JPH11132735A - Ic lead floating inspection device and inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make adjustable an optical system easily so as to enable highly precise inspection. SOLUTION: A workpiece W (QFP type IC) is arranged on an inspection stage and is illuminated by a light source through a diffusion plate 6 from below, and image in the vertical and horizontal directional and in the direction of height of the workpiece W are photographed by a camera 1 at the same time by reflecting the image of the side face of the workpiece W upward by a mirror part 7. An image processing block 2 detects a predetermined section from the image obtained by photographing a jig whose dimension of the predetermined section is measured in advance by the camera 1. A coordinate system of the image photographed by the camera 1 is compensated based on coordinates obtained by measuring the dimension of the predetermined section and coordinates obtained by the detection, and a virtual plane with which a lead comes in contact is obtained using the value detecting the predetermined section in the compensated coordinate system to calculate the floating amount of the lead based on the distance between the virtual plane and the lead. Consequently, the adjustment of an optical system can be done easily, and highly precise inspection becomes possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC lead floating inspection apparatus and method for inspecting the floating (bending in the vertical direction) of each IC lead from an IC substrate ground plane (mounting surface) in a non-contact manner. is there.

[0002]

2. Description of the Related Art For example, a QFP type IC is mounted on a printed circuit board via a number of leads projecting in four directions of a package mold body, and each lead is joined to a pattern formed on the printed circuit board by soldering or the like. Is done. Each lead of such an IC protrudes horizontally from four sides of the rectangular mold body and is bent downward, and furthermore, the board joint at the tip is bent horizontally, and the tip horizontal portion is grounded to the printed circuit board. . In this case, variations (floating) occur in the vertical height of a large number of protruding leads in accordance with the bending accuracy of each lead. If such a lift of the lead is large, a lead that does not reliably come into contact with the substrate mounting surface may be generated, and the reliability of the function may be reduced.

In order to prevent such a problem from occurring, an inspection is performed after the manufacture of the IC to determine whether or not the lift of the leads is within a predetermined range. It is desirable that such an inspection be performed in a non-contact manner in order to minimize deformation of the lead. 2. Description of the Related Art Conventionally, as a method of inspecting the float of an IC lead, a method of simply inspecting the float by focusing on a variation in the vertical height of a lead protruding from the same side (side surface) of a mold body, And a method of inspecting the floating of the lead using a non-contact laser displacement meter, or the like. Gazette, JP-A-63-275937, JP-A-3-1
5707 and JP-A-3-2608).

[0004]

However, in the method of focusing on the variation of the leads protruding from each side (side surface) of the molded body of the IC, for example, in the case of the QFP type IC, the variation of all the leads on the four sides is considered. Is not comprehensively determined, and may be different from the floating amount when the IC is actually grounded. In addition, in the method of inspecting the lead based on the length of the shadow, it is difficult to adjust the optical system for creating the shadow and measuring the length of the shadow, and it is difficult to adjust the start-up. Furthermore, in the case of inspection using a laser displacement meter, when the IC is of the QFP type, all the leads cannot be measured at once due to its structure, and the lead is turned for each side while rotating the IC by 90 degrees. Must be measured, and there is a drawback that the accuracy is reduced and the measurement takes a long time.

On the other hand, there is a method of measuring the floating amount of each lead by actually grounding the IC on a flat surface in order to inspect the floating of the lead. However, the lead may be deformed at the time of the measurement. As described above, it is desirable that the lead be inspected in a non-contact manner without being grounded. Therefore, conventionally, the height of each lead of an IC is measured, and a virtual plane where the lead will be grounded to a printed circuit board is obtained by calculation based on the height data of each lead, and the distance from this virtual plane to each lead is determined. (Coplanarity inspection method) has been considered.

However, even in the above coplanarity inspection method, it is necessary to adjust an optical system for imaging an IC in order to obtain high accuracy, and it takes time to maintain and maintain the inspection apparatus and to perform actual inspection. Have a problem. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an IC lead floating inspection apparatus and an inspection method capable of easily performing adjustment of an optical system and performing high-precision inspection. Is what you do.

