CN117393655A - High-precision mounting method and system for silicon optical chip and active device - Google Patents
High-precision mounting method and system for silicon optical chip and active device Download PDFInfo
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 97
- 239000010703 silicon Substances 0.000 title claims abstract description 97
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- 230000003287 optical effect Effects 0.000 title claims abstract description 45
- 238000001514 detection method Methods 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 238000012937 correction Methods 0.000 claims abstract description 26
- 230000032683 aging Effects 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 10
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- 238000000547 structure data Methods 0.000 claims description 9
- 210000001503 joint Anatomy 0.000 claims description 7
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- 125000006850 spacer group Chemical group 0.000 description 6
- 238000012797 qualification Methods 0.000 description 5
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- 230000005693 optoelectronics Effects 0.000 description 2
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- 238000005452 bending Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
- H01L31/125—Composite devices with photosensitive elements and electroluminescent elements within one single body
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Abstract
The present disclosure provides a high-precision mounting method and system for silicon optical chips and active devices, and relates to a silicon optical chip integration technology, wherein the method comprises: determining the surface of a silicon substrate and an active device to be attached; determining a pin point type mounted active device and an integrated surface mounted active device; the method comprises the steps of mounting an active device to be mounted on the surface of a silicon substrate, and determining a first precision index when the active device is pin point type mounting; when the integrated surface mounting is performed, determining a second precision index; and carrying out mounting accuracy recognition on the real-time mounting data set according to the first accuracy index and the second accuracy index, and generating mounting feedback data according to the mounting accuracy recognition result to carry out mounting accuracy correction. The method can solve the technical problems of low accuracy and practicability of the mounting accuracy recognition result due to low detection accuracy of the mounting quality detection method of the silicon optical chip and the active device, and can improve the accuracy of the mounting accuracy recognition result, thereby improving the accuracy of the mounting accuracy correction.
Description
Technical Field
The present disclosure relates to silicon photonics chip integration technology, and more particularly, to a high precision mounting method and system for silicon photonics chips and active devices.
Background
Silicon photonics is an important technology in the field of optical communications, which has significant advantages in terms of transmission rate, power consumption, and cost by integrating optical elements with semiconductor devices on a single silicon wafer.
The high-precision mounting of the silicon optical chip and the active device is one of important links of the silicon-based photoelectronic integrated chip, and has great influence on the integration quality of the silicon optical chip. The existing mounting method of the silicon optical chip and the active device has the following defects: because the mounting quality detection method is imperfect, the accuracy and the practicability of the mounting accuracy recognition result are lower, and the mounting accuracy correction data are inaccurate, so that the mounting accuracy and quality are affected.
Disclosure of Invention
Therefore, in order to solve the above technical problems, the technical solution adopted in the embodiments of the present disclosure is as follows:
the high-precision mounting method for the silicon optical chip and the active device comprises the following steps of: determining the surface of a silicon substrate and an active device to be attached according to the design information of the silicon optical chip; classifying the active devices to be mounted according to the mounting mode of the devices, and determining the active devices in a pin point type mounting mode and the active devices in an integrated surface mounting mode; the connection mounter mounts the active device to be mounted on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device; when the mounting mode of the real-time active device is an integrated surface mounting mode, determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device; collecting a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the mounting machine when the mounting machine is used for mounting; and carrying out mounting precision recognition on the real-time mounting data set according to the first precision index and the second precision index, generating mounting feedback data according to a mounting precision recognition result, and carrying out mounting precision correction by using the mounting feedback data.
A high precision mounting system for silicon photonics chips and active devices, comprising: the mounting information determining module is used for determining the surface of the silicon substrate and the active device to be mounted according to the design information of the silicon optical chip; the active device classification module is used for classifying the active devices to be pasted according to the pasting mode of the devices and determining the active devices in the pin point pasting mode and the active devices in the integrated surface pasting mode; the first precision index determining module is used for being connected with a mounter to mount the to-be-mounted active device on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device; the second precision index determining module is used for determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device when the mounting mode of the real-time active device is an integrated surface mounting mode; the real-time mounting data set acquisition module is used for acquiring a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the machine when the mounting machine mounts; the mounting accuracy correction module is used for carrying out mounting accuracy recognition on the real-time mounting data set according to the first accuracy index and the second accuracy index, generating mounting feedback data according to a mounting accuracy recognition result, and carrying out mounting accuracy correction on the mounting feedback data.
