JPS6026662B2 - How to align the bonding head in ultrasonic wire bonding - Google Patents

How to align the bonding head in ultrasonic wire bonding

Info

Publication number
JPS6026662B2
JPS6026662B2 JP51058916A JP5891676A JPS6026662B2 JP S6026662 B2 JPS6026662 B2 JP S6026662B2 JP 51058916 A JP51058916 A JP 51058916A JP 5891676 A JP5891676 A JP 5891676A JP S6026662 B2 JPS6026662 B2 JP S6026662B2
Authority
JP
Japan
Prior art keywords
bonding
bonding head
pedestal
rotation
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP51058916A
Other languages
Japanese (ja)
Other versions
JPS52141455A (en
Inventor
猛 長谷川
清 鳥海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP51058916A priority Critical patent/JPS6026662B2/en
Publication of JPS52141455A publication Critical patent/JPS52141455A/en
Publication of JPS6026662B2 publication Critical patent/JPS6026662B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明はＩＣ，偽１のごとき半導体部品にワイヤボンデ
ィングを施す超音波ワイヤボンディングにおけるボンデ
ィングヘッドの位置合わせ方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for positioning a bonding head in ultrasonic wire bonding for wire bonding semiconductor components such as ICs and circuit boards.

一般にリードフレーム上に固着されている半導体べレツ
トとりードフレームのりードとの間をワイヤで接続する
のに超音波ワイヤボンダを用いる。Generally, an ultrasonic wire bonder is used to connect a semiconductor pellet fixed on a lead frame to the leads of the lead frame using a wire.

この超音波ワイヤボンダを用いてワイヤボンディングを
行う場合には、相互に接続されるべき一つのボンディン
グ点を結ぶ線の方向を超音波振動の伝達方向に一致させ
る必要がある。従って、超音波ワイヤボンディングにお
いては、一般にボンディングすべき点を一定の方向に並
べるように受台上のボンディング部品（以下、試料とい
う）を被ボンディング面に垂直な軸を中心として０方向
に回転させる動作と、ワイヤを保持したボンディング工
具を被ボンディング面に平行で互いに直角をなすＸ方向
及びＹ方向に変位させて、一定方向に並べられた試料の
各ボンディング点に案内する動作とによりワイヤを各ボ
ンディング点に導いてボンディングを行っている。この
種のボンデイングにおいて、試料の回転量及び回転の順
序と、工具の変位量及び変位の順序とを予め定めておい
て所定のプログラムに従ってボンディング作業を進める
方法が知られている。しかしながらこの方法においては
、試料を戦層する受台の回転の中心位置とボンディング
ヘッド駆動の原点とが所定の関係位置にあるものとして
受台の回転量及び工具の変位量が設定されているので、
上記二者の関係位置が所定の関係にないと所定の位置に
正しくボンディングを行うことができない。When performing wire bonding using this ultrasonic wire bonder, it is necessary to align the direction of a line connecting one bonding point to be mutually connected with the transmission direction of ultrasonic vibration. Therefore, in ultrasonic wire bonding, the bonding part (hereinafter referred to as the sample) on the pedestal is generally rotated in the 0 direction around an axis perpendicular to the surface to be bonded so that the points to be bonded are aligned in a fixed direction. The wires are moved to each bonding point by displacing the bonding tool holding the wire in the X and Y directions parallel to the surface to be bonded and perpendicular to each other, and guiding it to each bonding point on the sample arranged in a fixed direction. Bonding is performed by guiding the wire to the bonding point. In this type of bonding, a method is known in which the amount and order of rotation of a sample and the amount and order of displacement of a tool are determined in advance and the bonding operation is performed according to a predetermined program. However, in this method, the amount of rotation of the pedestal and the amount of displacement of the tool are set on the assumption that the center of rotation of the pedestal that holds the sample and the origin of the bonding head drive are in a predetermined relationship. ,
If the relative positions of the two are not in a predetermined relationship, bonding cannot be performed correctly at the predetermined position.

