CN114758969B - Wafer back vision detection structure, detection method and related equipment - Google Patents
Wafer back vision detection structure, detection method and related equipment Download PDFInfo
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- CN114758969B CN114758969B CN202210404322.7A CN202210404322A CN114758969B CN 114758969 B CN114758969 B CN 114758969B CN 202210404322 A CN202210404322 A CN 202210404322A CN 114758969 B CN114758969 B CN 114758969B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the application discloses a wafer back vision detection structure, a detection method and related equipment, wherein the wafer back vision detection structure comprises the following steps: a lifting assembly; the sucker is connected to one end of the lifting assembly and is used for sucking the wafer; the detection assembly comprises a detection table, a line scanning camera and a moving assembly, wherein the line scanning camera is arranged on one side of the detection table, the detection table is rotatably connected with the moving assembly, and the sucker is arranged above the detection assembly. The wafer back vision detection structure can realize the production of the back wafer under the condition that the front alignment of the wafer is not changed, thereby improving the utilization rate of the wafer and reducing the production cost.
Description
Technical Field
The embodiment of the application relates to the technical field of wafer detection, in particular to a wafer back vision detection structure, a wafer back vision detection method, a computer readable storage medium and a control device.
Background
In the semiconductor device manufacturing process, the devices on the front and back sides of the wafer are not randomly arranged, and the devices must be aligned correctly on both sides to be effective, and each contact must penetrate the wafer to make a telecommunication contact. In the prior art, the wafer needs to be turned over for detection, and the defect of easy cracking and high waste cost is overcome.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art or related art.
To this end, a first aspect of the present application provides a wafer backside visual inspection structure.
The second aspect of the application provides a wafer backside visual inspection method.
A third aspect of the present application provides a computer-readable storage medium.
A fourth aspect of the present application provides a control apparatus.
In view of this, according to a first aspect of an embodiment of the present application, a wafer backside visual inspection structure is provided, including:
a lifting assembly;
the sucker is connected to one end of the lifting assembly and is used for sucking the wafer;
the detection assembly comprises a detection table, a line scanning camera and a moving assembly, wherein the line scanning camera is arranged on one side of the detection table, the detection table is rotatably connected with the moving assembly, and the sucker is arranged above the detection assembly.
In one possible embodiment, the lifting assembly comprises:
a motor;
the output end of the motor is connected with the lead screw;
the sliding block is arranged on the lead screw in a sliding manner;
wherein, the sucking disc is connected with the slider.
In one possible embodiment, the mobile assembly comprises:
an X-axis sliding rail;
the Y-axis sliding rail is arranged on the X-axis sliding rail in a sliding manner;
the moving piece is arranged on the Y-axis sliding rail in a sliding manner;
wherein, the detection platform is rotatably connected with the moving part.
In one possible embodiment, the wafer backside visual inspection structure further comprises:
the lifting assembly and the detection assembly are connected to the rack.
In a possible embodiment, the number of the detecting stations is plural, and plural detecting stations are arranged at intervals on the moving assembly.
According to a second aspect of the embodiments of the present application, a wafer backside visual inspection method is provided, which is used for the wafer backside visual inspection structure according to any one of the above-mentioned technical solutions, where the wafer backside visual inspection method includes:
acquiring wafer detection information, and controlling the lifting assembly to be sucked on a wafer to be detected;
controlling the lifting assembly to drive the wafer to be detected to be far away from the detection table;
the line scanning camera is driven by the detection platform to move on one side of the wafer far away from the lifting assembly, and the image information on the back surface of the wafer is collected by the line scanning camera.
In one possible embodiment, the wafer backside visual inspection method further includes:
acquiring the ink point position information of the back surface of the real-time wafer based on the image information;
and determining the electric shock setting position of the front surface of the wafer based on the ink point position information.
In one possible embodiment, the wafer backside visual inspection method further includes:
and controlling the lifting assembly to drive the wafer to move towards the position where the detecting assembly is located, arranging the wafer on the detecting table, and controlling the detecting table to move away from the lifting assembly.
