KR100570513B1 - Semiconductor chip attach system for semiconductor package manufacturing - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip attach system for manufacturing a semiconductor package. In the present invention, various structures capable of operating a plurality of semiconductor chips in a semiconductor chip assembly line, for example, a semiconductor chip alignment tool, a semiconductor chip attach tool, and a semiconductor After arranging the chip transfer tool and the like, using each of these components, the "semiconductor chip alignment process", the "semiconductor chip attach process", and the like are collectively performed on the plurality of semiconductor chips.

When the present invention is achieved, in the production line, unlike the prior art, the semiconductor chip alignment process, the semiconductor chip attach process, and the like can be carried out collectively for a plurality of semiconductor chips, thereby providing a semiconductor chip. The overall process time required for attach can be greatly reduced, and as a result, the smoothness of product production can be secured widely, thereby maximizing the overall product production efficiency.

Description

Semiconductor chip attach system for fabricating a semiconductor package

1 is an exemplary view showing a semiconductor chip attach system for manufacturing a semiconductor package according to the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip attach system for manufacturing a semiconductor package, for example, a lead on chip (LOC) type semiconductor package. The process of the present invention relates to a semiconductor chip attach system for manufacturing a semiconductor package that can maximize the production efficiency of an overall semiconductor chip attach process by performing a process of “semiconductor chip attach process” and a “semiconductor chip attach process” at a time.

In recent years, as the memory capacity of electronic and information devices has increased, semiconductor chips such as DRAM and SRAM have been increasingly integrated, and accordingly, the size of semiconductor chips has also increased.

However, in contrast to the increase in size of such semiconductor chips, packaging technology for packaging semiconductor chips is moving toward the direction of making the size of the final semiconductor chip package light and small in accordance with the trend of miniaturization and light weight of electronic and information devices.

In terms of structure, semiconductor chip package has a conventional type that uses a lead pad die pad and a LOC type that directly bonds the semiconductor chip with internal leads using an adhesive tape without using a die pad. It is roughly divided into.

In general, in the case of a conventional type package, internal leads must be arranged in the remaining areas other than the occupied area of the semiconductor chip, and thus, when the share of the semiconductor chip increases due to the multifunction and high integration of the semiconductor chip, There is a disadvantage that cannot be coped.

On the other hand, in the case of the LOC type package, since all internal leads can be arranged in a flat surface on the surface of the semiconductor chip without a die pad, there is an advantage that a larger size semiconductor chip can be mounted in a limited size package. As a result, even if the share of the semiconductor chip increases, it can flexibly cope with it. Accordingly, LOC packages have been applied to various high density packages that are recently required.

Various types of such conventional LOC type semiconductor packages are described, for example, in U.S. Patent No. 5428247, "Down-bonded lead on chip type semiconductor device", U.S. Patent No. 5572066. Lead on chip semiconductor device and method for its fabrication, US Patent No. 5733800 "Underfill coating for LOC package", US Patent No. 5821605 "LOC semiconductor package", US Patent Publication No. 5834830 "LOC package and fabricating method," and the like in more detail.

When manufacturing such a conventional LOC type semiconductor package, a production line first attaches a semiconductor chip to a LOC type lead frame strip.

Since the semiconductor chip attach process is performed at the earliest of the entire packaging processes of the LOC type semiconductor package, the semiconductor chip attach process has a great effect on the quality of the final LOC type semiconductor package. When an unexpected error occurs during the semiconductor chip attach process, the finally completed LOC type semiconductor package causes a serious problem in that it cannot perform a normal function. In the conventional production line, in order to prevent such a problem in advance, much effort has been put into "improving the process environment" of the semiconductor chip attach process.

In the above-described semiconductor chip attach process, first, in a production line, a semiconductor chip in a wafer state is separately separated through a sawing process and then, for example, the semiconductor chip is picked up through a pick-up place. Carry it to the chip alignment stage.

After that, in the production line, the semiconductor chip alignment stage is used to align the positions of the semiconductor chips one by one, and then the aligned semiconductor chips are attached to the attach regions of the lead frame strips one by one using the semiconductor chip attach tool. The semiconductor chip attach process is completed.

 However, there are some serious problems in operating such a conventional semiconductor chip attach process.

As described above, in the conventional production line, when the semiconductor chip attach process is performed, the semiconductor chip alignment stage is used to align the positions of the semiconductor chips one by one, and then the aligned semiconductor chips are attached one by one to the lead frame. Will proceed with the process.

