JPS5921167B2 - Ultrasonic wire bonding equipment - Google Patents
Ultrasonic wire bonding equipmentInfo
- Publication number
- JPS5921167B2 JPS5921167B2 JP49079206A JP7920674A JPS5921167B2 JP S5921167 B2 JPS5921167 B2 JP S5921167B2 JP 49079206 A JP49079206 A JP 49079206A JP 7920674 A JP7920674 A JP 7920674A JP S5921167 B2 JPS5921167 B2 JP S5921167B2
- Authority
- JP
- Japan
- Prior art keywords
- wedge
- bonding
- wire bonding
- pellet
- sample stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4943—Connecting portions the connecting portions being staggered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は超音波ワイヤボンディング装置、特にシーケン
シャルな動きをさせるに便利な超音波ワイヤボンディン
グ装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ultrasonic wire bonding device, and particularly to an ultrasonic wire bonding device convenient for sequential movement.
周知のように、超音波ワイヤボンディング装置はワイヤ
を押圧するウェッジを振動させてワイヤを接続している
が、振動には方向性がある。As is well known, an ultrasonic wire bonding device connects wires by vibrating a wedge that presses the wires, but the vibrations have directionality.
この結果、ウェッジの振動方向とワイヤの長手（軸）方
向とを一致させてボンディングを行なわないと、押圧さ
れるワイヤはウェッジから外れたり、あるいは確実な接
続ができなくなるなどの不都合が生じる。このため、従
来のこの種装置では、第１図に示すように、ウェッジ１
を支持するホーン２は振動運動およびカム機構３による
ウェッジ１の上下運動だけで、その方向性は常に一定方
向にセットされている。As a result, unless bonding is performed while the vibration direction of the wedge and the longitudinal (axial) direction of the wire are aligned, there will be problems such as the pressed wire coming off the wedge or a reliable connection being impossible. For this reason, in conventional devices of this type, as shown in FIG.
The horn 2 that supports the wedge 1 only vibrates and moves the wedge 1 up and down by the cam mechanism 3, and its directionality is always set in a constant direction.
これに対して、ペレットなどを載置する試料台４はＸＹ
平面方向および回転方向に移動できるように構成されて
いる。すなわち、試料台４はＸＹテーブル５に取り付け
られ、モータ６によつて回転制御される。また、ＸＹテ
ーブル５は基台Ｔ上にボール８を介して支持され、この
ＸＹテーブル５は２組（図では１組を示す）のマニピュ
レータ９によりＸＹ方向に移動調整される。しかし、こ
の装置では試料台４の回転中心はウェッジ１に対しボン
ディングごとにその位置を変える。ところで、第２図に
示すように、ペレット１０のボンディングパッド１１と
リードフレーム１２のボンディングパッド１３は、ペレ
ット１０の中心に対して放射状に配置され、連続して行
なうボンディングにおいて、所定角度ずつペレットを回
動させるとともに、ウェッジの振動方向に沿う方向（た
とえばＸ方向）にペレットを移動させるだけでワイヤボ
ンディングを行なうことが考え、られているが、前述の
ように、試料台はＸＹ方向に動く構造となつていること
から、移動誤差の重畳により試料台のウェッジに対する
回転中心も一定しない。このため、ワイヤボンデイング
の自動化（シーケンシャルな動作）を図る際、ペレット
のボンデイングパツドとリードフレームのボンデイング
パツドとの位置の設定がしにくい。すなわち、ボンデイ
ングごとにペレツトのＸＹ方向をいずれも調整する必要
が生じ、顕微鏡を観察しながら行なうマニユアルな作業
では容易であるが、自動化の場合には基準となるところ
もなく、シーケンシヤルな動きを設定（プログラミング
）することもできない。したがつて、本発明の目的は超
音波ワイヤボンデイングにおいて、シーケンシヤルなボ
ンデイングを行なうことのできる超音波ワイヤボンデイ
ング装置を提供するにある。On the other hand, the sample stage 4 on which pellets etc. are placed is
It is configured to be movable in the plane direction and rotational direction. That is, the sample stage 4 is attached to an XY table 5 and its rotation is controlled by a motor 6. Further, the XY table 5 is supported on a base T via a ball 8, and the XY table 5 is moved and adjusted in the XY directions by two sets (one set is shown in the figure) of manipulators 9. However, in this device, the center of rotation of the sample stage 4 changes its position with respect to the wedge 1 every time bonding is performed. By the way, as shown in FIG. 2, the bonding pads 11 of the pellet 10 and the bonding pads 13 of the lead frame 12 are arranged radially with respect to the center of the pellet 10, and in continuous bonding, the pellets are attached