According to a third aspect of the embodiments of the present application, a computer readable storage medium is provided, where a computer program is stored, to implement the wafer backside visual inspection method according to any one of the above-mentioned technical solutions.
According to a fourth aspect of the embodiment of the present application, there is provided a control apparatus including:
a memory storing a computer program;
a processor executing the computer program;
when the processor executes the computer program, the wafer back vision detection method according to any one of the technical schemes is realized.
Compared with the prior art, the application at least comprises the following beneficial effects: the wafer back vision detection structure provided by the embodiment of the application comprises the lifting component, the sucker and the detection component, wherein in the use process, the sucker can grab the wafer arranged on the detection table, the lifting component can drive the wafer to lift, the detection table drives the line scanning camera to move and rotate, the line scanning camera can acquire the ink dot information on the back of the wafer, and the ink dot information is further used for marking the front of the wafer based on the ink dot information, so that the production of the wafer on the back can be realized under the condition that the front alignment of the wafer is not changed, the utilization rate of the wafer is improved, and the production cost is reduced.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic block diagram of a wafer backside visual inspection structure according to one embodiment of the present application;
FIG. 2 is a schematic step flow diagram of a wafer backside visual inspection method according to one embodiment of the present application;
FIG. 3 is a block diagram of one embodiment of a computer readable storage medium according to the present application;
fig. 4 is a block diagram of a control device according to an embodiment of the present application.
The correspondence between the reference numerals and the component names in fig. 1 is:
1 sucking disc, 2 detecting table, 3 line scan camera, 4 motors, 5 lead screws, 6 sliders, 7X axis slide rails and 8Y axis slide rails.
Detailed Description
In order to better understand the above technical solutions, the following detailed description of the technical solutions of the embodiments of the present application is made by using the accompanying drawings and the specific embodiments, and it should be understood that the specific features of the embodiments of the present application are detailed descriptions of the technical solutions of the embodiments of the present application, and not limit the technical solutions of the present application, and the technical features of the embodiments of the present application may be combined with each other without conflict.
As shown in fig. 1, according to a first aspect of an embodiment of the present application, a wafer backside visual inspection structure is provided, including: a lifting assembly; the sucker 1 is connected to one end of the lifting assembly and is used for sucking the wafer; the detection assembly comprises a detection table 2, a line scanning camera 3 and a moving assembly, wherein the line scanning camera 3 is arranged on one side of the detection table 2, the detection table 2 is rotatably connected to the moving assembly, and the sucker 1 is located above the detecting assembly.
The wafer back vision detection structure provided by the embodiment of the application comprises the lifting component, the sucker 1 and the detection component, wherein in the use process, the sucker 1 can grab the wafer arranged on the detection table 2, the wafer can be driven to rise through the lifting component, then the detection table 2 drives the line scanning camera 3 to move and rotate, so that the ink point information on the back of the wafer can be obtained through the line scanning camera 3, and further, dotting marking is carried out on the front of the wafer based on the ink point information, so that the production of the wafer on the back can be realized under the condition that the front alignment of the wafer is not changed, the utilization rate of the wafer is improved, and the production cost is reduced.
In one possible embodiment, the lifting assembly comprises: a motor 4; the output end of the motor 4 is connected with the lead screw 5; the sliding block 6 is arranged on the screw rod 5 in a sliding manner; wherein the suction cup 1 is connected to the slider 6.
In this embodiment, the lifting assembly further includes a motor 4, a screw 5 and a slider 6, the screw 5 is driven to rotate by the motor 4, the screw 5 can drive the slider 6 to ascend or descend on the screw 5, the suction cup 1 is connected to the slider 6 again, and the suction cup 1 can ascend or descend relative to the detection table 2.
In one possible embodiment, the mobile assembly comprises: an X-axis sliding rail 7; the Y-axis sliding rail 8 is arranged on the X-axis sliding rail 7 in a sliding manner; the moving piece is arranged on the Y-axis sliding rail 8 in a sliding manner; wherein the detection stage 2 is rotatably connected to the moving member.
