component mounting part dividing 9a by means of circuit board imaging camera 36B.Then, based on the positional information that the positional information and the electronic component mounting part of chip 6 divides 9a, chip 6 and electronic component mounting part divide the relative position relation between the 9a to calculate by relative position relation computing part 53i.

In other words, divide the image of chip 6 of 9a and the image that electronic component mounting part divides 9a based on each core assembly sheet 6 and electronic component mounting part, relative position relation computing part 53i obtains to be mounted 33 chip that hold/keeps 6 and electronic component mounting part and divides relative position relation between the 9a, and described image is by viewing head 34 acquisitions.

Alignment information calculating section 53h divides the interim position location of 9a and relative position relation to calculate alignment information based on every core assembly sheet 6 and electronic component mounting part, these alignment information are used to location and installation 33, and described interim position location and relative position relation are stored in respectively among interim positioning position information storage compartment 53f and the relative position relation storage compartment 53g.This alignment information represents that installation head 33 is in the ideal position that is used for the electronic component mounting part that chip 6 is installed in circuit board 9 is divided the fitting operation on the 9a.This alignment information is output with this form, and promptly this form comprises and is used for proofreading and correct the correction quantity that said chip 6 and electronic component mounting part divide the relative position drift between the 9a.

Divide being comprised in of 9a to be stored in array information in the circuit board information among the circuit board information storage part 53e based on electronic component mounting part, viewing head transmission process part 53a control holding unit rising mechanism 16 and viewing head transport sector 58, so that when the circuit board 9 that is held unit 10 maintenances is taken pictures, viewing head 34 is carried out positioning action, in addition, also viewing head 34 is carried out one and withdraw operation, describedly withdraw operation and be used for viewing head 34 is transported to such position that viewing head can not disturb the fitting operation that chip 6 undertakies by installation head 33.

Viewing head 34, viewing head transport sector 58, transport processing section 53a with viewing head and constitute a finder that is equipped with viewing head 34, described finder can divide this chip 6 of 9a and electronic component mounting part to divide image that obtains interim positioning chip 6 space that limits between the 9a and the image that electronic component mounting part divides 9a from each core assembly sheet 6 and electronic component mounting part.

Pick-up operation processing section 53b control installation head transport sector 59, with convenient chip 6 based on this chip 6 in electronic component feed unit 2 the position and when picked, can carry out positioning action from electronic component feed unit 2 to installation head 33.The position of this chip 6 can obtain by discerning/handle by means of the 56 pairs of images of being taken pictures by wafer imaging camera 35 in a wafer identification unit.

An interim positioning action processing section 53c control installation head transport sector 59 divides 9a the top so that will sequentially be positioned at electronic component mounting part by the chip 6 that a plurality of nozzle 33a hold/keep.This interim positioning action is based on the position that array information and being in that the electronic component mounting part that is stored among the circuit board information storage part 53e divides 9a is mounted the chip 6 under 33 state that keep to carry out.By taking pictures by means of 15 pairs of chips 6 that keep by installation head 33 of interim location camera, can obtain the position of chip 6, then, this result that takes pictures discerns/handles by an interim recognition unit 57 of electronic component.

Based on the alignment information of calculating by alignment information calculating section 53h, a fitting operation processing section 53d control installation head transport sector 59 is so that sequentially locate the chip that each nozzle 33a is kept with respect to the corresponding electronic element mounting portion 9a of circuit board 9.

Next, now will be according to the flow chart of Figure 11, and, the electronic component fitting operation that is in the mode standard is described referring to figs 12 to Figure 15.In this fitting operation, as shown in Figure 5 and Figure 6, this example of operation shows in the following situation, promptly with respect to the circuit board 9 that chip 6 is installed, carries out fitting operation continuously.

In Figure 11, electronic component holds/keeps operation and at first is carried out (ST1).That is to say, chip 6 is held/keep (element maintenance step) by the nozzle 33a of a plurality of installation head 33 from objective table 79 (with reference to figure 7 and Fig. 8).Then, when the installation head 33 that keeps chip 6 is passed the upper space of interim location camera 15, this chip 6 is carried out interim identifying operation (ST2).As a result, be in the chip 6 that is mounted under 33 state that keep and taken pictures, the position of this chip 6 of being taken pictures is identified then.Then, based on this interim recognition result, carry out interim positioning action (ST3) to first group.In other words, installation head 33 moves above the circuit board 9 that is held unit 10 maintenances, then, being mounted the electronic component mounting part that chip 6 that a nozzle among 33 a plurality of nozzle 33a holds is positioned at provisionally corresponding to this chip 6 divides 9a to go up (interim positioning step).

In this step, at first, be mounted 33 chip 6 that keep (promptly in Figure 12 (a), chip 6 by right side nozzle 33a maintenance), in this fitting operation, first electronic component mounting part that is navigated to circuit board 9 provisionally divides 9a (that is, the electronic component mounting part adjacent to the right side of the previous chip of installing 6 divides 9a).This interim positioning action is based on above-mentioned interim recognition result and divides the array information of 9a to carry out with the electronic component mounting part that is stored among the circuit board information storage part 53e.

With these operations parallel be in holding unit 10, to carry out holding unit step-down operation (ST4).As a result, the viewing head space of advancing is therein guaranteed above holding unit 10.Then, under this state, shown in Figure 12 (a), viewing head 34 advances to the such space that limits between circuit board 9 and the chip 6 by installation head 33 maintenances, then, carries out viewing head positioning action (ST5).

