JPS63195730U - - Google Patents

Info

Publication number
JPS63195730U
JPS63195730U JP1987087430U JP8743087U JPS63195730U JP S63195730 U JPS63195730 U JP S63195730U JP 1987087430 U JP1987087430 U JP 1987087430U JP 8743087 U JP8743087 U JP 8743087U JP S63195730 U JPS63195730 U JP S63195730U
Authority
JP
Japan
Prior art keywords
bonding
horn
wire
wedge
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987087430U
Other languages
Japanese (ja)
Other versions
JPH0617291Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987087430U priority Critical patent/JPH0617291Y2/en
Publication of JPS63195730U publication Critical patent/JPS63195730U/ja
Application granted granted Critical
Publication of JPH0617291Y2 publication Critical patent/JPH0617291Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例の概略図、第３図は従
来のワイヤーボンデイング装置の断面図である。 １……ボンデイングウエツジ、２……ホーン、
３……ワイヤー、４，７，１０……クランパ、５
……凹状パツケージ、６……半導体素子、８……
貫通孔、９……ワイヤーガイド孔。 FIG. 1 is a sectional view of the first embodiment of the present invention;
The figure is a schematic diagram of a second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional wire bonding apparatus. 1... Bonding wedge, 2... Horn,
3...Wire, 4,7,10...Clamper, 5
...Concave package, 6...Semiconductor element, 8...
Through hole, 9...Wire guide hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子とパツケージインナーリードとを電
気的に結合させるウエツジタイプのワイヤーボン
デイング装置において、超音波を発生させるホー
ンと、ホーン先端に取付けられボンデイングワイ
ヤーを半導体素子に圧着するボンデイングウエツ
ジと、ボンデイングウエツジの上方に配置されホ
ーンとは独立して動作を行うワイヤーカツト用の
クランパとを有することを特徴とするワイヤーボ
ンデイング装置。 A wedge-type wire bonding device that electrically connects a semiconductor element and a package inner lead includes a horn that generates ultrasonic waves, a bonding wedge that is attached to the tip of the horn and crimps the bonding wire to the semiconductor element, and a bonding wedge that A wire bonding device comprising a clamper for wire cutting arranged above and operating independently of a horn.
JP1987087430U 1987-06-05 1987-06-05 Wire-bonding equipment Expired - Lifetime JPH0617291Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987087430U JPH0617291Y2 (en) 1987-06-05 1987-06-05 Wire-bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987087430U JPH0617291Y2 (en) 1987-06-05 1987-06-05 Wire-bonding equipment

Publications (2)

Publication Number Publication Date
JPS63195730U true JPS63195730U (en) 1988-12-16
JPH0617291Y2 JPH0617291Y2 (en) 1994-05-02

Family

ID=30944635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987087430U Expired - Lifetime JPH0617291Y2 (en) 1987-06-05 1987-06-05 Wire-bonding equipment

Country Status (1)

Country Link
JP (1) JPH0617291Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050931A (en) * 1983-08-31 1985-03-22 Hitachi Ltd Vertical feed type wire bonder
JPS63127542A (en) * 1986-11-18 1988-05-31 Toshiba Corp Wire bonding equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050931A (en) * 1983-08-31 1985-03-22 Hitachi Ltd Vertical feed type wire bonder
JPS63127542A (en) * 1986-11-18 1988-05-31 Toshiba Corp Wire bonding equipment

Also Published As

Publication number Publication date
JPH0617291Y2 (en) 1994-05-02

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