The moving assembly comprises an X-axis sliding rail 7, a Y-axis sliding rail 8 and a moving piece, so that the detecting table 2 can move in multiple dimensions through the moving assembly and can rotate at the same time, and the image information of the wafer can be conveniently collected through the line scanning camera 3.
In one possible embodiment, the wafer backside visual inspection structure further comprises: the rack, lifting assembly and detection assembly are connected to the rack.
In this embodiment, a stand is further included, with the mounting location provided for the lifting assembly and the detection assembly by the provision of the stand.
In one possible embodiment, the number of the inspection stations 2 is plural, and the plurality of inspection stations 2 are arranged on the moving assembly at intervals.
The inspection stations 2 are a plurality of inspection stations which are favorable for realizing the continuity of the inspection of the wafer.
As shown in fig. 2, a second aspect of an embodiment of the present application provides a wafer backside visual inspection method, which is used for the wafer backside visual inspection structure of any one of the above-mentioned technical solutions, and the wafer backside visual inspection method includes:
step 201: acquiring wafer detection information, and controlling the lifting assembly to be sucked on the wafer to be detected;
step 202: the lifting assembly is controlled to drive the wafer to be detected to be far away from the detection table;
step 203: the detection platform is used for driving the line scanning camera to move on one side of the wafer far away from the lifting assembly, and the line scanning camera is used for collecting image information on the back surface of the wafer.
The wafer back vision detection structure provided by the embodiment of the application comprises the lifting component, the sucker and the detection component, and by the wafer back vision detection method provided by the embodiment of the application, the sucker can grab the wafer arranged on the detection table, the wafer can be driven to lift by the lifting component, then the detection table is used for driving the line scanning camera to move and rotate, so that the ink point information on the back of the wafer can be obtained by the line scanning camera, and further, the marking is carried out on the front of the wafer based on the ink point information, so that the production of the wafer on the back can be realized under the condition that the front alignment of the wafer is not changed, the utilization rate of the wafer is improved, and the production cost is reduced.
In one possible embodiment, the wafer backside visual inspection method further includes: acquiring the ink point position information of the back surface of the real-time wafer based on the image information; and determining the electric shock setting position of the front surface of the wafer based on the ink point position information.
In the technical scheme, the ink point position information can be obtained by further analyzing the image information, so that dotting marking can be conveniently carried out on the front surface of the wafer based on the ink point information, and the production of the wafer on the back surface can be realized under the condition that the front surface alignment of the wafer is not changed, thereby improving the utilization rate of the wafer and reducing the production cost.
In one possible embodiment, the wafer backside visual inspection method further includes: the lifting assembly is controlled to drive the wafer to move towards the position of the detecting assembly, the wafer is arranged on the detecting table, and the detecting table is controlled to move away from the lifting assembly.
After the detection of one wafer is completed, the wafer can be far away from the lifting component under the action of the detection table, and the lifting component can be used for detecting the next wafer.
As shown in fig. 3, a third aspect of the embodiment of the present application proposes a computer readable storage medium 301, where the computer readable storage medium 301 stores a computer program 302, to implement a wafer backside visual inspection method according to any of the above-mentioned aspects.
The wafer back vision detection structure provided by the embodiment of the application comprises the lifting component, the sucking disc and the detection component, and the computer readable storage medium 301 provided by the embodiment of the application can be used for grabbing the wafer arranged on the detection table, driving the wafer to lift through the lifting component, then driving the line scanning camera to move and rotate through the detection table, acquiring the ink point information on the back of the wafer through the line scanning camera, further marking the front of the wafer based on the ink point information, and realizing the production of the wafer on the back under the condition of not changing the front alignment of the wafer, thereby improving the utilization rate of the wafer and reducing the production cost.
Based on such understanding, the technical solution of the present application may be embodied in the form of a software product, which may be stored in a non-volatile storage medium (may be a CD-ROM, a U-disk, a mobile hard disk, etc.), and includes several instructions for causing a computer device (may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective implementation scenario of the present application.
