CN214443912U

CN214443912U - Laser processing device

Info

Publication number: CN214443912U
Application number: CN202023061524.1U
Authority: CN
Inventors: 不公告发明人
Original assignee: Wuxi Lead Intelligent Equipment Co Ltd
Current assignee: Wuxi optical guide precision technology Co.,Ltd.
Priority date: 2020-12-17
Filing date: 2020-12-17
Publication date: 2021-10-22
Anticipated expiration: 2030-12-17

Abstract

The application discloses a laser processing device. The laser processing apparatus includes: a base plate; the feeding and discharging mechanism is arranged on one side of the bottom plate and used for providing workpieces to be processed and recycling the processed workpieces; the feeding and discharging mechanism is arranged on one side of the feeding and discharging mechanism, which is far away from the bottom plate, and comprises a fixed plate and at least two feeding and discharging assemblies, wherein at least one feeding and discharging assembly is arranged on a first side of the fixed plate, at least one other feeding and discharging assembly is arranged on a second side of the fixed plate, and the first side and the second side are arranged in a back-to-back manner; the processing mechanism is arranged on one side of the bottom plate and used for processing the workpiece to be processed, and the feeding and discharging assembly is used for transferring the workpiece to be processed to the processing mechanism from the feeding and discharging mechanism and/or transferring the processed workpiece to the feeding and discharging mechanism from the processing mechanism. This application can improve laser beam machining device's compactedness, reduces its volume, reduces simultaneously and goes up the unloading and interfere.

Description

Laser processing device

Technical Field

The present application relates to the field of laser processing technology, and more particularly, to a laser processing apparatus.

Background

The traditional laser processing device is complex in structure and large in occupied area, particularly in a loading and unloading transfer area, two groups of sucker assemblies are usually needed for respectively loading and unloading workpieces, and structural interference is easily caused because loading and unloading are in the same space; in order to avoid interference between feeding and discharging, the suction cup of the existing laser processing equipment is usually implemented by using a connecting frame (not shown) capable of rotating 180 degrees as shown in fig. 1, wherein the connecting frame rotates by taking a rotating shaft as a central shaft to transfer a workpiece to be processed from a feeding station to a discharging station or from a discharging station to the feeding station; however, the connecting frame occupies a large space on a plane parallel to the paper surface, so that the whole structure of the laser processing equipment is not compact.

SUMMERY OF THE UTILITY MODEL

The main technical problem who solves of this application is how to improve laser beam machining device's compactedness, reduces its volume, reduces simultaneously and goes up the unloading and interfere.

In order to solve the technical problem, the application adopts a technical scheme that: provided is a laser processing device. The laser processing apparatus includes: a base plate; the feeding and discharging mechanism is arranged on one side of the bottom plate and used for providing workpieces to be processed and recycling the processed workpieces; the feeding and discharging mechanism is arranged on one side of the feeding and discharging mechanism, which is far away from the bottom plate, and comprises a fixed plate and at least two feeding and discharging assemblies, wherein at least one feeding and discharging assembly is arranged on a first side of the fixed plate, at least one other feeding and discharging assembly is arranged on a second side of the fixed plate, and the first side and the second side are arranged in a back-to-back manner; the processing mechanism is arranged on one side of the bottom plate and used for processing the workpiece to be processed, and the feeding and discharging assembly is used for transferring the workpiece to be processed to the processing mechanism from the feeding and discharging mechanism and/or transferring the processed workpiece to the feeding and discharging mechanism from the processing mechanism.

The beneficial effects of the embodiment of the application are that: the feeding and discharging mechanism of the laser processing device is provided with at least two feeding and discharging assemblies, so that the feeding and discharging efficiency of a workpiece to be processed can be improved, and the processing and discharging of the workpiece to be processed can be improved; and the at least two unloading subassembly dispersions of going up of this application set up on the both sides that the fixed plate set up mutually back of the body, not only can reduce the interference of going up between the unloading subassembly, but also can reduce the space of arranging between the unloading subassembly of going up (for reducing the interference, the fixed plate is with the space of arranging between two or a plurality of unloading subassemblies of going up on one side must be great), and then can improve laser beam machining device's compactness, reduce its volume.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic view of a loading and unloading structure of a laser processing apparatus;

FIG. 2 is a schematic front view of an embodiment of the laser machining apparatus of the present application;

FIG. 3 is a schematic side view of an blanking mechanism of the laser machining apparatus of FIG. 2;

FIG. 4 is a schematic side view of a feed and discharge mechanism in the laser machining apparatus of the embodiment of FIG. 2;

fig. 5 is a schematic structural view of another state of the feeding and discharging mechanism of the embodiment in fig. 4.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.

