JPH0383943U - - Google Patents

Info

Publication number
JPH0383943U
JPH0383943U JP1989144086U JP14408689U JPH0383943U JP H0383943 U JPH0383943 U JP H0383943U JP 1989144086 U JP1989144086 U JP 1989144086U JP 14408689 U JP14408689 U JP 14408689U JP H0383943 U JPH0383943 U JP H0383943U
Authority
JP
Japan
Prior art keywords
wire
bonding
wires
guide holes
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989144086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989144086U priority Critical patent/JPH0383943U/ja
Publication of JPH0383943U publication Critical patent/JPH0383943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示すワイヤボンダの
斜視図、第２図はそのボンデイングツールの端面
部分の拡大斜視図、第３図はそのボンデイングツ
ールの正面図、第４図は従来の超音波ワイヤボン
ダの斜視図、第５図はその超音波ワイヤボンダの
ボンデイングツールの端面部分の拡大斜視図、第
６図はそのボンデイングツールの正面図、第７図
は本考案の他の実施例を示す超音波ワイヤボンデ
イング状態を示す図である。 ６，２２，３０〜３３……ワイヤ、１０……ワ
イヤクランプ、１１，２１……ワイヤスプール、
１２……ガイドホール、１３……ＩＣ、１５，２
３……ワイヤガイド穴、１７，２７……ボンデイ
ングツール、１８，２８……ツール端面、１９…
…電極、２０……超音波発振器。 Fig. 1 is a perspective view of a wire bonder showing an embodiment of the present invention, Fig. 2 is an enlarged perspective view of the end face portion of the bonding tool, Fig. 3 is a front view of the bonding tool, and Fig. 4 is a conventional ultrasonic wave bonding tool. FIG. 5 is an enlarged perspective view of the end face portion of the bonding tool of the ultrasonic wire bonder, FIG. 6 is a front view of the bonding tool, and FIG. 7 is an ultrasonic wire bonder showing another embodiment of the present invention. It is a figure showing a wire bonding state. 6, 22, 30-33... wire, 10... wire clamp, 11, 21... wire spool,
12...Guide hole, 13...IC, 15,2
3... Wire guide hole, 17, 27... Bonding tool, 18, 28... Tool end surface, 19...
... Electrode, 20 ... Ultrasonic oscillator.

Claims (1)

【実用新案登録請求の範囲】 ボンデイングワイヤを超音波接続するワイヤボ
ンダにおいて、 (a) 超音波発振器、超音波振動子、コーン及び
ホーンを有する１本のボンデイングアームの先端
に複数個のワイヤガイド穴を有するボンデイング
ツールと、 (b) 前記ワイヤガイド穴の数と同数のワイヤを
ワイヤガイド穴に供給する手段とを設け、 (c) 複数本のワイヤを１回のボンデイング動作
で同時にワイヤボンドすることを特徴とするワイ
ヤボンダ。[Claims for Utility Model Registration] A wire bonder for ultrasonically connecting bonding wires: (a) a bonding arm having an ultrasonic oscillator, an ultrasonic vibrator, a cone, and a horn; (b) means for supplying the same number of wires to the wire guide holes as the number of the wire guide holes, and (c) wire bonding a plurality of wires at the same time in one bonding operation. Characteristic wire bonder.
JP1989144086U 1989-12-15 1989-12-15 Pending JPH0383943U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989144086U JPH0383943U (en) 1989-12-15 1989-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989144086U JPH0383943U (en) 1989-12-15 1989-12-15

Publications (1)

Publication Number Publication Date
JPH0383943U true JPH0383943U (en) 1991-08-26

Family

ID=31690823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989144086U Pending JPH0383943U (en) 1989-12-15 1989-12-15

Country Status (1)

Country Link
JP (1) JPH0383943U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067342A (en) * 2005-09-02 2007-03-15 Ultrasonic Engineering Co Ltd Method of bonding wire and wire bonding apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176138A (en) * 1986-01-29 1987-08-01 Toshiba Corp Wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176138A (en) * 1986-01-29 1987-08-01 Toshiba Corp Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067342A (en) * 2005-09-02 2007-03-15 Ultrasonic Engineering Co Ltd Method of bonding wire and wire bonding apparatus

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