By adopting the technical method, compared with the prior art, the technical progress of the present disclosure has the following points:
the method can solve the technical problems of low accuracy and practicability of the identification result of the mounting accuracy due to low detection accuracy of the mounting quality detection method of the silicon optical chip and the active device, and firstly, the active devices to be mounted are classified according to the mounting mode of the active devices, and the active devices of the pin point type mounting mode and the active devices of the integrated surface mounting mode are determined; determining a first precision index for point type mounting detection according to the pin geometric data, and determining a second precision index for surface type mounting detection according to the contact surface structure data; then, carrying out mounting accuracy recognition on the real-time mounting data set according to the first accuracy index and the second accuracy index, so that the accuracy of mounting accuracy recognition results can be improved; and finally, generating mounting feedback data according to the mounting precision recognition result to carry out mounting precision correction, so that the accuracy of the mounting precision correction can be improved, and the mounting precision and accuracy of the silicon optical chip and the active device are further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic flow chart of a high-precision mounting method for silicon optical chips and active devices;
fig. 2 is a schematic flow chart of outputting a mounting accuracy recognition result based on a first accuracy index in a high-accuracy mounting method for a silicon optical chip and an active device;
fig. 3 is a schematic structural diagram of a high-precision mounting system for silicon photonics chips and active devices.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
Based on the above description, as shown in fig. 1, the present disclosure provides a high-precision mounting method for a silicon optical chip and an active device, including:
determining the surface of a silicon substrate and an active device to be attached according to the design information of the silicon optical chip;
the silicon optical chip is a novel integrated circuit which integrates optoelectronic devices on the same chip by utilizing silicon-based materials and processes, has high efficiency of semiconductor devices and high communication capability of optical elements, and is an important support for future information technology. The active device refers to an electronic element that requires a power source to realize a specific function thereof, and in this embodiment, the active device mainly includes an electronic element for mounting with a silicon optical chip, such as a laser, a detector, and a modulator. The method is used for improving the mounting precision of the silicon optical chip and the active device, so that the integration quality of the silicon optical chip is improved, and the method is particularly applied to a high-precision mounting system for the silicon optical chip and the active device.
First, design information of a silicon optical chip, which refers to a design scheme of the silicon optical chip, is obtained, wherein the design information comprises an optoelectronic device, a transmission line and a logic circuit. And then determining the surface of a silicon substrate of the silicon optical chip and an active device to be attached according to the design information, wherein the silicon substrate refers to silicon wafer materials for manufacturing the silicon optical chip, such as: wafers and the like, wherein the surface of the silicon substrate refers to the outer layer which is used for being attached with an active device and is arranged in a silicon wafer material; the to-be-attached active device refers to an electronic element which needs to be attached in the production process of the silicon optical chip, and comprises a laser, a detector, a modulator and the like. By determining the surface of the silicon substrate and the active devices to be mounted, data support is provided for the next step of classifying and mounting the active devices to be mounted.
Classifying the active devices to be mounted according to the mounting mode of the devices, and determining the active devices in a pin point type mounting mode and the active devices in an integrated surface mounting mode;
the method comprises the steps of obtaining a mounting mode of an active device to be mounted, wherein the mounting mode comprises a pin point type mounting mode and an integrated surface type mounting mode, the pin point type mounting mode refers to mounting pins of the active device on a silicon optical chip to realize functions of the active device, and the active device with the pins comprises elements such as a diode, a triode, a transistor, a capacitor and the like; the integrated surface mounting mode refers to mounting the surface of an active device on a silicon optical chip to realize the function of the active device. Classifying the to-be-mounted active devices according to the mounting mode, and dividing the to-be-mounted active devices into active devices in a pin point mounting mode and active devices in an integrated surface mounting mode. Because the mounting precision detection methods of the active devices in different mounting modes are different, the active devices to be mounted are classified according to the mounting modes, so that support is provided for setting the mounting precision detection index in the next step, and the accuracy and precision of the mounting quality detection of the active devices can be improved.