[0007]

According to a first aspect of the present invention, there is provided an imaging device for imaging an IC to be inspected from above, and an image viewed from a lateral direction of the IC. An optical unit for reflecting or refracting the light; and an image processing unit for processing an image obtained from the image pickup unit to calculate a floating amount of the lead of the IC in the vertical direction. The predetermined location is detected from an image obtained by imaging the jig being taken by the imaging unit, and the image is captured by the imaging unit based on the coordinates obtained by measuring the dimensions of these predetermined locations and the coordinates obtained by the detection. Correcting the coordinate system of the image, obtaining a virtual plane on which the lead is grounded by using a detection value obtained by detecting a predetermined location in the corrected coordinate system, and calculating the floating amount of the lead from the distance between the virtual plane and the lead. Special The image viewed from above and the image viewed from the side of the IC can be simultaneously captured by one image capturing means, so that the configuration of the optical system can be simplified and the jig can be used. By correcting the coordinate system of the captured image, adjustment of the optical system can be easily performed, and high-precision inspection can be performed.

In order to achieve the above object, a second aspect of the present invention provides a plurality of image pickup means for picking up an IC to be inspected from above and in a lateral direction, and processing an image obtained from each image pickup means to obtain the IC. Image processing means for calculating the vertical floating amount of the lead, wherein the image processing means determines the position of the predetermined location from an image obtained by imaging each of the imaging means with a jig whose dimensions have been measured in advance. Detection, correcting the coordinate system of the image captured by the imaging means based on the coordinates obtained by measuring the dimensions of these predetermined locations and the coordinates obtained by the detection, and detecting the predetermined location in the corrected coordinate system. Calculating the floating amount of the lead from the distance between the virtual plane and the lead using the value, and correcting the coordinate system of the image captured using the jig. Yo Performed simply the adjustment of the optical system, it is possible to highly precise inspection.

According to a third aspect of the present invention, in the first or the second aspect of the present invention, the image processing means corrects the coordinate system for each of a plurality of predetermined locations to be detected. Become. The invention of claim 4 is the invention of claim 1 or 2
In the invention, the image processing means averages the coordinates obtained by measuring the dimensions of a plurality of predetermined portions of the jig and the coordinates obtained by the detection for each of two components of the rectangular coordinate system, and views the image viewed from the lateral direction. Is calculated, the calculation for the correction can be simplified, and the error of the detection value obtained by detecting the predetermined portion of the jig can be reduced.

According to a fifth aspect of the present invention, in order to achieve the above object, an image of an IC to be inspected viewed from the lateral direction is reflected or refracted in the upward direction of the IC and viewed from the upward direction and the lateral direction of the IC. The image is simultaneously captured, the predetermined location is detected from an image obtained by imaging a jig in which the dimensions of the predetermined location are measured in advance, and the coordinates obtained by measuring the dimensions of these predetermined locations and the detection are obtained by the detection. The coordinate system of the image captured based on the coordinates is corrected, a virtual plane where the lead is grounded is determined using a detection value obtained by detecting a predetermined location in the corrected coordinate system, and the lead is determined from the distance between the virtual plane and the lead. Calculating the floating amount of the IC, the image viewed from above and the image viewed from the side of the IC can be simultaneously imaged by one image pickup means, and the configuration of the optical system can be simplified. In Together, performed in the adjustment of the optical system is simplified by correcting the coordinate system of an image captured by using a jig, it is possible to highly precise inspection.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments. In this embodiment, Q is used as the inspection target.
Although an FP-type IC is exemplified, the present invention is not limited to this, and may be another type of package IC such as an SOP-type IC having leads protruding from two opposing side surfaces.

FIG. 1 is a block diagram showing an IC lead floating inspection apparatus according to this embodiment. This inspection apparatus includes a diffusion plate 6 for diffusing light from a light source (not shown) irradiated from below a QFP type IC (hereinafter, referred to as a work W), and four directions on a side surface of the work W (partially shown). (Omitted), an optical system including a mirror section 7 for reflecting incident light at a substantially right angle, and a work W
The camera 1 includes an image processing block 2 that processes an image of the work W captured by the camera 1.

