CN115371543A - Surface mounting precision calibration method - Google Patents
Surface mounting precision calibration method Download PDFInfo
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- CN115371543A CN115371543A CN202111514222.1A CN202111514222A CN115371543A CN 115371543 A CN115371543 A CN 115371543A CN 202111514222 A CN202111514222 A CN 202111514222A CN 115371543 A CN115371543 A CN 115371543A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
Abstract
The invention relates to the technical field of precision calibration, in particular to a mounting precision calibration method, which is used for detecting the mounting precision of a chip mounted on a die bonder in real time and calibrating the die bonder according to a detection result and comprises the following steps: obtaining mounting area reference information corresponding to a chip to be mounted on a substrate before mounting; mounting the chip to the corresponding mounting area; acquiring actual mounting position information of the mounted chip on the substrate in real time; comparing the actual mounting position with the reference information of the mounting area in real time, and calculating the mounting precision error of the chip; when the precision error exceeds a preset range, calibrating the die bonder; the mounting precision calibration method can measure the chips and the substrates after the chips and the substrates are mounted, can immediately finish precision measurement as long as the mounting is finished, provides data reference for the chips and the substrates to be die-bonded in the same batch, and can greatly reduce the fraction defective of finished products in the same batch.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of precision calibration, in particular to a mounting precision calibration method.
[ background ] A method for producing a semiconductor device
In the existing process, a batch of chips and substrates are usually subjected to die bonding and then measured to obtain the mounting precision of the batch of finished products, so that the die bonder is calibrated before next die bonding, but the existing die bonder does not have the function of detecting the mounting precision, needs to transfer the mounted batch of chips and substrates to other equipment for detection, and then calibrates the die bonder inversely according to the detection result, and has the problems of low flexibility and lag of the measurement result.
[ summary of the invention ]
The invention provides a mounting precision calibration method for solving the problem of lag of measurement results of die bonding finished products.
The invention provides a mounting precision calibration method for detecting the mounting precision of a chip mounted on a die bonder in real time and calibrating the die bonder according to a detection result, which comprises the following steps:
obtaining mounting area reference information corresponding to a chip to be mounted on a substrate before mounting;
mounting the chip to the corresponding mounting area;
acquiring actual mounting position information of the mounted chip on the substrate in real time;
comparing the actual mounting position with the reference information of the mounting area in real time, and calculating the mounting precision error of the chip;
and when the precision error exceeds a preset range, calibrating the die bonder.
Preferably, the step of obtaining the mounting area reference information corresponding to the chip to be mounted on the substrate before mounting specifically includes the following steps:
acquiring mark point information preset on a substrate;
and reading the preset mounting area information, and generating mounting area reference information according to the preset mounting area information by taking the preset mark point as a reference.
Preferably, the preset mounting area reference information includes profile data of an image projected on the substrate by the chip.
Preferably, the obtaining the actual mounting position information of the mounted chip on the substrate in real time specifically includes the following steps:
acquiring image information of the mounted chip and the substrate;
and analyzing the image information to obtain the actual position of the mounted chip on the substrate.
Preferably, the acquiring of the image information of the mounted chip specifically includes:
image information is acquired after the chip is placed on the substrate but at the time curing has not yet started.
Preferably, comparing the actual mounting position of the chip on the substrate with the mounting area reference information, so as to calculate the mounting accuracy error of the chip specifically includes the following steps:
comparing the actual mounting position of the chip on the substrate with the reference information of the mounting area to obtain the deviation value between the actual mounting position of the chip on the substrate and the preset mounting area in the X direction and the Y direction and the angle deviation value;
and respectively calculating errors of the chip in the X direction and the Y direction and angle errors according to the deviation values in the X direction and the Y direction and the angle deviation values.
Preferably, when the precision error exceeds a preset range, calibrating the die bonder specifically comprises the following steps:
judging whether the mounting precision error of the chip is larger than a first preset value or not;
judging whether the number of the chips with the mounting precision errors larger than the first preset value on the substrate reaches a second preset value or not;
and when the first preset value and the second preset value are simultaneously met, calibrating the die bonder.
Preferably, the second preset value is greater than or equal to 1.