The connection mounter mounts the active device to be mounted on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device;
and starting a mounter to mount the active device to be mounted on the surface of the silicon substrate, wherein the mounter refers to equipment for mounting the active device, such as: and when the mounting mode of the real-time active device is a pin point type mounting mode, determining a first precision index according to pin geometric data of the real-time active device, wherein the pin geometric data comprise data such as pin size and pin shape, and the first precision index is used for detecting the point type mounting quality of the active device. And a first precision index is determined, so that a basis is provided for the next-step dot type mounting quality detection.
When the mounting mode of the real-time active device is an integrated surface mounting mode, determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device;
when the mounting mode of the real-time active device is an integrated surface mounting mode, determining a second precision index according to contact surface structure data of the real-time active device, wherein the contact surface structure data comprise the shape and the size of the mounting surface of the active device and the thickness of the active device, and the second precision index is used for detecting the surface mounting quality of the active device. And a second precision index is determined, so that a basis is provided for next surface mount quality detection.
Collecting a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the mounting machine when the mounting machine is used for mounting;
and in the process of mounting the active device by the mounter, collecting real-time mounting data of the real-time active device, wherein the real-time mounting data comprises sensing data from a starting position to a specified mounting position by the mounter when the mounter is used for mounting, wherein the starting position is the position of a mounting part of the mounter before mounting the active device, the specified mounting position is the position of the mounting part of the mounter after mounting the active device, the real-time mounting data of the real-time active device are obtained, and a real-time mounting data set is constructed. By obtaining the real-time mounting data set, data support is provided for the next mounting accuracy identification.
And carrying out mounting precision recognition on the real-time mounting data set according to the first precision index and the second precision index, generating mounting feedback data according to a mounting precision recognition result, and carrying out mounting precision correction by using the mounting feedback data.
As shown in fig. 2, in one embodiment, the method further comprises:
acquiring the first precision index, wherein the first precision index comprises a preset translation error and a preset rotation error;
identifying the mounting position of the real-time mounting data set according to the preset translation error and the preset rotation error, identifying a single precision error of the mounting machine when the mounting machine firstly moves from a starting position to a specified mounting position, and identifying repeated precision errors of the mounting machine for carrying out multiple mounting on each pin of the same active device;
and outputting a mounting precision identification result based on the first precision index according to the single precision error and the repeated precision error.
Acquiring a first precision index, wherein the first precision index comprises a preset translation error and a preset rotation error, and the preset translation error is a horizontal error of active device pin mounting in a point type mounting process, for example: the pins are offset 0.01 nanometers to the left or right; the preset rotation error refers to a horizontal inclination angle error of the active device pin mounting in the point mounting process, wherein the preset translation error and the preset rotation error can be set based on the actual mounting requirement of the silicon optical chip, for example: the translational error was set to 0.001 nm.
Then, the mounting positions of the pins of the active devices in the real-time mounting data set are identified according to the preset translation errors and the preset rotation errors, and single precision errors and repeated precision errors are obtained, wherein the single precision errors refer to the precision errors of the mounting machine when the mounting machine performs mounting and the machine moves from the initial position to the specified mounting position for the first time, namely, the errors generated by the mounting machine at the first pin of the active devices are usually the mounting errors carried by the machine; the repeated precision error refers to the precision error of the mounter for carrying out multiple mounting on each pin of the same active device, wherein the repeated precision error refers to the comprehensive mounting precision error of each pin in the same active device, and the repeated precision error is the sum of error data of pins with mounting errors in the same active device.
And generating a mounting precision identification result based on the first precision index according to the single precision error and the repeated precision error, wherein the mounting precision identification result is a mounting quality detection result of active device point mounting, and the single precision error and the repeated precision error are included. By generating a mounting accuracy recognition result based on the first accuracy index, support is provided for generating mounting feedback data for active device point mounting.