The image processing block 2 includes an A / D converter 3 for A / D converting an analog image signal captured from the camera 1 to obtain pixel data (shading data or binary data). The memory unit 4 for storing the obtained pixel data, the control of the entire image processing block 2 and the calculation (described later) for calculating a virtual plane based on the pixel data are performed, and finally the floating amount of each lead 8 is determined. A CPU 5 for performing various arithmetic processing such as measurement.

When the work W is arranged on an inspection stage (not shown) and irradiated with light from below through the diffusion plate 6, the camera 1 can display an image of the front of the work W (vertical and horizontal images) and a mirror as shown in FIG. Images of the four side surfaces of the workpiece W reflected by the unit 7 (images in the height direction) are simultaneously captured. It is desirable that the work W be disposed on the inspection stage such that the tip of the lead 8 is on the top.

As described above, the provision of the mirror section 7 enables two types of images in the vertical and horizontal directions and the height direction to be simultaneously captured by one camera 1, thereby simplifying the structure of the optical system and storing pixel data. There is an advantage that the capacity of the memory unit 4 can be reduced. Note that a prism may be used instead of the mirror unit 7. By the way, when the inspection apparatus is started up, there is a possibility that a subtle error may occur in the optical system of the camera 1 and the mirror unit 7. When the system is replaced, a subtle error may occur at the time of replacement. For example, if the mirror unit 7 is attached to the inspection stage so as to be inclined, the image in the height direction of the work W captured by the camera 1 will also be inclined. It is very difficult and takes a lot of time to adjust the positional relationship between the camera 1 and the mirror unit 7 with high accuracy in three dimensions.

Therefore, according to the present invention, a predetermined position (point) of a jig formed substantially the same as the outer shape of the workpiece W is measured in advance, and the jig is imaged by the camera 1 and pixels corresponding to the predetermined position are measured. Are calculated, and the coordinates of the optical system are corrected (calibrated) based on the actual dimensions of the jig and the pixel data (coordinate values) of the jig obtained by imaging with the camera 1. Thus, highly accurate adjustment of the optical system can be easily performed.

FIG. 3 shows a correction jig 1 according to this embodiment.
0, and the comb-shaped leg piece 1 is attached to the side surface of the rectangular main body 10a so as to have substantially the same shape as the IC which is the work W to be inspected.
0b are arranged in a large number. Such a jig 10 is manufactured by appropriately selecting a material such as a synthetic resin, and coordinates of a predetermined position (distance from a reference position) are measured in advance using a conventionally known three-dimensional measuring device or the like. In this embodiment, as shown in FIG. 4A, one leg in the vertical and horizontal directions of the jig body 10a is regarded as the origin of the X, Y orthogonal coordinate system, and each leg 10b
The position of the center between the front end of the tool and each leg 10b (hereinafter, referred to as a "measurement point") is measured in units of mm or μm, and as shown in FIG. The height dimension of each measurement point is measured as a Z coordinate value based on Then, the obtained actual measurement value (coordinate data) of the measurement point is input to the image processing block 2 of the IC lead floating inspection apparatus of the present embodiment and stored in the memory unit 4 (see the flowchart of FIG. 5). The input of the actual measurement value (coordinate data) may be directly input by a worker from a keyboard or the like, but it is possible to transfer the data using serial communication or collectively input the data via a recording medium such as an IC card. In addition, since the input of data does not need to be performed manually, labor and time can be saved, and problems such as input errors can be prevented.

Further, since the actual measurement of the predetermined position (measurement point) is performed after the jig 10 is manufactured, the accuracy of the calibration described later depends on the actual measurement accuracy of the jig 10. Therefore, the jig 10 does not need to be manufactured with high dimensional accuracy, and high processing accuracy is not required only by paying attention to storage management and the like, and the manufacturing cost can be reduced. Next, the jig 10 for which the actual measurement of the measurement points has been completed is arranged on the inspection stage. However, since calibration is performed later,
For example, even if the coordinates of the optical system such as the camera 1 and the mirror unit 7 are inclined, the operator only needs to easily arrange the jig 10 in the inspection stage. Then, images of the arranged jig 10 in the vertical and horizontal directions and the height direction are captured by the camera 1, and images in the vertical and horizontal directions and the height direction as shown in FIGS. 6 and 7 are obtained.
In the image processing block 2, the obtained gradation data or binarized data of the image is stored in the memory unit 4 as pixel data.

