TWI397147B - Installation device and installation method of semiconductor wafer - Google Patents

Description

Semiconductor wafer mounting device and mounting method

The present invention relates to a mounting device and a mounting method for mounting a semiconductor chip on a substrate.

Generally, in a mounting apparatus for mounting a semiconductor wafer on a substrate, a supplied semiconductor wafer (hereinafter simply referred to as a wafer) and a substrate are imaged by an imaging means disposed between the semiconductor wafer and the substrate, and aligned according to the obtained image ( After alignment, the semiconductor wafer is mounted on the substrate. Specifically, an alignment mark is attached to the circuit formation surface of the semiconductor wafer on which the circuit is formed, and the semiconductor wafer is mounted on the substrate after the alignment of the alignment marks.

Here, the mounting substrate includes a mounting substrate (surface-up mounting substrate) in which the semiconductor wafer is mounted on the upper side of the circuit forming surface (face-up state), and the circuit forming surface faces downward. Mounting substrate (surface-down mounting substrate) mounted under the state of the (substrate side) (face down state).

For example, in the case where the substrate is mounted face down, since the alignment mark of the semiconductor wafer is held downward before mounting, alignment can be performed according to the alignment mark. Further, in the case where the substrate is mounted face up, since the alignment mark of the semiconductor wafer is held upward before mounting, the alignment mark cannot be visually confirmed, and alignment cannot be performed based on the alignment mark.

Thus, since the type of the mounting substrate to be produced is such that the alignment mark of the semiconductor wafer cannot be visually confirmed by inversion of the surface, the conventional mounting device only produces the face-up mounting substrate or the face-down mounting substrate. One is composed. On the other hand, when it is not possible to directly visually confirm the alignment mark, for example, a method of recognizing an alignment mark using an X-ray imaging apparatus or an infrared microscope is used as in Patent Document 1.

[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-183406

In recent years, for example, a thin substrate in which a semiconductor wafer is buried in a substrate such as a wafer embedded in a substrate has been developed, and a substrate-embedded substrate and a face-down mounting type are also required for such a substrate. However, in order to prepare the mounting device corresponding to the face up and face down, there is a problem that the installation space of the cost surface and the device cannot be secured. Therefore, it is necessary to change the device configuration of the mounting device in accordance with the type of the mounting substrate to be produced. However, such a device change is troublesome for the change operation and the adjustment work, and as a result, the production cost is deteriorated.

Further, in the case of using an X-ray imaging apparatus or an infrared microscope as in the above-described Patent Document 1, the configuration of the apparatus becomes complicated, and it takes time to recognize the alignment mark, and the tact time becomes long.

The present invention has been made in view of the above problems, and an object thereof is to provide a mounting device and a mounting method capable of producing a substrate of any type, such as a face-down mounting substrate and a face-up mounting substrate, in a common device. And it is possible to shorten the working time.

In order to solve the above problems, the mounting apparatus according to the present invention mounts a semiconductor wafer at a predetermined position of the substrate based on an alignment mark attached to one side of the supplied semiconductor wafer and an alignment mark attached to the substrate, and the features include: The wafer identification unit photographs the surface of the semiconductor wafer with the alignment mark and the back surface thereof while holding the semiconductor wafer, and the pre-mounting imaging device photographs the pre-installation state in a state in which the semiconductor wafer and the substrate before the mounting are opposed to each other. a surface of the semiconductor wafer on the substrate side and the substrate; the mounting portion performs alignment of the semiconductor wafer to mount the semiconductor wafer on the substrate; and a control device that drives and controls the device, wherein the wafer identification portion has a light emitting portion and a light receiving portion And a first photographing means for photographing the semiconductor wafer on the one hand side of the semiconductor wafer; and having a light-emitting portion and a light-receiving portion, and photographing the second photograph of the semiconductor wafer from a side opposite to the first photographing means Means, the first photographing means is photographed by the first photographing means Among the light irradiated to the semiconductor wafer, the light reflected by the surface of the semiconductor wafer on the first imaging means side is captured by the second imaging means by the second imaging means side toward the semiconductor wafer. Light reflected from the surface of the semiconductor wafer on the second imaging means side, the control device In the case where the image of the surface on the substrate side of the semiconductor wafer before mounting is photographed by the pre-mounting photographing apparatus as the surface of the semiconductor wafer, the position information of the alignment mark on the surface of the semiconductor wafer is used before the mounting. When the image of the substrate side of the semiconductor wafer before the mounting of the semiconductor wafer is the back surface of the semiconductor wafer, the image of the back surface of the semiconductor wafer obtained by the wafer identification portion and the alignment mark of the surface of the semiconductor wafer are obtained by the photographing device. In the relationship of the position information, the position of the back surface alignment mark in the back surface of the semiconductor wafer before mounting is calculated by the image matching processing, and the position of the back surface alignment mark is used as the position of the alignment mark at the time of mounting, and the mounting portion is controlled so as to Installed on a quasi-semiconductor wafer.

According to the mounting apparatus described above, the alignment mark position information in the image on the back side is obtained by taking an image obtained by photographing the surface of the semiconductor wafer with the alignment mark attached thereto and the back surface thereof, so that the surface of the semiconductor wafer cannot be photographed at the time of mounting. The alignment can be performed based on the alignment mark position information in the image on the back side. Therefore, in the case where the surface of the semiconductor wafer cannot be photographed at the time of mounting, the alignment can be performed according to the alignment mark position information, and in the case where the surface of the semiconductor wafer can be photographed at the time of mounting, the alignment in the image according to the surface can be performed. Mark the location for installation. Therefore, even a substrate of any type of the face-down mounting substrate and the face-up mounting substrate can be produced by a common mounting device without performing equipment change or adjustment work. Further, since alignment is made possible by the alignment information in the back image, it is possible to identify the alignment mark of the surface of the semiconductor wafer by using an X-ray imaging apparatus or the like as in the prior art, and it is not necessary to constitute a complicated device and recognize When aligning the mark The length is also shortened, so that the working time of the mounting device can be shortened.

According to this configuration, since the alignment target image of the semiconductor wafer is obtained from the image of the front surface corner portion and the back surface corner portion of the semiconductor wafer obtained by the wafer identification portion, each semiconductor wafer can be set in accordance with the alignment standard of the shape of each of the designated wafers. image. Therefore, compared with the case where the alignment reference image is prepared in advance according to the type of the semiconductor wafer, and the back alignment mark position is calculated using the alignment reference image, even if the back surface shape of the designated wafer is uneven or defective, It is also possible to set an alignment reference image in accordance with the shape of the back surface of the wafer, and it is possible to accurately calculate the position of the back alignment mark.

According to this configuration, in the case where the semiconductor wafer is held while the surface of the semiconductor wafer is imaged by the pre-mounting imaging device, the alignment mark is set as a reference, so that the semiconductor wafer can be aligned more reliably.

Further, the wafer identifying unit may be configured to arrange light for suppressing the light emitting portion from the second imaging means at least between the light receiving portion of the first imaging means and the optical path of the light emitting portion of the second imaging means. A filter received by the light receiving unit of the first imaging means is disposed at least between the light receiving portion of the second imaging means and the optical path of the light emitting portion of the first imaging means to suppress the light emitting portion from the first imaging means The light is received by the light receiving portion of the second photographing means.