As shown in fig. 4, a fourth aspect of an embodiment of the present application proposes a control device including: a memory 401 storing a computer program; a processor 402 executing a computer program; the processor 402, when executing the computer program, implements the wafer backside visual inspection method according to any of the above aspects.
The wafer back vision detection structure provided by the embodiment of the application comprises the lifting component, the sucking disc and the detection component, the sucking disc can grab the wafer arranged on the detection table through the control device provided by the embodiment of the application, the wafer can be driven to rise through the lifting component, then the detection table is used for driving the line scanning camera to move and rotate, the ink point information on the back of the wafer can be obtained through the line scanning camera, and dotting marks are further carried out on the front of the wafer based on the ink point information, so that the production of the wafer on the back can be realized under the condition that the front alignment of the wafer is not changed, the utilization rate of the wafer is improved, and the production cost is reduced.
In some examples, the control device may also include a user interface, a network interface, a camera, radio Frequency (RF) circuitry, sensors, audio circuitry, WI-FI modules, and so forth. The user interface may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), etc., and the optional user interface may also include a USB interface, a card reader interface, etc. The network interface may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface), etc.
In an exemplary embodiment, the control apparatus may further include an input-output interface and a display device, wherein the respective functional units may communicate with each other through a bus. The memory stores a computer program, and a processor is configured to execute the program stored in the memory to perform the method in the above embodiment.
The storage medium may also include an operating system and a network communication module. The operating system is a program that manages the physical device hardware and software resources of the above-described methods, supporting the execution of information handling programs and other software and/or programs. The network communication module is used for realizing communication among all components in the storage medium and communication with other hardware and software in the information processing entity equipment.
From the above description of the embodiments, it will be apparent to those skilled in the art that the present application may be implemented by means of software plus necessary general hardware platforms, or may be implemented by hardware.
The present application is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or units referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present application.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (7)
1. The wafer back vision detection method is characterized by being used for a wafer back vision detection structure, and the wafer back vision detection structure comprises the following steps: a lifting assembly; the sucker is connected to one end of the lifting assembly and is used for sucking the wafer; the detection assembly comprises a detection table, a line scanning camera and a moving assembly, wherein the line scanning camera is arranged on one side of the detection table, the detection table is rotatably connected with the moving assembly, and the sucker is positioned above the detection assembly; the moving assembly includes: an X-axis sliding rail; the Y-axis sliding rail is arranged on the X-axis sliding rail in a sliding manner; the moving piece is arranged on the Y-axis sliding rail in a sliding manner; wherein the detection table is rotatably connected to the moving member;
the wafer back vision detection method comprises the following steps: acquiring wafer detection information, and controlling the lifting assembly to be sucked on a wafer to be detected;
controlling the lifting assembly to drive the wafer to be detected to be far away from the detection table;
the line scanning camera is driven to move on one side, far away from the lifting assembly, of the wafer through the detection table, and image information on the back surface of the wafer is collected through the line scanning camera;
acquiring the ink point position information of the back surface of the real-time wafer based on the image information;
and determining the electric shock setting position of the front surface of the wafer based on the ink point position information.
2. The wafer backside visual inspection method of claim 1, further comprising: and controlling the lifting assembly to drive the wafer to move towards the position where the detecting assembly is located, arranging the wafer on the detecting table, and controlling the detecting table to move away from the lifting assembly.
3. The method of claim 1, wherein the lifting assembly comprises: a motor;
the output end of the motor is connected with the lead screw;
the sliding block is arranged on the lead screw in a sliding manner;
wherein, the sucking disc is connected with the slider.
4. The wafer backside visual inspection method according to claim 1, wherein the wafer backside visual inspection structure further comprises: the lifting assembly and the detection assembly are connected to the rack.
5. The method of claim 1, wherein the plurality of inspection stations are spaced apart on the moving assembly.
6. A computer-readable storage medium storing a computer program for implementing the wafer backside visual inspection method according to any one of claims 1 to 5.
7. A control apparatus, characterized by comprising: a memory storing a computer program;
a processor executing the computer program;
wherein the processor, when executing the computer program, implements the wafer backside visual inspection method of any one of claims 1 to 5.
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