In the integrated circuit manufacturing technology, wafer dicing and cutting are used as the front-end process in the semiconductor technology field, and the cutting effect and yield directly affect the quality and cost of the final product. The use of large-size, thin wafers and other substrate materials and the development of advanced packaging techniques present new challenges to wafer dicing processes, such as reducing chip cracking, reducing chip breakage rate, improving chip strength, and the like. The traditional diamond grinding wheel cutting process applied to chips such as memories, logic devices, micro electro mechanical systems, radio frequency identification devices and power devices is not suitable any more, and the laser nondestructive internal cutting technology becomes an optimal scheme for solving the wafer scribing process by virtue of the advantages of small heat affected zone, no splash, small edge breakage, high efficiency and the like.

But the existing laser processing device has the problems of not compact structure, large occupied area, easy interference of feeding and discharging and the like.

To solve the above technical problem, the present application first provides a laser processing apparatus, as shown in fig. 2 to 5, fig. 2 is a schematic front view of an embodiment of the laser processing apparatus of the present application; FIG. 3 is a schematic side view of an blanking mechanism of the laser machining apparatus of FIG. 2; FIG. 4 is a schematic side view of a feed and discharge mechanism in the laser machining apparatus of the embodiment of FIG. 2; fig. 5 is a schematic structural view of another state of the feeding and discharging mechanism of the embodiment in fig. 4. The laser processing apparatus 10 of the present embodiment includes: the device comprises a bottom plate 20, a feeding and discharging mechanism 30, a feeding and discharging mechanism 40 and a processing mechanism 50; the feeding and discharging mechanism 30 is arranged on one side of the bottom plate 20 and is used for providing workpieces to be processed and recycling the processed workpieces; the feeding and discharging mechanism 40 is disposed on a side of the feeding and discharging mechanism 30 away from the bottom plate 20, wherein the feeding and discharging mechanism 40 includes a fixing plate 41 and at least two feeding and discharging assemblies (not shown), at least one feeding and discharging assembly is disposed on a first side of the fixing plate 41, at least another feeding and discharging assembly is disposed on a second side of the fixing plate 41, and the first side and the second side are disposed opposite to each other; the processing mechanism 50 is disposed on one side of the bottom plate 20 and is used for processing a workpiece to be processed, and the feeding and discharging assembly is used for transferring the workpiece to be processed from the feeding and discharging mechanism 30 to the processing mechanism 50 or transferring the processed workpiece from the processing mechanism 50 to the feeding and discharging mechanism 30.

Among them, the bottom plate 20 of the present embodiment is disposed on a horizontal plane perpendicular to the paper plane; the feeding and discharging mechanism 30, the feeding and discharging mechanism 40 and the processing mechanism 50 are all arranged on the upper surface of the bottom plate 20; the lower surface of the base plate 20 may be fixed to a table to improve the smoothness of the laser machining apparatus 10.

The workpiece to be processed in this embodiment may be a silicon wafer, a ceramic material, or a glass material.

Further, in order to shorten the movement track of the feeding and discharging components in the feeding and discharging mechanism 40 and improve the feeding and discharging efficiency, the feeding and discharging components are arranged between the feeding and discharging mechanism 30 and the processing mechanism 50 in this embodiment, that is, the projection of the feeding and discharging components on the bottom plate 20 is located between the projection of the feeding and discharging mechanism 30 on the bottom plate 20 and the projection of the processing mechanism 50 on the bottom plate 20.

Further, the laser processing apparatus 10 of the present embodiment further includes a control mechanism (not shown) respectively connected to the feeding and discharging mechanism 30, the loading and unloading mechanism 40, and the processing mechanism 50, wherein the control mechanism is used for controlling the feeding and discharging mechanism 30, the loading and unloading mechanism 40, and the processing mechanism 50 to operate.

The control mechanism of this embodiment may be an industrial personal computer. Of course, in other embodiments, the control mechanism may also be a mobile terminal or the like, or the control mechanism may be composed of a control chip and various circuits electrically connected to the control chip.

In an application scenario, the control mechanism first controls the feeding and discharging mechanism 30 to obtain the workpiece to be processed, then controls the loading and unloading mechanism 40 to transfer the workpiece to be processed in the feeding and discharging mechanism 30 to the processing mechanism 50, then controls the processing mechanism 50 to perform laser processing on the workpiece to be processed, and finally controls the loading and unloading mechanism 40 to transfer the processed workpiece in the processing mechanism 50 back to the feeding and discharging mechanism 30.

Of course, in other embodiments, after the processing mechanism completes the laser processing of the workpiece to be processed, the control mechanism may also control the mechanical arm or other mechanisms to perform warehousing or detection operations on the processed workpiece.

Different from the prior art, the feeding and discharging mechanism 40 of the laser processing device 10 of the embodiment is provided with at least two feeding and discharging assemblies, so that the feeding and discharging efficiency of the workpiece to be processed can be improved, and the processing and discharging of the workpiece to be processed can be improved; and the at least two unloading subassemblies of this embodiment dispersion sets up on the both sides of the back of the body setting of fixed plate 41, not only can reduce the interference between the unloading subassembly of going up, but also can reduce the space of arranging between the unloading subassembly of going up (for reducing the interference, the fixed plate 41 is with the space of arranging between the unloading subassembly of going up on one side certainly great), and then can improve laser beam machining device 10's compactedness, reduce its volume.