After this, observe operation (ST6), so that the image of interim positioning chip 6 and the image that electronic component mounting part divides 9a can obtain by viewing head 34, described viewing head is positioned between this chip 6 and electronic component mounting part and divides (observation step) in the space that limits between the 9a.In this step, at first, shown in Figure 12 (a), the image of interim positioning chip 6 and the image that electronic component mounting part divides 9a can use circuit board imaging camera 36B and electronic component imaging camera 36A to obtain respectively, simultaneously, discern as recognition objective for above-mentioned first group.In this example, adopted recognition methods (see figure 6) in groups, by this method, recognition objective is discerned by means of the wide visual field " W2 " with burst mode.Then, the position of installation head 33 as this interim positioning position information with respect among one group that divides 9a to constitute by this chip 6 and the electronic component mounting part interim positioning position information storage compartment 53f that is stored into.

After this, the image that divides 9a based on the image and the electronic component mounting part of chip 6, to dividing the relative position information of 9a to survey about this chip 6 and electronic component mounting part, these images are in observing step obtained (relative position relation detection steps).In other words, the image that divides 9a based on chip 6 and electronic component mounting part, the position of this chip 6 and electronic component mounting part divide the position of 9a to be identified by electronic component recognition unit 54 and board recognition unit 55, then, chip 6 and electronic component mounting part divide the relative position relation between the 9a to be calculated by relative position relation computing part 53i.Result of calculation is stored into about this core assembly sheet 6 and the electronic component mounting part corresponding with it divides among the relative position relation storage compartment 53g of 9a (storing step).

Next, judge whether to have another group (ST7) of dividing 9a to constitute by next chip 6 and next electronic component mounting part.When having next group, next group is carried out interim positioning action (ST8), and next group is carried out viewing head positioning action (ST9).The content of these operations is identical with the content of operation (ST5) with (ST3) respectively.In other words, shown in Figure 12 (b), installation head 33 and viewing head 34 are moved, and divide 9a so that next chip 6 is navigated to next electronic component mounting part.At this moment, the operation of viewing head 34 and chip 6 carry out synchronously by moving of installation head 33.

Then, after this, handle operation and get back to step (ST6), wherein, observe operation by viewing head 34.Up to confirm not have next group in later step (ST7), interim positioning step is observed step and relative position relation detection steps and is all sequentially carried out with respect to all chips that held/keep by other nozzle 33a.

When all these groups are finished interim positioning action, when observing each step of operation and relative position relation exploration operation, carry out viewing head and withdraw operation (ST10), carry out lift operations on the holding unit (changing step at interval) subsequently (ST11).In other words, shown in Figure 13 (a), viewing head 34 is withdrawn (viewing head is withdrawn step) from the upper space of circuit board 9.Next, shown in Figure 13 (b), holding unit 10 is caused and rises to an element setting height(from bottom).Then, with these operations parallel be that the first core assembly sheet 6 divides 9a to position (that is, 33 a left side chip 6 and second electronic component mounting part that keep that are mounted from the chip 6 of previous installation divide 9a) (ST12) with respect to this electronic component mounting part.

When finishing this positioning action, at first, alignment information calculating section 53h reads interim positioning position information and relative position information about relevant group from interim positioning position information storage compartment 53f and relative position relation storage compartment 53g, then, based on the interim positioning position information of reading and the relative position relation of reading, the alignment information of compute location action need (alignment information calculation procedure).Then, based on the alignment information that calculates, fitting operation processing section 53d control installation head transport sector 59 is so that execution is to the positioning action of installation head 33.

Then, after this, shown in Figure 14 (b), cause keeping the nozzle 33a of the top chip of explaining 6 in first group to descend, so that the electronic component mounting part that chip 6 is installed in circuit board 9 divides 9a to go up (ST13).Next, check that the chip 6 whether have next group will install (ST14).Shown in Figure 14 (b), when having next group, just position operation (ST15) with respect to this next group.Then, fitting operation is got back to previous steps (ST13).In this step (ST13), shown in Figure 15 (a) and Figure 15 (b), nozzle 33a is caused decline, so that chip 6 is installed on the circuit board 9.

In other words, the relative position relation that detects in the relative position relation detection steps is reflected in the transmission course of installation head 33, because installation head 33 is moved, so fitting operation just can carry out being mounted all chips that a nozzle 33a of 33 holds/keep, in described fitting operation, the chip 6 that is held/keep by a plurality of nozzles 33 divides 9a to position with respect to electronic component mounting part, so that be installed on the circuit board 9.Then, in a step (ST14), confirming does not have next group, and all chips 6 are finished the sheet fitting operation, then, finishes the electronic component fitting operation.

As preceding explanation, the electronic component mounting method in the mode standard is realized by sequentially carrying out fitting operation cited below.That is exactly, and when the installation head 33 that is equipped with a plurality of nozzle 33a by use, when being installed in chip 6 on the circuit board 9, observing operation and just divides 9a to carry out by chip 6 and the electronic component mounting part that limits as all groups of object observing in advance.Be ready to information (promptly for all these groups, interim positioning position information and relative position relation) after, described information is that the alignment information that the compute location operation is relevant when carrying out fitting operation is needed, the chip that will install with respect to each these calculates alignment information, so that execution positioning action, then, nozzle 33a is caused decline, divides on the 9a so that chip 6 is dropped to electronic component mounting part.

As a result, when carrying out fitting operation with respect to a chip 6, viewing head 34 just no longer advances between installation head 33 and holding unit 10 and withdraws at every turn, so that shorten the operating time.Then, when chip 6 is landed on circuit board 9, because nozzle 33a is caused under the state that rises to the element setting height(from bottom) at holding unit 10 and is caused decline, so, the whole operation time is used for causing that nozzle 33a can be shortened in the fitting operation needed time of decline, so that can further be shortened.That is to say, as top the explanation, electronic component mounting method, can be installed in electronic component on the circuit board with high efficiency as mode standard corresponding to this general fitting operation execution pattern.