at a predetermined angle. It has been considered and proposed that wire bonding be performed simply by rotating the pellet and moving the pellet in the direction along the vibration direction of the wedge (for example, in the X direction), but as mentioned above, the sample stage has a structure that moves in the Therefore, the center of rotation of the sample stage relative to the wedge is not constant due to the superposition of movement errors. For this reason, when attempting to automate wire bonding (sequential operation), it is difficult to set the positions of the pellet bonding pad and the lead frame bonding pad. In other words, it is necessary to adjust the pellet in both the X and Y directions for each bonding process, which is easy to do manually when observing with a microscope, but in the case of automation, there is no standard and sequential movement must be set. (Programming) is also not possible. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an ultrasonic wire bonding apparatus capable of performing sequential bonding in ultrasonic wire bonding.
このような目的を達成するための本発明の要旨は、試料
台を回転運動だけできるように機台に取り付け、この試
料台上にウエツジを臨ませるとともに、このウエツジを
支持するホーンを少なくともウエツジの振動方向に移動
可能なテーブルに取り付け、かつ前記ウエツジを上下に
移動させる移動機構を設け、前記試料台の回転運動、ウ
エツジの振動運動、ウエツジの上下運動およびテーブル
の振動方向への移動運動をシーケンシヤルに行なうもの
である。The gist of the present invention to achieve these objects is to attach the sample stand to the machine stand so that only rotational movement is possible, to make the wedge face the sample stand, and to attach a horn supporting the wedge to at least the edge of the wedge. A moving mechanism is provided that is attached to a table movable in the vibration direction and moves the wedge up and down, and sequentially performs rotational movement of the sample stage, vibrational movement of the wedge, vertical movement of the wedge, and movement of the table in the vibrational direction. It is something that is done.
以下本発明を実施例により詳細に説明する。The present invention will be explained in detail below using examples.
第３図に本発明の超音波ワイヤボンデイング装置の一実
施例を示す。同図に示すように、機台２０には回転軸２
１が軸受２２を介して取り付けられ、この回転軸２１の
上端には上面が平担な試料台２３が固定されている。ま
た、この回転軸２１の下端には駆動モータ２４が取り付
けられ、この駆動モータ２４により試料台２３は回転運
動を制御されるようになつている。一方、前記機台２０
上にはマニピユレータ２５により、機台２０上をＸＹ方
向に移動する手動ＸＹテーブル２６が配設されている。FIG. 3 shows an embodiment of the ultrasonic wire bonding apparatus of the present invention. As shown in the figure, the machine base 20 has a rotating shaft 2.
1 is attached via a bearing 22, and a sample stage 23 having a flat upper surface is fixed to the upper end of this rotating shaft 21. Further, a drive motor 24 is attached to the lower end of this rotating shaft 21, and the rotational movement of the sample stage 23 is controlled by this drive motor 24. On the other hand, the machine stand 20
A manual XY table 26 that is moved in the XY directions on the machine base 20 by a manipulator 25 is disposed above.
この手動ＸＹテーブル２６上にはｙ方向駆動用モータ２
７によりＸ方向（すなわち、前記試料台２３の回転中心
に対する放射（半径）方向であり、かつウエツジ３１の
振動方向）の動きを制御される自動Ｘテーブル２８が取
り付けられるとともに、この自動Ｘテーブル２８上には
Ｙ方向（前記Ｘ方向に直向する方向）の動きをＹ方向駆
動用モータ２９により制御される自動Ｙテーブル３０が
取り付けられている。ま．た、前記自動Ｙテーブル３０
上には先端にウエツジ３１を取り付けたホーン３２がピ
ン３３を介して取り付けられている。さらに、このホー
ン３２は一端にカムフロア３４が取り付けられ、このカ
ムフロア３４は駆動カム３５に接している。したがつて
、駆動カム３５の回動によつてホーン３２はピン３３を
中心に揺動し、先端のウエツジ３１は前記試料台２３上
を上下に移動する。また、前記機台２０上には始動釦３
６が配設されている。つぎに、使用状態について説明す
る。On this manual XY table 26 is a motor 2 for driving in the y direction.