The feeding and discharging mechanism 40 of the present embodiment includes two feeding and discharging assemblies respectively disposed on a first side and a second side of the fixing plate 41 opposite to each other; in other embodiments, to further improve the feeding and discharging efficiency of the feeding and discharging mechanism, the feeding and discharging mechanism may further include more than two feeding and discharging assemblies, for example, three feeding and discharging assemblies, wherein two feeding and discharging assemblies are disposed on the first side of the fixing plate, and another feeding and discharging assembly is disposed on the second side of the fixing plate.

One of the two loading and unloading assemblies of the present embodiment is used for loading, i.e. transferring the workpiece to be processed from the feeding and discharging mechanism 30 to the processing mechanism 50, and the other one is used for unloading, i.e. transferring the processed workpiece from the processing mechanism 50 to the feeding and discharging mechanism 30.

In other embodiments, the same loading and unloading assembly can be used for loading and unloading, i.e. the two loading and unloading assemblies work identically.

Optionally, the feeding and discharging assembly of this embodiment includes: the first driving assembly 420 is fixed on the first side of the fixing plate 41, and the suction cup assembly 430 is fixedly connected with the first driving assembly 420; the first driving assembly 420 drives the suction cup assembly 430 to move along a first direction and a second direction, wherein the first direction is perpendicular to the second direction, the first direction and the second direction are both parallel to the fixing plate 41, and the second direction is perpendicular to the base plate 20.

The first direction of the present embodiment may be an x-axis direction, the second direction may be a y-axis direction, and the bottom plate 20 is parallel to an x-z plane. In other embodiments, the first direction may be a y-axis direction, the second direction may be an x-axis direction, and the base plate is parallel to a y-z plane.

Optionally, the first driving assembly 420 of this embodiment includes a first driving member 421 and a second driving member 422, the first driving member 421 is fixed on the fixing plate 41, and the first driving member 421 is disposed along the first direction; the second driving member 422 is connected with the output end of the first driving member 421, the second driving member 422 is arranged along the second direction, and the suction cup assembly 430 is arranged at the output end of the second driving member 422; the first driving member 421 drives the second driving member 422 to move along the first direction, and the second driving member 422 drives the suction cup assembly 430 to move along the first direction; the second electric cylinder 422 drives the suction cup assembly 430 to move in the second direction.

The first driving member 421 of the present embodiment is a first electric cylinder, and the second driving member 422 is a second electric cylinder; in this embodiment, the fixed end of the first electric cylinder is fixed on the fixing plate 41, the lead screw of the first electric cylinder is arranged along the x-axis direction, and the output end of the lead screw is connected with the second electric cylinder; and the screw rod of the second electric cylinder is arranged along the y-axis direction.

In other embodiments, a driving assembly such as a cylinder assembly may be used instead of the electric cylinder assembly of the present embodiment.

Optionally, the feeding and discharging assembly of this embodiment further includes a bracket 440, one end of the bracket 440 is connected to the output end of the second electric cylinder 422, and the other end is provided with a suction cup assembly 430.

Optionally, the feeding and discharging assembly of this embodiment further includes a guiding assembly 410, and the guiding assembly 410 is slidably connected to the fixing plate 41 and the second driving member 422, and is configured to guide the second driving member 422 when the first driving member 421 drives the second driving member 422 to move along the first direction.

The guide component 410 of the embodiment provides a guide limiting function for the sucker component 430 to move along the first direction, so that the movement stability of the sucker component can be improved; in other embodiments, to simplify the structure, the guiding component may be omitted, or another structure may be adopted, for example, a magnetic conducting structure is adopted to realize the guiding and limiting function of the sucker component along the first direction.

Optionally, the guiding assembly 410 includes a sliding block 411 and a sliding rail 412, wherein the sliding block 411 moves in the sliding rail 412 along a first direction, the sliding rail 412 is fixed on the second driving member 422, the sliding block 411 is fixed on the fixing plate 41, and the sliding block 411 is embedded in the sliding rail 412.

The slide rail 412 of this embodiment fixes the fixed end of the second electric cylinder, and one end of the bracket 440 is connected to the output end of the lead screw of the second electric cylinder.

In an application scene, the control mechanism controls the first electric cylinder to work, the first electric cylinder drives the second electric cylinder to move along the x-axis direction, and meanwhile, the sliding block 411 moves along the x-axis direction in the sliding rail 412, so that the second electric cylinder drives the sucker assembly 430 to move along the x-axis direction through the bracket 440, and the relative positions of the sucker assembly 430 and the feeding and discharging mechanism 30 in the x-axis direction and the relative positions of the sucker assembly 430 and the processing mechanism 50 in the x-axis direction can be adjusted; the control mechanism controls the second electric cylinder to work, and the second electric cylinder drives the bracket 440 to move along the y-axis direction, so that the bracket 440 drives the sucker assembly 430 to move along the y-axis direction, and the relative positions of the sucker assembly 430 and the feeding and discharging mechanism 30 in the y-axis direction and the relative positions of the sucker assembly 430 and the processing mechanism 50 in the y-axis direction can be adjusted. Therefore, in this way, the chuck assembly 430 can accurately suck or place the workpiece to be processed, and accurately suck or place the processed workpiece.

