JPS5897839U - Package transfer device in bonding equipment - Google Patents

Package transfer device in bonding equipment

Info

Publication number
JPS5897839U
JPS5897839U JP1981191737U JP19173781U JPS5897839U JP S5897839 U JPS5897839 U JP S5897839U JP 1981191737 U JP1981191737 U JP 1981191737U JP 19173781 U JP19173781 U JP 19173781U JP S5897839 U JPS5897839 U JP S5897839U
Authority
JP
Japan
Prior art keywords
packages
package
mechanism section
transfer device
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981191737U
Other languages
Japanese (ja)
Other versions
JPS6339973Y2 (en
Inventor
秀明 三好
山崎　光格
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1981191737U priority Critical patent/JPS5897839U/en
Publication of JPS5897839U publication Critical patent/JPS5897839U/en
Application granted granted Critical
Publication of JPS6339973Y2 publication Critical patent/JPS6339973Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は実施例の斜視図。第２図は分離機構の説明図。 １・・・パッケージ、２・・・マガジン、３・・・引き
出しアーム、４・・・爪、５・・・ガイドレール、６・
・・検出スイッチ、７・・・分離用・爪、８・・・固定
用爪、９・・・送りアーム、１０・・・ボンディングス
テージ、１１・・・ボンディングヘッド、１２・・・送
りアーム。FIG. 1 is a perspective view of the embodiment. FIG. 2 is an explanatory diagram of the separation mechanism. 1...Package, 2...Magazine, 3...Drawer arm, 4...Claw, 5...Guide rail, 6...
...detection switch, 7...separation claw, 8...fixing claw, 9...feeding arm, 10...bonding stage, 11...bonding head, 12...feeding arm.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージを列状に載置したマガジンを、前後及び上下
方向に移送せしむるローグー機構部と、所定位置におい
て前記マガジン内のパッケージを一列毎に引き出すり１
き出しアームと、分離用爪及び固定用爪を備えた分離機
構部と、パッケージを一個づつ移送せしめる送りアーム
と、移送されたパッケージを載置せしめるボンディング
ステージと、該ボンディングステージからパッケージを
移送せしめる送りアームを備えた送り機構部と、送り機
構部から送られるパッケージをマガジンに格納するアン
ローダ−機構部とからなり、前記分離機構部において分
離爪と固定用爪で、それぞれ最先端及び第２番目のパッ
ケージの両側面が押えられ、分離用爪で押えられたまま
最先端のパッケージだけが移送されて、第２番目のパッ
ケージから分離されるように構成されたことを特徴とす
るボンディング装置におけるパッケージ移送装置。A rogue mechanism unit that moves a magazine in which packages are placed in rows in the front and back and up and down directions;
A separation mechanism section including a take-out arm, a separating claw and a fixing claw, a feeding arm for transferring the packages one by one, a bonding stage for placing the transferred packages, and a bonding stage for transferring the packages from the bonding stage. It consists of a feeding mechanism section equipped with a feeding arm, and an unloader mechanism section that stores the packages sent from the feeding mechanism section into a magazine. A package in a bonding device characterized in that both sides of the package are pressed down, and only the most advanced package is transferred while being held down by separation claws and separated from the second package. Transfer device.
JP1981191737U 1981-12-24 1981-12-24 Package transfer device in bonding equipment Granted JPS5897839U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (en) 1981-12-24 1981-12-24 Package transfer device in bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981191737U JPS5897839U (en) 1981-12-24 1981-12-24 Package transfer device in bonding equipment

Publications (2)

Publication Number Publication Date
JPS5897839U true JPS5897839U (en) 1983-07-02
JPS6339973Y2 JPS6339973Y2 (en) 1988-10-19

Family

ID=30105184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981191737U Granted JPS5897839U (en) 1981-12-24 1981-12-24 Package transfer device in bonding equipment

Country Status (1)

Country Link
JP (1) JPS5897839U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Conveyance of lead frame provided with base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5955025A (en) * 1982-09-22 1984-03-29 Fujitsu Ltd Conveyance of lead frame provided with base

Also Published As

Publication number Publication date
JPS6339973Y2 (en) 1988-10-19

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