しかるに、一般には試料受台の回転の中心とボンディン
グヘッド駆動の原点とを常に正確に所定の関係位置に置
くことは必ずしも容易でなく、温度変化その他により多
少なりとも関係位置がずれてくる。However, in general, it is not always easy to accurately position the center of rotation of the sample holder and the origin of driving the bonding head at a predetermined relative position, and the relative positions may shift to some extent due to temperature changes or other factors.

このため従来は、各ボンディング点にボンディングする
ごとに手作業で位置ずれを修正する必要があり、ボンデ
ィング作業を完全に自動化することができなかった。本
発明の目的は、受台の回転中心と工具駆動原点とが常に
正確に所定の関係位置をとらせて、それによってボンデ
ィング作業のすべての自動化を可能とするためにボンデ
ィング作業の始めにおいて、受台の回転中心にボンディ
ングヘッドの駆動原点を巧みに正しく合致させる超音波
ワイヤボンディングにおけるボンディングヘッドの位置
合わせ方法を提供することにある。For this reason, in the past, it was necessary to manually correct positional deviations each time bonding was performed at each bonding point, making it impossible to fully automate the bonding work. It is an object of the present invention to set the cradle at the beginning of the bonding operation in order to ensure that the center of rotation of the pedestal and the tool drive origin are always accurately positioned in a predetermined relationship, thereby making it possible to fully automate the bonding operation. An object of the present invention is to provide a method for positioning a bonding head in ultrasonic wire bonding in which the driving origin of the bonding head is skillfully and accurately aligned with the center of rotation of a table.

以下、図面を参照して本発明の方法を詳細に説明する。Hereinafter, the method of the present invention will be explained in detail with reference to the drawings.

第１図は本発明の方法を実施する装置の概略を示したも
ので、１は基台、２はこの基台１上に配置された被ボン
ディング部品受台である。この受台２はリードフレーム
及び半導体べレット等よりなる試料Ｐを上面に乗せた後
、図示しない駆動源により駆動されて被ボンディング面
に垂直な軸を中心としてａ方向に回転するようになって
いる。３はボンディング工具（以下工具という）５を図
示しない上下動させる機構と超音波振動源を内蔵したボ
ンディングヘッド本体、４はこのボンディングヘッド本
体３より突出する超音波ホーン、５はこの超音波ホーン
４の先端側に該超音波ホーン４の軸に直角に固着されて
先端部が試料Ｐに対向する工具である。FIG. 1 schematically shows an apparatus for carrying out the method of the present invention, in which 1 is a base, and 2 is a holder for parts to be bonded placed on the base 1. In FIG. After a sample P consisting of a lead frame, a semiconductor pellet, etc. is placed on the pedestal 2, it is driven by a drive source (not shown) and rotates in the direction a about an axis perpendicular to the surface to be bonded. There is. Reference numeral 3 denotes a bonding head main body incorporating a mechanism for vertically moving a bonding tool (hereinafter referred to as tool) 5 and an ultrasonic vibration source; 4 an ultrasonic horn protruding from the bonding head main body 3; 5 an ultrasonic horn 4. This is a tool that is fixed to the tip side of the ultrasonic horn 4 at right angles to the axis of the ultrasonic horn 4, with the tip facing the sample P.

以上の３〜５の部分でボンディングヘッドを構成してい
る。６はボンディングヘッド本体３の上部にホーン４と
同方向に突設されたアーム、７はこのアーム６の先端側
に配設されたスポット光役映器である。The above three to five parts constitute the bonding head. Reference numeral 6 designates an arm projecting from the upper part of the bonding head main body 3 in the same direction as the horn 4, and reference numeral 7 designates a spot light projector provided at the tip side of the arm 6.