The structure of another feeding and discharging assembly of this embodiment is similar to that of the feeding and discharging assembly described above, and is not described herein.

The chuck assembly 430 of this embodiment includes four chucks (not shown) arranged in a rectangular pattern in the x-z plane. In other embodiments, the suction cup assembly may further include one, two, three, or more than four suction cups, and the arrangement of the suction cups may be set according to the size, shape, surface condition, and other factors of the workpiece to be processed.

In other embodiments, other structures may be used in place of suction cups, such as gripping structures.

In this embodiment, the sliding block 411 is disposed on the fixing plate 41, and the sliding rail 412 is disposed on the second electric cylinder; in other embodiments, the sliding block can be arranged on the second electric cylinder, and the sliding rail can be arranged on the fixed plate; or the slide rail and the fixed plate or the electric cylinder are integrally arranged, namely the slide rail is integrally formed on the fixed plate or the electric cylinder.

Alternatively, the distance between the other end of the bracket 440 and the bottom plate 20 of the loading and unloading assembly disposed on the first side of the fixing plate 41 in the extracted state is different from the distance between the other end of the bracket 440 and the bottom plate 20 of the loading and unloading assembly disposed on the second side of the fixing plate 41 in the extracted state.

The extraction state of the loading and unloading assembly means that after the suction cup assembly 430 sucks a workpiece to be processed or a processed workpiece, the second driving member 422 drives the support 440 to move to the top along the second direction, and in the extraction state, the first driving member 421 drives the second driving member 422 to move along the first direction so as to drive the support 440 to move along the first direction.

The distance between the bracket 440 and the bottom plate 20 is different when the feeding and discharging assemblies arranged on the two opposite sides of the fixing plate 41 are in the extracting state, so that the sucker assemblies 430 arranged on the two opposite sides of the fixing plate 41 can be prevented from interfering with each other.

Optionally, the bracket 440 of the present embodiment includes a first connecting portion 441 disposed along the second direction and a second connecting portion 442 disposed along the third direction, one end of the first connecting portion 441 is connected to the output end of the second driving member 422, the other end of the first connecting portion 441 is connected to one end of the second connecting portion 442, and the other end of the second connecting portion 442 is disposed with the suction cup assembly 430; wherein the third direction is perpendicular to the first direction and the second direction.

When the first driving assembly 420 on the first side of the fixing plate 41 and the first driving assembly 420 on the second side of the fixing plate 41 are identical in structure and size, the size of the first connecting portion 441 of the feeding and discharging assembly disposed on the first side of the fixing plate 41 along the second direction is different from the size of the first connecting portion 441 of the feeding and discharging assembly disposed on the second side of the fixing plate 41 along the second direction (the difference between the two sizes should be larger than the size of the sucking disc assembly 430 along the second direction), so that mutual interference of the sucking disc assemblies 430 disposed on opposite sides of the fixing plate 41 can be avoided.

Optionally, in this embodiment, a projection of a motion trajectory of the chuck assembly 430 of the upper and lower loader assembly disposed on the first side along the first direction on the bottom plate 20 at least partially overlaps a projection of a motion trajectory of the chuck assembly 430 of the upper and lower loader assembly disposed on the second side along the first direction on the bottom plate 20.

The third direction of the present embodiment is the z-axis direction.

The bracket 440 of the present embodiment is disposed in an L-shape, and the suction cup is disposed perpendicular to the second connecting portion 442; in other embodiments, the support can also be arranged in a shape like a Chinese character '1', the sucker is arranged in parallel with the support, and the like, so that the sucker can absorb the workpiece to be machined along the direction of the screw rod of the second cylinder.

Further, the connection position of the first connection portion 441 and the second connection portion 442 is chamfered, so that the smoothness of the second connection portion 442 can be increased, and the smoothness of the suction cup assembly 430 can be increased.

In this embodiment, the projections of the motion tracks of the suction cup assemblies 430 arranged on the two opposite sides of the fixed plate 41 on the bottom plate 20 along the x-axis direction are at least partially overlapped, so that the arrangement space of the suction cup assemblies 430 on the x-z plane can be reduced, the structure of the loading and unloading mechanism 40 is more compact, the two first connecting portions 441 respectively connecting the suction cup assemblies 430 on the two opposite sides of the fixed plate 41 are different in size along the second direction (the structures and the control of the other assemblies are the same), and interference of the suction cup assemblies 430 on the two opposite sides of the fixed plate 41 can be avoided.