However, in the case where the semiconductor chip attach process is performed through the above-described conventional process, each time the semiconductor chip is attached in the production line, the "semiconductor chip alignment process" and the "semiconductor chip attach process" are performed in individual units. "We have to repeat the process every time, so we have to deal with the problem of significantly increasing the overall process run time.

For example, assuming that 100 semiconductor chips are required to be attached, and that two steps of aligning and attaching one semiconductor chip are required, all of a minute is required. When the semiconductor chip attach process is performed by using the method, the entire process is inevitably performed on the semiconductor chip alignment process and the semiconductor chip attach process every time for 100 semiconductor chips. In addition to the time to transport the semiconductor chip, it takes only 100 minutes.

As such, when the overall process progress time increases, the production flow of the product is greatly delayed, and the production line has a problem that the production efficiency of the product is greatly reduced.                         

As described above, since the semiconductor chip attach process has a great influence on the function of the finally completed LOC type semiconductor package and requires a lot of caution, the production line is aware of the above-mentioned problems, and the specific measures are taken. The situation is not prepared.

Accordingly, an object of the present invention is to significantly reduce the overall process time required for attaching a semiconductor chip by greatly improving the method of aligning and attaching the semiconductor chip.

Another object of the present invention is to significantly reduce the processing time required for the semiconductor chip attach, to ensure the smooth progress of the product production, and eventually to significantly improve the overall product production efficiency.

Still other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, the present invention collectively collects a plurality of semiconductor chips that have been separated and transferred from a wafer into a plurality of alignment pockets, and then positions the semiconductor chips in the attach region of the lead frame strip. A semiconductor chip alignment tool that aligns collectively so as to correspond to a semiconductor chip, a semiconductor chip transfer tool that picks up and transfers a plurality of aligned semiconductor chips in a batch, and a semiconductor chip transferred by the semiconductor chip transfer tool. And a semiconductor chip attach tool for attaching collectively in a state arranged in the attach region of the frame strip.

When the present invention is achieved, in the production line, the "semiconductor chip alignment process" and "semiconductor chip attach process" are performed on a plurality of semiconductor chips using the above-described semiconductor chip alignment tool and semiconductor chip attach tool. By collectively proceeding, the overall process time required for semiconductor chip attach can be greatly reduced, and as a result, the smoothness of product production can be secured widely, thereby maximizing product production efficiency. .

Hereinafter, a semiconductor chip attach system for manufacturing a semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1, in one region of a semiconductor chip assembly line, semiconductor chips 2 which have been completed a pretreatment process, for example, a sawing process, are disposed in a state supported by the wafer support 10.

At this time, as shown in the figure, the semiconductor chip attach system for manufacturing a semiconductor package according to the present invention, as a whole, is composed of a combination of the semiconductor chip alignment tool 20, the semiconductor chip attach tool 40. The semiconductor chip alignment tool 20, the semiconductor chip attach tool 40, and the like are disposed at a predetermined distance from the above-described wafer support 10, in this case, the wafer support 10 and the semiconductor chip alignment tool 20. In between, a pickup place (not shown) for transporting the semiconductor chips 2 separated from the wafer 1 to the semiconductor chip alignment tool 20 is arranged.

At this time, the semiconductor chip alignment tool 20 collects a plurality of semiconductor chips 2 separated and transferred from the wafer 1 in a batch, and then positions the semiconductor chips 2 in a lead frame strip. The semiconductor chip attach tool 40 aligns the semiconductor chips 2 of the lead frame strip 3 to which the alignment process is completed. It attaches to a batch in the attach area A temporarily.

Here, the semiconductor chip transfer tool 30 is disposed between the semiconductor chip alignment tool 20 and the semiconductor chip attach tool 40. The semiconductor chip transfer tool 30 is the semiconductor chip alignment tool 20 described above. When the basic alignment process of the semiconductor chips 2 is completed, the semiconductor chips 2 are picked up and transferred to the semiconductor chip attach tool 40.

At this time, the semiconductor chip transfer tool 30 maintains the same size as the alignment flame (Align flame) 22 of the semiconductor chip alignment tool 20 to be described later so that a plurality of semiconductor chips can be handled at once.

Here, as shown in the figure, the semiconductor chip alignment tool 20 is composed of a combination of a stage 21 and an alignment frame 22. In this case, the alignment frame 22 forms a structure stably supported by the stage 21.

