JPS5924540B2 - Ultrasonic wire bonding equipment - Google Patents

Abstract

PURPOSE:To accomplish an oblique-directioned bonding and to simplify an automatic sample-feeding mechanism by a method wherein a slit is provided at the front surface of a tool and the wire is guided with the slit. CONSTITUTION:When the tool 12 is positioned on a bonding point 1a, the tool 12 comes in contact with the bonding point at the set pressure by means of the working of a cam, an ultrasonic wave is transferred and the wire 3 is bonded 3a. Simultaneously with the start of the ultrasonic wave oscillation, a wire guide 40 is lowered to the position adjacent to the bonding point 1a. When the bonding 3a is completed, a rest is shifted, the tool 12 is positioned above the next bonding point 1b and the guide 40 is shifted horizontally together with the tool in the lowered position. At this time, the wire 3 is guided to the slit 40a on the guide 40. Then immediately before the wire is pressure-welded to the point 1b, the wire is separated from the guide 40, but as it is pressed immediately after that, the wire is held in the slit of the tool. After that a clamper 13 is shifted toward the wire and the wire is cut. In this constitution, the rotation of the sample is unnecessary even when the direction of wire distribution is diagonal to the upper side than the inserted direction and a wire bonding can be performed with a simple mechanism.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic wire bonding device.

In manufacturing semiconductor devices, integrated circuit devices, etc., as shown in FIG.
An ultrasonic wire bonding device is used to connect the two with the wire 3.

FIG. 2 conceptually shows the overall configuration of an apparatus for performing wire bonding on such semiconductor devices, etc. (hereinafter referred to as samples), where 4 is a loader section that supplies the sample, and 5 is a sample that is supplied from the loader section 4. 7 is a rotation device for rotating the positioning table 5 in the direction of arrow A; 8 is an unloader section for carrying out the sample after the work is completed; 9 is parallel to the punch ink surface of the sample; an ultrasonic wire bonding device 11 mounted on an XY table 10 that is movable in the X direction and the Y direction perpendicular thereto within a plane;
is a horn of the ultrasonic wire bonding device 9, and a tool 12 is provided at the tip.

Further, at the tip of this tool 12, as shown in FIG.
A clamper 13 that is aligned in the insertion direction of the wire 3 and clamps the wire 3 is provided in the vicinity of a, and a guide hole Ila is provided in the horn 11 on the extension line of the clamper 13, and the wire 3 passes through these to the tool 12. is guided to the tip of the Therefore, in order to perform bonding with such an apparatus, after placing the sample 6 at a predetermined position on the positioning table 5, the positioning table 5 is rotated in the direction of arrow A, and the ultrasonic wire bonding apparatus 9, that is, the horn 11 and the tool 12 to X
The connection direction of the wires 3 is sequentially placed in the direction of vibration of the horn 11 by Y displacement, and the punch ink operation is performed on each connection of the wires 3 one by one.

That is, as shown in FIG. 4, the tip of the wire 3 is first bonded 3a to the pad (first bond point) 1a of the sample 6, and then the horn 11 and clamper 13 are attached to the next lead (second bond point I).
Move above b and attach the second bond 3b to this point. and,
The wire 3 is clamped by the clamper 13, and the clamper 1
3 is moved along the wire insertion direction in a direction away from the tool 12, and the wire 3 is inserted into the bond groove 12b at the tip of the tool.
Cut from the end. In this way, a pair of two mutually connected bond points are connected by a wire. Now, in this ultrasonic wire bonding apparatus, as shown in FIG.
When the bond wiring direction (direction from the first bond point 1a to the second bond point 1b) is diagonal (diagonal by θ) with respect to the direction), the tool 12 As a result of the movement in the x direction, the wire 3 comes off the bond groove 12b of the tool 12, and cannot be bonded at the second bond point.

Therefore, as described above, in order to prevent the wire 3 from escaping from the bond groove 12b of the tool 12, the wire insertion direction (Y direction) is
The positioning table 5 must be rotated so that the bond wiring direction (1a→1b) is aligned with the bond wiring direction (1a→1b) before bonding is performed. In addition, for this reason, the automatic sample supply/removal mechanism also includes a rotation mechanism for the positioning table, which has the disadvantage of making the structure complicated and large. The present invention was made in view of the above-mentioned drawbacks of the prior art, and an object of the present invention is to provide an ultrasonic wire bonding device that enables diagonal bonding without rotating the sample and simplifies the automatic sample feeding mechanism. do.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

FIG. 6 shows the overall configuration of an embodiment of the ultrasonic wire bonding apparatus according to the present invention, where 3 is a wire, 10 is an X
Y table, 11 is a horn, 12 is a tool, and 13 is a clamper. Each of these is provided to perform the functions described above. 20 is a housing mounted on the XY table 10; 21 is a horn support arm that supports the horn 11 and is swingable up and down; the housing 20II
C is fixed to a rotatably supported support shaft 22.