In one embodiment, the method further comprises:
acquiring the second precision index, wherein the second precision index comprises a preset horizontal error and a preset vertical error of a contact structure;
identifying the mounting position of the real-time mounting data set according to the preset horizontal error and the preset vertical error, and identifying the butt-joint precision error of mounting the structure of the contact surface of the real-time active device and the surface of the silicon substrate;
in one embodiment, the method further comprises:
acquiring an active device in an integrated surface mounting mode, and determining a contact surface between the real-time active device and the surface of the silicon substrate;
and detecting the warping degree of the contact surface, and when the warping degree detection result does not meet the preset flatness in mounting, connecting a leveling control module of the precise leveling machine to perform leveling correction on the real-time active device, wherein the leveling control module is provided with a protection pressure threshold value for controlling the maximum pressure of the precise leveling machine for straightening the real-time active device.
Acquiring a second precision index, wherein the second precision index comprises a preset horizontal error and a preset vertical error of a contact structure, and the preset horizontal error refers to a horizontal offset error of a mounting contact surface, wherein the horizontal offset error comprises a direction offset and an angle offset; the preset vertical error refers to a mounting thickness error of the mounting contact surface.
And starting the mounter to mount the active devices which are to be mounted and are mounted in an integrated surface mounting mode. Firstly, an active device which is mounted in an integrated surface type is obtained, and a contact surface between the active device and the surface of the silicon substrate is determined, wherein the contact surface refers to the surface of the active device for mounting. And then detecting the warping degree of the contact surface through a flatness detector, wherein the warping degree is used for representing the bending degree of the contact surface, and obtaining a warping degree detection result of the contact surface.
The preset flatness when the contact surface is mounted is obtained, the preset flatness refers to a warp detection index of the contact surface when the contact surface is mounted, and a person skilled in the art can set according to real-time mounting requirements and actual conditions of active devices and the contact surface, for example: the flatness was set to 5 degrees of warpage. Judging the warp detection result according to the preset flatness, when the warp detection result is larger than or equal to the preset flatness, connecting and starting a precise leveling machine, wherein the precise leveling machine is equipment for performing straightening correction on an active device, then performing straightening correction on the real-time active device through a leveling control module of the precise leveling machine, a protection pressure threshold is arranged in the leveling control module, the protection pressure threshold is the maximum pressure of the precise leveling machine for straightening the real-time active device, the protection pressure threshold can be set according to the type and structure of the active device, the protection pressure threshold of different types of active devices is different, the internal structure of the active device can be protected by setting the protection pressure threshold, the active device is prevented from being damaged due to overlarge straightening pressure, the real-time active device with the completed straightening correction is obtained, and then the real-time active device with the completed straightening correction is attached. The method has the advantages that the warp degree detection is carried out on the contact surface of the active device, and the real-time active device is subjected to straight correction according to the warp degree detection result, so that the mounting precision and quality of the active device in an integrated surface mounting mode can be improved.
In one embodiment, the method further comprises:
acquiring a silicon substrate area when the real-time active device is integrated, judging whether the silicon substrate area is provided with a groove embedded in the real-time active device, and acquiring a groove surface structure if the groove embedded in the real-time active device is included;
and carrying out flip-chip butt joint precision identification according to the surface structure of the groove and the contact surface structure of the real-time active device, and outputting the butt joint precision error.
And identifying the mounting position of the real-time mounting data set according to the preset horizontal error and the preset vertical error, and then calculating the butt-joint accuracy error of mounting according to the structure identification result of the contact surface of the real-time active device and the surface of the silicon substrate.
Firstly, image acquisition is performed on a silicon substrate area integrated with a real-time active device by an image acquisition device, wherein the image acquisition device refers to a device with a high-precision image acquisition function, for example: and when the silicon substrate area is provided with the groove embedded with the real-time active device, data acquisition is carried out on the groove to obtain a groove surface structure, wherein the groove surface structure comprises data such as the shape, the size, the depth and the like of the groove surface.