An automatic X table 28 whose movement in the X direction (that is, the radial (radial) direction with respect to the rotation center of the sample stage 23 and the vibration direction of the wedge 31) is controlled by 7 is attached, and this automatic X table 28 An automatic Y table 30 whose movement in the Y direction (direction perpendicular to the X direction) is controlled by a Y direction drive motor 29 is attached above. Ma. In addition, the automatic Y table 30
A horn 32 with a wedge 31 attached to its tip is attached via a pin 33 to the top. Furthermore, a cam floor 34 is attached to one end of the horn 32, and this cam floor 34 is in contact with a drive cam 35. Therefore, as the drive cam 35 rotates, the horn 32 swings around the pin 33, and the wedge 31 at the tip moves up and down on the sample stage 23. Further, a start button 3 is provided on the machine base 20.
6 are arranged. Next, the usage status will be explained.
まず、試料台２３上にペレツト３７を固定する。この際
、ワイヤボンデイング時のペレツトの中心を、前記試料
台２３の回転中心に一致させて固定する必要がある。そ
の後、マニピユレータ２５を操作して手動ＸＹテーブル
２６を移動させウエツジ３１の先端（下端）をペレツト
３７のボンデイングパツド上に臨ませる。つぎに、始動
釦３６を押すことにより、駆動カム３５の動きによつて
前記ウエツジ３１は下降し、ペレツト３７のボンデイン
グパツド上にワイヤ３８の一端を押圧する。そこで、ウ
エツジ３１を振動させてワイヤ３８をペレツト３７に固
定する。つぎに、ウエツジ３１は上昇するとともに、Ｘ
方向駆動用モータ２７が所定量回転し自動Ｘテーブル２
８を移動させ、ウエツジ３１の先端をワイヤ３８を保持
した状態でリードフレーム３９側のボンデイングパツド
上に臨ませる。すると、再びウエツジ３１が下降して、
ワイヤ３８の他端を超音波振動によりリードフレーム側
のボンデイングパツド上に固定する。つぎに、ウエツジ
３１は上昇するとともに、ワイヤ３８を接合部の近くで
破断させる。このとき、再びＸ方向駆動用モータ２７が
プログラムによつて設定された回転量だけ回転し、自動
Ｘテーブル２８を動かしてウエツジ３１を試料台２３の
中心方向に動かす。また、これに同期して駆動モータ２
４が作動し、試料台２３をプログラムによつて設定され
た回転量だけ回転させる。これによつて、ウエツジ３１
の先端はペレツト３７上の新たなボンデイングパツド上
に臨み、前記と同様な手順によつて作動し、ペレツトと
リードフレーム間をワイヤで接続する。このように、順
次各駆動部がシーケンシヤルに作動して、ワイヤボンデ
イングを確実に行なう。前記実施例によれば、試料台の
回転中心が、ワイヤボンデイングの回転中心となるため
、所定角度ずつ試料台を回動させ、ウエツジを試料台の
回転中心の放射方向（ウエツジの振動方向もこの方向に
してある）に前進あるいは後退させるだけで、ペレツト
上のボンデイングパツド上あるいはり−ドフレーム上の
ボンデイングパツド上に正確に臨む。First, the pellet 37 is fixed on the sample stage 23. At this time, it is necessary to align the center of the pellet during wire bonding with the rotation center of the sample stage 23 and fix it. Thereafter, the manipulator 25 is operated to move the manual XY table 26 so that the tip (lower end) of the wedge 31 faces onto the bonding pad of the pellet 37. Next, by pressing the start button 36, the wedge 31 is lowered by the movement of the drive cam 35 and presses one end of the wire 38 onto the bonding pad of the pellet 37. Therefore, the wire 38 is fixed to the pellet 37 by vibrating the wedge 31. Next, the wedge 31 rises and
The direction drive motor 27 rotates by a predetermined amount and the automatic X table 2
8 is moved so that the tip of the wedge 31 faces onto the bonding pad on the lead frame 39 side while holding the wire 38. Then, the wedge 31 descends again,