According to this configuration, since the first imaging means and the second imaging means each have a filter for suppressing the transmission of light from the light-emitting portion on the other side, the light can be captured without being affected by the light from the light-emitting portion on the other side. . According to this, the respective light-emitting portions of the first imaging means and the second imaging means can be simultaneously illuminated to capture the surface and the back surface of the semiconductor wafer. therefore, In order to avoid the influence of the light-emitting portions of each other, the time required for the imaging of the semiconductor wafer can be shortened by comparing the first imaging means with the second imaging means at different timings, and the entire mounting device can be shortened. Working time.

Further, the configuration may further include a post-mounting imaging device that captures a state in which the semiconductor wafer is mounted on the substrate, and the control device calculates the front surface of the semiconductor wafer when the post-mounting imaging device captures the back surface of the semiconductor wafer. The offset amount of the back alignment mark position and the alignment mark position of the substrate determines whether the mounting state is good or bad.

According to this configuration, even when the back surface of the semiconductor wafer is imaged, that is, when the surface of the alignment mark cannot be visually confirmed after mounting, the back alignment mark position can be used as a reference. Make a decision. Therefore, even if the substrate of any type of the face-down mounting substrate and the face-up mounting substrate is not subjected to device change or adjustment work, it is possible to determine the quality of the mounting substrate.

Further, it is preferable that the pre-installation photographing device and the post-installation photographing device are configured by a common two-view camera.

According to this configuration, the pre-installation photographing device and the post-installation photographing device can be configured by a common camera, and the device configuration can be simplified.

Further, the wafer supply unit may be provided with a wafer supply unit that reverses the surface of the semiconductor wafer, and the semiconductor wafer is supplied to the wafer identification unit in a face-up state or a face-down state.

According to this configuration, the semiconductor wafer can be selectively supplied with the semiconductor wafer in a face-up state and a face-down state.

In order to solve the above problems, according to the mounting method according to the present invention, a semiconductor wafer is mounted on a predetermined position of the substrate in accordance with an alignment mark attached to one surface of the supplied semiconductor wafer and an alignment mark attached to the substrate. The method includes: a reference image acquisition process, wherein an image obtained by simultaneously photographing a surface of the semiconductor wafer with an alignment mark of a semiconductor wafer and a back surface thereof, and an alignment mark position on a surface of the semiconductor wafer and a part of a shape of a back surface of the semiconductor wafer Providing an alignment, obtaining an alignment reference image, and a pre-installation image acquisition process, and obtaining a surface of the substrate side of the semiconductor wafer before mounting and an image of the substrate in a state in which the semiconductor wafer before mounting is opposed to the substrate; a quasi-marking position acquisition process for obtaining an alignment mark position of the semiconductor wafer and an alignment mark position of the substrate by the image obtained by the pre-installation image acquisition process; and an installation process for obtaining a process according to the pre-installation alignment mark position Alignment mark position and base of the obtained semiconductor wafer The alignment mark position is used to align the semiconductor wafer, and the semiconductor wafer is mounted on the substrate, wherein in the pre-mounting alignment mark position obtaining process, the substrate side of the semiconductor wafer before the mounting is performed by the pre-mount image acquisition process In the case where the image obtained by the surface is the surface of the semiconductor wafer, the position of the alignment mark on the surface of the semiconductor wafer is used as the position of the alignment mark at the time of mounting, and the pre-installation image acquisition process is performed by the pre-installation semiconductor. The image obtained on the substrate side of the wafer is the back side of the aforementioned semiconductor wafer In the case of the image of the back surface of the semiconductor wafer obtained by the reference image acquisition process and the position information of the alignment mark on the surface of the semiconductor wafer, the position of the back alignment mark is calculated by the image matching process, and the back surface is The alignment mark position is used as the alignment mark position at the time of mounting, and the aforementioned mounting portion is controlled to be mounted in alignment with the semiconductor wafer.

According to the mounting method, in the case where the image obtained by the pre-installation image acquisition process is an image of the back surface of the semiconductor wafer, the back alignment mark position obtained by the pre-mounting alignment mark position obtaining process is mounted. Since the semiconductor wafer is on the substrate, it can be mounted with the back alignment mark position as a reference even if it is held in a state where the alignment mark cannot be visually confirmed at the time of mounting. Therefore, even a substrate of any type of the face-down mounting substrate and the face-up mounting substrate can be produced by a common mounting device without performing equipment change or adjustment work. Further, since the surface of the semiconductor wafer and the back surface thereof are simultaneously imaged in the wafer identification process, the time required for photographing the semiconductor wafer can be shortened as compared with the case of photographing at different timings, and the operation time of the mounting device can be shortened.

Further, it is also possible to have a configuration in which the image acquisition process is performed after the mounting process, and the mounted semiconductor wafer and the substrate are imaged after the mounting process, and the image of the semiconductor wafer and the image of the substrate are obtained; and the alignment mark position is obtained after the mounting process. Obtaining an alignment mark position of the semiconductor wafer mounted on the substrate and an alignment mark position of the substrate by the image obtained by the image mounting process after the mounting; and Inspecting the process, checking whether the semiconductor wafer is mounted on the predetermined position of the substrate according to the alignment mark position of the semiconductor wafer obtained by the pre-installation alignment mark position obtaining process and the alignment mark position of the substrate, wherein after the aforementioned mounting In the quasi-marking position obtaining process, when the image on the back side of the semiconductor wafer is acquired, the image matching processing is performed based on the alignment reference image, and the back alignment mark position is calculated, and the back alignment mark position is used as the alignment. Mark the location.

According to this configuration, even when the back surface of the semiconductor wafer is imaged, that is, when the surface of the alignment mark cannot be visually confirmed after mounting, the back alignment mark position can be used as a reference. Make a decision. Therefore, even if the substrate of any type of the face-down mounting substrate and the face-up mounting substrate is not subjected to device change or adjustment work, the mounting substrate can be inspected by a common mounting device.

According to the mounting apparatus and the mounting method of the present invention, even a substrate of any type in which the substrate is mounted face down and the substrate is mounted face up can be produced by a common mounting device. Moreover, the working time of the mounting device can be shortened.

Embodiments of the present invention will be described using the drawings.

Fig. 1 is a view schematically showing a mounting device according to the embodiment.

The mounting device in the present embodiment mounts the supplied semiconductor wafer 10 (hereinafter referred to as the wafer 10) on the substrate 20, and has the wafer supply portion 3 and the wafer. The identification unit 4 and the mounting unit 5. The supplied semiconductor wafer 10 is transported by the wafer supply unit 3 to the wafer identification unit 4 and the mounting unit 5 via a transport device 6, and is mounted on the substrate by performing predetermined processing on the devices. The predetermined location on the 20th.

In the following description, the direction in which the wafer 10 is transported by the transport device 6 is taken as the X-axis direction, and the direction orthogonal to the horizontal plane in the X-axis direction is referred to as the Y-axis direction, and is orthogonal to the X-axis and The direction of both of the Y-axis directions will be described as the Z-axis direction.

Here, the supplied wafer 10 is carried on a chip tray 7, and all of the wafers 10 are on a circuit forming surface (hereinafter simply referred to as a surface 11, and the back side of the surface 11 is referred to as a back surface 12) It is carried in an upward state (face up state). Further, two alignment marks (x marks in Fig. 11) are attached to the corners of the surface 11 of the wafer 10.

In the wafer supply unit 3, the designated wafer 10a (the wafer 10 to be mounted) is taken out from the wafer tray 7, and is supplied to the transport device 6, and includes a transfer head 31 and a reversal tool 32.