Preferably, the calibration of the die bonder specifically comprises the following steps:
calibrating an operation initial point of the die bonder;
compared with the prior art, the mounting precision calibration method has the following advantages:
1. the mounting precision calibration method can measure the chips and the substrates after the chips and the substrates are mounted, does not need to wait for the mounting of the chips and the substrates of the whole batch to be finished, does not need to transfer the chips and the substrates on the die bonder to other equipment, can immediately finish precision measurement after the mounting is finished, provides data reference for the chips and the substrates to be die bonded in the same batch, and can greatly reduce the reject ratio of finished products in the same batch.
2. The mounting area reference information is respectively generated according to the preset mounting area information and the mark point information independently acquired from each substrate, and the method and the device are strong in pertinence and high in reliability.
3. The preset mounting area information comprises the outline data of the image projected by the chip on the substrate, and the related information of the actual mounting position of the chip on the substrate also comprises the outline information.
4. The chip and the substrate image information after die bonding obtained in the invention refers to the image information after the chip is placed on the substrate but before the chip is cured, so that the design can avoid the influence of errors caused by curing on the detection result, and can also confirm whether the chip is mounted or cured according to the final result, thereby improving the reliability of the detection result and avoiding meaningless or even wrong calibration of the die bonding machine.
5. According to the method, the mounting precision errors of the chip are respectively judged according to the deviation values in the X direction and the Y direction and the angle deviation values, judgment is carried out from multiple dimensions, the result is reliable, and the precision is high.
6. When the first preset value and the second preset value are simultaneously met, the die bonder can be calibrated, so that the phenomenon that the die bonder is subjected to meaningless calibration too frequently to influence the die bonding efficiency can be avoided.
7. The second preset value can be 1, or other values larger than one, so that the diversity of the mounting precision calibration method can be enriched.
8. The calibration of the die bonder comprises the calibration of an operation initial point of the die bonder and the calibration of equipment used for adjusting the chip orientation on the die bonder, so that the reliability of a calibration result is ensured.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a block diagram of an accuracy measurement system provided in a first embodiment of the present invention.
Fig. 2 is a cross-sectional view of a vision module provided in a first embodiment of the invention (with the first optical configuration deployed).
Fig. 3 is a cross-sectional view of a vision module (first optical structure receiving) provided by a first embodiment of the present invention.
Fig. 4 is a block diagram of a mounting accuracy calibration method provided in a second embodiment of the present invention.
The attached drawings indicate the following:
100. a precision measurement system;
1. a data processing module;
2. a vision module; 21. an adjustment device; 211. a first cavity; 212. a second cavity; 213. a light inlet; 214. a first optical structure; 215. a second optical structure; 216. a limiting structure; 217. a receiving groove; 218. a drive device; 219. mounting grooves; 220. a bump; 22. a first visual component; 23. a second visual element;
3. a client; 4. a storage system.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The terms "vertical," "horizontal," "left," "right," "up," "down," "left up," "right up," "left down," "right down," and the like as used herein are for illustrative purposes only.
Referring to fig. 1 to 3, a precision measurement calibration system 100 for calibrating a chip and a substrate mounted on a die bonder includes a data processing module 1, a vision module 2 and an adjusting device 21, which are connected to each other via signals; the vision module 2 is arranged on the adjusting device 21 and used for acquiring image information of the chip and the substrate in real time, and comprises a first vision component 22 and a second vision component 23, light rays entering the adjusting device 21 are received by the first vision component 22, or a light path is changed under the action of the adjusting device 21 so as to be received by the second vision component 23, and the data processing module 1 is used for processing the image information acquired by the vision module 2.
It can be understood that the precision measurement calibration system 100 of the present invention realizes the function of real-time detection of the chip and the substrate after die bonding by installing the vision module 2 and the data processing module 1 on the die bonding machine; after the mounting is finished, the image information of the mounted chip and the mounted substrate can be directly obtained through the vision module 2, and the mounting error of the chip is calculated through the data processing module 1, so that the sensitivity is high, and the timeliness is strong; meanwhile, the detection precision can be effectively improved by matching the first visual component 22 and the second visual component 23, and the time for replacing the visual components can be shortened by adjusting the light path of the light through the adjusting device 21, so that the detection efficiency is improved.
The existing die bonder is generally provided with a conveying device for sucking the chip and the substrate, wherein the conveying device can be a mechanical arm; the vision module 2 in this application can be arranged on the movable end of the transportation device to move together with the transportation device, so that the shooting direction can be adjusted conveniently.