The other end of the wire 38 is fixed onto a bonding pad on the lead frame side by ultrasonic vibration. Wedge 31 then rises and breaks wire 38 near the joint. At this time, the X-direction drive motor 27 rotates again by the amount of rotation set by the program, moves the automatic X-table 28, and moves the wedge 31 toward the center of the sample stage 23. Also, in synchronization with this, the drive motor 2
4 is activated, and the sample stage 23 is rotated by the amount of rotation set by the program. With this, wedge 31
The tip of the lead is positioned over a new bonding pad on the pellet 37 and operated in the same manner as described above to connect the wire between the pellet and the lead frame. In this manner, each driving section operates sequentially to ensure wire bonding. According to the above embodiment, the rotation center of the sample stand becomes the rotation center of wire bonding, so the sample stand is rotated by a predetermined angle and the wedge is moved in the radial direction of the rotation center of the sample stand (the vibration direction of the wedge is also in this direction). Simply move it forward or backward in the same direction (as indicated) to position it precisely on the bonding pad on the pellet or the bonding pad on the board frame.
また、試料台は固定される機台２０に対して回転運動だ
けしか動作しない。Further, the sample stage only moves in rotation relative to the fixed machine stage 20.
したがつて、試料台の回転中心にワイヤボンデイングの
際の中心が一致するようにペレツトを試料台に取り付け
れば、試料台を回転させても、ワイヤボンデイングの中
心がずれることはほとんどない。すなわち、従来の装置
では、試料台の中心に合うようにペレツトを取り付けて
も、試料台を支持するテーブルがＸＹ方向に移動する構
造となつていることから、移動時の前記テーブルの停止
精度、換言すれば停止誤差によつて、位置ずれが生じ、
プログラム通りに各部を動作させても、ウエツジの先端
は所定のボンデイングパツド上に正確に臨まなくなるが
、本実施例では、このような不都合は生じない。したが
つて、各部をプログラム通りに動作させても、正確なワ
イヤボンデイングが行なえることから、自動化も効果的
に行なえる。以上のように、本発明の超音波ワイヤボン
デイング装置によれば、その構造上ペレツトにおけるワ
イヤボンデイングの中心が常に一定していることから、
各部をプログラムによる設定通りに動作させても正確な
ワイヤボンデイングを行なうことができる。Therefore, if the pellet is attached to the sample stand so that the center of wire bonding coincides with the rotation center of the sample stand, the center of wire bonding will hardly shift even if the sample stand is rotated. In other words, in the conventional apparatus, even if the pellet is attached to the center of the sample stand, the table supporting the sample stand moves in the X and Y directions, so the stopping accuracy of the table during movement is In other words, positional deviation occurs due to stopping error,
Even if the various parts are operated according to the program, the tip of the wedge will not be placed exactly on the predetermined bonding pad, but in this embodiment, such a problem does not occur. Therefore, even if each part operates according to a program, accurate wire bonding can be performed, and automation can be effectively performed. As described above, according to the ultrasonic wire bonding device of the present invention, the center of wire bonding in the pellet is always constant due to its structure.
Accurate wire bonding can be performed even if each part operates as set by the program.
このため、作業性も向上する。Therefore, work efficiency is also improved.