Acquiring a contact surface structure of the real-time active device, wherein the contact surface structure comprises data such as the shape, the size, the height and the like of a contact surface; and then carrying out flip-chip butt-joint precision identification according to the surface structure of the groove and the contact surface structure of the real-time active device, wherein the flip-chip precision refers to the degree of adhesion of the real-time active device and the silicon substrate area, for example: when the depth of the groove surface is 0.09 nm and the height of the contact surface is 0.093 nm, a butt-joint precision error is generated, and the butt-joint precision error is generated.
And outputting a mounting precision identification result based on the second precision index by using the docking precision error.
And outputting the docking precision error as a mounting precision recognition result based on the second precision index, and providing support for generating mounting feedback data of the surface mounting of the active device by generating the mounting precision recognition result based on the second precision index.
In one embodiment, the method further comprises:
judging whether the real-time active device comprises a gasket or not when being mounted, wherein the gasket is arranged between the real-time active device and the surface of the silicon substrate and is used for supporting the device connection containing the height error;
when the real-time active device comprises a gasket, an upper contact surface and a lower contact surface of the gasket are obtained, wherein the upper contact surface is a contact surface between the gasket and the real-time active device, and the lower contact surface is a contact surface between the gasket and the surface of the silicon substrate;
respectively carrying out mounting and fixing detection on the upper contact surface and the lower contact surface, and outputting a mounting and fixing detection result;
judging whether the real-time active device is mounted or not, wherein the pad is arranged between the real-time active device and the surface of the silicon substrate and is used for supporting the device connection containing the height error, for example: insulating gaskets, active ceramic gaskets and the like, wherein the device containing the height error is characterized in that the height of the active device is not satisfied with the final mounting requirement, so that the gaskets are required to increase the mounting height of the active device and play a supporting role on the active device.
When the real-time active device comprises a gasket, a contact surface between the gasket and the real-time active device is marked as an upper contact surface, a contact surface between the gasket and the surface of the silicon substrate is marked as a lower contact surface, and the upper contact surface and the lower contact surface of the gasket are obtained. And then the upper contact surface and the lower contact surface are respectively subjected to mounting and fixing detection through a mounting detector, wherein the mounting and fixing detection refers to the mounting firmness of the upper contact surface and the lower contact surface, a mounting and fixing detection result is obtained, the mounting and fixing detection result is represented by a mounting and fixing coefficient, and the mounting firmness is better, the mounting and fixing coefficient is larger. By obtaining the mounting and fixing detection result, the fixing mounting quality of the active device can be obtained more accurately and intuitively, and support is provided for optimizing the mounting accuracy recognition result.
And optimizing the mounting precision identification result according to the mounting fixing detection result.
In one embodiment, the method further comprises:
acquiring gasket material information, identifying the elastic modulus by using the gasket material information, and outputting a first elastic modulus;
determining a thermal environment when the real-time active device works, identifying the aging rate of the first elastic modulus based on the thermal environment, and outputting a mounting aging detection result according to the aging rate;
and optimizing the mounting precision identification result according to the mounting fixing detection result and the mounting aging detection result.
And acquiring gasket material information, wherein the gasket material information comprises index data such as material, strength, hardness, elasticity, extensibility and the like of a gasket, and carrying out elastic modulus identification on the gasket according to the gasket material information, wherein the elastic modulus is a physical index used for representing elasticity of the gasket, and is a proportionality coefficient between stress and strain of the gasket, and the elastic modulus of the gasket is obtained as a first elastic modulus.
The method comprises the steps of collecting a heat environment during operation of the real-time active device, wherein the heat environment comprises data such as the highest temperature, the average temperature and the operation time corresponding to the temperature during operation of the active device, then identifying the aging rate of the first elastic modulus according to the heat environment, wherein the aging rate is the aging rate of the first elastic modulus under the heat environment, an aging rate identification result can be obtained by a person skilled in the art through multiple experiments on a gasket, the aging rate identification result of the first elastic modulus is obtained, then mounting aging calculation is carried out according to the aging rate identification result, when the gasket is subjected to aging deformation, the mounting quality of the active device is influenced, meanwhile, the normal operation of a silicon optical chip is influenced, the mounting aging is the time that the active device can normally operate, and the mounting failure detection result of the real-time active device is obtained.