このスポット光投映器７は、試料Ｐ上に工具５の先端が
当接する位置を示すスポット光を技映するように、予め
工具５との関係位置が設定される。８はボンディングヘ
ッド本体３を支承し、図示されない操作装置により操作
されてボンディングヘッド３〜５を被ボンディング面に
平行で互いに直角をなす×方向及びＹ方向に移動させる
ＸＹ駆動装置、９は基台１上に配設されてボンディング
ヘッド３〜５をＸＹ駆動装置８とともに×方向及びＹ方
向に移動させるマニピュレータである。The position of this spot light projector 7 relative to the tool 5 is set in advance so that it projects a spot light indicating the position where the tip of the tool 5 contacts the sample P. 8 is an XY drive device that supports the bonding head main body 3 and is operated by an operating device (not shown) to move the bonding heads 3 to 5 in the X and Y directions parallel to the bonding surface and at right angles to each other; 9 is a base; This is a manipulator that is disposed on the bonding head 1 and moves the bonding heads 3 to 5 in the X direction and the Y direction together with the XY drive device 8.

次に、上記の装置で実施する本発明の方法を説明する。
本実施例では、第２図に示した試料Ｐとしての半導体べ
レット上の一つのパッドＰ，を位置合わせ用の指標とし
て用いるものとする。先ず、位置合わせに先立って、前
述のようにスポット光Ｓが、受台２上の試料Ｐ上に工具
５の先端が当援する位置を示すように調整する。それに
は、ＸＹ駆動装置８及び図示されないボンディングヘッ
ド上下動装置を操作して、工具５の先端をパッドＰ，の
真上に当接させ、このパッドＰ，に役映器７を手動操作
してスポット光Ｓを合わせる。これにより、以後スポッ
ト光Ｓは試料Ｐの厚みが変らない限り、工具５の先端が
試料Ｐに当接する位置を示すガイドマークとして用いら
れる。以上のスポット光較正の後、本発明の方法による
位置合わせを行う。Next, the method of the present invention implemented using the above-mentioned apparatus will be explained.
In this embodiment, one pad P on the semiconductor pellet as the sample P shown in FIG. 2 is used as an index for positioning. First, prior to positioning, the spot light S is adjusted so as to indicate the position where the tip of the tool 5 is placed on the sample P on the pedestal 2, as described above. To do this, the XY drive device 8 and the bonding head vertical movement device (not shown) are operated to bring the tip of the tool 5 into contact directly above the pad P, and the imager 7 is manually operated on the pad P. Adjust the spotlight S. Thereby, the spot light S is thereafter used as a guide mark indicating the position where the tip of the tool 5 contacts the sample P unless the thickness of the sample P changes. After the above spot light calibration, alignment is performed using the method of the present invention.

