JPS58169920A - Manufacturing device for semiconductor - Google Patents

Abstract

PURPOSE:To completely guide a metal fine wire and to permit positive bonding by a device wherein a horn having a wedge at its one end and an ultrasonic vibrator at its the other end is arranged to be movable in the X, Y directions and in the theta direction. CONSTITUTION:Provided between a support 11 and an XY table 14 is turntable 15 causing the support 11 to be rotated in the horizontal direction. First, when a semiconductor pellet 2 is in a normal position as indicated by dotted lines, distances between the original Xo, Yo of a lead 3b and an electrode position xo, yo of the pellet 2 in both X, Y directions are detected to as to operate the table 14. Next, the wedge 7 is moved onto the electrode of the pellet 2 and at the same time an angle thetao of the original making with the electrode is determined so as to rotate the table 15 by the angle thetao. By so doing, since the guide direction of the metal fine wire 4 is made coincident with the direction of a groove 7b in the wedge 7, the fine wire 4 will not slip from the groove 7b when guiding the fine wire 4 toward the lead side after bonding on the electrode side, thereby ensuring positive bonding. In case the pellet 2 is shifted in position as indicated by solid lines, positive bonding can be also achieved in a similar manner.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to semiconductor manufacturing equipment, and particularly to wire bonding equipment! -Related.

FIG. 1 shows an example of a resin-molded semiconductor device, in which 1 is a substrate on which semiconductor pellets 2 are scattered and fixed and also serves as a heat dissipation root, and 1a is a hole for mounting. 3 is a set of three leads in the illustrated example, and one end of the center lead 3a is connected to the board I.
Connect in a K-shaped manner, with leads 3b on both sides of lJ-do 3a,
3c is arranged in parallel with one end close to the semiconductor pellet 2. 4° The resin molded part is covered with the main parts including the 5-piece semiconductor pellet 2 and the thin metal wires connecting the 1tf& on the 4-piece semiconductor pellet 2 and the leads 3b and 3c, respectively.

This semiconductor device generally includes a lead frame formed by punching a flat metal plate and integrating a plurality of sets of leads 3 with connecting pieces, and a plurality of substrates integrated with connecting pieces. As the semiconductor pellet 2 is mounted on the substrate l via solder or the like, a wire bonding process is performed to electrically connect the semiconductor pellet 2 and the leads 3b, 3c with metal wires lIM+, +. A resin molding process in which the main parts are covered and covered with resin,
It is manufactured through a process of cutting and removing the connection piece between the lead frame and the board and separating it into individual semiconductor devices, and a process of inspecting the electrical characteristics and appearance.

By the way, in the bonding process, solder is supplied to a positioned and heated substrate, and semiconductor pellets that have been positioned and swelled are supplied onto the molten solder to be fixed. Because the semiconductor pellets were heated both before and after, the semiconductor pellets sometimes shifted or rotated by 41'r on the substrate after being supplied.

Therefore, in the subsequent wire bonding process, the t& position of the semiconductor pellet 2 is detected. Here, since the positional deviation of the leads 3b and 3c of the lead frame is small and the area of the semiconductor pellet 2 is sufficiently large, the coordinates are considered to be fixed, so that once the lE & position of the semiconductor pellet 2 is determined, A guide direction of 4° is determined.

By the way, an example of a wire bonding apparatus using an aluminum wire as the thin metal fj1414 will be explained with reference to FIG. A wedge 7 that presses a thin metal wire is placed at one end of the wedge 7, and an ultrasonic vibrator 8 that applies ultrasonic vibration to the wedge 7 is placed at the other end of the wedge. It is protruding from the Furthermore, a retaining portion 10 is formed behind the support shaft portion. 11 is the support shaft 9 of the horn 6
14 supports the shaft 13 of the cam 12 that presses the engaging portion 10 to rotate the bone 6 and move the wedge 7 up and down. Show table.

This device detects the position of the electrode of the semiconductor pellet 2 on the substrate 1.Based on the detected data, the XY table 14 moves the wedge 7 to the semiconductor pellet 2-L, and the cam 1
2. Release the suppression of the engaging part 10 by rotating the horn 6 fully around the spindle 9, lowering the wedge 7 onto the semiconductor pellet 2, and attaching the tip of the metal thin #14 to the semiconductor pellet. 2 electrodes are pressed fF, L, the ultrasonic vibrator 8 is operated to perform ultrasonic bonding, and the retaining portion 10 is bonded by a cam.
is pressed to raise the wedge 7, and by the operation of the XY table 14, the thin metal wire 4? While guiding, the wedge 7 is moved onto the lead 3b, and the cam 12 is rotated simultaneously to release the suppression of the retaining portion 1o, and the wedge 7 is moved onto the lead 3b-).
, presses the middle part of the thin metal wire 4, activates the ultrasonic vibrator 8 to perform ultrasonic bonding, and then raises the wedge 7 by -E to cut the thin metal wire 4 and perform photon bonding. Similarly, other ¥ of semiconductor pellet 2
Wire bonding is performed between Lm and another board 3C.

Here, an example of the shape of the lower end of the wedge 7 is shown in FIGS. 3 and 4.
As shown in the figure, 7a is a thin metal wire suppressing part in which a groove 7b for guiding and pressing the thin metal wire 4 is formed on the lower end surface, and 7C is a metal wire suppressing part with a hole 7d for guiding the thin metal wire 4 to the thin metal wire presser part 7b. This is the Japanese paper style section.