In this embodiment, two opposite sides of the fixing plate 41 are respectively disposed and only one loading and unloading assembly is disposed; in other embodiments, in order to improve the feeding and discharging efficiency, two or more feeding and discharging assemblies can be arranged on the same side of the fixed plate, and in order to avoid interference, the feeding and discharging assemblies on the same side of the fixed plate are synchronously controlled; the feeding and discharging assemblies on the same side share, do not share or partially share the electric cylinder assembly, the feeding and discharging assemblies on the same side share, do not share or partially share the sliding assembly, and the feeding and discharging assemblies on the same side share, do not share or partially share the support.

Alternatively, the processing mechanism 50 of the present embodiment includes: an air bearing processing platform 510, an objective lens assembly 520, and an automatic follower assembly (not shown); wherein, the air-floating processing platform 510 is fixed on the bottom plate 20 and used for bearing the workpiece to be processed; the objective lens assembly 520 is arranged on the side, away from the bottom plate 20, of the air floating processing platform 510, and is used for generating a laser beam and adjusting the relative position of the laser beam and a workpiece to be processed on the air floating processing platform 510 along the second direction; the automatic following assembly is electrically connected with the objective lens assembly 520 and is used for detecting the distance between the objective lens assembly 520 and the workpiece to be machined on the air-floating machining platform 510, and the objective lens assembly 520 adjusts the focal position of the laser beam on the workpiece to be machined on the air-floating machining platform 510 according to the distance.

In this embodiment, the air floating platform 510 is used as a laser processing platform, so that the operation speed and the stability of the workpiece to be processed can be improved, and the processing effect of the workpiece to be processed can be improved.

Further, in the embodiment, the distance between the objective lens assembly 520 and the workpiece to be machined located on the air floating machining platform 510 along the y-axis direction is detected by using the automatic following assembly, so that the objective lens assembly 520 adjusts the focal position of the laser beam on the workpiece to be machined according to the distance, the stability of the focal point on the workpiece to be machined can be improved, and the adverse effect of technologies such as Total Thickness Variation (TTV) on machining can be compensated.

Optionally, objective lens assembly 520 of this embodiment includes: a laser cutting part (not shown) and a third driving part (not shown), wherein the laser cutting part is used for generating a laser beam and processing a workpiece to be processed on the air-floating processing platform 510; the output end of the third driving member is connected to the laser cutting member, and is configured to drive the laser cutting member to approach or depart from the air floating processing platform 510 along the second direction, so as to adjust the depth of the focus on the workpiece to be processed on the air floating processing platform 510.

The third driving member of this embodiment is a third electric cylinder, a fixed end of the third electric cylinder is fixed on the bottom plate 20, a lead screw of the third electric cylinder is arranged along the y-axis direction, and an output end of the lead screw is connected with the laser cutting member; the control mechanism controls the third electric cylinder to work, and the third electric cylinder drives the laser cutting piece to move along the y-axis direction so as to adjust the focal depth of the laser beam on the workpiece to be machined.

In other embodiments, other actuators such as a pneumatic cylinder may be used in place of the third electric cylinder.

In this embodiment, the automatic following assembly is adopted to detect the distance between the objective lens assembly 520 and the workpiece to be machined on the air floating machining platform 510 along the y-axis direction, so that the objective lens assembly 520 adjusts the focal depth of the laser beam on the workpiece to be machined according to the distance, thereby ensuring that the focal point of the laser beam emitted by the laser cutting member is located at the same depth of the workpiece to be machined, and overcoming the following defects: the laser focus is too shallow, so that hidden cracks can not be formed on the workpiece to be processed easily, and the subsequent operation is influenced; the laser focus is too deep, dust is easy to generate, cracks are too large, the edge cracks of the workpiece to be processed are not straight, the appearance of the workpiece to be processed does not reach the standard, and the like.

The automatic following component of the embodiment can comprise detection components such as a height indicator, a piezoelectric ceramic motor and the like; the height gauge and the piezoelectric ceramic motor realize closed-loop control, and the realized focus precision can reach 0.1 micron; the fastest processing speed that the air floating processing platform 510 can realize can reach 1000 mm/s.

The laser cutting piece of the embodiment can integrate a laser light source, a focusing system and the like.

In other embodiments, the laser cutting element may further integrate a beam control system, which controls the beam characteristics of the laser beam, such as polarization direction, spot size, divergence angle, phase distribution, etc., and may finely adjust the focal position of the laser beam.

Optionally, the processing mechanism 50 of the present embodiment further includes: a turntable 530 and a fourth drive; wherein, the turntable 530 is arranged on the bottom plate 20, and the air-floating processing platform 510 is fixed on one side of the turntable 530 departing from the bottom plate 20; the output end of the fourth driving element is connected to the turntable 530 for driving the turntable 530 to move on a plane perpendicular to the second direction, and the turntable 530 drives the workpiece to be processed to move in the plane, so that the laser cutting element cuts the workpiece to be processed of the air floating processing platform 510 along the predetermined cutting path.