先ず受台２の回転中心を見し、出すために、試料Ｐを載
せた受台２を連続的に回転させる。パッド群が並ぶ試料
Ｐが回転する結果、同心円模様があらわれる。その中心
位置付近に１つのパッドＰ，が位置するように試料Ｐの
位置を調整する。これにより、パッドＰ，はほぼ受台２
の回転中心に位置する。次に、第３図Ａに示したように
パッドＰ，上にスポット光Ｓが投映されるように、マニ
ピュレータ９を操作してボンディングヘッド３〜５をＸ
Ｙ駆動装置８とともに移動させる。これにより、工具５
の先端位置が受台２の回転の中心位鷹にほぼ一致するよ
うに合わされる。この後、次の操作によって工具５の先
端位置を受台２の回転中心に正確に合せる。まず第３図
Ｂに示すように受台２を１８０度の角度回転させて回転
の前後のパッドＰ，の位置の変化を観察する。そして、
第３図Ａに示した回転前と第３図Ｂに示した回転後のパ
ッドＰ，の変位の中間位置に第３図Ｃに示したようにス
ポット光Ｓが合致するようにＸＹ駆動装置８を操作して
ボンディングヘッド３〜５の位置を調整する。次に再び
受台２の回転の中心位置に合致していれば、第３図Ｄに
示したようになる。もし、スポット光Ｓがずれていれば
位置を修正し、再度１８０度回転させて確認する。以上
のようにして所望の位置合わせが達成されるが、なお位
置合わせの精度を上げるには、受台２を初めの位置より
９０度回転変位させた位置で上記と同様に１８０度回転
させて、ＸＹ駆動装置８の操作によりパッドＰ，の変位
の中間位置にスポット光Ｓを合致させるようにする。以
上の１８０度ずつ回転させてスポット光Ｓを合わせる操
作が完了すると、所定のボンディング作業におけるボン
ディングヘッドの駆動の原点となる工具５の先端位置が
受台２の８方向の回転の中心位置に正確に合致する。な
お、上記の受台２を１８０度回転させる位置合わせで要
したＸＹ駆動装置８の調整変位量は、該装置の操作部に
設けられた修正スイッチの操作により本装置の制御用コ
ンピュータに入力され、制御デー外切ｏ算される。この
結果、以後のボンディングヘッド３〜５の試料Ｐに対す
る駆動は所定のプログラムに従ってＸＹ駆動装置８の自
動制御により行い得ることとなり、ボンディング作業が
自動化される。なお、本実施例においては試料としての
半導体べレット上の一つのパッドを位置合わせの指標と
して用いたが、指標となる適当な目安を有し、かつ、被
ボンディング部品である半導体べレツトと同じ高さを有
する治具を受台２上に配置して用いてもよい。First, the center of rotation of the pedestal 2 is checked, and the pedestal 2 on which the sample P is placed is continuously rotated in order to take it out. As a result of the rotation of the sample P in which the pad groups are lined up, a concentric pattern appears. The position of the sample P is adjusted so that one pad P is located near the center position. As a result, the pad P, is almost the same as the pedestal 2.
located at the center of rotation. Next, as shown in FIG. 3A, the manipulator 9 is operated to move the bonding heads 3 to 5 in the
It is moved together with the Y drive device 8. As a result, tool 5
The position of the tip of the pedestal 2 is adjusted so that it almost coincides with the center of rotation of the pedestal 2. Thereafter, the tip position of the tool 5 is accurately aligned with the center of rotation of the pedestal 2 by the following operation. First, as shown in FIG. 3B, the pedestal 2 is rotated through an angle of 180 degrees, and changes in the position of the pad P before and after the rotation are observed. and,
The XY drive device 8 is arranged so that the spot light S matches the displacement of the pad P before the rotation shown in FIG. 3A and after the rotation shown in FIG. 3B, as shown in FIG. 3C. Adjust the positions of bonding heads 3 to 5 by operating . Next, if the center position of the rotation of the pedestal 2 is again matched, the result will be as shown in FIG. 3D. If the spot light S is shifted, correct the position, rotate it 180 degrees again, and check. The desired positioning is achieved in the above manner, but in order to further improve the positioning accuracy, the pedestal 2 is rotated 180 degrees in the same manner as above at a position rotated 90 degrees from the initial position. , XY drive device 8 is operated to make the spot light S coincide with the intermediate position of the displacement of the pad P. When the above operation of rotating the spotlight S by 180 degrees is completed, the tip position of the tool 5, which is the origin of the drive of the bonding head in a predetermined bonding operation, is accurately aligned with the center position of the rotation of the pedestal 2 in eight directions. matches. The amount of adjustment displacement of the XY drive device 8 required for the positioning of rotating the pedestal 2 by 180 degrees is inputted into the control computer of this device by operating a correction switch provided on the operation section of the device. , the outside of the control data is calculated. As a result, the subsequent driving of the bonding heads 3 to 5 with respect to the sample P can be performed by automatic control of the XY drive device 8 according to a predetermined program, and the bonding work is automated. In this example, one pad on the semiconductor pellet as a sample was used as an index for positioning, but it should be noted that it has an appropriate standard as an index and is the same as the semiconductor pellet that is the component to be bonded. A jig having a height may be placed on the pedestal 2 and used.