With reference now to Figure 16 to Figure 22,, the processing capacity and the electronic component fitting operation of the electronic component mounting apparatus in high precision mode described.Electronic component fitting operation in high precision mode comprises: a step, and wherein, chip (electronic component) 6 is mounted a plurality of nozzles (installation nozzle) 33a of 33 and holds/keep; An interim positioning step wherein, is mounted among 33 a plurality of nozzle 33a a chip 6 that a nozzle holds/keep and is positioned at an electronic component mounting part provisionally and divides on the 9a; Observe step for one, wherein, the image that the image of this interim positioning chip 6 and electronic component mounting part divide 9a obtains by viewing head 34, and described viewing head is positioned in the space that this interim positioning chip 6 and electronic component mounting part divide between the 9a to be limited; A relative position relation detection steps, wherein, chip 6 and electronic component mounting part divide the relative position relation between the 9a to survey based on the image of the chip 6 that obtains in observing step and the image that electronic component mounting part divides 9a; A viewing head is withdrawn step, and wherein, viewing head is withdrawn from the upper space of circuit board 9; Electronic component installation steps wherein, by mobile installation head 33, be reflected in the relative position relation of surveying in the above-mentioned relative position relation detection steps simultaneously, and the chip 6 that will temporarily locate divide 9a to position with respect to electronic component mounting part; An interim positioning step wherein, is located provisionally by all chips that other nozzle 33a holds/keeps; And a step, be used for sequentially carrying out the observation step, the relative position relation detection steps, viewing head is withdrawn step and electronic component installation steps.

The FBD (function block diagram) of the high precision mode that shows among Figure 16 is by eliminate interim positioning position information storage compartment 53f and relative position relation storage compartment 53g layout from the FBD (function block diagram) of the mode standard shown in Figure 10, promptly form by deleting this function that is used to store interim positioning position information and relative position relation information, described information constitutes the basis that can calculate alignment information.In this high precision mode, calculate alignment information under the situation that the information of explaining had not stored on two groups.That is to say, as shown in figure 16, an alignment information calculating section 53h divides the relative position relation between the 9a to calculate this alignment information based on chip 6 and electronic component mounting part, and this alignment information is to calculate by relative position information computing part 53i with from the present position (interim positioning position information) of the next installation head 33 of installation head transport sector 59 transmission.

Next, to be described in the electronic component fitting operation in the high precision mode according to the flow chart of Figure 17 and referring to figs. 18 to 22 now.In this fitting operation, similarly be that the example of this operation shows in the following situation, promptly with respect to the top circuit board 9 that chip 6 has been installed, carries out a fitting operation continuously with above-mentioned fitting operation.

In Figure 17 because (ST21) to each step shown in (ST25) have with as shown in Figure 11 step (ST1) to (ST5) in identical content, so omit its explanation.Because these corresponding steps are done, so chip 6 and electronic component mounting part divide 9a to enter observation state.

After this, observe operation for one and be carried out (ST26), so that can obtain the image of interim positioning chip 6 and the image that electronic component mounting part divides 9a by viewing head 33, described viewing head is positioned between this chip 6 and electronic component mounting part and divides in the space that limits between the 9a.Similar to Example 1 is that in this step, at first, shown in Figure 18 (a), the image of interim positioning chip 6 and the image that electronic component mounting part divides 9a can obtain by using viewing head 34.

After this, based on the image of the chip 6 that in observing step, obtains and the image that electronic component mounting part divides 9a, divide the relative position relation of 9a to survey to this chip 6 and electronic component mounting part.In other words, the image that divides 9a based on chip 6 and electronic component mounting part, the position of this chip 6 and electronic component mounting part divide the position of 9a to discern by electronic component recognition unit 54 and board recognition unit 55, then, by relative position relation computing part 53i, calculate at chip 6 and electronic component mounting part and divide relative position relation between the 9a.Then, alignment information calculating section 53h concerns based on the position that calculates and from the present position that installation head transport sector 59 transmits the installation head 33 of coming, calculates alignment information.

After viewing head 34 is withdrawn operation (ST27), when detecting relative position relation, just carry out the last lift operations (ST28) of holding unit 10 subsequently to one group.In other words, shown in Figure 18 (b), viewing head 34 is withdrawn from the upper space of circuit board 9.Shown in Figure 19 (a), holding unit 10 is caused and rises to an element setting height(from bottom).Then, with these operations parallel be that the first core assembly sheet 6 divides 9a to position (that is, be mounted 33 a right side chip 6 that keep and divide 9a adjacent to the electronic component mounting part of the previous chip of installing 6 location) (ST29) with respect to this electronic component mounting part.

Then, after this, shown in Figure 19 (b), keep the nozzle 33a of first group of chip of explaining above 6 to be caused decline, so that the electronic component mounting part that chip 6 is installed in circuit board 9 divides 9a to go up (ST30).Next, check that the chip 6 whether have next group will install (ST31).In this case, if having next group, fitting operation is got back to and is used for carrying out the operation of observing operation by viewing head 34 so.That is to say, shown in Figure 20 (a), holding unit 10 is caused and drops to an identification height (ST32), and viewing head 34 advances to a space that limits between chip 6 and the circuit board 9, so that carry out the positioning action (ST33) of viewing head 34.

With these steps parallel be that next group is carried out interim positioning action (ST34).Then, fitting operation is got back to step (ST26), and shown in Figure 20 (b), the image of chip 6 and electronic component mounting part divide the image of 9a to obtain by viewing head 34.Then, similarly be to survey relative position relation.After this, shown in Figure 21 (a), viewing head 34 is withdrawn from the upper space of holding unit 10.Next, shown in Figure 21 (b), holding unit 10 is caused and rises to the element setting height(from bottom), then, next core assembly sheet 6 is positioned to electronic component mounting part and divides 9a (electronic component mounting part that is mounted chip 6 location that are mounted in 33 a left side chip 6 that keep and the adjacent fitting operation formerly divides 9a).