And adding the mounting fixing detection result and the mounting aging detection result into the mounting precision identification result to finish optimizing the mounting precision identification result. By optimizing the mounting accuracy recognition result according to the mounting fixing detection result and the mounting aging detection result, the accuracy and the accuracy obtained by the mounting accuracy recognition result can be improved, and support is provided for mounting accuracy correction.
Setting a plurality of mounting precision qualification indexes, wherein the mounting precision qualification indexes can be set according to the type and the mounting precision requirement of each mounting index in the mounting precision identification results, judging the mounting precision identification results according to the mounting precision qualification indexes, when each identification result in the mounting precision identification results does not meet the corresponding mounting precision qualification index, taking the mounting precision identification result which does not meet the corresponding mounting precision qualification index as abnormal mounting data, generating mounting feedback data according to the abnormal mounting data, and finally carrying out mounting precision correction on the mounting results of the silicon optical chip and the active device according to the mounting feedback data.
The method solves the technical problems of low accuracy and practicability of the mounting accuracy identification result due to low detection accuracy of the mounting quality detection method of the silicon optical chip and the active device, and can improve the accuracy of the mounting accuracy identification result, thereby further improving the mounting accuracy and accuracy of the silicon optical chip and the active device.
In one embodiment, a high precision mounting system for silicon photonics chips and active devices is provided as shown in fig. 3, comprising:
the mounting information determining module is used for determining the surface of the silicon substrate and the active device to be mounted according to the design information of the silicon optical chip;
the active device classification module is used for classifying the active devices to be pasted according to the pasting mode of the devices and determining the active devices in the pin point pasting mode and the active devices in the integrated surface pasting mode;
the first precision index determining module is used for being connected with a mounter to mount the to-be-mounted active device on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device;
the second precision index determining module is used for determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device when the mounting mode of the real-time active device is an integrated surface mounting mode;
the real-time mounting data set acquisition module is used for acquiring a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the machine when the mounting machine mounts;
the mounting accuracy correction module is used for carrying out mounting accuracy recognition on the real-time mounting data set according to the first accuracy index and the second accuracy index, generating mounting feedback data according to a mounting accuracy recognition result, and carrying out mounting accuracy correction on the mounting feedback data.
In one embodiment, the system further comprises:
the first precision index acquisition module is used for acquiring the first precision index, and the first precision index comprises a preset translation error and a preset rotation error;
the precision error recognition module is used for recognizing the mounting position of the real-time mounting data set according to the preset translation error and the preset rotation error, recognizing a single precision error of the mounting machine when the mounting machine performs mounting and the mounting machine moves from the initial position to the specified mounting position for the first time, and recognizing a repeated precision error of the mounting machine for performing multiple mounting on each pin of the same active device;
and the mounting precision recognition result output module is used for outputting a mounting precision recognition result based on the first precision index according to the single precision error and the repeated precision error.
In one embodiment, the system further comprises:
the second precision index acquisition module is used for acquiring the second precision index, and the second precision index comprises a preset horizontal error and a preset vertical error of the contact structure;
the butt-joint precision error identification module is used for identifying the mounting position of the real-time mounting data set according to the preset horizontal error and the preset vertical error and identifying the butt-joint precision error of mounting the structure of the contact surface of the real-time active device and the surface of the silicon substrate;
and the mounting precision recognition result output module is used for outputting a mounting precision recognition result based on the second precision index according to the docking precision error.
In one embodiment, the system further comprises:
the contact surface determining module is used for acquiring an active device in an integrated surface mounting mode and determining the contact surface between the real-time active device and the surface of the silicon substrate;
the real-time active device straightening and correcting module is used for detecting the warping degree of the contact surface, and when the warping degree detection result does not meet the preset straightening degree in mounting, the real-time active device straightening and correcting module is connected with the straightening control module of the precise straightening machine to straighten and correct the real-time active device, wherein the straightening control module is provided with a protective pressure threshold value and used for controlling the maximum pressure of straightening the real-time active device by the precise straightening machine.