Reference numeral 23 denotes a clamper holder for holding the clamper 13, and is slidably provided on a pedestal 24 fixed to the side surface of the horn support arm 21.

A wire spool 25 is provided on an extension line in the insertion direction of the wire 3 and supplies the wire 3 to the lower surface of the tool 2 through the hole of the horn 11, the clamper 13, and the guide hole of the tool 12.

A camshaft 26 is rotatably supported by the housing 20 and rotated by a camshaft drive motor (not shown).This camshaft 26f1C includes a tool vertical drive cam 27 that moves the tool 12 up and down, and a clamper drive cam that moves the clamper 13 horizontally. 28 and various timing signal cams, etc. (not shown) are fixed.

The tool vertical drive cam 27 has a horn support arm 2.
A cam follower 29 provided at one end of the cam follower 1 is urged by a spring 30 so as to come into pressure contact with the cam follower 29 . 31 is a clamper drive arm fixed to a support shaft 32VC which is rotatably supported by the horn support arm 21, and a spring 34 is attached so that the cam follower 33 attached to one end of the clamper 1 drive arm 31 comes into pressure contact with the clamper drive cam 28. is energized by

Further, a pin 36 implanted in the upper end of the clamper holder 23 is in contact with the other end of the clamper drive arm 31 with a spring 35 . The above is a conventionally known structure. Next, the wire guide mechanism according to the present invention will be explained.

A wire guide member 40 is provided parallel to the tool 12 in front of the tool, and is provided at the tip of a wire guide member drive arm 41 so as to be vertically slidable, and is biased downward by a spring 42.

This wire guide member 40 has a guide slit 4 which is open at the bottom as shown in FIG. 7 so as to guide the wire 3.
0a is provided. The wire guide member 5 drive arm 41 has a support shaft 43 rotatably supported by the housing 20.
VC is fixed, and one end is connected to the wire guide member 40.
A cam follower 44 that is in contact with the upper surface and provided at the other end is connected to a wire guide member driving cam 45 that is fixed to the camshaft 26.
It is urged by a spring 46 so as to come into pressure contact with. Next, the operation of the present apparatus having such a configuration will be explained with reference to FIG. The XY table 10 is moved to position the tool 12 directly above the first bond point 1a as shown in FIG. 8a. Subsequently, the camshaft 26 begins to rotate, causing the vertical drive cam 27 to draw a downward curve on its operation diagram.
The horn support arm 21 rotates counterclockwise around the support shaft 22, and as a result, the tool 12 and the clamper 13 descend as shown in FIG.
a with a preset working pressure. Next, camshaft 2
A micro switch is activated by Command Cam Co., Ltd. (not shown) fixed at 6 VC, and the horn 11 starts to oscillate, transmitting ultrasonic vibration to the tool 12, and connecting the wire 3 to the first bond point 1a to the first bond 3a. do. Also, as mentioned above, the horn 11
At the same time as the tool 12 starts to oscillate, or as the tool 12 descends as described above, the wire guide member driving cam 45 draws an upward curve, and the wire guide member 40 approaches the first bonding point 1a as shown in FIG. 8c. Lower to upper position.
When the first bond 3a is completed as described above, the vertical first drive cam 27 changes to an upward curve, and the XY table 10 moves to the
After moving in the direction shown in FIG. 6d, the tool 12 is positioned directly above the second bond point 1b as shown in FIG. 6e.