Referring to fig. 1, the precision measurement calibration system 100 further includes a client 3, the data processing module 1 and the vision module 2 are in signal connection with the client 3, and the client 3 is used as a transfer station for information interaction between the data processing module 1 and the vision module 2.
It can be understood that, in the precision measurement calibration system 100 of the present invention, the client 3 is used as a transfer station for information interaction between the data processing module 1 and the vision module 2, which is beneficial for expanding other functional modules through the client 3 and is also convenient for a user to monitor a detection condition.
Optionally, the client 3 may be integrated on the die bonder, or may be a PC end disposed beside or remote from the die bonder, or may be a handheld device; the client 3 is only required to be ensured to be used as a transfer station for information interaction between the data processing module 1 and the vision module 2. It will be appreciated that when the client 3 is a remote PC or handheld device, the client 3 is in remote communication with the data processing module 1 and the vision module 2.
Further, the precision measurement calibration system 100 further includes a storage system 4 for storing pre-stored data and temporary data.
Optionally, the storage system 4 includes a RAM and/or a cloud. Specifically, in this embodiment, the storage system 4 includes a RAM and a cloud. Historical data can be uploaded to the cloud, and calling and tracing are facilitated.
Referring to fig. 2 and fig. 3, a first cavity 211 for accommodating the first visual component 22 and a second cavity 212 for accommodating the second visual component 23 are disposed in the adjusting device 21, one end of the adjusting device 21 away from the first visual component 22 and the second visual component 23 is provided with a light inlet 213, the first cavity 211, the second cavity 212 and the light inlet 213 are communicated with each other, and a movable first optical structure 214 is disposed at the light inlet 213; light entering the light inlet 213 can be received by the first vision assembly 22 through the first cavity 211 or by the second vision assembly 23 through the second cavity 212 in cooperation with the first optical structure 214.
It can be understood that the adjusting device 21 of the present invention can change the light path of the light entering the light inlet 213 through only one first optical structure 214, and has the advantages of simple structure, easy production and easy maintenance.
Specifically, in this embodiment, the first cavity 211 and the second cavity 212 are communicated at one end near the light inlet 213.
Further, the cross-sectional area of the light inlet 213 is equal to the cross-sectional area of the first cavity 211. Specifically, in the present embodiment, the cross-sections of the light inlet 213, the first cavity 211 and the second cavity 212 are all rectangular.
Further, a second optical structure 215 is disposed in the adjusting device 21, and is used to cooperate with the first optical structure 214 to reflect the light entering the light inlet 213 to the second cavity 212 for being received by the second visual component 23.
It can be understood that the adjusting device 21 of the present invention is further provided with the second optical structure 215, and the guiding capability of the adjusting device 21 to the light entering the light inlet 213 can be greatly improved by the cooperation of the first optical structure 214 and the second optical structure 215, so that the installation position of the second visual component 23 can be more diversified.
Further, the first optical structure 214 and the second optical structure 215 each include a mirror. The first optical structure 214 and the second optical structure 215 adjust the optical path of the light entering the light inlet 213 through the reflector.
Further, the minimum angle between the second optical structure 215 and the shooting direction of the second visual element 23 is 45 °. It can be understood that the minimum included angle between the second optical structure 215 of the present invention and the shooting direction of the second visual component 23 is 45 °, which is favorable for ensuring the normal imaging proportion of the second visual component 23 and improving the working efficiency of the data processing module 1.
In other embodiments, to meet specific structural or installation requirements, the minimum angle between the second optical structure 215 and the shooting direction of the second vision assembly 23 can be other angles, and then the imaging is calibrated by an algorithm to obtain a normal-scale image; it will be appreciated that the image may be retained at this particular scale if desired.
Further, a bump 220 for carrying the second optical structure 215 is disposed on the adjusting device 21 corresponding to the bottom of the second optical structure 215. The design can avoid the second optical structure 215 from position deviation caused by long-term use, which is beneficial to improving the working stability of the vision module 2 and prolonging the service life of the vision module 2.
With continued reference to fig. 2 and 3, the shooting direction of the first vision element 22 is parallel to the shooting direction of the second vision element 23. As will be appreciated, this design effectively saves space occupied by the vision module 2.