Then, the CPU 5 of the image processing block 2 detects the same position as the measurement point based on the pixel data. That is, as shown in FIG. 8, the edges detected by the grayscale sub-pixel edge (differentiation of grayscale data) or the binarized edge (differentiation of binary data) are points D and E, and the middle point of the line segment DE is A point F is calculated by detecting edges along a straight line that passes through and is orthogonal to the line segment DE. Further, as shown in FIG. 9, the edge is detected along a straight line that passes through the middle point of the line segment EH connecting the point H and the point E where the edge is detected on the extension line of the line segment DE and is orthogonal to the line segment EH. To calculate the point I. Thus, the points F and I correspond to the same positions as the measurement points of the jig 10, and the detection values (pixel coordinates (hereinafter, referred to as "detection points") at the same positions as all the measurement points (hereinafter, referred to as "detection points"). = Coordinates in pixel units)), and stored in the memory unit 4 as calibration data. Note that the jig 10 may be removed from the inspection stage after imaging with the camera 1 for calculating calibration data. In addition, it is desirable that the jig 10 is usually stored at room temperature, and the above processing is performed again at regular intervals to calibrate the calibration data, thereby ensuring accuracy.

When the actually measured value and the detected value for the same position (measurement point) of the jig 10 are obtained as described above, the CPU 5 of the image processing block 2 adjusts the detected value to the actually measured value so that the coordinate system is adjusted. Make corrections. In addition, correction of a minute space between adjacent measurement points, that is, correction of a point on a line segment connecting the measurement points is performed at a fixed ratio in the correction of the measurement point. 2
The dimensional space can be corrected (see the flowchart of FIG. 10). If the correction is performed by such a method, fine correction can be performed since the correction is performed for each measurement point. For example, when the image of the jig 10 is tilted due to an attachment error of the optical system (the camera 1 or the mirror unit 7) as shown in FIG. Can be modified.

The correction ratio of the height screen can be calculated by calculating the average of the actual measurement value and the detection value of the jig 10 for each of the X component and the Y component. According to this method, there is an advantage that the correction calculation is simplified and the measurement error at each measurement point can be reduced. Next, the procedure of the IC lead floating inspection will be described with reference to the flowchart of FIG.

First, the work W is placed on the inspection stage and imaged by the camera 1. The captured image is converted into a digital signal (pixel data) by the A / D converter 3 of the image processing block 2.
And stored in the memory unit 4. At this point, the workpiece W may be removed from the inspection stage. Then, the CPU 5 of the image processing block 2 calculates the pixel coordinate value of the center of the leading end of each lead (hereinafter, referred to as “lead position”) based on the pixel data stored in the memory unit 4. However, such a method of calculating the lead position is based on the jig 1
Since the method is the same as the method of calculating the detection point of 0, the description is omitted.

Subsequently, the CPU 5 uses the calibration data (actually measured and detected values of the jig 10) stored in the memory unit 4 to calibrate the calculated pixel coordinate value of each lead position, Is converted to the measured value [μm]. Specifically, FIG.
As shown in FIG. 3, the actual measurement points A (Xa, Ya), B of the jig 10 closest to each lead position P (Xp, Yp)
(Xb, Yb) is selected, and proportional constants m and n satisfying the relationship of vector P = m (vector A) + n (vector B) from the base point (that is, Xp = mXa + nXb, Yp = mYa)
The value of m, n) that satisfies + nYb is calculated. Where P
(Xp, Yp), A (Xa, Ya), B (Xb, Yb)
Are the pixel coordinate values, but the same relational expression should be established for the measured values of the points A and B. Therefore, the coordinates of the measured values of the points P, A, and B are represented by Pr (xp, yp),
If Ar (xa, ya) and Br (xb, yb), then x
The coordinate value of the point Pr can be obtained from the equations of p = mxa + nxb and yp = mya + nyb. Then, by adding the coordinate value of the obtained point Pr to the actually measured value of the base point, the coordinates of the lead position P can be finally converted from the pixel coordinate value to the coordinate value in μm. The calibration process as described above is performed for all the lead positions, and the actual coordinates [μm] of each lead position are obtained. Although the above description has been made in the vertical and horizontal directions (XY plane), the coordinates of the lead position are similarly converted from pixel coordinates to actual size coordinates in the height direction (Z direction).