In this case, a plurality of alignment pockets 23 are arranged in the alignment frame 22, and the alignment pockets 23 are semiconductor chips 2 separated from the wafer 1, for example. In the case of being transported through the pick-up place, the semiconductor chips 2 are collectively collected. At this time, since each of the alignment pockets 23 maintains a pitch corresponding to each other with the attach region A of the leadframe strip 3, the semiconductor chips 2 carried from the wafer 1 are aligned. As soon as it is mounted in the pockets 23, it is possible to maintain the alignment enough to be immediately attached to the attach area A of the leadframe strip 3.

On the other hand, the semiconductor chip attach tool 40 described above is composed of a combination of a guide rail 41 and a mounting head 43 disposed on the guide rail 41. In this case, the guide rail 41 forms a structure supported by, for example, the support frame 42.

At this time, the guide rail 41 mounts the lead frame strip 3 so that the lead frame strip 3 supplied from the outside can be attached to the semiconductor chips 2 separated from the wafer 1. Guide to the bottom of the).

In addition, the mounting head 43 disposed on the upper portion of the guide rail 41 has the above-described semiconductor chip 2 and the lead frame strip 3 with the lead frame strip 3 reaching its bottom. In the case of the temporary arrangement in the attach region A of the semiconductor chip 2, the semiconductor chips 2 are lowered by the operation of the up / down shaft 44, and then the semiconductor chips 2 are heated and pressurized at a constant temperature and pressure, thereby providing the respective semiconductor chips 2 ) Can be attached to the attach region A of the leadframe strip 3.

At this time, the mounting head 43 maintains the same size as the lead frame strip 3 to heat / press the plurality of semiconductor chips 2 at once.

Hereinafter, the operation of the semiconductor chip attach system for manufacturing a semiconductor package according to the present invention having the above-described configuration will be described in detail.

First, in the production line, when the semiconductor chips 2 are separately separated from the wafer 1 through a pretreatment process, for example, a sawing process, each of the semiconductor chips separately separated by using a pick-up place, for example. Pick up (2) one by one.

Subsequently, in the production line, the picked-up individual semiconductor chips 2 are transported toward the semiconductor chip aligning tool 20 along, for example, arrow I, and then the semiconductor chips 2 are arranged on the alignment frame 22. It mounts in the said alignment pocket 23 sequentially. In the production line, this process is repeated continuously, so that the appropriate number of semiconductor chips 2 can be mounted in all the alignment pockets 23 of the alignment frame 22.

In this case, as described above, the alignment frame 22 includes a plurality of alignment pockets 23, and each of the alignment pockets 23 is connected to the attach area A of the lead frame strip 3. In order to maintain a corresponding pitch, in a production line, as soon as each semiconductor chip 2 is mounted in the alignment pockets 23, the semiconductor chips 2 are " attached regions of the lead frame strip 3 ". In order to maintain the alignment state that can be directly attached to A. In the end, the "semiconductor chip alignment process" can be carried out on a plurality of semiconductor chips 2 at a time in the production line. You can take advantage of it.

In the conventional case, since the "semiconductor chip alignment process" has been repeatedly performed every time the semiconductor chip is transported to the semiconductor chip alignment tool, the production line will inevitably suffer the problem of significantly increasing the overall process progress time. There was no choice but to.

In this case, the production flow of the overall product is greatly delayed, so that the production line has a problem that the production efficiency of the product is greatly reduced.

However, when the present invention is practiced, the production line uses the above-described aligning pockets 23 unique to the present invention to collectively perform the "semiconductor chip alignment process" for the plurality of semiconductor chips 2. By proceeding, the overall process execution time required for the "semiconductor chip aligning process" can be greatly reduced, and as a result, product smoothness can be widely secured and the best production efficiency can be maximized. .

On the other hand, in the production line, as soon as the alignment process of the semiconductor chips 2 using the semiconductor chip alignment tool 20 is completed, the semiconductor chips 2 may be selected using the semiconductor chip transfer tool 30. , Along with arrow II, to the semiconductor chip attach tool 40.

In this case, the lead frame strip 3 for attaching the semiconductor chips 2 to the guide rail 41 of the semiconductor chip attach tool 40 is preloaded.

In this state, in the production line, the semiconductor chips 2 are collectively arranged in the attach region A of the lead frame strip 3 using the semiconductor chip transfer tool 30, and then the mounting head 43 By heating and pressurizing each of the semiconductor chips 2 to a predetermined temperature and pressure by using a), each of the semiconductor chips 2 can be attached to the attach region A of the lead frame strip 3 at once.