Further, one end of the first optical structure 214 is rotatably connected to the inner wall of the first cavity 211, and a position-limiting structure 216 for being matched with the movable end of the first optical structure 214 is disposed on the other inner wall of the first cavity 211. It will be appreciated that the engagement of the position-limiting structure 216 allows the first optical structure 214 to be rotated to a specific angle without special control. In this embodiment, the first optical structure 214 can form a 45 ° minimum angle with the shooting direction of the first visual component 22 after rotation by the cooperation of the position-limiting structure 216.
Further, a driving device 218 for driving the first optical structure 214 to rotate is disposed in the adjusting device 21. Specifically, in this embodiment, the starting device includes a motor and a reduction box in transmission connection with the output shaft of the electrode, and the output shaft of the reduction box is in transmission connection with the first optical structure 214. It is understood that the first optical structure 214 is generally a lens structure, and is fragile, and the reduction of the rotation speed through the reduction box can avoid the first optical structure 214 from being damaged accidentally.
Further, a receiving groove 217 for receiving the first optical structure 214 is disposed on an inner wall of the first cavity 211. This design prevents the first vision assembly 22 from being affected by the first optical structure 214 during operation.
Further, the depth of the receiving groove 217 is greater than or equal to the thickness of the first optical structure 214. This design ensures that the first optical structure 214 can be completely received in the receiving slot 217, and further prevents the first vision assembly 22 from being affected by the first optical structure 214 during the operation.
Specifically, in the present embodiment, the depth of the receiving groove 217 is greater than the thickness of the first optical structure 214.
Further, the adjusting device 21 is further provided with an installation groove 219 for installing the driving device 218, and the installation groove 219 is communicated with the accommodating groove 217. This design facilitates reducing the overall volume of the vision module 2.
Further, the depth of the mounting groove 219 is greater than the depth of the receiving groove 217. This design can further reduce the overall volume of the vision module 2.
Referring to fig. 4, a second embodiment of the present invention provides a mounting accuracy calibration method for detecting mounting accuracy of a chip mounted on a die bonder in real time and calibrating the die bonder according to a detection result, including the following steps:
step S1: acquiring the reference information of a mounting area corresponding to a chip to be mounted on a substrate before mounting;
step S2: mounting the chip to the corresponding mounting area;
and step S3: acquiring actual mounting position information of the mounted chip on the substrate in real time;
and step S4: comparing the actual mounting position with the reference information of the mounting area in real time, thereby calculating the mounting precision error of the chip;
step S5: and when the precision error exceeds a preset range, calibrating the die bonder.
It can be understood that the mounting accuracy calibration method of the invention can measure the chips and the substrates after the chips and the substrates are mounted, and does not need to wait for the mounting of the chips and the substrates of the whole batch to be completed, and does not need to transfer the chips and the substrates on the die bonder to other equipment.
Further, step S1 specifically includes the following steps:
step S11: acquiring mark point information preset on a substrate;
step S12: and reading the preset mounting area information, and generating mounting area reference information according to the preset mounting area information by taking the preset mark point as a reference.
It can be understood that the mounting area reference information in the invention is respectively generated according to the preset mounting area information and the mark point information independently acquired from each substrate, and has strong pertinence and high reliability.
Specifically, in the present embodiment, the mounting area reference information includes a mounting area reference.
Furthermore, the number of the preset mark points on the substrate can be one or more; when a plurality of preset mark points are preset on the substrate, acquiring information of each preset mark point, and then respectively reading corresponding preset mounting area information to generate corresponding mounting area reference information.
It can be understood that the corresponding chip types of each marking point may be the same or different, so that the preset mounting area information corresponding to each marking point may be the same or different; even if the mark points correspond to the same chip, the preset mounting area information corresponding to the mark points can be the same or different because the different mark points are positioned at different positions on the substrate.
Further, the preset mounting area information includes profile data of an image projected on the substrate by the chip. It can be understood that the relevant information of the actual mounting position of the chip on the substrate also includes the profile information of the chip, and the design is convenient for reducing the comparison difficulty and improving the calculation efficiency.
Specifically, in the present embodiment, the contour data of the image projected on the substrate by the chip includes, but is not limited to, length data and angle data; in addition, the preset mounting region information also includes other data such as area data and height data.
Further, step S2 specifically includes the following steps:
step S21: acquiring image information of the mounted chip and the substrate;
step S22: and analyzing the image information to obtain the actual position of the mounted chip on the substrate.