第１図は従来使用されている超音波ワイヤボンデイング
装置の機構図、第２図はウエツジを支持するホーンとペ
レツトとの動きを説明する平面図、第３図は本発明の超
音波ワイヤボンデイング装置の一実施例を示す正面図で
ある。
１・・・−・・ウエツジ、２・・・・・・ホーン、３・
・・・・・カム機構、４・・・・・試料台、５・・・・
・・ＸＹテーブル、６・・・・・・モータ、７・・・・
・・基台、８・・・・・・ボール、９・・・・・・マニ
ピユレータ、１０・・・・・・ペレツト、１１・・・・
・・ボンデイングパツド、１２・・・・・・リードフレ
ーム、１３・・・・・・ボンデイングパツド、２０・・
・・・・機台、２１・・・・・・回転軸、２２・・・・
・・軸受、２３・・・・・・試料台、２４・・・・・・
駆動モータ、２５・・・・・・マニピユレータ、２６・
・・・・・手動ＸＹテーブル、２７・・・・・・Ｘ方向
駆動用モータ、２８・・・・・第動Ｘテーブル、２９・
・・・・・Ｙ方向駆動用モータ、３０・・・・・・自動
Ｙテーブル、３１・・・・・・ウエツジ、３２・・・・
・・ホーン、３３・・・・・・ピン、３４・・・・・・
カムフロア、３５・・・・・・駆動カム、３６・・・・
・・始動釦、３７・・・・・・ペレツト、３８・・・・
・・ワイヤ、３９・・・・・・リードフレーム。Fig. 1 is a mechanical diagram of a conventionally used ultrasonic wire bonding device, Fig. 2 is a plan view illustrating the movement of the horn and pellet that supports the wedge, and Fig. 3 is the ultrasonic wire bonding device of the present invention. FIG. 3 is a front view showing one embodiment of the invention. 1...Wedge, 2...Horn, 3.
...Cam mechanism, 4...Sample stage, 5...
...XY table, 6...Motor, 7...
... Base, 8 ... Ball, 9 ... Manipulator, 10 ... Pellet, 11 ...
... Bonding pad, 12... Lead frame, 13... Bonding pad, 20...
... Machine base, 21 ... Rotating shaft, 22 ...
...Bearing, 23...Sample stage, 24...
Drive motor, 25... Manipulator, 26.
...Manual XY table, 27...X direction drive motor, 28...No. 1 movement X table, 29.
...Y direction drive motor, 30...Automatic Y table, 31...Wedge, 32...
...Horn, 33...Pin, 34...
Cam floor, 35... Drive cam, 36...
...Start button, 37...Pellet, 38...
...Wire, 39...Lead frame.
Claims (1)
数個の第２ボンディング位置をもつリードとを少なくと
も有する被ボンディング体を回転させる機構をもつた試
料台と、この試料台上に臨むウェッジと、このウェッジ
を支持し、かつウェッジを超音波振動させる振動機構を
内蔵したホーンと、このホーンを支持し、かつ上記試料
台と独立して平面ＸＹ方向に移動動作させうるテーブル
と、ウェッジを上下動させる上下動機構とを備え、前記
試料台の回転運動は前記第１ボンディング位置からそれ
に１対１応する第２ボンディング位置を見た方向にウェ
ッジの振動方向が一致するまで回転するものであること
を特徴とする超音波ワイヤボンディング装置。1. A sample stand having a mechanism for rotating a bonded object having at least pellets having a plurality of first bonding positions and leads having a plurality of second bonding positions; a wedge facing onto the sample stand; A horn that supports the wedge and has a built-in vibration mechanism that causes the wedge to vibrate ultrasonically; a table that supports the horn and that can be moved in a plane XY direction independently of the sample stage; and a table that moves the wedge up and down. and a vertical movement mechanism, and the rotational movement of the sample stage is such that the vibration direction of the wedge matches the direction seen from the first bonding position to the second bonding position corresponding one-to-one thereto. Features of ultrasonic wire bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49079206A JPS5921167B2 (en) | 1974-07-12 | 1974-07-12 | Ultrasonic wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49079206A JPS5921167B2 (en) | 1974-07-12 | 1974-07-12 | Ultrasonic wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS519372A JPS519372A (en) | 1976-01-26 |
| JPS5921167B2 true JPS5921167B2 (en) | 1984-05-18 |
Family
ID=13683462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49079206A Expired JPS5921167B2 (en) | 1974-07-12 | 1974-07-12 | Ultrasonic wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921167B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169920A (en) * | 1982-03-30 | 1983-10-06 | Nec Home Electronics Ltd | Manufacturing device for semiconductor |
-
1974
- 1974-07-12 JP JP49079206A patent/JPS5921167B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS519372A (en) | 1976-01-26 |
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