After this, shown in Figure 22 (a), nozzle 33a is caused decline, so that the electronic component mounting part that chip 6 is installed in circuit board 9 divides 9a to go up (ST30).Then, these steps are repeatedly carried out.Do not have next core assembly sheet 6 to be mounted (ST31) in this step if judge, the electronic component fitting operation has just been finished so.

The same as explained before, according to the electronic component mounting method in high precision mode, when chip 6 was installed on the circuit board 9 by the installation head 33 that is equipped with a plurality of nozzle 33a, a core assembly sheet 6 and electronic component mounting part divided 9a observed as observation group.If be used for dividing the alignment information of 9a location to be based on observed result and obtaining to these chips 6 and electronic component mounting part, the electronic component fitting operation by installation head 33 can carry out immediately based on this alignment information so.

As a result, when installation head 33 is positioned based on this alignment information, can eliminate in transporting installation head 33 this position error that each the mechanism error in the installation head transport sector 59 that uses causes, make it possible to achieve high installation site precision.That is to say, the above-mentioned this fitting operation execution pattern of installation method hint in high precision mode, the purpose that this pattern had is to need the high precision components of high encapsulation precision to be installed on the circuit board with better positional precision.

Figure 23 is a FBD (function block diagram), is used to be illustrated in according to the processing capacity under the situation of the high-speed pattern of the electronic component mounting apparatus of the embodiment of the invention 1.Figure 24 is a flow chart, is used to explain the electronic component mounting method (high-speed pattern) of the embodiment of the invention 1.

FBD (function block diagram) shown in Figure 23 is to arrange like this, promptly from the FBD (function block diagram) of the mode standard shown in Figure 10, remove interim positioning position information storage compartment 53f, relative position relation storage compartment 53g, relative position relation computing part 53i, interim positioning action processing section 53c, electronic component imaging camera 36A, and electronic component recognition unit 54.This FBD (function block diagram) among Figure 23 forms by the following method, and the method for promptly calculating alignment information is simplified.

As shown in figure 23, alignment information calculating section 53h calculates alignment information based on the position recognition result of chip 6 and the position recognition result of circuit board 9.This position recognition result of chip 6 is to obtain in the following manner, and promptly the image of this chip 6 that obtains by interim location camera 15 is discerned by the interim recognition unit 57 of electronic component.This position recognition result of circuit board 9 is to obtain in the following manner, and promptly the image of this circuit board 9 that obtains by circuit board imaging camera 36B is discerned by board recognition unit 55.Based on the position of characteristic (for example being formed on the identification mark on the circuit board 9), circuit board 9 is carried out the location recognition operation.

In other words, based on being comprised in the array information that electronic component mounting part in the circuit board information that is stored among the circuit board information storage part 53e divides 9a, and the position excursion of the circuit board 9 that obtains by board recognition operation, determine that each electronic component mounting part divides the position of 9a.Then, divide the position of 9a and the position excursion amount of the chip 6 that obtains from the recognition result of chip 6 based on this electronic component mounting part, the ideal position of calculating installation head 33.

Next, to be described in the electronic component fitting operation in the high-speed pattern with reference to the flow chart of Figure 24 now.This electronic component fitting operation is corresponding to the high-speed pattern of fitting operation, and described fitting operation is carried out by using this electronic component mounting apparatus.Before fitting operation began, the circuit board 9 that is held unit 10 maintenances thus, detected the displacement of circuit board 9 by circuit board imaging camera 36B identification.Then, in Figure 24, at first carry out electronic component and hold/keep operation (ST41).

That is to say, chip 6 is mounted 33 a plurality of nozzle 33a and is held/keep from objective table 79.Then, if keep the installation head 33 of chip 6 to pass the upper space of interim location camera 15, so just this chip 6 is carried out interim identifying operation (ST42).As a result, be in the chip 6 that is mounted under 33 state that keep and taken pictures, and discern the position of this chip 6 of being taken pictures then.Then, based on this interim recognition result, carry out interim positioning action (ST43) to first group.

After this, present interim positioning action advances to fitting operation.In this case, make the nozzle 33a decline remain in first chip 6 interim positioning states under, so that the electronic component mounting part that chip 6 is installed in circuit board 9 divides on the 9a.Next, check whether also have next core assembly sheet 6 to install.When having next group, carry out interim positioning action (ST46) with respect to next group.Then, fitting operation is got back to previous steps (ST44).In this step, this fitting operation is carried out similarly, and wherein, nozzle 33a is caused decline.Then, these steps are repeatedly carried out.When judging the chip 6 that does not have next group will install in step (ST45), the electronic component fitting operation has just been finished.

The same as explained before, the electronic component mounting method in high-speed pattern is realized by sequentially carrying out fitting operation cited below.That is to say, when the installation head 33 that is equipped with a plurality of nozzle 33a by use when chip 6 is installed on the circuit board 9, just alignment information is calculated in the position of dividing 9a based on the position and the electronic component mounting part of chip 6, and the position of described chip 6 is to detect by the image that obtains these chips 6 by means of interim location camera 15.The position of chip 6 is by being detected by interim location camera 15 path that is transferred to holding unit 10 in the installation head 33 that keeps chip 6 from component feeding unit 2.By considering to divide the board recognition result of array information of the previous storage of 9a, can detect the position that electronic component mounting part divides 9a about electronic component mounting part.