Further, the obtaining of the image information of the mounted chip specifically includes: image information is acquired after the chip is placed on the substrate but at the time curing has not yet started.
It can be understood that the image information of the die and the substrate after die bonding obtained in the present invention refers to the image information after the die is placed on the substrate but before curing is started, and this design can avoid the influence of errors caused by curing on the detection result, and can also confirm whether the deviation is caused by mounting or curing operation according to the final result, thereby improving the reliability of the detection result and avoiding meaningless or even wrong calibration of the die bonder.
Further, step S3 specifically includes the following steps:
step S31: comparing the actual mounting position of the chip on the substrate with the reference information of the mounting area to obtain the deviation value between the actual mounting position of the chip on the substrate and the preset mounting area in the X and Y directions;
step S32: and calculating the errors of the chip in the X direction and the Y direction according to the deviation values in the X direction and the Y direction.
The method and the device can judge the mounting precision error of the chip according to the deviation value in the X direction and the Y direction, and have reliable result and high precision.
Further, step S3 further includes the following steps:
step S33: and calculating the angle error of the chip according to the deviation values or the angle deviation values in the X and Y directions.
Specifically, in the embodiment, the angle error is a deviation between the chip and the substrate in clockwise and counterclockwise directions.
It can be understood that the invention can detect the error of the chip in the X and Y directions, and can also detect the error of the chip in the clockwise or counterclockwise direction, the detection result is comprehensive, and the reliability is strong.
Furthermore, whether the chip type is correct can be judged according to the acquired area data and the acquired height data.
Further, step S4 specifically includes the following steps:
step S41: judging whether the mounting precision error of the chip is larger than a first preset value or not;
step S42: judging whether the number of the chips with the mounting precision error larger than the first preset value on the substrate reaches a second preset value or not;
step S43: and when the first preset value and the second preset value are simultaneously met, namely the mounting precision error of the chips is larger than the first preset value and the number of the chips with the mounting precision error larger than the first preset value on the substrate is larger than or equal to the second preset value, calibrating the die bonder.
It can be understood that, in the invention, when the first preset value and the second preset value are simultaneously satisfied, the die bonder is calibrated, and the design can avoid that the die bonder is subjected to meaningless calibration too frequently to influence the die bonder efficiency.
Further, the second preset value is greater than or equal to 1. The design is beneficial to enriching the diversity of the mounting precision calibration method.
Specifically, in this embodiment, when the second preset value is greater than 2 and the deviation types of the recorded chips are consistent, the die bonder is calibrated. It will be appreciated that if the types of errors for several chips are irregular or even completely opposite, this may be an unavoidable mechanical error that is difficult to eliminate by calibration; when the error types of several chips are consistent, for example, several new disks have approximately equal errors in the X direction, the calibration can be performed obviously.
Further, the calibration of the die bonder in step S43 specifically includes the following steps:
calibrating an operation initial point of the die bonder;
and calibrating equipment used for adjusting the orientation of the chip on the die bonder.
It will be appreciated that performing the calibration from multiple aspects facilitates ensuring the reliability of the calibration results.
Compared with the prior art, the mounting precision calibration method has the following advantages:
1. the mounting precision calibration method can measure the chips and the substrates after the chips and the substrates are mounted, does not need to wait for the mounting of the chips and the substrates of the whole batch to be completed, does not need to transfer the chips and the substrates on the die bonder to other equipment, can complete the precision measurement in real time only after the mounting is completed, provides data reference for the chips and the substrates to be die bonded in the same batch, and can greatly reduce the fraction defective of finished products in the same batch.
2. The mounting area reference information is respectively generated according to the preset mounting area information and the mark point information independently acquired from each substrate, and the method and the device are strong in pertinence and high in reliability.
3. The preset mounting area information comprises the outline data of the image projected by the chip on the substrate, and the related information of the actual mounting position of the chip on the substrate also comprises the outline information.
4. The chip and substrate image information after die bonding obtained in the invention refers to the image information after the chip is placed on the substrate but before the curing is started, so that the design can avoid the influence of errors caused by curing on the detection result, and can also confirm whether the deviation is caused by mounting or curing operation according to the final result, thereby improving the reliability of the detection result and avoiding the meaningless or even wrong calibration of the die bonding machine.
