JPS6245846U - - Google Patents
Info
- Publication number
- JPS6245846U JPS6245846U JP13781485U JP13781485U JPS6245846U JP S6245846 U JPS6245846 U JP S6245846U JP 13781485 U JP13781485 U JP 13781485U JP 13781485 U JP13781485 U JP 13781485U JP S6245846 U JPS6245846 U JP S6245846U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead wires
- semiconductor
- lead
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の素子の断面図、第３図は第１図のリード線
のみを拡大して示し、ａは正面図、ｂは側面図で
ある。
１：半導体片、２：ヘツダ部、３：リード線、
４：樹脂。
Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is a sectional view of a conventional element, and Fig. 3 is an enlarged view of only the lead wires in Fig. 1, where a is a front view and b is a side view. It is a diagram. 1: Semiconductor piece, 2: Header part, 3: Lead wire,
4: Resin.
Claims (1)
ダ部を有するリード線の先端を露出させて樹脂に
より被覆されるものにおいて、リード線が半導体
両面に平行でかつ互いに所定の間隔で平行な方向
に引き出されたことを特徴とする樹脂封止リード
形半導体素子。 In a device in which the tips of lead wires having header portions that contact electrodes on both surfaces of a semiconductor piece are exposed and covered with resin, the lead wires are drawn out in parallel directions to both surfaces of the semiconductor and at a predetermined interval from each other. A resin-sealed lead-type semiconductor element characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13781485U JPS6245846U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13781485U JPS6245846U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245846U true JPS6245846U (en) | 1987-03-19 |
Family
ID=31042217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13781485U Pending JPS6245846U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245846U (en) |
-
1985
- 1985-09-09 JP JP13781485U patent/JPS6245846U/ja active Pending