JPS61173138U - - Google Patents

Info

Publication number
JPS61173138U
JPS61173138U JP1985055885U JP5588585U JPS61173138U JP S61173138 U JPS61173138 U JP S61173138U JP 1985055885 U JP1985055885 U JP 1985055885U JP 5588585 U JP5588585 U JP 5588585U JP S61173138 U JPS61173138 U JP S61173138U
Authority
JP
Japan
Prior art keywords
wire
tool
guide
bonding head
bond point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985055885U
Other languages
Japanese (ja)
Other versions
JPH0220833Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985055885U priority Critical patent/JPH0220833Y2/ja
Publication of JPS61173138U publication Critical patent/JPS61173138U/ja
Application granted granted Critical
Publication of JPH0220833Y2 publication Critical patent/JPH0220833Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案になる超音波ワイヤボンデイン
グ装置の一実施例を示す全体構成図、第２図はワ
イヤガイド部材の正面図、第３図ａ〜ｅはワイヤ
ボンド作業の工程を示す説明図、第４図は本考案
になる装置によるワイヤボンド状態を示す平面説
明図である。 １：ＸＹテーブル、２：ボンデイングヘツド、
４：ホーン、６：ツール、７：ワイヤ、３０：ワ
イヤガイド部材、３０ａ：ガイドスリツト。 Fig. 1 is an overall configuration diagram showing one embodiment of the ultrasonic wire bonding device according to the present invention, Fig. 2 is a front view of the wire guide member, and Figs. 3 a to e are explanatory diagrams showing the steps of wire bonding work. , FIG. 4 is an explanatory plan view showing the state of wire bonding by the apparatus according to the present invention. 1: XY table, 2: bonding head,
4: horn, 6: tool, 7: wire, 30: wire guide member, 30a: guide slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＸＹテーブル上に載架されたボンデイングヘツ
ドと、先端にツールが取付けられ該ツールが上下
動可能に前記ボンデイングヘツドに設けられたホ
ーンと、前記ツールの前方に配設され前記ツール
に挿通されたワイヤをガイドするように下方が開
放したガイドスリツトを有するワイヤガイド部材
とを備え、第１ボンド点と第２ボンド点との間を
前記ツールにより前記ワイヤを接続する超音波ワ
イヤボンデイング装置において、前記ワイヤガイ
ド部材を前記ボンデイングヘツドに固定したこと
を特徴とする超音波ワイヤボンデイング装置。 A bonding head mounted on an XY table, a horn provided on the bonding head with a tool attached to its tip so that the tool can move up and down, and a wire placed in front of the tool and inserted through the tool. and a wire guide member having a guide slit that is open at the bottom so as to guide the wire, and connects the wire between a first bond point and a second bond point using the tool, the wire guide An ultrasonic wire bonding apparatus characterized in that a member is fixed to the bonding head.
JP1985055885U 1985-04-15 1985-04-15 Expired JPH0220833Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985055885U JPH0220833Y2 (en) 1985-04-15 1985-04-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985055885U JPH0220833Y2 (en) 1985-04-15 1985-04-15

Publications (2)

Publication Number Publication Date
JPS61173138U true JPS61173138U (en) 1986-10-28
JPH0220833Y2 JPH0220833Y2 (en) 1990-06-06

Family

ID=30578980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985055885U Expired JPH0220833Y2 (en) 1985-04-15 1985-04-15

Country Status (1)

Country Link
JP (1) JPH0220833Y2 (en)

Also Published As

Publication number Publication date
JPH0220833Y2 (en) 1990-06-06

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