JPH0235441U - - Google Patents
Info
- Publication number
- JPH0235441U JPH0235441U JP1988113066U JP11306688U JPH0235441U JP H0235441 U JPH0235441 U JP H0235441U JP 1988113066 U JP1988113066 U JP 1988113066U JP 11306688 U JP11306688 U JP 11306688U JP H0235441 U JPH0235441 U JP H0235441U
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- electrode portion
- bonding device
- spark rod
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の第1の実施例を示す側面図、
第2図は本考案の第2の実施例を示す側面図、第
3図は従来のワイヤボンデイング装置のスパーク
ロツドを示す側面図、第4図は従来のワイヤボン
デイング装置の摩耗したスパークロツドを示す側
面図である。
1,1a;スパークロツド、2,2a;電極部
、3;金属細線、4;キヤピラリー、5;ボール
、6;成形位置が悪いボール、7,7a;放電用
突起、8;放電部分。
FIG. 1 is a side view showing the first embodiment of the present invention;
Fig. 2 is a side view showing a second embodiment of the present invention, Fig. 3 is a side view showing a spark rod of a conventional wire bonding device, and Fig. 4 is a side view showing a worn spark rod of a conventional wire bonding device. It is. 1, 1a; Spark rod; 2, 2a; Electrode portion; 3; Fine metal wire; 4; Capillary; 5; Ball;
Claims (1)
イヤボンデイング装置のスパークロツドにおいて
、電極部と、この電極部に対し着脱可能に取付け
られた放電用突起とを有することを特徴とするワ
イヤボンデイング装置のスパークロツド。 1. A spark rod for a wire bonding device for connecting a semiconductor chip and a lead frame, the spark rod for a wire bonding device comprising an electrode portion and a discharge protrusion detachably attached to the electrode portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988113066U JPH0235441U (en) | 1988-08-29 | 1988-08-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988113066U JPH0235441U (en) | 1988-08-29 | 1988-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0235441U true JPH0235441U (en) | 1990-03-07 |
Family
ID=31352575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988113066U Pending JPH0235441U (en) | 1988-08-29 | 1988-08-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0235441U (en) |
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1988
- 1988-08-29 JP JP1988113066U patent/JPH0235441U/ja active Pending