As a result, the electronic component fitting operation can be performed, and divides 9a for each core assembly sheet 6 and electronic component mounting part simultaneously, does not carry out the needed observation operation of described positioning action.In other words, above-mentioned electronic component mounting method promptly, does not need this electronic component of high installation site precision at full speed to be mounted in the pipe nipple bat time corresponding to a kind of so high-speed Installation Modes.

The same as previously explained, except that the installation execution pattern of universal standard pattern, electronic component mounting apparatus shown in the embodiment 1 can be in response to wanting the needed installation accuracy of electronic components mounted, select high precision mode and high-speed pattern, by described universal standard pattern, better installation site precision can get both mutually with the installment work of high efficiency element.

In other words, the installation execution pattern of high precision mode is designed to high precision components, and this high precision components needs high encapsulation precision, in addition, in high-speed Installation Modes, do not need the electronic component of high installation site precision in pipe nipple is clapped the time, at full speed to be mounted.

(embodiment 2)

Next, description is according to the electronic component mounting apparatus of the embodiment of the invention 2.For the electronic component mounting apparatus of embodiment 2, only a treatment mechanism with mode standard operation is different from embodiment 1, and at high precision mode with other structure in the pattern is all identical with embodiment 1 with processing capacity at a high speed.Therefore, just be limited to the processing capacity of carrying out with mode standard about explanation according to the electronic component mounting apparatus of embodiment pattern 2.

Figure 25 is a FBD (function block diagram), is used to be illustrated in the processing capacity under the following situation, and promptly the electronic component mounting apparatus according to the embodiment of the invention 2 is operated with mode standard.In embodiment 1 (see figure 10), divide 9a for each core assembly sheet 6 and electronic component mounting part, the interim positioning position information of installation head 33 and expression chip 6 and electronic component mounting part divide the information of the relative position relation between the 9a to be stored.In embodiment 2, divide 9a for each core assembly sheet 6 and electronic component mounting part, alignment information is stored.

In other words, as shown in figure 25, the relative position relation that calculates by relative position relation computing part 53i was not stored, but directly was passed to alignment information calculating section 53h.Based on when interim positioning action is performed, be stored in the position of the installation head among the interim positioning position information storage compartment 53f, and passing through the relative position relation that relative position relation computing part 53i calculates, alignment information calculating section 53h calculates alignment information (alignment information calculation procedure).

Divide 9a for each core assembly sheet 6 and electronic component mounting part, alignment information storage compartment 53j stores the alignment information of calculating by alignment information calculating section 53h (storing step) therein.When fitting operation was mounted operational processes part 53d control, installation head transport sector 59 was based on the alignment information Be Controlled that is stored among the alignment information storage compartment 53j.Among this external this embodiment 2, similar to Example 1 is, because fitting operation is just all groups to be carried out after being used in the observation operation execution in advance of calculating alignment information, so can obtain similar effects.

As previously mentioned, in electronic component mounting method (mode standard) according to the embodiment of the invention 2, in following this electronic component fitting operation, promptly the corresponding a plurality of nozzle 33a that are set on the installation head 33 at chip 6 hold/keep, and the electronic component mounting part that is installed in circuit board 9 divides in the fitting operation on the 9a, carries out this relative position exploration operation with respect to all chips 6 that held/keep by nozzle 33a.In this relative position exploration operation, it is observed that interim positioning chip 6 and electronic component mounting part divide 9a to pass through viewing head 34, and described viewing head is positioned between this chip 6 and electronic component mounting part and divides in the space that limits between the 9a.Then, sequentially carry out fitting operation with respect to all chips 6, described fitting operation is used for the relative position relation that calculates by reflection, divides 9a to give chip 6 location with respect to electronic component mounting part, divides on the 9a so that this positioning chip 6 is installed to electronic component mounting part.

As a result, compare with conventional method, the pitch time of each electronic component can shorten greatly, in described conventional method, when an electronic component is installed at every turn, observes camera and advances between installation head and circuit board/withdraw.In addition, when the holding unit that is used for the holding circuit plate can upborne mode be arranged with this holding unit, because when carrying out fitting operation, interval between circuit board and the installation head narrows down, so the time that the rising nozzle needs can be shortened, therefore pitch time can further be shortened, and in addition, better the installation site precision can get both mutually with the installment work of high efficiency element.

Industrial applicibility

According to the present invention, in this electronic component fitting operation, be that corresponding a plurality of nozzles that electronic component is set on the installation head hold/keep, and the electronic component mounting part that is installed in circuit board 9 divides the 9a electronic component mounting part to divide, at this moment, carry out a such relative position exploration operation with respect to all electronic components that held by nozzle/keep, simultaneously, in this relative position exploration operation, interim positioning electronic components and electronic component mounting part divide by viewing head observed, and described viewing head is positioned in the space that limits between this electronic component and electronic component mounting part branch.Then, sequentially carry out fitting operation with respect to all electronic components, described fitting operation is used for the relative position relation that calculates by reflection, gives the electronic component location with respect to electronic component mounting part, divides so that this positioning electronic components is installed in electronic component mounting part.As a result, better the installation site precision can get both mutually with the installment work of high efficiency element.

Claims

1. electronic component mounting apparatus comprises:

The holding unit of holding circuit plate;

Installation head, this installation head are equipped with and a plurality ofly are applicable to the installation nozzle that holds/keep electronic component, and have the installation nozzle rising mechanism of the described a plurality of installation nozzles that are used for raising separately;

Electronic component supply device is used for electronic component is supplied to described installation head;

The installation head transport sector is used for the described installation head of transmission between described holding unit and described electronic component supply device;

Viewing head, this viewing head the electronic component that holds/keep by described installation nozzle be positioned at provisionally that a plurality of electronic component mounting parts that are formed on the described circuit board divide above state under, from the space that electronic component mounting part divides and limits between the positioning electronic components temporarily, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides;

The viewing head transport sector, this viewing head transport sector with by move described installation head by sequentially and the electronic component of locating provisionally synchronously transport described viewing head, but also when electronic component is installed on the circuit board, described viewing head is withdrawn from described holding unit upper space; With

Control device, the image that it divides based on the image and the described electronic component mounting part of the described electronic component that obtains by described viewing head, control described installation head transport sector, so that with respect to the electronic component mounting part branch corresponding, will sequentially be located by each electronic component of nozzle is installed is held/keeping with it.