The transfer head 31 is held by the predetermined wafer 10a, and is transported to the transport device 6 in this state. Specifically, a drive device (not shown) is attached to the transfer head 31, and the transfer head 31 is moved in the X-axis direction (the left-right direction in FIG. 1) and the Y-axis direction by driving the drive device (in the figure). 1 is the direction through the paper). Accordingly, the transfer head 31 can be freely scanned on the XY plane of the wafer tray 7, and the wafer 10 can be transferred to the transport device 6.

Further, the transfer head 31 has a suction hole formed in the head surface 31a that is in contact with the designated wafer 10a, and the suction hole and the vacuum pump 9 (refer to the figure) 4) is linked. In other words, by operating the vacuum pump 9, a negative pressure is generated in the suction hole, and the designated wafer 10a can be adsorbed. Further, the transfer head 31 is configured to be expandable and contractible in the Z-axis direction (vertical direction in FIG. 1). Accordingly, the transfer head 31 can be lowered to the wafer tray 7 to directly adsorb and hold the designated wafer 10. In other words, the transfer head 31 can be supplied to the transport device 6 while maintaining the posture in which the designated wafer 10a is placed on the wafer tray 7 (in the present embodiment, the posture facing upward).

Further, the inversion tool 32 reverses the front and back of the designated wafer 10a and supplies it to the transfer head 31. Specifically, the inversion tool 32 has the adsorption head 32a that adsorbs and holds the designated wafer 10a, and the designated wafer 10a can be reversed by rotating the adsorption head 32a.

The adsorption head 32a has an adsorption surface 32b for adsorbing the designated wafer 10a. A suction port is formed in the adsorption surface 32b, and the suction port is connected to the vacuum pump 9. Therefore, by operating the vacuum pump 9, a negative pressure is generated at the suction port, and the wafer 10 can be held by the adsorption surface 32b.

Further, a rotation driving device (not shown) is coupled to the reversing tool 32, and the reversing tool 32 is rotated about the Y-axis by operating the rotation driving device.

According to this, by inverting the inversion tool 32 in a state where the designated wafer 10a on the wafer tray 7 is adsorbed to the adsorption head 32a, the designated wafer 10a can be oriented upward from the surface 11 of the designated wafer 10a (facing) The upper state) is reversed to the downward posture (face down state).

Moreover, the designated wafer 10a inverted by the inversion tool 32 is adsorbed and held by the transfer head 31, and the designated wafer 10a is transferred to the transport package. With reference to 6, the designated wafer 10a can be supplied to the transport device 6 in a face-down state.

Further, a drive device (not shown) is attached to the reversing tool 32, and the reversing tool 32 is moved in the X-axis direction and the Y-axis direction by driving the drive device. That is, by driving the driving means, the adsorption head 32a of the reversing tool 32 can be positioned on the designated wafer 10a, and the reversing tool 32 can be placed at a hunting position to be avoided by the supplied wafer tray 7.

Therefore, in the case where the designated wafer 10a is supplied to the transport device 6 in the face-up state, the wafer 10 is transferred to the transport device only by the transfer head 31 in a state where the reversing tool 32 is placed at the standby position. 6. Further, when the designated wafer 10a is supplied to the transport device 6 in a face-down state, the designated wafer 10a is reversed by the inversion tool 32, and the designated wafer 10a in this state is adsorbed by the transfer head 31. It is transferred to the transport device 6. In this manner, when the designated wafer 10a supplied to the wafer tray 7 in the face-up state is transferred to the transport device 6, it is possible to supply the supply in the face-up state or the face-down state.

The transport device 6 transports the designated wafer 10a supplied from the wafer supply unit 3 to the wafer identification unit 4 and the mounting unit 5. Specifically, the transport device 6 has a chip slider 61 that carries the wafer 10 and a driving device 6a. Further, by operating the driving device 6a, the wafer slider 61 can be moved in the X-axis direction and can be stopped at a predetermined position. In the present embodiment, the wafer slider 61 can be stopped at the wafer supply position (position A), the wafer identification position (position B), and the wafer delivery position (position C), respectively. Further, the wafer supply unit 3 is supplied with the designated wafer 10a at the wafer supply position (position A), and the surface 11 and the back surface 12 of the designated wafer 10a are imaged at the wafer identification position (position B) at the wafer delivery position (position C). The delivery operation of the designated wafer 10a in the mounting portion 5 is performed.

Here, FIG. 2 is a view in which the wafer identification unit 4 is enlarged. As shown in Fig. 2, the wafer slider 61 has a mounting portion 61a for carrying the designated wafer 10a and a mounting portion 61b orthogonal to the carrying portion 61a, and the mounting portion 61b is coupled to the driving device 6a.

The carrier portion 61a is formed in a flat shape and carries a portion of the designated wafer 10a, that is, the wafer carrying region 62 is formed by transmitting light in the thickness direction of the carrier portion 61a. Specifically, the wafer carrying region 62 of the carrier portion 61a is formed by a glass member and is formed over a wider range than the outer shape of the designated wafer 10a. According to this, when the light is irradiated from the upper side (or the lower side), the light is transmitted on the lower side (or the upper side), and the designated wafer 10a carried on the top surface of the carrying portion 61a can be visually confirmed by the bottom surface side of the carrying portion 61a.

The wafer identification unit 4 is for capturing the surface 11 of the designated wafer 10a carried on the transport device 6 and the back surface 12 of the corresponding surface 11. As shown in Figs. 1 and 2, the wafer identification unit 4 has two imaging means 41 and 42 and a support frame 43 that connects the imaging means 41 and 42 so as to face each other in the vertical direction. The support frame 43 is connected and supported in a state in which the two imaging means 41, 42 are disposed slightly coaxially in the vertical direction. Therefore, by imaging with the two imaging means 41, 42, the image 45 (see FIG. 11(a)) specifying the corner of the wafer surface 11 and the image 46 corresponding to the back surface 12 of the surface 11 can be imaged (refer to FIG. 11). (b)). Moreover, a driving device is mounted on the support frame 43 (not shown) In the driving control of the driving device, the photographing means 41, 42 can be moved to the photographing position of the photographing wafer 10 and the standby position from the photographing position to a direction (Y-axis direction) which is approximately perpendicular to the transport direction (Y-axis direction). . That is, in the case where the transport device 6 is stopped at the wafer identification position (position B), the photographing device is moved to the photographing position, so that the upper and lower photographing means 41, 42 are positioned on the extension line of the wafer carrying region 62, and the photograph can be taken. The designated wafer 10a carried on the carrying portion 61a.

Here, FIG. 3 is a schematic view showing the photographing means 41, 42. As shown in FIG. 3, the two imaging means 41, 42, that is, the upper imaging means 41 and the lower imaging means 42 have the same configuration. The upper photographing means includes a photographing main body portion 41a and a mirror 41b, and the photographing object reflected by the mirror 41b is photographed by the photographing main body portion 41a. Specifically, the imaging main unit 41a includes a CCD camera 41c (light receiving unit according to the present invention), an illumination 41d (light emitting unit according to the present invention), and a mirror case (mirror case) that connects the CCD camera 41c and the illumination unit 41d. 41e, a half-mirror 41f is accommodated in the mirror box 41e at a position where the CCD camera 41c intersects the optical path of the illumination 41d. According to this, as shown by the solid line in Fig. 3, the light irradiated by the illumination 41d is reflected by the half mirror 41f to the mirror 41b side, and is reflected by the mirror 41b to the object side. Then, after being reflected by the object to be photographed, the light reflected by the mirror 41b to the side of the photographing main body portion 41a passes through the half mirror 41f, and is received by the CCD camera 41c. That is, the light irradiated by the illumination 41d is reflected by the designated wafer 10a, the reflected light is received by the CCD camera 41c, and the designated wafer 10a is imaged.