That is, the coordinates of the lead position calculated from the image stored in the memory unit 4 are two-dimensional (vertical and horizontal directions and height direction) coordinates in pixel units corresponding to the resolution of the camera 1. On the other hand, the actual measurement value of the jig 10 is a three-dimensional coordinate, and if the above processing is performed based on the actual measurement value of the jig 10 and the detected value (pixel coordinate value), the lead position of the work W can be changed to a two-dimensional pixel. The coordinate system can be converted to a three-dimensional actual size coordinate system.

Next, the CPU 5 executes a program for calculating a virtual plane based on each converted lead position (actual size coordinates). A method for obtaining the virtual plane will be described with reference to the flowchart of FIG. . Prior to the inspection, the coordinates of the center of gravity G of the workpiece W are obtained in advance. Then, a lead position (point A) where the work W is grounded first when the work W is placed on a plane is obtained. First, the point A ₁ Z-coordinate is the largest. However, the Z coordinate is represented by the height of the IC from the surface of the molded body, and the larger the coordinate value, the farther (lower) from the molded body. Point A ₁ and center of gravity G
The perpendicular is lowered from the remaining lead position to the straight line connecting Then, the intersection of the perpendicular and the straight line A ₁ G and the point A
The lead _{position 1} the distance between d is minimized to a point A ₂ (see FIG. 15 (a)). Further, with respect to a straight line A ₂ G passing through the point A ₂ and the center of gravity G, a perpendicular line is lowered from the remaining lead position, and the point at which the distance between the intersection and the point A ₂ becomes minimum is A (FIG. 15B). reference).

Next, with respect to a straight line AG passing through the point A and the center of gravity G, a perpendicular line is lowered from the remaining lead position, and a lead position at which the distance d between the intersection of the perpendicular line and the straight line AG and the point A becomes minimum is defined as: It is assumed that the grounding point is the second point B (see FIG. 16). Then, a virtual plane can be determined by obtaining the third ground point C as follows. Therefore, I
Among the lead positions that do not exist on the same side (side) as the lead positions of points A and B with respect to the mold body of C, the lead position that minimizes the distance d to the straight line AB is determined, and this point and the point AB are connected. Let C be the point at which the area of the triangle formed by is maximum (subroutine).

If the center of gravity G exists in the triangle formed by connecting the obtained points ABC and the area of the triangle is equal to or more than one-eighth of the area of the square formed by connecting all the lead positions, three The points A, B, and C are set as ground points, and a plane including these points is calculated to be a virtual plane. If at least one of the above conditions is not satisfied, point A is discarded and point B
Is replaced with a point A and the point C is replaced with a point B, and a process of obtaining the point C again is performed.

If the point C that satisfies the condition is not found even after repeating the above processing loop four times, the point C is found by another procedure as follows (subroutine). First, the distance between a lead position outside the triangle formed by connecting the points A and B with the center of gravity G and not on the same side as the points A and B and the straight line AB is determined, and the point Q at which the distance is minimized is determined. (See FIG. 17). The point at which the area of the triangle formed by connecting the point Q and the points A and B is maximized is C. That is, the point at which the angle θ formed between the virtual plane to be obtained and the perpendicular drawn from the point Q to the straight line AB is the smallest (the area of the triangle ABQ is the largest) is the lead position closest to the virtual plane (FIG. 18). And the point C obtained in this way
The above-mentioned verification is performed for
The same processing is repeated until is obtained.

Once the virtual plane is obtained in this way, the distance between the virtual plane and each lead position can be easily calculated, and the distance between the virtual plane and the lead position is the amount of lead lift. At this time, if the limit value of the floating amount is set, the quality of the floating amount of the work W can be determined for each inspection. In the configuration for capturing an image of the vertical and horizontal direction and the height direction with the mirror portion 7 in one camera 1, each separate camera 1 ₁ image of horizontal and vertical directions and the height direction as shown in FIG. 19
Resolution compared is reduced when imaged with ~ 1 _3. That is, the camera 1 of the plurality as shown in FIG. 19 ₁ ...
High resolution can be obtained by imaging with. However, FIG.
As shown in the figure, if an image processing block 2 for processing an image obtained for each camera 1 ₁ ... Is provided, the cost increases, and one image processing block 2 is also used for a plurality of cameras 1 ₁ . Then, the captured images of the cameras 1 ₁ ... Must be sequentially processed, and there is a disadvantage that the processing time becomes long. Therefore, it is desirable to select an optimal device configuration in consideration of various conditions such as required accuracy, cost, and processing time.