In one embodiment, the system further comprises:
the device comprises a groove surface structure acquisition module, a groove surface structure acquisition module and a display module, wherein the groove surface structure acquisition module is used for acquiring a silicon substrate area when a real-time active device is integrated, judging whether the silicon substrate area is provided with a groove embedded in the real-time active device or not, and acquiring a groove surface structure if the groove embedded in the real-time active device is included;
and the butt joint precision error output module is used for carrying out flip-chip butt joint precision identification according to the surface structure of the groove and the contact surface structure of the real-time active device and outputting the butt joint precision error.
In one embodiment, the system further comprises:
the real-time active device judging module is used for judging whether the real-time active device comprises a gasket or not when being mounted, wherein the gasket is arranged between the real-time active device and the surface of the silicon substrate and is used for supporting device connection containing height errors;
the device comprises a spacer contact surface acquisition module, a silicon substrate surface acquisition module and a real-time active device, wherein the spacer contact surface acquisition module is used for acquiring an upper contact surface and a lower contact surface of a spacer when the real-time active device comprises the spacer, the upper contact surface is a contact surface between the spacer and the real-time active device, and the lower contact surface is a contact surface between the spacer and the silicon substrate surface;
the mounting and fixing detection module is used for respectively carrying out mounting and fixing detection on the upper contact surface and the lower contact surface and outputting a mounting and fixing detection result;
and the mounting precision recognition result optimizing module is used for optimizing the mounting precision recognition result according to the mounting fixed detection result.
In one embodiment, the system further comprises:
the first elastic modulus output module is used for acquiring gasket material information, carrying out elastic modulus identification according to the gasket material information and outputting a first elastic modulus;
the mounting aging detection result output module is used for determining the heat environment of the real-time active device during operation, identifying the aging rate of the first elastic modulus based on the heat environment, and outputting a mounting aging detection result according to the aging rate;
and the mounting precision recognition result optimizing module is used for optimizing the mounting precision recognition result according to the mounting fixing detection result and the mounting aging detection result.
In summary, compared with the prior art, the embodiments of the present disclosure have the following technical effects:
(1) The detection results of the silicon optical chip and the active device are subjected to multi-index detection and identification by setting a plurality of mounting quality detection indexes, so that the accuracy and the practicability of mounting accuracy identification results can be improved, then mounting accuracy correction is performed by generating mounting feedback data according to the mounting accuracy identification results, the accuracy of mounting accuracy correction can be improved, and the mounting accuracy of the silicon optical chip and the active device can be further improved.
(2) The mounting precision recognition result is optimized according to the mounting fixing detection result and the mounting aging detection result, so that the precision and accuracy of the mounting precision recognition result can be improved, and support is provided for mounting precision correction.
The above examples merely represent a few embodiments of the present disclosure and are not to be construed as limiting the scope of the invention. Accordingly, various alterations, modifications and variations may be made by those having ordinary skill in the art without departing from the scope of the disclosed concept as defined by the following claims and all such alterations, modifications and variations are intended to be included within the scope of the present disclosure.
Claims (8)
1. A high-precision mounting method for silicon optical chips and active devices, the method comprising:
determining the surface of a silicon substrate and an active device to be attached according to the design information of the silicon optical chip;
classifying the active devices to be mounted according to the mounting mode of the devices, and determining the active devices in a pin point type mounting mode and the active devices in an integrated surface mounting mode;
the connection mounter mounts the active device to be mounted on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device;
when the mounting mode of the real-time active device is an integrated surface mounting mode, determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device;
collecting a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the mounting machine when the mounting machine is used for mounting;
and carrying out mounting precision recognition on the real-time mounting data set according to the first precision index and the second precision index, generating mounting feedback data according to a mounting precision recognition result, and carrying out mounting precision correction by using the mounting feedback data.
2. The method of claim 1, wherein the method further comprises:
acquiring the first precision index, wherein the first precision index comprises a preset translation error and a preset rotation error;
identifying the mounting position of the real-time mounting data set according to the preset translation error and the preset rotation error, identifying a single precision error of the mounting machine when the mounting machine firstly moves from a starting position to a specified mounting position, and identifying repeated precision errors of the mounting machine for carrying out multiple mounting on each pin of the same active device;
and outputting a mounting precision identification result based on the first precision index according to the single precision error and the repeated precision error.
