JPS6315045U - - Google Patents
Info
- Publication number
- JPS6315045U JPS6315045U JP10680586U JP10680586U JPS6315045U JP S6315045 U JPS6315045 U JP S6315045U JP 10680586 U JP10680586 U JP 10680586U JP 10680586 U JP10680586 U JP 10680586U JP S6315045 U JPS6315045 U JP S6315045U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- guide hole
- led out
- width direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
Landscapes
- Wire Bonding (AREA)
Description
第１図は実施例のボンデイング用ツールの全体
を示す斜視図、第２図は実施例のボンデイング用
ツールの下面図、第３図はワイヤをガイド穴に挿
通させた状態の実施例のボンデイング用ツールの
要部を示す断面図、第４図はワイヤ及び電極間の
接合を行なつている状態の実施例のボンデイング
用ツールを示す正面図、第５図は従来のボンデイ
ング用ツールの全体を示す斜視図、第６図は従来
のボンデイング用ツールの上面図、第７図は従来
のボンデイング用ツールの下面図、第８図はワイ
ヤをガイド穴に挿通させた状態の従来のボンデイ
ング用ツールの要部を示す断面図、第９図はワイ
ヤ及び電極間の接合を行なつている状態の従来の
ボンデイング用ツールの正面図である。
１３…装着部、１７…ボンデイング面、２３，
２３′…電極（例えばボンデイングパツド）、２
５…ボンデイングワイヤ、３１…ボンデイング用
ツール、３３…ガイド穴。
Fig. 1 is a perspective view showing the entire bonding tool of the embodiment, Fig. 2 is a bottom view of the bonding tool of the embodiment, and Fig. 3 is a bonding tool of the embodiment with the wire inserted through the guide hole. A cross-sectional view showing the main parts of the tool, FIG. 4 is a front view showing an embodiment of the bonding tool in a state where bonding between wires and electrodes is being performed, and FIG. 5 shows the entire conventional bonding tool. 6 is a top view of a conventional bonding tool, FIG. 7 is a bottom view of a conventional bonding tool, and FIG. 8 is a schematic view of a conventional bonding tool with a wire inserted through a guide hole. FIG. 9 is a front view of a conventional bonding tool in a state where bonding is performed between a wire and an electrode. 13... Mounting part, 17... Bonding surface, 23,
23'...electrode (for example, bonding pad), 2
5... Bonding wire, 31... Bonding tool, 33... Guide hole.
Claims (1)
れ、他方の端部にガイド穴と該ガイド穴から導出
されたボンデイングワイヤの部分を電気部品の電
極に接合するためのボンデイング面とを具えるワ
イヤボンデイング用ツールにおいて、 前記ガイド穴のボンデイング面側の開口部を、
該開口部から導出されるボンデイングワイヤの延
在方向と直交する前記ボンデイング面の幅方向の
中心から前記幅方向のボンデイング面の端部側に
ずれた位置で前記ボンデイングワイヤを導出する
ような位置に、具えていることを特徴とするワイ
ヤボンデイング用ツール。[Claims for Utility Model Registration] One end is attached to a wire bonding device, and the other end has a guide hole and a bonding wire for joining the part of the bonding wire led out from the guide hole to the electrode of an electrical component. In a wire bonding tool comprising a surface, an opening of the guide hole on the bonding surface side,
A position where the bonding wire is led out at a position shifted from the center in the width direction of the bonding surface perpendicular to the extending direction of the bonding wire led out from the opening toward the end side of the bonding surface in the width direction. A wire bonding tool characterized by comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10680586U JPS6315045U (en) | 1986-07-14 | 1986-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10680586U JPS6315045U (en) | 1986-07-14 | 1986-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6315045U true JPS6315045U (en) | 1988-02-01 |
Family
ID=30982506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10680586U Pending JPS6315045U (en) | 1986-07-14 | 1986-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315045U (en) |
-
1986
- 1986-07-14 JP JP10680586U patent/JPS6315045U/ja active Pending
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