[0030]

According to the first aspect of the present invention, there is provided an imaging means for imaging an IC to be inspected from above, an optical means for reflecting or refracting an image viewed from a lateral direction of the IC in an upward direction, and an imaging means. Image processing means for processing the image to be obtained and calculating the vertical lifting amount of the leads of the IC. The image processing means obtains the image of the jig in which the dimensions of the predetermined portions are measured in advance by the imaging means. The predetermined location is detected from the image to be obtained, and the coordinate system of the image captured by the imaging unit is corrected based on the coordinates obtained by measuring the dimensions of these predetermined locations and the coordinates obtained by the detection, and the corrected coordinate system is used. A virtual plane where the lead is grounded is obtained using the detection value obtained by detecting the predetermined position in the above, and the floating amount of the lead is calculated from the distance between the virtual plane and the lead. The picture I saw Can be imaged at the same time by one imaging means, and the configuration of the optical system can be simplified, and the adjustment of the optical system can be simplified by correcting the coordinate system of the image captured using the jig. And high-precision inspection can be performed.

According to a second aspect of the present invention, there are provided a plurality of image pickup means for picking up an image of an IC to be inspected from above and in a lateral direction, and processing the images obtained from each of the image pickup means to determine the amount of vertical lifting of the IC lead. Image processing means for calculating, wherein the image processing means detects the predetermined location from an image obtained by imaging the jig whose dimensions of the predetermined location are measured in advance by each imaging means, and detects the predetermined location. The coordinate system of the image picked up by the image pickup means is corrected based on the coordinates obtained by measuring the dimensions and the coordinates obtained by the detection, and the lead is grounded using a detection value obtained by detecting a predetermined position in the corrected coordinate system. Since the virtual plane is obtained and the floating amount of the lead is calculated from the distance between the virtual plane and the lead, the adjustment of the optical system can be easily performed by correcting the coordinate system of the image captured using the jig, thereby achieving high precision. There is an effect that inspection is possible.

According to a third aspect of the present invention, the image processing means corrects the coordinate system for each of a plurality of predetermined locations detected.
There is an effect that fine correction can be performed. According to a fourth aspect of the present invention, the image processing means averages the coordinates obtained by measuring the dimensions of a plurality of predetermined portions of the jig and the coordinates obtained by the detection for each of the two components of the rectangular coordinate system, from the horizontal direction. Since the correction ratio of the viewed image is calculated, there is an effect that the calculation for correction can be simplified and the error of the detection value obtained by detecting the predetermined portion of the jig can be reduced.

According to a fifth aspect of the present invention, an image of an IC to be inspected as viewed from the lateral direction is reflected or refracted in the upward direction of the IC so as to reflect the image.
C, the images viewed from above and from the lateral direction are simultaneously captured, and the predetermined location is detected from an image obtained by capturing a jig in which the dimensions of the predetermined locations are measured in advance. Correcting the coordinate system of the image captured based on the coordinates obtained by the measurement and the coordinates obtained by the detection, obtaining a virtual plane on which the lead is grounded using a detection value obtained by detecting a predetermined location in the corrected coordinate system, Since the lift amount of the lead is calculated from the distance between the virtual plane and the lead,
An image viewed from above and an image viewed from the side of the IC can be simultaneously captured by one image capturing unit, so that the configuration of the optical system can be simplified, and the image is captured using a jig. By correcting the coordinate system of the image, the adjustment of the optical system can be easily performed, and there is an effect that a highly accurate inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a block diagram showing an embodiment.

FIG. 2 is a diagram showing an image of a work taken by a camera in the above.

3A and 3B show a correction jig in the above embodiment, wherein FIG. 3A is a plan view, and FIGS. 3B and 3C are side views.