2. electronic component mounting apparatus as claimed in claim 1, wherein, described electronic component mounting apparatus comprises modifier at interval, this interval modifier changes the interval between described installation head and the described holding unit, so that after described viewing head is withdrawn from described space, described interval is narrowed down.

3. electronic component mounting apparatus as claimed in claim 2, wherein, described interval modifier comprises a holding unit rising mechanism, this rising mechanism described holding unit that raises; And the interval transversely of described holding unit is used as the evacuation situation of described viewing head.

4. electronic component mounting apparatus as claimed in claim 1, wherein, described viewing head comprises the circuit board imaging camera that the electronic component imaging camera of observing electronic component and the electronic component mounting part of observing circuit board are divided.

5. electronic component mounting apparatus as claimed in claim 4, wherein, the light path of the light path of described electronic component imaging camera and described circuit board imaging camera flatly is provided with; And

Described electronic component mounting apparatus also comprises, a prism, described prism changes to a direction that makes progress with the direction of the light path of described electronic component imaging camera, and at same position the direction of the light path of described circuit board imaging camera is changed to a downward direction.

6. electronic component mounting apparatus as claimed in claim 1, wherein, described electronic component supply device comprises:

The electronic component feed unit, described feed unit is supplied with a plurality of electronic components by this way, and upwards overturn in the surface that is formed with grand piece above in promptly described a plurality of electronic components; With

Electronic component reversing/feedway, described device is obtained electronic component from described electronic component feed unit, and supplies with the described electronic component of being obtained under the state that is reversed in the top and the bottom of the described electronic component of being obtained.

7. electronic component mounting apparatus as claimed in claim 1, wherein, described electronic component supply device comprises:

The electronic component feed unit, described feed unit is supplied with a plurality of electronic components by this way, and upwards overturn in the surface that is formed with grand piece above in promptly described a plurality of electronic components;

Inverter up and down, described inverter up and down reverses electronic component; With

The electronic component transport sector, described transport sector picks up electronic component from described electronic component feed unit, and described picked electronic component is transported to described inverter up and down.

8. electronic component mounting apparatus as claimed in claim 1, wherein, described electronic component supply device comprises:

Inverter up and down, described inverter up and down reverses electronic component; And

Described installation head transport sector is at described electronic component feed unit, described inverter up and down, with transport described installation head on the described holding unit, so that the electronic component of described electronic component feed unit is transported to described inverter up and down by described installation head, and be installed on the circuit board of described holding device by described installation head by the electronic component of described inverter up and down reversing.

9. electronic component mounting apparatus comprises:

The holding unit that is used for the holding circuit plate;

The installation head transport sector, this installation head transport sector transmits described installation head between described holding unit and described electronic component supply device, wherein, a plurality of electronic components that held/keep by described a plurality of installation nozzles are installed on a plurality of electronic component mounting parts branches;

Interim positioning action processing section, this interim positioning action processing section will sequentially be navigated to the upper space that electronic component mounting part divides by the electronic component that described a plurality of installation nozzles hold/keep by the described installation head transport sector of control;

Finder, this finder is equipped with a viewing head, organize the electronic component and the described electronic component mounting part branch of described interim location for each, the space of described viewing head from limiting between interim described positioning electronic components and described electronic component mounting part branch obtains the image of interim positioning electronic components and the image that electronic component mounting part divides;

Interim positioning position information storage compartment, when carrying out interim positioning action, interim positioning position information storage compartment is to each the described group interim positioning position information of position conduct of storing described installation head therein;

Relative position relation computing part, relative position relation computing part is based on the image that the described electronic component mounting part of the image of the described electronic component that obtains by described viewing head and the described electronic component of top installation divides, and calculates electronic component that is mounted nozzle and holds/keep in described every group and the relative position relation between the electronic component mounting part branch;

Relative position relation storage compartment, the relative position relation that each described group storage partly calculated by the described relative position relation computing in described every group therein;

The alignment information calculating section, based on each described group described interim positioning position information and described relative position relation of being stored into respectively in described interim positioning position information storage compartment and the described relative position relation storage compartment, calculate alignment information, this alignment information is used for described installation head location; With

The fitting operation processing section, be used for based on described alignment information, control described installation head transport sector, so that with respect to corresponding electronic component mounting part branch, sequentially locate by each electronic component that nozzle holds/keeps is installed, and the electronic component of described location is installed on the described corresponding electronic element mounting portion.

10. electronic component mounting apparatus as claimed in claim 9, wherein, described electronic component mounting apparatus comprises modifier at interval, this interval modifier changes the interval between described installation head and the described holding unit, so that after described viewing head is withdrawn from described space, described interval is narrowed down.

11. electronic component mounting apparatus as claimed in claim 10, wherein, described interval modifier comprises the holding unit rising mechanism of the described holding unit that raises; And the interval transversely of described holding unit is used as the evacuation situation of described viewing head.

12. electronic component mounting apparatus as claimed in claim 9, wherein, described viewing head comprises the circuit board imaging camera that the electronic component mounting part of an electronic component imaging camera of observing electronic component and an observation circuit board divides.