Further, the lower photographing means 42 has a photographing main body portion 42a and a mirror 42b, and the photographing main body portion 42a includes a CCD camera 42c and an illumination 42d, and a mirror box 42e that connects the CCD camera 42c and the illumination 42d, and has a semi-reflection in the mirror box 42e. Mirror 42f. Since the lower imaging device 42 has the same configuration as the upper imaging device 41, detailed description thereof will be omitted.

Further, in the present embodiment, the alignment marks in the corner portions of the surface 11 of the designated wafer 10a and the corner portions of the back surface 12 thereof can be imaged by the upper and lower side imaging means 41, 42. For example, in a case where the surface 11 of the designated wafer 10a is carried to the carrying portion 61a of the transport device 6 in the upward state (face up state), the upper photographing means 41 photographs the designated wafer 10a with the alignment mark attached thereto. At the corner of the surface 11, the corner portion of the back surface 12 of the designated wafer 10a corresponding to the corner portion of the surface 11 is imaged by the lower side photographing means 42.

In addition, since the surface 11 and the back surface 12 of the wafer 10 are finally processed into a mirror surface, the light from the illumination 41d, 42d irradiated on the surface 11 or the back surface 12 of the wafer 10 is substantially totally reflected by the alignment mark and the wafer bearing area. Since the glass member of 62 hardly reflects light, the contrast of the contrast is sufficiently obtained in the CCD cameras 41c and 42c, and the alignment mark and the corner portion of the back surface 12 of the designated wafer 10a can be accurately photographed.

In the upper photographing means 41, the upper filter 41g is disposed between the mirror 41b and the photographing main body portion 41a, whereby the light of the illumination 42d of the lower photographing means 42 is suppressed from entering the CCD camera 41c. Further, the lower side photographing means 42 is disposed with the lower side filter 42g between the mirror 42b and the photographing main body portion 42a, whereby the illumination 41d of the upper side photographing means 41 is suppressed. The light is incident on the CCD camera 42c. In the present embodiment, since the red LED is disposed in the illumination 41d of the upper imaging device 41, and the blue LED is disposed on the illumination 42d of the lower imaging device 42, the blue filter is disposed on the upper filter 41g. The member of the light is provided with a member for suppressing light of the red LED in the lower filter 42g.

As described above, by arranging the upper and lower filters 41g and 42g, the upper surface of the designated wafer 10a and the back surface 12 can be simultaneously imaged by the upper image capturing means 41 and the lower image capturing means 42. That is, as shown in FIG. 3, when the upper side photographing means 41 and the lower side photographing means 42 are simultaneously photographed, the lower side photographing means 42 is guided by the light reflected from the back surface 12 of the wafer 10a and the upper side of the through wafer carrying area 62. The illumination light of 41 is incident, but the transmission of the illumination light of the upper photographing means 41 is suppressed by the presence of the lower side filter 42g. Therefore, the CCD camera 42c of the lower photographing means 42 specifies that only the reflected light of the back surface 12 of the wafer 10a is incident. Similarly, only the reflected light of the surface 11 of the wafer 10 is incident on the CCD camera 41c of the upper image capturing means 41. In other words, even if the upper and lower side photographing means 41, 42 are simultaneously photographed by the presence of the upper and lower side filters 41g, 42g, the photographing means on the other side can be omitted (the lower side photographing means 42) The photographing is performed by the influence of the illumination light in the upper photographing means 41). Therefore, the difference in contrast between the CCD cameras 41c and 42c can be sufficiently obtained, and the alignment mark and the corner portion of the back surface 12 of the wafer 10a can be accurately photographed.

The mounting portion 5 is mounted by aligning the supplied designated wafer 10a with a predetermined position of the substrate 20. The mounting portion 5 has a mounting head 51 for holding the supplied designated wafer 10a and a mounting table 52 for holding the substrate 20 to borrow The designated wafer 10a carried by the transport device 6 is sucked and held by the mounting head 51, and can be attached to the substrate 20 held by the mounting table 52 by the mounting head 51.

The mounting head 51 is configured to adsorb and hold the designated wafer 10a. Specifically, an adsorption hole is formed in a portion in contact with the designated wafer 10a, and the adsorption hole is in communication with the vacuum pump 9. Therefore, by operating the vacuum pump 9 while the mounting head 51 abuts against the designated wafer 10a, an attractive force can be generated in the adsorption hole to adsorb and hold the designated wafer 10a on the mounting head 51. Further, a driving device 51a is attached to the mounting head 51, and the driving device 51a is movable by a driving control in a direction (up and down direction) in which the mounting table 52 is attached and detached, and can be stopped at a predetermined position. According to this, in a state where the transporting device 6 carrying the designated wafer 10a is stopped at the wafer delivery position (position C), the designated wafer 10a can be delivered from the transporting device 6 to the mounting head by lowering the adsorption holding designated wafer 10a by the mounting head 51. 51.

The aforementioned mounting table 52 is a holding substrate 20. Specifically, a suction hole that communicates with the vacuum pump 9 is disposed on the table surface 52a, and the suction force is generated in the suction hole by operating the vacuum pump 9, and the substrate 20 is adsorbed and held on the stage. Further, the mounting base 52 is provided with a positioning mechanism 52b, and the table surface 52a is movable in the X-axis direction and the Y-axis direction, and is configured to rotate around the Z-axis. Therefore, by controlling the positioning mechanism 52b by the drive, the mounting position of the designated wafer 10a of the mounting head 51 and the substrate 20 is aligned, and the designated wafer 10a can be aligned with the mounting position on the substrate 20.

Further, an imaging device 8 is disposed in the mounting portion 5. The photographing device 8 captures the designated wafer 10a and the substrate 20 in order to align the designated wafer 10a. The imaging device 8 in the present embodiment is a two-view camera 8a having an up camera and a down camera, and the upper image and the lower image can be obtained by one camera. Specifically, the two-view camera 8a is configured to advance and retreat to a photographing position that is photographed between the mounting head 51 and the mounting table 52, and is configured to be evacuated from the mounting portion 5, and is configured to be located at the photographing position. Shoot the upper side and the lower side in the state. That is, in a state before the designated wafer 10a is mounted, the designated wafer 10a adsorbed to the mounting head 51 is photographed by an upward camera, and the substrate 20 is photographed by a downward camera (pre-installation photographing apparatus of the present invention). Further, in a state after the designated wafer 10a is mounted, the designated wafer 10a on the substrate 20 and the substrate 20 (the post-mounting photographing device of the present invention) can be photographed with a downward camera.

Fig. 4 is a block diagram showing a control system of the control device 90 disposed in the mounting device. As shown in Fig. 4, the mounting device is a control device 90 equipped with a drive for controlling the various units described above. The control device 90 includes a control main unit 91, a drive control unit 92, an image processing unit 93, an imaging device control unit 94, an external device control unit 95, and an input unit 96.

The control main unit 91 includes a CPU that performs a well-known logic calculation, a ROM that stores various programs such as the CPU in advance, a RAM that stores various kinds of data at a time during the operation of the device, and various programs or OSs; Memory HDD of various materials such as production programs. Further, the control main unit 91 includes a main control unit 91a, a reference video setting unit 91b, a comparison calculation unit 91c, an offset calculation unit 91d, a determination unit 91e, and a storage unit 91f.