上記のように本発明の位置合わせ方法によれば、ボンデ
ィングヘッドに工具の先端が被ボンディング部品に当援
する位置に示すスポット光を投影する投影器を設けると
ともに、被ボンディング部品の受台上に変位可能の位置
合わせ用指標を設け、受台を回転させて観察した該回転
の中心相当位置に前記指標を配置し、マニピュレータを
操作して該指標に、ボンディングヘッドの工具先端位置
を示すスポット光を合致させてのち、前記受台をほぼ１
８０度回転させるとともにＸＹ駆動装置を操作して、該
回転における前記指標の位置の変位の中間位置に前記ス
ポット光を合致させるようにしたので、ボンディングヘ
ッドの駆動の原点を容易に正確に被ボンディング部品受
台の回転の中心位置に合致させることができる。As described above, according to the alignment method of the present invention, the bonding head is provided with a projector that projects a spot light indicating the position where the tip of the tool is applied to the bonded parts, and A movable positioning index is provided, the index is placed at a position corresponding to the center of rotation observed by rotating the pedestal, and a spot light indicating the tool tip position of the bonding head is applied to the index by operating a manipulator. After aligning the pedestal to approximately 1
By rotating the bonding head by 80 degrees and operating the XY drive device, the spot light is made to match the intermediate position of the displacement of the position of the index during the rotation, so that the origin of the drive of the bonding head can be easily and accurately aligned with the bonding target. It can be matched with the center of rotation of the component holder.

これにより、超音波ワイヤボンダにおけるボンディング
ヘッドの駆動を所定のプログラムに従って自動的に行う
ことができ、ボンディング作業を自動化することができ
る。Thereby, the bonding head in the ultrasonic wire bonder can be automatically driven according to a predetermined program, and the bonding work can be automated.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の方法を実施する装置の概要を示す正面
図、第２図は被ボンディング部品としての半導体べレツ
トの平面図、第３図Ａ〜Ｄは本発明の方法を説明する説
明図である。 ２・・・受台、３・・・ボンディングヘッド本体、４・
・・超音波ホーン、５・・・ボンディング工具、７・・
・スポット光投影器、８・・・ＸＹ駆動装置、９・・・
マニピュレータ、Ｐ・・・被ボンディング部品、Ｐ．・
・・位置合わせ用指標としてのパッド、Ｓ…スポット光
。 多ノ函多そ函 多う図FIG. 1 is a front view showing an outline of an apparatus for carrying out the method of the present invention, FIG. 2 is a plan view of a semiconductor pellet as a component to be bonded, and FIGS. 3A to 3D are explanations for explaining the method of the present invention. It is a diagram. 2... cradle, 3... bonding head body, 4...
... Ultrasonic horn, 5... Bonding tool, 7...
・Spot light projector, 8...XY drive device, 9...
Manipulator, P... bonding target component, P.・
...Pad as a positioning index, S...spot light. Tanokanta Sokantaou diagram

Claims (1)