13. electronic component mounting apparatus as claimed in claim 12, wherein, the light path of the light path of described electronic component imaging camera and described circuit board imaging camera flatly is provided with; And

14. electronic component mounting apparatus as claimed in claim 9, wherein, described electronic component supply device comprises:

15. electronic component mounting apparatus as claimed in claim 9, wherein, described electronic component supply device comprises:

16. electronic component mounting apparatus as claimed in claim 9, wherein, described electronic component supply device comprises:

Described installation head transport sector is at described electronic component feed unit, described inverter up and down, with the described installation head of transmission on the described holding unit, so that the electronic component of described electronic component feed unit is transported to described inverter up and down by described installation head, and be installed on the circuit board of described holding device by described installation head by the electronic component of described inverter up and down reversing.

17. an electronic component mounting apparatus comprises:

The holding unit that is used for the holding circuit plate;

Installation head, this installation head are equipped with a plurality of installation nozzles that are used to hold/keep electronic component, and have the installation nozzle rising mechanism of the described a plurality of installation nozzles that are used for raising separately;

Electronic component supply device, this feedway supplies to described installation head with electronic component;

Interim positioning action processing section, interim positioning action processing section will sequentially be navigated to the upper space that electronic component mounting part divides by the electronic component that described a plurality of installation nozzles hold/keep by the described installation head transport sector of control;

Finder, this finder is equipped with a viewing head, organize described interim positioning electronic components and described electronic component mounting part branch for each, the space of described viewing head from limiting between interim described positioning electronic components and described electronic component mounting part branch obtains the image of interim positioning electronic components and the image that electronic component mounting part divides;

Relative position relation computing part, this relative position relation computing part is based on the image that the described electronic component mounting part of the image of the described electronic component that obtains by described viewing head and the described electronic component of top installation divides, and calculates the electronic component that is mounted nozzle and holds/keep of described each group and the relative position relation between the electronic component mounting part branch;

The position of described installation head and described relative position relation calculated alignment information when alignment information calculating section, this alignment information calculating section were performed based on described interim positioning action, and described alignment information is used to locate described installation head;

Alignment information storage compartment, this alignment information storage compartment store the described alignment information that the described alignment information calculating section to described each group calculates therein; With

The fitting operation processing section, this fitting operation processing section is based on described alignment information, control described installation head transport sector, so that with respect to corresponding electronic component mounting part branch, sequentially locate by each electronic component that nozzle holds/keeps is installed, and described positioning electronic components is installed on the described corresponding electronic element mounting portion.

18. electronic component mounting apparatus as claimed in claim 17, wherein, described electronic component mounting apparatus comprises modifier at interval, this interval modifier changes the interval between described installation head and the described holding unit, so that after described viewing head is withdrawn from described space, described interval is narrowed down.

19. electronic component mounting apparatus as claimed in claim 18, wherein, described interval modifier comprises the holding unit rising mechanism of the described holding unit that raises; And the interval transversely of described holding unit is used as the evacuation situation of described viewing head.

20. electronic component mounting apparatus as claimed in claim 17, wherein, described viewing head comprises the circuit board imaging camera that the electronic component mounting part of an electronic component imaging camera of observing electronic component and an observation circuit board divides.

21. electronic component mounting apparatus as claimed in claim 20, wherein, the light path of the light path of described electronic component imaging camera and described circuit board imaging camera flatly is provided with; And

22. electronic component mounting apparatus as claimed in claim 17, wherein, described electronic component supply device comprises:

23. electronic component mounting apparatus as claimed in claim 17, wherein, described electronic component supply device comprises:

24. electronic component mounting apparatus as claimed in claim 17, wherein, described electronic component supply device comprises:

25. an electronic component mounting method, wherein, electronic component is set at one of a plurality of installation nozzles in the installation head and holds and keep, and divides so that be installed in the electronic component mounting part of circuit board, and this method comprises:

Element keeps step, is used for holding/keep electronic component by described a plurality of installation nozzles of described installation head;

Interim positioning step is used for that the electronic component that is held by one of described a plurality of installation nozzles and keep is positioned at an electronic component mounting part provisionally and divides;

Observe step, wherein, obtain the image of interim positioning electronic components and the image that electronic component mounting part divides by viewing head, described viewing head is located in the space that limits between described interim positioning electronic components and the electronic component mounting part branch;

The relative position relation detection steps, be used for the described image that divides based on the described electronic component that in described observation step, obtains and described electronic component mounting part, survey described interim positioning electronic components and the described electronic component mounting part relative position relation between dividing;

Such step, this step are used for sequentially carrying out described interim positioning step, described observation step and described relative position relation detection steps to by other all electronic components that nozzle holds and keeps being installed;

Viewing head is withdrawn step, is used for withdrawing described viewing head from the upper space of circuit board; And

Such step, in this step, with respect to all electronic components, carry out this fitting operation, the electronic component that is promptly held by described a plurality of installation nozzles and keep is oriented to, and can electronic component be installed on the electronic component mounting part branch by transporting described installation head when the relative position relation that will detect in described relative position relation detection steps reflexes to wherein.

26. electronic component mounting method as claimed in claim 25 wherein, after described viewing head is withdrawn step, is carried out an interval and changed step, this changes step at interval and is used to make the interval between described circuit board and the described installation nozzle to narrow down; After this, carry out described fitting operation, described installation nozzle is raised simultaneously.

27. electronic component mounting method as claimed in claim 26, wherein, described interval changes step and causes that circuit board rises with respect to described installation head.

28. electronic component mounting method as claimed in claim 25, wherein, electronic component promptly wherein, is formed with a plurality of grand pieces corresponding to this electronic component on one surface; And described grand piece is installed on the electrode that the electronic component mounting part of described circuit board divides.