The fourth driving component of this embodiment may be composed of an air cylinder or an electric cylinder disposed along the first direction and an air cylinder or an electric cylinder disposed along the third direction, so as to respectively drive the rotary table to move along the first direction and the second direction, that is, to drive the rotary table 530 to move in the x-z plane, and the rotary table 530 drives the workpiece to be processed to move in the x-z plane, so as to adjust the position of the laser beam on the workpiece to be processed, and to process the workpiece to be processed along the preset processing lane by the laser beam.

Optionally, the feeding and discharging mechanism 30 of the present embodiment includes: a fifth driving member 310, a positioning assembly 320 and a feeding and discharging assembly 330; wherein, the fifth driving member 310 is disposed on the base plate 20; the positioning assembly 320 is disposed on the base plate 20; the feeding and discharging assembly 330 is connected to the output end of the fifth electric cylinder 310, and is driven by the fifth driving member 310 to transfer the workpiece to be processed on the carrier plate 340 to the positioning assembly 320 in the second direction and transfer the processed workpiece on the positioning assembly 320 to the carrier plate 340 in the second direction.

The fifth driving member 310 of this embodiment is a fifth electric cylinder, and a fixed end thereof is fixed on the bottom plate 20, and a screw rod of the fifth electric cylinder is arranged along the x-axis direction; the control mechanism controls the fifth electric cylinder to work, the fifth electric cylinder drives the feeding and discharging assembly 330 to move along the x-axis direction, and the feeding and discharging assembly 330 transports the workpiece to be processed on the carrier plate 340 to the positioning assembly 320 along the x-axis direction and transports the processed workpiece on the positioning assembly 320 to the carrier plate 340 along the x-axis direction.

In other embodiments, other actuators such as a pneumatic cylinder may be used in place of the fifth electric cylinder.

The positioning assembly 320 includes a turntable (not shown); the control mechanism controls the feeding and discharging assembly 330 to clamp the workpiece to be machined and then place the workpiece on the turntable, and the positions of the workpiece to be machined in the x-axis direction and the y-axis direction are respectively adjusted through the two groups of sliding assemblies and the like, so that the marking point on the workpiece to be machined after feeding can be within the visual field range of the camera in the machining mechanism 50.

Optionally, the feeding and discharging assembly 330 of the present embodiment includes: a material clamping arm 331, a second driving component 332 and a clamping component 333; one end of the material clamping arm 331 is connected to the fifth driving element 310, and moves along the second direction under the driving of the fifth driving element 310; the second driving assembly 332 is disposed at the other end of the material clamping arm 331, and is driven by the material clamping arm 331 to move along the first direction; the gripping component 333 is arranged at the output end of the second driving component 332, and the gripping component 333 grips the workpiece to be processed and the processed workpiece under the driving of the second driving component 332.

One end of the material clamping arm 331 is connected with the output end of the screw rod of the fifth driving member 310, and the screw rod is arranged along the x direction; the material clamping arm 331 moves along the x direction under the driving of the fifth driving element 310, and the material clamping arm 331 drives the second driving element 332 to move along the x direction, so that the clamping element 333 arranged at the output end of the second driving element 332 clamps the workpiece to be processed and the processed workpiece.

Optionally, the second driving assembly 332 of the present embodiment includes: a sixth driver 3321 and a seventh driver 3322; the sixth driving element 3321 is disposed at the other end of the material clamping arm 331; the seventh driving member 3322 is disposed at an output end of the sixth driving member 3321, the seventh driving member 3322 is disposed along the second direction, and the sixth driving member 3321 drives the seventh driving member 3322 to move along the second direction.

Optionally, the gripping assembly 333 of the present embodiment includes: an upper plate 3331 and a lower plate 3332; wherein, the upper clamping plate 3331 is arranged at the output end of the sixth driving piece 3321; the lower clamp plate 3332 is connected to an output end of the seventh driving member 3322, and the lower clamp plate 3332 is moved closer to or away from the upper clamp plate 3331 by the seventh driving member 3322 to clamp or release the member to be machined.

The seventh driving element 3322 and the upper clamping plate 3331 are arranged at the output end of the sixth driving element 3321, and the screw rod of the seventh driving element 3322 is arranged along the y direction; the control mechanism controls the seventh driving member 3322 to operate, and the seventh driving member 3322 drives the lower clamp plate 3332 to move closer to or away from the upper clamp plate 3331 to clamp or release the workpiece to be machined and the machined workpiece.

Further, the feeding and discharging assembly 330 further comprises a detecting member (not shown) disposed on the sixth driving member 3321 for triggering the laser processing apparatus 10 to alarm or stop when the upper clamping plate 3331 and the lower clamping plate 3332 are abnormally clamped.

When the extended upper clamp plate 3331 and the extended lower clamp plate 3332 cannot clamp the workpiece to be machined or the machined due to the fact that the workpiece to be machined or the machined is placed obliquely or in other situations, the sixth driving member 3321 is subjected to acting force along the x axis, and the control mechanism controls the laser machining device 10 to alarm or stop.