3. The method of claim 1, wherein the method further comprises:
acquiring the second precision index, wherein the second precision index comprises a preset horizontal error and a preset vertical error of a contact structure;
identifying the mounting position of the real-time mounting data set according to the preset horizontal error and the preset vertical error, and identifying the butt-joint precision error of mounting the structure of the contact surface of the real-time active device and the surface of the silicon substrate;
and outputting a mounting precision identification result based on the second precision index by using the docking precision error.
4. A method as claimed in claim 3, wherein the method further comprises:
acquiring an active device in an integrated surface mounting mode, and determining a contact surface between the real-time active device and the surface of the silicon substrate;
and detecting the warping degree of the contact surface, and when the warping degree detection result does not meet the preset flatness in mounting, connecting a leveling control module of the precise leveling machine to perform leveling correction on the real-time active device, wherein the leveling control module is provided with a protection pressure threshold value for controlling the maximum pressure of the precise leveling machine for straightening the real-time active device.
5. A method as claimed in claim 3, wherein the method further comprises:
acquiring a silicon substrate area when the real-time active device is integrated, judging whether the silicon substrate area is provided with a groove embedded in the real-time active device, and acquiring a groove surface structure if the groove embedded in the real-time active device is included;
and carrying out flip-chip butt joint precision identification according to the surface structure of the groove and the contact surface structure of the real-time active device, and outputting the butt joint precision error.
6. The method of claim 1, wherein the method further comprises:
judging whether the real-time active device comprises a gasket or not when being mounted, wherein the gasket is arranged between the real-time active device and the surface of the silicon substrate and is used for supporting the device connection containing the height error;
when the real-time active device comprises a gasket, an upper contact surface and a lower contact surface of the gasket are obtained, wherein the upper contact surface is a contact surface between the gasket and the real-time active device, and the lower contact surface is a contact surface between the gasket and the surface of the silicon substrate;
respectively carrying out mounting and fixing detection on the upper contact surface and the lower contact surface, and outputting a mounting and fixing detection result;
and optimizing the mounting precision identification result according to the mounting fixing detection result.
7. The method of claim 6, wherein the method further comprises:
acquiring gasket material information, identifying the elastic modulus by using the gasket material information, and outputting a first elastic modulus;
determining a thermal environment when the real-time active device works, identifying the aging rate of the first elastic modulus based on the thermal environment, and outputting a mounting aging detection result according to the aging rate;
and optimizing the mounting precision identification result according to the mounting fixing detection result and the mounting aging detection result.
8. A high-precision mounting system for a silicon optical chip and an active device, characterized by the steps for performing any one of the high-precision mounting methods for a silicon optical chip and an active device as set forth in claims 1 to 7, the system comprising:
the mounting information determining module is used for determining the surface of the silicon substrate and the active device to be mounted according to the design information of the silicon optical chip;
the active device classification module is used for classifying the active devices to be pasted according to the pasting mode of the devices and determining the active devices in the pin point pasting mode and the active devices in the integrated surface pasting mode;
the first precision index determining module is used for being connected with a mounter to mount the to-be-mounted active device on the surface of the silicon substrate, and when the mounting mode of the real-time active device is a pin point mounting mode, the first precision index for point mounting detection is determined according to the pin geometric data of the real-time active device;
the second precision index determining module is used for determining a second precision index for surface mounting detection according to the contact surface structure data of the real-time active device when the mounting mode of the real-time active device is an integrated surface mounting mode;
the real-time mounting data set acquisition module is used for acquiring a real-time mounting data set of the mounting machine, wherein the real-time mounting data set comprises a sensing data set from a starting position to a specified mounting position of the machine when the mounting machine mounts;
the mounting accuracy correction module is used for carrying out mounting accuracy recognition on the real-time mounting data set according to the first accuracy index and the second accuracy index, generating mounting feedback data according to a mounting accuracy recognition result, and carrying out mounting accuracy correction on the mounting feedback data.
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