JPH0432530U - - Google Patents

Info

Publication number
JPH0432530U
JPH0432530U JP1990073403U JP7340390U JPH0432530U JP H0432530 U JPH0432530 U JP H0432530U JP 1990073403 U JP1990073403 U JP 1990073403U JP 7340390 U JP7340390 U JP 7340390U JP H0432530 U JPH0432530 U JP H0432530U
Authority
JP
Japan
Prior art keywords
bonding
wire
guide holes
wires
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990073403U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990073403U priority Critical patent/JPH0432530U/ja
Publication of JPH0432530U publication Critical patent/JPH0432530U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の実施例を示すワイヤボンダの
斜視図、第２図はそのボンデイングツールの部分
斜視図、第３図はそのクランプ部の斜視図、第４
図はＩＣ上に６０μｍピツチ電極が配置された場
合の複数ワイヤ同時ボンデイング状態を示す正面
図、第５図は従来の超音波ワイヤボンダの斜視図
、第６図はそのボンデイングツール端面部分の拡
大斜視図、第７図はその正面図、第８図は本考案
の他の実施例を示すボンデイング装置の概略構成
図である。 ６，２２，６１，６２，６３……ワイヤ、１１
，２１……ワイヤスプール、１２……ガイドホー
ル、１５，２３……ワイヤガイド穴、２４，５０
……ボンデイングツール、２５，５１……ボンデ
イングツール端面、３０，５２，５３，５４……
ワイヤクランプ、４０……電極。 Fig. 1 is a perspective view of a wire bonder showing an embodiment of the present invention, Fig. 2 is a partial perspective view of its bonding tool, Fig. 3 is a perspective view of its clamp section, and Fig. 4
The figure is a front view showing simultaneous bonding of multiple wires when 60 μm pitch electrodes are arranged on an IC, Figure 5 is a perspective view of a conventional ultrasonic wire bonder, and Figure 6 is an enlarged perspective view of the end face of the bonding tool. , FIG. 7 is a front view thereof, and FIG. 8 is a schematic configuration diagram of a bonding apparatus showing another embodiment of the present invention. 6, 22, 61, 62, 63...Wire, 11
, 21... Wire spool, 12... Guide hole, 15, 23... Wire guide hole, 24, 50
... Bonding tool, 25, 51 ... Bonding tool end face, 30, 52, 53, 54 ...
Wire clamp, 40...electrode.

Claims (1)

【実用新案登録請求の範囲】 ボンデイングワイヤを熱圧着、超音波接続又は
両者を併用するワイヤボンデイングにおいて、 (a) 超音波発振器と、超音波振動子と、コーン
と、ホーンから構成される１本のボンデイングア
ームの先端に設けられる複数個の違つた角度をも
つたワイヤガイド穴を有するボンデイングツール
と、 (b) 複数個のワイヤを同時にクランプでき、そ
のクランプ開閉動作が同時でかつ個々にできるワ
イヤクランプと、 (c) ワイヤガイド穴の数と同数のボンデイング
ワイヤを該ワイヤガイド穴に供給し、複数本のワ
イヤを１回のボンデイング動作で同時にワイヤボ
ンドする手段とを具備することを特徴とするワイ
ヤボンダ。[Scope of claim for utility model registration] In wire bonding using thermocompression bonding, ultrasonic bonding, or a combination of both, (a) one wire consisting of an ultrasonic oscillator, an ultrasonic vibrator, a cone, and a horn; (b) A bonding tool that has a plurality of wire guide holes with different angles provided at the tip of a bonding arm; (b) A wire that can clamp multiple wires at the same time and that can open and close the clamp simultaneously and individually. (c) a means for supplying the same number of bonding wires as the number of wire guide holes to the wire guide holes and simultaneously wire-bonding a plurality of wires in one bonding operation. wire bonder.
JP1990073403U 1990-07-12 1990-07-12 Pending JPH0432530U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990073403U JPH0432530U (en) 1990-07-12 1990-07-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990073403U JPH0432530U (en) 1990-07-12 1990-07-12

Publications (1)

Publication Number Publication Date
JPH0432530U true JPH0432530U (en) 1992-03-17

Family

ID=31612189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990073403U Pending JPH0432530U (en) 1990-07-12 1990-07-12

Country Status (1)

Country Link
JP (1) JPH0432530U (en)

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