The main control unit 91a is a drive device that drives and controls various units via a drive control unit 92 that performs a series of mounting operations in accordance with a program stored in advance. 51a, 51b, etc. are placed, and various calculations necessary for the mounting operation are performed. Further, based on the image obtained by the wafer identification unit 4, the alignment mark position P (P1 (X1, Y1)) and P2 (X2, Y2) in the back image of the designated wafer 10a is calculated, and accordingly, the control is mounted. The alignment action in section 5.

The reference image setting unit 91b sets an alignment reference image S corresponding to the image of the alignment mark position P of the surface 11 of the designated wafer 10a and the image of the corner of the designated wafer back surface 12. Specifically, the alignment mark position P is calculated from the image 45 (Fig. 11 (a)) of the surface 11 of the designated wafer 10a obtained by the wafer identification portion 4. Then, the alignment mark position P (back alignment mark position P') in the image 46 of the back surface 12 corresponding to the image 45 of the surface 11 is calculated from the positional relationship between the image 45 of the surface 11 and the alignment mark position P. The corresponding back surface alignment mark position P' and the back surface image 46 are set as the reference image (alignment reference image S) for the image detection alignment mark position P on the back surface 12 of the designated wafer 10a.

The comparison calculation unit 91c calculates the back alignment mark position P' from the obtained image on the back side by the image of the back surface of the designated wafer 10a obtained by the comparison and the alignment reference image S. That is, the image detection and alignment of the designated wafer back surface 12 are performed by aligning the reference image S (pattern matching) with respect to the image of the designated wafer back surface 12 obtained by the two-view camera 8a in the mounting portion 5. The same shape portion of the quasi-reference image S. Then, the back alignment mark position P' is calculated from the same shape portion to be detected, that is, the position of the back alignment mark in the same shape portion is calculated from the relationship between the alignment reference image S and the back alignment mark position P'. P'.

The offset calculation unit 91d is a bit of the calculation substrate 20 and the designated wafer 10a. Set the offset in the relationship. Specifically, the alignment mark position Q of the current designated wafer 10a, the alignment mark position Q of the substrate 20 (now the alignment mark position Pq), and the alignment mark position P are calculated for the predetermined alignment mark position Q of the substrate 20. (Set the offset of the alignment mark position Pqo). That is, the offset between the current alignment mark position Pq and the set alignment mark position Pqo (X, Y, θ) of the designated wafer 10a before the installation and the current alignment mark position Pq of the designated wafer 10a after mounting are The post-installation offset amount (X', Y', θ') of the alignment mark position Pqo is set.

Here, the alignment mark position Pq is now the alignment of the alignment mark position P attached to the surface 11 of the designated wafer 10a to the substrate 20 in the case where the surface 11 of the designated wafer 10a is imaged by the 2-view camera 8a. Mark position Q. Further, in the case where the back surface 12 of the designated wafer 10a is imaged, the alignment mark position Q of the substrate 20 by the back surface alignment mark position P' calculated by the comparison calculation unit 91c.

The determination unit 91e determines whether or not the offset amount calculated by the offset amount calculation unit 91d and the post-installation offset amount are within a tolerance. Specifically, it is determined whether or not the offset amount and the post-installation offset amount calculated by the offset amount calculation unit 91d are within the range of the allowable offset amount of the memory unit 91f. Then, the determination result is output to the main control unit 91a. Further, the main control unit 91a drives and controls the mounting head 51 and the mounting base 52 via the drive control unit 92 based on the determination result.

The memory unit 91f is for storing various materials, and stores calculation results and the like at one time. Specifically, the contents of the setting alignment mark position Pqo, the current alignment mark position Pq, and the setting alignment mark position Pqo are stored. Xu offset data and so on. Further, the image data captured by the above-described side and lower side imaging means 41, 42 and 2 of the field of view camera 8a or the data of the alignment reference image S created by the reference image setting unit 91b are temporarily stored.

The drive control unit 92 controls the drive devices 51a and 52b of each unit such as the wafer supply unit 3, the wafer identification unit 4, and the mounting unit 5 based on a control signal from the control unit main body.

The image processing unit 93 applies predetermined processing to the video signals output from the upper and lower imaging devices 41, 42 and 2 to the visual field camera 8a, and generates image data suitable for image recognition, and outputs the image data to the control unit main body.

The photographing device control unit 94 controls the driving of the upper and lower photographing means 41, 42 and the two-view camera 8a based on a control signal from the main body of the control unit. Further, the illuminations 41d and 42d of the upper and lower imaging devices 41 and 42 are also controlled.

The external device control unit 95 is a drive that controls an external device such as the vacuum pump 9.

The input unit 96 performs various settings and data input on the main body of the control unit using a keyboard 71 or a touch panel 72. Specifically, the setting and input of various materials such as setting the alignment mark position Pqo data can be performed by the operator side. Further, the mounting of the designated wafer 10a on the substrate 20 in the face-up state or in the face-down state can be selected using these input means.

Next, the operation in the mounting device will be described with reference to the flowcharts shown in FIGS. 5 to 10.

First, the supply of the wafer tray 7 is performed by the mounting device (step S1). in The wafer disk 7 is loaded with a plurality of semiconductor wafers 10 in a face-up state, and is set by a device in the front process to a predetermined position of the wafer supply portion 3.

When the wafer tray 7 is supplied to the wafer supply unit 3, it is determined whether or not the mounted wafer 10a to be mounted is mounted on the substrate 20 in a face-up state (step S2). In the present embodiment, it is judged by the input information input by the operator. Specifically, the preparation work before the installation is performed by the touch panel 72 through the operator inputting the type of the mounted mounting substrate 20 (face-up mounting, face-down mounting), and then producing the substrate in the memory portion 91f of the control device 90. Information is remembered. That is, it is judged whether or not the designated wafer 10a is mounted on the substrate 20 in a face-up state based on the production substrate information. Further, in the case of mounting in the face-up state, the step S2 advances to the YES direction, and the designated wafer 10a on the wafer tray 7 is suction-held by the adsorption head 32a (step S3). Further, in the case of being mounted in the face-down state, the direction proceeding to NO in step S2 is held in a state where the designated wafer 10a is reversed by the reversing tool 32, and the designation is held by the adsorption head 32a. Wafer 10a (step S4). That is, in the adsorption head 32a, the surface 11 of the designated wafer 10a is adsorbed and held in a downward state.

Next, delivery of the designated wafer 10a is performed at the transport device 6 (step S5). That is, the adsorption head 32a moves to the side of the transport device 6 (on the right side in FIG. 1), and the designated wafer 10a is carried on the carrier portion 61a of the wafer slider 61 stopped at the wafer supply position (position A). At this time, the designated wafer 10a is carried in the wafer carrying region 62 of the carrying portion 61a.

If the delivery of the designated wafer 10a to the delivery device 6 is completed, then the pair is performed. Acquisition of the quasi-reference image S (alignment mark position information) (the reference image acquisition process in step S6). That is, when the designated wafer 10a is carried on the transport device 6, the wafer slider 61 is moved to the wafer identification position (position B), and the designated wafer 10a is photographed at the position, and the alignment reference image of the designated wafer 10a is obtained. S.

Specifically, according to the flowchart of FIG. 6, the upper side photographing means 41 and the lower side photographing means 42 simultaneously photograph the surface 11 and the back surface 12 of the designated wafer 10a, and obtain the corners of the designated wafer surface 11 shown in FIG. The image 45 and the image 46 of the corner of the back surface 12 of the image 45 corresponding to the corner of the surface 11 (step S21). Then, the alignment mark positions P (P1 and P2) are obtained from the image 45 of the designated wafer surface 11 (step S22). The alignment mark position P is detected by the image 45 of the corner portion of the designated wafer surface 11 in comparison with the image of the alignment mark previously stored in the designated wafer 10a of the memory portion 91f. According to this, the alignment mark position P of the designated wafer surface 11 is obtained.

On the other hand, the back surface alignment mark position P' in the back surface 12 is obtained from the image 46 in the corner portion of the designated wafer back surface 12 shown in Fig. 11 (b) (step S23). Specifically, the back surface alignment mark position P' in the back surface 12 of the designated wafer is calculated by associating the image 46 of the corner portion of the designated wafer back surface 12 with the image 45 of the corner portion of the surface 11. In other words, since the upper photographing means 41 and the lower photographing means 42 are disposed slightly coaxially, the image obtained by the upper photographing means 41 and the lower photographing means 42 is the surface 11 in the same corner portion of the designated wafer 10a. And the image of the back side 12. Therefore, the positional relationship between the end portion of the designated wafer 10a on the surface image 45 and the alignment mark position P (coordinate) is obtained to be the aforementioned in the back image 46 of the designated wafer 10a. The position of the positional relationship is calculated as the back alignment mark position P' (P1', P2') (indicated by a broken line in Fig. 11(b)). Then, the calculated back alignment mark position P' is associated with the image 46 on the back surface of the designated wafer 10a, and is stored in the memory portion 91f as the alignment reference image S (step S24).

When the alignment reference image S in the wafer identification unit 4 is acquired, the wafer slider 61 is moved to the wafer delivery position (position C), and the delivery of the designated wafer 10a is performed at the mounting portion 5 (step S7). Specifically, if the wafer slider 61 is stopped at the wafer delivery position, the mounting head 51 is lowered to abut the designated wafer 10a, and the adsorption is carried on the designated wafer 10a of the wafer slider 61. Then, the mounting head 51 is raised to a height position which does not hinder the movement of the wafer slider 61, in which the designated wafer 10a is stopped in the state of adsorption holding.

Next, the image of the designated wafer 10a and the substrate 20 before mounting is obtained, and the designated wafer 10a is mounted on the substrate 20 (pre-installation image acquisition process in step S8). Specifically, after the wafer slider 61 at the wafer delivery position (position C) is moved to the wafer supply position (position A), after receiving the next piece of the designated wafer 10a, the 2-view camera 8a at the retracted position enters the mounting head 51 and is mounted. Between the stages 52, the designated wafer 10a sucked and held by the mounting head 51 is photographed by an upward camera, and the substrate 20 is photographed by a downward camera to obtain images of the designated wafers 10a and 20.

Then, the alignment mark position Q of the substrate 20 and the alignment mark position P of the designated wafer 10a (pre-installation alignment mark position acquisition process) are obtained from the obtained image. Specifically, the substrate is obtained by comparing the image of the substrate 20 obtained by the comparison with the image of the alignment mark of the substrate 20 previously stored in the memory portion 91f. The alignment mark position 20 of 20 is (step S9).

Then, the alignment mark position P of the designated wafer 10a is obtained from the obtained image of the designated wafer 10a (step S10). Here, the posture of the designated wafer 10a that is adsorbed and held by the mounting head 51 is different depending on the case of face-up mounting and the case of face-down mounting. That is, in the case where the face wafer 10a is mounted face up, the designated wafer 10a is held by the mounting head 51 in the face up state, so that the back surface 12 of the designated wafer 10a is photographed in the two-view camera 8a. Further, in the case where the face wafer 10a is mounted face down, the designated wafer 10a is held by the mounting head 51 in the face-down state, so that the surface 11 of the wafer 10a is photographed in the two-view camera 8a. Therefore, the processing of this step S10 is performed in accordance with the production substrate information input in step S2 being face-up mounted or face-down mounted. That is, in the case of face-up mounting, processing is performed in accordance with the flowchart of Fig. 7, and in the case of face-down mounting, processing is performed in accordance with the flowchart of Fig. 8. Further, in the present embodiment, the processing of Fig. 7 or Fig. 8 is automatically selected in accordance with the production substrate information input in step S2.

Further, in the case where the production substrate information is mounted face up, the image of the designated wafer 10a obtained by the two-view camera 8a, that is, the image of the back surface 12 of the wafer 10a is first obtained in accordance with the flowchart of FIG. S31), and reading of the alignment reference image S memorized in the memory unit 91f is performed (step S32). Then, by aligning the reference image S with respect to the image of the back surface 12 of the designated wafer 10a, the alignment reference image S (the corner portion of the wafer back surface 12) in the image of the back surface 12 of the designated wafer 10a is detected (step S33). Then, the aligned alignment image S and the back alignment mark are memorized The relationship of the position P' is calculated as the back alignment mark position P' in the obtained image of the back surface 12 (step S34). Then, from the relationship between the calculated back alignment mark position P' and the alignment mark position Q of the substrate 20, the alignment mark position Q of the substrate 20 is regarded as the current alignment mark position by the back alignment mark position P'. It is set by Pq (step S35).

Further, in the case where the production substrate information is mounted face down, the image of the surface 11 of the designated wafer 10a is obtained by the two-view camera 8a, so that the alignment mark position P attached to the designated wafer 10a can be directly detected. That is, the image of the surface 11 of the designated wafer 10a is obtained by the flowchart of Fig. 8 (step S41), by aligning the image of the surface 11 of the designated wafer 10a with the designated wafer 10a previously memorized in the memory portion 91f. The image is marked (step S42), and the alignment mark position P of the designated wafer 10a is acquired (step S43). Then, from the relationship between the calculated alignment mark position P and the alignment mark position Q of the substrate 20, the alignment mark position Q of the substrate 20 is set as the current alignment mark position Pq with the alignment mark position P (steps) S44).

Next, the predetermined wafer 10a is mounted at a predetermined position of the substrate 20 (step S11). Specifically, the offset (X, Y, θ) between the current alignment mark position Pq and the set alignment mark position Pqo obtained in the alignment mark position acquisition process before the mounting is calculated. Then, by operating the positioning mechanism 52b of the control mounting table 52 in accordance with the offset amount, the adjustment 俾 is now aligned to the mark position Pq to set the alignment mark position Pqo. Then, the mounting head 51 is lowered in a state where the two-view camera 8a is retracted, and the predetermined wafer 10a is mounted on a predetermined portion of the substrate 20 (installation process).

Next, it is confirmed whether or not the designated wafer 10a is mounted on the substrate 20 position. Specifically, it is confirmed by acquiring an image of the state in which the designated wafer 10a is mounted on the substrate 20 (the post-installation image acquisition process in step S12). That is, the two-view camera 8a is entered, and the designated wafer 10a and the substrate 20 in the mounted state are imaged. Then, the alignment mark position Q of the substrate 20 and the alignment mark position P of the designated wafer 10a (the post-mounting alignment mark position acquisition process) are obtained from the obtained image.

That is, the alignment mark position Q of the substrate is obtained by comparing the image of the alignment mark of the substrate 20 previously stored in the memory portion 91f with the obtained image (step S13).

Then, the alignment mark position P of the designated wafer 10a is obtained from the obtained image (step S14). Here, the image of the designated wafer 10a taken by the two-view camera 8a is different depending on the case where the designated wafer 10a mounted on the substrate 20 is mounted face up and the case where it is mounted face down. That is, the surface 11 of the designated wafer 10a is photographed in the case of face-up mounting, and the back surface 12 of the designated wafer 10a is photographed in the case of face-down mounting. Therefore, the processing of this step S14 is performed differently in accordance with the production substrate information input in step S2 for face-up mounting or face-down mounting. That is, in the case of face-up mounting, processing is performed in accordance with the flowchart of Fig. 9, and in the case of face-down mounting, processing is performed in accordance with the flowchart of Fig. 10. Further, in the present embodiment, the processing of Fig. 9 or Fig. 10 is automatically selected in accordance with the production substrate information input in step S2.

In addition, since the processing of steps S51 to S54 in FIG. 9 is the same as the processing of steps S41 to S44 described above, the processing of steps S61 to S65 in FIG. 10 is the same as the processing of steps S31 to S35 described above, and thus the description thereof will be omitted.

Next, it is checked whether or not the mounting position of the designated wafer 10a is the margin (step S15). Specifically, the current alignment mark position Pq after the installation (the alignment mark position P of the designated wafer 10a that is currently mounted is aligned with the alignment mark position Q of the substrate 20 obtained after mounting) and the set alignment mark position Pqo ( The post-installation offset amount (X', Y', θ') of the alignment mark position P of the wafer 10a to the alignment mark position Q) of the substrate 20 previously stored in the memory portion 91f is specified. Then, in the case where the offset amount after the mounting is within the tolerance, the substrate 20 is discharged in the next process, and the substrate 20 is discharged as a defective product without being placed in the margin.

As described above, according to the mounting apparatus of the above-described embodiment, the corner portion of the surface 11 of the designated wafer 10a with the alignment mark and the corner portion of the back surface 12 are photographed, and the back surface alignment in the back image 46 is calculated from the obtained image. The mark position P' can be mounted or inspected according to the alignment mark position P in the surface image 45 in the case where the surface 11 of the designated wafer 10a cannot be photographed at the time of mounting or inspection, and is also on the surface 11 of the designated wafer 10a. In the case where photography is impossible, the installation or inspection can be performed based on the calculated back alignment mark position P'. Therefore, even the substrate 20 of any of the face-down mounting substrate 20 and the face-up mounting substrate 20 can be produced by a common mounting device without performing equipment change or adjustment work. Moreover, since alignment is made possible by the back image 46, it is possible to recognize the alignment mark without complicated device configuration as compared with the case where the alignment mark of the surface 11 of the semiconductor wafer 10 is recognized by an X-ray apparatus or the like as is conventionally known. The time is also shortened, so that the working time of the mounting device can be shortened.

Moreover, the upper side photographing means 41 for obtaining the alignment reference image S is obtained. Since the lower imaging means 42 are provided with the filters 41g and 42g, respectively, the imaging can be performed without being affected by the illumination light in the imaging means (the lower imaging means 42 or the upper imaging means 41) on the other side. Therefore, the upper photographing means 41 and the lower photographing means 42 can cause the illuminations 41d, 42d to emit light at the same time, and photograph the surface 11 and the back surface 12 of the designated wafer 10a, so that they have different timings in order to avoid the influence of the illumination light of each other. In the case of photographing, the time required for photographing the designated wafer 10a can be shortened, and the operation time of the entire mounting apparatus can be shortened.

Further, the mounting device of the present invention is not limited to the above embodiment. For example, in the above-described embodiment, the image of the corner portion of the back surface 12 of the designated wafer 10a obtained by the wafer identification unit 4 is set as the alignment reference image S, but is not limited to the corner of the semiconductor wafer 10. The image of the end portion of the outer shape of the semiconductor wafer 10 can also be used as the alignment reference image S.

Further, in the above-described embodiment, the alignment mark position information is described as an example using the alignment reference image S, but is not limited to the image, and is selected from the back image 46 of the semiconductor wafer 10 obtained by the wafer identification unit 4. A plurality of reference points (coordinates) are also available. In other words, by setting the reference point and the alignment mark position P as the alignment position information, the back alignment mark position P' can be calculated from the back surface image of the designated wafer 10a at the time of mounting.

In the above-described embodiment, the upper and lower filters 41g and 42g are disposed outside the mirror boxes 41e and 42e. However, the present invention is not limited thereto, and the CCD cameras 41c and 42c are disposed on the other side. Side lighting Between the optical paths of 41d and 42d, the light from the counterpart illuminations 41d and 42d can be suppressed by the CCD cameras 41c and 42c.

Further, in the above-described embodiment, an example in which the two-view camera 8a is used in the mounting unit 5 is described. However, the configuration may be such that an upward camera that captures the upper camera and a downward camera that captures the lower camera are disposed.

3‧‧‧ Wafer Supply Department

4‧‧‧ wafer identification department

5‧‧‧Installation Department

6‧‧‧Transportation device

6a‧‧‧Drive

7‧‧‧ Chip plate

8‧‧‧Photographing device

8a‧‧2 vision camera

9‧‧‧Vacuum pump

10‧‧‧Semiconductor wafer

10a‧‧‧Specified wafer

11‧‧‧ surface

12‧‧‧ Back

20‧‧‧Substrate

31‧‧‧Transfer head

31a‧‧‧ Head

32‧‧‧Reversal tools

32a‧‧‧Adsorption head

32b‧‧‧Adsorption surface

41‧‧‧Upper photography

41a, 42a‧‧‧Photographic Body

41b, 42b‧‧‧ mirror

41c, 42c‧‧‧CCD camera

41d, 42d‧‧‧ illumination

41e, 42e‧‧ ‧ mirror box

41f, 42f‧‧‧ half mirror

41g‧‧‧Upper filter

42‧‧‧Bottom photography

42c‧‧‧CCD camera

42g‧‧‧lower side filter

43‧‧‧Support frame

45‧‧‧Surface image

46‧‧‧Back image

51‧‧‧Installation head

51a, 51b‧‧‧ drive

52‧‧‧Installation table

52a‧‧‧ surface

52b‧‧‧ Positioning agency

61‧‧‧ wafer slider

61a‧‧‧Loading Department

61b‧‧‧Installation Department

62‧‧‧ wafer bearing area

69‧‧‧Transportation device

71‧‧‧ keyboard

72‧‧‧ touch panel

90‧‧‧Control device

91‧‧‧Control body

91a‧‧‧Main Control Department

91b‧‧‧Digital Image Setting Department

91c‧‧‧Comparative Computing Department

91d‧‧‧Offset Calculation Department

91e‧‧‧Decision Department

91f‧‧‧Memory Department

92‧‧‧Drive Control Department

93‧‧‧Image Processing Department

94‧‧‧Photographic Equipment Control Department

95‧‧‧External Device Control

96‧‧‧ Input Department

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a mounting device relating to the present invention.

Fig. 2 is an enlarged schematic view showing a wafer identification portion.

Fig. 3 is a schematic view showing the configuration of a photographing means.

Figure 4 is a block diagram showing a control system of the control device.

Fig. 5 is a flow chart showing the operation of the entire mounting apparatus.

Fig. 6 is a flow chart showing the operation of the reference image acquisition process.

Fig. 7 is a flow chart showing the operation of obtaining the alignment mark position of the designated wafer before mounting when the face-up mounting is performed.

Fig. 8 is a flow chart showing the operation of obtaining the alignment mark position of the designated wafer before mounting when the face-down mounting is performed.

Fig. 9 is a flow chart showing the operation of obtaining the alignment mark position of the designated wafer after mounting when the face-up mounting is performed.

Fig. 10 is a flow chart showing the operation of obtaining the alignment mark position of the designated wafer after mounting when the face-down mounting is performed.

11(a) and 11(b) are schematic diagrams showing an image of a corner portion of a designated wafer, wherein (a) is a view showing an image of a surface corner portion of a designated wafer, and (b) is a view showing a back corner portion of a designated wafer. Image of the image.

3‧‧‧ Wafer Supply Department

4‧‧‧ wafer identification department

5‧‧‧Installation Department

6‧‧‧Transportation device

7‧‧‧ Chip plate

8‧‧‧Photographing device

8a‧‧2 vision camera

10‧‧‧Semiconductor wafer

10a‧‧‧Specified wafer

11‧‧‧ surface

12‧‧‧ Back

20‧‧‧Substrate

31‧‧‧Transfer head

31a‧‧‧ Head

32‧‧‧Reversal tools

32a‧‧‧Adsorption head

32b‧‧‧Adsorption surface

41‧‧‧Upper photography

42‧‧‧Bottom photography

51‧‧‧Installation head

52‧‧‧Installation table

52a‧‧‧ surface

52b‧‧‧ Positioning agency

Claims (8)

A mounting device for mounting a semiconductor wafer at a predetermined position on a substrate according to an alignment mark attached to one side of the supplied semiconductor wafer and an alignment mark attached to the substrate, the feature comprising: a wafer identification portion holding the semiconductor In the state of the wafer, the surface of the semiconductor wafer with the alignment mark and the back surface thereof are photographed, and the pre-mounting photographing device photographs the surface of the substrate side of the semiconductor wafer before mounting in a state where the semiconductor wafer and the substrate before the mounting are opposed to each other. And the substrate; the mounting portion, aligning the semiconductor wafer, mounting the semiconductor wafer on the substrate; and a control device for driving and controlling the devices, wherein the wafer identification portion has a light emitting portion and a light receiving portion, and is composed of the semiconductor wafer a first photographing means for photographing the semiconductor wafer on the one hand side; and a second photographing means having the light emitting portion and the light receiving portion and photographing the semiconductor wafer on the side opposite to the first photographing means, the first photographing means photographing The semiconductor crystal is irradiated by the first photographic means toward the semiconductor wafer The light reflected by the surface on the first imaging means side, the second imaging means images the light irradiated by the second imaging means side toward the semiconductor wafer, which is reflected by the surface of the semiconductor wafer on the second imaging means side. Light, the control device In the case where the image of the surface of the substrate side of the pre-installed semiconductor wafer is taken as the surface of the semiconductor wafer by the pre-mounting photographing apparatus, the position information of the alignment mark on the surface of the semiconductor wafer is used before the mounting. When the image of the surface of the semiconductor wafer on the semiconductor wafer before the mounting of the semiconductor wafer is the back surface of the semiconductor wafer, the image of the back surface of the semiconductor wafer obtained by the wafer identification portion and the alignment mark of the surface of the semiconductor wafer are obtained by the photographing device. The position information relationship is calculated by performing image matching processing to calculate the position of the back surface alignment mark in the back surface of the semiconductor wafer before mounting, and the position of the back surface alignment mark is used as the position of the alignment mark at the time of mounting, and the mounting portion is controlled so as to Installed on a quasi-semiconductor wafer. The mounting device of claim 1, wherein the wafer identification unit is configured to suppress a light emitting portion from the second imaging means at least between an optical path of the light receiving portion of the first imaging device and the light emitting portion of the second imaging device The light received by the light receiving unit of the first imaging means is arranged to suppress the light emission from the first imaging means at least between the light receiving portion of the second imaging means and the optical path of the light emitting portion of the first imaging means. The light of the portion is received by the light receiving portion of the second imaging means. The mounting device of claim 1 or 2, further comprising a post-mounting photographing device for photographing a state in which the semiconductor wafer is mounted on the substrate, wherein the control device photographs the semiconductor wafer by the post-installation photographing device In the case of the back surface, the amount of shift between the position of the back alignment mark and the position of the alignment mark of the substrate is calculated, and the state of the mounting state is determined. Such as the installation device of claim 3, wherein the installation The photographing device and the post-installation photographing device are constituted by a common two-view camera. The mounting device according to claim 1 or 2, further comprising: a wafer supply unit that reverses the surface of the semiconductor wafer, wherein the semiconductor wafer is in a face up state or a face down state It is supplied to the wafer identification unit. The mounting device of claim 4, comprising: a wafer supply unit that reverses the surface of the semiconductor wafer, wherein the semiconductor wafer is supplied to the wafer in a face-up state or a face-down state; Identification department. A mounting method is characterized in that a semiconductor wafer is mounted on a predetermined position of a substrate according to an alignment mark attached to one side of the supplied semiconductor wafer and an alignment mark attached to the substrate, and the feature includes: a reference image acquisition process, and simultaneous shooting An image obtained by attaching the alignment mark of the semiconductor wafer to the surface of the semiconductor wafer and the back surface thereof, and the alignment mark position on the surface of the semiconductor wafer is associated with a part of the shape of the back surface of the semiconductor wafer to obtain an alignment reference image; The process of obtaining the image on the substrate side of the semiconductor wafer before mounting and the image of the substrate in a state in which the semiconductor wafer before mounting is opposed to the substrate; and preparing the alignment mark position before mounting, by using the pre-installation image Obtaining an image obtained by the process to obtain an alignment mark position of the semiconductor wafer and an alignment mark position of the substrate; and an installation process, and obtaining a process according to the position of the alignment mark by the pre-installation Aligning the alignment mark position of the obtained semiconductor wafer with the alignment mark position of the substrate, and mounting the semiconductor wafer on the substrate, wherein the pre-installation alignment mark position obtaining process is performed by the pre-installation image In the case where the image obtained by the surface of the substrate side of the semiconductor wafer before the mounting is the surface of the semiconductor wafer, the position of the alignment mark on the surface of the semiconductor wafer is regarded as the position of the alignment mark at the time of mounting, by In the pre-installation image acquisition process, when the image obtained on the substrate side surface of the semiconductor wafer before the mounting is the back surface of the semiconductor wafer, the image of the back surface of the semiconductor wafer obtained by the reference image acquisition process and the semiconductor wafer The position of the alignment mark position information of the surface is calculated by performing image matching processing to calculate the position of the back alignment mark, and the position of the back alignment mark is regarded as the position of the alignment mark at the time of mounting, and the mounting portion is controlled to align the semiconductor wafer And install. For example, the installation method of the seventh application of the patent scope further includes: an image acquisition process after installation, and after the installation process, photographing the mounted semiconductor wafer and the substrate to obtain an image of the semiconductor wafer and the image of the substrate; a position acquisition process for obtaining an alignment mark position of the semiconductor wafer mounted on the substrate and an alignment mark position of the substrate by the image obtained by the post-installation image acquisition process; and an inspection process according to the post-installation alignment mark Positioning the alignment mark position of the semiconductor wafer obtained by the process and the alignment mark position of the substrate, and checking whether the semiconductor wafer is mounted on the predetermined position of the substrate, wherein the post-installation alignment mark position is obtained in the process, In the case of an image of the back side of a semiconductor wafer, according to the alignment reference The image is subjected to image matching processing to calculate the position of the back alignment mark, and the position of the back alignment mark is regarded as the alignment mark position.