In other embodiments, it is also possible to provide only the seventh driving member and to provide the detection member on the upper and/or lower plates to detect gripping abnormality of the gripping assembly.

The sixth driving element is an air cylinder, and the seventh driving element is an air cylinder; in other embodiments, other driving members may be used instead of the cylinder, such as an electric cylinder or the like; structures such as suction cups can also be used instead of gripping assemblies.

Optionally, the feeding and discharging mechanism 30 of the present embodiment further includes: and a carrier plate 340 for carrying the workpiece to be processed and the processed workpiece. In other embodiments, a magazine may be used instead of a carrier plate.

In an application scenario, the control mechanism controls the fifth driving element 310 to work, the fifth driving element 310 drives the material clamping arm 331 to move along the x direction, and the material clamping arm 331 drives the second driving assembly 332 to move along the x direction, so that the material clamping assembly 333 arranged at the output end of the second driving assembly 332 moves to the position above the workpiece to be machined on the carrier plate 340; the control mechanism controls the seventh driving member 3322 to work, the seventh driving member 3322 drives the lower clamping plate 3332 to move away from the upper clamping plate 3331 along the y-axis direction so as to extend the lower clamping plate 3332 into the workpiece to be machined, and then the seventh driving member 3322 controls the lower clamping plate 3332 to move close to the upper clamping plate 3331 along the y-axis direction so as to clamp the workpiece to be machined; the control mechanism controls the fifth driving element 310 to drive the material clamping arm 331 to move along the x direction, so that the clamped workpiece to be machined is transferred to the positioning assembly 320, and initial positioning is realized; the control mechanism controls the feeding and discharging assembly to transfer the workpiece to be machined on the positioning assembly 320 onto the air floatation machining platform 510, and controls the objective lens assembly 520 to machine the workpiece to be machined on the air floatation machining platform 510; the control mechanism controls the loading and unloading assembly to transfer the processed workpiece on the air floating processing platform 510 back to the positioning assembly 320, and then controls the fifth driving element 310, the seventh driving element 3322, etc. to work so as to transfer the processed workpiece back to the carrier plate 340.

Be different from prior art, this application embodiment laser beam machining device includes: a base plate; the feeding and discharging mechanism is arranged on one side of the bottom plate and used for providing workpieces to be processed and recycling the processed workpieces; the feeding and discharging mechanism is arranged on one side of the feeding and discharging mechanism, which is far away from the bottom plate, and comprises a fixed plate and at least two feeding and discharging assemblies, wherein at least one feeding and discharging assembly is arranged on a first side of the fixed plate, at least one other feeding and discharging assembly is arranged on a second side of the fixed plate, and the first side and the second side are arranged in a back-to-back manner; the processing mechanism is arranged on one side of the bottom plate and used for processing the workpiece to be processed, and the feeding and discharging assembly is used for transferring the workpiece to be processed to the processing mechanism from the feeding and discharging mechanism and/or transferring the processed workpiece to the feeding and discharging mechanism from the processing mechanism. The feeding and discharging mechanism of the laser processing device is provided with at least two feeding and discharging assemblies, so that the feeding and discharging efficiency of a workpiece to be processed can be improved, and the processing and discharging of the workpiece to be processed can be improved; and the at least two unloading subassembly dispersions of going up of this application set up on the both sides that the fixed plate set up mutually back of the body, not only can reduce the interference of going up between the unloading subassembly, but also can reduce the space of arranging between the unloading subassembly of going up (for reducing the interference, the fixed plate is with the space of arranging between two or a plurality of unloading subassemblies of going up on one side must be great), and then can improve laser beam machining device's compactness, reduce its volume.

The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all equivalent mechanisms or equivalent processes performed by the present application and the contents of the appended drawings, or directly or indirectly applied to other related technical fields, are all included in the scope of the present application.

Claims

1. A laser processing apparatus, characterized by comprising:

a base plate;

the feeding and discharging mechanism is arranged on one side of the bottom plate and used for providing workpieces to be processed and recycling the processed workpieces;

the feeding and discharging mechanism is arranged on one side of the feeding and discharging mechanism, which is far away from the bottom plate, and comprises a fixed plate and at least two feeding and discharging assemblies, at least one feeding and discharging assembly is arranged on a first side of the fixed plate, at least one other feeding and discharging assembly is arranged on a second side of the fixed plate, and the first side and the second side are arranged in a back-to-back manner;

the feeding and discharging assembly is used for transferring the workpiece to be processed to the processing mechanism from the feeding and discharging mechanism and/or transferring the processed workpiece to the feeding and discharging mechanism from the processing mechanism.

2. The laser processing apparatus of claim 1, wherein the loading and unloading assembly comprises: the first driving assembly is fixed on the first side of the fixing plate, and the sucker assembly is fixedly connected with the first driving assembly;

the first driving component drives the sucker component to move along a first direction and a second direction, wherein the first direction is perpendicular to the second direction, the first direction and the second direction are both parallel to the fixing plate, and the second direction is perpendicular to the bottom plate.