5. According to the method, the mounting precision errors of the chip are respectively judged according to the deviation values in the X direction and the Y direction and the angle deviation values, judgment is carried out from multiple dimensions, the result is reliable, and the precision is high.
6. When the first preset value and the second preset value are simultaneously met, the die bonder is calibrated, so that the influence on die bonding efficiency caused by the fact that the die bonder is subjected to meaningless calibration frequently can be avoided.
7. The second preset value can be 1, or other values larger than one, so that the diversity of the mounting precision calibration method can be enriched.
8. The calibration of the die bonder comprises the calibration of an operation initial point of the die bonder and the calibration of equipment used for adjusting the chip orientation on the die bonder, so that the reliability of a calibration result is favorably ensured.
The mounting precision calibration method disclosed by the embodiment of the invention is described in detail, a specific example is applied in the description to explain the principle and the implementation of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for the persons skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present invention, and any modification, equivalent replacement, and improvement made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A mounting precision calibration method is used for detecting the mounting precision of a chip mounted on a die bonder in real time and calibrating the die bonder according to a detection result, and is characterized by comprising the following steps of:
acquiring the reference information of a mounting area corresponding to a chip to be mounted on a substrate before mounting;
mounting the chip to the corresponding mounting area;
acquiring actual mounting position information of the mounted chip on the substrate in real time;
comparing the actual mounting position with the reference information of the mounting area in real time, and calculating the mounting precision error of the chip;
and when the precision error exceeds a preset range, calibrating the die bonder.
2. The mounting accuracy calibration method according to claim 1, wherein the step of obtaining the reference information of the mounting area corresponding to the chip to be mounted on the substrate before mounting specifically includes the steps of:
acquiring mark point information preset on a substrate;
and reading the preset mounting area information, and generating mounting area reference information according to the preset mounting area information by taking the preset mark point as a reference.
3. The mounting accuracy calibration method according to claim 2, wherein: the preset mounting area information comprises outline data of an image projected on the substrate by the chip.
4. The mounting accuracy calibration method according to claim 1, wherein the step of identifying the chip and the substrate that have just been mounted and the step of obtaining the actual mounting position information of the chip on the substrate specifically includes the steps of:
acquiring image information of the mounted chip and the substrate;
and analyzing the image information to obtain the actual position of the mounted chip on the substrate.
5. The mounting accuracy calibration method according to claim 4, wherein the obtaining of the image information of the mounted chip specifically includes:
image information is acquired after the chip is placed on the substrate but at the time curing has not yet started.
6. The mounting accuracy calibration method according to claim 1, wherein comparing the actual mounting position of the chip on the substrate with the mounting area reference information, thereby calculating the mounting accuracy error of the chip specifically comprises the steps of:
comparing the actual mounting position of the chip on the substrate with the reference information of the mounting area to obtain a deviation value and an angle deviation value between the actual mounting position of the chip on the substrate and the preset mounting area in the X direction and the Y direction;
and respectively calculating errors and angle errors of the chip in the X direction and the Y direction according to the deviation values and the angle deviation values in the X direction and the Y direction.
7. The mounting accuracy calibration method according to claim 1, wherein when the accuracy error exceeds a preset range, the step of calibrating the die bonder specifically comprises the steps of:
judging whether the mounting precision error of the chip is larger than a first preset value or not;
judging whether the number of the chips with the mounting precision error larger than the first preset value on the substrate reaches a second preset value or not;
and when the first preset value and the second preset value are simultaneously met, calibrating the die bonder.
8. The mounting accuracy calibration method according to claim 7, wherein: the second preset value is greater than or equal to 1.
9. The mounting accuracy calibration method according to claim 1, wherein the calibration of the die bonder specifically includes the steps of:
and calibrating the operation initial point of the die bonder.
Priority Applications (1)
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|---|---|---|---|
| CN202111514222.1A CN115371543A (en) | 2021-12-10 | 2021-12-10 | Surface mounting precision calibration method |
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| CN202111514222.1A CN115371543A (en) | 2021-12-10 | 2021-12-10 | Surface mounting precision calibration method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393655A (en) * | 2023-12-08 | 2024-01-12 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
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2021
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117393655A (en) * | 2023-12-08 | 2024-01-12 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
| CN117393655B (en) * | 2023-12-08 | 2024-02-20 | 苏州易缆微光电技术有限公司 | High-precision mounting method and system for silicon optical chip and active device |
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