29. electronic component mounting method as claimed in claim 28 also comprises:

Such step, this step is used to reverse electronic component, described electronic component is supplied to by this way, be formed with grand piece above in the promptly described electronic component surperficial directed upward to, and the electronic component that this step is used for reversing supplies to described installation head.

30. electronic component mounting method as claimed in claim 28 also comprises:

Electronic component transports step, this step is used for by the electronic component transport sector electronic component being transported to inverter up and down, described electronic component is supplied to by this way, be formed with grand piece above in the promptly described electronic component surperficial directed upward to;

Reverse step up and down, this step is used for putting upside down electronic component by inverter up and down; And

Such step, this step are used for picking up the electronic component of reversing up and down by described installation head.

31. electronic component mounting method as claimed in claim 28 also comprises:

Electronic component transports step, is used for by described installation head electronic component being transported to up and down inverter, and described electronic component is supplied to by this way, be formed with grand piece above in the promptly described electronic component surperficial directed upward to;

Reverse step up and down, this step is used for putting upside down electronic component by inverter up and down; With

32. an electronic component mounting method, wherein, electronic component be set in a plurality of installation nozzles in the installation head each hold/keep divide so that be installed in the electronic component mounting part of circuit board, this method comprises:

Element keeps step, is used for described a plurality of installation nozzles by described installation head and holds and keep electronic component;

Observe step, wherein, the image that the image of the electronic component of one group of interim location and electronic component mounting part divide obtains by viewing head, and described viewing head is located in the space that limits between described interim positioning electronic components and the electronic component mounting part branch;

The relative position relation detection steps, be used for described image, survey the electronic component of described interim location and the relative position relation between the described electronic component mounting part branch based on described electronic component that obtains in described observation step and described electronic component mounting part branch;

Storing step is used for storing therein described relative position relation and corresponding to the interim positioning position information of the positional information of described interim location and installation head;

Such step, wherein, because held and all described electronic components that keep and the electronic component mounting part branch that described electronic component is installed on it by other installation nozzle for each group, sequentially carry out described interim positioning step, described observation step, described relative position relation detection steps and described storing step, so, store interim positioning position information and relative position relation for described each group;

Such step, in this step, based on the interim positioning position information of described storage and the relative position information of described storage, to described each batch total neat information of getting it right, then, described each group is all carried out this fitting operation, wherein, electronic component is oriented to, can be based on described alignment information, by transmitting described installation head, install with respect to the electronic component mounting part branch.

33. electronic component mounting method as claimed in claim 32 wherein, after described viewing head is withdrawn step, is carried out an interval and changed step, this changes step at interval and is used to make the interval between described circuit board and the described installation nozzle to narrow down; After this, carry out described fitting operation, described installation nozzle is raised simultaneously.

34. electronic component mounting method as claimed in claim 33, wherein, described interval changes step and causes that circuit board rises with respect to described installation head.

35. electronic component mounting method as claimed in claim 32, wherein, electronic component promptly wherein, is formed with a plurality of grand pieces corresponding to a kind of like this electronic component on one surface; And described grand piece is installed on the electrode that the electronic component mounting part of described circuit board divides.

36. electronic component mounting method as claimed in claim 35 also comprises:

37. electronic component mounting method as claimed in claim 35 also comprises:

Electronic component transports step, is used for by the electronic component transport sector electronic component being transported to up and down inverter, and described electronic component is supplied to by this way, be formed with grand piece above in the promptly described electronic component surperficial directed upward to;

Reverse step up and down, be used for putting upside down electronic component by inverter up and down; And

38. electronic component mounting method as claimed in claim 35 also comprises:

Reverse step up and down, be used for putting upside down electronic component by inverter up and down; With

A kind of like this step, this step are used for picking up the electronic component of reversing up and down by described installation head.

39. an electronic component mounting method, wherein, electronic component is set in a plurality of installation nozzles in the installation head each and holds and keep, and divides so that be installed in the electronic component mounting part of circuit board, and this method comprises:

Observe step, wherein, the image that the image of one group of interim positioning electronic components and electronic component mounting part divide obtains by viewing head, and described viewing head is located in the space that limits between described interim positioning electronic components and the electronic component mounting part branch;

The alignment information calculation procedure, be used for based on described relative position relation and with the corresponding interim positioning position information of the positional information of described interim location and installation head, calculate alignment information;

Storing step is used for storing therein the described alignment information that is calculated;

Such step, wherein, because held and all described electronic components that keep and the electronic component mounting part branch that described electronic component is installed on it by other installation nozzle for each group, all sequentially carry out described interim positioning step, described observation step, described relative position relation detection steps, described alignment information calculation procedure and described storing step, so, for described each group, all store alignment information;

Such step wherein, is all carried out this fitting operation to described each group, and wherein, based on described storage alignment information, electronic component is oriented to install with respect to the electronic component mounting part branch by transmitting described installation head.

40. electronic component mounting method as claimed in claim 39 wherein, after described viewing head is withdrawn step, is carried out an interval and changed step, this changes step at interval and is used to make the interval between described circuit board and the described installation nozzle to narrow down; After this, carry out described fitting operation, described installation nozzle is raised simultaneously.

41. electronic component mounting method as claimed in claim 39, wherein, described interval changes step and causes that circuit board rises with respect to described installation head.

42. electronic component mounting method as claimed in claim 39, wherein, electronic component promptly wherein, is formed with a plurality of grand pieces corresponding to a kind of like this electronic component on one surface; And described grand piece is installed on the electrode that the electronic component mounting part of described circuit board divides.

43. electronic component mounting method as claimed in claim 42 also comprises:

44. electronic component mounting method as claimed in claim 42 also comprises:

45. electronic component mounting method as claimed in claim 42 also comprises: