CN115223885A - Component picking and placing bonding system and method thereof - Google Patents
Component picking and placing bonding system and method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The invention discloses a component taking and placing bonding system, which comprises a taking and placing body, a component observation module, a substrate observation module, a processing unit and a bearing seat, wherein the substrate observation module comprises a voice coil motor, the bearing seat is loaded with a substrate, a component is picked up by the taking and placing body, the taking and placing body and the component are observed by the component observation module to obtain a first image, the taking and placing body is moved above the bearing seat, the voice coil motor is used for adjusting the distance between the substrate observation module and the substrate as well as the taking and placing body, the substrate and the taking and placing body are observed to obtain a second image, then the processing unit is combined with the images to convert the images into position information, and the taking and placing body is bonded on the substrate according to the position information to complete the component taking and placing bonding with the accuracy reaching the nanometer level.
Description
Technical Field
The invention belongs to the field of semiconductor packaging, and particularly relates to a component taking and placing bonding system and a component taking and placing bonding method for precisely bonding a precise electronic or optical component to a specified position.
Background
The semiconductor packaging process mainly comprises the stages of grinding, selecting, cutting, attaching, sealing and the like, and the component taking, placing and attaching system is used for transferring and attaching the components cut into the crystal grains on the appointed substrate in the attaching stage.
In order to accurately mount a die at a predetermined position, there is a device and a method for mounting a component on a substrate disclosed in the patent application No. TW107114542 (U.S. patent application No. US15/947,571, chinese patent application No. cn201810391562.1a, japanese patent application No. JP2018-190958A, korean patent application No. KR 1020180048520A) in taiwan, which is a former patent, in which a component mark of a component is photographed by a component camera, a component holder is moved to a position below a substrate camera, the reference mark of the component holder is photographed by a substrate camera, the component holder is moved away to allow the substrate camera to photograph a substrate mark of the substrate located below the substrate camera, and finally the component holder is moved to a position below the substrate camera and the reference mark of the component holder is photographed, and the component is aligned on the substrate according to the position of the reference mark and the position of the substrate mark.
However, the alignment of the aforementioned taiwan patent application No. TW107114542 requires continuous movement of the part holder, and each movement causes errors, so that the precision of the prior art is only two to three micrometers, which cannot meet the precision requirement of the packaging process in the present semiconductor manufacturing.
In addition, since the transistor size has approached the physical limit, the semiconductor manufacturing is not going toward the three-dimensional chip package, i.e. there will be multiple layers of dies on the substrate, but the aforementioned TW107114542 patent application prevents the camera from adjusting the camera depth according to the height of the die stacked on the substrate because the camera has a fixed depth of field.
In view of the above drawbacks of the prior art, the present inventor has earnestly studied and innovated, and after many years of research and experiment, has successfully developed and completed the component pick-and-place bonding system and method of the present invention.
Disclosure of Invention
The invention relates to a system and a method for picking, placing and bonding components, which aims to:
1. the precision of the part attaching technology is improved to a Sub-Micron (Sub-Micron) grade;
2. the problem that the depth of field of a camera in the prior art cannot be adjusted along with the height of crystal grains stacked on a substrate is solved.
The component taking and placing bonding system comprises a support frame, a taking and placing body, a component observation module, a substrate observation module, a bearing seat and a processing module, wherein the number of the substrate observation modules is two, namely a first substrate observation module and a second substrate observation module, only one component observation module is provided, but the second substrate observation module consists of two component observation units, namely a first component observation unit and a second component observation unit.
The base plate observation module is arranged on the supporting frame, the observation direction of the base plate observation module faces the bearing seat, the base plate observation module comprises a first base plate observation assembly and a second base plate observation assembly, the first base plate observation assembly is formed by connecting a first voice coil motor and a first base plate observation unit, the second base plate observation assembly is formed by connecting a second voice coil motor and a second base plate observation unit, the first base plate observation assembly is used for observing a base plate label of a base plate, and the second base plate observation assembly is used for observing a part label of a part.
The taking and placing body is arranged on the sliding rail of the supporting frame, and the taking and placing body can move among the component observation module, the first substrate observation module and the second substrate observation module.
The pick-and-place body also comprises a transparent pick-and-place unit, the left side and the right side of the pick-and-place unit are respectively provided with a pick-and-place volume label, and the pick-and-place unit is used for moving the part from the part waiting position to the substrate on the bearing seat.
The processing unit is used for controlling the pick-and-place body, the component observation module, the substrate observation module and the bearing seat, and executing an Image enhancement step (Image update), so that the observation accuracy of the substrate observation module and the component observation module reaches the submicron level.
The image enhancement step is one or a combination of two of a Sub Pixel Edge step (Sub Pixel Edge), an Advanced Adaptive Interpolation step (Advanced Adaptive Interpolation), and a Super Resolution step (Super Resolution).
The invention also provides a component taking and placing bonding method, which comprises the steps of starting with a picking component, moving the component to the position above the component observation module by using the taking and placing unit, and shooting the component by using the component observation module to obtain first image data; then, the component is moved to the position above the substrate by using the pick-and-place unit, and then a substrate observation module positioned at the top end shoots a component label positioned on the component and a substrate label positioned on the substrate from top to bottom to obtain second image data; then, the processing module obtains third position information according to the first position information and the second position information; and finally, accurately placing the component on the specified position of the substrate according to the third position information.
The process of placing the component on the designated position is completed by the taking and placing unit and the bearing plate in a cooperative manner, and the movement of the bearing plate is zero backlash.
As described above, the component pick-and-place bonding system of the present invention uses the component observation module to simultaneously observe the component tag of the component and the pick-and-place tag of the pick-and-place unit, uses the substrate observation module of the present invention to simultaneously observe the substrate tag of the substrate and the pick-and-place tag of the pick-and-place unit, and finally uses the pick-and-place body to align and place the component on the substrate, thereby achieving the sub-micron level high-precision component bonding.
Drawings
FIG. 1 is a schematic view of a substrate inspection system of the present invention;
FIG. 2 is a schematic view of a component pick and place bonding system of the present invention;
FIG. 3 is a step diagram of a component pick-and-place bonding method of the present invention;
FIG. 4 is a schematic view of a pickup assembly of an embodiment of a component pick and place bonding system;
FIG. 5 is a schematic view of an alignment feature of an embodiment of a component pick and place bonding system;
fig. 6 is a schematic diagram of a second embodiment of the present invention.
[ notation ] to show
1: support frame
2 first substrate observation module
211 first substrate Observation Unit
21 first substrate observing assembly
212 first Voice coil Motor
22 second substrate observing assembly
221 second substrate observing Unit
222 second voice coil motor
3: second substrate observation module
31 third substrate observing assembly
311 third substrate Observation Unit
312 third voice coil motor
32 fourth substrate observation assembly
321 fourth substrate observing unit
322 fourth voice coil motor
4: component observation module
41 first part Observation Unit
42 second-part observing unit
5 taking and placing body
51 pick-and-place unit
52 left picking and placing label
53 right picking and placing label
6: bearing seat
7 processing module
8: component
81 left part tag
82 right part label
9: substrate
91 left base plate label
92 Right base plate label
10 second part
101 left second part label
102 right second part tag
S101-S110 step
Detailed Description
In order to make those skilled in the art fully understand the technical features, contents, and advantages of the present invention and the efficacy achieved thereby, the present invention will be described in detail with reference to the accompanying drawings and the following embodiments, wherein the drawings are used for illustration and the accompanying specification, and are not necessarily the actual proportion and the precise configuration after the implementation of the present invention, and therefore, the proportion and the configuration relationship of the drawings should not be interpreted to limit the scope of the right of the present invention in the actual implementation.
Please refer to fig. 1, which is a schematic diagram of a substrate observing system of the present invention, and as shown in the figure, the substrate observing system of the present invention includes a supporting frame 1, a first substrate observing module 2 and a second substrate observing module 3, wherein the second substrate observing module 3 has the same mechanical design as the first substrate observing module 2, and both of them are installed on the supporting frame 1.
The first substrate observing module 2 includes a first substrate observing assembly 21 and a second substrate observing assembly 22, which are adjacent to each other and have a very small distance therebetween.
The first substrate observing assembly 21 includes a first substrate observing unit 211 and a first voice coil motor 212, and the distance between the first substrate observing unit 211 and a substrate can be controlled by the first voice coil motor 212.
The second substrate observing assembly 22 includes a second substrate observing unit 221 and a second voice coil motor 222, and the distance between the second substrate observing unit 221 and a pick-and-place unit can be controlled by the second voice coil motor 222.
The second substrate observation module 3 includes a third substrate observation assembly 31 and a fourth substrate observation assembly 32, the third substrate observation assembly 31 includes a third substrate observation unit 311 and a third voice coil motor 312, the fourth substrate observation assembly 32 includes a fourth substrate observation unit 321 and a fourth voice coil motor 322, and the mechanical relationship of the second substrate observation module 3 is the same as that of the first substrate observation module 2, which is not repeated.
Referring to fig. 2, which is a schematic view of a component pick-and-place bonding system of the present invention, the component pick-and-place bonding system of the present invention includes a supporting frame 1, a first substrate observing module 2, a second substrate observing module 3, a component observing module 4, a pick-and-place body 5, a carrying seat 6, and a processing module 7.
The support frame 1 is a bracket of a multi-axis alignment platform and is located above the bearing seat 6, wherein the taking and placing body 5 is arranged on the support frame 1, and the taking and placing body 5 is moved within a certain moving range by using a driving system of the support frame 1, wherein the taking and placing unit 51 is arranged at one end of the taking and placing body 5 facing the bearing seat 6, and a left taking and placing label 52 and a right taking and placing label 53 are respectively arranged at the left side and the right side of the taking and placing unit 51.
The first substrate observing module 2 and the second substrate observing module 3 are both mounted on the supporting frame 1, and the first substrate observing module 2 and the second substrate observing module 3 are separated by a distance, so that the second substrate observing module 3 can observe the right pick-and-place tag 53 while the first substrate observing module 2 observes the left pick-and-place tag 52.
The component observation module 4 is disposed in the moving range of the pick-and-place body 5, and the component observation module 4 includes a first component observation unit 41 and a second component observation unit 42, when the component 8 is attached to the pick-and-place body 5 and the pick-and-place body 5 moves above the observation module 4, the first component observation unit 41 observes the left component tag 81 of the component 8, and the second component observation unit 42 observes the right component tag 82, and the two cooperate to generate the image data.
Wherein, the bearing seat 6 is a movable platform without back clearance.
The processing module 7 is connected to the support frame 1, the first substrate observation module 2, the second substrate observation module 3, the component observation module 4, the pick-and-place body 5, and the carrying seat 6, and the processing module 7 receives Image data from the first substrate observation module 2, the second substrate observation module 3, and the component observation module 4, and uses an Image enhancement step (Image Upscale) to improve the resolution of the Image data, and then generates position information according to the Image data, and then controls the support frame 1, the pick-and-place body 5, and the carrying seat 6 according to the position information, so as to execute the task of aligning/placing and bonding the component 8 and the substrate 9.
Please refer to fig. 3, which is a step diagram of a pick-and-place bonding method according to the present invention. The pick-and-place method of the invention comprises the following steps:
s101: the picking and placing body is moved to a part waiting position, and a picking and placing unit is used for picking the part;
s102: the picking and placing body moves to the position above the component observation module;
s103: the component observation unit observes a component volume label of the component and a pick-and-place volume label of the pick-and-place unit to obtain first image data, and then the first high-resolution image data is obtained through an image enhancement step;
s104: based on the first high-resolution image data, the difference (Deltax) of the component volume label and the pick-and-place volume label in the X direction is judged 1 ) And the difference (Δ Y) between the component tag and the pick-and-place tag in the Y direction 1 ) And first position information is obtained, wherein the first position information is a difference value (Δ X) from the X direction 1 ) And difference value (Δ x) in Y direction 1 ) Constituent vector information (Δ x) 1 ,Δy 1 )；
S105: the pick-and-place body is moved to the position above the appointed position of the substrate, and the substrate observation module is moved to the position above the pick-and-place body;
s106: the distance between the first substrate observation unit and the substrate is adjusted by the first voice coil motor, so that the substrate label of the substrate is positioned in the field depth range of the first substrate observation unit, and the distance between the second substrate observation unit and the pick-and-place unit is adjusted by the second voice coil motor, so that the pick-and-place volume label of the pick-and-place unit is positioned in the field depth range of the second substrate observation unit;
s107: the substrate observation module observes a substrate volume label of the substrate and a pick-and-place volume label of the pick-and-place unit to obtain second image data, and then a second high-resolution image data is obtained through an image enhancement step;
s108: based on the second high-resolution image data, the difference (Deltax) of the substrate volume label and the pick-and-place volume label in the X direction is judged 2 ) And the difference (delta Y) between the substrate tag and the pick-and-place tag in the Y direction 2 ) Obtaining second position information, wherein the second position information is derived from the difference (Δ X) in the X direction 2 ) And difference value (Δ x) in Y direction 2 ) Constituent vector information (Δ x) 2 ,Δy 2 )；
S109: the absolute value (| delta X) of the difference value of the component volume label and the pick-and-place volume label in the X direction 1 | absolute value (| Δ X) of difference between substrate tag and pick-and-place tag in X direction 2 | to obtain the difference (Δ X) between the part label and the substrate label in the X direction 3 )；
Absolute value (| delta Y) of difference value of component volume label and pick-and-place volume label in Y direction 1 | Y) and absolute value (| Δ Y) of difference between the substrate tag and the pick-and-place tag in the Y direction 2 | to obtain the difference (Δ Y) between the part label and the substrate label in the Y direction 3 )；
In step S109, the third position information is obtained according to the difference (Δ X) in the X direction 3 ) And difference value (Δ x) in Y direction 3 ) Constituent vector information (Δ x) 3 ,Δy 3 )；
S110: the bearing seat moves with zero back clearance according to the third position information to align the component with the specified position on the substrate, and then the component is placed on the substrate by the taking and placing unit.
Referring to fig. 4, which is a schematic diagram of a pickup device according to an embodiment of the component pick-and-place bonding system, as shown in the figure, in an embodiment of the present invention, the component pick-and-place bonding system includes a first substrate observing module 2, a second substrate observing module 3, a component observing module 4, a pick-and-place body 5, a carrying seat 6, and a processing module 7.
The pick-and-place body 5 includes a pick-and-place unit 51, and a left pick-and-place tag 52 and a right pick-and-place tag 53 are respectively disposed on left and right sides of the pick-and-place unit 51, the pick-and-place unit 51 picks up one component 8, and a left component tag 81 and a right component tag 82 are respectively disposed on left and right sides of the component 8.
The pick-and-place unit 51 is moved to the top of the component observing module 4, so that the first component observing unit 41 can simultaneously observe the left pick-and-place tag 52 and the left component tag 81, and the second component observing unit 42 can simultaneously observe the right pick-and-place tag 53 and the right component tag 82, so as to obtain the first image data, and transmit the first image data to the processing module 7 in real time.
After receiving the first Image data, the processing module 7 uses an Image enhancement step (Image update) to improve the resolution of the first Image data, converts the first Image data into first high-resolution Image data, and then determines the relative positions between the left pick-and-place tag 52 and the left component tag 81 and the relative positions between the right pick-and-place tag 53 and the right component tag 82 to obtain first position information.
Referring to fig. 5, which is a schematic diagram of an alignment component of an embodiment of a component pick-and-place bonding system, in the embodiment, as shown in the drawing, the pick-and-place body 5 moves the component 8 above a designated position of the substrate 9, and simultaneously the first substrate observing module 2 and the second substrate observing module 3 also move above the pick-and-place body 5.
A left substrate label 91 and a right substrate label 92 are provided on the left and right sides of the substrate 9, respectively.
The first substrate observing module 2 uses the first voice coil motor 212 to extend the first substrate observing unit 211 towards the substrate 9, so that the left substrate label 91 of the substrate 9 enters the depth of field range of the first substrate observing unit 211, and the second substrate observing module 3 uses the fourth voice coil motor 322 to extend the fourth substrate observing unit 321 towards the substrate 9, so that the right substrate label 92 of the substrate 9 enters the depth of field range of the fourth substrate observing unit 321.
The first substrate observing module 2 uses the second voice coil motor 222 to approach the second substrate observing unit 24 toward the pick-and-place unit 51, so that the left pick-and-place tag 52 of the pick-and-place unit 51 enters the depth of field range of the second substrate observing unit 221, and the second substrate observing module 3 uses the third voice coil motor 312 to approach the third substrate observing unit 311 toward the pick-and-place unit 51, so that the right pick-and-place tag 53 of the pick-and-place unit 51 enters the depth of field range of the third substrate observing unit 311.
The first substrate observing module 2 observes the left pick-and-place tag 52 and the left substrate tag 91 at the same time, the second substrate observing module 3 observes the right pick-and-place tag 53 and the right substrate tag 92 at the same time, and the second image data is obtained by cooperation of the first substrate observing module 2 and the second substrate observing module 3 and is transmitted to the processing module 7 in real time.
After receiving the second Image data, the processing module 7 uses an Image enhancement step (Image update) to improve the resolution of the second Image data, converts the second Image data into second high-resolution Image data, and then determines the relative position between the left pick-and-place tag 52 and the left substrate tag 91 and the relative position between the right pick-and-place tag 53 and the right substrate tag 92, so as to obtain second position information.
The processing module 7 then obtains the third position information in step S109.
The pick-and-place body 5 and the carrier 6 are then used to accurately place the component 8 at the designated position on the substrate 9 with a Sub-Micron (Sub-Micron) precision in step S109.
Referring to fig. 6, which is a schematic view illustrating a second embodiment of the present invention, in this embodiment, a plurality of layers of second components 10 are stacked on a substrate 9, wherein a left second component label 101 and a right second component label 102 are disposed on the second components 10.
In the present embodiment, the first voice coil motor 212 adjusts the distance between the first substrate observing unit 211 and the second part 10, so that the left second part tag 101 is located within the depth of field of the first substrate observing unit 211.
In the present embodiment, the fourth vcm 322 adjusts the distance between the fourth substrate observing unit 321 and the second component 10, so that the right second component label 102 is located within the depth of field of the fourth substrate observing unit 321.
In the present embodiment, the second voice coil motor 222 and the third voice coil motor 312 respectively adjust the distances between the second substrate observing unit 221 and the pick-and-place unit 51 and the third substrate observing unit 311, so that the left pick-and-place tag 52 and the right pick-and-place tag 53 are respectively located within the depth of field of the second substrate observing unit 221 and the third substrate observing unit 311.
By the cooperation of the first voice coil motor 212, the second voice coil motor 222, the third voice coil motor 312 and the fourth voice coil motor 322, the component pick-and-place bonding system of the present invention can adapt to the thickness of various substrates 9, components 8 and second components 10, and can also flexibly adjust the height, thereby completing the stacking operation of the multi-layer component 8.
The component 8 of the present invention is a flip chip, and may be any semiconductor die. In some embodiments, the component 8 may be an electronic, optical, optoelectronic, or any other component.
The substrate observation unit is a high-resolution CCD camera or a CMOS camera, which is generally used in the art.
In summary, the component pick-and-place bonding system and the component pick-and-place method of the present invention have the precision reaching the sub-micron level when the alignment bonding between the component 8 and the substrate 9 is performed; in addition, the voice coil motor included in the substrate observation module of the invention has a function of adjusting the distance between the substrate observation unit and the substrate, thereby solving the problem that the depth of field of a high-resolution CCD camera or a CMOS camera in the field is narrow and short, which makes it difficult to meet the multiple height requirements in the three-dimensional crystal packaging process.
The above description is only exemplary, and is intended to illustrate possible embodiments of the technical content of the present invention, and not to limit the present invention. All equivalent substitutions, modifications and variations which may be suggested to one skilled in the art based on the teachings disclosed in the specification are included within the scope of the invention as claimed.
Claims (10)
1. A component pick and place bonding system for placing a component on a substrate, wherein the component has a component label and the substrate has a substrate label, the component pick and place bonding system comprising:
a support frame;
the pick-and-place body is arranged on the support frame and moves between the substrate and the part to be placed, the pick-and-place body also comprises a pick-and-place unit used for picking and placing the part, and the pick-and-place unit is provided with a pick-and-place label;
the component observation module is arranged in the moving range of the taking and placing body, and when the taking and placing body is positioned in the observation range of the component observation module and the component is being picked up by the taking and placing unit, the component observation unit simultaneously observes the component volume label and the taking and placing volume label; and
the substrate observation module is arranged on the support frame and comprises a first substrate observation assembly and a second substrate observation assembly;
wherein the first substrate observing assembly comprises a first substrate observing unit, and the second substrate observing assembly comprises a second substrate observing unit;
when the component is aligned to the substrate by the taking and placing unit, the first substrate observation unit observes the substrate volume label, and the second substrate observation unit observes the component volume label.
2. The component pick-and-place bonding system of claim 1, wherein the first substrate vision assembly further comprises a first voice coil motor coupled to the first substrate vision unit, and wherein the second substrate vision assembly further comprises a second voice coil motor coupled to the second substrate vision unit.
3. The component pick-and-place bonding system of claim 1, wherein the component vision module further comprises a first component vision unit and a second component vision unit, and the first component vision unit is connected to the second component vision unit.
4. The component pick-and-place bonding system of claim 1, wherein the pick-and-place unit is optically transparent.
5. The component handling and bonding system of claim 1, wherein multiple layers of the component are stacked on the substrate.
6. The component pick-and-place bonding system of claim 1, further comprising a carrier disposed within the observation range of the substrate observation module, wherein the carrier is configured to carry and move the substrate, and the carrier mechanism is designed without backlash.
7. The system of claim 1, further comprising a processing module coupled to the substrate observing module and the component observing module, wherein the processing module is configured to perform an Image enhancement (Image update) step, wherein the Image enhancement step is one or a combination of Sub-Pixel Edge (Sub Pixel Edge), advanced Adaptive Interpolation (Advanced Adaptive Interpolation), and Super Resolution (Super Resolution).
8. A component taking, placing and bonding method is characterized by comprising the following steps:
picking a component by using a taking and placing body so that the component is attached to the taking and placing unit of the taking and placing body;
moving the taking and placing unit to an observation range of a component observation module, and acquiring first image data by the component observation module;
utilizing a processing module to generate first position information based on the first image data, wherein the first position information is a relative position between a part volume label and a pick-and-place volume label;
moving the pick-and-place unit between the substrate and a substrate observation module, and acquiring second image data by the substrate observation module;
generating second position information based on the second image data by using the processing module, wherein the second position information is a relative position between the component volume label and a substrate volume label;
obtaining third position information based on the first position information and the second position information by using the processing module, wherein the third position information is a relative position between the component volume label and the substrate volume label;
and aligning the component to the substrate by using the pick-and-place body based on the third position information, and placing and attaching the component to the substrate.
9. The method of claim 8, further comprising performing an image enhancement step by the processing module to enhance the resolution of the substrate observation module and the component observation module, wherein the resolution enhancement step is one or a combination of sub-pixel edge step, advanced adaptive interpolation step, and super-resolution step.
10. The method of claim 8, wherein when the pick-and-place unit is moved between the substrate and a substrate vision module, the method further comprises:
adjusting the distance between a first substrate observation unit and the substrate by using a first voice coil motor;
and adjusting the distance between a second substrate observation unit and the pick-and-place unit by using a second voice coil motor.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110404435.2A CN115223885A (en) | 2021-04-15 | 2021-04-15 | Component picking and placing bonding system and method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110404435.2A CN115223885A (en) | 2021-04-15 | 2021-04-15 | Component picking and placing bonding system and method thereof |
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