3. The laser processing apparatus of claim 2, wherein the first drive assembly comprises: the first driving piece is fixed on the fixing plate and arranged along the first direction; the second driving piece is connected with the output end of the first driving piece, the second driving piece is arranged along the second direction, and the output end of the second driving piece is provided with the sucker component;

the first driving piece drives the second driving piece to move along the first direction, and the second driving piece drives the sucker assembly to move along the first direction; the second driving piece drives the sucker assembly to move along the second direction.

4. The laser processing device as claimed in claim 3, wherein the loading and unloading assembly further comprises a bracket, one end of the bracket is connected with the output end of the second driving member, and the other end of the bracket is provided with the sucker assembly;

the distance between the other end of the support and the bottom plate when the feeding and discharging assembly arranged on the first side is in the extracting state is different from the distance between the other end of the support and the bottom plate when the feeding and discharging assembly arranged on the second side is in the extracting state.

5. The laser processing apparatus of claim 4, wherein a projection of a motion trajectory of the suction cup assembly of the loading and unloading assembly disposed on the first side along the first direction on the base plate at least partially overlaps a projection of a motion trajectory of the suction cup assembly of the loading and unloading assembly disposed on the second side along the first direction on the base plate.

6. The laser processing apparatus as claimed in claim 4, wherein the loading and unloading assembly further comprises a guiding assembly slidably connecting the fixing plate and the second driving member for guiding the second driving member when the first driving member drives the second driving member to move along the first direction.

7. The laser processing apparatus according to claim 2, wherein the processing mechanism comprises:

the air floatation processing platform is fixed on the bottom plate and used for bearing the workpiece to be processed;

the objective lens assembly is arranged on one side, away from the bottom plate, of the air floatation processing platform and used for generating a laser beam and adjusting the relative position of the laser beam and the workpiece to be processed on the air floatation processing platform along the second direction;

and the automatic following assembly is electrically connected with the objective lens assembly and is used for detecting the distance between the objective lens assembly and the workpiece to be machined on the air-floating machining platform, and the objective lens assembly adjusts the focal position of the laser beam on the workpiece to be machined on the air-floating machining platform according to the distance.

8. The laser processing apparatus of claim 7, wherein the objective lens assembly comprises:

the laser cutting part is used for generating laser beams and processing the workpiece to be processed on the air floatation processing platform;

and the output end of the third driving piece is connected with the laser cutting piece and is used for driving the laser cutting piece to be close to or far away from the air floatation processing platform along the second direction so as to adjust the depth of the focus on the workpiece to be processed on the air floatation processing platform.

9. The laser processing apparatus according to claim 8, wherein the processing mechanism further comprises:

the rotary table is arranged on the bottom plate, and the air floatation processing platform is fixed on one side of the rotary table, which is far away from the bottom plate;

and the output end of the fourth driving part is connected with the rotary table and is used for driving the rotary table to move in a plane perpendicular to the second direction, and the rotary table drives the workpiece to be machined to move in the plane, so that the laser cutting part cuts the workpiece to be machined of the air floatation machining platform along a preset cutting path.

10. The laser processing apparatus according to claim 2, wherein the feed/discharge mechanism comprises:

the fifth driving piece is arranged on the bottom plate;

the positioning assembly is arranged on the bottom plate;

and the feeding and discharging assembly is connected with the output end of the fifth driving piece and is used for transferring the workpiece to be processed on the carrier plate to the positioning assembly in the first direction and transferring the workpiece to be processed on the positioning assembly to the carrier plate in the second direction under the driving of the fifth driving piece.

11. The laser machining apparatus of claim 10, wherein the feed and discharge assembly comprises:

one end of the material clamping arm is connected with the fifth driving piece and moves along the first direction under the driving of the fifth driving piece;

the second driving assembly is arranged at the other end of the material clamping arm and driven by the material clamping arm to move along the first direction;

and the clamping assembly is arranged at the output end of the second driving assembly and is driven by the second driving assembly to clamp the workpiece to be machined and the machined workpiece.

12. The laser processing apparatus of claim 11, wherein the second drive assembly comprises:

the sixth driving piece is arranged at the other end of the material clamping arm;

the seventh driving piece is arranged at the output end of the sixth driving piece;

the clamping assembly comprises:

the upper clamping plate is arranged at the output end of the sixth driving piece;

and the lower clamping plate is connected with the output end of the seventh driving piece and driven by the seventh driving piece to approach or separate from the upper clamping plate so as to clamp or release the workpiece to be machined and the machined workpiece.

13. The laser processing device as claimed in claim 12, wherein the feeding and discharging assembly further comprises a detecting member disposed on the sixth driving member for triggering the laser processing device to alarm or stop when the upper clamp plate and the lower clamp plate are clamped abnormally.