In this case, as described above, a plurality of semiconductor chips 2 are arranged in each attach region A of the lead frame strip 3, and a mounting head 43 for heating / pressing the semiconductor chips 2 is provided. ) Maintains the same size as the leadframe strip 3 so that each semiconductor chip 2 can be pressed at a time, so in the production line, each semiconductor chip 2 has a respective attach area of the leadframe strip 3. Immediately after being arrayed in A, each of the semiconductor chips 2 can be collectively attached to the attach region A of the leadframe strip 3, and finally, the production line performs the "semiconductor chip attach process". Advantages that can be advanced to a plurality of semiconductor chips 2 at once can be obtained.

In the conventional case, the "semiconductor chip attach process" has been repeatedly performed each time one semiconductor chip is transported to the semiconductor chip attach tool, so that the overall process progress time in the production line is inevitably increased. I was forced to take.

In this case, the production flow of the overall product is greatly delayed, and as a result, the production line has no choice but to suffer the problem that the production efficiency of the product is greatly reduced.

However, in the case where the present invention is implemented, the production line can be used to carry out a "semiconductor chip attach process" for a plurality of semiconductor chips 2 collectively using the above-described mounting head 43 of the present invention. By doing so, the overall process execution time required for the "semiconductor chip attach process" can be greatly reduced, and as a result, the smoothness of product production can be widely secured, and as a result, the overall product production efficiency can be maximized. Can be.

Then, each time the attach process of the semiconductor chip in the production line, each component constituting the semiconductor chip attach system of the present invention, for example, the semiconductor chip alignment tool 20, semiconductor chip transfer tool 30, By systematically connecting the semiconductor chip attach tool 40, etc., a more rapid and stable semiconductor chip attach process can be achieved.

As described above, in the present invention, the "semiconductor chip alignment process" and the "semiconductor chip attach process" may be performed on a plurality of semiconductor chips at once, thereby maximizing the production efficiency of the overall semiconductor chip attach process. You can.

The present invention exhibits an overall useful effect in all kinds of semiconductor packages using not only the above-described lead frame strips, but also printed circuit boards.

And while certain embodiments of the invention have been described and illustrated, it will be apparent that the invention may be embodied in various modifications by those skilled in the art.

Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

As described in detail above, in the semiconductor chip attach system for manufacturing a semiconductor package according to the present invention, various structures for operating a plurality of semiconductor chips in a semiconductor chip assembly line, for example, a semiconductor chip alignment tool and a semiconductor chip attach tool After arranging the semiconductor chip transfer tool and the like, the semiconductor chip alignment process, the semiconductor chip attach process, and the like are carried out collectively with respect to the plurality of semiconductor chips.

When the present invention is achieved, in the production line, unlike the prior art, the semiconductor chip alignment process, the semiconductor chip attach process, and the like can be carried out collectively for a plurality of semiconductor chips, thereby providing a semiconductor chip. The overall process time required for attach can be greatly reduced, and as a result, the smoothness of product production can be secured widely, thereby maximizing the overall product production efficiency.

Claims (3)

A semiconductor chip alignment tool for collectively collecting a plurality of semiconductor chips separated from a wafer and then aligning the positions of the semiconductor chips in a manner corresponding to an attach region of a lead frame strip; A semiconductor chip transfer tool for picking up and transferring the plurality of aligned semiconductor chips in a batch; And a semiconductor chip attach tool for attaching the semiconductor chips conveyed by the semiconductor chip transfer tool in a state of being arranged in an attach region of the lead frame strip. system. The semiconductor chip alignment tool of claim 1, further comprising: a stage; Aligned to the upper part of the stage with a plurality of alignment pockets, when the semiconductor chips separated from the wafer are transferred, the alignment to collect and align the semiconductor chips collectively in the pockets A semiconductor chip attach system for manufacturing a semiconductor package comprising a frame. The semiconductor chip attach tool of claim 1, further comprising: a guide rail configured to guide the lead frame strip; When the semiconductor chips are disposed on the guide rail and the semiconductor chips are arranged in the attach region of the lead frame strip, the semiconductor chips are heated and pressed to attach the semiconductor chips to the attach region of the lead frame strip. The semiconductor chip attach system for manufacturing a semiconductor package comprising a mounting head.

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