FIG. 4 is a diagram for explaining a calibration method in the above.

FIG. 5 is a flowchart for explaining a calibration method in the above.

FIG. 6 is a view showing vertical and horizontal images of the jig in the same embodiment.

FIG. 7 is a diagram showing an image in the height direction of the jig in the same embodiment.

FIG. 8 is a diagram for explaining a calibration method in the above.

FIG. 9 is a diagram for explaining a calibration method in the above.

FIG. 10 is a flowchart illustrating a calibration method according to the embodiment.

FIG. 11 is a diagram for explaining a calibration method in the above.

FIG. 12 is a flowchart illustrating an inspection method according to the embodiment.

FIG. 13 is a diagram for explaining the inspection method of the above.

FIG. 14 is a flowchart for explaining a virtual plane calculation method in the above energy management system;

FIG. 15 is a diagram for explaining a method of calculating a virtual plane in the above embodiment.

FIG. 16 is a diagram illustrating a method for calculating a virtual plane in the above embodiment.

FIG. 17 is a diagram illustrating a method for calculating a virtual plane in the above embodiment.

FIG. 18 is a diagram illustrating a method for calculating a virtual plane in the above embodiment.

FIG. 19 is a block diagram showing another configuration.

FIG. 20 is a diagram showing an image obtained by capturing the work in the above with a camera.

[Explanation of symbols]

 Reference Signs List 1 camera 2 image processing block 3 A / D conversion unit 4 memory unit 5 CPU 6 diffuser 7 mirror unit

Claims (5)

[Claims] An image pickup means for picking up an image of an IC to be inspected from above, an optical means for reflecting or refracting an image viewed from a lateral side of the IC in an upward direction, and an image processing means for processing an image obtained from the image pickup means. Image processing means for calculating the vertical floating amount of the lead of the lead, wherein the image processing means determines the predetermined position of the predetermined portion from an image obtained by imaging the jig whose dimensions have been measured in advance by the imaging device. Detection, correcting the coordinate system of the image captured by the imaging means based on the coordinates obtained by measuring the dimensions of these predetermined locations and the coordinates obtained by the detection, and detecting the predetermined location in the corrected coordinate system. An IC lead floating inspection apparatus, wherein a virtual plane on which a lead is grounded is obtained using a value, and a floating amount of the lead is calculated from a distance between the virtual plane and the lead. 2. A plurality of image pickup means for picking up an IC to be inspected in an upward direction and in a lateral direction, and an image processing means for processing an image obtained from each image pickup means to calculate a floating amount of an IC lead in a vertical direction. The image processing means detects the predetermined location from an image obtained by imaging the jig whose dimensions of the predetermined location are measured in advance by each imaging means, and obtains the measurement by measuring the dimensions of these predetermined locations. The coordinate system of the image captured by the imaging unit is corrected based on the obtained coordinates and the coordinates obtained by the detection, and a virtual plane where the lead is grounded using a detection value obtained by detecting a predetermined location in the corrected coordinate system is obtained, An IC lead floating inspection device, which calculates a lead floating amount from a distance between the virtual plane and the lead. 3. The IC lead floating inspection device according to claim 1, wherein the image processing means corrects the coordinate system for each of a plurality of predetermined positions detected. 4. The image processing means averages the coordinates obtained by measuring the dimensions of a plurality of predetermined portions of the jig and the coordinates obtained by detection for each of two components of a rectangular coordinate system, and looks at the horizontal direction. 3. The IC lead floating inspection device according to claim 1, wherein a correction ratio of the image is calculated. 5. An image of an IC to be inspected viewed from the lateral direction is reflected or refracted in the upward direction of the IC to simultaneously capture images of the IC viewed from the upward direction and the lateral direction. The predetermined location is detected from an image obtained by imaging the jig being set, and the coordinate system of the image captured based on the coordinates obtained by measuring the dimensions of these predetermined locations and the coordinates obtained by the detection is determined. An IC lead, wherein a virtual plane where the lead is grounded is obtained by using a detected value obtained by detecting a predetermined position in the corrected coordinate system, and a floating amount of the lead is calculated from a distance between the virtual plane and the lead. Floating inspection method.