【特許請求の範囲】[Claims] １ 超音波振動により駆動されるボンデイング工具を備
えたボンデイングヘツドと、このボンデイングヘツドを
被ボンデイング面に平行で互いに直角をなす２方向に移
動するように駆動するＸＹ駆動装置とともに前記ボンデ
イングヘツドを駆動して該ボンデイングヘツドの設置位
置を調整するマニピユレータと、被ボンデイング面に垂
直な軸を中心として回転自在に設けられて上面に被ボン
デイング部品を支持する受台とを備えた超音波ワイヤボ
ンダを用いた超音波ワイヤボンデイングにおけるボンデ
イングヘツドの位置合わせ方法において、前記ボンデイ
ング工具の先端が当接する被ボンデイング部品表面上の
位置にスポツト光を投映するよう投映器を前記ボンデイ
ングヘツドに設置するとともに前記受台上に変位可能な
位置合わせ用指標を設置し、先ず前記受台を連続的に回
転させて観察した該回転のほぼ中心相当位置に前記指標
を配置し、次いで前記マニピユレータを操作して前記指
標に前記ボンデイングヘツドの工具先端位置を示す前記
スポツト光を合致させ、更に前記受台をほぼ１８０度の
角度回転させるとともに前記ＸＹ駆動装置を操作して該
回転の前後における前記指標の位置の中間位置に前記ス
ポツト光を合致させることにより前記ボンデイングヘツ
ドの駆動の原点を前記受台の回転の中心位置に合致させ
ることを特徴とする超音波ワイヤボンデイングにおける
ボンデイングヘツドの位置合わせ方法。1. A bonding head equipped with a bonding tool driven by ultrasonic vibration, and an XY drive device that drives the bonding head so as to move it in two directions parallel to the surface to be bonded and perpendicular to each other, and driving the bonding head together with An ultrasonic wire bonder using an ultrasonic wire bonder, which is equipped with a manipulator that adjusts the installation position of the bonding head, and a pedestal that is rotatable about an axis perpendicular to the surface to be bonded and supports the component to be bonded on the upper surface. In a method for positioning a bonding head in sonic wire bonding, a projector is installed on the bonding head and displaced onto the pedestal so as to project a spot light onto a position on the surface of the bonded component that the tip of the bonding tool comes into contact with. A possible positioning index is installed, and the index is placed at a position approximately corresponding to the center of rotation as observed by continuously rotating the pedestal, and then the manipulator is operated to align the bonding head to the index. The spot light indicating the position of the tool tip is aligned, and the pedestal is rotated through an angle of approximately 180 degrees, and the XY drive device is operated to bring the spot light to an intermediate position between the position of the index before and after the rotation. 1. A method for positioning a bonding head in ultrasonic wire bonding, characterized in that the origin of the drive of the bonding head is made to match the center of rotation of the pedestal by matching the position of the bonding head.
JP51058916A 1976-05-21 1976-05-21 How to align the bonding head in ultrasonic wire bonding Expired JPS6026662B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51058916A JPS6026662B2 (en) 1976-05-21 1976-05-21 How to align the bonding head in ultrasonic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51058916A JPS6026662B2 (en) 1976-05-21 1976-05-21 How to align the bonding head in ultrasonic wire bonding

Publications (2)

Publication Number Publication Date
JPS52141455A JPS52141455A (en) 1977-11-25
JPS6026662B2 true JPS6026662B2 (en) 1985-06-25

Family

ID=13098137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51058916A Expired JPS6026662B2 (en) 1976-05-21 1976-05-21 How to align the bonding head in ultrasonic wire bonding

Country Status (1)

Country Link
JP (1) JPS6026662B2 (en)

Also Published As

Publication number Publication date
JPS52141455A (en) 1977-11-25

Similar Documents

Publication Publication Date Title
US4361261A (en) Apparatus for wire bonding
US5307978A (en) Smart indexing head for universal lead frame work station
US4239144A (en) Apparatus for wire bonding
US11273515B2 (en) Bonding process with rotating bonding stage
US4672742A (en) Process for assembling and connecting integrated circuits to circuit units and apparatus for carrying out the process
KR950009623B1 (en) The method and apparatus of wire-bonding
JPS6026662B2 (en) How to align the bonding head in ultrasonic wire bonding
JP3305923B2 (en) Semiconductor manufacturing apparatus and semiconductor manufacturing method
JP3937162B2 (en) Component mounting apparatus and component mounting method
JPS5917975B2 (en) automatic wireless bonding equipment
KR19990073550A (en) Alignment device of wafer with semiconductor chip and patterned film
JPS6120134B2 (en)
JP2757127B2 (en) Method and apparatus for correcting bonding position of wire bonder
JPS634691A (en) Parts mounting system
JPS6120136B2 (en)
JPS5921167B2 (en) Ultrasonic wire bonding equipment
KR830001356B1 (en) Thermo compression wding device
SU740448A1 (en) Automatic unit for connecting wire leads with overlap
JP4149718B2 (en) Component mounting method
JP2550905B2 (en) Wire bonding equipment
JPS6027200A (en) Automatic coordinates correcting device at electronic part mounting time
JP2548031B2 (en) Contact checker
JPS62271441A (en) Correction of misregistration
JPS6293069A (en) Laser soldering device
JPS6329536A (en) Wire bonding apparatus