The direction of the groove 7b of this wedge 7, the axial direction of the horn 6, and R11 are made to coincide with the guide direction of the thin metal wire 4. Therefore, after the first bonding, the thin wire 4 is attached to the wedge 7 as shown in FIG. At the S second bonding position 4, which is guided by the 147 b end of the press R1 part 7a, as shown in FIG. As shown in FIG.
Then, move the XY table 14 from the origin in the X direction (zo
xo) and in the Y direction (ffoYo), the wedge 7 can be positioned at xi-h of the semiconductor pellet 2. Connect the XY table 14 in reverse from this point.
and return wedge 7 to its origin. At this time, groove 7 of wedge 7
Direction of b θ0 digit tan −'((”a Xo)/1f
Fo Yo)), the same is true on the semiconductor area 7 to 2 [- and lead 3b, and the thin wire 4 never comes off from the groove 7b.

As shown in FIG. 7 by the solid line, the semiconductor pellet 2 is
This position is greatly deviated from the normal position, and the electrode (xl.

ff+), move the XY table 14 from the origin to
(t+ -'Xo), Y direction K (3'+Yo
) By moving 1'rI, the wedge 7 can be moved to the 'N-FK' position of the semiconductor pellet 2.After bonding at this point, the XY table 14 is moved backward to position the wedge 7 at the origin. I can do it.

However, the guide direction θ of the thin metal wire is tM-'((
'+-Xo)/(3'+Yo)), and a deviation occurs between the direction θ0 of the groove 7b of the wedge 7, and when bonding on the lead side, a part of the metal shaft 117J4 crosses the groove 7b of the wedge 7. When the thin metal wire 4 is crushed by the protrusion of the pressing portion 7a, the bonding strength is reduced, and the wire may be broken when a pressing IF force is applied to the metal shaft &14 in a resin molding process or the like.

Also, if the guide direction θ of the metal shaft lR4 is too large, the groove 7
In some cases, the thin metal wire 4 was detached from b, making it impossible to perform bonding on the lead side.

This is because the thin metal wire 4 is not guided while being completely accommodated in the groove 7b, but is guided while being hooked on the end of the groove 7b, so that the guiding direction bl is the direction θ of the groove 7b. This is because if the metal wire 4 deviates from the groove 7b, the thin metal wire 4 is likely to come off the groove 7b.

The present invention has been proposed to address the above-mentioned problems, and provides a semiconductor manufacturing apparatus that can completely guide a thin metal wire and perform bonding reliably.

The present invention will now be explained with reference to FIG. In the figure, the second
The same reference numerals as 1 indicate the same parts, and the explanation will be omitted. The present invention is characterized in that a turntable 15 for horizontally rotating the support base 11 is provided between the support base 11 and the XY table 14.

Below, the operation of this device will be described as ia u/+. First, when the semiconductor pellet 2 is in the normal position "-" as shown by the dotted line in FIG. , distance in the Y direction ME (to Xo) + (ffo
Yo) is detected, the XY table 14 is operated, and the wedge 7 is moved onto the electrode of the semiconductor pellet 2. At the same time, the angle θ between the origin and tfIk is detected. (θo-taa-1(
go Xo)/(ffo-Yo)) and rotate the turn tape 15 by an angle θ0.

From this K, the guide direction of the thin metal wire 4 and the wed'; 7
(7) The direction of iQj '7 b matches. After bonding on the L1 electrode side, when guiding the thin metal wire 4 to the lead side, the gold-finished IIM will not come off from the groove 7b, and the bonding will ensure kill on the lead side as well. .

Further, if the semiconductor pellet 2 is misaligned as shown by the solid line in FIG. 9, the origin of the lead 3b (
o) to 'thh-dispersion (xl.

y+) Distance in the X and Y directions at t ("+ Xo), (3
'+ Yo) and create XY table 14 ￥1+
While moving the wedge 7 onto the electrode of the semiconductor pellet 2, the angle θr (θr −t
An-'('+-X.)/('h Yo)) is determined and the turntable 15 is rotated by an angle lθ.

With this arrangement as well, the guide direction of the metal shaft 114 and the direction of the groove 7b of the wedge 7 match, and the gold hazel twill 4 does not come off from the groove b, allowing for reliable bonding.

As described above, according to the present invention, even if the semiconductor pellet 2 is largely displaced from its normal position, the guiding direction of the thin metal wire 4 and the direction of the groove 7b of the wedge 7 can be made to match.
VC bonding can be performed reliably, disconnection can be prevented, and a highly reliable semiconductor device I6 can be realized.

Further, FIG. 1 shows a semiconductor pellet 2 of a semiconductor device.

Bonding with different guide directions as in -dodes 3b and 3crl+1 is also possible with one device.

[Brief explanation of the drawing]

FIG. 1 shows an example of a semiconductor device in a partially transparent view.
Figure 3 is a side view of the main part showing an example of a wedge, Figure 4 is a front view of the third door 1, φ, Figures 5 to 7 are FIG. 8 is a side view showing an example of the wire bonding apparatus according to the main part 11J, and FIG. 9 is an enlarged plan view of the main part of the semiconductor device to explain the operation of the 8M bagging. 4...Thin metal wire, 6...Horn, 7...Wedge, 8...Ultrasonic vibrator, 14...XY table. 15... Turntable.

Claims (1)

[Claims] A wedge that guides the thin metal wire and presses it against the object to be bonded is fixed to one end, and an ultrasonic vibrator that imparts ultrasonic vibration to the wedge is fixed to the other end of the horn, which can be moved freely in the XY direction and the θ direction. A semiconductor manufacturing device characterized in that it is arranged in a.