At this time, since the wire guide member 1 driving cam 45 has a concentric arc curve, the wire guide member 40 moves horizontally together with the tool 12 while being lowered. Therefore, Figure 6c
When moving from to d, that is, when the tool 12 rises and moves in the XY direction, the wire 3 extending from the lower end of the tool 12
is guided to the guide slit 40a of the wire guide member 40. The wire 3 with the lower end of the tool 12 extended in this manner is guided by the guide slit 40aVC of the wire guide member 40 while the tool 12 is moving above the second bonding point 1b, so that the wire 3 moves while the tool 12 is moving above the second bonding point 1b. Bond point 1a (
first bond 3a) and second bond point 1b (second bond 3b)
) is the wire insertion direction (Y direction) inserted into the tool 12
Even if the wire 3 is diagonal to Vc, the wire 3 is connected to the tool 12.
without coming off the bond groove 12b of the second bond point 1b.
be led upwards. In this case, there is no problem as long as the wire arrangement direction is within 45 degrees with respect to the wire insertion direction. Next, the upper and lower drive cams 27 draw a downward curve, and the tool 12 and clamper 13 descend as shown in FIG. 8f, and the tool 12 comes into contact with the second bond point 1b.

In this state, the wire guide member 1 drive cam 45
is a concentric arc curve, so the wire guide member 4
0 is in the lowered position. Therefore, tool 1
2 presses the wire 3 to the second bond point 1b, the wire 3 extending from the tool 12 separates from the wire guide member 40, but immediately after that, the wire 3 extends from the tool 12 to the second bond point 1b.
Since the wire 3 is pressed against the bond point 1b, the tool 12
The bond groove 12b is never separated from the bond groove 12b. Next, camshaft 2
A microswitch is activated by the command cam (h shown in the figure) fixed to the tool 6, and the horn 11 starts to oscillate. Ultrasonic vibrations are transmitted to the tool 12, and the wire 3 is connected to the second bond point 1b by the second bond 3b. .After the second bond 3b is completed, the camshaft 2
The clamper 13 clamps the wire 3 by a command cam (not shown) fixed to the clamper holder 6, and then the clamper and drive cam 28 draw an upward curve, the clamper drive arm 31 rotates clockwise, and the clamper holder 23 is raised via the pin 36, and as a result, the clamper 13 moves away from the tool 12 in the wire insertion direction while clamping the wire 3, and moves the wire 3 behind the lower surface of the tool 12 as shown in FIG. 8g. Cut from the end. Further, the wire guide member drive cam 45 draws a downward curve and the wire guide member 40 rises. Subsequently, the vertical drive cam 27 draws an upward curve, and the tool 12 and clamper 13 rise. Next is Clamper 1
The drive cam 28 draws a downward curve, and the clamper drive arm 3
1 rotates counterclockwise, the clamper 13 moves forward in the direction of the tool 12, and feeds out the wire 3 to the lower end of the tool 12, as shown in FIG. 8a. The above operation completes the operation of bonding the wire 3 between the two bond points 1a and 1b. As is clear from the above description, according to the ultrasonic wire bonding apparatus of the present invention, the wire guide member is provided in front of the tool, so that when the tool moves from the first bonding point to the second bonding point, the The wire is guided by a wire guide member extending from the tip, and punch ink can be made even if the wire wiring direction is oblique to the wire insertion direction through the tool. Therefore, bonding is possible without rotating the sample, and the automatic feeding mechanism including the sample rotation mechanism is simplified. Further, since the wire guide member is driven up and down once by the wire guide 5 drive mechanism, it can be easily put into practical use. Further, when the tool comes into contact with the sample, the wire guide member can be positioned above the sample without adversely affecting the sample.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of the semiconductor device, Fig. 2 is a schematic diagram of the overall configuration of the wire punch ink device including ancillary equipment, Fig. 3 is an explanatory sectional view showing the vicinity of the tool, and Fig. 4 is an explanation of the wire bonding work. 5 is an explanatory diagram of diagonal bonding by Jubei's device, FIG. 6 is an overall configuration diagram showing an embodiment of the ultrasonic wire bonding device according to the present invention, and FIG. 7 shows a wire guide member, a is a front view, b is a side view, FIGS. 8a to 8g are explanatory views showing the process of wire bonding work, and FIG. FIG. 1a...first bond point, 1b...second bond point
Bond point, 3...Failure, 3a...First bond, 3b...Second bond, 11...
...Horn, 12...Tool, 40...
-Wire guide member, 40a... Guide slit.

Claims (1)

[Claims] 1 In an ultrasonic wire bonding device that connects a wire between a first bond point and a second bond point using a tool provided at the tip of a horn, an ultrasonic wire bonding device is provided in front of the tool and is open at the bottom to guide the wire. An ultrasonic wire bonding apparatus comprising: a wire guide member having a guide slit; and a wire guide drive mechanism that drives the wire guide member up and down.